JP7379141B2 - Substrate holding device, substrate processing method - Google Patents

Description

The present invention relates to a technique for holding a substrate and a technique for processing a substrate. Substrates to be held include, for example, semiconductor wafers, liquid crystal display substrates, plasma display substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, and photosensitive disks. Includes mask substrates, ceramic substrates, and solar cell substrates.

In the manufacturing process of semiconductor devices and liquid crystal display devices, single-wafer processing equipment (hereinafter referred to as "single-wafer processing equipment") processes substrates one by one, and batch processing equipment processes multiple substrates at once. A type of substrate processing apparatus is used. In typical single-wafer processing equipment, one substrate is held horizontally in the processing chamber, and the substrate is rotated and processing liquids (chemicals and rinsing liquid) are supplied to the substrate depending on the processing content. .

A single wafer processing apparatus may include, for example, a plurality of chucks along the rotation direction on a spin base that rotates around a rotation axis. Since the chuck has a pin-like shape, it is sometimes called a "chuck pin." A spin base equipped with a chuck is also sometimes referred to as a "chuck base."

In such a single-wafer processing apparatus, the rotation and supply of processing liquid are performed while the chuck grips the peripheral edge of the substrate from above and below (hereinafter also referred to as "gripping"). Further, the substrate is removed from the chuck base while its lower surface is supported (hereinafter also referred to as "mounted") above the chuck base without being gripped. Alternatively, the substrate is placed on the chuck base prior to gripping. Note that in the following, "holding" is used as a concept that includes both "placing" and "grasping."

For example, Patent Documents 1 to 6 listed below exemplify techniques in which a substrate is held using a plurality of chuck pins provided on a chuck base.

Patent Document 1 introduces a technique in which a substrate is gripped and released by rotating a chuck pin by magnetic force via a cam plate.

Patent Document 2 introduces a technology in which a component called a spin chuck rotates and moves up and down while holding a wafer.

Patent Document 3 introduces a technique for raising and lowering chuck pins using magnetic force.

Patent Document 4 introduces a technique for gripping and releasing a substrate by rotating a chuck pin using magnetic force.

Patent Document 5 introduces a technique for raising and lowering a chuck base.

Patent Document 6 introduces a technology in which a cylindrical recess that allows a mechanism for supporting a chuck pin to move up and down is provided at the periphery of a chuck base and rotates together with the chuck base.

JP2016-25186A Japanese Patent Application Publication No. 2005-183709 JP 2018-50013 Publication Japanese Patent Application Publication No. 2010-130018 Patent No. 5172884 JP2019-46985A

In the process of placing a substrate on the chuck base or removing the placed substrate from the chuck base (hereinafter, this process is referred to as "transfer" of the substrate), raising and lowering the chuck base is This is undesirable from the viewpoint of increasing the size of the mechanism for realizing this. From this point of view, it is desirable to move the chuck pin up and down as in the technique introduced in Patent Document 3.

However, in Patent Document 3, the components that drive the gripping and release of the substrate by the chuck pins are fixed to the splash guard. Therefore, it is necessary to raise and lower the splash guard in accordance with the raising and lowering of the chuck pin.

One of the objects of the present invention is to provide a technique for easily raising and lowering a chuck, and gripping and releasing a substrate by the chuck. Another object of the present invention is to provide a technique for changing the distance between the chuck base and the substrate while rotating the substrate in a processing step for the substrate.

A first aspect for solving the above problems is a substrate holding device that holds a substrate, and includes a plurality of chucks, a chuck base, a first mechanism, and a second mechanism. Each of the plurality of chucks has a gripping portion used to grip the substrate. The chuck base mounts the plurality of chucks, has a main surface that exposes the gripping portion, and is used to rotate the substrate gripped by the gripping portion.

The first mechanism includes: a first drive unit that drives the plurality of chucks to move the plurality of chucks between a first position and a second position; a movable first drive magnet; and a first driven magnet that is fixed to the first driving section and moves in accordance with the movement of the first driving magnet to operate the first driving section. The height of the gripping portion relative to the main surface at the first position is higher than the height of the gripping portion relative to the main surface at the second position.

The second mechanism is configured to drive the plurality of chucks to move the plurality of chucks between a first posture in which the gripping section is capable of gripping the substrate and a second posture in which the gripping portion is released. a second drive section that causes the transition, a movable second drive magnet, and a second driven magnet that is fixed to the second drive section and moves according to the movement of the second drive magnet to operate the second drive section. have
The gripping portion includes a concave surface that grips a peripheral edge of the substrate when the substrate is gripped. Rotation of the plurality of chucks about an axis parallel to the normal direction of the main surface moves the opening direction of the concave surface. The second driving section converts the movement of the second driven magnet in the normal direction into the rotation of the plurality of chucks. Movement of the second drive magnet in the normal direction causes the second driven magnet to move in the normal direction.

A second aspect for solving the above problems is a substrate holding device that holds a substrate, and includes a plurality of chucks, a chuck base, a first mechanism, and a second mechanism. Each of the plurality of chucks has a gripping portion used to grip the substrate. The chuck base mounts the plurality of chucks, has a main surface that exposes the gripping portion, and is used to rotate the substrate gripped by the gripping portion.
The first mechanism includes: a first drive unit that drives the plurality of chucks to move the plurality of chucks between a first position and a second position; a movable first drive magnet; and a first driven magnet that is fixed to the first driving section and moves in accordance with the movement of the first driving magnet to operate the first driving section. The height of the gripping portion relative to the main surface at the first position is higher than the height of the gripping portion relative to the main surface at the second position.
The second mechanism is configured to drive the plurality of chucks to move the plurality of chucks between a first posture in which the gripping section is capable of gripping the substrate and a second posture in which the gripping portion is released. a second drive section that causes the transition, a movable second drive magnet, and a second driven magnet that is fixed to the second drive section and moves according to the movement of the second drive magnet to operate the second drive section. have
The plurality of chucks include a first chuck and a second chuck. When the substrate is rotated by the chuck base and both the first chuck and the second chuck are in the first position, or both the first chuck and the second chuck are in the second position. In one case: when the first chuck takes the second attitude, the second chuck does not take the second attitude but takes the first attitude; when the second chuck takes the second attitude, the second chuck takes the first attitude; One chuck takes the first attitude without taking the second attitude; both the first chuck and the second chuck can take the first attitude.

A third aspect is the second aspect, in which the gripping portion includes a concave surface that grips a peripheral edge of the substrate when the substrate is gripped. Rotation of the plurality of chucks about an axis parallel to the normal direction of the main surface moves the opening direction of the concave surface. The second driving section converts the movement of the second driven magnet in the normal direction into the rotation of the plurality of chucks. Movement of the second drive magnet in the normal direction causes the second driven magnet to move in the normal direction.

A fourth aspect is the first aspect or the third aspect, in which movement of the first driving magnet in the normal direction causes the first driven magnet to move in the normal direction. The magnetic force when the plurality of chucks take the second attitude is greater than the magnitude of the magnetic force acting between the second driving magnet and the second driven magnet when the plurality of chucks take the first attitude. is large. When the plurality of chucks take the first posture, the magnitude of the magnetic force when the plurality of chucks is in the second position is greater than the magnitude of the magnetic force when the plurality of chucks are in the first position. It's large in size.

A fifth aspect is the fourth aspect, in which, when the plurality of chucks take the second posture, the magnitude of the magnetic force is greater than the magnitude of the magnetic force when the plurality of chucks are in the first position. The magnetic force is large when the chuck is in the second position.

A sixth aspect is any one of the first aspect or the third to fifth aspects, wherein the plurality of chucks transition from the second posture to the first posture. The rotation of the substrate is limited by the substrate being held by the gripping portion.

A seventh aspect is a substrate processing method performed in any of the first to sixth aspects. The substrate has a first surface and a second surface closer to the chuck base than the first surface. The substrate processing method includes a first step of supplying a processing liquid to at least one of the first surface and the second surface held by the gripping section at the first position, and the first step; Alternatively, the method further includes a second step of supplying gas to the second surface after the first step is completed. In the second step, the plurality of chucks move from the first position to the second position while the substrate is rotated by the chuck base while being gripped by the gripping part.

According to the first aspect, the chuck can be easily raised and lowered, and the chuck can easily grip and release the substrate. The substrate can be easily gripped and released.

According to the second aspect, the chuck can be easily raised and lowered, and the chuck can easily grip and release the substrate. The chuck that grips the rotating substrate is replaced.

According to the third aspect, the substrate can be easily gripped and released.

According to the fourth aspect, even when the chuck is in the first position, the chuck can take the second attitude.

According to the fifth aspect, even when the chuck is in the second position, the chuck can take the second attitude.

According to the sixth aspect, falling of the substrate is detected.

According to the seventh aspect, the distance between the chuck base and the substrate is changed while rotating the substrate.

FIG. 1 is a plan view schematically illustrating the configuration of a substrate processing system. FIG. 1 is an overall diagram illustrating a schematic configuration of one substrate processing apparatus. It is a sectional view showing a part of a spin chuck. FIG. 3 is a top view of the chuck. It is a sectional view showing a part of a spin chuck. FIG. 3 is a cross-sectional view partially showing the chuck and the substrate. FIG. 3 is a top view of the chuck. FIG. 7 is a top view showing the positional relationship between the gripping portion and the position of the peripheral edge of the substrate. FIG. 3 is a top view partially showing the ring, the first drive magnet, and the second drive magnet. It is a side view which shows the positional relationship of a cam plate, a shaft, an elevating plate, and a 2nd driven magnet. It is a side view which shows the positional relationship of a cam plate, a shaft, an elevating plate, and a 2nd driven magnet. It is a sectional view showing a part of a spin chuck. 5 is a flowchart illustrating a substrate processing step in this embodiment. 14 is a cross-sectional view illustrating a part of the operation of the flowchart shown in FIG. 13. FIG. 14 is a cross-sectional view illustrating a part of the operation of the flowchart shown in FIG. 13. FIG. It is a sectional view showing a part of a spin chuck. FIG. 3 is a top view partially showing the ring, the first drive magnet, and the second drive magnet. FIG. 3 is a top view of the chuck base. FIG. 3 is a top view of the chuck. It is a side view which shows the positional relationship of a cam plate, a shaft, an elevating plate, and a 2nd driven magnet. 7 is a flowchart illustrating a specific operation of a step of changing the holding of a board. It is a sectional view showing a part of a spin chuck. FIG. 3 is a top view showing the chuck. FIG. 7 is a top view showing the positional relationship between the gripping portion and the position of the peripheral edge of the substrate. It is a side view which shows the positional relationship of a cam plate, a shaft, an elevating plate, and a 2nd driven magnet. It is a sectional view showing a part of a spin chuck. It is a sectional view showing a part of a spin chuck. FIG. 3 is a cross-sectional view illustrating a configuration for detecting whether or not a substrate is being gripped. It is a flowchart illustrating the operation of detecting that the board has fallen.

Embodiments of the present invention will be described below with reference to the accompanying drawings. Note that the components described in this embodiment are merely examples, and the scope of the present invention is not intended to be limited thereto. In the drawings, dimensions and numbers of parts may be exaggerated or simplified as necessary to facilitate understanding.

In this embodiment, "holding the substrate" refers to maintaining the position of the substrate, especially in the vertical direction, and "placing the substrate" refers to supporting the bottom surface of the substrate and holding it above the chuck base. "Gripping the substrate" refers to holding the periphery of the substrate by sandwiching it from above and below. In this embodiment, both mounting and gripping of the substrate are performed by a chuck.

In particular, the state in which the periphery of the substrate is gripped by the chuck is referred to as the "gripping state," and the state in which the substrate is simply placed on the chuck pins without the periphery of the board being gripped by the chuck is referred to as the "mounted state." to be called. Moreover, the state in which the substrate is held, regardless of the gripping state or the mounting state, is referred to as a "holding state."

[Substrate processing system configuration]
FIG. 1 is a plan view schematically illustrating the configuration of a substrate processing system 700. In this embodiment, direction Z is introduced to facilitate understanding of the invention. Typically, direction Z is a vertically upward direction.

The substrate processing system 700 includes a substrate processing apparatus 710. In FIG. 1, the substrate processing apparatuses 710 are provided in four groups 71, and each group 71 is provided with three substrate processing apparatuses 710.

The substrate processing apparatus 710 is a single-wafer processing apparatus that processes the substrate W using a processing liquid. The substrate W is, for example, a semiconductor wafer and has a disk shape. The concept of the processing liquid includes a chemical liquid and a rinsing liquid.

Examples of chemical solutions include sulfuric acid, acetic acid, nitric acid, hydrochloric acid, hydrofluoric acid, aqueous ammonia, aqueous hydrogen peroxide, organic acids (e.g. citric acid, oxalic acid), organic alkalis (e.g. TMAH: tetramethylammonium hydroxide), surfactants. and a corrosion inhibitor.

Examples of the rinsing liquid include pure water (deionized water), carbonated water, electrolyzed ionized water, hydrogen water, ozone water, IPA (isopropyl alcohol), and hydrochloric acid water.

The substrate processing system 700 further includes a fluid cabinet 702, a fluid box 703, a load port 706, a center robot 708, and an indexer robot 709.

Each load port 706 can accommodate a plurality of substrates W. For example, the substrates W are stacked and accommodated at the load port 706.

Between the center robot 708 and the load port 706, the substrate W is transported by an indexer robot 709.

The substrate W is transported by the central robot 708 between the indexer robot 709 and the substrate processing apparatus 710.

The fluid cabinet 702 accommodates the above-mentioned processing liquid and gas used when processing the substrate W. Fluid box 703 supplies processing liquid and gas from fluid cabinet 702 to substrate processing apparatus 710 . In FIG. 1, a case is illustrated in which a fluid box 703 is provided for each set 71.

The operation of the substrate processing apparatus 710, the operation of the center robot 708, and the operation of the indexer robot 709 are controlled by the control device 73. In FIG. 1, a case is illustrated in which the control device 73 is included in a substrate processing system 700.

The control device 73 includes, for example, a control section 731 and a storage section 732. The control unit 731 can be realized by a microcomputer. Storage unit 732 stores computer programs. The control unit 731 executes a computer program stored in the storage unit 732.

The storage unit 732 further stores recipe data. The recipe data includes information indicating multiple recipes. Each recipe defines the contents and procedures for transporting the substrate W and processing the substrate W, respectively.

Storage unit 732 includes a main storage device and an auxiliary storage device. The main storage device and the auxiliary storage device are realized by semiconductor memory, for example. The auxiliary storage device may be implemented by another storage device, such as a hard disk drive, or by a removable medium.

[Substrate processing equipment configuration]
FIG. 2 is an overall view illustrating the outline of the configuration of one substrate processing apparatus 710. The control device 73 controls the operation of devices provided in the substrate processing apparatus 710 and the opening and closing of valves.

The substrate processing apparatus 710 includes a chamber 74, an FFU (fan filter unit) 79, and an exhaust duct 72.

The chamber 74 includes a spin chuck 75, a processing liquid supply mechanism 76, a cup 77, and a partition wall 78. The partition wall 78 is box-shaped and has an internal space, and the spin chuck 75, the processing liquid supply mechanism 76, and the cup 77 are housed in the internal space.

The FFU 79 is a blower unit and is located above the partition wall 78. The FFU 79 sends clean air (air filtered by a filter) into the chamber 74 from above the chamber 74 .

The spin chuck 75 functions as a substrate holding device that holds one substrate W in a horizontal position within the chamber 74 . The spin chuck 75 rotates the substrate W around the substrate rotation axis Q, which is a vertical line (here, parallel to the direction Z). The substrate rotation axis Q passes through the center of the substrate W, for example.

The processing liquid supply mechanism 76 supplies a processing liquid to the upper surface (hereinafter referred to as "first surface") W1 of the substrate W held by the spin chuck 75. The cup 77 has a cylindrical shape and surrounds the spin chuck 75 around the substrate rotation axis Q.

An exhaust duct 72 is connected to the bottom of the cup 77 to exhaust the gas inside the chamber 74. The exhausted gas is guided toward exhaust equipment (not shown) provided in the factory where the substrate processing apparatus 710 is installed.

A downflow flowing downward within the chamber 74 is formed by the FFU 79 and the exhaust duct 72 . For example, the substrate W is processed while a downflow is formed in the chamber 74.

The spin chuck 75 includes a chuck base 711, a plurality of chuck pins 712, a chuck opening/closing mechanism 713, and a spin motor 714.

For example, the chuck base 711 has a disc shape and is rotatably held in a horizontal position. A plurality of chuck pins 712 are provided on an upwardly exposed surface of the chuck base 711 (hereinafter referred to as the "principal surface"). For example, all of the chuck pins 712 are provided so as to protrude upward at the outer periphery of the main surface.

The chuck opening/closing mechanism 713 opens and closes the plurality of chuck pins 712. "Closed" in "opening/closing" of the chuck pin 712 refers to the chuck pin 712 taking a posture (hereinafter also referred to as "first posture CL") in which a gripping state can be obtained. "Opening" in "opening/closing" of the chuck pin 712 refers to the chuck pin 712 taking a posture (hereinafter also referred to as "second posture OP") in which the mounting state can be obtained. As the chuck pin 712 transitions from the second attitude OP to the first attitude CL, the chuck pin 712 that has been in the second attitude OP is closed. As the chuck pin 712 transitions from the first attitude CL to the second attitude OP, the chuck pin 712 that has been in the first attitude CL is opened.

Some of the chuck pins 712 may take the first attitude CL, and some others may take the second attitude OP (this will be explained later in <“Changing the holding of the substrate W”). It is also assumed that the chuck pins 712 take the first attitude CL without the substrate W being gripped (this will be explained later in <Detection of falling off of the substrate W>).

The spin motor 714 rotates the chuck base 711 and thus the chuck pin 712 around the substrate rotation axis Q in a clockwise direction RDr when viewed along the direction Z, for example.

The outer diameter of the chuck base 711 is larger than the diameter of the substrate W. The center line of the chuck base 711 is located on the substrate rotation axis Q. The plurality of chuck pins 712 are positioned at intervals in the circumferential direction (circumferential direction centered on the substrate rotation axis Q). Any of the chuck pins 712 can be used to grip or place the substrate W.

The chuck pins 712 have a function of holding the substrate W apart from the chuck base 711 upwardly by gripping or placing the substrate W. With the lower surface (hereinafter referred to as the "second surface") W2 of the substrate W and the main surface of the chuck base 711 separated in the vertical direction, the substrate W is horizontally aligned with direction Z as the normal direction. Retained. The second surface W2 is closer to the chuck base 711 than the first surface W1. Direction Z, which is a normal direction, is a vertically upward direction on the earth.

By causing the spin motor 714 to rotate the chuck base 711 while the substrate W is being held, the substrate W rotates about the substrate rotation axis Q together with the chuck base 711 and the chuck pins 712.

The processing liquid supply mechanism 76 includes a chemical liquid nozzle 734, a chemical liquid pipe 735, and a chemical liquid valve 736. The chemical liquid nozzle 734 functions as an upper surface nozzle that discharges a chemical liquid toward the first surface W1. The chemical liquid piping 735 is connected to the chemical liquid nozzle 734. The chemical liquid valve 736 is provided in the middle of the chemical liquid piping 735. A chemical liquid is supplied to the chemical liquid piping 735 from the fluid box 703 (see FIG. 1) via a chemical liquid valve 736.

When the chemical liquid valve 736 is opened, the chemical liquid supplied from the chemical liquid piping 735 to the chemical liquid nozzle 734 is discharged downward from the chemical liquid nozzle 734. This discharge supplies the chemical liquid to the first surface W1. When the chemical liquid valve 736 is closed, the discharge of the chemical liquid from the chemical liquid nozzle 734 is stopped.

The substrate processing apparatus 710 includes a chemical liquid nozzle moving device 737. The chemical liquid nozzle moving device 737 moves the chemical liquid nozzle 734.

The chemical liquid nozzle moving device 737 moves the chemical liquid nozzle 734 between a processing position where the chemical liquid discharged from the chemical liquid nozzle 734 lands on the first surface W1 and a retracted position where the chemical liquid nozzle 734 is retracted around the spin chuck 75. move it.

The chemical liquid nozzle moving device 737 moves the chemical liquid landing position within the first surface W1 by moving the chemical liquid nozzle 734. The chemical liquid nozzle 734 functions as a scan nozzle that discharges the chemical liquid while moving the position of the chemical liquid onto the first surface W1 between the center and the peripheral edge.

The processing liquid supply mechanism 76 includes a rinse liquid nozzle 738, a rinse liquid pipe 739, and a rinse liquid valve 740. The rinse liquid nozzle 738 functions as an upper surface nozzle that discharges the rinse liquid toward the first surface W1. Rinse liquid piping 739 is connected to rinse liquid nozzle 738. The rinse liquid valve 740 is provided in the middle of the rinse liquid pipe 739. Rinsing liquid is supplied to the rinsing liquid piping 739 from the fluid box 703 (FIG. 1) via a rinsing liquid valve 740.

When the rinse liquid valve 740 is opened, the rinse liquid supplied from the rinse liquid piping 739 to the rinse liquid nozzle 738 is discharged downward from the rinse liquid nozzle 738. This discharge supplies the rinse liquid to the first surface W1. When the rinse liquid valve 740 is closed, the discharge of rinse liquid from the rinse liquid nozzle 738 is stopped.

The substrate processing apparatus 710 includes a rinsing liquid nozzle moving device 741. The rinse liquid nozzle moving device 741 moves the rinse liquid nozzle 738.

The rinsing liquid nozzle moving device 741 moves the rinsing liquid nozzle 738 between a processing position where the rinsing liquid discharged from the rinsing liquid nozzle 738 lands on the first surface W1 and a retracted position where the rinsing liquid nozzle 738 is retracted around the spin chuck 75. Move the rinse liquid nozzle 738.

The rinse liquid nozzle moving device 741 moves the rinse liquid landing position within the first surface W1 by moving the rinse liquid nozzle 738. The rinsing liquid nozzle 738 functions as a scan nozzle that discharges the rinsing liquid while the position of the rinsing liquid on the first surface W1 moves between the center and the periphery.

Substrate processing apparatus 710 includes a fluid supply mechanism 742 . The fluid supply mechanism 742 has a function of supplying processing liquid and gas to the second surface W2.

A chemical liquid piping 743, a rinsing liquid piping 745, and a gas piping 781 are connected to the fluid supply mechanism 742, and a chemical liquid, a rinsing liquid, and a gas are supplied from each. Examples of the gas include inert gas and nitrogen gas.

A chemical liquid valve 744 is provided in the middle of the chemical liquid pipe 743. A chemical liquid is supplied to the chemical liquid piping 743 from the fluid box 703 (see FIG. 1) via a chemical liquid valve 744.

When the chemical liquid valve 744 is opened, the chemical liquid supplied from the chemical liquid piping 743 to the fluid supply mechanism 742 is supplied toward the second surface W2. Through this supply, the chemical solution is supplied to the second surface W2. When the chemical liquid valve 744 is closed, the supply of the chemical liquid from the fluid supply mechanism 742 is stopped.

A rinsing liquid valve 746 is provided in the middle of the rinsing liquid piping 745. Rinsing liquid is supplied to the rinsing liquid piping 745 from the fluid box 703 (see FIG. 1) via a rinsing liquid valve 746.

When the rinse liquid valve 746 is opened, the rinse liquid supplied from the rinse liquid pipe 745 to the fluid supply mechanism 742 is supplied toward the second surface W2. Through this supply, the rinsing liquid is supplied to the second surface W2. When the rinse liquid valve 746 is closed, the supply of rinse liquid from the fluid supply mechanism 742 is stopped.

A gas valve 782 is provided in the middle of the gas pipe 781. Gas is supplied to the gas pipe 781 from the fluid box 703 (see FIG. 1) via a gas valve 782.

When the gas valve 782 is opened, the gas supplied from the gas pipe 781 to the fluid supply mechanism 742 is supplied toward the second surface W2. Through this supply, gas is supplied to the second surface W2. When gas valve 782 is closed, gas supply from fluid supply mechanism 742 is stopped.

The cup 77 is located outward (in the direction away from the substrate rotation axis Q) from the substrate W in the held state. The cup 77 includes an outer wall 747, a plurality of processing liquid cups, a plurality of guards, and a guard lifting device 755.

The outer wall 747 is cylindrical and surrounds the spin chuck 75. The plurality of processing liquid cups include a first processing liquid cup 748 , a second processing liquid cup 749 , and a third processing liquid cup 750 . The first processing liquid cup 748 , the second processing liquid cup 749 , and the third processing liquid cup 750 all surround the spin chuck 75 between the spin chuck 75 and the outer wall 747 .

The first processing liquid cup 748 is located closer to the spin chuck 75 than the second processing liquid cup 749. The second processing liquid cup 749 is located further outward than the first processing liquid cup 748. The third processing liquid cup 750 is located further outward than the second processing liquid cup 749.

The plurality of guards catch the processing liquid scattered around the substrate W. A plurality of guards surround spin chuck 75 between spin chuck 75 and outer wall 747. The plurality of guards include a first guard 751, a second guard 752, a third guard 753, and a fourth guard 754.

The first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 are driven by the control of a guard lifting device 755, and are independently raised and lowered as desired. By such lifting and lowering, the used processing liquid is guided to the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750, depending on the type of the processing liquid, for example. The guard lifting device 755 lifts and lowers the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754 independently of each other. The third processing liquid cup 750 moves up and down together with the second guard 752. The third processing liquid cup 750 is, for example, integrated with the second guard 752.

Each of the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 forms an annular groove that opens upward. The processing liquid led to the first processing liquid cup 748, the second processing liquid cup 749, and the third processing liquid cup 750 is sent to a recovery device or a waste liquid device (not shown) through these grooves.

Each of the first guard 751, second guard 752, third guard 753, and fourth guard 754 includes an inclined portion 756 and a guide portion 757. The inclined portion 756 has a cylindrical shape and extends outward from the top to the bottom. The guide portion 757 has a cylindrical shape and extends downward from the lower end of the inclined portion 756. The four inclined parts 756 are located one above the other. The four guide parts 757 are coaxially located.

The upper ends of the first guard 751 , the second guard 752 , the third guard 753 , and the fourth guard 754 are formed by the upper ends of the respective inclined parts 756 . These upper ends have a larger diameter than the substrate W and the chuck base 711.

The guide portion 757 of the first guard 751 is placed in the first processing liquid cup 748, the guide portion 757 of the second guard 752 is placed in the second processing liquid cup 749, and the guide portion 757 of the third guard 753 is placed in the third processing liquid cup. They can go in and out of 750 respectively.

The cup 77 can be expanded and folded by the guard elevating device 755 elevating at least one of the first guard 751, the second guard 752, the third guard 753, and the fourth guard 754.

The guard lifting device 755 lifts and lowers the first guard 751 between an upper position where the upper end of the first guard 751 is located above the substrate W and a lower position where the upper end of the first guard 751 is located below the substrate W. It has a function of holding the first guard 751 at any position between the upper position and the lower position. The guard elevating device 755 has a function of similarly elevating and holding the second guard 752, third guard 753, and fourth guard 754.

The supply of the processing liquid to the substrate W and the drying of the substrate W are performed with the plurality of guards facing the peripheral surface of the substrate W. For example, when the third guard 753 is arranged to face the peripheral surface of the substrate W, the first guard 751 and the second guard 752 are arranged at the lower position, and the third guard 753 and the fourth guard 754 are arranged at the upper position. . In addition, when the outermost fourth guard 754 is arranged to face the peripheral surface of the substrate W, the fourth guard 754 is arranged at the upper position, and the first guard 751, the second guard 752, and the third guard 753 are arranged at the lower position. will be placed in

<Spin chuck 75>
Next, details of the configuration employed in the spin chuck 75 will be explained. FIG. 3 is a cross-sectional view that includes the substrate rotation axis Q and shows a cross section of a part of the spin chuck 75 parallel to the direction Z.

The chuck base 11 is adopted as a chuck base 711. Although the fixed base 15 is located below the chuck base 11, only the position occupied by the fixed base 15 is shown by a chain line to avoid complication of illustration. Similarly, to avoid complication in the illustration, the spin motor 714 that rotates the chuck base 11 is also omitted from the illustration.

In the following example, the chuck 12 has a columnar shape and is employed as a chuck pin 712. The chuck 12 does not necessarily have to be pin-shaped.

The chuck 12 passes through the chuck base 11 on the outer peripheral side and the main surface 111 side of the chuck base 11 . The main surface 111 is a surface of the chuck base 11 on the Z direction side, and the normal direction of the main surface 111 is parallel to the Z direction.

A bearing 112 is provided at a portion where the chuck 12 passes through the chuck base 11. The bearing 112 allows the chuck 12 to move along the direction Z (movement along the direction Z is also expressed as "elevating"), and allows the chuck 12 to rotate around the chuck rotation axis J parallel to the direction Z. shall be. The bearing 112 suppresses movement of the chuck 12 non-parallel to the Z direction.

Here, the rotating plate 30, the cam plate 31, the shaft 33, the elevating plate 34, the magnet 35, and the rotating shaft 36 are illustrated as components corresponding to the chuck opening/closing mechanism 713. The rotary plate 30 is attached below the chuck 12. The rotating shaft 36 is coaxially attached to the chuck 12 via the rotating plate 30. The rotating shaft 36 is attached to the elevating plate 22 via a bearing 37. The bearing 37 supports the rotary shaft 36 so that the rotary shaft 36 can rotate around the chuck rotation axis J.

The cam plate 31 is fixed to the upper surface of the elevating plate 34. The magnet 35 is fixed to the lower surface of the elevating plate 34.

The rotating shaft 36 pushes down the lifting plate 22 due to the weight of the chuck 12, the rotating plate 30, and the rotating shaft 36. The elevating plate 22 is pushed up along the direction Z by magnetic force, which will be described later. Therefore, the chuck 12 moves up and down as the lifting plate 22 moves up and down.

Since the bearing 112 suppresses non-parallel movement of the chuck 12 in the Z direction, non-parallel movement of the elevating plate 22 in the Z direction is also indirectly suppressed.

The chuck 12 has a mounting surface 122 on its Z-direction side. The chuck 12 further includes a grip portion 121 on the Z-direction side of the mounting surface 122 . The mounting surface 122 is used for mounting the substrate W, and the gripping part 121 is used for gripping the substrate W.

The chuck 12 can be located at a first position H and a second position L where the height of the gripping part 121 with respect to the main surface 111 is different from each other. The chuck 12 moves (raises and lowers) between a first position H and a second position L. The second position L is lower than the first position H. Specifically, the distance separating the gripping part 121 and the main surface 111 at the second position L is shorter than the distance separating the gripping part 121 and the main surface 111 at the first position H. However, in both the first position H and the second position L, the grip portion 121 and the mounting surface 122 are exposed from the main surface 111 in the direction Z. FIG. 3 illustrates a case where the chuck 12 is in the first position H.

The transfer process is performed when the chuck 12 is in the first position H. Processing using a processing liquid or using a gas on the substrate W can be performed at both the first position H and the second position L.

The bearing 37 and the rotating shaft 36 have a function of causing the rotating plate 30 and thus the chuck 12 to rotate around the chuck rotation axis J, or assist in this function.

The rotating plate 30 is provided with a shaft 33 . For example, the axis 33 is provided in a direction perpendicular to the direction Z. In FIG. 3, a mode in which the shaft 33 protrudes outward with respect to the substrate rotation axis Q is illustrated.

Due to the function of the cam plate 31, which will be described later, the shaft 33 rotates around the chuck rotation axis J, and accordingly, the rotary plate 30 rotates around the chuck rotation axis J. By rotating the rotating plate 30 around the chuck rotation axis J, rotation of the chuck 12 around the chuck rotation axis J (hereinafter referred to as "chuck rotation") is obtained.

<Opening and closing the chuck 12>
Hereinafter, it will be explained that the chuck 12 opens and closes, that is, transitions between the first attitude CL and the second attitude OP, due to the chuck rotation.

FIG. 3 shows a state in which the substrate W is placed on the placement surface 122. At this time, the chuck 12 is in the second posture OP.

FIG. 4 is a top view of the chuck 12 taken along the direction opposite to the Z direction. In FIG. 4, a state in which the chuck 12 is in the second posture OP is illustrated. In FIG. 4, parts of the rotating plate 30, shaft 33, and cam plate 31 are also shown for use in later explanation.

By rotating the chuck 12 in the direction Dr2, the chuck 12 transitions from the second posture OP to the first posture CL. By rotating the chuck 12 in the direction Dr1, the chuck 12 transitions from the first attitude CL to the second attitude OP.

FIG. 5 is a cross-sectional view that includes the substrate rotation axis Q and shows a cross section of a part of the spin chuck 75 parallel to the direction Z. FIG. 5 shows a state in which the chuck 12 is in the first position H and the substrate W is gripped by the gripper 121. At this time, the chuck 12 is in the first attitude CL.

FIG. 6 is a sectional view partially showing the chuck 12 and the substrate W in a state where the substrate W is held by the gripping part 121. The cross section is parallel to direction Z.

The grip portion 121 has a concave surface 121a. By fitting the peripheral edge of the substrate W into the concave surface 121a, the substrate W is sandwiched between the concave surface 121a from above and below, and is gripped by the gripping portion 121.

For example, it is desirable that the grip portion 121 be formed of a material containing synthetic resin, from the viewpoint that the substrate W is less likely to break when the peripheral edge of the substrate W is gripped.

FIG. 7 is a top view of the chuck 12 taken along the direction opposite to the Z direction. In FIG. 7, a state in which the chuck 12 is in the first posture CL is illustrated. In FIG. 7, parts of the rotating plate 30, the shaft 33, and the cam plate 31 are also shown for use in later explanations.

FIG. 8 is a top view showing the positional relationship between the gripping part 121 and the position W0 of the peripheral edge of the substrate W. The position of the gripping portion 121 when the chuck 12 takes the first attitude CL is shown by a solid line, and the position when the chuck 12 takes the second attitude OP is shown by a chain line.

3 and 5 both show the chuck 12 in the first position H. When the chuck 12 is in the first position H and assumes the second posture OP (see FIG. 3), the substrate W is placed on the placement surface 122 (transfer of the substrate W to the spin chuck 75). After the substrate W is placed on the mounting surface 122, the concave surface 121a guides the periphery of the substrate W along the direction Z due to chuck rotation, and the gripping part 121 grips the substrate W (see FIG. 5).

Alternatively, from the state where the chuck 12 is in the first position H and takes the first attitude CL, the concave surface 121a guides the periphery of the substrate W along the direction opposite to the direction Z by rotation of the chuck, and the substrate W is placed on the mounting surface. 122. Thereafter, the substrate W is removed from the mounting surface 122 (removal of the substrate W from the spin chuck 75).

From the above, the following explanation is possible. The spin chuck 75 is a substrate holding device that holds the substrate W, and includes a chuck base 11 and a plurality of chucks 12. The chuck base 11 mounts the chuck 12. Each of the chucks 12 has a gripping part 121 used to grip the substrate W. The main surface 111 of the chuck base 11 exposes the grip portion 121. The substrate W is held by the holding part 121. The chuck base 11 is used to rotate the substrate W gripped by the gripper 121 .

Note that, as described above, the first posture CL and the second posture OP taken by the chuck 12 are distinguished by the fact that the concave surface 121a of the gripping portion 121 faces in different directions. Therefore, hereinafter, the chuck 12 taking the first attitude CL and the second attitude OP may be expressed as the gripping part 121 taking the first attitude CL or the second attitude OP.

<Mechanism that causes chuck rotation>
Referring to FIGS. 3 and 5, the fixed base 15 houses a first drive magnet 201 and a second drive magnet 501. The first drive magnet 201 is fixed on the Z direction side with respect to the ring 20, and the second drive magnet 501 is fixed on the Z direction side with respect to the ring 50, respectively.

FIG. 9 is a top view partially showing the rings 20, 50, the first drive magnet 201, and the second drive magnet 501, as seen along the direction opposite to the direction Z. Here, a case is illustrated in which the first drive magnet 201 and the second drive magnet 501 have annular shapes. Either or both of the first drive magnet 201 and the second drive magnet 501 may be realized using a plurality of magnets arranged in a ring.

The rings 20 and 50 can be moved up and down while being restrained from moving in directions non-parallel to the Z direction. The raising and lowering of the rings 20 and 50 causes the first driving magnet 201 and the second driving magnet 501 to rise and fall. Mechanisms for such lifting and lowering are known, for example, from Patent Documents 1 and 4, and therefore their explanation and illustration will be omitted.

A magnetic force acts between the magnet 35 and the second drive magnet 501. More specifically, a repulsive force acts between the magnet 35 and the second drive magnet 501. The raising and lowering of the second driving magnet 501 is not affected by the raising and lowering of the magnet 35, and the magnet 35 is raised and lowered by the raising and lowering of the second driving magnet 501. Therefore, the magnet 35 will also be referred to as a second driven magnet 35 below.

10 and 11 both show the positional relationship among the cam plate 31, shaft 33, elevating plate 34, and second driven magnet 35. 10 and 11 are side views of the chuck base 11 viewed from the outer circumferential side toward the substrate rotation axis Q.

Similar to FIGS. 3 and 4, FIG. 10 shows a case where the chuck 12 takes the second posture OP. Similar to FIGS. 5 and 7, FIG. 11 shows a case where the chuck 12 takes the first attitude CL.

A hole 32 is bored in the cam plate 31. A shaft 33 is fitted into the hole 32. 3, FIG. 5, FIG. 10, and FIG. 11 illustrate the case where the hole 32 penetrates the cam plate 31. The hole 32 does not need to pass through as long as the shaft 33 is fitted therein.

In FIGS. 3 and 5, a bearing 38 surrounding the shaft 33 is also illustrated, but in FIGS. 10 and 11, the bearing 38 is considered to be included in the shaft 33, and illustration thereof is omitted.

The hole 32 is long in a direction inclined with respect to both the direction Z and the direction RDr. In FIGS. 3, 4, 5, and 7, the cam plate 31 is shown in cross section along the longitudinal direction of the hole 32 in order to make it easier to see the position of the shaft 33 in the hole 32.

As the ring 50 moves (rises) along the direction Z, the second drive magnet 501 rises. Due to the repulsive force caused by the magnetic force acting between the second drive magnet 501 and the second drive magnet 501, the rise of the second drive magnet 501 causes the second driven magnet 35 to rise. The rise of the second driven magnet 35 causes the elevating plate 34 to rise. The rise of the elevating plate 34 causes the cam plate 31 to rise.

The rise of the cam plate 31 causes the hole 32 to rise. The lifting of the shaft 33 is suppressed by the weight of the chuck 12, the rotary plate 30, and the rotary shaft 36. On the other hand, since the shaft 33 can rotate about the chuck rotation axis J, the rise of the hole 32 causes the shaft 33 and the rotary plate 30 to rotate, and thus the chuck 12 to rotate on its own axis. Specifically, as the hole 32 rises, the shaft 33 descends relative to the hole 32, and this relative descent causes the hole 32 to guide the shaft 33 in the direction Dr1. As the shaft 33 rotates in the direction Dr1, the chuck 12 rotates in the direction Dr1.

As described above, by raising the second driving magnet 501, the chuck rotates in the direction Dr1, and the chuck 12 takes the second posture OP (the gripping portion 121 indicated by the chain line in FIG. 8 (see also).

As the ring 50 moves (descends) in the direction opposite to the direction Z, the second drive magnet 501 descends. As the second driving magnet 501 descends, the second driven magnet 35 is lowered by the weight of the cam plate 31, the elevating plate 34, and the second driven magnet 35 while receiving a repulsive force due to the magnetic force acting between it and the second driving magnet 501. do.

The lowering of the second driven magnet 35 lowers the elevating plate 34 and the cam plate 31. The chuck 12, the rotary plate 30, and the rotary shaft 36 move the shaft 33 downwards due to the repulsive force acting between the first driving magnet 201 and the first driven magnet 202 (which will be explained later in <Mechanism for raising and lowering the chuck 12>). is suppressed. On the other hand, since the shaft 33 can rotate about the chuck rotation axis J, the lowering of the hole 32 causes the shaft 33 and the rotating plate 30 to rotate, and thus the chuck 12 to rotate on its own axis. Specifically, the lowering of the hole 32 causes the shaft 33 to rise relative to the hole 32, and this relative rise causes the hole 32 to guide the shaft 33 in the direction Dr2. As the shaft 33 rotates in the direction Dr2, the chuck 12 rotates in the direction Dr2.

As described above, by lowering the second driving magnet 501, the chuck rotates in the direction Dr2, and the chuck 12 takes the first attitude CL (the gripping portion 121 shown by the solid line in FIG. 8 (see also).

Since the shaft 33 fits into the hole 32, the movement range of the shaft 33 is limited between the end of the hole 32 on the Z direction side (hereinafter also referred to as the "upper end") and the end of the hole 32 on the opposite side to the Z direction. Ru. The shaft 33 is guided by the hole 32 and rotates around the chuck rotation axis J. Therefore, the rotatable range of the shaft 33 and, in turn, the rotatable range of the chuck 12 due to chuck rotation are determined by the positional relationship between the shaft 33 and the cam plate 31 in which the hole 32 is formed.

For example, the technique disclosed in Patent Document 1 may be applied to rotate the chuck by raising and lowering the cam plate 31. Alternatively, chuck rotation may be obtained without using a cam plate, using repulsion and attraction of a magnet, as disclosed in Patent Document 4, for example. Further, from the viewpoint of elevating the hole 32, the elevating plate 34 may be omitted.

The above-mentioned raising and lowering of the second drive magnet 501 is realized by a mechanism (not shown) under the control of the control device 73.

Note that chuck rotation is not necessarily performed over the entire range. This is because when the substrate W is held by the gripping portion 121, the rotation of the chuck can be stopped by the substrate W instead of the rotation of the shaft 33 being suppressed by the hole 32.

That is, even when the chuck 12 takes the first attitude CL, it may rotate more in the direction Dr2 when not gripping the substrate W than when gripping the substrate W. The fact that the first posture CL of the chuck 12 depends on whether or not it grips the substrate W will be explained in <Detection of falling off of the substrate W> below.

<Mechanism for raising and lowering the chuck 12>
The first driving magnet 201 exerts magnetic force with the magnet 202 housed in the chuck base 11. More specifically, a repulsive force acts between the magnet 202 and the first drive magnet 201. The raising and lowering of the first driving magnet 201 is not affected by the raising and lowering of the magnet 202, and the magnet 202 is raised and lowered by the raising and lowering of the first driving magnet 201. Therefore, the magnet 202 will also be referred to as a first driven magnet 202 below. The first driven magnet 202 is fixed to the lower surface of the elevating plate 22.

As the ring 20 rises, the first drive magnet 201 rises. Due to the repulsive force derived from the magnetic force acting between the first drive magnet 201 and the first drive magnet 201, the rise of the first drive magnet 201 causes the first driven magnet 202 to rise. The rise of the first driven magnet 202 causes the elevating plate 22 to rise. The lifting of the elevating plate 22 causes the chuck 12 to rise. As the first driving magnet 201 rises in this manner, the chuck 12 rises, and the chuck 12 moves to the first position H.

As the ring 20 descends, the first drive magnet 201 descends. As the first drive magnet 201 descends, the first driven magnet 202 is lowered by the weight of the chuck 12, the rotary plate 30, and the rotary shaft 36 while receiving a repulsive force derived from the magnetic force acting between it and the first drive magnet 201. do.

The lowering of the first driven magnet 202 lowers the elevating plate 22. The lowering of the elevating plate 22 lowers the chuck 12. As the first driving magnet 201 descends in this manner, the chuck 12 descends, and the chuck 12 moves to the second position L.

For example, the technique disclosed in Patent Document 3 may be applied to such raising and lowering of the chuck 12.

The lifting of the shaft 33 is suppressed by the weight of the chuck 12, the rotary plate 30, and the rotary shaft 36. Further, since the repulsive force acting between the first drive magnet 201 and the first driven magnet 202 is large enough to support the weight, the descent of the shaft 33 is also suppressed. Therefore, the rotation of the shaft 33 and, by extension, the rotary plate 30 does not affect the vertical movement of the chuck 12.

The rotary plate 30 moves up and down along the Z direction, and the rotary plate 30 rotates around a chuck rotation axis J parallel to the Z direction. Therefore, the movement of the chuck 12 up and down does not affect the rotation of the rotary plate 30 or the rotation of the chuck.

FIG. 12 is a cross-sectional view that includes the substrate rotation axis Q and shows a cross section of a part of the spin chuck 75 parallel to the direction Z. FIG. 12 illustrates a case where the chuck 12 is in the second position L and assumes the first posture CL. In comparison with FIG. 5, FIG. 12 shows a state in which the first drive magnet 201 is lowered (located away from the main surface 111).

Normally, when the chuck 12 is in the second position L, the substrate W is gripped, so the chuck 12 does not entirely take the second posture OP. However, as will be explained later in <"Changing the grip" of the substrate W>, on the premise that some of the chucks 12 take the first attitude CL, some of the other chucks 12 may take the second attitude OP. .

The above-mentioned raising and lowering of the first drive magnet 201 is realized by a mechanism (not shown) under the control of the control device 73.

From the above, the following explanation is possible. The spin chuck 75 includes a first mechanism and a second mechanism. The first mechanism includes a first drive section, a first drive magnet 201, and a first driven magnet 202. The second mechanism includes a second drive section, a second drive magnet 501, and a second driven magnet 35.

The first drive unit drives the chuck 12 to move the chuck 12 between a first position H and a second position L. The height of the grip portion 121 relative to the main surface 111 at the first position H is higher than the height at the second position L. The first driving section is realized by the elevating plate 22, the rotating shaft 36, and the rotating plate 30.

The first drive magnet 201 is movable, and in particular can be raised and lowered. The first driven magnet 202 is fixed to the first drive section. The first driven magnet 202 is fixed to the elevating plate 22, for example, and faces the first driving magnet 201. The first driven magnet 202 moves according to the movement of the first driving magnet 201. Typically, the first driven magnet 202 moves up and down as the first driving magnet 201 moves up and down. The first driven magnet 202 has a function of operating the first drive section.

The second drive unit drives the chuck 12 to transition the chuck 12 between the first attitude CL and the second attitude OP. In the first attitude CL, the gripping section 121 can grip the substrate W. In the second posture OP, the grip is released. The second driving section is realized by the elevating plate 34, the cam plate 31, the shaft 33, the rotating plate 30, and the rotating shaft 36.

The second drive magnet 501 is movable, and in particular can be raised and lowered. The second driven magnet 35 is fixed to the second drive section. The second driven magnet 35 is fixed to the elevating plate 34, for example, and faces the second driving magnet 501. The second driven magnet 35 moves in accordance with the movement of the second drive magnet 501. Typically, the second driven magnet 35 moves up and down as the second drive magnet 501 moves up and down. The second driven magnet 35 has a function of operating the second drive section.

The rotating plate 30 and the rotating shaft 36 are also components that realize the functions of the first drive section, and are also components that realize the functions of the second drive section. This is because by raising and lowering these, the chuck 12 is moved between the first position H and the second position L, and by rotating, the chuck 12 is transitioned between the first posture CL and the second posture OP. .

Furthermore, the following explanation is possible. The grip portion 121 includes a concave surface 121a. The concave surface 121a grips the periphery of the substrate W when the substrate W is gripped. The rotation of the chuck moves the opening direction of the concave surface 121a. Chuck rotation is rotation of the chuck 12 in directions Dr1 and Dr2 around the chuck rotation axis J. The chuck rotation axis J is parallel to the direction Z, which is the normal direction of the chuck base 11 (more specifically, the main surface 111 thereof).

Movement of the second drive magnet 501 in the Z direction (in this case up and down) causes the second driven magnet 35 to move in the Z direction. The second drive unit converts movement of the second driven magnet 35 in direction Z into chuck rotation.

The spin chuck 75 having such a structure easily moves the chuck 12 up and down, and easily grips and releases the substrate W by the chuck 12.

<Relationship between the magnitude of magnetic force>
As the chuck 12 rises, the rotary plate 30 also rises, so that the cam plate 31 and, by extension, the second driven magnet 35 also rise via the shaft 33. Therefore, in order for the chuck 12 to be able to assume the second posture OP even when the chuck 12 is in the first position H, it is desirable that the following relationship exists.

For convenience, regarding the magnetic force acting between the second driving magnet 501 and the second driven magnet 35, there is a repulsive force f1 when the chuck 12 is in the first position H and takes the second posture OP, and a repulsive force f1 when the chuck 12 is in the second position L. repulsive force f2 when the chuck 12 is in the first position H and assumes the first attitude OP; repulsive force f3 when the chuck 12 is in the second position L and assumes the first attitude CL; This will be explained by introducing the repulsive force f4.

Regardless of whether the chuck 12 is in the first position H or the second position L, when the chuck 12 takes the second position OP, the cam plate 31 is located above relative to the axis 33. Therefore, the repulsive forces f1 and f2 are larger than the repulsive forces f3 and f4. Specifically, as can be understood by comparing FIGS. 3 and 5, the second drive magnet 501 rises and approaches the main surface 111, so that the repulsive force f1 is larger than the repulsive force f3.

When the chuck 12 takes the first posture CL, the repulsive force f4 when the chuck 12 is at the second position L is larger than the repulsive force f3 when the chuck 12 is at the first position H. Since the shaft 33 moves up and down as the chuck 12 moves up and down, the repulsive force f4 when the chuck 12 is at the second position L (see FIG. 12), even if the second driving magnet 501 does not move up and down, It is larger than the repulsive force f3 when it is in position H (see FIG. 5).

It is assumed that some chucks 12 take the second posture OP not only when they are at the first position H but also when they are at the second position L (<"Switching" of the substrate W, which will be described later). reference). In this case, considering the same, the repulsive force f2 is larger than the repulsive force f1.

<Substrate processing flow>
FIG. 13 is a flowchart illustrating the substrate processing step in this embodiment, specifically, the step in which the substrate W held on the chuck base 11 is processed. This flowchart is executed under the control of the control device 73.

The first attitude CL and the second attitude OP can be distinguished by the direction in which the concave surface 121a of the gripping part 121 opens, so in FIG. ”.

In step S101, the chuck 12 assumes the second posture OP at the first position H. After step S101 is executed, the substrate W is placed on the mounting surface 122 in step S102. Specifically, the substrate W is placed on the placement surface 122 by the central robot 708. FIG. 3 shows the state immediately after step S102 is executed.

After step S102 is executed, in step S103, the chuck 12 assumes the first posture CL while being maintained at the first position H. As a result, the substrate W is held by the holding section 121. FIG. 5 shows the state immediately after step S103 is executed.

After step S103 is executed, the substrate W starts rotating in step S104. Specifically, with the substrate W being gripped, the chuck base 11 rotates about the substrate rotation axis Q in the direction RDr.

After step S104 is executed, the chuck 12 moves to the second position L while maintaining the first posture CL in step S105. Specifically, the chuck 12 moves to the second position L with the substrate W being gripped and rotated. The state in which step S105 is being executed corresponds to FIG. 12 (however, it is not clearly shown that the chuck base 11 is rotating).

After step S105 is executed, in step S106, the chuck 12 moves to the first position H while maintaining the first posture CL. Specifically, the chuck 12 moves to the first position H with the substrate W being gripped and rotated.

After step S106 is executed, the rotation of the substrate W is stopped in step S107. Specifically, the chuck base 11 stops rotating while the substrate W is being gripped. FIG. 5 shows the state immediately after step S107 is executed.

After step S107 is executed, in step S108, the chuck 12 assumes the second posture OP while being maintained at the first position H. As a result, the substrate W is placed on the placement surface 122. FIG. 3 shows the state immediately after step S108 is executed.

After step S108 is executed, the substrate W is removed from the mounting surface 122. Specifically, the substrate W is removed from the mounting surface 122 by the central robot 708.

In FIG. 13, the process of using the treatment liquid is represented by step S120. Step S120 starts at any timing after execution of step S103, and then ends at any timing before execution of step S107.

In FIG. 13, the step of supplying gas to the substrate W is represented by step S110. Step S110 starts at any timing after execution of step S102, and then ends at any timing before execution of step S109.

In FIG. 13, step S2 is also shown. Step S2 is a step in which the chuck 12 that grips the substrate W is replaced while the substrate W is held above the main surface 111. For convenience, this process is tentatively referred to as "switching the grip" of the substrate W. Step S2 starts at some timing after the execution of step S102, and then ends at some timing before the execution of step S108.

<Use of processing liquid and gas supply>
FIG. 14 is a cross-sectional view illustrating a part of the flowchart shown in FIG. 13, specifically, the operation of steps S110 and S120. The cross section corresponds to FIG. 5, and FIG. 14 shows an enlarged view of the main surface 111 and its vicinity.

FIG. 14 illustrates a state in which both steps S110 and S120 are executed after step S104 is executed and before step S105 is executed.

The fluid supply mechanism 42 functions as a fluid supply mechanism 742. In this embodiment, the fluid supply mechanism 42 does not rotate. A fluid supply pipe 421 extending along direction Z and opening toward the main surface 111 is open to the fluid supply mechanism 42 . The pipe 421 communicates with a chemical liquid pipe 743, a rinse liquid pipe 745, and a gas pipe 781 (see FIG. 2).

In FIG. 14, a case is illustrated in which the substrate W is held by the chuck 12 at the first position H, the chemical F1 is supplied from the chemical nozzle 734 to the first surface W1, and the fluid F2 is supplied from the pipe 421. . A rinsing liquid may be supplied to the first surface W1 instead of the chemical liquid F1. The fluid F2 may be any of a chemical liquid, a rinsing liquid, and a gas. It is not necessary to supply the fluid F2 while the substrate W is being held by the chuck 12 at the first position H.

FIG. 15 is a cross-sectional view illustrating a part of the flowchart shown in FIG. 13, specifically, the operation of step S120. The cross section corresponds to FIG. 12, and FIG. 15 shows an enlarged view of the main surface 111 and its vicinity.

In FIG. 15, after step S104 is executed, step S120 is executed and the process ends, and then step S105 is executed while the substrate W is still rotating without using the processing liquid, and step S110 is executed before step S106 is executed. The following is an example of a state in which is being executed.

Gas is supplied to the second surface W2 of the substrate W gripped by the chuck 12 at the second position L, for example, as a fluid F2. In a situation where the chuck 12 is at the second position L and the distance separating the second surface W2 and the tube 421 is shorter than the distance separating the second surface W2 and the tube 421 when the chuck 12 is at the first position H, Supplying gas to the second surface W2 is advantageous in at least the following two points. The first is that turbulence is less likely to occur in the gas between the main surface 111 and the second surface W2. The second reason is that it is easy to increase the gas wind speed and prevent the processing liquid from flowing around from the first surface W1.

A situation in which the chuck 12 is in the second position L and the distance separating the second surface W2 and the main surface 111 is shorter than the distance separating the second surface W2 and the main surface 111 when the chuck 12 is in the first position H. However, supplying the processing liquid to the first surface W1 is disadvantageous in at least the following two points. The first is that the processing liquid tends to adhere to both the second surface W2 and the main surface 111. The second problem is that when impurities or dirt adhere to the main surface 111, the second surface W2 is likely to be contaminated.

Considering these two advantages and two disadvantages, a desirable embodiment of the process of using a chemical solution and supplying gas to the gripped substrate W is exemplified as follows. (a1) With the chuck 12 in the first position H, supply of the processing liquid to the first surface W1 is started and stopped. (a2) Then, with the chuck 12 in the second position L, gas is supplied to the second surface W2.

When the rotation of the substrate W stops between steps (a1) and (a2), there is a high possibility that the processing liquid that covers the first surface W1 in step (a1) will not partially exist on the first surface W1. Such partial absence of the processing liquid tends to cause so-called watermarks. Therefore, from the viewpoint of suppressing the occurrence of watermarks, it is further advantageous that the rotation of the substrate W is maintained between the above steps (a1) and (a2). In this embodiment, the rotation of the substrate W is maintained after step S104 is executed until step S107 is executed, so it is possible to execute steps (a1) and (a2) while the substrate W remains rotated. can.

Note that in this embodiment, it is not excluded that the fluid F2 is supplied to the second surface W2 in step (a1) (see FIG. 14). In this case, it does not matter whether the fluid F2 is a processing liquid or a gas.

For example, the fluid F2 shown in FIG. 14 corresponding to step (a1) may be a processing liquid, and the fluid F2 shown in FIG. 15 corresponding to step (a2) may be a gas. In this case, the processing liquid is supplied from the tube 421 to the second surface W2 with the substrate W being held high relative to the main surface 111, and with the substrate W being held low relative to the main surface 111. Gas is supplied. The gas contributes to drying the processing liquid supplied to the second surface W2.

For example, both the fluid F2 shown in FIG. 14 corresponding to step (a1) and the fluid F2 shown in FIG. 15 corresponding to step (a2) may be gases.

Alternatively, the chamber 74 may include a spin chuck 75 and a mechanism for supplying gas to the first surface W1 together with the processing liquid supply mechanism 76. In this case, the following step can be adopted instead of step (a1). (b1) With the chuck 12 in the first position H, the supply of gas to the first surface W1 and the supply of the processing liquid to the second surface W2 are started and stopped. In this case, the gas supplied to the second surface W2 in step (a2) contributes to drying the processing liquid supplied to the second surface W2 in step (b1).

Based on the above, the following explanation can be made. The second surface W2 of the substrate W is closer to the chuck base 11, more specifically to the main surface 111, than the first surface W1. When the chuck 12 is in the first position H and the substrate W is gripped by the gripping part 121, the processing liquid is supplied to at least one of the first surface W1 and the second surface W2 in the first step. In the second step, gas is supplied to the second surface W2 together with the first step or after the first step is completed.

In the second step, the substrate W is rotated by the chuck base 11 while being held by the holding part 121, and the holding part 121 is moved from the first position H to the second position L by the chuck 12. Alternatively, the substrate W approaches the chuck base 11 by the movement of the chuck 12 while being rotated by the chuck base 11 while being held by the gripping part 121 .

In this manner, in the processing step for the substrate W, the distance between the chuck base 11 and the substrate W is changed while the substrate W is being rotated.

<“Switching” the board W>
FIG. 16 is a cross-sectional view that includes the substrate rotation axis Q and shows a cross section of a part of the spin chuck 75 parallel to the direction Z. The chuck 12 that allows the holding of the substrate W to be changed includes a chuck 12A and a chuck 12B. Hereinafter, a case where a plurality of chucks 12A and chucks 12B, typically three chucks 12A and three chucks 12B, are provided as the chuck 12 will be exemplified.

The chuck 12A has the same configuration as the chuck 12 used in the explanation of FIGS. 3 to 15.

The chuck 12B also has a gripping portion 121 and a mounting surface 122 similar to those of the chuck 12A, and is used to place and grip the substrate W. Specifically, chuck 12B has the same first mechanism as chuck 12A, and has a different second mechanism.

The chuck 12B also has a first driven magnet 202, a lifting plate 22, a rotating shaft 36, and a rotating plate 30 similar to the chuck 12A.

The second mechanism of the chuck 12B includes a second drive section, a second drive magnet 601, and a second driven magnet 65. The second drive unit drives the chuck 12B to transition the chuck 12B between the first attitude CL and the second attitude OP.

The second driving section is realized by the elevating plate 64, the cam plate 61, the shaft 63, the rotating plate 30, and the rotating shaft 36.

The second drive magnet 601 is movable, and in particular can be raised and lowered. The second drive magnet 601 is fixed on the Z-direction side with respect to the ring 60. The second drive magnet 601 may be realized using a plurality of magnets arranged in a ring.

The ring 60 can move up and down while being restrained from moving in directions non-parallel to the Z direction. The raising and lowering of the ring 60 causes the second drive magnet 601 to rise and fall. Mechanisms for such lifting and lowering are known, for example, from Patent Documents 1 and 4, and therefore their explanation and illustration will be omitted.

A second driven magnet 65 is fixed to the second drive section. The second driven magnet 65 is fixed to the elevating plate 64, for example, and faces the second driving magnet 601. The second driven magnet 65 moves in accordance with the movement of the second drive magnet 601. Typically, the second driven magnet 65 moves up and down as the second drive magnet 601 moves up and down. The second driven magnet 65 has a function of operating the second drive section.

The elevating plate 64, cam plate 61, and shaft 63 are configured similarly to the elevating plate 34, cam plate 31, and shaft 33 of the chuck 12A, respectively. A hole 62 is bored in the cam plate 61. The shaft 33 fits into the hole 62. The hole 62 is long in a direction inclined with respect to both the direction Z and the direction RDr. In FIG. 16, in order to make it easier to see the position of the shaft 63 in the hole 62, the cam plate 61 is shown in cross section along the longitudinal direction of the hole 62.

Similarly to the chuck 12A, in the chuck 12B, the second driven magnet 65, the elevating plate 64, and the cam plate 61 move up and down as the second drive magnet 601 moves up and down, and the shaft 63 and, in turn, the rotating shaft 36 move around the chuck rotation axis J. Rotate.

The second drive magnets 501 and 601 move up and down independently. In order to avoid interference between the operations of the rings 50 and 60, the rings 50, the second driving magnet 501, the second driven magnet 35, the cam plate 31, the elevating plate 34, and the shaft 33 are located closer to the outer periphery of the chuck base 11 than the rotating shaft 36. The ring 60, the second driving magnet 601, the second driven magnet 65, the cam plate 61, the elevating plate 64, and the shaft 63 are provided closer to the inner circumference of the chuck base 11 than the rotating shaft 36.

FIG. 17 is a top view partially showing the rings 20, 50, 60, the first drive magnet 201, and the second drive magnet 501, 601, as seen along the direction opposite to the direction Z. Here, a case is illustrated in which the first drive magnet 201 and the second drive magnets 501 and 601 have an annular shape.

FIG. 18 is a top view of the chuck base 11 as seen along the direction opposite to the Z direction. An example is illustrated in which three chucks 12A and 12B are arranged annularly at equal intervals. Rings 20, 50, and 60 are also shown, but since they are housed in fixed base 15 below chuck base 11, they are represented by hidden dashed lines.

FIG. 19 is a top view of the chuck 12B taken along the direction opposite to the Z direction. In FIG. 19, a state in which the chuck 12B is in the first posture CL is illustrated. In FIG. 19, parts of the rotating plate 30, the shaft 63, and the cam plate 61 are also shown. In FIG. 19, in order to make it easier to see the position of the shaft 63 in the hole 62, the cam plate 61 is shown in cross section along the longitudinal direction of the hole 62.

FIG. 20 shows the positional relationship among the cam plate 61, shaft 63, elevating plate 64, and second driven magnet 65. FIG. 20 is a side view taken along the direction from the substrate rotation axis Q toward the outer circumferential side of the chuck base 11. FIG. 20 shows a case where the chuck 12B takes the first attitude CL.

In FIGS. 16 and 19, a bearing 68 surrounding the shaft 63 is also illustrated, but in FIG. 20, the bearing 68 is considered to be included in the shaft 63, and illustration thereof is omitted.

FIG. 21 is a flowchart illustrating a specific operation of step S2 (see FIG. 13) for changing the holding of the substrate W.

In step S201, the gripping part 121 of the chuck 12A takes the second attitude OP, and the gripping part 121 of the chuck 12B takes the first attitude CL. As a result, the substrate W is not held by the chuck 12A, but is held by the chuck 12B. FIG. 16 shows the state immediately after step S201 is executed.

Since the substrate W is held by the three chucks 12B, it does not come into contact with the mounting surface 122 of the chuck 12A.

For example, after step S102 is executed and before step S103 is executed, since the gripping part 121 was in the second posture OP in step S101, both the gripping parts 121 of the chucks 12A and 12B are in the second posture. I'm taking the OP. When step S2 is started before step S103 is executed, step S201 is executed, so that chuck rotation of the chuck 12A is not performed and chuck rotation of the chuck 12B is performed.

When step S2 starts after step S103 or step S104 is executed, step S201 is executed, so that chuck rotation of the chuck 12B is not performed and chuck rotation of the chuck 12A is performed.

After step S201 is executed, in step S202, the gripping part 121 of the chuck 12A takes the first attitude CL, and the gripping part 121 of the chuck 12B also takes the first attitude CL. Therefore, the substrate W is gripped by both chucks 12A and 12B. By executing step S202, the chuck 12B does not rotate on its axis, but the chuck 12A rotates on its axis.

After step S202 is executed, in step S203, the gripping part 121 of the chuck 12A takes the first attitude CL, and the gripping part 121 of the chuck 12B takes the second attitude OP. As a result, the substrate W is not held by the chuck 12B, but is held by the chuck 12A. By executing step S203, the chuck 12A does not rotate on its axis, but the chuck 12B rotates on its axis. Since the substrate W is held by the three chucks 12A, it does not come into contact with the mounting surface 122 of the chuck 12B. Step S2 ends by executing step S203.

By executing steps S201 and S203, a state in which the substrate W is held by the chuck 12B changes to a state in which the substrate W is held by the chuck 12A. In this way, the holding of the substrate W is changed in step S2.

Changing the grip of the substrate W is advantageous in terms of drying the processing liquid supplied to the substrate W. When the substrate W is rotated and dried while being held by the chuck 12B, the processing liquid tends to be difficult to dry between and in the vicinity of the holding part 121 of the chuck 12B and the substrate W. Therefore, by changing the chuck 12 that grips the substrate W from the chuck 12B to the chuck 12A, drying of the processing liquid in the portion of the substrate W that was gripped by the gripping portion 121 of the chuck 12B and its vicinity is facilitated. .

Therefore, one of the preferable timings for executing step S2 is after the completion of step S120 (that is, after the process using the processing liquid is finished) and before the execution of step S107 (that is, when the rotation of the substrate W is maintained). state).

Considering that step S2 is executed while the rotation of the substrate W is maintained and that the substrate W is gripped while the substrate W is rotating, the step S2 is performed between step S201 and step S203. It is preferable that S202 is executed.

When both chucks 12A and 12B are in the second position L, it is also possible to change the holding of the substrate W. FIG. 22 is a cross-sectional view that includes the substrate rotation axis Q and shows a cross section of a part of the spin chuck 75 parallel to the direction Z. FIG. 22 shows a state in which the chucks 12A and 12B are both in the second position L, the grip of the chuck 12A is released, and the substrate W is gripped by the chuck 12B.

From the above, the following explanation is possible. When the substrate W is rotated by the chuck base 11 and both the chucks 12A and 12B are at the first position H or when both the chucks 12A and 12B are at the second position L: the chuck 12A is in the second posture When the chuck 12B takes the second attitude OP, the chuck 12B takes the first attitude CL without taking the second attitude OP (S201); When the chuck 12B takes the second attitude OP, the chuck 12A takes the first attitude CL without taking the second attitude OP. (S203); Both chucks 12A and 12B can take the first attitude CL (S202).

It is also possible to adopt a process in which the chucks 12A and 12B are replaced with each other in steps S201 and S203.

The mechanisms for causing the chucks 12A and 12B to take the first position H and the second position L are the same, and the mechanisms for making them take the first posture CL and the second posture OP are similar. Therefore, both of the chucks 12A and 12B can be understood as the chuck 12, and the following explanation can be made in the same manner as in the above <Relationship of magnitude of magnetic force>. The repulsive forces f1 and f2 are larger than the repulsive forces f3 and f4. The repulsive force f1 is larger than the repulsive force f3. The repulsive force f4 is larger than the repulsive force f3. The repulsive force f4 is larger than the repulsive force f3. The repulsive force f2 is larger than the repulsive force f1. In other words, it is desirable that there be a relationship of f2>f1>f4>f3.

In order to avoid interference between the operations of the rings 50 and 60, the ring 60, the second driving magnet 601, the second driven magnet 65, the cam plate 61, the elevating plate 64, and the shaft 63 are connected to the ring 50, the second driving magnet 501, It may be provided closer to the outer circumference of the chuck base 11 than the second driven magnet 35, the cam plate 31, the elevating plate 34, and the shaft 33.

<Detection of falling off of substrate W>
When the chuck 12 transitions from the second attitude OP to the first attitude CL, the chuck rotates and the gripping portion 121 rotates in the direction Dr1. When the substrate W is held by the gripping part 121, the rotation of the chuck may be stopped by the substrate W. Hereinafter, stopping the rotation of the chuck by the substrate W will be referred to as "locking" by the substrate W.

The orientation of the gripping portion 121 when the chuck 12 assumes the first attitude CL is limited by being locked by the substrate W or by the shaft 33 reaching the upper end of the hole 32 . Hereinafter, a case will be assumed in which the shaft 33 does not reach the upper end of the hole 32 when the chuck 12 takes the first attitude CL and the substrate W is gripped. 5, 7, and 11 illustrate such a case, and there is a space between the shaft 33 and the upper end of the hole 32. When the chuck 12 assumes the first posture CL without the substrate W being gripped, the chuck rotation stops when the shaft 33 reaches the upper end of the hole 32.

FIG. 23 is a top view showing the chuck 12 in the first posture CL when the substrate W is not engaged. Similarly to FIG. 7, FIG. 23 also shows the rotating plate 30, shaft 33, and part of the cam plate 31, and the cam plate 31 is shown in a cross section along the direction of the hole 32. If the substrate W is not gripped when the chuck 12 assumes the first attitude CL, the shaft 33 will reach the upper end of the hole 32 without being locked by the substrate W.

FIG. 24 is a top view showing the positional relationship between the gripping part 121 and the position W0 of the periphery of the substrate W. In FIG. 24, the chain line indicates the gripping portion 121 and the position W0 when gripping the substrate W, and indicates the state shown by the solid line in FIG. 8, which corresponds to FIG. 7. In FIG. 24, the solid line indicates the gripping portion 121 when not gripping the substrate W, and corresponds to FIG. 23.

FIG. 25 is a side view showing the positional relationship among the cam plate 31, shaft 33, elevating plate 34, and second driven magnet 35. In FIG. 25, the chain line indicates the axis 33 when gripping the substrate W, and indicates the state shown by the solid line in FIG. 11, which corresponds to FIG. In FIG. 25, the solid line indicates the axis 33 when the substrate W is not gripped, and corresponds to FIG. 23.

As shown in FIG. 24, the first posture CL taken by the chuck 12 differs depending on whether the gripping section 121 grips the substrate W or not. Specifically, when the substrate W is gripped, the rotation angle in the chuck rotation direction Dr2 is small. Such a difference in rotation angle causes a difference in the relative positional relationship between the elevating plate 34 and the shaft 33, as understood from FIG. 25.

The vertical movement of the shaft 33 is not affected by the rotation of the shaft 33 about the chuck rotation axis J. Therefore, when the chuck 12 takes the first attitude CL, the position of the lifting plate 34 when the substrate W is being gripped is closer to the direction Z than the position of the lifting plate 34 when the substrate W is not being gripped.

Therefore, by detecting the position of the elevating plate 34 in the direction Z, it is possible to detect whether the substrate W is being gripped when the chuck 12 takes the first attitude CL. For example, it is detected that the substrate W has fallen from the chuck 12 that was gripping the substrate W.

From the above, the following explanation can be made. Chuck rotation when the chuck 12 transitions from the second attitude OP to the first attitude CL is limited by the substrate W being held by the holding part 121. By detecting the position of the elevating plate 34, it is possible to detect whether the substrate W is held by the chuck 12 in the first attitude CL. Considering that the second driven magnet 35 is fixed to the elevating plate 34, detection of the position of the elevating plate 34 indirectly detects the position of the second driven magnet 35.

The presence or absence of such gripping of the substrate W can be detected regardless of whether the chuck 12 is at the first position H or the second position L. 26 and 27 are cross-sectional views that include the substrate rotation axis Q and show a cross section of a part of the spin chuck 75 parallel to the direction Z. FIG. 26 illustrates a case where the chuck 12 is in the first position H and assumes the first attitude CL, and the substrate W is not gripped. FIG. 27 illustrates a case where the chuck 12 is in the second position L, assumes the first attitude CL, and the substrate W is not gripped.

FIG. 28 is a cross-sectional view illustrating a configuration for detecting whether or not the substrate W is being held. FIG. 28 shows the elevating plate 34, the second drive magnet 501, and their vicinity. A portion of the chuck base 11 on the fixed base 15 side is a translucent window 11a. A portion of the fixed base 15 on the chuck base 11 side is a translucent window 15a.

The fixed base 15 is provided with a distance measuring device 81 that measures the distance from itself to the elevating plate 34. The distance measuring device 81 irradiates the region 34a of the elevating plate 34 with the light L1, and receives the light L2 generated by the region 34a reflecting the light L1.

The region 34a is a region of the elevating plate 34 where the second driven magnet 35 is not provided, and is lined up along the direction Z with the distance measuring device 81 along with the windows 11a and 15a. The light L1 passes through the windows 15a and 11a from the range finder 81 in this order, is reflected by the area 34a to generate light L2, and the light L2 passes through the windows 11a and 15a in this order and is received by the range finder 81. Ru.

The technology of irradiating light onto a measurement target, receiving the light reflected by the measurement target, and measuring the distance to the measurement target is publicly known, and the distance measuring device 81 is configured with a known technology, so the details will be explained below. Further explanations will be omitted. The distance measurement is performed under the control device 73.

Although the elevating plate 34 can be omitted from the viewpoint of elevating the hole 32 as described above, it is desirable to provide it from the viewpoint of detecting the position of the second driven magnet 35.

FIG. 29 is a flowchart illustrating an operation for detecting that the substrate W has fallen (referred to as "substrate drop detection" in FIG. 29 and below). This flowchart is executed by the control device 73.

In step S301, it is determined whether the chuck 12 takes the first attitude CL or the second attitude OP. Such determination depends on the steps performed in the substrate processing process shown in FIG. As described above, since the substrate processing step is executed under the control of the control device 73, the control device 73 can execute the determination in step S301.

If it is determined in step S301 that the chuck 12 is in the second posture OP, step S301 is executed again. This is because the fact that the substrate W has fallen is detected by determining that the substrate W is not being held in a situation where the substrate W should be being held.

When substrate drop detection is performed after step S103 of the flowchart shown in FIG. 13 is executed and before step S108 is executed, step S301 may be omitted. This is because the chuck 12 assumes the first attitude CL by executing step S103.

If it is determined in step S301 that the chuck 12 is in the first attitude CL, step S302 is executed. In step S302, a difference in measured distances is acquired. Here, the “measured distance” is the distance from the distance measuring device 81 to the elevating plate 34 measured by the distance measuring device 81. The measured distance is sequentially notified to the control device 73, and the temporal fluctuation of the value is acquired by the control device 73 as a difference in the measured distance.

The difference in measured distance indicates the fluctuation of the elevating plate 34, and in turn, the fluctuation of the cam plate 31, the hole 32, and the second driven magnet 35.

After executing step S302, the difference and a threshold value are compared in step S303. The fact that the difference is larger than the threshold value indicates that the elevation plate 34 has changed more than the threshold value. Considering that the substrate W is normally gripped when the chuck 12 assumes the first attitude CL, the fact that the elevating plate 34 fluctuates more than the threshold value is an indicator that the substrate W has fallen.

Therefore, when it is determined in step S303 that the difference is larger than the threshold value (denoted as "Y" in FIG. 29), it is determined in step S304 that the substrate W has fallen. When it is determined in step S303 that the difference is less than or equal to the threshold value (denoted as "N" in FIG. 29), it is determined in step 305 that the substrate W is normally gripped (without falling).

The flowchart for substrate drop detection ends by executing either step S304 or S305. However, when the substrate W falls, it is preferable to stop processing the substrate W. From this point of view, when step S304 is executed, it is preferable to stop the rotation of the chuck base 11 and the supply of the processing liquid and gas.

The same value may be adopted as the threshold value regardless of whether the chuck 12 is in the first position H or the second position L. This is because the movement of the chuck 12 up and down does not affect the rotation of the rotary plate 30, nor does it affect the rotation of the chuck.

In the chucks 12A and 12B as well, it is possible to detect whether the substrate W is being gripped or not.

Although this invention has been described in detail, the above description is illustrative in all aspects, and the invention is not limited thereto. It is understood that countless variations not illustrated can be envisaged without departing from the scope of the invention. The configurations described in the above embodiment and each modification can be appropriately combined or omitted as long as they do not contradict each other.

11 Chuck base 12, 12A, 12B Chuck 22, 34, 64 Elevating plate 30 Rotating plate 31, 61 Cam plate 33, 63 Shaft 35, 65 Second driven magnet 36 Rotating shaft 111 Main surface 121 Gripping part 121a Concave surface 201 First drive Magnet 202 First driven magnet 501,601 Second driving magnet CL First posture Dr1, Dr2, RDr, Z direction F1 Chemical solution F2 Fluid f1, f2, f3, f4 Repulsion H First position J Chuck rotation axis L Second position OP Second attitude Q Substrate rotation axis W Substrate W0 Position W1 First surface W2 Second surface

Claims (7)

A substrate holding device that holds a substrate,
multiple chucks,
Chuck base and
A first mechanism;
and a second mechanism,
Each of the plurality of chucks has a gripping part used for gripping the substrate,
The chuck base is
Equipped with the plurality of chucks,
having a main surface exposing the gripping part,
used for rotating the substrate held by the gripping part,
The first mechanism is
a first driving unit that drives the plurality of chucks to move the plurality of chucks between a first position and a second position;
a movable first driving magnet;
a first driven magnet fixed to the first driving section and moving according to movement of the first driving magnet to operate the first driving section;
The height of the gripping portion relative to the main surface at the first position is higher than the height of the gripping portion relative to the main surface at the second position,
The second mechanism is
a second driving unit that drives the plurality of chucks to transition the plurality of chucks between a first posture in which the gripping portion can grip the substrate and a second posture in which the gripping portion is released; and,
a movable second drive magnet;
a second driven magnet fixed to the second driving section and moving according to movement of the second driving magnet to operate the second driving section ;
The gripping portion is
a concave surface that grips the periphery of the substrate when the substrate is gripped;
including;
Rotation of the plurality of chucks about an axis parallel to the normal direction of the main surface moves the opening direction of the concave surface,
The second driving unit converts the movement of the second driven magnet in the normal direction into the rotation of the plurality of chucks,
A substrate holding device , wherein movement of the second drive magnet in the normal direction causes the second driven magnet to move in the normal direction . A substrate holding device that holds a substrate,
multiple chucks,
Chuck base and
A first mechanism;
Second mechanism and
Equipped with
Each of the plurality of chucks has a gripping part used for gripping the substrate,
The chuck base is
Equipped with the plurality of chucks,
having a main surface exposing the gripping part,
used for rotating the substrate held by the gripping section,
The first mechanism is
a first driving unit that drives the plurality of chucks to move the plurality of chucks between a first position and a second position;
a movable first driving magnet;
a first driven magnet fixed to the first driving section and moving according to movement of the first driving magnet to operate the first driving section;
has
The height of the gripping portion relative to the main surface at the first position is higher than the height of the gripping portion relative to the main surface at the second position,
The second mechanism is
a second driving unit that drives the plurality of chucks to transition the plurality of chucks between a first posture in which the gripping portion can grip the substrate and a second posture in which the gripping portion is released; and,
a movable second drive magnet;
a second driven magnet fixed to the second driving section and moving according to movement of the second driving magnet to operate the second driving section;
has
The plurality of chucks include a first chuck and a second chuck,
When the substrate is rotated by the chuck base and both the first chuck and the second chuck are in the first position, or both the first chuck and the second chuck are in the second position. In some cases:
When the first chuck takes the second attitude, the second chuck takes the first attitude without taking the second attitude;
When the second chuck takes the second attitude, the first chuck takes the first attitude without taking the second attitude;
A substrate holding device in which both the first chuck and the second chuck can take the first posture. The gripping portion is
a concave surface that grips a peripheral edge of the substrate when the substrate is gripped;
Rotation of the plurality of chucks about an axis parallel to the normal direction of the main surface moves the opening direction of the concave surface,
The second driving unit converts the movement of the second driven magnet in the normal direction into the rotation of the plurality of chucks,
3. The substrate holding device according to claim 2, wherein the movement of the second drive magnet in the normal direction moves the second driven magnet in the normal direction. Movement of the first drive magnet in the normal direction moves the first driven magnet in the normal direction,
The magnetic force when the plurality of chucks take the second attitude is greater than the magnitude of the magnetic force acting between the second driving magnet and the second driven magnet when the plurality of chucks take the first attitude. is large,
When the plurality of chucks take the first posture, the magnitude of the magnetic force when the plurality of chucks is in the second position is greater than the magnitude of the magnetic force when the plurality of chucks are in the first position. The substrate holding device according to claim 1 or 3, which is large in size. When the plurality of chucks take the second posture, the magnitude of the magnetic force when the plurality of chucks is in the second position is greater than the magnitude of the magnetic force when the plurality of chucks are in the first position. The substrate holding device according to claim 4, having a large size. The rotation of the plurality of chucks when the plurality of chucks transition from the second attitude to the first attitude is limited by the substrate being held by the gripping part. The substrate holding device according to any one of claims 3 to 5. A substrate processing method carried out in the substrate holding device according to any one of claims 1 to 6, comprising:
The substrate has a first surface and a second surface closer to the chuck base than the first surface,
a first step of supplying a processing liquid to at least one of the first surface and the second surface gripped by the gripping section at the first position;
a second step of supplying gas to the second surface together with the first step or after the first step is completed;
In the second step, the plurality of chucks move from the first position to the second position while the substrate is rotated by the chuck base while being gripped by the gripping part.

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