KR20070098566A - 정전 척 - Google Patents

정전 척 Download PDF

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Publication number
KR20070098566A
KR20070098566A KR1020070029275A KR20070029275A KR20070098566A KR 20070098566 A KR20070098566 A KR 20070098566A KR 1020070029275 A KR1020070029275 A KR 1020070029275A KR 20070029275 A KR20070029275 A KR 20070029275A KR 20070098566 A KR20070098566 A KR 20070098566A
Authority
KR
South Korea
Prior art keywords
electrostatic chuck
adsorption
dielectric layer
elastic layer
glass substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020070029275A
Other languages
English (en)
Korean (ko)
Inventor
다다요시 요시카와
나오토 하야시
히로시 요네쿠라
미키 사이토
고키 다마가와
히토시 가네코
Original Assignee
신꼬오덴기 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 신꼬오덴기 고교 가부시키가이샤 filed Critical 신꼬오덴기 고교 가부시키가이샤
Publication of KR20070098566A publication Critical patent/KR20070098566A/ko
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070029275A 2006-03-29 2007-03-26 정전 척 Ceased KR20070098566A (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2006090717 2006-03-29
JPJP-P-2006-00090717 2006-03-29
JPJP-P-2006-00341355 2006-12-19
JP2006341355A JP4808149B2 (ja) 2006-03-29 2006-12-19 静電チャック

Publications (1)

Publication Number Publication Date
KR20070098566A true KR20070098566A (ko) 2007-10-05

Family

ID=38765131

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070029275A Ceased KR20070098566A (ko) 2006-03-29 2007-03-26 정전 척

Country Status (3)

Country Link
JP (1) JP4808149B2 (enrdf_load_stackoverflow)
KR (1) KR20070098566A (enrdf_load_stackoverflow)
TW (1) TW200800478A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200025901A (ko) * 2018-08-31 2020-03-10 이지스코 주식회사 고무 탄성체 다이아프램 타입 정전척 및 그 제조방법

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010182866A (ja) * 2009-02-05 2010-08-19 Nikon Corp 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法
JP5846186B2 (ja) * 2010-01-29 2016-01-20 住友大阪セメント株式会社 静電チャック装置および静電チャック装置の製造方法
TWI560803B (en) * 2014-06-13 2016-12-01 Mobile electrostatic chuck and manufacturing method of the same
DE102015210736B3 (de) * 2015-06-11 2016-10-27 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger
JP6642170B2 (ja) * 2016-03-23 2020-02-05 住友大阪セメント株式会社 静電チャック装置及びその製造方法
JP6808979B2 (ja) * 2016-06-01 2021-01-06 株式会社リコー 入力素子及び入力装置
US10899605B2 (en) * 2018-03-05 2021-01-26 Sharp Kabushiki Kaisha MEMS device and manipulation method for micro-objects
KR102292501B1 (ko) * 2019-01-24 2021-08-23 김순훈 정전척
JP7128534B2 (ja) * 2020-05-26 2022-08-31 Ａｉメカテック株式会社 基板組立装置及び基板組立方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0422153A (ja) * 1990-05-17 1992-01-27 Tokyo Electron Ltd 静電吸着装置
JP3805134B2 (ja) * 1999-05-25 2006-08-02 東陶機器株式会社 絶縁性基板吸着用静電チャック
JP3599634B2 (ja) * 2000-04-10 2004-12-08 信越化学工業株式会社 イオン注入機用静電チャック
US20070223173A1 (en) * 2004-03-19 2007-09-27 Hiroshi Fujisawa Bipolar Electrostatic Chuck

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20200025901A (ko) * 2018-08-31 2020-03-10 이지스코 주식회사 고무 탄성체 다이아프램 타입 정전척 및 그 제조방법

Also Published As

Publication number Publication date
TW200800478A (en) 2008-01-01
JP2007294852A (ja) 2007-11-08
JP4808149B2 (ja) 2011-11-02

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