KR20090129943A - 표시 소자의 제조 방법 - Google Patents
표시 소자의 제조 방법 Download PDFInfo
- Publication number
- KR20090129943A KR20090129943A KR1020090049447A KR20090049447A KR20090129943A KR 20090129943 A KR20090129943 A KR 20090129943A KR 1020090049447 A KR1020090049447 A KR 1020090049447A KR 20090049447 A KR20090049447 A KR 20090049447A KR 20090129943 A KR20090129943 A KR 20090129943A
- Authority
- KR
- South Korea
- Prior art keywords
- glass substrate
- terminal
- display element
- polishing
- mechanical polishing
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 36
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 125
- 239000011521 glass Substances 0.000 claims abstract description 109
- 238000005498 polishing Methods 0.000 claims abstract description 69
- 239000000126 substance Substances 0.000 claims description 18
- 239000000463 material Substances 0.000 claims description 13
- 239000012769 display material Substances 0.000 claims description 8
- 238000012423 maintenance Methods 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims 1
- 230000000717 retained effect Effects 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 12
- 239000004973 liquid crystal related substance Substances 0.000 description 36
- 239000000047 product Substances 0.000 description 18
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 16
- 239000010408 film Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 8
- 238000005530 etching Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 238000000227 grinding Methods 0.000 description 4
- 239000012788 optical film Substances 0.000 description 4
- 238000007500 overflow downdraw method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000002585 base Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000003280 down draw process Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004831 Hot glue Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- -1 acryl Chemical group 0.000 description 1
- 239000003522 acrylic cement Substances 0.000 description 1
- 238000007259 addition reaction Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 229910000420 cerium oxide Inorganic materials 0.000 description 1
- 238000006757 chemical reactions by type Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000002438 flame photometric detection Methods 0.000 description 1
- 239000005357 flat glass Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3046—Mechanical treatment, e.g. grinding, polishing, cutting using blasting, e.g. sand-blasting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Surface Treatment Of Glass (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2008-155114 | 2008-06-13 | ||
JP2008155114A JP5285336B2 (ja) | 2008-06-13 | 2008-06-13 | 表示素子の製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090129943A true KR20090129943A (ko) | 2009-12-17 |
Family
ID=41469870
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020090049447A KR20090129943A (ko) | 2008-06-13 | 2009-06-04 | 표시 소자의 제조 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP5285336B2 (ja) |
KR (1) | KR20090129943A (ja) |
CN (1) | CN101604079A (ja) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5963349B2 (ja) * | 2012-04-27 | 2016-08-03 | 株式会社Joled | 表示装置の製造方法 |
US10121951B2 (en) * | 2013-11-29 | 2018-11-06 | Sharp Kabushiki Kaisha | Light-emitting device substrate, light-emitting device, and method for producing light-emitting device substrate |
CN104953043A (zh) * | 2014-03-24 | 2015-09-30 | 信利半导体有限公司 | 有机电致发光显示面板及其制作方法 |
CN104849900A (zh) | 2015-06-03 | 2015-08-19 | 京东方科技集团股份有限公司 | 显示面板的制备方法及显示面板、显示装置 |
CN107611286A (zh) * | 2017-08-21 | 2018-01-19 | 信利半导体有限公司 | 一种柔性oled显示器的制备方法 |
CN108098559B (zh) * | 2017-12-27 | 2024-08-13 | 嘉兴驰诚光电科技有限公司 | 一种导光板抛光装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3290379B2 (ja) * | 1997-06-19 | 2002-06-10 | 株式会社東芝 | 表示装置及びその製造方法 |
JP3888223B2 (ja) * | 2002-05-13 | 2007-02-28 | ソニー株式会社 | 液晶表示素子の製造方法 |
JP3737782B2 (ja) * | 2002-06-18 | 2006-01-25 | 淀川ヒューテック株式会社 | 薄型液晶表示素子の製造方法 |
JP2006162968A (ja) * | 2004-12-07 | 2006-06-22 | Sanyo Electric Co Ltd | 表示パネルの製造方法及びこの表示パネルを用いた表示装置 |
JP2008083144A (ja) * | 2006-09-26 | 2008-04-10 | Sony Corp | 液晶パネルの製造方法 |
-
2008
- 2008-06-13 JP JP2008155114A patent/JP5285336B2/ja not_active Expired - Fee Related
-
2009
- 2009-06-04 KR KR1020090049447A patent/KR20090129943A/ko not_active Application Discontinuation
- 2009-06-15 CN CNA2009101394546A patent/CN101604079A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
JP5285336B2 (ja) | 2013-09-11 |
JP2009300735A (ja) | 2009-12-24 |
CN101604079A (zh) | 2009-12-16 |
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WITN | Withdrawal due to no request for examination |