JP2021077734A - Chuck pin, board processing device, and board processing system - Google Patents

Abstract

To provide a chuck pin in which a portion for holding a substrate can be easily replaced.SOLUTION: A chuck pin 712 includes a pin portion 2 that grips the peripheral edge of a substrate W when the substrate W is held with a direction Z as the normal direction, and a main body 1 having a groove 116 into which the pin portion 2 fits. The groove 116 movably guides the pin portion 2 along a direction R2 inclined with respect to a direction Z and a direction R3 opposite to the direction R2. The groove 116 opens on the direction R3 side. The groove 116 restrains the movement of the pin portion 2 in a direction other than the directions R2 and R3.SELECTED DRAWING: Figure 3

Description

The present invention relates to a technique for holding a substrate. The substrates to be held include, for example, semiconductor wafers, liquid crystal display device substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, opto-magnetic disk substrates, and photomasks. Includes mask substrates, ceramic substrates, solar cell substrates, and the like.

In the manufacturing process of semiconductor devices and liquid crystal display devices, a single-wafer processing device (hereinafter referred to as "single-leaf processing device") that processes substrates one by one, or a plurality of substrates are collectively processed. A batch type substrate processing apparatus is used. In a general single-wafer processing apparatus, one substrate is held horizontally in the processing chamber, and the substrate is rotated or a treatment liquid (chemical solution or rinse liquid) is supplied to the substrate according to the content of the treatment.

The single-wafer processing apparatus may include, for example, a plurality of chuck pins along the rotation direction on a spin base that rotates about a rotation axis. In such a single-wafer processing apparatus, the substrate is held by the chuck pins sandwiching the peripheral edge of the substrate (hereinafter referred to as "grasping").

For example, Patent Documents 1 to 4 exemplify a technique in which a substrate is held by using a plurality of chuck pins provided on a spin base. As a structure that functions as a chuck pin, for example, in Patent Document 1, a main body material and a substrate holding member provided on a spin base are sandwiched between a fastening screw and a support base member that are screwed together along a vertical axis. The structure is disclosed.

As a structure that bears the function of the chuck pin, for example, in Patent Document 4, the core material is fixed to the support member by the fastening member, and the fastening member has a male screw. A structure in which a female screw is provided on the support member is disclosed. The core material is covered with a conductive member that is pressed against the outer peripheral portion of the substrate. The support member is connected to the chuck opening / closing mechanism and rotates around the center line of the vertical support member.

Japanese Unexamined Patent Publication No. 2005-19701 Japanese Unexamined Patent Publication No. 2014-241390 Japanese Unexamined Patent Publication No. 2015-170609 Japanese Unexamined Patent Publication No. 2017-228582

Considering that the chuck pin is deformed or worn out, it is desirable that the portion holding the substrate can be replaced. In the structure disclosed in Patent Documents 1 and 4, the operation of rotating the screw is required to replace the portion holding the substrate, and this operation requires a lot of time.

One of the objects of the present invention is to provide a chuck pin whose portion for holding a substrate can be easily replaced.

The first aspect for solving the above-mentioned problems has a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction, and a groove into which the pin portion fits. A chuck pin provided with a main body. The groove movably guides the pin portion along a second direction inclined with respect to the first direction and a third direction opposite to the second direction, and the second direction. The movement of the pin portion is restrained in a direction other than the direction of the above and the direction other than the third direction, and the opening is made on the third direction side.

The second aspect is the chuck pin of the first aspect, in which the groove opens in a fourth direction inclined with respect to the first direction when viewed along the second direction.

The third aspect is the chuck pin of the first aspect or the second aspect, and the main body is opened with a hole for exposing the pin portion in the second direction side.

The fourth aspect is the chuck pin of the third aspect, in which a flow path along the second direction is formed between the pin portion fitted in the groove and the groove, and the flow path is the said. Communicate with the hole.

A fifth aspect is a chuck pin according to any one of the first to fourth aspects, in which the groove has a step with respect to the second direction.

The sixth aspect is a chuck pin according to any one of the first to fifth aspects, and the main body further has a surface for restraining the movement of the pin portion in the second direction side.

A seventh aspect is a chuck pin according to any one of the first to sixth aspects, and the main body can rotate about an axis along the first direction.

The eighth aspect is the chuck pin of the seventh aspect, and the pin portion has a grip portion that grips the peripheral edge and a guide surface that guides the substrate to the grip portion along the first direction. Have.

A ninth aspect is a substrate processing apparatus that processes a substrate using a processing liquid, and mounts the supply mechanism for supplying the processing liquid to the substrate and the substrate with the first direction as a normal direction. A spin base to be placed, a rotation drive mechanism for rotating the spin base around a rotation axis, and a chuck pin provided on the spin base and having a pin portion for gripping the peripheral edge of the substrate when the substrate is held. To be equipped. The chuck pin further has a main body having a groove into which the pin portion fits, and the groove is in a second direction inclined with respect to the first direction and in a direction opposite to the second direction. The pin portion is movably guided along a certain third direction, the movement of the pin portion is restrained in a direction other than the second direction and the third direction, and the movement of the pin portion is restrained on the third direction side. Open.

A tenth aspect is the substrate processing apparatus of the ninth aspect, in which the main body is removable from the spin base.

The eleventh aspect is the substrate processing apparatus of the ninth aspect or the tenth aspect, wherein the chuck pin shaft for rotating the main body about the axis along the first direction and the chuck pin shaft are rotatable. A supporting base portion and an annular first packing and a second packing, both of which surround the base portion around the shaft, are further provided. The second packing is separated from the shaft and has high chemical resistance as compared with the first packing.

A twelfth aspect is a substrate processing system, which includes a substrate processing apparatus according to any one of the ninth to eleventh aspects and a conveying mechanism for conveying the substrate to the substrate processing apparatus.

According to the chuck pin of the first aspect, the pin portion that grips the peripheral edge of the substrate when it is held is separated from the main body along the third direction, and the main body is separated from the main body along the third direction from the third direction side to the groove along the second direction. It is easy to replace by being attached to.

According to the chuck pin of the second aspect, screwing is not required and the movement of the pin portion in the first direction is suppressed.

According to the chuck pin of the third aspect, it is easy to push the pin portion through the hole to separate the pin portion from the main body.

According to the chuck pin of the fourth aspect, the processing liquid supplied to the substrate is discharged via the chuck pin.

According to the chuck pin of the fifth aspect, it is restricted that the pin portion is separated from the main body except at the time of attachment / detachment.

According to the chuck pin of the sixth aspect, the pin portion is supported against the centrifugal force acting on the pin portion when the spin base is rotated.

According to the chuck pin of the seventh aspect, the presence or absence of gripping the peripheral edge of the substrate by the pin portion is realized by the rotation of the main body.

According to the chuck pin of the eighth aspect, the presence or absence of gripping the peripheral edge of the substrate by the pin portion is realized by the rotation of the main body.

According to the substrate processing apparatus of the ninth aspect, the pin portion that grips the peripheral edge of the substrate when it is held is separated from the main body along the third direction, and from the third direction side to the groove in the second direction. By attaching it to the main body along the line, replacement is easy.

According to the substrate processing apparatus of the tenth aspect, the main body is also replaceable.

According to the substrate processing apparatus of the eleventh aspect, deterioration of the first packing is prevented.

According to the substrate processing system of the twelfth aspect, the pin portion that grips the peripheral edge of the substrate when it is held is separated from the main body along the third direction, and the second portion from the third direction side to the groove is separated from the main body. It is easy to replace because it is attached to the main body along the direction.

It is a top view which illustrates the outline of the structure of the substrate processing system. It is an overall view which illustrates the outline of the structure of one substrate processing apparatus. It is a perspective view which shows the main body and a pin part. It is a side view of the main body. It is sectional drawing of the main body. It is a perspective view which shows the pin part. It is a perspective view which shows the chuck pin. It is sectional drawing of a chuck pin. It is sectional drawing of a main body and a pin part. It is a top view which shows the position of a chuck pin. It is a top view which shows the position of a chuck pin. It is sectional drawing which shows the 1st deformation of a chuck pin. It is sectional drawing which shows the 2nd deformation of a chuck pin. It is sectional drawing which shows the 3rd deformation of a chuck pin. It is sectional drawing which shows the cross section of a chuck pin and a chuck opening / closing mechanism partially.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. It should be noted that the components described in this embodiment are merely examples, and the scope of the present invention is not limited to them. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for easy understanding.

In the present embodiment, "holding" means keeping the position of the object to be held, "mounting" means placing the object to be placed, and "grasping" means directly holding the object to be held. "Holding" is used as a concept that includes both "placement" and "grasping".

In particular, the state in which the peripheral edge of the substrate is gripped by the chuck pin is called the "grasping state", and the state in which the substrate is simply mounted on the chuck pin without the peripheral edge of the substrate being gripped by the chuck pin is the "mounting state". ". Further, the state in which the substrate is held regardless of the gripping state and the mounting state is referred to as a "holding state".

[Board processing system configuration]
FIG. 1 is a plan view illustrating an outline of the configuration of the substrate processing system 700. Direction Z is introduced in this embodiment to facilitate understanding of the invention. Typically, the direction Z is a vertically upward direction.

The board processing system 700 includes a board processing device 710 and a center robot 708. In FIG. 1, the substrate processing apparatus 710 is provided in four sets 71, and the case where three substrate processing devices 710 are provided in each of the sets 71 is shown.

The substrate processing apparatus 710 is a single-wafer processing apparatus that processes the substrate W with a processing liquid. The treatment solution is a concept including a chemical solution and a rinse solution described later. Examples of chemicals include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, hydrogen peroxide, organic acids (eg citric acid, oxalic acid, etc.), organic alkalis (eg, TMAH: tetramethylammonium hydroxide, etc.), Examples include liquids containing at least one of a surfactant and an antioxidant. As an example of the rinse solution, as an example of the rinse solution supplied to the rinse solution nozzle 738, pure water (deionized water), carbonated water, electrolytic ionized water, hydrogen water, ozone water, IPA (isopropyl alcohol), and hydrochloric acid water. Can be mentioned.

The substrate W is, for example, a semiconductor wafer and has a disk shape. The center robot 708 is a transfer mechanism that transfers the substrate W to the substrate processing device 710.

The substrate processing system 700 further includes a fluid cabinet 702, a fluid box 703, a load port 706, and an indexer robot 709.

The fluid cabinet 702 houses the above-mentioned treatment liquid. The fluid cabinet 702 can further accommodate the gas adopted when processing the substrate W. The fluid box 703 supplies the treatment liquid or the treatment liquid and the above gas from the fluid cabinet 702 to the substrate processing apparatus 710. In FIG. 1, a case where a fluid box 703 is provided for each set 71 is illustrated.

Each load port 706 can accommodate a plurality of boards W. For example, the substrate W is stacked and accommodated at the load port 706. The substrate W is conveyed between the center robot 708 and the load port 706 by the indexer robot 709. The substrate W is conveyed by the center robot 708 between the indexer robot 709 and the substrate processing apparatus 710.

The operation of the substrate processing device 710, the operation of the center robot 708, and the operation of the indexer robot 709 are controlled by the control device 73. In FIG. 1, a case where the control device 73 is provided in the substrate processing system 700 is illustrated.

The control device 73 includes, for example, a control unit 731 and a storage unit 732. The control unit 731 can be realized by a microcomputer. The storage unit 732 stores a computer program. The control unit 731 executes a computer program stored in the storage unit 732.

The storage unit 732 further stores recipe data. Recipe data includes information indicating a plurality of recipes. Each of the recipes defines the content and procedure for each of the transfer of the substrate W and the processing on the substrate W.

The storage unit 732 includes a main storage device and an auxiliary storage device. The main storage device and the auxiliary storage device are realized by, for example, a semiconductor memory. The auxiliary storage device may be realized by another storage device, for example, a hard disk drive, or may be realized by a removable medium.

[Configuration of board processing equipment]
FIG. 2 is an overall view illustrating an outline of the configuration of one substrate processing apparatus 710. The control device 73 controls the operation of the device provided in the substrate processing device 710 and the opening / closing of the valve.

The substrate processing apparatus 710 includes a chamber 74, a spin chuck 75, a processing liquid supply mechanism 76, and a cup 77.

The chamber 74 is box-shaped and has an internal space. The spin chuck 75 functions as a substrate holding mechanism for holding one substrate W in a horizontal posture in the chamber 74. The spin chuck 75 rotates the substrate W around the substrate rotation axis A1 which is a vertical line (here, parallel to the direction Z). The substrate rotation axis A1 passes through the center of the substrate W, for example. The treatment liquid supply mechanism 76 supplies the treatment liquid to the surface (main surface) of the substrate W held by the spin chuck 75 to be treated. The cup 77 has a tubular shape and surrounds the spin chuck 75 around the substrate rotation axis A1.

The chamber 74 includes a partition wall 78, an FFU (fan filter unit) 79, and an exhaust duct 72. The partition wall 78 has a box shape and accommodates a spin chuck 75 and the like. The FFU 79 is a blower unit that sends clean air (air filtered by a filter) downward into the chamber 74 from the ceiling of the substrate processing device 710. The FFU 79 is located above the partition wall 78 and sends clean air into the partition wall 78 from above the partition wall 78.

The exhaust duct 72 discharges the gas in the chamber 74 from the lower part of the cup 77. The exhaust duct 72 is connected to the bottom of the cup 77 and guides the gas in the chamber 74 toward the exhaust equipment (not shown) provided in the factory where the substrate processing device 710 is installed. Therefore, a downflow that flows downward in the chamber 74 is formed by the FFU 79 and the exhaust duct 72. The processing of the substrate W is performed in a state where a downflow is formed in the chamber 74.

The spin chuck 75 includes a spin base 711, a plurality of chuck pins 712, and a chuck opening / closing mechanism 713. The spin base 711 has a disk shape and is held in a horizontal position. The plurality of chuck pins 712 project upward from the outer peripheral portion of the upper surface (the surface exposed upward in the vertical direction) of the spin base 711. The chuck opening / closing mechanism 713 opens / closes a plurality of chuck pins 712.

"Open" of "opening and closing" of the chuck pin 712 means moving the chuck pin 712 to a position where the mounted state can be obtained, and "closed" means moving the chuck pin 712 to a position where the gripping state can be obtained. Refers to letting. When the chuck pin 712 in the mounted state is closed, the state transitions from the mounted state to the gripped state. When the chuck pin 712 in the gripped state is opened, the state transitions from the gripped state to the mounted state.

The substrate processing apparatus 710 includes a spin shaft 714 and a spin motor 715. The spin shaft 714 extends vertically downward from the central portion of the spin base 711. The spin motor 715 rotates the spin shaft 714, and thus rotates the spin base 711 and the chuck pin 712 around the substrate rotation shaft A1 in a counterclockwise direction Rdr when viewed along, for example, vertically downward. The spin motor 715 and the spin shaft 714 function as a rotation drive mechanism 716 that rotates the spin chuck 75 around the substrate rotation shaft A1 extending in the vertical direction.

The outer diameter of the spin base 711 is larger than the diameter of the substrate W. The center line of the spin base 711 is located on the substrate rotation axis A1. The plurality of chuck pins 712 are held by the spin base 711 at the outer peripheral portion of the spin base 711. The plurality of chuck pins 712 are located at intervals in the circumferential direction (circumferential direction centered on the substrate rotation axis A1). Each of the chuck pins 712 comes into contact with the peripheral edge of the substrate W.

As a result, the substrate W is held horizontally with the direction Z as the normal direction in a state where the lower surface of the substrate W and the upper surface of the spin base 711 are separated in the vertical direction. The chuck pin 712 has a function of holding the substrate W apart from the spin base 711 on the upper side by gripping the peripheral edge of the substrate W.

When the spin motor 715 rotates the spin shaft 714 while the substrate W is gripped by the plurality of chuck pins 712, the substrate W rotates about the substrate rotation shaft A1 together with the spin base 711 and the chuck pins 712.

The treatment liquid supply mechanism 76 includes a chemical liquid nozzle 734, a chemical liquid pipe 735, and a chemical liquid valve 736. The chemical solution nozzle 734 functions as an upper surface nozzle that discharges the chemical solution toward the upper surface of the substrate W. The chemical solution pipe 735 is connected to the chemical solution nozzle 734. The chemical solution valve 736 is provided in the middle of the chemical solution pipe 735. The chemical solution is supplied to the chemical solution pipe 735 from the fluid box 703 via the chemical solution valve 736.

When the chemical solution valve 736 is opened, the chemical solution supplied from the chemical solution pipe 735 to the chemical solution nozzle 734 is discharged downward from the chemical solution nozzle 734. When the chemical solution valve 736 is closed, the discharge of the chemical solution from the chemical solution nozzle 734 is stopped.

The chemical solution nozzle 734 functions as a scan nozzle for discharging the chemical solution while moving so that the landing position of the chemical solution with respect to the upper surface of the substrate W moves between the central portion and the peripheral portion.

The substrate processing device 710 includes a chemical solution nozzle moving device 737. The chemical solution nozzle moving device 737 moves the chemical solution nozzle 734 to move the chemical solution landing position within the upper surface of the substrate W.

The chemical solution nozzle moving device 737 moves the chemical solution nozzle 734 between the processing position where the chemical solution discharged from the chemical solution nozzle 734 landed on the upper surface of the substrate W and the retracted position where the chemical solution nozzle 734 retracts around the spin chuck 75. Move.

The treatment liquid supply mechanism 76 includes a rinse liquid nozzle 738, a rinse liquid pipe 739, and a rinse liquid valve 740. The rinse liquid nozzle 738 functions as a top surface nozzle that discharges the rinse liquid toward the upper surface of the substrate W. The rinse liquid pipe 739 is connected to the rinse liquid nozzle 738. The rinse liquid valve 740 is provided in the middle of the rinse liquid pipe 739. The rinse liquid is supplied from the fluid box 703 to the rinse liquid pipe 739 via the rinse liquid valve 740.

When the rinse liquid valve 740 is opened, the rinse liquid supplied from the rinse liquid pipe 739 to the rinse liquid nozzle 738 is discharged downward from the rinse liquid nozzle 738. When the rinse liquid valve 740 is closed, the discharge of the rinse liquid from the rinse liquid nozzle 738 is stopped.

The rinse liquid nozzle 738 functions as a scan nozzle that discharges the treated rinse liquid while moving so that the landing position of the rinse liquid with respect to the upper surface of the substrate W moves between the central portion and the peripheral portion.

The substrate processing device 710 includes a rinse liquid nozzle moving device 741. The rinse liquid nozzle moving device 741 moves the rinse liquid nozzle 738 to move the landing position of the rinse liquid within the upper surface of the substrate W.

The rinse liquid nozzle moving device 741 moves the rinse liquid nozzle 738 to move the landing position of the rinse liquid within the upper surface of the substrate W.

The rinse liquid nozzle moving device 741 is located between a processing position where the rinse liquid discharged from the rinse liquid nozzle 738 is deposited on the upper surface of the substrate W and a retracted position where the rinse liquid nozzle 738 is retracted around the spin chuck 75. The rinse liquid nozzle 738 is moved.

The cup 77 is located outside the substrate W in the holding state (in the direction away from the substrate rotation axis A1). The cup 77 includes an outer wall 747, a plurality of treatment liquid cups, a plurality of guards, and a guard elevating device 755.

The outer wall 747 has a tubular shape and surrounds the spin chuck 75. The plurality of treatment liquid cups include a first treatment liquid cup 748, a second treatment liquid cup 749, and a third treatment liquid cup 750. The first treatment liquid cup 748, the second treatment liquid cup 749, and the third treatment liquid cup 750 all surround the spin chuck 75 between the spin chuck 75 and the outer wall 747.

The first treatment liquid cup 748 is located closer to the spin chuck 75 than the second treatment liquid cup 749. The second treatment liquid cup 749 is located outside the first treatment liquid cup 748. The third treatment liquid cup 750 is located outside the second treatment liquid cup 749.

The plurality of guards receive the processing liquid scattered around the substrate W. The plurality of guards surround the spin chuck 75 between the spin chuck 75 and the outer wall 747. The plurality of guards include a first guard 751, a second guard 752, a third guard 753, and a fourth guard 754.

The first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 are driven by the control of the guard elevating device 755, and independently and arbitrarily elevate and descend. By such raising and lowering, the used treatment liquid is guided to the first treatment liquid cup 748, the second treatment liquid cup 749, and the third treatment liquid cup 750, for example, depending on the type thereof. The guard elevating device 755 raises and lowers the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 independently of each other. The third treatment liquid cup 750 moves up and down together with the second guard 752. The third treatment liquid cup 750 is integrated with, for example, the second guard 752.

Each of the first treatment liquid cup 748, the second treatment liquid cup 749, and the third treatment liquid cup 750 forms an annular groove that opens upward. The treatment liquid guided to the first treatment liquid cup 748, the second treatment liquid cup 749, and the third treatment liquid cup 750 is sent to a recovery device or a waste liquid device (not shown) through these grooves.

Each of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 includes an inclined portion 756 and a guide portion 757. The inclined portion 756 has a cylindrical shape and goes inward from the bottom to the top. The guide portion 757 has a cylindrical shape and extends downward from the lower end of the inclined portion 756. The four inclined portions 756 are located so as to overlap each other. The four guides 757 are located coaxially.

The upper ends of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 are formed by the upper ends of the respective inclined portions 756. These upper ends have a diameter larger than that of the substrate W and the spin base 711.

The guide portion 757 of the first guard 751 is in the first treatment liquid cup 748, the guide portion 757 of the second guard 752 is in the second treatment liquid cup 749, and the guide portion 757 of the third guard 753 is in the third treatment liquid cup. Each can enter and exit within 750.

The guard elevating device 755 raises and lowers at least one of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754, so that the cup 77 can be unfolded and folded.

The guard elevating device 755 raises and lowers the first guard 751 between an upper position where the upper end of the first guard 751 is located above the substrate W and a lower position where the upper end of the first guard 751 is located below the substrate W. It has a function of holding the first guard 751 at an arbitrary position between the upper position and the lower position. The guard elevating device 755 has a function of raising and lowering and holding the second guard 752, the third guard 753, and the fourth guard 754 in the same manner.

The supply of the processing liquid to the substrate W and the drying of the substrate W are performed in a state where a plurality of guards face the peripheral surface of the substrate W. For example, when the third guard 753 faces the peripheral surface of the substrate W, the first guard 751 and the second guard 752 are arranged at the lower position, and the third guard 753 and the fourth guard 754 are arranged at the upper position. .. When the outermost fourth guard 754 is opposed to the peripheral surface of the substrate W, the fourth guard 754 is arranged at the upper position, and the first guard 751, the second guard 752, and the third guard 753 are at the lower position. Is placed in.

<Chuck pin 712>
Next, the detailed configuration of the chuck pin 712 will be described. FIG. 3 is a perspective view showing the main body 1 and the pin portion 2 constituting the chuck pin 712. A pin portion 2 is fitted into the main body 1 to form a chuck pin 712. In other words, the chuck pin 712 includes a main body 1 and a pin portion 2.

FIG. 3 shows a state in which the main body 1 and the pin portion 2 are separated from each other, not in a state in which the chuck pin 712 is configured. It is indicated by four chain lines parallel to the direction R2 that the pin portion 2 is fitted to the main body 1 along the direction R2. The direction R2 is inclined with respect to the direction Z, and is substantially perpendicular to the direction Z, for example.

The pin portion 2 is attached to the main body 1 along the direction R2. The direction R2 fluctuates due to rotation about the axis Q of the main body 1. The fluctuation of the direction R2 will be described later.

The direction R3 is the direction opposite to the direction R2, and the pin portion 2 can be separated from the main body 1 along the direction R3.

The main body 1 has an annular portion 10 through which the hole 102 opens and a shaft 101. The hole 102 penetrates along the direction Z. The hole 102 may be covered with, for example, a lid. For the lid, for example, PTFE (polytetrafluoroethylene) can be adopted.

The annular portion 10 and the shaft 101 are connected. The shaft 101 is driven by a mechanism (not shown), and the annular portion 10 rotates. For example, the central axis of the hole 102 is the axis Q, and the annular portion 10 rotates about the axis Q. The annular portion 10 is provided on the surface (upper surface) of the spin base 711 on the direction Z side, and the shaft 101 penetrates the spin base 711 along the direction Z.

The pin portion 2 grips the peripheral edge of the substrate W when the substrate W is held with the direction Z as the normal direction. The main body 1 has a groove 116 into which the pin portion 2 is fitted. The groove 116 opens on the direction R3 side and guides the pin portion 2 movably along the directions R2 and R3. The pin portion 2 can move from the direction R3 side along the direction R3 and be inserted into the groove 116, and can move along the direction R2 and be separated from the groove 116.

The groove 116 restrains the movement of the pin portion 2 in a direction other than the directions R2 and R3. Specific shapes for obtaining this constraint will be described below.

FIG. 4 is a side view of the main body 1 as viewed along the direction R2. The groove 116 has a bottom surface 111, a pair of side surfaces 113, and a pair of top surfaces 115. The bottom surface 111 and the top surface 115 face each other in the direction Z, and the side surface 113 is sandwiched between the top surface 115 and the bottom surface 111 and extends along the direction R2.

When viewed along the direction R2, the groove 116 opens in the direction D4 at the portion appearing on the right side of FIG. 4, and opens in the direction D5 at the portion appearing on the left side.

The directions D4 and D5 are inclined with respect to the direction Z, for example, perpendicular to the directions Z, R2 and R3, and opposite to each other. In this case, the pair of side surfaces 113 face each other in the direction D4 or the direction D5.

The main body 1 has a pair of side surfaces 114 facing each other in directions D4 and D5 on the Z side of the groove 116. The distance between the pair of side surfaces 114 facing each other is narrower than the distance between the pair of side surfaces 113 facing each other.

FIG. 5 is a cross-sectional view taken along the direction D4 at positions VV of the main body 1 (see FIG. 3). The position VV is in the center in the direction D4 while the side surfaces 113 face each other (see also FIG. 4). FIG. 6 is a perspective view showing the pin portion 2. FIG. 7 is a perspective view showing the chuck pin 712, showing a state in which the main body 1 and the pin portion 2 are fitted (hereinafter, tentatively referred to as “fitting state”). FIG. 8 is a cross-sectional view taken along the direction D4 at positions VIII-VIII of the chuck pin 712. Positions VIII-VIII are centered in direction D4 while the sides 113 face each other. In FIG. 6, the direction when the mated state is obtained is also added.

In FIG. 7, the edge of the groove 116 on the direction R3 side is drawn so as to be deviated from the edge of the end surface 231 on the direction R3 side. This depiction is due to the fact that FIG. 7 is an inclined perspective view having a depression angle with respect to the direction R2, and the edge of the groove 116 on the direction R3 side maintains the position in the direction Z while the direction is in the vicinity of the annular portion 10. It is shown to incline with respect to D4 and D5.

The pin portion 2 has a grip portion 21 that grips the peripheral edge of the substrate W, a guide surface 232, and an overhanging portion 22 that fits into the groove 116. The grip portion 21 exhibits a recess having a function of gripping the peripheral edge of the substrate W. The direction in which the recess is opened is the direction R3 in the fitted state. The guide surface 232 guides the substrate W to the grip portion 21 along the direction Z. Details of the guide surface 232 will be described later.

The pin portion 2 has a side surface 214 between the grip portion 21 and the overhanging portion 22, more specifically, between the guide surface 232 and the overhanging portion 22. The side surface 214 faces the side surface 114 in the mated state in directions D4 and D5.

The overhanging portion 22 overhangs the side surface 214. The overhanging direction is along the directions D4 and D5 in the fitted state.

The overhanging portion 22 has a pair of upper surfaces 215, a pair of side surfaces 213, and a bottom surface 211. The upper surface 215 faces the upper surface 115 in the direction Z in the fitted state. The side surface 213 faces the side surface 113 in the mated state in the directions D4 and D5. The bottom surface 211 faces the bottom surface 111 in the fitted state along the direction Z.

(i) In the fitted state, the upper surface 115 suppresses the upper surface 215 from moving along the direction Z. As a result, the pin portion 2 is restricted from moving along the direction Z.

(ii) In the fitted state, the upper surface 115 suppresses the upper surface 215 from moving along the direction Z. In the fitted state, the bottom surface 111 suppresses the bottom surface 211 from moving in the direction opposite to the direction Z. Therefore, the movement of the overhanging portion 22 and the pin portion 2 along the direction Z and the opposite direction is restricted.

(iii) In the fitted state, the side surface 113 suppresses the side surface 213 from moving along the directions D4 and D5. Therefore, the movement of the overhanging portion 22 and the pin portion 2 along the directions D4 and D5 is restricted.

As understood from the above (i), (ii), and (iii), the groove 116 functions to restrain the movement of the pin portion 2 in the directions other than the directions R2 and R3.

As described above, in the chuck pin 712, the pin portion 2 is detachable from the main body 1, and the movement in the direction of attachment / detachment, that is, in the above-mentioned example, in a direction other than the directions R2 and R3 is restricted.

When the substrate W is held, the pin portion 2 that grips the peripheral edge thereof is separated from the main body 1 along the direction R3, and is attached to the main body 1 along the direction R2 from the direction R3 side toward the groove 116. Therefore, not only is it not necessary to replace the entire chuck pin 712, but it is also easy to replace the pin portion 2.

Since the groove 116 opens in the directions D4 and D5, as can be understood from the above (i) and (ii), screwing is not required and the movement of the pin portion 2 in the direction Z is suppressed.

From the above, the following description can be made: The chuck pin 712 has a main body 1 and a pin portion 2. The pin portion 2 is provided on the spin base 711 and grips the peripheral edge of the substrate W when the substrate W is held. The main body 1 has a groove 116 into which the pin portion 2 is fitted. The groove 116 movably guides the pin portion 2 along the direction R2 inclined with respect to the direction Z and the direction R3 opposite to the direction R2, and guides the pin portion 2 in a direction other than the directions R2 and R3. The movement is restrained and the opening is made on the direction R3 side.

The following description is also possible: The substrate processing apparatus 710 processes the substrate W with the processing liquid. The substrate processing apparatus 710 has a processing liquid supply mechanism 76 that supplies the processing liquid to the substrate W, a spin base 711 on which the substrate W is placed with the direction Z as the normal direction, and a spin base 711 centered on the substrate rotation axis A1. A rotation drive mechanism 716 for rotating and a chuck pin 712 are provided.

The following description is also possible: The substrate processing system 700 includes a substrate processing apparatus 710 and a center robot 708 that functions as a conveying mechanism for conveying the substrate W to the substrate processing apparatus 710.

For example, the main body 1 and the pin portion 2 are made of different materials. For example, it is desirable to form the main body 1 with ceramics from the viewpoint of preventing expansion. Silicon carbide (SiC) can be exemplified as the ceramic.

For example, it is desirable that the pin portion 2 is made of a material containing a synthetic resin from the viewpoint that the substrate W is not easily cracked when gripping the peripheral edge of the substrate W. Examples of the material include PTFE-CNT (carbon nanotube) and PFA (Perfluoroalkoxy alkane) -CF (carbon fiber). These materials are advantageous in terms of being conductive and having a small coefficient of thermal expansion. PTFE-CNT is even more advantageous from the viewpoint of being rich in chemical resistance.

The pin portion 2 has an end surface 221 located on the direction R2 side and an end surface 231 located on the direction R3 side in the fitted state. The end face 231 appears to be sandwiched by the grooves 116 in the directions D4 and D5 when viewed along the direction R2 in the fitted state (see FIG. 7).

A hole 120 is opened in the main body 1. The hole 120 exposes the pin portion 2 on the direction R2 side, and more specifically, the end face 221 (see FIG. 8).

By pushing the pin portion 2 from the hole 120 against the pin portion 2 in the fitted state, for example, by pushing the pin portion 2 in the direction R3 via a rod (not shown) penetrating the hole 120, the pin portion It is easy to separate 2 from the main body 1.

FIG. 9 is a cross-sectional view of the main body 1 and the pin portion 2 in the fitted state. FIG. 9 shows a cross section seen along the direction R2 at a position where the groove 116 and the overhanging portion 22 appear in the direction R2.

The side surfaces 114 and 214 located on the D4 side (left side of the drawing) and facing each other are shown to be in contact with each other. The side surfaces 114 and 214 located on the D5 side (right side of the drawing) and facing each other are shown to be in contact with each other.

When the pin portion 2 is made of synthetic resin and the main body 1 is made of ceramics as described above, when the pin portion 2 is fitted to the main body 1, the pin portion 2 moves toward the main body 1 along the direction R2. Is press-fitted. Therefore, if the tolerance in the process of manufacturing the main body 1 and the pin portion 2 is ignored, it can be assumed that the distance between the opposing side surfaces 114 and 214 becomes substantially zero. However, since the tolerance actually exists, the distance is not necessarily substantially zero. The distance between the opposing upper surfaces 115 and 215 is also not substantially zero. Therefore, it is assumed that the processing liquid flows between the main body 1 and the pin portion 2 in the fitted state, for example, through the side surfaces 114 and 214 and the upper surfaces 115 and 215.

Although not shown in detail in FIG. 7, there is a gap of a distance d31 between the side surfaces 113 and 213 located on the direction D4 side (left side of the drawing) and facing each other. Although not shown in detail in FIG. 7, there is a gap with a distance d32 between the side surfaces 113 and 213 located on the direction D5 side (right side in the drawing) and facing each other. The distances d31 and d32 are designed to be, for example, about several mm. As a result, a flow path along the direction R2 is formed between the pin portion 2 fitted to the groove 116 and the groove 116, and the flow path communicates with the hole 120. Therefore, even when the processing liquid flows between the main body 1 and the pin portion 2 in the mated state via, for example, between the side surfaces 114 and 214, the processing liquid flows from the chuck pin 712 through the hole 120. It is discharged.

That is, the hole 120 may function as a discharge port for the treatment liquid. It is desirable that the treatment liquid supplied to the substrate W is discharged from the viewpoint of suppressing the residual fine particles on the substrate W.

Notches along the direction R2 may be provided on at least one of the side surfaces 114 and 214, or on at least one of the top surfaces 115 and 215. The notch may be along direction Z. Since these cuts can serve as a flow path when the treatment liquid is discharged, the treatment liquid is likely to be discharged even if the flow path between the side surfaces 113 and 213 is filled.

10 and 11 are plan views showing the positions of the chuck pins 712, both of which are viewed from the direction opposite to the direction Z. FIG. 10 shows a mounted state, and FIG. 11 shows a gripped state. The mounted state and the gripped state are realized by rotating the main body 1 about the axis Q. In other words, the main body 1 can rotate about the axis Q along the direction Z, and the rotation realizes whether or not the pin portion 2 grips the peripheral edge of the substrate W.

In order to improve visibility, the peripheral edge of the substrate W is indicated by a chain double-dashed line in both FIGS. 10 and 11. In FIG. 10, the shape of the chuck pin 712 that appears only in the gripped state is shown by the alternate long and short dash line, and in FIG. 11, the shape of the chuck pin 712 that appears only in the mounted state is indicated by the alternate long and short dash line.

In the mounted state, the peripheral edge of the substrate W is mounted on the guide surface 232 and is not gripped by the grip portion 21 (see FIG. 10). In the gripped state, the peripheral edge of the substrate W is gripped by the gripping portion 21 and is separated from the guide surface 232 (see FIG. 11). The guide surface 232 realizes whether or not the peripheral edge of the substrate W is gripped by the pin portion 2 by rotating the main body 1. In order to fulfill such a function, the guide surface 232 has an inclination, and the inclination rises in the direction Z toward the direction R2 in the fitted state. The guide surface 232 can guide the substrate W to the grip portion 21 along the direction R2, or the guide surface 232 can guide the substrate W to the grip portion 21 along the direction Z.

The guide surface 232 has a shape that becomes wider toward the direction R2 in the fitted state. Such a shape is desirable from the viewpoint that the treatment liquid does not remain on the chuck pin 712.

Since the main body 1 rotates about the axis Q to switch between the mounted state and the gripped state, the direction R2 differs between the mounted state and the gripped state (direction R2 fluctuates). From the viewpoint that the hole 120 functions as a discharge port, it is desirable that the direction R2 is less than 90 degrees with respect to the direction r from the substrate rotation axis A1 to the chuck pin 712 in both the mounted state and the gripped state. This is because the centrifugal force applied to the pin portion 2 with the rotation of the spin base 711 makes it difficult for the pin portion 2 to separate and makes it easier for the treatment liquid to be discharged from the hole 120.

The pin portion 2 is press-fitted into the main body 1. If the press-fitting is possible, the length of the pin portion 2 may be set longer than the length of the main body 1 in any of the directions perpendicular to the direction R2. The press-fitted pin portion 2 tends to adhere to the main body 1 due to the creep phenomenon.

The bottom surface 111 is provided with a recess 112 (see FIGS. 3, 5, 8 and 9), and the bottom surface 211 is provided with a convex portion 212 (see FIGS. 6, 8 and 9). FIG. 9 shows a cross section in the direction R2 at a position where the concave portion 112 and the convex portion 212 do not appear, and thus the concave portion 112 and the convex portion 212 are indicated by a broken line as a hidden line.

By press-fitting the pin portion 2 into the main body 1, the pin portion 2 can be inserted in the direction R2 along the groove 116 even though the convex portion 212 is present.

In the fitted state, the convex portion 212 fits with the concave portion 112. From this point of view, the concave portion 112 functions as a first fitting portion included in the groove 116, and the convex portion 212 functions as a second fitting portion included in the pin portion 2.

By fitting the convex portion 212 with the concave portion 112, the movement of the pin portion 2 in both the directions R2 and R3, or the directions R2 and R3 is restricted. This is desirable from the viewpoint that the pin portion 2 is restricted from being detached from the main body 1 except when it is attached and detached.

However, the strength with which the convex portion 212 fits with the concave portion 112 is limited to the extent that the pin portion 2 is separated from the outside along the direction R3.

The first fitting portion may be provided on, for example, the upper surface 115 or the side surface 113 other than the bottom surface 111. In this case, the second fitting portion is provided on the upper surface 215 and the side surface 213, respectively.

However, even if the convex portion 212 is not provided and only the concave portion 112 is provided, the effect of restricting the movement of the pin portion 2 in both the direction R2 and the direction R3, or the directions R2 and R3 can be obtained. This is because the pin portion 2 is press-fitted into the main body 1, and the press-fitted pin portion 2 penetrates into the recess 112 by a creep phenomenon.

From this point of view, it can be said that the groove 116 has a step with respect to the direction R2 to obtain the above effect, and the step is formed by the recess 112.

However, when the convex portion 212 is not provided, it is desirable that a fitted state can be obtained with a so-called “tightening fit”. Specifically, it is desired that the distance between the upper surface 215 and the bottom surface 211 before the fitting state is obtained is larger than the distance between the upper surface 115 and the bottom surface 111 with a predetermined fitting tolerance.

The above effect can also be obtained when the groove 116 has a step with respect to the direction R2 on either one side surface 113 or both of the pair of side surface 113s. When the second fitting portion is not provided, the distance between the pair of side surfaces 213 before the fitting state is obtained may be larger than the distance between the pair of side surfaces 113 with a predetermined fitting tolerance. desired.

The main body 1 has a portion 12 located on the Z side in the direction Z with respect to the hole 120. The portion 12 exhibits a surface 121 on the direction R3 side and a surface 122 on the direction Z side. In the fitted state, the surface 121 comes into contact with the end surface 221 (see FIG. 8). Due to such contact, the movement of the pin portion 2 in the direction R2 is restricted. In other words, the surface 121 of the main body 1 restrains the movement of the pin portion 2 toward the direction R2. Such restraint is desirable from the viewpoint of supporting the pin portion 2 against the centrifugal force acting on the pin portion 2 due to the rotation of the spin base 711.

The pin portion 2 has a surface 222 with respect to the grip portion 21 on the Z side in the direction Z with respect to the end surface 221. In the fitted state, the surface 222 faces the surface 122. It is desirable that the surface 222 comes into contact with the surface 122 as illustrated in FIG. 8 from the viewpoint that the treatment liquid does not flow between the pin portion 2 and the main body 1.

However, even if the processing liquid flows between the surfaces 222 and 122 or between the surface 121 and the end surface 221 on the chuck pin 712, the processing liquid is discharged from the chuck pin 712 via the hole 120. To.

The main body 1 has an upper surface 123 on the Z side in the direction Z, and is adjacent to the side surface 114. The boundary between the top surface 123 and the side surface 114 typically extends along direction R2. The pin portion 2 has an upper surface 233 on the direction Z side and is adjacent to the side surface 214. The direction in which the boundary between the upper surface 233 and the side surface 214 extends is typically parallel to the direction R2 in the fitted state.

In the fitted state, the upper surface 123 is exposed in the vicinity of the pin portion 2 on the direction Z side of the main body 1. In the fitted state, the upper surface 233 is exposed in the vicinity of the main body 1 on the Z side in the direction Z of the pin portion 2. However, the guide surface 232 is exposed further on the Z side of the upper surface 233.

In the fitted state, the upper surface 233 projects toward the direction Z side at a distance t from the upper surface 123 (see FIGS. 7 and 8). Therefore, the boundary between the upper surface 123 and the side surface 114 and the boundary between the upper surface 233 and the side surface 214 are separated from each other via a distance t.

Such separation is advantageous from the viewpoint of suppressing the retention of the treatment liquid between the main body 1 and the pin portion 2. When the main body 1 and the pin portion 2 are formed and chamfered at the above two boundaries, a V-shaped groove is generated by the two chamfer surfaces. The volume of the groove is smaller when the distance t is positive than when the distance t is zero.

It is not desirable that the upper surface 123 protrudes in the Z direction from the upper surface 233 in the fitted state. This is because the upper surfaces 123 and 233 form recesses, and on the contrary, the treatment liquid is retained.

[Modification example of chuck pin 712]
FIG. 12 is a cross-sectional view showing the first deformation of the chuck pin 712. FIG. 12 shows a cross section seen from the direction Z at the position where the side surfaces 114 and 214 appear in the direction Z. In the first deformation, the distance between the side surfaces 114 increases toward the direction R2. For example, in comparison between the end portion of the side surface 114 on the direction R3 side and the end portion on the direction R2 side, the distance is increased by 0.1 to 0.2 mm. In FIG. 12, a case where the side surface 114 expands in each of the directions D4 and D5 is illustrated. As a result, the pin portion 2 is prevented from moving in the direction R3 with respect to the main body 1.

It is desirable that the side surfaces 114 and 214 come into contact with each other in the fitted state. Therefore, the distance between the side surfaces 214 also increases in the mated state toward the direction R2. In the fitted state, the pin portion 2 increases in size along the direction R2 in at least one of the directions D4 and D5. In order to mount the pin portion 2 on the main body 1, the minimum value of the lengths of the side surfaces 114 facing each other along the direction D4 (which appears on the direction R3 side) face each other before mounting. It is desirable that the distance between the side surfaces 214 is equal to or greater than the maximum value of the distance along the direction D4 (this appears on the direction R2 side). However, by forming the pin portion 2 using the synthetic resin as the main material as described above, the side surfaces 114 and 214 can be brought into contact with each other by the creep phenomenon.

FIG. 13 is a cross-sectional view showing a second deformation of the chuck pin 712. FIG. 13 shows a cross section seen from the direction D4 at the position where the bottom surfaces 111, 211 and the top surfaces 115 and 215 appear in the direction D4. In the second deformation, the distance between the bottom surface 111 and the top surface 115 increases toward the direction R2. For example, in comparison between the end portion on the direction R3 side of the bottom surface 111 and the end portion on the direction R2 side, the distance is 0.1 to 0.2 mm wider. In FIG. 13, the upper surface 115 expands in the direction Z, and the bottom surface 111 expands in the direction opposite to the direction Z. As a result, the pin portion 2 is prevented from moving in the direction R3 with respect to the main body 1.

In the fitted state, it is desirable that the bottom surfaces 111, 211 and the top surfaces 115, 215 are in contact with each other, respectively. Therefore, the distance between the upper surface 215 and the bottom surface 211 also increases in the fitted state in the direction R2. In the fitted state, the pin portion 2 increases in size along the direction R2 in at least one of the direction Z and the direction opposite to the direction Z. In order to mount the pin portion 2 on the main body 1, before mounting the pin portion 2, the minimum value of the length along the direction Z between the upper surface 115 and the bottom surface 111 (which appears on the direction R3 side) is set to the upper surface 215. It is desirable that the distance from the bottom surface 211 along the direction Z is equal to or greater than the maximum value (which appears on the direction R2 side). However, by forming the pin portion 2 using the synthetic resin as the main material as described above, the bottom surfaces 111, 211 can be brought into contact with each other by the creep phenomenon, and the top surfaces 115, 215 can be brought into contact with each other.

In the second modification, the size of the pin portion 2 may increase along the direction R2 in a direction opposite to the direction Z and the direction Z and in a direction other than the directions D4 and D5.

FIG. 14 is a cross-sectional view showing a third deformation of the chuck pin 712. FIG. 14 shows a cross section seen from the direction D4 at the position where the convex portion 212 and the concave portion 112 appear in the direction D4. In the third deformation, the diameter of the recess 112 increases in the direction Z. The shape of such a concave portion 112 is desirable from the viewpoint that the strength with which the convex portion 212 fits can be weakened and the pin portion 2 can be easily attached to and detached from the main body 1.

It is desirable that the convex portion 212 comes into contact with the concave portion 112 in the fitted state. Therefore, the shape of the convex portion 212 also expands toward the direction Z in the fitted state. In such a case, the length along the direction Z of the overhanging portion 22 is wider than the length along the direction Z on the direction R3 side of the groove 116. However, by forming the pin portion 2 with the synthetic resin as the main material as described above, the pin portion 2 can be press-fitted to be fitted to the main body 1.

[Combining body 1 with spin base 711]
From the viewpoint that the main body 1 can also be replaced, it is desirable that the main body 1 is also removable with respect to the spin base 711.

FIG. 15 is a cross-sectional view partially showing a cross section of the chuck pin 712 and the chuck opening / closing mechanism 713. The cross section is parallel to the direction Z.

The chuck opening / closing mechanism 713 has a chuck pin shaft 33, a support mechanism 32, and a base portion 31. The chuck pin shaft 33 rotates the main body 1, more specifically, the shaft 101 about the axis Q. The base portion 31 rotatably supports the chuck pin shaft 33. The support mechanism 32 supports the base portion 31 from the side opposite to the direction Z via the packings 91 and 92, and supports the chuck pin shaft 33 in a direction inclined with the direction Z. The main body 1 is removable from the base portion 31, and the base portion 31 is also removable from the support mechanism 32.

The packings 91 and 92 are both annular, and surround the base portion 31 around the axis Q. The packing 92 is separated from the shaft Q and has high chemical resistance as compared with the packing 91.

For example, the material of the packing 91 is FFKM (a rubbery copolymer in which all side chains are fluoro and perfluoroalkyl or perfluoroalkoxy groups), and the material of the packing 92 is PTFE.

With such an arrangement of the packings 91 and 92, deterioration of the packing 91 is prevented even if the processing liquid comes into contact with the surroundings of the chuck opening / closing mechanism 713.

In the above embodiment, the chuck pin 712 can be in two states, a mounted state and a gripped state. However, the fitting of the main body 1 and the pin portion 2 and the structure contributing to the fitting are not premised on being able to take two states, a mounted state and a gripped state. In other words, the fitting of the main body 1 and the pin portion 2 and the structure contributing to the fitting can be applied to the chuck pin which can take only one of the mounted state and the gripped state.

Although the present invention has been described in detail, the above description is exemplary in all aspects and the invention is not limited thereto. It is understood that innumerable variations not illustrated can be assumed without departing from the scope of the present invention. Each configuration described in the above-described embodiment and each modification can be appropriately combined or omitted as long as they do not conflict with each other.

1 Main body 2 Pin part 21 Grip part 31 Base part 33 Chuck pin shaft 91 (1st) packing 92 (2nd) packing 112 Recess (step)
116 Groove 120 Hole 121 Surface 232 Guide surface 700 Board processing system 710 Board processing device 711 Spin base 712 Chuck pin 716 Rotation drive mechanism 708 Conveyance mechanism D4, D5 (4th) direction Q axis R2 (2nd) direction R3 ( Third) direction W board Z (first) direction

Claims (12)

A pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction,
A main body having a groove into which the pin portion is fitted is provided.
The groove movably guides the pin portion along a second direction inclined with respect to the first direction and a third direction opposite to the second direction, and the second direction. A chuck pin that restrains the movement of the pin portion in a direction other than the direction of the third direction and the direction other than the third direction, and opens in the third direction side. The chuck pin according to claim 1, wherein the groove opens in a fourth direction inclined with respect to the first direction when viewed along the second direction. The chuck pin according to claim 1 or 2, wherein a hole for exposing the pin portion in the second direction side is opened in the main body. The chuck pin according to claim 3, wherein a flow path along the second direction is formed between the pin portion fitted in the groove and the groove, and the flow path communicates with the hole. The chuck pin according to any one of claims 1 to 4, wherein the groove has a step with respect to the second direction. The main body
The chuck pin according to any one of claims 1 to 5, further comprising a surface for restraining the movement of the pin portion in the second direction side. The chuck pin according to any one of claims 1 to 6, wherein the main body can rotate about an axis along the first direction. The pin portion is
A grip portion that grips the peripheral edge and
The chuck pin according to claim 7, further comprising a guide surface for guiding the substrate to the grip portion along the first direction. A substrate processing device that processes a substrate using a processing liquid.
A supply mechanism for supplying the treatment liquid to the substrate, and
A spin base on which the substrate is placed with the first direction as the normal direction,
A rotation drive mechanism that rotates the spin base around a rotation axis,
A chuck pin provided on the spin base and having a pin portion for gripping the peripheral edge of the substrate when the substrate is held is provided.
The chuck pin
Further having a main body having a groove into which the pin portion is fitted,
The groove movably guides the pin portion along a second direction inclined with respect to the first direction and a third direction opposite to the second direction, and the second direction. A substrate processing device that restrains the movement of the pin portion in a direction other than the direction of the above and the direction other than the third direction and opens in the third direction side. The substrate processing apparatus according to claim 9, wherein the main body is removable from the spin base. A chuck pin shaft that rotates the main body about an axis along the first direction, and a chuck pin shaft.
A base portion that rotatably supports the chuck pin shaft and
Each further comprising an annular first packing and a second packing surrounding the base portion around the shaft.
The substrate processing apparatus according to claim 9, wherein the second packing is separated from the shaft and has higher chemical resistance as compared with the first packing. The substrate processing apparatus according to any one of claims 9 to 11.
A substrate processing system including a transport mechanism for transporting the substrate to the substrate processing apparatus.

Images