JP7406957B2 - Chuck pins, substrate processing equipment, substrate processing systems - Google Patents

Description

The present invention relates to a technique for holding a substrate. Substrates to be held include, for example, semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photosensitive disks. This includes mask substrates, ceramic substrates, solar cell substrates, etc.

In the manufacturing process of semiconductor devices, liquid crystal display devices, etc., single-wafer processing equipment (hereinafter referred to as "single-wafer processing equipment") processes substrates one by one, or processes multiple substrates at once. A batch type substrate processing apparatus is used. In a typical single-wafer processing apparatus, one substrate is held horizontally in a processing chamber, and the substrate is rotated or a processing liquid (chemical solution or rinsing liquid) is supplied to the substrate depending on the content of the processing.

A single wafer processing apparatus may include a plurality of chuck pins along the rotation direction on a spin base that rotates about a rotation axis, for example. In such a single-wafer processing apparatus, the substrate is held by the chuck pins pinching the periphery of the substrate (hereinafter referred to as "gripping").

For example, Patent Documents 1 to 4 exemplify techniques in which a substrate is held using a plurality of chuck pins provided on a spin base. For example, in Patent Document 1, a structure that functions as a chuck pin has a structure in which a main body member provided on a spin base and a substrate holding member are sandwiched between a fastening screw and a support base member that are threaded together along a vertical axis. A structure is disclosed.

For example, in Patent Document 4, a core material is fixed to a support member by a fastening member, and the fastening member has a male thread. A structure is disclosed in which each of the support members is provided with a female thread. The core material is covered with a conductive member pressed against the outer periphery of the substrate. The support member is connected to the chuck opening/closing mechanism and rotates about the vertical center line of the support member.

Japanese Patent Application Publication No. 2005-19701 Japanese Patent Application Publication No. 2014-241390 Japanese Patent Application Publication No. 2015-170609 JP2017-228582A

Considering that the chuck pin may be deformed or worn out, it is desirable that the part that holds the substrate in particular be replaceable. In the structures disclosed in Patent Documents 1 and 4, replacing the part that holds the substrate requires an operation of rotating a screw, and this operation requires a lot of time.

One of the objects of the present invention is to provide a chuck pin in which a portion for holding a substrate can be easily replaced.

In order to solve the above problems, the chuck pin has a main body having a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction, and a groove into which the pin portion fits. Equipped with. The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and The pin portion is restrained from moving in directions other than the direction and the third direction, and is opened in the third direction.

In the chuck pin of the first aspect , the groove opens in a fourth direction that is inclined with respect to the first direction when viewed along the second direction.

In the chuck pin of the second aspect , the main body has a hole opened in the second direction to expose the pin portion in the second direction.

A third aspect is the chuck pin of the second aspect, wherein a flow path along the second direction is formed between the pin portion fitted in the groove and the groove, and the flow path is formed in the second direction. communicates with the hole.

In the chuck pin of the fourth aspect, the groove has a step in the second direction.

In the chuck pin of the fifth aspect, the main body further includes a surface that restricts movement of the pin portion in the second direction.

In the chuck pin of the sixth aspect, the main body is rotatable about an axis along the first direction.

A seventh aspect is the chuck pin according to the sixth aspect, wherein the pin portion includes a gripping portion that grips the peripheral edge and a guide surface that guides the substrate to the gripping portion along the first direction. have

A substrate processing apparatus that processes a substrate using a processing liquid includes: a supply mechanism that supplies the processing liquid to the substrate; a spin base on which the substrate is placed with a first direction as a normal direction; The spin base includes a rotation drive mechanism that rotates the spin base around a rotation axis, and a chuck pin that is provided on the spin base and has a pin portion that grips the periphery of the substrate when the substrate is held. The chuck pin further includes a main body having a groove into which the pin portion fits, and the groove has a second direction inclined with respect to the first direction and a direction opposite to the second direction. The pin part is movably guided along a certain third direction, the movement of the pin part in directions other than the second direction and the third direction is restrained, and in the third direction side Open your mouth.

In the substrate processing apparatus of the eighth aspect, the main body is removable from the spin base.

A substrate processing apparatus according to a ninth aspect includes a chuck pin shaft that rotates the main body about an axis along the first direction, a base portion that rotatably supports the chuck pin shaft, and the base portion. The apparatus further includes a first packing and a second packing, both of which are annular, surrounding the shaft. The second packing is further away from the axis and has higher chemical resistance than the first packing.
A tenth aspect is the substrate processing apparatus according to the ninth aspect, in which the main body is removable from the spin base.

A 11th aspect is a substrate processing system, comprising the substrate processing apparatus according to any of the 8th to 10th aspects, and a transport mechanism that transports the substrate to the substrate processing apparatus.
A twelfth aspect is a substrate processing system, which includes a substrate processing apparatus that processes a substrate using a processing liquid, and a transport mechanism that transports the substrate to the substrate processing apparatus. The substrate processing apparatus includes a supply mechanism that supplies the processing liquid to the substrate, a spin base on which the substrate is placed with a first direction as a normal direction, and a rotation mechanism that rotates the spin base around a rotation axis. The invention includes a drive mechanism, and a chuck pin provided on the spin base and having a pin portion that grips a peripheral edge of the substrate when the substrate is held. The chuck pin further includes a main body having a groove into which the pin portion fits. The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and The pin portion is restrained from moving in directions other than the direction and the third direction, and is opened in the third direction.

According to the above -mentioned chuck pin, the pin portion that grips the peripheral edge of the substrate when the substrate is held is detached from the main body along the third direction and attached to the main body from the third direction side into the groove along the second direction. This makes it easy to replace.

According to the chuck pin of the first aspect, no screwing is required and movement of the pin portion in the first direction is suppressed.

According to the chuck pin of the second aspect, it is easy to push the pin portion through the hole and separate the pin portion from the main body.

According to the chuck pin of the third aspect, the processing liquid supplied to the substrate is discharged via the chuck pin.

According to the chuck pin of the fourth aspect, the pin portion is restricted from detaching from the main body except during attachment and detachment.

According to the chuck pin of the fifth aspect, the pin portion is supported against the centrifugal force acting on the pin portion during rotation of the spin base.

According to the chuck pin of the sixth aspect, the rotation of the main body allows the pin portion to grip the peripheral edge of the substrate.

According to the chuck pin of the seventh aspect, the rotation of the main body allows the pin portion to grip the peripheral edge of the substrate.

According to the above -described substrate processing apparatus, the pin portion that grips the peripheral edge of the substrate when the substrate is held is detached from the main body along the third direction, and is moved from the third direction side into the groove along the second direction of the main body. It can be easily replaced by being attached to the

According to the substrate processing apparatuses of the eighth and tenth aspects, the main body is also replaceable.

According to the substrate processing apparatus of the ninth aspect, deterioration of the first packing is prevented.

According to the substrate processing systems of the eleventh and twelfth aspects, the pin portion that grips the peripheral edge of the substrate when the substrate is held is detached from the main body along the third direction, and is separated from the main body from the third direction side. By being attached to the main body along the second direction into the groove, replacement is easy.

1 is a plan view schematically illustrating the configuration of a substrate processing system. FIG. 1 is an overall diagram illustrating a schematic configuration of one substrate processing apparatus. It is a perspective view showing a main body and a pin part. FIG. 3 is a side view of the main body. FIG. 3 is a sectional view of the main body. It is a perspective view showing a pin part. It is a perspective view showing a chuck pin. It is a sectional view of a chuck pin. It is a sectional view of a main body and a pin part. FIG. 3 is a plan view showing the position of the chuck pin. FIG. 3 is a plan view showing the position of the chuck pin. FIG. 7 is a cross-sectional view showing a first modification of the chuck pin. FIG. 7 is a cross-sectional view showing a second modification of the chuck pin. FIG. 7 is a sectional view showing a third modification of the chuck pin. FIG. 2 is a cross-sectional view partially showing a cross section of a chuck pin and a chuck opening/closing mechanism.

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the components described in this embodiment are merely examples, and the scope of the present invention is not intended to be limited thereto. In the drawings, dimensions and numbers of parts may be exaggerated or simplified as necessary to facilitate understanding.

Note that in this embodiment, "holding" refers to maintaining the position of the object to be held, "placing" refers to placing the object on it, and "grasping" refers to directly holding the object. ``Holding'' is a concept that includes both ``placing'' and ``gripping.''

In particular, the state where the periphery of the substrate is gripped by the chuck pins is called the "gripping state", and the state where the board is simply placed on the chuck pins without the periphery of the board being gripped by the chuck pins is called the "mounted state". ”. Moreover, the state in which the substrate is held, regardless of the gripping state or the mounting state, is referred to as a "holding state."

[Substrate processing system configuration]
FIG. 1 is a plan view schematically illustrating the configuration of a substrate processing system 700. In this embodiment, direction Z is introduced to facilitate understanding of the invention. Typically, direction Z is a vertically upward direction.

The substrate processing system 700 includes a substrate processing apparatus 710 and a central robot 708. In FIG. 1, the substrate processing apparatuses 710 are provided in four groups 71, and each group 71 is provided with three substrate processing apparatuses 710.

The substrate processing apparatus 710 is a single-wafer processing apparatus that processes the substrate W using a processing liquid. The concept of the processing liquid includes a chemical liquid and a rinsing liquid, which will be described later. Examples of chemical solutions include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (for example, citric acid, oxalic acid, etc.), organic alkalis (for example, TMAH: tetramethylammonium hydroxide, etc.), Included are liquids containing at least one of a surfactant and a corrosion inhibitor. Examples of the rinsing liquid supplied to the rinsing liquid nozzle 738 include pure water (deionized water), carbonated water, electrolyzed ionized water, hydrogen water, ozone water, IPA (isopropyl alcohol), and hydrochloric acid water. can be mentioned.

The substrate W is, for example, a semiconductor wafer and has a disk shape. The center robot 708 is a transport mechanism that transports the substrate W to the substrate processing apparatus 710.

The substrate processing system 700 further includes a fluid cabinet 702, a fluid box 703, a load port 706, and an indexer robot 709.

Fluid cabinet 702 contains the processing liquid described above. Fluid cabinet 702 can further contain gases employed in processing substrate W. The fluid box 703 supplies the processing liquid or the processing liquid and the above gas from the fluid cabinet 702 to the substrate processing apparatus 710 . In FIG. 1, a case is illustrated in which a fluid box 703 is provided for each set 71.

Each load port 706 can accommodate a plurality of substrates W. For example, the substrates W are stacked and accommodated at the load port 706. Between the center robot 708 and the load port 706, the substrate W is transported by an indexer robot 709. The substrate W is transported by the central robot 708 between the indexer robot 709 and the substrate processing apparatus 710.

The operation of the substrate processing apparatus 710, the operation of the center robot 708, and the operation of the indexer robot 709 are controlled by the control device 73. In FIG. 1, a case is illustrated in which the control device 73 is included in a substrate processing system 700.

The control device 73 includes, for example, a control section 731 and a storage section 732. The control unit 731 can be realized by a microcomputer. Storage unit 732 stores computer programs. The control unit 731 executes a computer program stored in the storage unit 732.

The storage unit 732 further stores recipe data. The recipe data includes information indicating multiple recipes. Each recipe defines the contents and procedures for transporting the substrate W and processing the substrate W, respectively.

Storage unit 732 includes a main storage device and an auxiliary storage device. The main storage device and the auxiliary storage device are realized by semiconductor memory, for example. The auxiliary storage device may be implemented by another storage device, such as a hard disk drive, or by a removable medium.

[Substrate processing equipment configuration]
FIG. 2 is an overall view illustrating the outline of the configuration of one substrate processing apparatus 710. The control device 73 controls the operation of devices provided in the substrate processing apparatus 710 and the opening and closing of valves.

The substrate processing apparatus 710 includes a chamber 74 , a spin chuck 75 , a processing liquid supply mechanism 76 , and a cup 77 .

The chamber 74 is box-shaped and has an internal space. The spin chuck 75 functions as a substrate holding mechanism that holds one substrate W in a horizontal position within the chamber 74 . The spin chuck 75 rotates the substrate W around the substrate rotation axis A1, which is a vertical line (here, parallel to the direction Z). The substrate rotation axis A1 passes through the center of the substrate W, for example. The processing liquid supply mechanism 76 supplies a processing liquid to the surface (principal surface) to be processed of the substrate W held by the spin chuck 75 . The cup 77 is cylindrical and surrounds the spin chuck 75 around the substrate rotation axis A1.

The chamber 74 includes a partition wall 78, an FFU (fan filter unit) 79, and an exhaust duct 72. The partition wall 78 is box-shaped and accommodates the spin chuck 75 and the like. The FFU 79 is a blower unit that sends clean air (air filtered by a filter) downward into the chamber 74 from the ceiling of the substrate processing apparatus 710 . The FFU 79 is located above the partition wall 78 and sends clean air into the partition wall 78 from above the partition wall 78 .

The exhaust duct 72 exhausts the gas in the chamber 74 from the lower part of the cup 77. The exhaust duct 72 is connected to the bottom of the cup 77, and guides the gas in the chamber 74 toward exhaust equipment (not shown) provided in the factory where the substrate processing apparatus 710 is installed. Therefore, a downflow flowing downward within the chamber 74 is formed by the FFU 79 and the exhaust duct 72. The processing of the substrate W is performed while a downflow is formed within the chamber 74.

The spin chuck 75 includes a spin base 711, a plurality of chuck pins 712, and a chuck opening/closing mechanism 713. The spin base 711 has a disc shape and is held in a horizontal position. The plurality of chuck pins 712 protrude upward from the outer periphery of the upper surface (the surface exposed upward in the vertical direction) of the spin base 711. The chuck opening/closing mechanism 713 opens and closes the plurality of chuck pins 712.

In "opening/closing" of the chuck pin 712, "open" refers to moving the chuck pin 712 to a position where a placed state can be obtained, and "close" refers to moving the chuck pin 712 to a position where a gripping state can be obtained. Refers to causing. When the chuck pin 712 in the placed state is closed, the placed state changes to the gripped state. When the chuck pin 712 in the gripping state is opened, the gripping state changes to the placing state.

The substrate processing apparatus 710 includes a spin shaft 714 and a spin motor 715. The spin shaft 714 extends vertically downward from the center of the spin base 711. The spin motor 715 rotates the spin shaft 714, and in turn rotates the spin base 711 and the chuck pin 712 in a counterclockwise direction Rdr, for example, when viewed vertically downward, about the substrate rotation axis A1. The spin motor 715 and the spin shaft 714 function as a rotational drive mechanism 716 that rotates the spin chuck 75 around the substrate rotation axis A1 extending in the vertical direction.

The outer diameter of the spin base 711 is larger than the diameter of the substrate W. The center line of the spin base 711 is located on the substrate rotation axis A1. The plurality of chuck pins 712 are held by the spin base 711 at the outer periphery of the spin base 711. The plurality of chuck pins 712 are positioned at intervals in the circumferential direction (circumferential direction centered on the substrate rotation axis A1). Each of the chuck pins 712 contacts the periphery of the substrate W.

As a result, the substrate W is held horizontally with the direction Z as the normal direction, with the lower surface of the substrate W and the upper surface of the spin base 711 separated in the vertical direction. The chuck pins 712 have a function of holding the substrate W apart from the spin base 711 upward by gripping the periphery of the substrate W.

When the spin motor 715 rotates the spin shaft 714 while the substrate W is held by the plurality of chuck pins 712, the substrate W rotates about the substrate rotation axis A1 together with the spin base 711 and the chuck pins 712.

The processing liquid supply mechanism 76 includes a chemical liquid nozzle 734, a chemical liquid pipe 735, and a chemical liquid valve 736. The chemical liquid nozzle 734 functions as an upper surface nozzle that discharges a chemical liquid toward the upper surface of the substrate W. The chemical liquid piping 735 is connected to the chemical liquid nozzle 734. The chemical liquid valve 736 is provided in the middle of the chemical liquid piping 735. A chemical liquid is supplied to the chemical liquid piping 735 from the fluid box 703 via a chemical liquid valve 736.

When the chemical liquid valve 736 is opened, the chemical liquid supplied from the chemical liquid piping 735 to the chemical liquid nozzle 734 is discharged downward from the chemical liquid nozzle 734. When the chemical liquid valve 736 is closed, the discharge of the chemical liquid from the chemical liquid nozzle 734 is stopped.

The chemical liquid nozzle 734 functions as a scan nozzle that discharges the chemical liquid while moving so that the position of the chemical liquid on the upper surface of the substrate W moves between the center and the periphery.

The substrate processing apparatus 710 includes a chemical liquid nozzle moving device 737. The chemical liquid nozzle moving device 737 moves the chemical liquid landing position within the upper surface of the substrate W by moving the chemical liquid nozzle 734 .

The chemical liquid nozzle moving device 737 moves the chemical liquid nozzle 734 between a processing position where the chemical liquid discharged from the chemical liquid nozzle 734 lands on the upper surface of the substrate W and a retracted position where the chemical liquid nozzle 734 is retracted around the spin chuck 75. move it.

The processing liquid supply mechanism 76 includes a rinse liquid nozzle 738, a rinse liquid pipe 739, and a rinse liquid valve 740. The rinse liquid nozzle 738 functions as an upper surface nozzle that discharges the rinse liquid toward the upper surface of the substrate W. Rinse liquid piping 739 is connected to rinse liquid nozzle 738. The rinse liquid valve 740 is provided in the middle of the rinse liquid pipe 739. Rinsing fluid is supplied to the rinsing fluid piping 739 from the fluid box 703 via a rinsing fluid valve 740 .

When the rinse liquid valve 740 is opened, the rinse liquid supplied from the rinse liquid piping 739 to the rinse liquid nozzle 738 is discharged downward from the rinse liquid nozzle 738. When the rinse liquid valve 740 is closed, the discharge of rinse liquid from the rinse liquid nozzle 738 is stopped.

The rinsing liquid nozzle 738 functions as a scan nozzle that discharges the processing rinsing liquid while moving so that the position of the rinsing liquid on the upper surface of the substrate W moves between the center and the periphery.

The substrate processing apparatus 710 includes a rinsing liquid nozzle moving device 741. The rinsing liquid nozzle moving device 741 moves the position of the rinsing liquid within the upper surface of the substrate W by moving the rinsing liquid nozzle 738 .

The rinsing liquid nozzle moving device 741 moves the position of the rinsing liquid within the upper surface of the substrate W by moving the rinsing liquid nozzle 738 .

The rinsing liquid nozzle moving device 741 moves the rinsing liquid nozzle 738 between a processing position where the rinsing liquid discharged from the rinsing liquid nozzle 738 lands on the upper surface of the substrate W and a retracted position where the rinsing liquid nozzle 738 is retracted around the spin chuck 75. Move the rinse liquid nozzle 738.

The cup 77 is located outward (in the direction away from the substrate rotation axis A1) from the substrate W in the held state. The cup 77 includes an outer wall 747, a plurality of processing liquid cups, a plurality of guards, and a guard lifting device 755.

The outer wall 747 is cylindrical and surrounds the spin chuck 75. The plurality of processing liquid cups include a first processing liquid cup 748 , a second processing liquid cup 749 , and a third processing liquid cup 750 . The first processing liquid cup 748 , the second processing liquid cup 749 , and the third processing liquid cup 750 all surround the spin chuck 75 between the spin chuck 75 and the outer wall 747 .

The first processing liquid cup 748 is located closer to the spin chuck 75 than the second processing liquid cup 749. The second processing liquid cup 749 is located further outward than the first processing liquid cup 748. The third processing liquid cup 750 is located further outward than the second processing liquid cup 749.

The plurality of guards catch the processing liquid scattered around the substrate W. A plurality of guards surround spin chuck 75 between spin chuck 75 and outer wall 747. The plurality of guards include a first guard 751, a second guard 752, a third guard 753, and a fourth guard 754.

The first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 are driven by the control of a guard lifting device 755, and are independently raised and lowered as desired. By such lifting and lowering, the used processing liquid is guided to the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750, depending on the type of the processing liquid, for example. The guard lifting device 755 lifts and lowers the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 independently of each other. The third processing liquid cup 750 moves up and down together with the second guard 752. The third processing liquid cup 750 is, for example, integrated with the second guard 752.

Each of the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 forms an annular groove that opens upward. The processing liquid led to the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 is sent to a recovery device or a waste liquid device (not shown) through these grooves.

Each of the first guard 751, second guard 752, third guard 753, and fourth guard 754 includes an inclined portion 756 and a guide portion 757. The inclined portion 756 is cylindrical and moves inward from the bottom to the top. The guide portion 757 has a cylindrical shape and extends downward from the lower end of the inclined portion 756. The four inclined parts 756 are located one above the other. The four guide parts 757 are coaxially located.

The upper ends of the first guard 751 , the second guard 752 , the third guard 753 , and the fourth guard 754 are formed by the upper ends of the respective inclined parts 756 . These upper ends have a larger diameter than the substrate W and spin base 711.

The guide portion 757 of the first guard 751 is placed in the first processing liquid cup 748, the guide portion 757 of the second guard 752 is placed in the second processing liquid cup 749, and the guide portion 757 of the third guard 753 is placed in the third processing liquid cup. They can go in and out of 750 respectively.

The cup 77 can be expanded and folded by the guard elevating device 755 elevating at least one of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754.

The guard lifting device 755 lifts and lowers the first guard 751 between an upper position where the upper end of the first guard 751 is located above the substrate W and a lower position where the upper end of the first guard 751 is located below the substrate W. It has a function of holding the first guard 751 at any position between the upper position and the lower position. The guard elevating device 755 has a function of similarly elevating and holding the second guard 752, third guard 753, and fourth guard 754.

The supply of the processing liquid to the substrate W and the drying of the substrate W are performed with the plurality of guards facing the peripheral surface of the substrate W. For example, when the third guard 753 is arranged to face the peripheral surface of the substrate W, the first guard 751 and the second guard 752 are arranged at the lower position, and the third guard 753 and the fourth guard 754 are arranged at the upper position. . In addition, when the outermost fourth guard 754 is arranged to face the peripheral surface of the substrate W, the fourth guard 754 is arranged at the upper position, and the first guard 751, the second guard 752, and the third guard 753 are arranged at the lower position. will be placed in

<Chuck pin 712>
Next, the detailed configuration of the chuck pin 712 will be explained. FIG. 3 is a perspective view showing the main body 1 and pin portion 2 that constitute the chuck pin 712. The pin portion 2 is fitted into the main body 1 to form a chuck pin 712. In other words, the chuck pin 712 includes the main body 1 and the pin portion 2.

FIG. 3 shows a state in which the main body 1 and the pin portion 2 are separated, not a state in which the chuck pin 712 is configured. The fact that the pin part 2 is fitted into the main body 1 along the direction R2 is indicated by four chain lines parallel to the direction R2. The direction R2 is inclined with respect to the direction Z, and is, for example, substantially perpendicular to the direction Z.

The pin part 2 is attached to the main body 1 along the direction R2. The direction R2 varies as the main body 1 rotates about the axis Q. The variation in direction R2 will be described later.

Direction R3 is the opposite direction to direction R2, and pin portion 2 can be removed from main body 1 along direction R3.

The main body 1 has an annular portion 10 in which a hole 102 is opened, and a shaft 101 . Hole 102 passes through along direction Z. The hole 102 may be covered with a lid, for example. For example, PTFE (polytetrafluoroethylene) can be used for the lid.

The annular portion 10 and the shaft 101 are connected. The shaft 101 is driven by a mechanism not shown, and the annular portion 10 rotates. For example, the central axis of the hole 102 is the axis Q, and the annular portion 10 rotates around the axis Q. The annular portion 10 is provided on the Z-side surface (upper surface) of the spin base 711, and the shaft 101 passes through the spin base 711 in the Z direction.

The pin portion 2 grips the periphery of the substrate W when the substrate W is held with direction Z as the normal direction. The main body 1 has a groove 116 into which the pin portion 2 fits. The groove 116 is open on the direction R3 side and guides the pin part 2 movably along the directions R2 and R3. The pin part 2 can be inserted into the groove 116 by moving along the direction R3 from the direction R3 side, and can be removed from the groove 116 by moving along the direction R2.

The groove 116 restricts movement of the pin portion 2 in directions other than directions R2 and R3. A specific shape for obtaining this constraint will be explained below.

FIG. 4 is a side view of the main body 1 viewed along direction R2. The groove 116 has a bottom surface 111, a pair of side surfaces 113, and a pair of top surfaces 115. The bottom surface 111 and the top surface 115 face each other in the direction Z, and the side surface 113 is sandwiched between the top surface 115 and the bottom surface 111 and extends along the direction R2.

When viewed along the direction R2, the groove 116 opens in the direction D4 in the portion appearing on the right side of FIG. 4, and opens in the direction D5 in the portion appearing in the left side.

Directions D4, D5 are oblique to direction Z, for example perpendicular to directions Z, R2, R3, and are mutually opposite directions. In this case, the pair of side surfaces 113 face each other in direction D4 or direction D5.

The main body 1 has a pair of side surfaces 114 that face each other in the directions D4 and D5 on the Z direction side of the groove 116. The distance between the pair of side surfaces 114 facing each other is narrower than the distance between the pair of side surfaces 113 facing each other.

FIG. 5 is a cross-sectional view of the main body 1 taken along the direction D4 at the position VV (see FIG. 3). The position VV is at the center in the direction D4 between the opposing sides 113 (see also FIG. 4). FIG. 6 is a perspective view showing the pin part 2. FIG. 7 is a perspective view of the chuck pin 712, showing a state in which the main body 1 and the pin portion 2 are fitted together (hereinafter tentatively referred to as the "fitted state"). FIG. 8 is a cross-sectional view of the chuck pin 712 taken along direction D4 at position VIII-VIII. Position VIII-VIII is located at the center in direction D4 between the opposing sides 113. In FIG. 6, the direction when the fitted state is obtained is also noted.

Note that in FIG. 7, the edge of the groove 116 on the R3 side is drawn to be offset from the edge of the end surface 231 on the R3 side. This depiction is due to the fact that FIG. 7 is a perspective view inclined with an angle of depression with respect to the direction R2, and the edge of the groove 116 on the direction R3 side maintains its position in the direction Z while changing the direction in the vicinity of the annular portion 10. It is shown that it is inclined with respect to D4 and D5.

The pin portion 2 has a grip portion 21 that grips the periphery of the substrate W, a guide surface 232, and an overhang portion 22 that fits into the groove 116. The grip portion 21 has a recessed portion that has a function of gripping the periphery of the substrate W. The direction in which the recess opens is direction R3 in the fitted state. The guide surface 232 guides the substrate W along the direction Z to the gripping section 21 . Details of the guide surface 232 will be described later.

The pin portion 2 has a side surface 214 between the grip portion 21 and the overhang portion 22, more specifically between the guide surface 232 and the overhang portion 22. Side surface 214 faces side surface 114 in directions D4 and D5 in the fitted state.

The overhanging portion 22 overhangs the side surface 214. The direction in which it protrudes is along the directions D4 and D5 in the fitted state.

The projecting portion 22 has a pair of upper surfaces 215, a pair of side surfaces 213, and a bottom surface 211. Upper surface 215 faces upper surface 115 in direction Z in the fitted state. The side surface 213 faces the side surface 113 in directions D4 and D5 in the fitted state. The bottom surface 211 faces the bottom surface 111 along the direction Z in the fitted state.

(i) In the fitted state, the upper surface 115 prevents the upper surface 215 from moving along the Z direction. As a result, movement of the pin portion 2 in the Z direction is restricted.

(ii) In the fitted state, the upper surface 115 prevents the upper surface 215 from moving along the Z direction. In the fitted state, the bottom surface 111 prevents the bottom surface 211 from moving in the direction opposite to the Z direction. Therefore, movement of the overhanging portion 22 and, by extension, the pin portion 2 in the direction Z and the opposite direction is restricted.

(iii) In the fitted state, the side surface 113 prevents the side surface 213 from moving along the directions D4 and D5. Therefore, the movement of the projecting portion 22 and, by extension, the pin portion 2 in the directions D4 and D5 is restricted.

As understood from the above (i), (ii), and (iii), the groove 116 functions to restrict movement of the pin portion 2 in directions other than directions R2 and R3.

In this manner, in the chuck pin 712, the pin portion 2 is removable from the main body 1, and furthermore, movement in directions other than the directions R2 and R3 in the above-mentioned example is restricted.

The pin portion 2 that grips the peripheral edge of the substrate W when it is held is detached from the main body 1 along the direction R3, and is attached to the main body 1 from the direction R3 side toward the groove 116 along the direction R2. Therefore, not only is it not necessary to replace the entire chuck pin 712, but also the pin portion 2 can be replaced easily.

Since the groove 116 opens in the directions D4 and D5, as can be understood from the above (i) and (ii), there is no need for screwing and movement of the pin portion 2 in the direction Z is suppressed.

From the above, the following explanation can be made: The chuck pin 712 has a main body 1 and a pin portion 2. The pin portion 2 is provided on the spin base 711 and grips the periphery of the substrate W when the substrate W is held. The main body 1 has a groove 116 into which the pin portion 2 fits. The groove 116 movably guides the pin portion 2 along a direction R2 that is inclined with respect to the direction Z and a direction R3 that is opposite to the direction R2, and allows the pin portion 2 to move in directions other than directions R2 and R3. It restricts movement and opens in direction R3.

The following explanation is also possible: The substrate processing apparatus 710 processes the substrate W using a processing liquid. The substrate processing apparatus 710 includes a processing liquid supply mechanism 76 that supplies processing liquid to the substrate W, a spin base 711 on which the substrate W is placed with the direction Z as the normal direction, and a spin base 711 that rotates the spin base 711 around the substrate rotation axis A1. A rotation drive mechanism 716 and a chuck pin 712 are provided.

The following explanation is also possible: The substrate processing system 700 includes a substrate processing apparatus 710 and a central robot 708 that functions as a transport mechanism that transports the substrate W to the substrate processing apparatus 710.

For example, the main body 1 and the pin part 2 are made of different materials. For example, it is desirable that the main body 1 be made of ceramics from the viewpoint of resistance to expansion. Silicon carbide (SiC) can be exemplified as the ceramic.

For example, it is desirable that the pin portion 2 be formed of a material containing synthetic resin, from the viewpoint that the substrate W is less likely to break when the peripheral edge of the substrate W is gripped. Examples of such materials include PTFE-CNT (carbon nanotube) and PFA (perfluoroalkoxy alkane)-CF (carbon fiber). These materials are advantageous in that they are electrically conductive and have a low coefficient of thermal expansion. PTFE-CNT is further advantageous in terms of high chemical resistance.

The pin portion 2 has an end surface 221 located on the direction R2 side and an end surface 231 located on the direction R3 side in the fitted state. The end face 231 appears sandwiched between the grooves 116 in the directions D4 and D5 when viewed along the direction R2 in the fitted state (see FIG. 7).

A hole 120 is opened in the main body 1 . The hole 120 exposes the pin portion 2, more specifically, the end surface 221 on the R2 side (see FIG. 8).

By pushing the pin part 2 through the hole 120 with respect to the pin part 2 in the fitted state, for example, by pushing the pin part 2 in the direction R3 via a rod (not shown) penetrating the hole 120, the pin part 2 is removed. 2 can be easily removed from the main body 1.

FIG. 9 is a sectional view of the main body 1 and the pin portion 2 in a fitted state. FIG. 9 shows a cross section taken along the direction R2 at a position where the groove 116 and the overhanging portion 22 appear in the direction R2.

The side surfaces 114 and 214, which are located on the direction D4 side (left side in the drawing) and are opposed to each other, are shown in a state in which they are in contact with each other. The side surfaces 114 and 214, which are located on the direction D5 side (right side in the drawing) and are opposed to each other, are shown in a state in which they are in contact with each other.

In the case where the pin part 2 is made of synthetic resin and the main body 1 is made of ceramics as described above, when the pin part 2 is fitted to the main body 1, the pin part 2 moves toward the main body 1 along the direction R2. It is press-fitted. Therefore, if tolerances in the process of manufacturing the main body 1 and the pin portion 2 are ignored, it can be assumed that the distance between the opposing side surfaces 114 and 214 becomes substantially zero. However, since the tolerance actually exists, the distance does not necessarily become substantially zero. The distance between the opposing upper surfaces 115 and 215 is also not substantially zero. Therefore, it is assumed that the processing liquid flows between the main body 1 and the pin portion 2 in the fitted state, for example, through between the side surfaces 114 and 214 and between the top surfaces 115 and 215.

Although not shown in detail in FIG. 7, there is a gap of distance d31 between the side surfaces 113 and 213 that are located on the direction D4 side (left side in the drawing) and face each other. Although not shown in detail in FIG. 7, there is a gap of distance d32 between the side surfaces 113 and 213 that are located on the direction D5 side (right side in the drawing) and face each other. The distances d31 and d32 are designed to be approximately several mm, for example. As a result, a flow path along the direction R2 is formed between the pin portion 2 fitted into the groove 116 and the groove 116, and the flow path communicates with the hole 120. Therefore, even if the processing liquid flows between the main body 1 and the pin part 2 in the fitted state through, for example, between the side surfaces 114 and 214, the processing liquid will flow through the hole 120 and from the chuck pin 712. be discharged.

In other words, the hole 120 may function as a discharge port for the processing liquid. It is desirable that the processing liquid supplied to the substrate W be discharged from the viewpoint of suppressing fine particles from remaining on the substrate W.

A cut along direction R2 may be provided on at least one of the side surfaces 114, 214 or on at least one of the top surfaces 115, 215. The cut may be along the Z direction. These cuts can serve as channels when discharging the processing liquid, so even if the channel between the side surfaces 113 and 213 is filled, the processing solution can be easily discharged.

10 and 11 are plan views showing the position of the chuck pin 712, both of which are views seen from the direction opposite to the Z direction. FIG. 10 shows the placed state, and FIG. 11 shows the gripped state. The placed state and the gripped state are realized by rotating the main body 1 around the axis Q. In other words, the main body 1 can rotate around the axis Q along the direction Z, and the rotation determines whether or not the peripheral edge of the substrate W is gripped by the pin portions 2.

In order to improve visibility, the periphery of the substrate W is indicated by a chain double-dashed line in both FIGS. 10 and 11. In FIG. 10, the shape of the chuck pin 712 that appears only in the gripping state is shown by a chain line, and in FIG. 11, the shape of the chuck pin 712 that appears only in the placed state is shown by a chain line.

In the placed state, the peripheral edge of the substrate W is placed on the guide surface 232 and is not held by the gripping section 21 (see FIG. 10). In the gripping state, the peripheral edge of the substrate W is gripped by the gripper 21 and removed from the guide surface 232 (see FIG. 11). The guide surface 232 realizes whether or not the peripheral edge of the substrate W is gripped by the pin portion 2 as the main body 1 rotates. In order to perform this function, the guide surface 232 has an inclination, and the inclination increases in the direction Z as it goes in the direction R2 in the fitted state. It can be said that the guide surface 232 guides the substrate W to the grip part 21 along the direction R2, or it can be said that the guide surface 232 guides the substrate W to the grip part 21 along the direction Z.

In the fitted state, the guide surface 232 has a shape that becomes wider in the direction R2. Such a shape is desirable from the viewpoint that the processing liquid does not remain on the chuck pin 712.

Since the main body 1 switches between the placed state and the gripped state by rotating around the axis Q, the direction R2 is different between the placed state and the gripped state (direction R2 varies). From the viewpoint of the hole 120 functioning as a discharge port, it is desirable that the direction R2 is less than 90 degrees with respect to the direction r from the substrate rotation axis A1 toward the chuck pin 712, both in the mounted state and in the gripped state. This is because the centrifugal force applied to the pin part 2 as the spin base 711 rotates makes it difficult to separate the pin part 2 and makes it easier to discharge the processing liquid from the hole 120.

The pin portion 2 is press-fitted into the main body 1. If the press-fitting is possible, the length of the pin portion 2 may be set longer than the length of the main body 1 in any direction perpendicular to the direction R2. The press-fitted pin portion 2 tends to come into close contact with the main body 1 due to the creep phenomenon.

A recess 112 is provided on the bottom surface 111 (see FIGS. 3, 5, 8, and 9), and a protrusion 212 is provided on the bottom surface 211 (see FIGS. 6, 8, and 9). FIG. 9 shows a cross section at a position where the recess 112 and the protrusion 212 do not appear in the direction R2, and therefore the recess 112 and the protrusion 212 are indicated by broken lines as hidden lines.

By being press-fitted into the main body 1, the pin portion 2 can be inserted in the direction R2 along the groove 116 despite the presence of the convex portion 212.

In the fitted state, the protrusion 212 fits into the recess 112. From this point of view, the recessed portion 112 functions as a first fitting portion of the groove 116, and the convex portion 212 functions as a second fitting portion of the pin portion 2.

By fitting the convex portion 212 into the concave portion 112, movement of the pin portion 2 in direction R2, direction R3, or both directions R2 and R3 is restricted. This is desirable from the viewpoint of restricting the pin portion 2 from detaching from the main body 1 except during attachment and detachment.

However, the strength with which the convex part 212 fits into the concave part 112 is limited to the extent that the pin part 2 can be detached by being pushed from the outside along the direction R3.

The first fitting portion may be provided on the top surface 115 or the side surface 113 other than the bottom surface 111, for example. In this case, the second fitting portions are provided on the top surface 215 and the side surface 213, respectively.

However, even if the convex part 212 is not provided and only the concave part 112 is provided, the effect of restricting the movement of the pin part 2 in the direction R2, the direction R3, or both directions R2 and R3 can be obtained. This is because when the pin portion 2 is press-fitted into the main body 1, the press-fitted pin portion 2 enters the recess 112 due to a creep phenomenon.

From this point of view, the above effect can be obtained by having the groove 116 with a step in the direction R2, and the step can be said to be formed by the recess 112.

However, if the protrusion 212 is not provided, it is desirable that a fitted state be obtained with a so-called "tight fit". Specifically, it is desirable that the distance between the top surface 215 and the bottom surface 211 before the fitted state is obtained is larger than the distance between the top surface 115 and the bottom surface 111 with a predetermined fitting tolerance.

The above effect can also be obtained when the groove 116 has a step in the direction R2 on one of the side surfaces 113 or on both of the pair of side surfaces 113. If the second fitting portion is not provided, the distance between the pair of side surfaces 213 before the fitted state is obtained may be larger than the distance between the pair of side surfaces 113 due to a predetermined fitting tolerance. desired.

The main body 1 has a portion 12 located closer to the direction Z than the hole 120 . The portion 12 has a surface 121 on the R3 side and a surface 122 on the Z side. In the fitted state, the surface 121 abuts the end surface 221 (see FIG. 8). This contact restricts movement of the pin portion 2 in the direction R2. In other words, the surface 121 of the main body 1 restricts movement of the pin portion 2 in the direction R2. Such restraint is desirable from the viewpoint of supporting the pin portion 2 against the centrifugal force acting on the pin portion 2 due to the rotation of the spin base 711.

The pin portion 2 has a surface 222 on the Z direction side with respect to the end surface 221 with respect to the grip portion 21 . In the fitted state, surface 222 faces surface 122. It is desirable that the surface 222 be in contact with the surface 122 as illustrated in FIG. 8 from the viewpoint of preventing the processing liquid from flowing between the pin portion 2 and the main body 1.

However, even if the processing liquid flows between the surfaces 222 and 122 in the chuck pin 712 or between the surface 121 and the end surface 221, the processing liquid will be discharged from the chuck pin 712 via the hole 120. Ru.

The main body 1 has an upper surface 123 on the Z-direction side and is adjacent to the side surface 114. The boundary between the top surface 123 and the side surface 114 typically extends along the direction R2. The pin portion 2 has an upper surface 233 on the Z-direction side and is adjacent to the side surface 214. The direction in which the boundary between the top surface 233 and the side surface 214 extends is typically parallel to the direction R2 in the fitted state.

In the fitted state, the upper surface 123 is exposed near the pin portion 2 on the Z-direction side of the main body 1. In the fitted state, an upper surface 233 is exposed near the main body 1 on the Z-direction side of the pin portion 2. However, the guide surface 232 is exposed further in the Z direction than the upper surface 233.

In the fitted state, the upper surface 233 projects further in the Z direction than the upper surface 123 by a distance t (see FIGS. 7 and 8). Therefore, the boundary between the top surface 123 and the side surface 114 and the boundary between the top surface 233 and the side surface 214 are separated by a distance t.

Such a separation is advantageous from the viewpoint of suppressing the processing liquid from remaining between the main body 1 and the pin portion 2. If the two boundaries are chamfered during the process of forming the main body 1 and the pin portion 2, a V-shaped groove is generated by the two chamfer surfaces. The volume of the groove is smaller when the distance t is positive than when the distance t is zero.

It is not desirable that the upper surface 123 protrudes further in the Z direction than the upper surface 233 in the fitted state. This is because the upper surfaces 123 and 233 form recesses, and rather the processing liquid is retained therein.

[Modified example of chuck pin 712]
FIG. 12 is a sectional view showing a first modification of the chuck pin 712. FIG. 12 shows a cross section seen in direction Z at a position where side surfaces 114, 214 appear in direction Z. In the first modification, the distance between the side surfaces 114 increases in the direction R2. For example, when comparing the end portion of the side surface 114 on the direction R3 side and the end portion on the direction R2 side, the above-mentioned interval increases by 0.1 to 0.2 mm. In FIG. 12, a case is illustrated in which the side surfaces 114 expand in directions D4 and D5, respectively. This prevents the pin portion 2 from moving in the direction R3 with respect to the main body 1.

It is desirable that the side surfaces 114 and 214 abut in the fitted state. Therefore, the distance between the side surfaces 214 also increases in the direction R2 in the fitted state. In the fitted state, the pin portion 2 increases in size in at least one of directions D4 and D5 along direction R2. In order to attach the pin part 2 to the main body 1, before attaching it, the minimum length of the mutually opposing side surfaces 114 along the direction D4 (this appears on the direction R3 side) must be It is desirable that the distance be equal to or greater than the maximum value of the distance between the side surfaces 214 along the direction D4 (this appears on the direction R2 side). However, by forming the pin portion 2 mainly from synthetic resin as described above, the side surfaces 114 and 214 can be brought into contact by the creep phenomenon.

FIG. 13 is a sectional view showing a second modification of the chuck pin 712. FIG. 13 shows a cross section viewed from direction D4 at a position where bottom surfaces 111, 211 and top surfaces 115, 215 appear in direction D4. In the second modification, the distance between the bottom surface 111 and the top surface 115 increases in the direction R2. For example, when comparing the end portion of the bottom surface 111 on the direction R3 side and the end portion on the direction R2 side, the above-mentioned interval increases by 0.1 to 0.2 mm. In FIG. 13, the top surface 115 widens in the Z direction, and the bottom surface 111 widens in the opposite direction to the Z direction. This prevents the pin portion 2 from moving in the direction R3 with respect to the main body 1.

In the fitted state, it is desirable that the bottom surfaces 111, 211 and the top surfaces 115, 215 contact each other. Therefore, the distance between the top surface 215 and the bottom surface 211 also increases in the direction R2 in the fitted state. In the fitted state, the pin portion 2 increases in size along the direction R2 in at least one of the direction Z and the direction opposite to the direction Z. In order to attach the pin portion 2 to the main body 1, before attaching it, the minimum length of the top surface 115 and the bottom surface 111 along the direction Z (this appears on the direction R3 side) must be the same as the top surface 215. It is desirable that the distance from the bottom surface 211 along the direction Z is greater than or equal to the maximum value (this appears on the direction R2 side). However, by forming the pin portion 2 mainly from synthetic resin as described above, the bottom surfaces 111 and 211 can be brought into contact with each other and the top surfaces 115 and 215 can be brought into contact with each other due to the creep phenomenon.

In the second modification, the pin portion 2 may increase in size along the direction R2, in the direction Z, in the opposite direction to the direction Z, and in a direction that is neither of the directions D4 and D5.

FIG. 14 is a sectional view showing a third modification of the chuck pin 712. FIG. 14 shows a cross section viewed from direction D4 at a position where convex portions 212 and concave portions 112 appear in direction D4. In the third modification, the diameter of the recess 112 increases in the Z direction. Such a shape of the recess 112 can be adjusted to weaken the strength with which the protrusion 212 is fitted, and is desirable from the viewpoint of making it easier to attach and detach the pin part 2 to the main body 1.

It is desirable that the convex portion 212 abuts the concave portion 112 in the fitted state. Therefore, the shape of the convex portion 212 also expands in the direction Z in the fitted state. In such a case, the length of the overhanging portion 22 along the direction Z is wider than the length of the groove 116 along the direction Z on the direction R3 side. However, by forming the pin portion 2 mainly from synthetic resin as described above, the pin portion 2 can be fitted into the main body 1 by press-fitting.

[Coupling between main body 1 and spin base 711]
From the viewpoint of making the main body 1 replaceable, it is desirable that the main body 1 is also removable from the spin base 711.

FIG. 15 is a sectional view partially showing the cross section of the chuck pin 712 and the chuck opening/closing mechanism 713. The cross section is parallel to direction Z.

The chuck opening/closing mechanism 713 includes a chuck pin shaft 33, a support mechanism 32, and a base portion 31. The chuck pin shaft 33 rotates the main body 1, more specifically the shaft 101, around the axis Q. The base portion 31 rotatably supports the chuck pin shaft 33. The support mechanism 32 supports the base portion 31 from the side opposite to the Z direction via the packings 91 and 92, and supports the chuck pin shaft 33 in a direction inclined to the Z direction. The main body 1 is removable from the base portion 31, and the base portion 31 is also removable from the support mechanism 32.

Packings 91 and 92 are both annular and surround base portion 31 around axis Q. Packing 92 is farther from axis Q than packing 91 and has higher chemical resistance.

For example, the material of packing 91 is FFKM (a rubbery copolymer in which all side chains are fluoro and perfluoroalkyl or perfluoroalkoxy groups) and the material of packing 92 is PTFE.

This arrangement of the packings 91 and 92 prevents the packing 91 from deteriorating even if the processing liquid comes into contact with it from around the chuck opening/closing mechanism 713.

In the embodiment described above, the chuck pin 712 could take two states: a placed state and a gripped state. However, the fitting between the main body 1 and the pin part 2, and the structure contributing to the fitting, are not based on the assumption that the two states, the placed state and the gripped state, can be taken. In other words, a structure that contributes to the fitting between the main body 1 and the pin portion 2 and the fitting can be applied to a chuck pin that can take only one of the placed state and the gripped state.

Although this invention has been described in detail, the above description is illustrative in all aspects, and the invention is not limited thereto. It is understood that countless variations not illustrated can be envisaged without departing from the scope of the invention. The configurations described in the above embodiment and each modification can be appropriately combined or omitted as long as they do not contradict each other.

1 Main body 2 Pin portion 21 Gripping portion 31 Base portion 33 Chuck pin shaft 91 (First) packing 92 (Second) packing 112 Recess (step)
116 groove 120 hole 121 surface 232 guide surface 700 substrate processing system 710 substrate processing apparatus 711 spin base 712 chuck pin 716 rotation drive mechanism 708 transport mechanism D4, D5 (fourth) direction Q axis R2 (second) direction R3 ( 3rd) direction W Substrate Z (1st) direction

Claims (12)

a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction;
a main body having a groove into which the pin part fits;
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
The chuck pin , wherein the groove opens in a fourth direction that is inclined with respect to the first direction when viewed along the second direction . a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction;
a main body having a groove into which the pin part fits;
Equipped with
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
A chuck pin, wherein the main body has a hole opened in the second direction to expose the pin portion in the second direction. The chuck pin according to claim 2 , wherein a flow path along the second direction is formed between the pin portion fitted in the groove and the groove, and the flow path communicates with the hole. a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction;
a main body having a groove into which the pin part fits;
Equipped with
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
The chuck pin, wherein the groove has a step in the second direction. a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction;
a main body having a groove into which the pin part fits;
Equipped with
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
The main body is
The chuck pin further includes a surface that restricts movement of the pin portion in the second direction. a pin portion that grips the peripheral edge of the substrate when the substrate is held with the first direction as the normal direction;
a main body having a groove into which the pin part fits;
Equipped with
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
The chuck pin, wherein the main body is rotatable about an axis along the first direction. The pin portion is
a gripping portion that grips the peripheral edge;
The chuck pin according to claim 6 , further comprising a guide surface that guides the substrate to the gripping portion along the first direction. A substrate processing apparatus that processes a substrate using a processing liquid,
a supply mechanism that supplies the processing liquid to the substrate;
a spin base on which the substrate is placed with the first direction as the normal direction;
a rotational drive mechanism that rotates the spin base around a rotation axis;
a chuck pin provided on the spin base and having a pin portion that grips a peripheral edge of the substrate when the substrate is held;
The chuck pin is
further comprising a main body having a groove into which the pin part fits;
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
A substrate processing apparatus , wherein the main body is attachable to and detachable from the spin base . A substrate processing apparatus that processes a substrate using a processing liquid,
a supply mechanism that supplies the processing liquid to the substrate;
a spin base on which the substrate is placed with the first direction as the normal direction;
a rotational drive mechanism that rotates the spin base around a rotation axis;
a chuck pin provided on the spin base and having a pin portion that grips a peripheral edge of the substrate when the substrate is held;
The chuck pin is
further comprising a main body having a groove into which the pin part fits;
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and restraining movement of the pin portion in a direction other than the direction and the third direction, and opening on the third direction side;
a chuck pin shaft that rotates the main body about an axis along the first direction;
a base portion rotatably supporting the chuck pin shaft;
a first packing and a second packing, both of which are annular, surrounding the base portion around the axis;
further comprising;
The second packing is further away from the axis than the first packing and has higher chemical resistance . The substrate processing apparatus according to claim 9, wherein the main body is detachable from the spin base. The substrate processing apparatus according to any one of claims 8 to 10 ,
A substrate processing system, comprising: a transport mechanism that transports the substrate to the substrate processing apparatus. a substrate processing device that processes a substrate using a processing liquid ;
A substrate processing system comprising: a transport mechanism that transports the substrate to the substrate processing apparatus;
The substrate processing apparatus includes:
a supply mechanism that supplies the processing liquid to the substrate;
a spin base on which the substrate is placed with the first direction as the normal direction;
a rotational drive mechanism that rotates the spin base around a rotation axis;
a chuck pin provided on the spin base and having a pin portion that grips a peripheral edge of the substrate when the substrate is held;
Equipped with
The chuck pin is
a main body having a groove into which the pin part fits;
It further has
The groove movably guides the pin portion along a second direction that is inclined with respect to the first direction and a third direction that is opposite to the second direction, and and the third direction, and the pin portion is opened in the third direction .

Images