KR20080039841A - 표면 및 평면형 물체의 처리장치 - Google Patents

표면 및 평면형 물체의 처리장치 Download PDF

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Publication number
KR20080039841A
KR20080039841A KR1020077029685A KR20077029685A KR20080039841A KR 20080039841 A KR20080039841 A KR 20080039841A KR 1020077029685 A KR1020077029685 A KR 1020077029685A KR 20077029685 A KR20077029685 A KR 20077029685A KR 20080039841 A KR20080039841 A KR 20080039841A
Authority
KR
South Korea
Prior art keywords
contact
contact means
planar objects
circuit board
treating flat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077029685A
Other languages
English (en)
Korean (ko)
Inventor
베르너 안드레아스 마우러
Original Assignee
게부르. 쉬미트 게엠베하 운트 코.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 게부르. 쉬미트 게엠베하 운트 코. filed Critical 게부르. 쉬미트 게엠베하 운트 코.
Publication of KR20080039841A publication Critical patent/KR20080039841A/ko
Withdrawn legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/005—Contacting devices
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1509—Horizontally held PCB

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020077029685A 2005-06-22 2006-06-20 표면 및 평면형 물체의 처리장치 Withdrawn KR20080039841A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102005030546.6 2005-06-22
DE102005030546A DE102005030546A1 (de) 2005-06-22 2005-06-22 Einrichtung zur Behandlung von flachen und flächigen Gegenständen

Publications (1)

Publication Number Publication Date
KR20080039841A true KR20080039841A (ko) 2008-05-07

Family

ID=36809626

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077029685A Withdrawn KR20080039841A (ko) 2005-06-22 2006-06-20 표면 및 평면형 물체의 처리장치

Country Status (7)

Country Link
EP (1) EP1899507A2 (cg-RX-API-DMAC7.html)
JP (1) JP2008544086A (cg-RX-API-DMAC7.html)
KR (1) KR20080039841A (cg-RX-API-DMAC7.html)
CN (1) CN101203632A (cg-RX-API-DMAC7.html)
AT (1) AT10276U1 (cg-RX-API-DMAC7.html)
DE (1) DE102005030546A1 (cg-RX-API-DMAC7.html)
WO (1) WO2006136362A2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) * 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
DE102009049565A1 (de) * 2009-10-09 2011-04-14 Gebr. Schmid Gmbh & Co. Verfahren und Anlage zur Metallisierung von Siliziumwafern
DE102009057463A1 (de) 2009-12-03 2011-06-09 Hübel, Egon Verfahren und Vorrichtung zum elektrischen Kontaktieren von Gut in Durchlaufanlagen
CN102808206B (zh) * 2012-05-04 2015-04-08 上海贺鸿电子有限公司 一种适用于片状和卷状产品水平电镀线的导电及辅助传动装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3729390A (en) * 1967-11-24 1973-04-24 Du Pont Electrotinning process to prevent plating on the cathode contact roll
JPH01162798A (ja) * 1987-12-18 1989-06-27 Nkk Corp 電気めっき用コンダクターロールの付着金属除去装置
JP2543299Y2 (ja) * 1989-12-14 1997-08-06 富士重工業株式会社 ディーゼルエンジンの停止装置
EP0578699B1 (de) * 1991-04-12 1995-07-12 Siemens Aktiengesellschaft Galvanisiereinrichtung für plattenförmige werkstücke, insbesondere leiterplatten
DE19628784A1 (de) * 1996-07-17 1998-01-22 Schmid Gmbh & Co Geb Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisiereinrichtung für Leiterplatten
DE19717512C3 (de) * 1997-04-25 2003-06-18 Atotech Deutschland Gmbh Vorrichtung zum Galvanisieren von Leiterplatten unter konstanten Bedingungen in Durchlaufanlagen

Also Published As

Publication number Publication date
WO2006136362A3 (de) 2008-02-28
WO2006136362A2 (de) 2006-12-28
CN101203632A (zh) 2008-06-18
EP1899507A2 (de) 2008-03-19
DE102005030546A1 (de) 2007-01-04
AT10276U1 (de) 2008-12-15
JP2008544086A (ja) 2008-12-04

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20071220

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid