KR100920323B1 - 습식세정장치 및 기판처리방법 - Google Patents
습식세정장치 및 기판처리방법 Download PDFInfo
- Publication number
- KR100920323B1 KR100920323B1 KR1020070106286A KR20070106286A KR100920323B1 KR 100920323 B1 KR100920323 B1 KR 100920323B1 KR 1020070106286 A KR1020070106286 A KR 1020070106286A KR 20070106286 A KR20070106286 A KR 20070106286A KR 100920323 B1 KR100920323 B1 KR 100920323B1
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- 239000000758 substrate Substances 0.000 title claims abstract description 123
- 238000004140 cleaning Methods 0.000 claims abstract description 41
- 238000003672 processing method Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 description 7
- KFZMGEQAYNKOFK-UHFFFAOYSA-N iso-propanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000356 contaminant Substances 0.000 description 4
- 238000011109 contamination Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229940119837 Isopropyl Alcohol Drugs 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 229960004592 isopropanol Drugs 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 230000000875 corresponding Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/137—Associated with semiconductor wafer handling including means for charging or discharging wafer cassette
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S414/00—Material or article handling
- Y10S414/135—Associated with semiconductor wafer handling
- Y10S414/14—Wafer cassette transporting
Abstract
Description
Claims (5)
- 기판을 수용한 풉(FOUP)이 로딩 및 언로딩되는 반출입부;상기 반출입부에 인접하게 제공되며 상기 반출입부에 로딩된 풉으로부터 처리될 기판을 반출하는 제1반출입유닛;상기 제1반출입유닛에 의해 반출된 상기 기판을 처리하는 처리부;상기 반출입부와 상기 처리부의 출구단을 연결하며 상기 반출입부와 상기 처리부의 출구단 사이에서 상기 풉을 이송하는 이송부; 및상기 처리부에 인접하게 제공되며, 상기 이송부에 의해 상기 처리부의 출구단으로 이송된 풉의 내부에 상기 처리부에 의해 처리된 기판을 반입하는 제2반출입유닛;을 포함하는 습식세정장치.
- 제1항에 있어서,상기 이송부는, 상기 반출입부로부터 상기 처리부의 출구단으로 상기 풉을 이송하는 제1이송라인, 및 상기 처리부의 출구단으로부터 상기 반출입부로 상기 풉을 이송하는 제2이송라인을 포함하며,상기 제1이송라인에 의해 이송되는 풉은 상기 처리부에 의해 처리될 기판이 비워진 빈 풉이고, 상기 제2이송라인에 의해 이송되는 풉은 상기 처리부에 의해 처리된 기판이 채워진 풉인 것을 특징으로 하는 습식세정장치.
- 풉이 로딩 및 언로딩되는 반출입부를 갖는 습식세정장치의 기판처리방법에 있어서,상기 반출입부에 로딩된 풉으로부터 처리될 기판을 반출하는 단계;반출된 상기 기판을 처리부에서 처리하는 단계;상기 반출입부로부터 상기 기판이 반출된 풉을 상기 처리부의 출구단으로 이송하는 단계;상기 처리부의 출구단으로 이송된 상기 풉에 상기 처리부에서 처리된 기판을 반입하는 단계;상기 기판이 반입된 풉을 상기 처리부의 출구단으로부터 상기 반출입부로 이송시키는 단계; 및상기 반출입부로 이송된 풉을 언로딩시키는 단계;를 포함하는 기판처리방법.
- 제3항에 있어서,상기 풉으로부터 기판을 반출하는 단계 및 상기 풉에 기판을 반입하는 단계에서는 각각 서로 다른 반출입유닛에 의해 기판의 반출입이 이루어지는 기판처리방법.
- 제3항 또는 제4항에 있어서,상기 기판이 반출된 풉을 상기 반출입부로부터 상기 처리부의 출구단으로 이송하는 단계, 및 상기 기판이 반입된 풉을 상기 처리부의 출구단으로부터 상기 반출입부로 이송시키는 단계에서는 각각 서로 다른 이송라인을 따라 상기 풉의 이송이 이루어지는 기판처리방법.
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---|---|---|---|
KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
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KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
Publications (2)
Publication Number | Publication Date |
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KR20090040781A KR20090040781A (ko) | 2009-04-27 |
KR100920323B1 true KR100920323B1 (ko) | 2009-10-07 |
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KR1020070106286A KR100920323B1 (ko) | 2007-10-22 | 2007-10-22 | 습식세정장치 및 기판처리방법 |
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Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US10381254B2 (en) | 2011-11-29 | 2019-08-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Wafer debonding and cleaning apparatus and method |
US11264262B2 (en) | 2011-11-29 | 2022-03-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Wafer debonding and cleaning apparatus |
KR20160030039A (ko) * | 2014-09-08 | 2016-03-16 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 웨이퍼 박리 및 세척 장치 및 방법 |
JP7175191B2 (ja) * | 2018-12-28 | 2022-11-18 | 株式会社Screenホールディングス | 基板処理装置および基板搬送方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050019223A (ko) * | 2003-08-18 | 2005-03-03 | 한국디엔에스 주식회사 | 카세트 이송 장치를 구비하는 세정 장치 및 그 동작 방법 |
KR20050051280A (ko) * | 2003-11-27 | 2005-06-01 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그 방법 |
KR20050106207A (ko) | 2004-05-04 | 2005-11-09 | 세메스 주식회사 | 기판 세정 시스템 |
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- 2007-10-22 KR KR1020070106286A patent/KR100920323B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20050019223A (ko) * | 2003-08-18 | 2005-03-03 | 한국디엔에스 주식회사 | 카세트 이송 장치를 구비하는 세정 장치 및 그 동작 방법 |
KR20050051280A (ko) * | 2003-11-27 | 2005-06-01 | 다이닛뽕스크린 세이조오 가부시키가이샤 | 기판처리장치 및 그 방법 |
KR20050106207A (ko) | 2004-05-04 | 2005-11-09 | 세메스 주식회사 | 기판 세정 시스템 |
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