KR20090059061A - Coating apparatus - Google Patents

Abstract

A coating apparatus is provided to fill a coating film with certain pattens in a thin film forming area with excellent precision and high efficiency by using an ink-jet coating method. A coating apparatus(100) forms a coating film by supplying coating solution in a thin film forming area on a substrate(G) by using an ink-jet method, then fills the coating film in the thin film forming area by softening and flowing the coating film. The coating apparatus comprises a pretreatment unit group; a coating unit(31); and a reflow unit(33) which reflows the coating film by softening it in organic solvent.

Description

Coating device {COATING APPARATUS}

TECHNICAL FIELD This invention relates to the coating apparatus which forms a coating film using inkjet coating on a board | substrate about manufacture of a color filter, an organic electroluminescent (EL) display apparatus, etc ..

For example, in the manufacture of a color filter, a color resist of three colors of red, green and blue or four colors of which black is added to a predetermined pattern is applied, but recently inkjet is a technique for applying a plurality of such materials to the same substrate. Application | coating is examined (for example, patent document 1, 2, 3). Inkjet coating is the application of the principle of the inkjet method used in inkjet printers widely used for color printing to apply to color filters, etc., and sprays color resist liquids of different colors for each nozzle. There is an advantage that the formation can be performed simultaneously.

When applying a plurality of color resists using inkjet coating, there is a possibility that a color resist applied to a certain region may leak into an adjacent region, but to solve such a problem, a bank for dividing another region is called. The method of providing a partition member and applying a color resist liquid to the area | region enclosed by a bank is employ | adopted (patent document 4).

By the way, in inkjet coating, in principle, the color resist liquid cannot be discharged at a precisely aimed position. Therefore, from the viewpoint of precisely supplying the color resist liquid to the area surrounded by the bank, after the whole surface is water-repelled by the plasma treatment with CF₄ gas, the substrate surface is hydrophilized by O2 gas plasma to selectively only the surface of the bank. The technique of making water-repellent and correct | amending the dropping position of a color resist liquid is proposed (patent document 5).

However, even if such a water repellent treatment does not sufficiently correct the dropping position of the color resist liquid, if the color resist liquid is to be filled in the entire area surrounded by the bank, it may be inconvenient to flow out to the adjacent region beyond the bank. In addition, when the bank side is water-repellent by the liquid repellent treatment, there is a fear that the color resist is popped up and the color resist is not sufficiently filled and light leakage occurs.

There is a need for a coating apparatus capable of carrying out high-accuracy coating without such a problem at high efficiency, but such an apparatus is still not realized.

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 1-217302

[Patent Document 2] Japanese Patent Application Laid-Open No. 7-72325

[Patent Document 3] Japanese Unexamined Patent Application Publication No. 7-146406

[Patent Document 4] Japanese Patent Application Laid-Open No. 10-133194

[Patent Document 5] Japanese Patent Application Laid-Open No. 2002-372921

This invention is made | formed in view of the related situation, and an object of this invention is to provide the coating apparatus which can form the coating film of a predetermined pattern with high precision and high efficiency using the inkjet system.

In order to solve the above problems, in the first aspect of the present invention, the coating film is formed by supplying a coating liquid by an inkjet method to a predetermined area of the coating film formation on a substrate to form a coating film, and then softening and flowing the coating film. An application device for filling a region to be formed,

A pretreatment unit group which performs a pretreatment before application to a substrate,

A coating unit for forming a coating film on the substrate by an inkjet method,

A reflow unit for softening and reflowing the coating film in an organic solvent environment to a substrate coated with a coating film,

A conveying mechanism for conveying the substrate to each of the units in the order of processing;

Each said unit is arranged in a processing sequence, and said conveying mechanism provides a coating apparatus, which in turn conveys a substrate for each of said arranged units.

In the first aspect, the apparatus may further include a drying unit for drying the coating film provided between the coating unit and the reflow unit. In this case, as the drying unit, drying the coating film in a reduced pressure environment can be used. As the drying unit, one having a unit for drying the coating film in a reduced pressure environment and a unit for applying heat treatment to the coating film can be used.

In addition, the pretreatment unit group may have a unit for performing a substrate cleaning process. In this case, the pretreatment unit group may have a unit for applying a cleaning treatment with a cleaning liquid to the substrate and a unit for subjecting the substrate to a substrate with a ultraviolet or plasma.

Further, in the first aspect, the pretreatment unit group may be configured to have a unit for applying an adhesion improving treatment on the substrate surface prior to the application in the coating unit.

In this case, the prewet unit which performs the process which exposes a board | substrate surface to a solvent environment prior to the application | coating in the said coating unit can be used as a unit which adds the adhesion improvement process of the said substrate surface, and the coating in the said coating unit is carried out. Prior to this, a unit for applying a hydrophobic treatment to the surface of the substrate may be used.

Moreover, in the said 1st viewpoint, it can be set as the structure further provided with the baking process unit which applies a baking process to a board | substrate after the said reflow process. In this case, a unit for drying the coating film in a reduced pressure environment may be provided between the reflow processing unit and the bake processing unit.

In the second aspect of the present invention, the coating film is supplied to the thin film forming region by supplying the coating liquid to the coating film forming region on the substrate by an inkjet method to form a coating film, and then softening and flowing the coating film. A coating device for filling, which is capable of mounting a carrier on which a plurality of substrates are stored, and a processing part for carrying out a series of processes including a coating process on a substrate by receiving an import / export unit for carrying in and out of the substrate and the substrate. And

The processing unit,

A pretreatment unit group which performs a pretreatment before application to a substrate,

A coating unit for forming a coating film on the substrate by an inkjet method,

A reflow unit for softening and reflowing the coating film in an organic solvent environment to a substrate coated with a coating film,

It has a conveyance mechanism which conveys a board | substrate to each said unit in a process order,

Each said unit is arranged in a processing sequence, and said conveying mechanism provides a coating apparatus, which in turn conveys a substrate for each of said arranged units.

In the second aspect, the processing unit is connected to the first conveying line and the first conveying line in which a plurality of units are arranged extending in a straight line from the carrying in and out portions and connected to the first conveying line and straight toward the carrying out portion. It can be set as the structure which has the 2nd conveyance line in which several unit was extended and extended. In this case, the said processing part can be set as the structure in which the said preprocessing unit group is arrange | positioned according to the said 1st conveyance line, and the said application unit and the reflow unit are arrange | positioned according to the said 2nd conveyance line.

According to the present invention, after the coating film is formed by inkjet coating, the coating film is expanded by the reflow process, so that the coating film can be accurately filled in the thin film formation scheduled region.

In addition, the pretreatment unit group which performs pretreatment before application | coating, an application | coating unit, a reflow unit, and other units are arrange | positioned in order of processing, and a board | substrate is conveyed sequentially and these processes are processed continuously, and therefore it is extremely efficient Can be processed. In addition, since the coating unit 31 which performs inkjet coating and the reflow unit are close to each other, the coating process and the reflow process can be carried out continuously without taking out the substrate, so that the coating film coated with the coating unit is extremely deformed without ripple. The substrate can be transported to the row unit, so that extremely high precision coating can be performed.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to an accompanying drawing.

1 is a schematic plan view of a coating device according to a first embodiment of the present invention. The coating apparatus 100 which concerns on this embodiment forms a coating film using inkjet coating on the glass substrate for color filters.

The coating device 100 applies color ink to the carry-in / out part 1 and the glass substrate G which carry out the carry-in / out of the glass substrate G by mounting the carrier C which accommodates several glass substrate G. It has the processing part 2 provided with the some processing unit for this.

The carry-in / out part 1 is glass between the mounting base 11 which mounts the some glass substrate G, and the carrier C which can be conveyed, between the carrier C on the mounting base 11, and the processing part 2 The carrying apparatus 12 for carrying in and carrying out the board | substrate G is provided, and the carry-in / out of the carrier C with respect to the exterior is carried out with respect to the carry-in / out part 1. Moreover, the conveying apparatus 12 has the conveying arm 12a, and can move the conveyance path top (not shown) provided along the arrangement direction of the carrier C, The carrier C and the processing part by the conveying arm 12a Carrying in and out of glass substrate G is carried out between (2).

The processing unit 2 basically has two parallel rows of conveying lines A and B for conveying the glass substrate G extending in a direction orthogonal to the direction in which the carrier C on the mounting table 11 is arranged. From the cassette station 1 side along the line (A), the scrub cleaning processing unit (SCR, 21), the baking unit (Bake, 22), the cooling unit (Col, 23), the conveying unit (Conv) 24 for adjustment, Ultraviolet irradiation unit (UV) 25 and buffer unit (Buf) 26 are arranged in this order. Further, at the rear end of the buffer unit Buf 26, a conveyance section Conv 30 for connection connecting the conveyance line A and the conveyance line B is provided.

Further, the inkjet coating unit (InkJet, 31), the vacuum drying unit (DP, 32), and the reflow unit (from the conveying unit (Conｖ) 30 for connection) to the carry-in / out unit (1) along the conveying line (B). Reflow, 33), bake unit (Bake, 34), cooling unit (Col, 35), and buffer unit (Buf, 36) are provided in this order.

With respect to the processing unit 2, these units are arranged in the processing order, and the processing unit 2 conveys the glass substrate G carried in from the carrying in / out unit 1 along the transfer line A so as to pass through each unit in turn. And a conveying mechanism for conveying along the conveying line (B) via a conveying unit (Conv) 30 for connection. As a conveyance mechanism, the nose conveyance mechanism is used typically. The corro conveying mechanism arranges a plurality of corro (not shown) along the conveying direction, drives a part of the corro (not shown) by the conveying drive part 41 as a corro for driving, and moves the glass substrate G thereon to convey it. In addition, these units may be made to carry out a predetermined treatment while conveying them to the nose from the inside or may be made to perform a predetermined treatment while the glass substrate G is stopped inside. In the latter case, however, an auxiliary arm is required for loading and unloading the unit.

The scrub cleaning treatment unit (SCR, 21) performs a scrub cleaning treatment and a drying treatment while conveying the glass substrate G substantially horizontally. The bake unit 22 and the cooling unit 23 are integrally installed. In the bake unit 22, the glass substrate G is heated by a hot plate or the like to perform dehydration after the cleaning treatment, and the cooling unit is cooled. In (Col, 23), the glass substrate G after heating is cooled by the cooling plate hold | maintained at predetermined temperature by water cooling system etc. The conveying section (Conｖ) 24 for the next adjustment adjusts the length of the unit arranged along the conveying line (A) and the length of the unit arranged along the conveying line (B) and prevents buffering of the glass substrate (G). It is for carrying out and only conveys glass substrate G by nose here.

In the UV irradiation unit (UV, 25), an ultraviolet lamp is installed in the case and the glass substrate G is irradiated with ultraviolet rays while conveying the glass substrate G after scrub cleaning to the nose, thereby cleaning the surface of the glass substrate G ( UV, 25) irradiates the glass substrate G with ultraviolet rays and cleans the surface. In addition, the same function can be obtained by providing a unit for irradiating atmospheric pressure plasma to the glass substrate G instead of the UV irradiation unit (UV) 25.

The unit thus far is a pretreatment unit before application of the color resist, and this unit functions as a pretreatment unit group.

The buffer unit (Buf) 26 holds and buffers the glass substrate (G) once when conveying the glass substrate (G) to the inkjet coating unit (InkJet, 31), for example, one or two or more glass substrates (G). Has a waiting area. It can also be used as buffering during transport troubles. The conveyance part Con '30 for a connection connects a conveyance line A and a conveyance line B, and conveys glass substrate G by nose.

The inkjet coating unit (InkJet) 31 is a unit for discharging a color resist liquid of a predetermined color as a coating liquid from a nozzle by ink jet coating to a predetermined region of the glass substrate G to form a color resist thin film serving as a color filter layer. As described above, inkjet coating applies the principle of an inkjet printer widely used for color printing to coating such as color filters. The inkjet coating unit (InkJet) 31 has different nozzles for each of the three color resists of red, green, and blue or the four color resists plus black, and is applied to the glass substrate G conveyed by the nose or the like in the case. On the other hand, color resist liquid is dripped at the predetermined position from each nozzle, and color resist liquid of a different color is apply | coated to the adjacent area | region. Thereby, formation of the color filter layer of three colors or four colors can be performed at once. In addition, this inkjet coating unit (InkJet) 31 can be made to apply the color resist without conveying the glass substrate G on a mounting table.

The pressure reduction drying units DP and 32 are for drying the coating film (color resist thin film) formed on the glass substrate G by the inkjet coating unit InkJet, 31 in a reduced pressure environment. The solvent in the color resist thin film is volatilized to uniformize the solvent concentration in the film and at the same time solidify it to some extent so that the glass substrate (G) reaches the next reflow unit (Reflow, 33) of the coating film (color resist thin film). In order to prevent deformation. This vacuum drying unit DP and 32 is performed by evacuating the inside of a case in the state which mounted the glass substrate G after color resist application | coating to the mounting object in a case.

The reflow unit 33 is made by exposing a coating film (color resist thin film) on the glass substrate G to an environment of an organic solvent such as thinner and softening it to flow (reflow). It is performed by forming an environment of an organic solvent in a case by a method such as introducing a solvent vapor such as thinner by a ring, and conveying the glass substrate G in the solvent environment.

In the reflow unit 33, the color resist thin film coated by the inkjet coating unit InkJet 31 is fluidized to appropriately fill the color resist thin film in the bank, which is a film formation region.

The baking unit 34 and the cooling unit 35 are integrally installed, and the baking unit 34 bakes and cures the color resist thin film after the reflow treatment by a hot plate or the like, and the cooling unit (Col, 35). In 35), the glass substrate G after baking is cooled by a cooling plate maintained at a predetermined temperature by a water cooling method or the like.

When the buffer unit (Buf, 36) carries out the glass substrate (G) to the carry-in / out unit 1, it hold | maintains and buffers the glass substrate (G) once, for example, 1 or 2 or more glass substrates (G). Has a waiting area.

Since the pressure reduction drying units DP and 32 process the glass substrate G on the mounting table in the case, the glass substrate G from the inkjet coating unit InkJet 31 to the pressure reduction drying unit DP 32 is processed. ) And conveyance of the glass substrate G from the reduced-pressure drying unit DP, 32 to the reflow unit 33, it is necessary to use an auxiliary conveyance mechanism other than a co-feed mechanism.

As such an auxiliary conveyance mechanism, what is shown by FIG. 2 and FIG. 3 is mentioned. In the example of FIG. 2, from the rear end of the inkjet coating unit InkJet 31 along the conveying line B to the front end of the reflow unit 33 via the pressure reduction drying unit DP 32. The shuttle arm mechanism 45 which has the base 43 which can reciprocate the outer part of the part, and the board | substrate support arm 44 provided so that it can advance and retreat on the base 43 is provided, In the example of FIG. 3, the inkjet coating unit ( A pair of guide rails provided along the conveying line (B) on both sides of the portion from the rear end of the InkJet, 31 to the front end of the reflow unit 33 through the pressure reduction drying unit DP, 32, and the like. The slide arm mechanism 49 which has a pair of board | substrate support arm 48 provided so that the reciprocating movement and the movement to the front-back direction along the 47 and the guide rail 47 is provided is provided.

In the shuttle arm mechanism 45 of FIG. 2, when conveying from the inkjet coating unit InkJet 31 to the pressure reduction drying unit DP, 32, the pressure-reducing unit DP, 32 passes from the pressure reduction drying unit DP, 32 to the reflow unit 33. At the time of conveyance, the base 43 is arrange | positioned at a predetermined position, the support arm 44 is advanced, the glass substrate G is received on the support arm 44, and conveyed.

In the slide arm mechanism 49 of FIG. 3, when conveying from the inkjet coating unit InkJet 31 to the vacuum drying unit DP, 32, the vacuum is transferred from the vacuum drying unit DP, 32 to the reflow unit 33. When it does, a pair of slide arm 48 is located in a predetermined position, these are advanced to the glass substrate G side, and it conveys in the state which supported both sides of the glass substrate G.

In addition, when the inkjet coating unit (InkJet) 31 is a type in which the glass substrate G is placed on the mounting table and applied, the support arm 44 of FIG. 2 and the slide arm 48 of FIG. 3 are conveyed. , 30), the operation of conveying the glass substrate G to the inkjet coating unit (InkJet, 31) is unnecessary.

Each component part of the coating device 100 is connected to and controlled by the controller 50 provided with a microprocessor (computer). The controller 50 has a user interface 51 including a keyboard for inputting commands or the like for the operator to manage the applicator 100, a display for visualizing and displaying the operation status of the applicator 100, and the like. You are connected.

In addition, the controller 50 is connected with a storage unit 52 in which a program or data for control is stored. As a program stored in the storage unit 52, a program for realizing various processes executed by the coating device 100 under the control of the controller 50, or the respective components of the coating device 100 according to the processing conditions. Program to run the program, including recipes. The recipe is stored in the storage medium in the storage unit 52. The storage medium may be fixed, such as a hard disk, or may be portable, such as a CDROM, a DVD, or a flash memory. In addition, the recipe may be appropriately transmitted from another device via, for example, a dedicated line.

Then, if necessary, an arbitrary recipe is called from the storage unit 52 and executed in the controller 50 by an instruction from the user interface 51, so that the application apparatus 100 under the control of the process controller 50 can be used. Do what you want.

Next, the operation | movement operation of the coating apparatus comprised as mentioned above is demonstrated with reference to FIG.

First, as shown in Fig. 4 (a), a glass substrate G is formed on a glass base body 101 by a photolithography and defines a plurality of thin film formation scheduled regions 103. A plurality of sheets are stored in the carrier (C), and the carrier (C) is placed on the mounting table 11 of the carry-in / out part 1. The thin film formation predetermined region 103 of the glass substrate G is formed in the position which should form each of the three colors of red, green, blue, or the four color resist thin films (coating film) which added these to black.

Next, the glass substrate G in the carrier C is taken out from the carrier C by the conveyance arm 12a of the conveying apparatus 12, and the scrub cleaning unit (SCR, 21) of the process part 2 is carried out. Bring in And scrub washing and drying process are performed, moving glass substrate G along the conveyance line A by conveyance by nose. Thereafter, the glass substrate G is conveyed to the bake unit (Bake) 22, dehydrated after the washing treatment, and further conveyed to the cooling unit (Col, 23) and cooled to a predetermined temperature.

After that, it is conveyed to the ultraviolet irradiation unit (UV, 25) through the conveyance part (Convex 24) for adjustment, and conveyed to the glass substrate (G), conveying the glass substrate (G) with respect to this ultraviolet irradiation unit (UV, 25). Ultraviolet rays are irradiated and the surface of the glass substrate G is cleaned.

The processing up to this point is a pretreatment before application of the color resist, and as described above, the above unit functions as a pretreatment unit group.

After that, the glass substrate G after the pretreatment is conveyed to the inkjet coating unit InkJet 31 by the auxiliary conveyance mechanism via the buffer unit Buf 26 and the conveying unit Conv 30 for connection.

In the inkjet coating unit (InkJet) 31, as shown in FIG. 4 (b), a color resist liquid 106 of a predetermined color is discharged from the nozzle 105 as a coating liquid to the thin film formation region 103 by inkjet coating. A color resist thin film (coating film) 107 serving as a color filter layer is formed. Such thin film formation is performed using different nozzles for each of three color resists of red, green and blue or four color resists in which black is added thereto, and color resist liquids of different colors are dropped into adjacent thin film formation regions 103. This forms the color filter layer of three colors or four colors at once. In this case, the color resist liquid 106 is not spread | diffused on the whole surface of the thin film formation planned area 103, but the space | interval is formed.

Then, the glass substrate G in which the color resist thin film 107 was formed is conveyed to the pressure reduction drying unit DP and 32 by an auxiliary conveyance mechanism, and the drying process in a reduced pressure environment is performed (FIG. 4 (c)). Immediately after application with the inkjet coating unit (InkJet, 31), the color resist thin film 107 contains a large amount of solvent, has low shape retention, and does not necessarily have high uniformity of solvent concentration. By uniformizing and solidifying to some extent, shape retention is improved to prevent deformation of the color resist thin film up to the reflow unit (33).

After such a reduced pressure drying process, the glass substrate G is conveyed to the reflow unit 33 by the auxiliary conveyance mechanism, and as shown in FIG.4 (d), the color resist thin film 107 is made of organic solvents, such as thinner. It is exposed to the environment to soften and flow (reflow). As a result, the color resist thin film 107 spreads over the entire surface of the thin film formation scheduled region 103 and becomes flat to cover the gap formed in the thin film formation scheduled region 103.

The reflow process is developed as a technique which changed the shape of the resist pattern in order to omit the process of forming a pattern for photolithography, for example, as disclosed in Japanese Patent Laid-Open No. 2002-334830.

In this way, when the reflow treatment is performed after the inkjet coating, the amount of the color resist liquid can be widened at least over the entire surface of the thin film formation scheduled region 103, so that the supply amount of the color resist during inkjet coating is reduced. There is a number. In this case, although the film thickness of the color resist thin film 107 becomes thin, it can respond by setting the resist density at the time of initial stage, or increasing the color density.

After the reflow treatment, the glass substrate G is transferred to the bake unit (Bake) 34, and the baking treatment is performed to cure the color resist thin film 107. Then, glass substrate G is conveyed to cooling unit Col and 35, and glass substrate G is cooled to predetermined temperature there.

Thereafter, the glass substrate G is conveyed to the buffer unit Buf 36, and the conveyance arm 12a of the conveying apparatus 12 of the carry-in / out part 1 receives the glass substrate G, and mounts 11 ) Is stored in the carrier (C).

The above process is continuously performed about the some glass substrate G of one carrier C, and when one lot is complete | finished, the process of the carrier C of the next lot is performed continuously.

Thus, the big advantage can be acquired as follows with the coating apparatus 100 of this embodiment which combined inkjet coating and the reflow process.

Since inkjet coating is inherently incapable of sufficiently coping with fine patterns, as shown in Fig. 5 (a), the dropping position of the color resist liquid 106 may be biased in the thin film formation region 103, in which case The position of the color resist thin film 107 formed as shown to FIG. 5 (b) also shifts | deviates, and the part (color light part 109) which becomes light is produced. In addition, as shown in FIG. 6 (a), the dropping position is shifted further, but it may be raised to some banks 102. In this case, as shown in FIG. 6 (b), the position of the color resist thin film 107 is further increased. Light leakage occurs due to the shifted part (color fading part) 110. On the other hand, after the inkjet coating, the color resist thin film 107 is flowed by applying a reflow process to show the deflection of the color resist thin film 107 as shown in Figs. 5 (b) and 6 (b). It can be corrected as in 7 (a) and (b) to prevent the occurrence of light or discolored parts.

In addition, with respect to the conventional inkjet coating, even if the dropping position of the color resist is slightly shifted, the discharge amount of the color resist liquid must be increased so that the color resist spreads widely on the entire surface of the thin film formation scheduled region 103. Although there was a risk of spilling over the bank 102 and color mixing, when the reflow treatment was applied after the inkjet coating, the color resist liquid was applied to the entire surface of the thin film formation scheduled region 103 at the time of ejection of the color resist by inkjet. There is no need to spread, and therefore, the discharge amount of the color resist liquid can be reduced, making it difficult to cause the outflow.

In addition, since the inkjet coating is to drop the liquid and to fill the liquid in the area surrounded by the bank 102, the ejection shape tends to be rounded by the surface tension of the liquid, and the thin film formation scheduled region 103 surrounded by the bank 102 is formed. In the case where the shape is, for example, a rectangular shape, the color resist liquid 106 does not spread widely in each part, and the part is likely to be discolored. Even in such a case, by applying the reflow treatment after the inkjet coating, the color resist can be caused to flow to the respective portions, making it difficult to generate a discolored portion.

In the case where a highly viscous resist is used, the amount of resist discharged during inkjet coating is good in a small amount, so that the amount of resist used can be reduced and color mixing hardly occurs beyond the bank 102. However, the high viscosity resist has a low fluidity and a small amount. Due to the high density, the color resist liquid is hardly spread widely on the outer circumference of the thin film formation region 103, and discoloration of the outer circumference easily occurs, but by applying a reflow treatment, a high-viscosity resist is flowed to make the color resist thin film 107 flow. It can spread to the outer periphery of the thin film formation planned area 103, and can spread it to the whole.

In addition, in the coating apparatus 100 of this embodiment, the preprocessing unit group which performs preprocessing before application | coating, the inkjet coating unit (InkJet, 31), the reflow unit (33), and other units in order are processed in order. It arrange | positions, and conveys glass substrate G about these units one by one, and performs a process continuously, and can process extremely efficiently. In addition, the inkjet coating unit (InkJet, 31) and the reflow unit (33) are close to each other, and the coating process by the inkjet coating unit (InkJet, 31) and the reflow processing by the reflow unit (Reflow, 33) are advantageous. Since it can be carried out continuously without taking out the board | substrate G, the glass substrate G can be conveyed to the reflow unit 33 without extreme deformation of the coating film apply | coated with the inkjet coating unit (InkJet, 31). There is an extremely high precision coating.

Moreover, since the coating film after inkjet coating is dried to the pressure reduction drying unit DP and 32, the shape retention property of a coating film can be improved further and subsequent reflow process can be performed. Moreover, since the solvent concentration in a coating film can be made uniform by this vacuum drying, subsequent reflow treatment can be performed uniformly. For this reason, the reflow process can be performed with higher accuracy.

Next, a second embodiment of the present invention will be described.

8 is a schematic plan view of a coating device according to a second embodiment of the present invention. The coating apparatus 100a which concerns on this embodiment is for adjustment to the front end of the buffer unit Buf 36 by that except the pressure reduction drying unit DP and 32 from the apparatus of 1st Embodiment shown in FIG. Since the conveyance part Conk 61 was arrange | positioned and the other structure is the same as the coating apparatus 100 of FIG. 1, the same code | symbol is attached | subjected to the same thing, and description is abbreviate | omitted. In addition, in FIG. 8, the controller 50, the user interface 51, and the memory | storage part 52 are abbreviate | omitted.

In the case where the shape stability of the coating film coated with the inkjet coating unit (InkJet, 31) is good, and the reflow unit (Reflow, 33) flows on condition that the flow rate is saturated, the drying treatment after the inkjet coating is unnecessary. The coating device of this embodiment is applied in such a case.

Next, a third embodiment of the present invention will be described.

9 is a schematic plan view of a coating device according to a third embodiment of the present invention. The coating apparatus 100b which concerns on this embodiment arrange | positions the pre-wet unit PreWet 62 instead of the conveyance part Conk 30 for the connection of the apparatus of 1st Embodiment shown in FIG. Since the other structure is the same as the coating apparatus 100 of FIG. 1, the same code | symbol is attached | subjected to the same thing, and description is abbreviate | omitted. 9, the controller 50, the user interface 51, and the memory | storage part 52 are abbreviate | omitted like FIG.

The prewet unit 62 is configured to form an environment of an organic solvent such as thinner in the case similar to the reflow unit 33 and to convey the glass substrate G in the solvent environment. Thereby, since the surface of the glass substrate G before inkjet coating becomes wet with a solvent, the adhesiveness of the coating film at the time of inkjet coating can be made favorable.

Next, a fourth embodiment of the present invention will be described.

It is a schematic top view which shows the coating device which concerns on 3rd Embodiment of this invention. The coating apparatus 100c which concerns on this embodiment differs in the structure of a preprocessing unit group from the apparatus of 1st Embodiment shown in FIG. That is, the ultraviolet irradiation unit (UV, 25) is installed immediately after the scrub cleaning unit (SCR, 21), and thereafter, the baking unit (Bake, 63), the adhering processing unit (AD, 64), and the cooling unit (Col, 65). ) In order, and then the buffer unit (Buf) 26 is placed. Since the other structure is the same as the coating apparatus 100 of FIG. 1, the same code | symbol is attached | subjected to the same thing, and description is abbreviate | omitted. 10 and 8, the controller 50, the user interface 51, and the storage unit 52 are not shown.

ADH treatment unit (AD, 64) introduces a hydrophobic agent of HMDS (hexamethylsilazane) into the case and hydrophobizes the surface of the glass substrate G being returned to the nose. The adhesiveness of the coating film at the time can be made favorable.

Next, a fifth embodiment of the present invention will be described.

It is a schematic top view which shows the coating device which concerns on 5th Embodiment of this invention. The coating apparatus 100d which concerns on this embodiment is another pressure reduction drying unit DP between the reflow unit 33 and the baking unit 34 of the apparatus of 1st Embodiment shown in FIG. And 66), and the other configuration is the same as that of the coating apparatus 100 of FIG. 1, the same code | symbol is attached | subjected to the same thing, and description is abbreviate | omitted. 11, the controller 50, the user interface 51, and the memory | storage part 52 are abbreviate | omitted like FIG.

Depending on the conditions in the reflow unit 33, a large amount of solvent may be contained in the coating film after reflow. In this case, in the case where the baking process is performed directly with the bake unit 34, Rapid drying of the solvent occurs, which adversely affects the coating film. Therefore, in this embodiment, in order to avoid such incompatibility, the other pressure reduction drying unit DP, 66 is provided in the rear end of the reflow unit 33, and it bakes with respect to the glass substrate G after the reflow process here. It is made to dry easily before processing.

Next, a sixth embodiment of the present invention will be described.

It is a schematic top view which shows the coating device which concerns on 6th Embodiment of this invention. The coating apparatus 100e which concerns on this embodiment is the pressure reduction drying unit DP of the apparatus of 1st Embodiment shown in FIG. 1, and is a baking unit Bake 67 between the reflow unit 33. ) And the cooling unit (Col, 68) and the buffer unit (Buf, 36) at the rear end of the reflow unit (Reflow, 33) and the other configuration is the same as the coating device 100 of FIG. The same reference numerals are used to omit the description.

12 and 8, the controller 50, the user interface 51, and the storage unit 52 are not shown.

Although the shape stability of the coating film after the inkjet coating and the uniformity of the solvent amount may not be sufficiently secured only by the vacuum drying unit (DP), in such a case, as in the present embodiment, at the rear end of the vacuum drying unit (DP, 32) It is preferable to provide a bake unit 67 to further advance the volatilization of the solvent after the inkjet coating. In addition, another pressure reducing drying unit may be provided after the reflow unit 33.

In addition, this invention can be variously modified without being limited to the said embodiment. For example, in the said embodiment, it is used as a filter layer of the color filter used for a liquid crystal display device etc.

Although the coating apparatus of this invention was applied to formation of a color resist thin film pattern, it is applicable also to formation of the color resist thin film pattern for EL elements using an organic semiconductor film. Further, the present invention can be applied to thin film formation in display devices such as LED (light emitting diode) elements, thin film formation of various organic films or inorganic films, for example, thin film formation of indium oxide (ITO) films and insulating films. have.

Further, after the entire surface including the bank is water-repellent treated by the plasma treatment with CF 문헌 gas disclosed in Patent Document 5, the substrate surface is subjected to hydrophilic treatment, and only the surface of the bank is selectively made water-repellent. The technique for correcting the dripping position of can also be applied to the present invention.

1 is a schematic plan view of a coating device according to a first embodiment of the present invention.

It is a schematic diagram which shows an example of the auxiliary conveyance apparatus used for the coating device of FIG.

It is a schematic diagram which shows another example of the auxiliary conveyance apparatus used for the coating device of FIG.

4 is a cross-sectional view illustrating the method of forming the coating film by the coating apparatus of FIG. 1.

Fig. 5 is a diagram showing the dropping position of the color resist liquid and the deflection of the formed thin film (coating film) in inkjet coating.

Fig. 6 is a diagram showing the deflection of the dropping position of the color resist liquid and the deflection of the formed thin film (coating film) in inkjet coating.

It is a figure which shows the state which correct | amended the deflection of the thin film in inkjet coating by the reflow process.

8 is a schematic plan view of a coating device according to a second embodiment of the present invention.

9 is a schematic plan view of a coating device according to a third embodiment of the present invention.

It is a schematic top view which shows the coating device which concerns on 4th Embodiment of this invention.

It is a schematic top view which shows the coating device which concerns on 5th Embodiment of this invention.

12 is a schematic plan view of a coating device according to a sixth embodiment of the present invention.

** Explanation of reference numerals indicating major parts **

1; import / export department

2; processing part

21; scrub cleaning unit

22, 34, 63, 67's Bake Unit

23, 35, 65, 68's cooling unit

25; UV irradiation unit

31; Inkjet Coating Unit

32, 66; Pressure Reducing Drying Unit

33; Reflow Unit

41; Drive device

62; Free Sweat Unit

64; Advance Unit

100, 100a, 100b, 100c, 100d, 100e; Coating Device

101; gas

102; Bank

103; thin film formation area

105; Nozzle

106; Color resist liquid (coating liquid)

107; color resist thin film (coating film)

A, B; Return Line

C; Carrier

G; Glass Substrate

Claims (14)

A coating apparatus for supplying a coating film to an area to be formed by coating by applying an inkjet method to form a coating film, and then softening and flowing the coating film, thereby filling the coating film in the thin film forming area. A pretreatment unit group which performs a pretreatment before application to a substrate, A coating unit for forming a coating film on the substrate by an inkjet method, A reflow unit for softening and reflowing the coating film in an organic solvent environment to a substrate coated with a coating film, A conveying mechanism for conveying the substrate to each of the units in the order of processing; Wherein each unit is arranged in a processing sequence, and the conveying mechanism conveys the substrate in sequence to each of the arranged units. The method according to claim 1, And a drying unit for drying the coating film provided between the coating unit and the reflow unit. The method according to claim 2, And the drying unit dries the coating film in a reduced pressure environment. The method according to claim 2, And the drying unit includes a unit for drying the coating film in a reduced pressure environment and a unit for applying heat treatment to the coating film. The method according to any one of claims 1 to 4, The said pretreatment unit group has a unit which performs the washing process of a board | substrate. The method according to claim 5, The pretreatment unit group has a unit for applying a cleaning treatment with a cleaning liquid to the substrate and a unit for applying a substrate cleaning treatment with ultraviolet rays or plasma. The method according to claim 5, The said pretreatment unit group has a unit which applies the adhesion improvement process of a board | substrate surface prior to the application | coating by the said coating unit, The coating apparatus characterized by the above-mentioned. The method according to claim 7, And the unit for applying the adhesion improving treatment of the substrate surface is a prewet unit which performs a treatment of exposing the substrate surface to a solvent environment prior to the application of the coating unit. The method according to claim 7, And the unit for applying the adhesion improving treatment of the substrate surface is a unit for applying a hydrophobic treatment to the substrate surface prior to the coating in the coating unit. The method according to claim 1 to 4, And a baking treatment unit which applies a baking treatment to the substrate after the reflow treatment. The method according to claim 10, And a unit for drying the coating film provided between the reflow processing unit and the bake processing unit in a reduced pressure environment. A coating apparatus for supplying a coating film to an area to be formed by a film by an inkjet method to form a coating film, and then softening and flowing the coating film to fill the film formation area with the thin film formation area. A carry-in / out portion for carrying out a carry-in / out of the substrate, which is capable of mounting a carrier in which a plurality of substrates are stored; A processing unit which receives a substrate carried in from the carrying-out unit and performs a series of processes including a coating process on the substrate; The processing unit, A pretreatment unit group which performs a pretreatment before application to a substrate, A coating unit for forming a coating film on the substrate by an inkjet method, A reflow unit for softening and reflowing the coating film in an organic solvent environment to a substrate coated with a coating film, It has a conveyance mechanism which conveys a board | substrate to each said unit in a process order, Wherein each unit is arranged in a processing sequence and the conveying mechanism conveys a substrate in sequence to each of the arranged units. The method according to claim 12, The processing unit extends from the carry-in and out portions in a straight line and is connected to the first conveying line and the first conveying line in which a plurality of units are arranged, and extends in a straight line toward the carry-in and out portions. And a second conveying line arranged. The method according to claim 13, The said processing part is the said preprocessing unit group arrange | positioned along the said 1st conveyance line, The said coating unit and the said reflow unit are arrange | positioned along the said 2nd conveyance line, The coating apparatus characterized by the above-mentioned.

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