KR20080016781A - 표면 개질에 의한 패턴화 방법 - Google Patents

표면 개질에 의한 패턴화 방법 Download PDF

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Publication number
KR20080016781A
KR20080016781A KR1020077015909A KR20077015909A KR20080016781A KR 20080016781 A KR20080016781 A KR 20080016781A KR 1020077015909 A KR1020077015909 A KR 1020077015909A KR 20077015909 A KR20077015909 A KR 20077015909A KR 20080016781 A KR20080016781 A KR 20080016781A
Authority
KR
South Korea
Prior art keywords
treatment
substrate
surface modification
mask
exposed portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077015909A
Other languages
English (en)
Korean (ko)
Inventor
스티븐 디. 테이스
티모시 디. 던바
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20080016781A publication Critical patent/KR20080016781A/ko
Withdrawn legal-status Critical Current

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Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76Patterning of masks by imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20Exposure; Apparatus therefor
    • G03F7/2002Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
    • G03F7/2014Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/80Constructional details
    • H10K10/82Electrodes
    • H10K10/84Ohmic electrodes, e.g. source or drain electrodes
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/60Forming conductive regions or layers, e.g. electrodes
    • H10K71/611Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41MPRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M5/00Duplicating or marking methods; Sheet materials for use therein
    • B41M5/0011Pre-treatment or treatment during printing of the recording material, e.g. heating, irradiating
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10KORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K10/00Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
    • H10K10/40Organic transistors
    • H10K10/46Field-effect transistors, e.g. organic thin-film transistors [OTFT]
    • H10K10/462Insulated gate field-effect transistors [IGFETs]
    • H10K10/464Lateral top-gate IGFETs comprising only a single gate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020077015909A 2004-12-13 2005-11-22 표면 개질에 의한 패턴화 방법 Withdrawn KR20080016781A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/010,846 US20060128165A1 (en) 2004-12-13 2004-12-13 Method for patterning surface modification
US11/010,846 2004-12-13

Publications (1)

Publication Number Publication Date
KR20080016781A true KR20080016781A (ko) 2008-02-22

Family

ID=36216851

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077015909A Withdrawn KR20080016781A (ko) 2004-12-13 2005-11-22 표면 개질에 의한 패턴화 방법

Country Status (6)

Country Link
US (1) US20060128165A1 (enExample)
EP (1) EP1825327A2 (enExample)
JP (1) JP2008523618A (enExample)
KR (1) KR20080016781A (enExample)
CN (1) CN101080670A (enExample)
WO (1) WO2006065474A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180094781A (ko) * 2017-02-16 2018-08-24 제록스 코포레이션 Uv 경화된 잉크 하층의 전처리

Families Citing this family (36)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4892209B2 (ja) * 2005-08-22 2012-03-07 日立化成デュポンマイクロシステムズ株式会社 半導体装置の製造方法
JP2007129007A (ja) * 2005-11-02 2007-05-24 Hitachi Ltd 有機半導体膜を有する半導体装置の製造方法
US7666968B2 (en) * 2006-04-21 2010-02-23 3M Innovative Properties Company Acene-thiophene copolymers with silethynly groups
US8083953B2 (en) 2007-03-06 2011-12-27 Micron Technology, Inc. Registered structure formation via the application of directed thermal energy to diblock copolymer films
US8557128B2 (en) 2007-03-22 2013-10-15 Micron Technology, Inc. Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers
US8294139B2 (en) 2007-06-21 2012-10-23 Micron Technology, Inc. Multilayer antireflection coatings, structures and devices including the same and methods of making the same
US7959975B2 (en) * 2007-04-18 2011-06-14 Micron Technology, Inc. Methods of patterning a substrate
US8097175B2 (en) * 2008-10-28 2012-01-17 Micron Technology, Inc. Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure
KR20100016643A (ko) * 2007-04-19 2010-02-12 바스프 에스이 기판 상에 패턴을 형성하는 방법 및 그에 의해 형성된 전자 장치
US8372295B2 (en) 2007-04-20 2013-02-12 Micron Technology, Inc. Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method
US8404124B2 (en) 2007-06-12 2013-03-26 Micron Technology, Inc. Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces
US8080615B2 (en) 2007-06-19 2011-12-20 Micron Technology, Inc. Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide
US8999492B2 (en) 2008-02-05 2015-04-07 Micron Technology, Inc. Method to produce nanometer-sized features with directed assembly of block copolymers
US8101261B2 (en) 2008-02-13 2012-01-24 Micron Technology, Inc. One-dimensional arrays of block copolymer cylinders and applications thereof
US8425982B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Methods of improving long range order in self-assembly of block copolymer films with ionic liquids
US8426313B2 (en) 2008-03-21 2013-04-23 Micron Technology, Inc. Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference
US8114301B2 (en) 2008-05-02 2012-02-14 Micron Technology, Inc. Graphoepitaxial self-assembly of arrays of downward facing half-cylinders
KR100997185B1 (ko) * 2008-09-17 2010-11-29 삼성전기주식회사 인쇄회로기판 수지의 표면 처리 방법 및 상기 방법에 의해처리된 인쇄회로기판 수지
ITMI20110363A1 (it) * 2011-03-09 2012-09-10 Cretec Co Ltd Metodo per ricavare un percorso conduttivo mediante irradiazione laser
US8900963B2 (en) 2011-11-02 2014-12-02 Micron Technology, Inc. Methods of forming semiconductor device structures, and related structures
US9087699B2 (en) 2012-10-05 2015-07-21 Micron Technology, Inc. Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure
US9229328B2 (en) 2013-05-02 2016-01-05 Micron Technology, Inc. Methods of forming semiconductor device structures, and related semiconductor device structures
US9177795B2 (en) 2013-09-27 2015-11-03 Micron Technology, Inc. Methods of forming nanostructures including metal oxides
KR20160068874A (ko) * 2013-10-11 2016-06-15 쓰리엠 이노베이티브 프로퍼티즈 캄파니 플렉소그래픽 인쇄면의 플라즈마 처리
WO2015097209A1 (en) * 2013-12-23 2015-07-02 Solvay Specialty Polymers Italy S.P.A. Display devices
US20150257283A1 (en) * 2014-03-06 2015-09-10 Carolyn Rae Ellinger Forming vertically spaced electrodes
US9244356B1 (en) 2014-04-03 2016-01-26 Rolith, Inc. Transparent metal mesh and method of manufacture
WO2015183243A1 (en) 2014-05-27 2015-12-03 Rolith, Inc. Anti-counterfeiting features and methods of fabrication and detection
CN104835721B (zh) * 2015-03-31 2017-10-17 上海华力微电子有限公司 改善ArF光阻在硅片表面上的黏附性的方法
CN108026291B (zh) 2015-09-28 2021-04-13 3M创新有限公司 包含可裂解交联剂的图案化膜制品和方法
CN107240544B (zh) * 2017-05-04 2019-10-15 中国科学院宁波材料技术与工程研究所 一种图形化薄膜、薄膜晶体管及忆阻器的制备方法
EP3556911A1 (fr) * 2018-04-19 2019-10-23 Comadur S.A. Procédé de structuration d'un motif décoratif ou technique dans un objet réalisé en un matériau amorphe, semi-cristallin ou cristallin au moins partiellement transparent
CN108682627B (zh) * 2018-05-18 2019-05-21 清华大学 图案化柔性有机薄膜及制备方法、层叠体及图案化方法
US20220161586A1 (en) * 2019-03-06 2022-05-26 Axalta Coating Systems Ip Co., Llc Controlled surface wetting resulting in improved digital print edge acuity and resolution
PT3835079T (pt) * 2019-12-12 2023-10-30 Akzenta Paneele Profile Gmbh Película antidesgaste estruturada para impressão digital com nível de brilho ajustável
US20220162118A1 (en) * 2020-11-23 2022-05-26 Innolux Corporation Method for preparing cover substrate

Family Cites Families (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3906769A (en) * 1973-05-02 1975-09-23 Nasa Method of making an insulation foil
US4338614A (en) * 1979-10-22 1982-07-06 Markem Corporation Electrostatic print head
GB2125248B (en) * 1982-07-23 1986-01-29 Dainippon Screen Mfg Aperture mask for image scanning and recording apparatus
US4581753A (en) * 1984-09-21 1986-04-08 John K. Grady Translatively driven X-ray aperture mask
US4581468A (en) * 1985-05-13 1986-04-08 Ultrasystems, Inc. Boron nitride preceramic polymers
US4612737A (en) * 1985-07-05 1986-09-23 Rohr Industries, Inc. Grit blast drilling of advanced composite perforated sheet
JPH06168919A (ja) * 1992-11-30 1994-06-14 Dainippon Printing Co Ltd 半導体装置のパターニング方法
GB2285411B (en) * 1993-12-22 1997-07-16 Kimberly Clark Co Process of manufacturing a water-based adhesive bonded, solvent resistant protective laminate
JPH10172912A (ja) * 1996-12-09 1998-06-26 Furukawa Electric Co Ltd:The 量子構造の形成方法
JP4003273B2 (ja) * 1998-01-19 2007-11-07 セイコーエプソン株式会社 パターン形成方法および基板製造装置
CA2329412C (en) * 1998-04-21 2010-09-21 President And Fellows Of Harvard College Elastomeric mask and use in fabrication of devices, including pixelated electroluminescent displays
US6428650B1 (en) * 1998-06-23 2002-08-06 Amerasia International Technology, Inc. Cover for an optical device and method for making same
US6403382B1 (en) * 1998-12-08 2002-06-11 Regents Of The University Of Minnesota Attachment chemistry for organic molecules to silicon
AU2015901A (en) * 1999-12-21 2001-07-03 Plastic Logic Limited Inkjet-fabricated integrated circuits
CA2395004C (en) * 1999-12-21 2014-01-28 Plastic Logic Limited Solution processing
US6281468B1 (en) * 2000-03-13 2001-08-28 Essilor International, Compagnie Generale D'optique Method and apparatus for producing a marking on an ophthalmic lens having a low surface energy
JP2001272505A (ja) * 2000-03-24 2001-10-05 Japan Science & Technology Corp 表面処理方法
US6718532B2 (en) * 2001-02-23 2004-04-06 Kabushiki Kaisha Toshiba Charged particle beam exposure system using aperture mask in semiconductor manufacture
US6433359B1 (en) * 2001-09-06 2002-08-13 3M Innovative Properties Company Surface modifying layers for organic thin film transistors
AU2002327747A1 (en) * 2001-09-27 2003-04-07 3M Innovative Properties Company Substituted pentacene semiconductors
US20030097010A1 (en) * 2001-09-27 2003-05-22 Vogel Dennis E. Process for preparing pentacene derivatives
US6998068B2 (en) * 2003-08-15 2006-02-14 3M Innovative Properties Company Acene-thiophene semiconductors
US6946676B2 (en) * 2001-11-05 2005-09-20 3M Innovative Properties Company Organic thin film transistor with polymeric interface
US6617609B2 (en) * 2001-11-05 2003-09-09 3M Innovative Properties Company Organic thin film transistor with siloxane polymer interface
US6660177B2 (en) * 2001-11-07 2003-12-09 Rapt Industries Inc. Apparatus and method for reactive atom plasma processing for material deposition
JP2003151960A (ja) * 2001-11-12 2003-05-23 Toyota Motor Corp トレンチエッチング方法
US6821348B2 (en) * 2002-02-14 2004-11-23 3M Innovative Properties Company In-line deposition processes for circuit fabrication
US20030151118A1 (en) * 2002-02-14 2003-08-14 3M Innovative Properties Company Aperture masks for circuit fabrication
US6897164B2 (en) * 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication
WO2003074200A1 (en) * 2002-03-02 2003-09-12 Polymeric Converting Llc Removable labels, coupons and the like
US6667215B2 (en) * 2002-05-02 2003-12-23 3M Innovative Properties Method of making transistors
US7459098B2 (en) * 2002-08-28 2008-12-02 Kyocera Corporation Dry etching apparatus, dry etching method, and plate and tray used therein
US7098525B2 (en) * 2003-05-08 2006-08-29 3M Innovative Properties Company Organic polymers, electronic devices, and methods
US7309731B2 (en) * 2003-06-02 2007-12-18 Avery Dennison Corporation Ink-receptive coatings, composites and adhesive-containing facestocks and labels
US7109519B2 (en) * 2003-07-15 2006-09-19 3M Innovative Properties Company Bis(2-acenyl)acetylene semiconductors
US7304263B2 (en) * 2003-08-14 2007-12-04 Rapt Industries, Inc. Systems and methods utilizing an aperture with a reactive atom plasma torch
US20050130422A1 (en) * 2003-12-12 2005-06-16 3M Innovative Properties Company Method for patterning films
WO2006043848A1 (en) * 2004-10-15 2006-04-27 Yuri Konstantinovich Nizienko Method for modifying portions of a product surface layer and device for carrying out said method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180094781A (ko) * 2017-02-16 2018-08-24 제록스 코포레이션 Uv 경화된 잉크 하층의 전처리

Also Published As

Publication number Publication date
EP1825327A2 (en) 2007-08-29
US20060128165A1 (en) 2006-06-15
WO2006065474A2 (en) 2006-06-22
JP2008523618A (ja) 2008-07-03
WO2006065474A3 (en) 2006-10-05
CN101080670A (zh) 2007-11-28

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Date Code Title Description
PA0105 International application

Patent event date: 20070712

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid