KR20070115639A - Prober for electronic device testing on large area substrates - Google Patents

Abstract

A prober for an electronic device testing large substrates is provided to increase a process amount by minimizing a ventilation and pump stopping time by arranging at least two probers on a test chamber. A prober(205B) includes a frame(303) and six contact head assemblies(318). Plural motors(505) are arranged the frame through belts. The frame includes plural step portions(508A-508B), which change an orientation of the contact head toward a first position, parallel to the frame, and a second portion, normal to the frame. A first length(L1) is defined to form a movement range of the contact head assemblies along the frame. A second length(L2) is adjusted to be equal to or slightly smaller than a length or a width of a large substrate. An area(506), which is a difference between the first and second lengths, forms a storage area for the contact head assembly. The respective contact head assemblies are arranged not to be interfered by the substrate, during a test or transfer process.

Description

PROBER FOR ELECTRONIC DEVICE TESTING ON LARGE AREA SUBSTRATES}

1 is a perspective view of one embodiment of a test system.

2A is a side view of the test system shown in FIG. 1.

FIG. 2B is a perspective view of a portion of the test table shown in FIG. 2A.

3A is a top view of one embodiment of a substrate and two probers above the substrate.

3B is a plan view of one embodiment of a test position of the prober of FIG. 3A.

3C is a top view of another embodiment of a test position of the prober shown in FIG. 3A.

4A is a perspective view of one embodiment of a contact head assembly.

4B is a side view of one embodiment of a contact head assembly.

4C is a perspective view of the contact head of FIG. 4B.

5A is a perspective view of another embodiment of a prober.

5B is a partial perspective view of another embodiment of a prober.

6 is a perspective view of a lower portion of the contact head assembly.

7A-7H illustrate various embodiments of contact head positioning.

8A is a perspective view of a portion of the frame shown in FIG. 5B.

8B is a perspective view of another portion of the frame shown in FIG. 5B.

Explanation of symbols on the main parts of the drawings

100: test system 105: substrate

110: chamber 120: load lock chamber

122: vacuum pump 130, 136: port

135 valve 150 movable side wall

151: actuator 158: microscope

160: microscope assembly 200: internal volume

205A, 205B: Prover 210: Test Table

212: upper stage 214A, 114B: frame

215: Slot 218: End Effector

218A to 218C: finger 222: top

224: drive unit 240: support member

240A, 240B: prober support 241: end

290 test area

Embodiments of the present invention generally relate to test systems for substrates. More particularly, the present invention relates to an integrated test system for large area substrates in the manufacture of flat panel displays.

Flat panel displays, sometimes referred to as active matrix liquid crystal displays (LCD's), are widely known worldwide as a replacement for cathode ray tubes in the past. LCDs have several advantages over CRTs that include high image quality, light weight, low voltage requirements, and low power consumption. A few of the displays are mentioned in computer monitors, mobile phones and televisions.

One type of active matrix LCD includes a liquid crystal material inserted between a thin film transistor (TFT) array substrate and a color filter substrate to form a flat substrate. Generally, TFT substrates comprise an array of thin film transistors, each coupled to a pixel electrode, and the color filter substrate comprises different color filter portions and a common electrode. When a predetermined voltage is applied to the pixel electrode, an electric field is formed between the pixel electrode and the common electrode so that the liquid crystal material is oriented to allow light to pass through the particular pixel. Substrates used typically include large areas and many independent flat panel displays are formed on large area substrates, which are subsequently separated from the substrate during final fabrication.

Some manufacturing processes require testing large area substrates to determine the operability of the pixels in each flat panel display. Voltage image, charge image, optical image and electron beam testing are some of the processes used to monitor and adjust for defects during the manufacturing process. TFT response in the pixel is monitored to provide defect information. In one example of an electron beam test, a predetermined voltage is applied to the TFT so that the electron beam can be directed to the individual pixel electrode under irradiation. Second electrons emitted from the pixel electrode are sensed to determine the TFT voltage.

Test devices, such as prober assemblies, are generally used to apply or sense a voltage from a TFT by contacting a conductive area on a large area substrate. The prober assembly is applied at a constant size to test the specific configuration of the flat panel display disposed on the substrate. Prover assemblies typically have an area that is the same size or larger than the dimensions of the substrate, such that this large area of the prober assembly results in processing, transport, and storage problems. Prover assemblies are also generally designed to test one particular configuration of a flat panel display or product, where different prober assemblies are required each time the product is different. Since manufacturers typically manufacture many different products, this can increase the number of prober assemblies required, which in turn results in storage, transport, and processing problems.

Thus, there is a need for a prober assembly to perform large area tests that solve some of the problems described above.

Embodiments described herein relate to testing electronic devices on large area substrates. In one embodiment, a prober assembly is described. The prober assembly includes a frame and a plurality of contact heads operatively coupled to the frame, each contact head in a direction parallel to the frame, in a direction orthogonal to the frame, at a constant angle relative to the frame, And independently in their combined direction.

In yet another embodiment, a prober assembly is described. The prober assembly comprises a frame, a plurality of contact head assemblies operatively coupled to the frame, each contact head assembly comprising a contact head having a housing and a plurality of prober pins disposed on the bottom surface, each The contact head assembly is operated independently of the length of the frame and each contact head is operated relative to the housing.

In yet another embodiment, a test system for testing a rectangular large area substrate is described. The test system includes a test table having a test table sized to receive a substrate on which a plurality of electronic devices are located, and a prober assembly having a plurality of contact heads that selectively contact the electronic devices on the substrate, wherein the prober assembly includes a test table. It is operated along the length of the.

BRIEF DESCRIPTION OF THE DRAWINGS In order that the features of the invention described above may be understood in detail, reference may be made to the embodiments, which are more particularly detailed, briefly summarized above, some of which are illustrated in the accompanying drawings. However, the accompanying drawings show only typical embodiments of the invention, and therefore, are not to be considered as limiting the scope of the invention, and embodiments can be recognized which have other equivalent effects on the invention.

To facilitate understanding, the same reference numerals have been used to denote the same elements that are common to the figures. Elements disclosed in one embodiment may be beneficially used in other embodiments without particular citation.

The term substrate, as used herein, generally refers to a large area substrate made of glass, polymeric material, or other suitable substrate material from which the electronic device is formed. Various embodiments are described herein in connection with test electronics such as TFTs and pixels located on a flat panel display. Other electronic devices that can be tested on large area substrates include photovoltaic cells for solar cell arrays, organic light emitting diodes (OLEDs), among others. While the test procedure is described by way of example using an electron beam or charged particle emitter, certain embodiments described herein may be used on an optical device, charge sensing, or in a vacuum, or at or near atmospheric or atmospheric pressure. It may be effective to use another test device that is configured to test the device.

Embodiments described herein may refer to various drives, motors and actuators, which may be one or a combination of the following, such as air cylinders, piezoelectric motors, hydraulic cylinders, magnetic drives, stepper or servo motors, Screwed actuators, or other types of exercise devices that provide vertical, horizontal, or combinational movements thereof, or other devices suitable for providing at least a portion of the described motion.

The various configurations described herein can make independent movements in the horizontal and vertical planes. Vertical is defined as a movement orthogonal to the horizontal plane and will be referred to as the Z direction. Horizontal is defined as a movement orthogonal to the vertical plane, referred to as the X or Y direction, where the X direction is a movement orthogonal to the Y direction, and the Y direction is a movement orthogonal to the X direction. The X, Y, and Z directions are further formed with direction insertions included as required in the drawings to assist the reader.

1 is a perspective view of one embodiment of a test system 100 for testing the operability of an electronic device located on a large area substrate, for example, the large area substrate has dimensions of at least about 2200 mm × about 2600 mm. The test system 100 includes a test chamber 110, a load lock chamber 120, and a plurality of test columns 115 (seven are shown in FIG. 1), where the test columns are thin film transistors (TFTs). By way of example, as an electron beam column for testing electronic devices located on a large area substrate. A number of sensing devices (not shown) for sensing backscattered electrons are located adjacent to the test column 115 in the interior volume of the test chamber 110. Test system 100 can typically be located within a clean room environment or substrate processing equipment such as a conveyor system or robotic equipment that transports one or more large area substrates 105 into and out of test system 100. It may be part of a manufacturing system that includes. In one embodiment, the test system 100 also includes a microscope assembly 160 coupled to the top surface of the test chamber 110 to observe the area of interest on the large area substrate when the substrate is placed in the test chamber 110. Include.

The interior of the test chamber 110 is accessible through at least a valve 135 between the load lock chamber 120 and the test chamber 110. The interior may also be accessed by one or more movable sidewalls 150, each of which includes one or more actuators 151 to facilitate opening and closing of the movable sidewalls 150 or a combination thereof. . The movable sidewall 150 provides access for maintenance and inspection of the interior of the test chamber 110, such as a prober assembly (not shown) into and out of the test chamber 110. Or facilitate the delivery of further test devices. The movable sidewall 150 is configured to provide a vacuum seal for the test chamber 110 when closed by O-rings, gaskets, or the like. In another embodiment (not shown), the top surface of the test chamber 110 may facilitate opening and closing of access to the interior and / or delivery of one or more test devices. At least the top surface of the test chamber can be hinged to allow for up and down, lateral movement, or a combination thereof. One example of various configurations of an electron beam test system for testing large area substrates is described in US Patent No. 11 / 375,625, filed March 14, 2006 and published as US Patent Publication No. 2006/0244467 on November 2, 2006. US Patent No. 11 / 190,320, filed on July 27, 2005 and published as US Patent Publication No. 2006/0038554 on February 23, 2006, and entitled “Electronic Beam with Integrated Substrate Transfer Module. Test System, "US Patent No. 6,833,717, issued December 21, 2004, which is incorporated herein by reference.

The load lock chamber 120 is selectively sealable from the atmospheric environment and is typically coupled to one or more vacuum pumps 122 and the test chamber 110 is separated from the vacuum pump of the load lock chamber 120. It may be coupled to more vacuum pumps 122. Examples of various configurations of electronic beam test systems for testing large area substrates are described in US Patent Publication No. 2006/0244467, filed March 14, 2004, and US Patent No. 6,833,717, issued December 21, 2004. Which are incorporated herein by reference.

In one embodiment, the load lock chamber 120 receives the large area substrate 105 from the clean room environment through the inlet port 130, and from the load lock chamber 120 through the valve 135 to the test chamber 110. Transfer of the substrate to the substrate is facilitated and, conversely, the large area substrate is returned to the cleaning chamber environment. In yet another embodiment, the large area substrate 105 enters the test system 100 through the inlet port 130, and then from the load lock chamber 120 through the valve 135 to the test chamber 110. Transferred, the large area substrate is returned to the clean room environment through a port 136 coupled to the opposite end of the test chamber 110. Alternatively, one or more load lock chambers may be coupled in a direction orthogonal to the Y axis or the Y direction of the test chamber 110 to form a “U” type processing system or a “Z” type processing system (not shown). do. Other embodiments of the test chamber 110 and various embodiments of substrate inlet / outlet devices are described more fully in previously referenced US Patent Publication No. 2006/0244467.

The load lock chamber 120 may be a dual slot load lock chamber configured to facilitate the transfer of at least two large area substrates. US Patent No. 6,833,717, previously referenced for examples of a dual slot load lock chamber, and US Patent Publication No. 2006/0273815, filed December 8, 2005, and US Patent Application No. 12, 2007 60 / 911,496, all of which are incorporated herein by reference.

The embodiments referred to herein are used in test system 100 to test the operability of electronic devices on large area substrates as described above. The prober assembly used to facilitate testing of the electronic device is applicable to display various layouts on multiple large area substrates to minimize transfer of the prober assembly to the test chamber 110. Thus minimizing prober transport allows for greater throughput to the system. Two typical prober assemblies will now be described as available in test system 100.

FIG. 2A is a side view of the test system 100 shown in FIG. 1. The test chamber 100 is coupled to the load lock chamber 120, where the substrate 105 is disposed. The test chamber 110 includes an internal volume 200, which includes two prober assemblies, such as the test table 210 and the prober 205A and 205B, which are disposed on and move along the frame 214A. Include. The probers 205A, 205B are at least partially supported and run along the prober supports 204A, 204B on the opposite side of the test table 210 (only 240A is shown here). The test table 210 is driven through the length of the interior volume 200 along the frame 214A by a drive (not shown) coupled between the frame 214A and the test table 210. The probers 205A, 205B are movable along the length of the prober support 240 by a plurality of drives 224 coupled to one or both probers 205A, 205B and the prober supports 240A, 240B. do. In another embodiment (not shown), the interior volume 200 includes more than two prober assemblies, at least one prober assembly can be used or prepared for the test procedure, and the other prober assembly is internal Stored in volume 200.

In one embodiment, the test table 210 includes three substantially planar stages stacked on each other. In one embodiment, each of the three stages moves independently along an orthogonal axis, such as in the X, Y, and Z directions. Upper stage 212 includes multiple panels configured to support substrate 105 during testing and having slots therebetween to accommodate multiple fingers of end effector 214 (shown in FIG. 2B). . In one embodiment, the upper stage 212 moves in at least the Z direction and the end effector 214 extends laterally (Y direction) to transfer the substrate to and from the load lock chamber 120. . Detailed configuration of the end effector and test table can be found in US Patent Publication No. 2006/0244467, referenced above.

In one embodiment, the test system 100 is configured to transport a large area substrate 105 having electronic devices positioned thereon through a test procedure along a single direction axis, as shown in the figure in the Y direction. In particular, the substrate 105 moves in a unidirectional axis through the test area 290 formed by the addressing area of the plurality of test columns 115 on the substrate. In other embodiments, the test procedure and / or pre-test or post-test include combined motion along the X and Y axis. For example, the substrate 105 can be moved by one or both of the upper stage 212 and the end effector 218 to correct misalignment of the substrate position prior to testing. In another embodiment, the test procedure may include a Z direction motion provided by one or both of the test column 115 and the test tables 210.

Substrate 105 may be introduced into test system 100 along a substrate width or substrate length. The Y direction motion of the substrate 105 in the test system allows the system dimension to be slightly larger than the width or length dimension of the substrate 105. Movement of the support table along the unidirectional axis also eliminates or minimizes the drive required to move the support table in the X direction. The height of the load lock chamber 120 and the test chamber 110 can be minimized as a result of unidirectional movement. The reduced height in combination with the minimum width of the test system provides a smaller volume for the load lock chamber 120 and the test chamber 110. This reduced volume reduces pump stop and vent time in the load lock chamber 120 and test chamber 110.

The test chamber 110 also includes a top 222, which may include a microscope assembly 160, the microscope assembly being movably positioned over the viewing port 159 formed in the top 222. It includes. Observation port 159 is a transparent strip made of glass, plastic, quartz or other transparent material, and is configured to withstand the negative pressure that may optionally be present in the interior volume 200 of the test chamber 110. In one embodiment, one or both of microscope 158 and microscope assembly 160 move horizontally (in the X direction) to observe the area of interest on the substrate when the substrate is positioned below viewing port 159. In certain embodiments, microscope 158 includes a focus module (not shown) to allow adjustment to the depth of field.

In one embodiment, the probers 205A and 205B are provided to the test table 210 through one or more movable sidewalls 150 (FIG. 1). The probers 205A and 305B may be transferred to the test table 210 by means of a prober transfer device (not shown) to transfer them manually, or to the prober holes, or together from the clean room environment to the test table 210. have. In one embodiment, two or more probers may be provided to the test chamber for storage in internal volume 200 or for use in a test procedure. The prober 205A, 205B is at least partially supported by the prober support 240 along the opposite sides of the test table 210. The probers 205A and 205B are adapted to move horizontally (Y direction) along the lengths of the prober supports 240A and 240B, and are applied to test electronic devices located on the substrate 105.

FIG. 2B is a perspective view of a portion of the test table 210 shown in FIG. 2A. The substrate 105 is located on the upper stage 212 of the test table 210. Probes 205A and 205B are shown on the top surface of the prober support 240 over the substrate 105. The prober supports 205A and 205B are supported by the plurality of drives 224 coupled between the prober supports 240A and 240B and the sides of the probers 205A and 205B facing the prober supports 240A and 240B. Exercise along the length of. In one embodiment, the probers 205A and 205B include two drives 224 each (only one is shown in the figure), and the two drives allow movement along the prober supports 240A and 240B. . Drive 224 coupled to each prober 205A, 205B provides substantially the same maneuverability and / or substantially the same amount of momentum to move each prober along the length of the prober supports 240A, 240B. To be synchronized and / or monitored. In another embodiment, the drive unit 224 provides horizontal (Y direction) motion as well as vertical (Z direction) motion. In this embodiment, the prober 205A, 205B may be spaced apart from the top surface of the prober supports 240A, 240B.

Each drive 224 may also be between substrates 105, between displays (not shown) located on the substrate 105, and / or contact pads (not shown) located on the substrate 105. It can be operated individually to align them. The drive portion of the substrate 105, and / or display and contact pads positioned thereon, for the contact head assembly 318 disposed on the prober 205A, 205B, and / or the prober 205A, 205B. You can enhance the alignment. The probers 205A and 205B are coupled to a controller that provides adjustment information for the drive 224. The controller also provides adjustment information for the individual contact head assembly 318 to facilitate movement of the contact head assembly 318. The controller is also electrically coupled to each prober 205A, 205B to provide a sense signal from the forver pin to a plurality of prober pins (not shown) disposed on the contact head assembly 318. . Certain wires or connectors between the controller and the power supply (not shown) may facilitate movement of the prober 205A, 205B along the length of the prober supports 240A, 240B and / or test table 210. It may be supported by the tray 342.

In one embodiment, the drive 224 is configured such that the prober 205A, 205B is positioned between an idle position, a substrate transfer position, and a test position along the length of the prober supports 240A, 240B and / or test table 210. Makes it possible to exercise. As an example of the transport position, the probers 205A and 205B may be at a predetermined position along the prober supports 240A and 240B, and the Z-direction motion of the drive unit 224 may be directed to the probers 205A and 205B. Probes 205A, 205B are spaced away from substrate 105 and / or upper stage 212, providing rise to allow unobstructed rise and transfer of substrate 105. In another example of the transport position, the prober 205A, 205B may be moved to the idle position at the distal ends of the prober supports 240A, 240B. For example, the drive 224 coupled to the probers 205A, 205B is actuated to cause one or two probers 205A, 205B to move to the end 241 to be positioned away from the substrate 105. When the probers 205A and 205B are spaced and / or away from the substrate 105, the end effector 214 moves the substrate 105 to the upper stage 212 for transfer to the load lock chamber 120 (FIG. 2A). The substrate to be lifted from and to be tested may be transferred to the test table 210.

3A is a top view of one embodiment of two probers 205A, 205B supported over the substrate 105 by the substrate 105 and the prober support members 240A, 240B. The substrate 105 may be transferred and positioned on a test table 210 that is received within the test chamber 110, or the substrate 105 may be transferred to support the substrate 105 to linearly move the substrate 105. Positioned on a predetermined stage or test table. In one application, the test table 210 may be any stage or support that can support the substrate 105 to linearly move the substrate 105. Additionally or alternatively, the test table 210 can be stationary and the substrate 105 can be moved relative to the test table 21 in a straight direction. In certain applications, test chamber 110 and / or load lock chamber 120 may be optional when the test procedure does not require a vacuum device.

Substrate 105 is generally rectangular as display 330 _N and typically includes a large area for forming one or more flat panel devices or liquid crystal displays. Each of the display (330 _N) will typically comprise a plurality of conductive areas, such as each display (330 _N) the contact pad (330 _N) which is located adjacent to an outer peripheral of. The contact pads 323, 327 may be a single conductive contact point or may be a plurality of conductive contact points, sometimes referred to as pad blocks, arranged typically parallel to the outer edge of each display 330 _N. . Another example of contact pads 323, 327 may be a shorting bar located adjacent the perimeter of display 330 _N.

The contact pads 323, 327 are generally in electrical communication with the electronic device on adjacent displays 330 _N and may be formed or positioned adjacent to each display 330 _N. Each contact pad 323, 327 may be configured to provide a bonding point for fine wireless connections in final fabrication but may also be used to test the operability of each display 330 _N. For example, during testing of the display, contact pads 323 and 327 are selectively in electrical communication with a plurality of contact head assemblies 318 coupled to respective probers 250A and 250B. The contact pads 323, 327 are a number of prober pins 425 (FIGS. 4B-4C) disposed on the contact head assembly 318 that apply or sense a signal from a TFT on each display 330 _N. Provides an interface for The signal may be provided or transmitted by a controller coupled to the prober 250A, 250B electrically coupled to each prober pin 425 by a wire or cable. The contact pads may be provided substantially along the Y axis and / or substantially along the X axis of the substrate 105, such as contact pad 323 and contact pad 327, respectively.

In one embodiment, each display 330 _N includes a perimeter that includes four edges, and each contact pad 323, 327 is positioned slightly outside the perimeter of the display 330 _N. The contact pads 323, 327 may be substantially parallel to the edge or edges of the perimeter, or may form an angle from the display edge or edges. For example, the contact pad may be a number of contact points in a row or column, and the row / column may be a display 330 _N in an area where the row / column of the contact pad is not parallel to the edge of the display. Angle can be formed from the edge of. Contact pads (323, 327) that are shown along the upper corner of the display (330 _N), the contact pads can be disposed on a side portion or a predetermined corner of the display (330 _N).

In one embodiment, one or two probers 205A and 205B include multiple contact head assemblies 318 to simultaneously test all displays 330 _N in a column of substrate 105 width (X direction). Do it. For example, prober 205A or 205B may include four contact head assemblies 318 to make contact with contact pad 327 adjacent display 330 ₁ . In another example, the prober 205A, 205B may include four contact head assemblies 318 to make contact with the contact pads 327 adjacent to the display 330 ₁ . In yet another embodiment, the prober 205A, 205B includes a plurality of contact head assemblies 318 that contact all of the contact pads 323 and 327 in the column. In this example, the prober 205A, 205B may include eight contact head assemblies 318, or four contact head assemblies 318 shaped to contact the contact pads 323 and 327. . In another embodiment, the prober 205A, 205B has a predetermined number of contacts for contacting a plurality of contact pads 323, 327 coupled to each display 330 _N in a column of substrate width (X direction). And a plurality of contact head assemblies. For example, each prober 205A, 205B may include eight contact head assemblies 318 to test the display 330 _N in the column. In another example, each prober 205A, 205B may include six contact head assemblies 318 such that the column includes six displays 330 _N and / or six contact pad positions. Test the display 330 _N.

Substrate 105 may include any number or shape of articles that may be referred to as displays, and the articles may include any corresponding contact pad configuration for each display. In this example, the substrate 105 includes eight 40 inch displays 330 ₁ 330 ₂ and eight 32 inch displays 330 ₃ , 330 ₄ . Each display 330 _N may have a contact pad 323, a contact pad 327, or a combination thereof. The probers 205A and 205B allow testing of these product shapes and other product shapes that may be applied to various display and / or contact pad shapes.

Substrate 105 may include any number and layout of displays 330 _N configured to efficiently utilize the surface area of the substrate. For example, a manufacturer can produce multiple substrates 105 having various display and contact pad configurations. For example, the substrate 105 may include eight displays 330 _N , 15 displays 330 _N , six displays 330 _N , one display of eight displays 330 _N , and one display of different sizes. It may include eight display (330 _N), or one of the plurality of display size (330 _N) and one or more of the display (330 _N) of more different sizes.

Regardless of the product configuration on the substrate 105, each display 330 _N may include contact pads 323, 327 adjacent to each display 330 _N. The display 330 _N and / or contact pads 323, 327 are not substantially aligned with some substrates in the X and Y axes as shown in FIG. 3A. Instead, the displays 330 _N are somewhat staggered to efficiently use the surface area of the substrate. One example is described with reference to FIG. 3A.

As shown, columns 1 and 2 (displays 330 ₁ and 330 ₂ ) may be substantially aligned with respect to the X and Y axes, and may have contact pads 323, 327 substantially aligned. However, the spacing and alignment of columns 3 and 4 (displays 330 ₃ and 330 ₄ ) are not aligned with columns 1 and 2 with respect to the Y direction. In order to apply the prober 205A, 205B to this changed alignment, the prober 205A, 205B provides motion along at least the length of the frame 303 to adjust the alignment of the various displays 330 _N. A movable contact head assembly 318. The movable contact head assembly 318 also allows for coordination between substrates having different display and contact pad configurations. Embodiments described herein facilitate differentiation of substrates or testing of substrates by providing a prober having multiple contact head assemblies 318 for applying different configurations on the same or different substrates. The applicability of the probers 205A and 205B allows the test chamber to remain in production by minimizing or eliminating the prober transfer, which typically requires significant venting and pump down time of the test chamber.

Each prober 205A, 205B generally includes at least one frame 303 that connects the area between the prober supports 240A, 240B. The frame 303 may be of a number of structural shapes joined together by an integral structure or fasteners, bolts, screws, welds, or a combination thereof. In one embodiment, the frame has a structural shape in cross section and at least a portion of the frame may form a tubular longitudinal passage. Frame 303 may be made of a lightweight material such as metal, rigid or semi-rigid plastic, or a combination thereof. In one embodiment, the frame 303 comprises aluminum material.

When contact head assembly 318 is electrically coupled to display 330 _N via contact pads 323 and 327, a controller is provided to provide a signal to or receive a signal from an electronic device on substrate 105. Can be prepared. The test table 210 may be an electron beam column, charged particle emitters, charge sensing device, optics, charge coupling device, camera, and other devices capable of testing the operability of the electronic device on the substrate 105. It may be operated to move the upper stage 212 through the test area 290 formed by the qualitatively designated area of the test column (not shown). The test region 290 is configured to provide a qualitatively designated area above the substrate 105 that is sufficient to test the length or width of the substrate 105 as the substrate moves through the test region 290. In one embodiment, the test area 290 includes an area between about 1950 mm to about 2250 mm in the X direction and about 240 mm to about 290 mm in the Y direction. In yet another embodiment, the test area 290 is between about 1920 mm to about 2320 mm in the X direction and about 325 mm to about 375 mm in the Y direction. Additional information on the test area provided by the test column is described in US Patent Publication No. 2006/0244467, referenced above.

Although a test operation is described for testing four displays 330 _N per column, a predetermined number of displays 330 _N per column can be tested by adding an additional contact head assembly 318. In addition, a larger number of contact head assemblies 318 can be coupled to each prober 205A, 205B so that a given contact head assembly 318 is not required for testing, so that the length of the frame 303 Store or park along. In one example, each prober 205A, 205B may include six contact head assemblies 318 that run along the length of the frame 303 and test four displays 330 _N per column. If so, the two contact head assemblies 318 can park along the frame 303 so as not to interfere with the test. The six contact head assemblies 318 allow testing up to six displays 330 _N or below per column by storing or parking undesired contact head assemblies. When testing four displays 330 _N per column, contact head assemblies that are not required for the test order may be parked outside of the area of the display 330 _N being tested. For example, the unused contact head assembly 318 will be positioned outside of the perimeter of the display 330 _N in the column. This position may be along the edge of the substrate 105 or may be a predetermined position, and the contact head assembly 318 does not interfere with the designated area of the display 330 _N in the column.

In one embodiment, the probers 205A and 205B are configured and applicable to differ in the substrate display and contact pad arrangement by having the contact head assembly 318 actuated. For example, prober 205A and / or prober 205B may be configured to test the first substrate, such as the first substrate as shown in FIG. 3A. When the first substrate 105 is tested, the manufacturer may be one or more substrates having a substantially similar display and contact pad configuration as the first substrate 105. In this case, the prober 205A and / or prober 205B may remain in the test chamber 110 during the testing of each substrate similar to the first substrate 105 without reconfiguration. The prober 205A, 205B may require minimal adjustment to the alignment of the substrate being tested, but the pitch of the contact head assembly may remain substantially the same.

However, after testing one or more substrates having similar display and contact pad configurations to the first substrate 105, the manufacturer has yet another substrate having a different display and contact pad configuration that differs from the layout of the first substrate 105. Can wait. In such a case, the contact head assembly 318 may be configured for the substrate under test, while the chamber may be under vacuum by signal from the controller to the individual contact head assembly 318. The prober 205A and / or 205B may remain in the test chamber 110, invalidating the venting, opening, and pump down time of the test chamber into the clean room environment.

3B is a top view of one embodiment of test locations of probers 205A and 205B. As shown, prober 205B is in a test position for testing display 330 ₄ in column 4 and prober 205A is in a test position for testing display 330 ₃ in column 3. . To test display 330 _{4 in} column 4, contact pads 327 and contactor pins (FIGS. 4B-4C) on contact head 318 of prober 205B are brought into contact with each other. Such contact may be provided by vertical (Z direction) motion of one or both of the contact head 318 and the upper stage of the test table 210. In one embodiment, the substrate 105, which is supported on top of the upper stage 212, is perpendicular (to facilitate contact between the prober 205B and the prober pins coupled to the contact pad 327). In the Z direction).

In this example, a prober (205B) will be ready to be tested by operating the driving unit (224) coupled to the column (4) where (a display (330, _4)), the prober (205B) in the Y direction relative to the adjacent have. Prober (205A) may also be a location (the display (330 ₃₎₎ adjacent to the third column. When probers 205A and 205B are adjacent to columns 3 and 4, respectively, drive 224 coupled to each prober 205A and 205B can be stopped. Any alignment correction between prober 205A, 205B and substrate 105, or display 330 _3-4 may be corrected by actuating drive 224 as desired. Prober (205B) is a test of the display (330 ₄₎ to be set adjacent to the columns of the 4-position, and a portion of the prober (205B) in column 4, the substrate 105 passes through the test zone 290 and , which may be interference, it does not cover the display (330 _4). When in place, the contact head assembly 318 on the probers 205A, 205B is aligned and positioned with the contact head of the contact head assembly 318 relative to the contact pads 323 and / or 327 on the substrate 105. It may move laterally (X direction) on each frame 303 to facilitate setting. The contact head of contact head assembly 318 is in a position parallel to frame 303 as shown for prober 205B, or relative to frame 303 as shown for prober 205A. It can be operated further in an orthogonal position. When the contact head of the contact head assembly 318 is in place, the contact pads 323, 327 contact the prober pins on the contact head of the contact head assembly 318, and the test procedure is performed by the test table 210 and It can be started by moving the substrate 105 horizontally (in the Y direction) through the test region 290.

3C is a top view of another embodiment of a test position of prober 205A. As shown, the display 330 _3-4 located in columns 3 and 4 moves through the test area 290 and the display 330 _1-2 located in columns 1 and 2 moves the test area 290. I am ready to pass. Although not shown, prober 205B may be used to test display 330 _N located in one or both of columns 1 and 2, but in this example, prober 205B may be used in columns 1 and 2; It may not be used to test the positioned display 330 _1-2 . In this example, prober 205B may be located outside of test area 290 so as not to interfere with subsequent tests.

To prepare the display of the second column (330 ₂₎ for the test, the contact head 318 of the prober (205A) is positioned over the contact pad 327. Although not shown, the contact head 318 may be positioned over the contact pads 323, or the prober 205A may be positioned with a combination of contact pads 323 and 327 between the contact heads 318. It may be configured to allow contact. To test display 330 _{2 in} column 2, the prober pins and contact pads 323 on contact head 318 of prober 205B are brought into contact with each other. Such contact may be provided by vertical (Z direction) motion of one or both of the contact head 318 and the upper stage 212 of the test table 210. In one embodiment, the substrate 105 supported on the top surface of the upper stage 212 is perpendicular (Z) to facilitate contact between the contact pad 323 and the prober pins coupled to the prober 205A. Direction). Once electrical communication is established between the contact pad 323 and the prober pin coupled to the prober 205A via the contact head 318, the substrate 105 is placed under a plurality of test columns (not shown). 290 may be exercised through. Display of the first column (330 ₁₎ may be prepared to similarly tested as described above and not shown for the sake of brevity.

After testing all displays 330 _N , substrate 105 may be transferred from test chamber 110 to load lock chamber 120. Substrates with different displays and / or contact pad patterns may be waiting for testing and transfer to test chamber 110. During or before the transfer of the substrate, one or both of the prober assemblies may be ready for testing, and the test chamber 110 is under vacuum.

4A is a perspective view of one embodiment of contact head assembly 318 coupled to frame 303 of prober 205B. The contact head assembly 318 includes a housing 405 that is movable relative to the frame 303 and the housing 405 includes a contact head 402 that is movable relative to the housing 405. Contact head 402 includes a plurality of prober pins (not shown) for contacting a plurality of contact pads 323 and / or 327 on substrate 105 and contact head 402 at pivot point 408. It is movably coupled to the housing 405. The housing 405 is also coupled to a carriage 410 which moves the housing 405 linearly across the interface 415, which is part of the frame 303. When the interface moves laterally across the frame 303, the interface 415 can be a guide for the contact head assembly 318, or can include a ceramic strip and / or encoder tape.

To facilitate lateral movement of the contact head assembly 318, the contact head assembly 318 is coupled to a belt 412A that is coupled to an actuator (not shown in the figure) that is coupled to the frame 303. The other belts 412B, 412C are also shown to be coupled to another contact head assembly 318, not shown in the figure. The belt 412A, coupled to the contact head assembly 318, moves in the X direction to move the housing 405 relative to the frame 303 in the X direction. The frame also includes a cable tray 409 to support a cable 411 that is coupled to the contact head 402 through the housing 405. The cable 411 may be a ribbon cable that includes a fine wire connection to each of the prober pins (not shown) disposed on the contact head 402 and may also be used for other electrical connections used on the prober 205B. Include.

4B is a schematic diagram of one embodiment of a contact head assembly 318. Contact head 402 includes a body having a lower surface 429 that includes a plurality of prober pins 425. The plurality of prober pins may be one or more pogo pins, one or more needle pins, and combinations thereof. The plurality of prober pins 425 are in contact with a plurality of contact pads 323, 327 located on the substrate 105 (FIGS. 3A-3C) to test the mobility of the electronic devices located on the substrate.

Each of the prober pins 425 may each display (330 _N) detect the signal or signals, and the signal (s) from providing signals or signal to the device, and each of the display (330 _N) on the from controller to controller Provide it. In one embodiment, the prober pins 425 are optionally electrically connected together to a controller such that one signal can be communicated to each of the plurality of prober pins 425 or from each of the plurality of prober pins. In yet another embodiment, each of the plurality of prober pins 425 may be selectively and electrically coupled independently to the controller, where the plurality of signals are to or from the plurality of prober pins 425. Communicated individually. Optional coupling and separation may be provided by input from the controller. The prober pin 425 may also be configured to transmit and receive one or more signals as well as to discharge static electricity.

In one embodiment, each prober pin 425 may be connected to a pattern generator output in communication with the controller by a patch board assembly 450. Individual patch boards can be used to control the output to the prober pin assignments and can be configured for a particular display type. Thus, testing different display types may include selecting a particular patch board that is configured for the display being tested.

The contact head assembly 318 also includes a movable member 420 that extends from the bottom surface of the housing 405 to facilitate movement of the contact head 402 relative to the housing 405 and the frame 303 (FIG. 4A). Include. In one embodiment, the movable member 420 is coupled to the contact head 402 to facilitate the rotational movement of the contact head 402 relative to the frame 303. The movable member 420 is in contact with a biasing member disposed within the housing 405, as described with reference to FIGS. 6 and 7A-7H, at least in part, at least in part in response to a force provided. Direction).

In one embodiment, the contact head 402 may be movable relative to the housing 405 as described above with reference to FIG. 4A and may be movable vertically and / or rotationally relative to the housing 405. In one aspect, the contact head 402 is coupled to the housing 405 by a motor 418 (indicated by dashed lines). The motor 418 provides at least vertical movement in the direction of arrow A, but can also move to the contact head 402 in an angular orientation with respect to the housing 405. The vertical movement of the contact head 402 can be used to provide contact between the contact pads 323, 327 located on the substrate 105 (FIGS. 3A-3C) and the angular movement is the substrate 105. And / or enhanced alignment of the contact head 402 with respect to the contact pads 323, 327. The angular movement of the contact head 402 relative to the housing 405 may be a rotational or radial movement at the pivot point 408 to provide an angle of incidence with respect to the housing 405 and / or the frame 303 (FIG. 4A). Can be. Alternatively or additionally, the angular movement of the contact head 402 relative to the housing 405 may be in the direction indicated by arrow B, which aligns the contact head 402 with respect to the horizontal plane of the substrate 105. Can strengthen.

4C is a perspective view of the contact head 402 of FIG. 4B. Contact head 402 includes a bottom surface 429 having one or more rows of prober pins 425. The prober pins 425 may be disposed in the furnace as shown, or the prober pins 425 may be disposed in any suitable pattern on the lower surface 429. Individual prober pins 425 may be selected or may be selected to provide or detect a signal from the entire furnace contact pads 323, 327 (FIGS. 3A-3C). Alternatively, bottom surface 429 may include only one prober pin 425.

5A is a perspective view of another embodiment of a prober 205B. The prober 205B includes a frame 303 and six contact head assemblies 318. The prober 205B also includes a plurality of motors 505 disposed by the belt in the frame 303 including the plurality of motors 505. Frame 303 also has a number of positions that facilitate switching of the orientation of the contact head of contact head assembly 318 to and from a position parallel to frame 303 and perpendicular to frame 303. Step portions 508A to 508B. The frame 303 includes a length L ₁ that forms a range of motion of the plurality of contact head assemblies 318 along the frame 303. The frame also includes a length L ₂ , which may be slightly less than or equal to the length or width (not shown) of the large area. In one embodiment, the area 506, which may be the difference between the length L ₁ and the length L ₂ , forms the contact head assembly 318 storage area. In such embodiments, each contact head assembly 318 may be positioned outside of the length or width of the substrate in area 506 so as not to interfere with the testing or transfer of the substrate.

5B is a partial perspective view of another embodiment of prober 205B. The prober 205B includes a frame 303 having a first portion 515A and a second portion 515B. First portion 515A includes belts 412A through 412C and cable tray 409, and second portion 515B includes interface 415 and step portions 508A through 508B (only 508A is shown in the figure). A contact head assembly comprising a moving portion. The first portion 515A may also include a cover 509 that houses the belts 412A-412C and the cable tray 409.

Second portion 515B also includes channel 518 along length L ₁ (FIG. 5A). Channel 518 is configured to provide a passage for movable member 420 that is coupled to contact head assembly 318. Channel 518 is coupled to step portion 508A to facilitate contact between the plurality of stops 520 and movable member 420 in step portion 508A. As described below, each stop 520 extends above the plane of the channel 518 to facilitate switching of the orientation of the contact head 402.

6 is a perspective view of the bottom of the contact head assembly 318. The contact head assembly 318 includes a contact head 402 that is statically coupled to the rotatable switching extension 622 at the pivot point 408. The switching extension 622 may include one or more stops 520 shown in FIG. 5B and a movable member 420 as shown in FIG. 4B for contact at other stops along the length of the frame 303. Include. The contact head 402 may be selectively switched rearward and forward from position "A" substantially parallel to frame 303 and from position "B" (shown in dashed lines) substantially perpendicular to frame 303. Can be. Positions "A" and "B" may be monitored by contact of the sensor 628 with the switching extension 6220.

The switching extension 622 includes a lower portion 630 and the movable member 420 extends from the lower portion. The switching extension 622 also includes a fin 635 extending from the upper portion opposite the lower portion 630, a portion of which is shown in FIG. 6A. The pin 635 makes contact with the biasing member 620 when the housing 405 moves along the length of the frame 303. The pin 635 facilitates switching of the contact head 402 when the movable member 420 contacts the stop 520.

7A-7H are schematic views of various embodiments of contact heads positioned on probers 205A, 205B. The contact head 402 is coupled to the switching extension 622 and pin 630 extends from the switching extension to contact the biasing member 620 and the biasing member may be a spring or other device that provides a tension. Frame 303 is also shown schematically and includes a number of stops 520. The stop 520 may be disposed at a desired position along the length of the frame 303. Although not explicitly shown, the switching extension 622 includes a movable member 420 (FIGS. 4B, 5B and 6) which makes contact with the stop 520, the stop being schematically for clarity in the drawing. Shown, pin 630 shows contact with stop 520 to illustrate the switching concept. In one embodiment, the stop 520 is positioned at or near the center of the length of the frame 303, and at a location remote from the center, such as an opposite end of the frame 303.

The housing 405 is caused to move in the X direction along the frame 303 by belts (FIGS. 4A and 5B) and the contact head 402 is at a position parallel to the frame 303, or perpendicular to the frame 303. Or rotate at pivot point 408 between the positions arranged in a cantilever form. The X direction motion allows the contact head 402 to change orientation by moving the contact head 402 from a position arranged in a cantilever shape relative to the parallel position and vice versa. The change in the directional orientation of the contact head 402 can be provided under vacuum in the test chamber, minimizing pump down time and / or venting for the prober setup. For example, the housing 405 moves in the X direction so that the contact head 502 moves from a cantilever shaped position as shown in FIG. 7A, such that the end of the elongated member 522, in particular the movable member 420, moves. 4B, 6B, and 6 contact the stop 520 as shown in FIG. 7B. The pin 630 is also in communication with the biasing member 620 to facilitate the movement of the contact head 402.

The X-direction motion of the housing 405 continues until the biasing member 622 is compressed by the pin 630. X until the contact head 402 is redirected to the point where the biasing member 620 bounces back and the contact head 402 is pressed into a parallel position by the biasing member 620 as shown in FIG. 7D. Directional motion continues.

In order to reverse the positioning of the contact head 402, the housing 405 is operated in the X direction relative to the stop 520 as shown in FIG. 7F. Operation in the X direction continues until the biasing member 620 is at least partially compressed by the pin 630 as shown in FIG. 7G. Until the biasing member 620 is bounced and the contact head 402 is redirected to a point where the contact head 402 is pressed into a cantilevered position by the biasing member 620 as shown in FIG. 7H. Operation continues.

FIG. 8A is a perspective view of a portion of the frame 303 shown in FIG. 5B. Step portion 508A of frame 303 is shown having three stops 525A-525C extending above the plane of channel 518. Stops 525A-525C facilitate switching of contact heads (not shown) by providing a hard stop for movable member 420 (FIGS. 4B, 5B, and 6). Each stop 525A-525C is raised to a different height above the channel 518 to facilitate contact with some movable member 420 on a particular contact head assembly 318, while other movable on other contact head assemblies. The member 420 allows it to pass through without contact with the movable member 420.

Referring again to FIG. 5A, the frame 303 may include six contact head assemblies 318 as shown in FIG. 5A and the three contact head assemblies 318 may be one half of the length L ₂ . Can be operated along. In one embodiment, the contact head may be parked in a cantilevered position at portion 506 and may be switched in parallel orientation at step portion 508B. When the contact head is switched, the contact head assembly is moved relative to the frame 303 in a parallel orientation until the contact head assembly 318 is actuated towards the step portion 508A. For example, referring to FIG. 8A, the outermost or first contact head assembly 318 (not shown) is in a parallel orientation along the frame 303 in the + X direction approaching the step portion 508A. Can be exercised. Movable member 420 (FIGS. 4B, 5B, and 6) of outermost contact head assembly 318 passes over or is allowed to pass by stops 525B and 525C. However, the stop 525A is high for contacting the movable member 420 of the outermost contact head assembly 318 such that the housing of the contact head assembly 318 is as described with reference to FIGS. 7E-7H. Facilitates switching from parallel orientation to cantilevered or orthogonal orientation when continuously pressed in the X direction.

In addition, the second (middle) and third (innermost) contact head assemblies 318 can move in the X direction with the contact head in a parallel orientation to selectively orient the cantilever shape at the step portion 508A. Can be. The movable member 420 of the second contact head assembly 318 passes over or by the stop 525C to contact the stop 525B so that it is easily switched by continuous pressing in the + X direction. And the movable member 420 of the third contact head assembly 318 is in contact with the stop 525C so that it is easily switched by continuous pressing in the + X direction. The frame 303 is substantially symmetrical with respect to the step portion 508A, while not shown in the figure, the frame 303 includes two step portions 508A at opposite ends and faces the frame 303. Contact heads on the three contact head assemblies 318 disposed on the halves can be switched by operation of the housing 405 in the -X direction as shown in this figure. The opposing step portion 508A also includes a stop with a symmetrical feature to provide a switching point for the outermost, intermediate, and innermost contact head assembly 318 disposed on the opposing halves of the frame 303. . Each stop 525A-525C also includes a cutout area 550 to allow a large area for the movable member 420 when switching and rotation of the contact head's orientation is facilitated.

FIG. 8B is a perspective view of a portion of the frame 303 shown in FIG. 5B. Frame 303 includes a centerline 540 that forms half of frame 303. For the six contact head assemblies 318, three contact head assemblies 318 are disposed on the frame 303 to the left of the center line 540, and the three contact head assemblies 318 are attached to the center line 540. It is placed on the right side. The frame 303 also facilitates switching the orientation of the contact heads disposed on the contact head assembly 318.

When the contact head of the contact head assembly is switched in an orthogonal orientation as described above with reference to FIG. 8A, the contact head assembly 318 is in accordance with the side of the centerline 540 on which the contact head assembly 318 is disposed. It can be moved toward -508 direction or + X direction toward 508B. As shown in FIG. 8A, stop 527C may be flush with stop 527A and provide a stop for innermost contact head assembly 318 such that the contact head is easily switched to a parallel orientation. do. The movable member 420 allows the stop 527C to pass over or by the stops 527A, 527B to allow movement of the contact head. Stops 527A and 527B are similarly formed in stops 527A and 527B, respectively, to provide stops for each of the intermediate and outermost contact head assemblies 318. Continuous movement of the housing and the intermediate head assembly 318 in the X (+ X or -X) direction depending on which half the contact head assembly is disposed is parallel to the contact head as described in FIGS. 7A-7D from orthogonal orientation. Press to change to one orientation.

Embodiments described herein provide loading of two or more probers for use in a test operation in test chamber 110, where the test chamber is opened to a clean room environment, typically at or near atmospheric pressure. Various embodiments described herein increase throughput by minimizing venting and pump down time by providing two or more probers in test chamber 110 for storage and / or use in a test operation. The prober can be remotely configured for different substrate displays and / or contact pad arrangements and the test chamber 110 is under vacuum.

What has been described above relates to embodiments of the present invention, and other and further embodiments of the present invention may be invented without departing from the scope of the present invention and the scope of the present invention is determined by the following claims.

Various embodiments of the present invention increase throughput by minimizing venting and pump down time by providing two or more probers in test chamber 110 for storage and / or use in a test operation.

Claims (28)

As a prober assembly, Frame, and A plurality of contact heads operatively coupled to the frame, Each of the contact heads is independently oriented in a direction parallel to the frame, orthogonal to the frame, at an angle to the frame, or a combination thereof, Prober assembly. The method of claim 1, Each of the contact heads comprises a plurality of prober pins coupled to the bottom surface of the contact head, Device. The method of claim 1, The frame includes one or more motors, Device. The method of claim 3, wherein The motor is operatively coupled to at least one of the plurality of contact heads, Device. The method of claim 1, The frame includes a plurality of motors, Device. The method of claim 5, Each of the motors is coupled to a contact head of one of the plurality of contact heads, Device. The method of claim 1, Each of the plurality of contact heads is coupled to a motor, Device. The method of claim 1, Each of the contact heads is oriented in the parallel direction and movable in the parallel orientation with respect to the frame, Device. The method of claim 1, Each of the contact heads is oriented in the orthogonal direction and movable in the orthogonal orientation relative to the frame; Device. The method of claim 1, The frame includes one or more step portions having a plurality of stops for causing the direction of the contact head to be switched; Device. As a prober assembly, Frame, and A plurality of contact head assemblies movably coupled to the frame, Each of the contact head assemblies, Housing, and Has a contact head having a plurality of prober pins disposed on the bottom surface, Each of the contact head assemblies is operated independently of the length of the frame, and the contact heads are operated relative to each other, Prober assembly. The method of claim 11, Each of the contact heads is independently operated in a parallel direction to the frame and in an orthogonal direction to the frame, Device. The method of claim 11, Each of the contact heads is coupled to a motor, Device. The method of claim 11, Each of the contact heads is coupled to the motor by a belt, Device. The method of claim 11, The frame includes a plurality of stops to move the contact head relative to the housing, Device. The method of claim 11, The frame comprises six or more contact head assemblies, Device. A test system for testing large rectangular substrates, A test table sized to receive the substrate on which a plurality of electronic devices are located, and A prober assembly having a plurality of contact heads for selectively contacting the electronic device on the substrate, The prober assembly is operated along a length of the test table, Testing system. The method of claim 17, Each of the plurality of contact heads moves independently of one another, Testing system. The method of claim 17, The prober assembly moves in a first direction and the contact head moves in a second direction orthogonal to the first direction, Testing system. The method of claim 17, The prober assembly further includes a frame, the plurality of contact heads moving independently of the frame, Testing system. The method of claim 17, The prober assembly further comprises a frame and each of the plurality of contact heads is disposed in a parallel orientation with respect to the frame, a cantilever shaped orientation with respect to the frame, or a combination orientation thereof, Testing system. The method of claim 17, The prober assembly further includes a frame and each of the plurality of contact heads is movable relative to the frame in a parallel orientation with respect to the frame or a cantilevered orientation with respect to the frame, Testing system. The method of claim 17, Further comprising at least two prober assemblies operatively coupled to the test table by a motor, Testing system. The method of claim 17, A chamber in which the test table is disposed, and Further comprising a plurality of test columns coupled to the upper surface of the chamber, Testing system. The method of claim 24, The plurality of electronic devices are a plurality of thin film transistors, Testing system. The method of claim 25, The test table moves in a first direction through a test area and the prober assembly selectively moves in the first direction with the test table, Testing system. The method of claim 26, The prober assembly moves in the first direction irrespective of the movement of the test table, Testing system. The method of claim 17, The test table moves in a first direction through a test area and the prober assembly selectively moves in the first direction with or without the test table, wherein each of the plurality of contact heads comprises: Moving in a second direction orthogonal to one direction, Testing system.

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