KR20090009876A - 전해 도금 장치 및 방법 - Google Patents
전해 도금 장치 및 방법 Download PDFInfo
- Publication number
- KR20090009876A KR20090009876A KR1020087028157A KR20087028157A KR20090009876A KR 20090009876 A KR20090009876 A KR 20090009876A KR 1020087028157 A KR1020087028157 A KR 1020087028157A KR 20087028157 A KR20087028157 A KR 20087028157A KR 20090009876 A KR20090009876 A KR 20090009876A
- Authority
- KR
- South Korea
- Prior art keywords
- shaft
- substrate
- band
- electrically conductive
- conductive
- Prior art date
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/14—Electrodes, e.g. composition, counter electrode for pad-plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/005—Contacting devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/10—Electrodes, e.g. composition, counter electrode
- C25D17/12—Shape or form
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
- C25D5/06—Brush or pad plating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
- C25D5/56—Electroplating of non-metallic surfaces of plastics
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0621—In horizontal cells
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP06112723.9 | 2006-04-18 | ||
EP06112723 | 2006-04-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20090009876A true KR20090009876A (ko) | 2009-01-23 |
Family
ID=38236519
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020087028157A KR20090009876A (ko) | 2006-04-18 | 2007-04-17 | 전해 도금 장치 및 방법 |
Country Status (11)
Country | Link |
---|---|
US (1) | US20090101511A1 (pt) |
EP (1) | EP2010699A2 (pt) |
JP (1) | JP2009534527A (pt) |
KR (1) | KR20090009876A (pt) |
CN (1) | CN101473072A (pt) |
BR (1) | BRPI0710241A2 (pt) |
CA (1) | CA2649786A1 (pt) |
IL (1) | IL194754A0 (pt) |
RU (1) | RU2420616C2 (pt) |
TW (1) | TW200811316A (pt) |
WO (1) | WO2007118875A2 (pt) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101103450B1 (ko) * | 2010-07-27 | 2012-01-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
KR101419276B1 (ko) * | 2013-08-27 | 2014-07-15 | (주)엠에스티테크놀로지 | 플라즈마 전해 산화에 의한 코팅 형성 방법 |
KR101681083B1 (ko) * | 2016-06-26 | 2016-12-01 | 주식회사 지에스아이 | 곡면부를 포함하는 상대전극을 갖는 도금장치 |
Families Citing this family (29)
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---|---|---|---|---|
JP5301993B2 (ja) | 2005-08-12 | 2013-09-25 | モジュメタル エルエルシー | 組成変調複合材料及びその形成方法 |
TW200829726A (en) * | 2006-11-28 | 2008-07-16 | Basf Ag | Method and device for electrolytic coating |
US20110014492A1 (en) * | 2008-03-13 | 2011-01-20 | Basf Se | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
NL1035265C2 (nl) * | 2008-04-07 | 2009-10-08 | Meco Equip Eng | Werkwijze en inrichting voor het elektrolytisch galvaniseren van niet-metallische glasachtige substraten. |
EP3009532A1 (en) | 2009-06-08 | 2016-04-20 | Modumetal, Inc. | Electrodeposited nanolaminate coatings and claddings for corrosion protection |
TW201121680A (en) * | 2009-12-18 | 2011-07-01 | Metal Ind Res & Dev Ct | Electrochemical machining device and machining method and electrode unit thereof. |
US20120231574A1 (en) * | 2011-03-12 | 2012-09-13 | Jiaxiong Wang | Continuous Electroplating Apparatus with Assembled Modular Sections for Fabrications of Thin Film Solar Cells |
CA2905575C (en) | 2013-03-15 | 2022-07-12 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
EA032264B1 (ru) | 2013-03-15 | 2019-05-31 | Модьюметл, Инк. | Способ нанесения покрытия на изделие, изделие, полученное вышеуказанным способом, и труба |
BR112015022020A8 (pt) | 2013-03-15 | 2019-12-10 | Modumetal Inc | objeto ou revestimento e seu processo de fabricação |
US10472727B2 (en) | 2013-03-15 | 2019-11-12 | Modumetal, Inc. | Method and apparatus for continuously applying nanolaminate metal coatings |
WO2016044720A1 (en) * | 2014-09-18 | 2016-03-24 | Modumetal, Inc. | A method and apparatus for continuously applying nanolaminate metal coatings |
WO2014145771A1 (en) | 2013-03-15 | 2014-09-18 | Modumetal, Inc. | Electrodeposited compositions and nanolaminated alloys for articles prepared by additive manufacturing processes |
RU2534794C2 (ru) * | 2013-03-21 | 2014-12-10 | Открытое акционерное общество "Научно-исследовательский институт конструкционных материалов на основе графита "НИИграфит" | Способ связывания волокнистого пан материала при проведении стадий получения из него углеродного волокна |
EP2799939A1 (fr) * | 2013-04-30 | 2014-11-05 | Universo S.A. | Support pour le traitement de pièces de micromécanique |
EA201790644A1 (ru) | 2014-09-18 | 2017-08-31 | Модьюметал, Инк. | Способы изготовления изделий электроосаждением и процессами послойного синтеза |
DE102015121349A1 (de) | 2015-12-08 | 2017-06-08 | Staku Anlagenbau Gmbh | Vorrichtung zur Oberflächenbehandlung eines Endlosmaterials sowie deren Verwendung |
CN109952391B (zh) | 2016-09-08 | 2022-11-01 | 莫杜美拓有限公司 | 在工件上提供层压涂层的方法,及由其制备的制品 |
EP3512987A1 (en) | 2016-09-14 | 2019-07-24 | Modumetal, Inc. | System for reliable, high throughput, complex electric field generation, and method for producing coatings therefrom |
CN110114210B (zh) | 2016-11-02 | 2022-03-04 | 莫杜美拓有限公司 | 拓扑优化的高界面填充结构 |
CA3057836A1 (en) | 2017-03-24 | 2018-09-27 | Modumetal, Inc. | Lift plungers with electrodeposited coatings, and systems and methods for producing the same |
US11286575B2 (en) | 2017-04-21 | 2022-03-29 | Modumetal, Inc. | Tubular articles with electrodeposited coatings, and systems and methods for producing the same |
EP3784823A1 (en) | 2018-04-27 | 2021-03-03 | Modumetal, Inc. | Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation |
CN110952121B (zh) * | 2018-12-17 | 2023-12-05 | 嘉兴瑞通智能装备有限公司 | 焊带制造装置和电镀机构及其电镀方法 |
CN110306218A (zh) * | 2019-07-15 | 2019-10-08 | 中国石油集团济柴动力有限公司再制造分公司 | 一种发动机主轴孔自动控制式刷镀设备 |
CN113512749A (zh) * | 2020-12-08 | 2021-10-19 | 郑州大学 | 一种电镀金刚石刀具实验装置 |
JP7561975B2 (ja) | 2021-04-21 | 2024-10-04 | 三菱電機株式会社 | めっき電極及び該めっき電極を用いためっき方法 |
CN113400698B (zh) * | 2021-05-11 | 2022-12-20 | 重庆金美新材料科技有限公司 | 一种导电传动带及其制备方法、薄膜水电镀设备 |
CN115896907A (zh) * | 2022-10-19 | 2023-04-04 | 重庆金美新材料科技有限公司 | 一种阴极导电机构和电镀系统 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1756267A1 (de) * | 1968-04-27 | 1971-10-07 | Carl Klingspor | Galvanisiervorrichtung fuer Gewebe |
LU80496A1 (fr) * | 1978-11-09 | 1980-06-05 | Cockerill | Procede et diopositif pour le depot electrolytique en continu et a haute densite de courant d'un metal de recouvrement sur une tole |
DE4413149A1 (de) * | 1994-04-15 | 1995-10-19 | Schmid Gmbh & Co Geb | Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten |
DE10234705B4 (de) * | 2001-10-25 | 2008-01-17 | Infineon Technologies Ag | Galvanisiereinrichtung und Galvanisiersystem zum Beschichten von bereits leitfähig ausgebildeten Strukturen |
WO2003038158A2 (de) * | 2001-10-25 | 2003-05-08 | Infineon Technologies Ag | Galvanisiereinrichtung und galvanisiersystem zum beschichten von bereits leitfähig ausgebildeten strukturen |
DE10342512B3 (de) * | 2003-09-12 | 2004-10-28 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von bandförmigem Behandlungsgut |
-
2007
- 2007-04-17 KR KR1020087028157A patent/KR20090009876A/ko not_active Application Discontinuation
- 2007-04-17 JP JP2009505867A patent/JP2009534527A/ja not_active Withdrawn
- 2007-04-17 CA CA002649786A patent/CA2649786A1/en not_active Abandoned
- 2007-04-17 CN CNA2007800226453A patent/CN101473072A/zh active Pending
- 2007-04-17 US US12/297,864 patent/US20090101511A1/en not_active Abandoned
- 2007-04-17 RU RU2008145108/02A patent/RU2420616C2/ru not_active IP Right Cessation
- 2007-04-17 WO PCT/EP2007/053707 patent/WO2007118875A2/de active Application Filing
- 2007-04-17 EP EP07728172A patent/EP2010699A2/de not_active Withdrawn
- 2007-04-17 BR BRPI0710241-0A patent/BRPI0710241A2/pt not_active IP Right Cessation
- 2007-04-18 TW TW096113679A patent/TW200811316A/zh unknown
-
2008
- 2008-10-22 IL IL194754A patent/IL194754A0/en unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101103450B1 (ko) * | 2010-07-27 | 2012-01-09 | 주식회사 케이씨텍 | 기판 도금 장치 |
KR101419276B1 (ko) * | 2013-08-27 | 2014-07-15 | (주)엠에스티테크놀로지 | 플라즈마 전해 산화에 의한 코팅 형성 방법 |
KR101681083B1 (ko) * | 2016-06-26 | 2016-12-01 | 주식회사 지에스아이 | 곡면부를 포함하는 상대전극을 갖는 도금장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2009534527A (ja) | 2009-09-24 |
CN101473072A (zh) | 2009-07-01 |
WO2007118875A3 (de) | 2008-08-07 |
RU2008145108A (ru) | 2010-05-27 |
RU2420616C2 (ru) | 2011-06-10 |
CA2649786A1 (en) | 2007-10-25 |
EP2010699A2 (de) | 2009-01-07 |
WO2007118875A2 (de) | 2007-10-25 |
BRPI0710241A2 (pt) | 2011-08-09 |
US20090101511A1 (en) | 2009-04-23 |
TW200811316A (en) | 2008-03-01 |
IL194754A0 (en) | 2009-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |