EP2033236A4 - Led-vorrichtung mit neuemittierender halbleiterkonstruktion und optisches element - Google Patents

Led-vorrichtung mit neuemittierender halbleiterkonstruktion und optisches element

Info

Publication number
EP2033236A4
EP2033236A4 EP07798367.4A EP07798367A EP2033236A4 EP 2033236 A4 EP2033236 A4 EP 2033236A4 EP 07798367 A EP07798367 A EP 07798367A EP 2033236 A4 EP2033236 A4 EP 2033236A4
Authority
EP
European Patent Office
Prior art keywords
optical element
led device
emitting semiconductor
semiconductor construction
construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP07798367.4A
Other languages
English (en)
French (fr)
Other versions
EP2033236A1 (de
Inventor
Catherine A Leatherdale
Andrew J Ouderkirk
Michael A Haase
Thomas J Miller
Dong Lu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of EP2033236A1 publication Critical patent/EP2033236A1/de
Publication of EP2033236A4 publication Critical patent/EP2033236A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
    • G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0061—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a LED
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
    • G02B19/0071—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source adapted to illuminate a complete hemisphere or a plane extending 360 degrees around the source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
    • G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
    • G02B19/0095—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with ultraviolet radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
    • H01L33/502—Wavelength conversion materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H01L33/60—Reflective elements

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Devices (AREA)
  • Led Device Packages (AREA)
EP07798367.4A 2006-06-12 2007-06-11 Led-vorrichtung mit neuemittierender halbleiterkonstruktion und optisches element Pending EP2033236A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80454106P 2006-06-12 2006-06-12
US80482406P 2006-06-14 2006-06-14
PCT/US2007/070847 WO2007146860A1 (en) 2006-06-12 2007-06-11 Led device with re-emitting semiconductor construction and optical element

Publications (2)

Publication Number Publication Date
EP2033236A1 EP2033236A1 (de) 2009-03-11
EP2033236A4 true EP2033236A4 (de) 2014-10-22

Family

ID=38832111

Family Applications (1)

Application Number Title Priority Date Filing Date
EP07798367.4A Pending EP2033236A4 (de) 2006-06-12 2007-06-11 Led-vorrichtung mit neuemittierender halbleiterkonstruktion und optisches element

Country Status (6)

Country Link
EP (1) EP2033236A4 (de)
JP (1) JP2009540615A (de)
KR (1) KR20090016694A (de)
CN (1) CN101467274B (de)
TW (1) TW200807769A (de)
WO (1) WO2007146860A1 (de)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100127286A (ko) * 2008-03-21 2010-12-03 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 발광 장치
US7741134B2 (en) * 2008-09-15 2010-06-22 Bridgelux, Inc. Inverted LED structure with improved light extraction
DE102009020127A1 (de) * 2009-03-25 2010-09-30 Osram Opto Semiconductors Gmbh Leuchtdiode
JP2012033823A (ja) 2010-08-02 2012-02-16 Stanley Electric Co Ltd 発光装置およびその製造方法
CN103180945B (zh) 2010-10-27 2016-12-07 皇家飞利浦电子股份有限公司 用于制造发光器件的层压支撑膜及其制造方法
DE102012102119A1 (de) * 2012-03-13 2013-09-19 Osram Opto Semiconductors Gmbh Flächenlichtquelle
JP6097084B2 (ja) 2013-01-24 2017-03-15 スタンレー電気株式会社 半導体発光装置
WO2014184757A1 (en) * 2013-05-15 2014-11-20 Koninklijke Philips N.V. Light emitting device with an optical element and a reflector
EP2953176A1 (de) * 2014-06-02 2015-12-09 Swarovski Energy GmbH Beleuchtungsvorrichtung
JP6758313B2 (ja) 2015-03-20 2020-09-23 シグニファイ ホールディング ビー ヴィＳｉｇｎｉｆｙ Ｈｏｌｄｉｎｇ Ｂ．Ｖ． Ｕｖ−ｃ浄水装置
US10629788B2 (en) 2015-03-26 2020-04-21 Koninklijke Philips N.V. Light source
CN105429002B (zh) * 2015-11-23 2018-10-19 深圳瑞波光电子有限公司 一种量子阱半导体激光外延结构及量子阱激光器
CN110945654A (zh) * 2017-05-09 2020-03-31 光引研创股份有限公司 用于不可见光应用的光学装置
US11650403B2 (en) * 2019-02-08 2023-05-16 Meta Platforms Technologies, Llc Optical elements for beam-shaping and illumination

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030006430A1 (en) * 2001-06-08 2003-01-09 Naoki Shibata Group III nitride compound semiconductor light-emitting element
US20040070000A1 (en) * 2002-10-10 2004-04-15 Ng Kee Yean Chip shaping for flip-chip light emitting diode
WO2006016326A2 (en) * 2004-08-06 2006-02-16 Philips Intellectual Property & Standards Gmbh Led lamp system
US20060091784A1 (en) * 2004-10-29 2006-05-04 Conner Arlie R LED package with non-bonded optical element
US20060092532A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package with multiple optical elements

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3014339B2 (ja) * 1997-04-25 2000-02-28 カナレ電気株式会社 量子波干渉層を有した半導体素子
JP3559446B2 (ja) * 1998-03-23 2004-09-02 株式会社東芝 半導体発光素子および半導体発光装置
DE19955747A1 (de) * 1999-11-19 2001-05-23 Osram Opto Semiconductors Gmbh Optische Halbleitervorrichtung mit Mehrfach-Quantentopf-Struktur
JP2001339121A (ja) * 2000-05-29 2001-12-07 Sharp Corp 窒化物半導体発光素子とそれを含む光学装置
KR100641989B1 (ko) * 2003-10-15 2006-11-02 엘지이노텍 주식회사 질화물 반도체 발광소자

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030006430A1 (en) * 2001-06-08 2003-01-09 Naoki Shibata Group III nitride compound semiconductor light-emitting element
US20040070000A1 (en) * 2002-10-10 2004-04-15 Ng Kee Yean Chip shaping for flip-chip light emitting diode
WO2006016326A2 (en) * 2004-08-06 2006-02-16 Philips Intellectual Property & Standards Gmbh Led lamp system
US20060091784A1 (en) * 2004-10-29 2006-05-04 Conner Arlie R LED package with non-bonded optical element
US20060092532A1 (en) * 2004-10-29 2006-05-04 Ouderkirk Andrew J High brightness LED package with multiple optical elements

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2007146860A1 *

Also Published As

Publication number Publication date
CN101467274A (zh) 2009-06-24
CN101467274B (zh) 2012-02-29
JP2009540615A (ja) 2009-11-19
KR20090016694A (ko) 2009-02-17
EP2033236A1 (de) 2009-03-11
WO2007146860A1 (en) 2007-12-21
TW200807769A (en) 2008-02-01

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