KR20090016694A - 재발광 반도체 구성 및 광학 요소를 갖는 led 소자 - Google Patents
재발광 반도체 구성 및 광학 요소를 갖는 led 소자 Download PDFInfo
- Publication number
- KR20090016694A KR20090016694A KR1020087029687A KR20087029687A KR20090016694A KR 20090016694 A KR20090016694 A KR 20090016694A KR 1020087029687 A KR1020087029687 A KR 1020087029687A KR 20087029687 A KR20087029687 A KR 20087029687A KR 20090016694 A KR20090016694 A KR 20090016694A
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- South Korea
- Prior art keywords
- optical element
- led
- light
- optical
- light source
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Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0071—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source adapted to illuminate a complete hemisphere or a plane extending 360 degrees around the source
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80454106P | 2006-06-12 | 2006-06-12 | |
US60/804,541 | 2006-06-12 | ||
US80482406P | 2006-06-14 | 2006-06-14 | |
US60/804,824 | 2006-06-14 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090016694A true KR20090016694A (ko) | 2009-02-17 |
Family
ID=38832111
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087029687A KR20090016694A (ko) | 2006-06-12 | 2007-06-11 | 재발광 반도체 구성 및 광학 요소를 갖는 led 소자 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP2033236A4 (de) |
JP (1) | JP2009540615A (de) |
KR (1) | KR20090016694A (de) |
CN (1) | CN101467274B (de) |
TW (1) | TW200807769A (de) |
WO (1) | WO2007146860A1 (de) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101978516A (zh) * | 2008-03-21 | 2011-02-16 | 皇家飞利浦电子股份有限公司 | 发光器件 |
US7741134B2 (en) * | 2008-09-15 | 2010-06-22 | Bridgelux, Inc. | Inverted LED structure with improved light extraction |
DE102009020127A1 (de) * | 2009-03-25 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Leuchtdiode |
JP2012033823A (ja) | 2010-08-02 | 2012-02-16 | Stanley Electric Co Ltd | 発光装置およびその製造方法 |
CN103180945B (zh) | 2010-10-27 | 2016-12-07 | 皇家飞利浦电子股份有限公司 | 用于制造发光器件的层压支撑膜及其制造方法 |
DE102012102119A1 (de) * | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
JP6097084B2 (ja) | 2013-01-24 | 2017-03-15 | スタンレー電気株式会社 | 半導体発光装置 |
KR102237304B1 (ko) * | 2013-05-15 | 2021-04-07 | 루미리즈 홀딩 비.브이. | 반사기 및 광학 요소를 갖는 발광 디바이스 |
EP2953176A1 (de) * | 2014-06-02 | 2015-12-09 | Swarovski Energy GmbH | Beleuchtungsvorrichtung |
WO2016150718A1 (en) * | 2015-03-20 | 2016-09-29 | Philips Lighting Holding B.V. | Uv-c water purification device |
WO2016150807A1 (en) * | 2015-03-26 | 2016-09-29 | Koninklijke Philips N.V. | Light source |
CN105429002B (zh) * | 2015-11-23 | 2018-10-19 | 深圳瑞波光电子有限公司 | 一种量子阱半导体激光外延结构及量子阱激光器 |
WO2018208964A1 (en) * | 2017-05-09 | 2018-11-15 | Forelux Inc. | Optical apparatus for non-visible light applications |
US11650403B2 (en) | 2019-02-08 | 2023-05-16 | Meta Platforms Technologies, Llc | Optical elements for beam-shaping and illumination |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
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JP3014339B2 (ja) * | 1997-04-25 | 2000-02-28 | カナレ電気株式会社 | 量子波干渉層を有した半導体素子 |
JP3559446B2 (ja) * | 1998-03-23 | 2004-09-02 | 株式会社東芝 | 半導体発光素子および半導体発光装置 |
DE19955747A1 (de) * | 1999-11-19 | 2001-05-23 | Osram Opto Semiconductors Gmbh | Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur |
JP2001339121A (ja) * | 2000-05-29 | 2001-12-07 | Sharp Corp | 窒化物半導体発光素子とそれを含む光学装置 |
JP3791765B2 (ja) * | 2001-06-08 | 2006-06-28 | 豊田合成株式会社 | Iii族窒化物系化合物半導体発光素子 |
US6784460B2 (en) * | 2002-10-10 | 2004-08-31 | Agilent Technologies, Inc. | Chip shaping for flip-chip light emitting diode |
KR100641989B1 (ko) * | 2003-10-15 | 2006-11-02 | 엘지이노텍 주식회사 | 질화물 반도체 발광소자 |
CN100521266C (zh) * | 2004-08-06 | 2009-07-29 | 皇家飞利浦电子股份有限公司 | Led灯系统 |
US7330319B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | High brightness LED package with multiple optical elements |
US7329982B2 (en) * | 2004-10-29 | 2008-02-12 | 3M Innovative Properties Company | LED package with non-bonded optical element |
-
2007
- 2007-06-11 JP JP2009515583A patent/JP2009540615A/ja active Pending
- 2007-06-11 EP EP07798367.4A patent/EP2033236A4/de active Pending
- 2007-06-11 WO PCT/US2007/070847 patent/WO2007146860A1/en active Application Filing
- 2007-06-11 TW TW096121064A patent/TW200807769A/zh unknown
- 2007-06-11 KR KR1020087029687A patent/KR20090016694A/ko not_active Application Discontinuation
- 2007-06-11 CN CN2007800220226A patent/CN101467274B/zh not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN101467274A (zh) | 2009-06-24 |
TW200807769A (en) | 2008-02-01 |
JP2009540615A (ja) | 2009-11-19 |
CN101467274B (zh) | 2012-02-29 |
WO2007146860A1 (en) | 2007-12-21 |
EP2033236A4 (de) | 2014-10-22 |
EP2033236A1 (de) | 2009-03-11 |
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