KR20080040005A - 전도성이 내재된 인듐 함유 중합체를 포함하는 조성물 - Google Patents
전도성이 내재된 인듐 함유 중합체를 포함하는 조성물 Download PDFInfo
- Publication number
- KR20080040005A KR20080040005A KR1020087006602A KR20087006602A KR20080040005A KR 20080040005 A KR20080040005 A KR 20080040005A KR 1020087006602 A KR1020087006602 A KR 1020087006602A KR 20087006602 A KR20087006602 A KR 20087006602A KR 20080040005 A KR20080040005 A KR 20080040005A
- Authority
- KR
- South Korea
- Prior art keywords
- composition
- indium
- polymer
- conductivity
- inherent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/06—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances
- H01B1/12—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of other non-metallic substances organic substances
- H01B1/124—Intrinsically conductive polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/02—Polyamines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/10—OLEDs or polymer light-emitting diodes [PLED]
- H10K50/17—Carrier injection layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
- H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
- H10K85/1135—Polyethylene dioxythiophene [PEDOT]; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Optics & Photonics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102005039608A DE102005039608A1 (de) | 2005-08-19 | 2005-08-19 | Zusammensetzung mit intrinsisch leitfähigem Polymer |
| DE102005039608.9 | 2005-08-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080040005A true KR20080040005A (ko) | 2008-05-07 |
Family
ID=37116093
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020087006602A Ceased KR20080040005A (ko) | 2005-08-19 | 2006-08-18 | 전도성이 내재된 인듐 함유 중합체를 포함하는 조성물 |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US7989533B2 (enExample) |
| EP (1) | EP1917666B1 (enExample) |
| JP (2) | JP2009504860A (enExample) |
| KR (1) | KR20080040005A (enExample) |
| CN (1) | CN101243523A (enExample) |
| AT (1) | ATE545937T1 (enExample) |
| CA (1) | CA2618563A1 (enExample) |
| DE (1) | DE102005039608A1 (enExample) |
| WO (1) | WO2007020100A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004003784B4 (de) * | 2004-01-23 | 2011-01-13 | Ormecon Gmbh | Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung |
| DE102004030388A1 (de) * | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
| DE102005010162B4 (de) * | 2005-03-02 | 2007-06-14 | Ormecon Gmbh | Leitfähige Polymere aus Teilchen mit anisotroper Morphologie |
| US8153271B2 (en) * | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| US9053083B2 (en) | 2011-11-04 | 2015-06-09 | Microsoft Technology Licensing, Llc | Interaction between web gadgets and spreadsheets |
| KR102080471B1 (ko) * | 2012-09-25 | 2020-02-24 | 메르크 파텐트 게엠베하 | 전도성 폴리머들을 포함하는 제제들 및 유기 전자 디바이스들에서의 그 사용 |
Family Cites Families (78)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3977756A (en) | 1975-09-22 | 1976-08-31 | General Motors Corporation | Transitional connector for printed circuits |
| US4394498A (en) | 1981-08-24 | 1983-07-19 | Celanese Corporation | Method for providing particulates of liquid crystal polymers and particulates produced therefrom |
| AT378008B (de) | 1982-09-07 | 1985-06-10 | Neumayer Karl Gmbh | Verfahren zur herstellung von mit einer zinnlegierung ueberzogenen draehten |
| US4585695A (en) | 1983-10-11 | 1986-04-29 | Agency Of Industrial Science And Technology | Electrically conductive polypyrrole article |
| DE3440617C1 (de) | 1984-11-07 | 1986-06-26 | Zipperling Kessler & Co (Gmbh & Co), 2070 Ahrensburg | Antistatische bzw. elektrisch halbleitende thermoplastische Polymerblends,Verfahren zu deren Herstellung und deren Verwendung |
| US4657632A (en) | 1985-08-29 | 1987-04-14 | Techno Instruments Investments 1983 Ltd. | Use of immersion tin coating as etch resist |
| US5104599A (en) | 1987-03-05 | 1992-04-14 | Allied-Signal Inc. | Method of forming short fibers composed of anisotropic polymers |
| DE3729566A1 (de) | 1987-09-04 | 1989-03-16 | Zipperling Kessler & Co | Intrinsisch leitfaehiges polymer in form eines dispergierbaren feststoffes, dessen herstellung und dessen verwendung |
| CA1339210C (en) | 1988-05-31 | 1997-08-05 | John Lewicki | Recombinant techniques for production of novel natriuretic and vasodilator peptides |
| US5498761A (en) | 1988-10-11 | 1996-03-12 | Wessling; Bernhard | Process for producing thin layers of conductive polymers |
| ATE156295T1 (de) | 1988-10-11 | 1997-08-15 | Zipperling Kessler & Co | Verfahren zur herstellung dünner schichten aus leitfähigen polymeren |
| US4959180A (en) | 1989-02-03 | 1990-09-25 | The United States Of America As Represented By The United States Department Of Energy | Colloidal polyaniline |
| EP0466943A4 (en) | 1990-02-05 | 1992-07-01 | Vsesojuzny Nauchno-Issledovatelsky Instrumentalny Institut | Liquid pulverizer |
| US5192835A (en) | 1990-10-09 | 1993-03-09 | Eastman Kodak Company | Bonding of solid state device to terminal board |
| US5281363A (en) | 1991-04-22 | 1994-01-25 | Allied-Signal Inc. | Polyaniline compositions having a surface/core dopant arrangement |
| US5278213A (en) | 1991-04-22 | 1994-01-11 | Allied Signal Inc. | Method of processing neutral polyanilines in solvent and solvent mixtures |
| DE4238765A1 (de) | 1992-11-10 | 1994-05-11 | Stuebing Gmbh | Verfahren zur stromlosen Verzinnung von Leiterplatten und deren Verwendung |
| DE4317010A1 (de) | 1993-05-17 | 1994-11-24 | Zipperling Kessler & Co | Dispergierbares intrinsisch leitfähiges Polymer und Verfahren zu dessen Herstellung |
| WO1995000678A1 (de) | 1993-06-25 | 1995-01-05 | Zipperling Kessler & Co (Gmbh & Co) | Verfahren zur herstellung korrosionsgeschützter metallischer werkstoffe und damit erhältliche werkstoffe |
| US5532025A (en) | 1993-07-23 | 1996-07-02 | Kinlen; Patrick J. | Corrosion inhibiting compositions |
| US5403913A (en) | 1993-08-12 | 1995-04-04 | The Trustees Of The University Of Pennsylvania | Methods for preparing conductive polyanilines |
| DE4333127A1 (de) | 1993-09-29 | 1995-03-30 | Basf Ag | Verfahren zum Schutz von lötfähigen Kupfer- und Kupferlegierungsoberflächen vor Korrosion |
| US5682043A (en) | 1994-06-28 | 1997-10-28 | Uniax Corporation | Electrochemical light-emitting devices |
| US5595689A (en) | 1994-07-21 | 1997-01-21 | Americhem, Inc. | Highly conductive polymer blends with intrinsically conductive polymers |
| US5700398A (en) | 1994-12-14 | 1997-12-23 | International Business Machines Corporation | Composition containing a polymer and conductive filler and use thereof |
| US5645890A (en) | 1995-02-14 | 1997-07-08 | The Trustess Of The University Of Pennsylvania | Prevention of corrosion with polyaniline |
| DE19525708C1 (de) | 1995-07-14 | 1997-01-30 | Rmh Polymers Gmbh & Co Kg | Temporärer Anlaufschutz für Kupfer und Kupferlegierungen |
| DE59608706D1 (de) | 1995-11-29 | 2002-03-21 | Zipperling Kessler & Co | Verfahren zur herstellung von metallisierten werkstoffen |
| US5733599A (en) | 1996-03-22 | 1998-03-31 | Macdermid, Incorporated | Method for enhancing the solderability of a surface |
| CA2295223C (en) * | 1997-06-27 | 2009-09-22 | University Of Southampton | Porous film and method of preparation thereof |
| DE59812308D1 (de) | 1997-07-25 | 2004-12-30 | Ormecon Gmbh | Chemische verbindungen von intrinsisch leitfähigen polymeren mit metallen |
| DE19754221A1 (de) | 1997-12-06 | 1999-06-17 | Federal Mogul Wiesbaden Gmbh | Schichtverbundwerkstoff für Gleitlager mit bleifreier Gleitschicht |
| US6015482A (en) | 1997-12-18 | 2000-01-18 | Circuit Research Corp. | Printed circuit manufacturing process using tin-nickel plating |
| US6123995A (en) | 1998-03-06 | 2000-09-26 | Shipley Company, L.L.C. | Method of manufacture of multilayer circuit boards |
| DE19812258A1 (de) * | 1998-03-20 | 1999-09-23 | Bayer Ag | Elektrolumineszierende Anordnungen unter Verwendung von Blendsystemen |
| JP3937113B2 (ja) | 1998-06-05 | 2007-06-27 | 日産化学工業株式会社 | 有機−無機複合導電性ゾル及びその製造法 |
| US6254996B1 (en) * | 1998-06-05 | 2001-07-03 | Teijin Limited | Antistatic polyester film and process for producing the same |
| JP3796381B2 (ja) | 1999-01-26 | 2006-07-12 | 株式会社エスアイアイ・マイクロパーツ | 電気二重層キャパシタ |
| US6593399B1 (en) | 1999-06-04 | 2003-07-15 | Rohm And Haas Company | Preparing conductive polymers in the presence of emulsion latexes |
| US6821323B1 (en) | 1999-11-12 | 2004-11-23 | Enthone Inc. | Process for the non-galvanic tin plating of copper or copper alloys |
| US6361823B1 (en) | 1999-12-03 | 2002-03-26 | Atotech Deutschland Gmbh | Process for whisker-free aqueous electroless tin plating |
| US6706418B2 (en) | 2000-07-01 | 2004-03-16 | Shipley Company L.L.C. | Metal alloy compositions and plating methods related thereto |
| US20020187364A1 (en) | 2001-03-16 | 2002-12-12 | Shipley Company, L.L.C. | Tin plating |
| US6730401B2 (en) | 2001-03-16 | 2004-05-04 | Eastman Chemical Company | Multilayered packaging materials for electrostatic applications |
| JP2002289653A (ja) | 2001-03-26 | 2002-10-04 | Hitachi Cable Ltd | 半導体装置用テープキャリアおよびその製造方法 |
| CN101330800B (zh) | 2001-07-19 | 2011-03-23 | 东丽株式会社 | 电路基板的制造方法 |
| WO2003020000A1 (en) | 2001-08-22 | 2003-03-06 | World Properties Inc. | Method for improving bonding of circuit substrates to metal and articles formed thereby |
| GB2380964B (en) | 2001-09-04 | 2005-01-12 | Multicore Solders Ltd | Lead-free solder paste |
| JP3513709B2 (ja) | 2001-10-16 | 2004-03-31 | 石原薬品株式会社 | 前処理によるスズホイスカーの防止方法 |
| TW200302685A (en) | 2002-01-23 | 2003-08-01 | Matsushita Electric Industrial Co Ltd | Circuit component built-in module and method of manufacturing the same |
| JP4078995B2 (ja) * | 2002-01-31 | 2008-04-23 | 宇部興産株式会社 | スルホン酸誘導体及び導電性高分子材料 |
| CN1639246A (zh) | 2002-03-01 | 2005-07-13 | 纳幕尔杜邦公司 | 包含添加剂的有机导电聚合物的印刷 |
| JP3940620B2 (ja) | 2002-03-22 | 2007-07-04 | ガンツ化成株式会社 | 非球塊状ポリマー微粒子の製造法 |
| JP2005524965A (ja) * | 2002-05-08 | 2005-08-18 | ゼオラックス コーポレーション | フィードバック増強型発光ダイオードを使用した照明装置<関連出願の記載>本願は、2002年5月8日出願の米国仮出願第60/379,141号(その全部が引用により本文書に組み込まれている)の利益を主張する。本願は、2003年5月8日出願の「フィードバック増強型発光デバイス(feedbackenhancedlightemittingdevice)」と称するの米国特許出願第号、および2003年5月8日出願の「フィードバック増強型照明ダイオードを使用したディスプレイデバイス(displaydevicesusingfeedbackenhancedlightingdiode)」と称するの米国特許出願第号(これら出願は、その全部が引用により本文書に組み込まれている)に関連している。 |
| JP3855161B2 (ja) | 2002-05-10 | 2006-12-06 | 石原薬品株式会社 | 電子部品のスズホイスカーの防止方法 |
| JP4096644B2 (ja) * | 2002-06-28 | 2008-06-04 | 住友化学株式会社 | 導電性高分子材料および有機エレクトロルミネッセンス素子 |
| DE10234363A1 (de) | 2002-07-27 | 2004-02-12 | Robert Bosch Gmbh | Korrosionsschutzlack für metallische Oberflächen |
| AU2003275203A1 (en) | 2002-09-24 | 2004-04-19 | E.I. Du Pont De Nemours And Company | Water dispersible polythiophenes made with polymeric acid colloids |
| US20040124504A1 (en) * | 2002-09-24 | 2004-07-01 | Che-Hsiung Hsu | Electrically conducting organic polymer/nanoparticle composites and methods for use thereof |
| US6962642B2 (en) | 2002-09-26 | 2005-11-08 | International Business Machines Corporation | Treating copper surfaces for electronic applications |
| US20040191605A1 (en) * | 2002-12-27 | 2004-09-30 | Foamex L.P. | Gas diffusion layer containing inherently conductive polymer for fuel cells |
| JP4394890B2 (ja) * | 2003-03-10 | 2010-01-06 | 株式会社Kri | 導電性組成物、導電膜、樹脂複合材料 |
| US6869699B2 (en) * | 2003-03-18 | 2005-03-22 | Eastman Kodak Company | P-type materials and mixtures for electronic devices |
| JP4603812B2 (ja) | 2003-05-12 | 2010-12-22 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 改良されたスズめっき方法 |
| DE10331673A1 (de) * | 2003-07-14 | 2005-02-10 | H.C. Starck Gmbh | Polythiophen mit Alkylenoxythiathiophen-Einheiten in Elektrolytkondensatoren |
| JP4300468B2 (ja) * | 2003-11-27 | 2009-07-22 | アキレス株式会社 | 導電性複合微粒子分散体 |
| DE102004003784B4 (de) | 2004-01-23 | 2011-01-13 | Ormecon Gmbh | Dispersion intrinsisch leitfähigen Polyanilins und deren Verwendung |
| JP5245188B2 (ja) | 2004-03-03 | 2013-07-24 | 日清紡ホールディングス株式会社 | 楕円球状有機ポリマー粒子およびその製造方法 |
| JP2007529586A (ja) | 2004-03-18 | 2007-10-25 | オルメコン・ゲーエムベーハー | コロイド状導電性ポリマーおよび炭素を含む組成物 |
| US20050269555A1 (en) | 2004-05-11 | 2005-12-08 | Suck-Hyun Lee | Conductive polymers having highly enhanced solubility in organic solvent and electrical conductivity and synthesizing process thereof |
| DE102004030388A1 (de) | 2004-06-23 | 2006-01-26 | Ormecon Gmbh | Artikel mit einer Beschichtung von elektrisch leitfähigem Polymer und Verfahren zu deren Herstellung |
| DE102004030930A1 (de) | 2004-06-25 | 2006-02-23 | Ormecon Gmbh | Zinnbeschichtete Leiterplatten mit geringer Neigung zur Whiskerbildung |
| US7087441B2 (en) | 2004-10-21 | 2006-08-08 | Endicott Interconnect Technologies, Inc. | Method of making a circuitized substrate having a plurality of solder connection sites thereon |
| DE102005010162B4 (de) | 2005-03-02 | 2007-06-14 | Ormecon Gmbh | Leitfähige Polymere aus Teilchen mit anisotroper Morphologie |
| DE202005010364U1 (de) | 2005-07-01 | 2005-09-08 | Ormecon Gmbh | Zinnbeschichtete flexible Leiterplatten mit geringer Neigung zur Whiskerbildung |
| US7576356B2 (en) * | 2005-08-08 | 2009-08-18 | Osram Opto Semiconductors Gmbh | Solution processed crosslinkable hole injection and hole transport polymers for OLEDs |
| US8153271B2 (en) | 2006-09-13 | 2012-04-10 | Ormecon Gmbh | Article with a coating of electrically conductive polymer and precious/semiprecious metal and process for production thereof |
| DE102007040065A1 (de) | 2007-08-24 | 2009-02-26 | Ormecon Gmbh | Artikel mit einer nanoskopischen Beschichtung aus Edel-/Halbedelmetall sowie Verfahren zu deren Herstellung |
-
2005
- 2005-08-19 DE DE102005039608A patent/DE102005039608A1/de not_active Withdrawn
-
2006
- 2006-08-18 EP EP06776958A patent/EP1917666B1/de not_active Not-in-force
- 2006-08-18 KR KR1020087006602A patent/KR20080040005A/ko not_active Ceased
- 2006-08-18 AT AT06776958T patent/ATE545937T1/de active
- 2006-08-18 CN CNA2006800297914A patent/CN101243523A/zh active Pending
- 2006-08-18 US US12/063,642 patent/US7989533B2/en not_active Expired - Fee Related
- 2006-08-18 WO PCT/EP2006/008165 patent/WO2007020100A1/de not_active Ceased
- 2006-08-18 CA CA002618563A patent/CA2618563A1/en not_active Abandoned
- 2006-08-18 JP JP2008526450A patent/JP2009504860A/ja not_active Withdrawn
-
2011
- 2011-08-26 JP JP2011185115A patent/JP5566973B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2011241405A (ja) | 2011-12-01 |
| JP2009504860A (ja) | 2009-02-05 |
| WO2007020100A1 (de) | 2007-02-22 |
| EP1917666A1 (de) | 2008-05-07 |
| DE102005039608A1 (de) | 2007-03-01 |
| CA2618563A1 (en) | 2007-02-22 |
| ATE545937T1 (de) | 2012-03-15 |
| JP5566973B2 (ja) | 2014-08-06 |
| US7989533B2 (en) | 2011-08-02 |
| EP1917666B1 (de) | 2012-02-15 |
| US20100140592A1 (en) | 2010-06-10 |
| CN101243523A (zh) | 2008-08-13 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4464277B2 (ja) | 導電性有機ポリマー/ナノ粒子複合材料およびその使用方法 | |
| KR101138137B1 (ko) | 전기 도핑된 전도성 중합체 및 콜로이드 형성 고분자 산을포함하는 비수성 분산액 | |
| CN102174246B (zh) | 带有氟化离子交换聚合物作为掺杂物的聚噻吩并噻吩的水分散体 | |
| KR101314877B1 (ko) | 정공 주입/수송 층 조성물 및 장치 | |
| TWI444403B (zh) | 從包含聚噻吩及含醚聚合物的分散液所形成的導電膜 | |
| Huang et al. | Synthesis, photophysics, and electroluminescence of high-efficiency saturated red light-emitting polyfluorene-based polyelectrolytes and their neutral precursors | |
| JP2011193002A (ja) | 導電性有機ポリマーと複数のナノ粒子とを含有するバッファー層を含むデバイス | |
| KR20050074323A (ko) | 광전자 소자용 전도성 중합체를 포함하는 분산액 및 필름 | |
| US7033646B2 (en) | High resistance polyaniline blend for use in high efficiency pixellated polymer electroluminescent devices | |
| JP5566973B2 (ja) | 固有導電性重合体を含む組成物 | |
| De Paoli et al. | Conductive polymer blends: preparation, properties and applications | |
| Kleybolte et al. | A polymer lost in the shuffle: the perspective of poly (para) phenylenes | |
| Huh et al. | A soluble self-doped conducting polyaniline graft copolymer as a hole injection layer in polymer light-emitting diodes | |
| JP2009504860A5 (enExample) | ||
| Perepichka et al. | Light-emitting polymers | |
| Xun et al. | Light emitting polymers | |
| WO2004019347A1 (en) | Layer configuration comprising an electron-blocking element |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| N231 | Notification of change of applicant | ||
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |
|
| T11-X000 | Administrative time limit extension requested |
St.27 status event code: U-3-3-T10-T11-oth-X000 |
|
| J201 | Request for trial against refusal decision | ||
| PJ0201 | Trial against decision of rejection |
St.27 status event code: A-3-3-V10-V11-apl-PJ0201 |
|
| J501 | Disposition of invalidation of trial | ||
| PJ0501 | Disposition of invalidation of trial |
St.27 status event code: A-3-3-V10-V13-apl-PJ0501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| R18-X000 | Changes to party contact information recorded |
St.27 status event code: A-3-3-R10-R18-oth-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |