KR20090040781A - 습식세정장치 및 기판처리방법 - Google Patents
습식세정장치 및 기판처리방법 Download PDFInfo
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- KR20090040781A KR20090040781A KR1020070106286A KR20070106286A KR20090040781A KR 20090040781 A KR20090040781 A KR 20090040781A KR 1020070106286 A KR1020070106286 A KR 1020070106286A KR 20070106286 A KR20070106286 A KR 20070106286A KR 20090040781 A KR20090040781 A KR 20090040781A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (5)
- 풉(FOUP)이 로딩 및 언로딩되는 반출입부;상기 반출입부에 로딩된 풉으로부터 처리될 기판을 반출하는 제1반출입유닛;반출된 상기 기판을 처리하는 처리부;상기 반출입부와 상기 처리부의 출구단을 연결하며 상기 반출입부와 상기 처리부의 출구단 사이에서 상기 풉을 이송하는 이송부; 및상기 처리된 기판을 상기 처리부의 출구단으로 이송된 상기 풉 내부에 반입하는 제2반출입유닛;을 포함하는 습식세정장치.
- 제1항에 있어서,상기 이송부는 상기 반출입부로부터 상기 처리부의 출구단으로 상기 풉을 이송하는 제1이송라인, 및 상기 처리부의 출구단으로부터 상기 반출입부로 상기 풉을 이송하는 제2이송라인을 포함하는 것을 특징으로 하는 습식세정장치.
- 풉이 로딩 및 언로딩되는 반출입부를 갖는 습식세정장치의 기판처리방법에 있어서,상기 반출입부에 로딩된 풉으로부터 처리될 기판을 반출하는 단계;반출된 상기 기판을 처리부에서 처리하는 단계;상기 반출입부로부터 상기 풉을 상기 처리부의 출구단으로 이송하는 단계;상기 처리부의 출구단으로 이송된 상기 풉에 처리된 기판을 반입하는 단계; 및내부에 기판이 반입된 상기 풉을 상기 처리부의 출구단으로부터 상기 반출입부로 이송시키는 단계;를 포함하는 기판처리방법.
- 제3항에 있어서,상기 처리될 기판을 반출하는 단계 및 상기 처리된 기판을 반입하는 단계에서 상기 처리될 기판과 상기 처리된 기판은 각각 서로 다른 반출입유닛에 의해 반출입되는 것을 특징으로 하는 기판처리방법.
- 제3항에 있어서,상기 풉을 상기 반출입부로부터 상기 처리부의 출구단으로 이송하는 단계, 및 상기 풉을 상기 처리부의 출구단으로부터 상기 반출입부로 이송시키는 단계에서 상기 풉은 각각 서로 다른 이송라인을 따라 이송되는 것을 특징으로 하는 기판처리방법.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
Publications (2)
Publication Number | Publication Date |
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KR20090040781A true KR20090040781A (ko) | 2009-04-27 |
KR100920323B1 KR100920323B1 (ko) | 2009-10-07 |
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KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
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KR (1) | KR100920323B1 (ko) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180025314A (ko) * | 2014-09-08 | 2018-03-08 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 웨이퍼 박리 및 세척 장치 및 방법 |
US10381254B2 (en) | 2011-11-29 | 2019-08-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer debonding and cleaning apparatus and method |
KR20200083286A (ko) * | 2018-12-28 | 2020-07-08 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
US11264262B2 (en) | 2011-11-29 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer debonding and cleaning apparatus |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20050019223A (ko) * | 2003-08-18 | 2005-03-03 | 한국디엔에스 주식회사 | 카세트 이송 장치를 구비하는 세정 장치 및 그 동작 방법 |
KR100546503B1 (ko) * | 2003-11-27 | 2006-01-26 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그 방법 |
KR100625310B1 (ko) | 2004-05-04 | 2006-09-20 | 세메스 주식회사 | 기판 세정 시스템 |
-
2007
- 2007-10-22 KR KR1020070106286A patent/KR100920323B1/ko active IP Right Grant
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10381254B2 (en) | 2011-11-29 | 2019-08-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer debonding and cleaning apparatus and method |
US11264262B2 (en) | 2011-11-29 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer debonding and cleaning apparatus |
KR20180025314A (ko) * | 2014-09-08 | 2018-03-08 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 웨이퍼 박리 및 세척 장치 및 방법 |
KR20200083286A (ko) * | 2018-12-28 | 2020-07-08 | 가부시키가이샤 스크린 홀딩스 | 기판 처리 장치 및 기판 반송 방법 |
Also Published As
Publication number | Publication date |
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KR100920323B1 (ko) | 2009-10-07 |
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