KR20080016781A - 표면 개질에 의한 패턴화 방법 - Google Patents
표면 개질에 의한 패턴화 방법 Download PDFInfo
- Publication number
- KR20080016781A KR20080016781A KR1020077015909A KR20077015909A KR20080016781A KR 20080016781 A KR20080016781 A KR 20080016781A KR 1020077015909 A KR1020077015909 A KR 1020077015909A KR 20077015909 A KR20077015909 A KR 20077015909A KR 20080016781 A KR20080016781 A KR 20080016781A
- Authority
- KR
- South Korea
- Prior art keywords
- treatment
- substrate
- surface modification
- mask
- exposed portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2014—Contact or film exposure of light sensitive plates such as lithographic plates or circuit boards, e.g. in a vacuum frame
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/80—Constructional details
- H10K10/82—Electrodes
- H10K10/84—Ohmic electrodes, e.g. source or drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/60—Forming conductive regions or layers, e.g. electrodes
- H10K71/611—Forming conductive regions or layers, e.g. electrodes using printing deposition, e.g. ink jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0011—Pre-treatment or treatment during printing of the recording material, e.g. heating, irradiating
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/20—Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/010,846 US20060128165A1 (en) | 2004-12-13 | 2004-12-13 | Method for patterning surface modification |
| US11/010,846 | 2004-12-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20080016781A true KR20080016781A (ko) | 2008-02-22 |
Family
ID=36216851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020077015909A Withdrawn KR20080016781A (ko) | 2004-12-13 | 2005-11-22 | 표면 개질에 의한 패턴화 방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20060128165A1 (enExample) |
| EP (1) | EP1825327A2 (enExample) |
| JP (1) | JP2008523618A (enExample) |
| KR (1) | KR20080016781A (enExample) |
| CN (1) | CN101080670A (enExample) |
| WO (1) | WO2006065474A2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180094781A (ko) * | 2017-02-16 | 2018-08-24 | 제록스 코포레이션 | Uv 경화된 잉크 하층의 전처리 |
Families Citing this family (36)
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| JP4892209B2 (ja) * | 2005-08-22 | 2012-03-07 | 日立化成デュポンマイクロシステムズ株式会社 | 半導体装置の製造方法 |
| JP2007129007A (ja) * | 2005-11-02 | 2007-05-24 | Hitachi Ltd | 有機半導体膜を有する半導体装置の製造方法 |
| US7666968B2 (en) * | 2006-04-21 | 2010-02-23 | 3M Innovative Properties Company | Acene-thiophene copolymers with silethynly groups |
| US8083953B2 (en) | 2007-03-06 | 2011-12-27 | Micron Technology, Inc. | Registered structure formation via the application of directed thermal energy to diblock copolymer films |
| US8557128B2 (en) | 2007-03-22 | 2013-10-15 | Micron Technology, Inc. | Sub-10 nm line features via rapid graphoepitaxial self-assembly of amphiphilic monolayers |
| US8294139B2 (en) | 2007-06-21 | 2012-10-23 | Micron Technology, Inc. | Multilayer antireflection coatings, structures and devices including the same and methods of making the same |
| US7959975B2 (en) * | 2007-04-18 | 2011-06-14 | Micron Technology, Inc. | Methods of patterning a substrate |
| US8097175B2 (en) * | 2008-10-28 | 2012-01-17 | Micron Technology, Inc. | Method for selectively permeating a self-assembled block copolymer, method for forming metal oxide structures, method for forming a metal oxide pattern, and method for patterning a semiconductor structure |
| KR20100016643A (ko) * | 2007-04-19 | 2010-02-12 | 바스프 에스이 | 기판 상에 패턴을 형성하는 방법 및 그에 의해 형성된 전자 장치 |
| US8372295B2 (en) | 2007-04-20 | 2013-02-12 | Micron Technology, Inc. | Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method |
| US8404124B2 (en) | 2007-06-12 | 2013-03-26 | Micron Technology, Inc. | Alternating self-assembling morphologies of diblock copolymers controlled by variations in surfaces |
| US8080615B2 (en) | 2007-06-19 | 2011-12-20 | Micron Technology, Inc. | Crosslinkable graft polymer non-preferentially wetted by polystyrene and polyethylene oxide |
| US8999492B2 (en) | 2008-02-05 | 2015-04-07 | Micron Technology, Inc. | Method to produce nanometer-sized features with directed assembly of block copolymers |
| US8101261B2 (en) | 2008-02-13 | 2012-01-24 | Micron Technology, Inc. | One-dimensional arrays of block copolymer cylinders and applications thereof |
| US8425982B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Methods of improving long range order in self-assembly of block copolymer films with ionic liquids |
| US8426313B2 (en) | 2008-03-21 | 2013-04-23 | Micron Technology, Inc. | Thermal anneal of block copolymer films with top interface constrained to wet both blocks with equal preference |
| US8114301B2 (en) | 2008-05-02 | 2012-02-14 | Micron Technology, Inc. | Graphoepitaxial self-assembly of arrays of downward facing half-cylinders |
| KR100997185B1 (ko) * | 2008-09-17 | 2010-11-29 | 삼성전기주식회사 | 인쇄회로기판 수지의 표면 처리 방법 및 상기 방법에 의해처리된 인쇄회로기판 수지 |
| ITMI20110363A1 (it) * | 2011-03-09 | 2012-09-10 | Cretec Co Ltd | Metodo per ricavare un percorso conduttivo mediante irradiazione laser |
| US8900963B2 (en) | 2011-11-02 | 2014-12-02 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related structures |
| US9087699B2 (en) | 2012-10-05 | 2015-07-21 | Micron Technology, Inc. | Methods of forming an array of openings in a substrate, and related methods of forming a semiconductor device structure |
| US9229328B2 (en) | 2013-05-02 | 2016-01-05 | Micron Technology, Inc. | Methods of forming semiconductor device structures, and related semiconductor device structures |
| US9177795B2 (en) | 2013-09-27 | 2015-11-03 | Micron Technology, Inc. | Methods of forming nanostructures including metal oxides |
| KR20160068874A (ko) * | 2013-10-11 | 2016-06-15 | 쓰리엠 이노베이티브 프로퍼티즈 캄파니 | 플렉소그래픽 인쇄면의 플라즈마 처리 |
| WO2015097209A1 (en) * | 2013-12-23 | 2015-07-02 | Solvay Specialty Polymers Italy S.P.A. | Display devices |
| US20150257283A1 (en) * | 2014-03-06 | 2015-09-10 | Carolyn Rae Ellinger | Forming vertically spaced electrodes |
| US9244356B1 (en) | 2014-04-03 | 2016-01-26 | Rolith, Inc. | Transparent metal mesh and method of manufacture |
| WO2015183243A1 (en) | 2014-05-27 | 2015-12-03 | Rolith, Inc. | Anti-counterfeiting features and methods of fabrication and detection |
| CN104835721B (zh) * | 2015-03-31 | 2017-10-17 | 上海华力微电子有限公司 | 改善ArF光阻在硅片表面上的黏附性的方法 |
| CN108026291B (zh) | 2015-09-28 | 2021-04-13 | 3M创新有限公司 | 包含可裂解交联剂的图案化膜制品和方法 |
| CN107240544B (zh) * | 2017-05-04 | 2019-10-15 | 中国科学院宁波材料技术与工程研究所 | 一种图形化薄膜、薄膜晶体管及忆阻器的制备方法 |
| EP3556911A1 (fr) * | 2018-04-19 | 2019-10-23 | Comadur S.A. | Procédé de structuration d'un motif décoratif ou technique dans un objet réalisé en un matériau amorphe, semi-cristallin ou cristallin au moins partiellement transparent |
| CN108682627B (zh) * | 2018-05-18 | 2019-05-21 | 清华大学 | 图案化柔性有机薄膜及制备方法、层叠体及图案化方法 |
| US20220161586A1 (en) * | 2019-03-06 | 2022-05-26 | Axalta Coating Systems Ip Co., Llc | Controlled surface wetting resulting in improved digital print edge acuity and resolution |
| PT3835079T (pt) * | 2019-12-12 | 2023-10-30 | Akzenta Paneele Profile Gmbh | Película antidesgaste estruturada para impressão digital com nível de brilho ajustável |
| US20220162118A1 (en) * | 2020-11-23 | 2022-05-26 | Innolux Corporation | Method for preparing cover substrate |
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| US3906769A (en) * | 1973-05-02 | 1975-09-23 | Nasa | Method of making an insulation foil |
| US4338614A (en) * | 1979-10-22 | 1982-07-06 | Markem Corporation | Electrostatic print head |
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| US7459098B2 (en) * | 2002-08-28 | 2008-12-02 | Kyocera Corporation | Dry etching apparatus, dry etching method, and plate and tray used therein |
| US7098525B2 (en) * | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| US7309731B2 (en) * | 2003-06-02 | 2007-12-18 | Avery Dennison Corporation | Ink-receptive coatings, composites and adhesive-containing facestocks and labels |
| US7109519B2 (en) * | 2003-07-15 | 2006-09-19 | 3M Innovative Properties Company | Bis(2-acenyl)acetylene semiconductors |
| US7304263B2 (en) * | 2003-08-14 | 2007-12-04 | Rapt Industries, Inc. | Systems and methods utilizing an aperture with a reactive atom plasma torch |
| US20050130422A1 (en) * | 2003-12-12 | 2005-06-16 | 3M Innovative Properties Company | Method for patterning films |
| WO2006043848A1 (en) * | 2004-10-15 | 2006-04-27 | Yuri Konstantinovich Nizienko | Method for modifying portions of a product surface layer and device for carrying out said method |
-
2004
- 2004-12-13 US US11/010,846 patent/US20060128165A1/en not_active Abandoned
-
2005
- 2005-11-22 WO PCT/US2005/042307 patent/WO2006065474A2/en not_active Ceased
- 2005-11-22 KR KR1020077015909A patent/KR20080016781A/ko not_active Withdrawn
- 2005-11-22 EP EP05826648A patent/EP1825327A2/en not_active Withdrawn
- 2005-11-22 CN CNA2005800428441A patent/CN101080670A/zh active Pending
- 2005-11-22 JP JP2007545499A patent/JP2008523618A/ja not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180094781A (ko) * | 2017-02-16 | 2018-08-24 | 제록스 코포레이션 | Uv 경화된 잉크 하층의 전처리 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP1825327A2 (en) | 2007-08-29 |
| US20060128165A1 (en) | 2006-06-15 |
| WO2006065474A2 (en) | 2006-06-22 |
| JP2008523618A (ja) | 2008-07-03 |
| WO2006065474A3 (en) | 2006-10-05 |
| CN101080670A (zh) | 2007-11-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
Patent event date: 20070712 Patent event code: PA01051R01D Comment text: International Patent Application |
|
| PG1501 | Laying open of application | ||
| PC1203 | Withdrawal of no request for examination | ||
| WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid |