KR20080004569A - 보강 패드 - Google Patents

보강 패드 Download PDF

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Publication number
KR20080004569A
KR20080004569A KR1020077025467A KR20077025467A KR20080004569A KR 20080004569 A KR20080004569 A KR 20080004569A KR 1020077025467 A KR1020077025467 A KR 1020077025467A KR 20077025467 A KR20077025467 A KR 20077025467A KR 20080004569 A KR20080004569 A KR 20080004569A
Authority
KR
South Korea
Prior art keywords
adhesive
nonwoven fibrous
reinforcement
composition
pad
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020077025467A
Other languages
English (en)
Korean (ko)
Inventor
마이클 디. 스완
베르나르두스 제이. 시켈
Original Assignee
쓰리엠 이노베이티브 프로퍼티즈 컴파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 쓰리엠 이노베이티브 프로퍼티즈 컴파니 filed Critical 쓰리엠 이노베이티브 프로퍼티즈 컴파니
Publication of KR20080004569A publication Critical patent/KR20080004569A/ko
Withdrawn legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/203Adhesives in the form of films or foils characterised by their carriers characterised by the structure of the release feature on the carrier layer
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/21Paper; Textile fabrics
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35Heat-activated
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/20Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/204Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/304Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/26Presence of textile or fabric
    • C09J2400/263Presence of textile or fabric in the substrate
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/24Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24628Nonplanar uniform thickness material
    • Y10T428/24669Aligned or parallel nonplanarities
    • Y10T428/24694Parallel corrugations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Reinforced Plastic Materials (AREA)
KR1020077025467A 2005-04-04 2006-03-31 보강 패드 Withdrawn KR20080004569A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP05102617.7 2005-04-04
EP05102617A EP1710286A1 (en) 2005-04-04 2005-04-04 Reinforcement Pad

Publications (1)

Publication Number Publication Date
KR20080004569A true KR20080004569A (ko) 2008-01-09

Family

ID=34939114

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077025467A Withdrawn KR20080004569A (ko) 2005-04-04 2006-03-31 보강 패드

Country Status (6)

Country Link
US (1) US20090197051A1 (enExample)
EP (1) EP1710286A1 (enExample)
JP (1) JP2008534335A (enExample)
KR (1) KR20080004569A (enExample)
CN (1) CN101189316A (enExample)
WO (1) WO2006107812A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
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EP2014734A1 (de) 2007-07-12 2009-01-14 Peter Georg Berger Klebeband
CN102307725A (zh) * 2008-12-15 2012-01-04 3M创新有限公司 用于具有阻挡层的复合材料的贴面膜
WO2011149925A1 (en) * 2010-05-24 2011-12-01 Shaw Industries Group, Inc. Fiber-based carpet cushion with added resilience from vertically oriented fiber construction
BR112013009688A2 (pt) * 2010-10-21 2018-05-08 Univ Massachusetts dispositivos adesivos de uso prolongado com liberação fácil de alta capacidade
DE102011118501A1 (de) 2011-11-15 2013-05-16 Alzchem Ag Alkyl- oder Dialkyl-Semicarbazone als Härter für Epoxidharze
DE102011118760A1 (de) * 2011-11-15 2013-05-16 Alzchem Ag Verwendung von N,N'(-Dimethyl)-Uronen sowie Verfahren zur Härtung von Epoxidharz-Zusammensetzungen
WO2013109695A1 (en) 2012-01-19 2013-07-25 University Of Massachusetts Double- and multi-sided adhesive devices
EP2954018A4 (en) 2013-02-06 2016-09-07 Univ Massachusetts LOADING ADHESIVES WITH ADJUSTABLE ANGLES
US9603419B2 (en) 2013-03-15 2017-03-28 University Of Massachusetts High capacity easy release extended use adhesive closure devices
US12157250B2 (en) * 2016-03-21 2024-12-03 Bondcore öU Composite wood panels with corrugated cores and method of manufacturing same
EP3642292B2 (en) 2017-06-23 2025-07-02 DDP Specialty Electronic Materials US, LLC High temperature epoxy adhesive formulations
MX2022002659A (es) * 2019-10-07 2022-04-07 Fuller H B Co Metodo y articulo de cinta libre de husillo.
CN113043684A (zh) * 2021-04-13 2021-06-29 中国航空制造技术研究院 用于成型碳纤维复合材料导流壳体的压力垫及其制备方法

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Also Published As

Publication number Publication date
US20090197051A1 (en) 2009-08-06
EP1710286A1 (en) 2006-10-11
WO2006107812A1 (en) 2006-10-12
JP2008534335A (ja) 2008-08-28
CN101189316A (zh) 2008-05-28

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20071102

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid