GB2476840A

GB2476840A - Electronic paper display panel and associated method of manufacture

Info

Publication number: GB2476840A
Application number: GB1002048A
Authority: GB
Inventors: Jae Chan Lee; Chang Soo Lim; Hak Sun Kim; Yong Gil Namgung; Su Hwan Cho; Keun Hwa Jung; Hyun Hak Kim
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2010-01-06
Filing date: 2010-02-08
Publication date: 2011-07-13
Anticipated expiration: 2030-02-08
Also published as: FR2954993A1; GB201002048D0; GB2476840B; KR101148467B1; CN102116987A; KR20110080559A

Abstract

Disclosed herein are an electronic paper panel, a method of manufacturing the same, and an electronic paper display device having the same.The electronic paper panel 100 comprises a flexible substrate 110 having a segment electrode 111 disposed on the upper surface of a base layer 116, a wire layer 114 is disposed on the lower surface of the base layer and is electrically connected to the segment electrode through a via hole 115, a pad unit 113 disposed on the lower surface of the flexible substrate is electrically connected to the wire layer, an electronic paper film 120 is electrically connected to the segment electrode and is bonded to the upper surface of the flexible substrate, the electronic paper film may comprise a layer 121 of electrophoretic, twist ball (gyricon) or microcapsule material, a driving chip 130 is electrically connected to the pad unit and is disposed on the lower surface of the flexible substrate.

Description

ELECTRONIC PAPER PANEL, METHOD OF MANUFACTURING THE SAME AND ELECTRONIC PAPER blsPtAY DEVICE HAVING THE SAME

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to an electronic paper display device, and more particularly, to an electronic paper panel that mounts an electronic paper film and a driving chip on one substrate, a method of manufacturing the same, and an electronic paper display device having the same.

2. Description of the Related Art

As a next generation display device, a liquid crystal display (LCD), a plasma display panel (PDP), an electro luminescence display, an electronic paper display device, etc. have been widely distributed.

Among others, the electronic paper display device may be flexibly bent and is very cheap in manufacturing costs compared to other display devices.

Further, since the electronic paper display device does not require background illumination or continuous recharge, it can be driven with very small energy, having significantly excellent energy efficiency.

Moreover, since the electronic paper display device has a dear and wide viewing angle and a memory function that allows displayed characters or images not to completely disappear although a power supply is instantly blocked, it is expected to be widely used in broad fields, for example, print media such as books, newspapers or magazines, foldable screens, electronic wallpapers, etc. Meanwhile, the electronic paper display device may include an electronic paper film, a substrate that has an electrode applying power to the electronic paper film, a driving chip that applies a driving signal to the electronic paper film, a chip on film (COF) that supports the driving chip, and a main board that is electrically connected to the dnving chip.

Herein, the driving chip is electrically connected to a printed circuit board and the main board and is supplied with the driving signal from the main board, making it possible to apply the driving signal to the electronic paper film through the pnnted drcu board.

At this time, the printed circuit board and the COF or the COF and the main board may be electrically connected to each other by an anisotropic conducve film (ACF) bonding process. Therefore, the ACF bonding process should be performed at least twice in order to manufacture the electronic paper display device, such that the manufacturing process of the electronic paper display device becomes complicated and product costs increase due to the use of ACF material.

SUMMARY OF THE INVENTION

The present invention proposes to solve the problems that may be generated from an electronic paper display device. More specifically, an object of the present invenon is to provide an electronic paper panel that mounts an electronic paper film and a driving chip on one substrate, a method of manufacturing the same, and an electronic paper display device having the same.

An object of the present invenon is to provide an electronic paper panel. The electronic paper panel may be configured to indude: a fledble substrate that indudes at least one segment electrode that is disposed on the upper surface of a base layer for defining an image, a wire layer that is disposed on the lower surface of the base layer and is electrically connected to the segment electrode, and a pad unit that is disposed on the lower surface of the flexible substrate and electrically connected to the wire layen an electronic paper film that is electrically connected to the segment electrode and is bonded to the upper surface of the flexible substrate; and a driving chip that is mounted on and electrically connected to the pad unit on the lower surface of the flexible substrate.

Herein, the electronic paper panel may include a via that penetrates through the base layer and electrically connects the segment electrode to the wire layer.

The electronic paper panel may further include a conductive adhesive member that is interposed between the electronic paper film and the segment electrode.

The electronic paper film may include an electronic paper layer, a common electrode that is disposed on the electronic paper film, and a protecfing layer that is disposed on the common electrode.

Further, the electronic paper panel may further include a resist layer that is attached to the lower surface of the flexible substrate.

* Another object of the present invention is to provide a method of manufacturing an electronic paper panel. The method of manufacturing the electronic paper panel may include: * forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, a wire layer that is disposed on the lower surface of the base layer and is electrically connepted to the segment electrode, and a pad unitthat is electrically connected to the wire layer bonding an electronic paper film to the upper surface of the flexible substrate so that it is electrically connected to the segment electrode; and mounting a driving chip on the lower surface of the flexible substrate so that it is electrically connected to the pad unit.

* Herein, the forming the flexible substrate may include: providing the base layer that has a conductive layer on both sides thereof; forming a via hole that penetrates through the base layer forming a via that has an interlayer connection with a plating layer on the both sides of the base layer including the via hole; and forming the segment electrode, the wire layer, and the pad unit by selectively etching the plating layer.

The forming the flexible substrate may include: forming the via hole that penetrates through the base layer; forming the via for the interlayer connection inside the via hole; and forming the segment electrode, the wire layer, and the pad unit by an inkjet printing method.

The driving chip may be mounted using any one of a flip-chip bonding method and a wire bonding method.

The bonding the electronic paper film may include using a conductive adhesive member.

The method of manufacturing the electronic paper panel may further include forming a resist layer ori the lower surface of the flexible substrate.

Still another object of the present invention is to provide a method of manufacturing an electronic paper panel. The method of manufacturing the electronic paper panel may include: forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, and a wire layer and a pad unit that are disposed on the lower surface of the base layer by performing a via hole forming process, a plating process, and an etching process on the base layer bonding an electronic paper film to the upper surface of the flexible substrate so that it is electrically connected to the segment electrode; and mounting a driving * chip on the lower surface of the flexible substrate so that it is electrically connected to the pad unit.

Herein, the base layer may have a conductive layer on at least one surface thereof.

The via hole forming process may be performed by laser processing.

Still another object of the present invention is to provide a method of manufacturing an electronic paper panel. The method of manufacturing the electronic paper panel may include: forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, and a wire layer and a pad unit that are disposed on the lower surface of the base layer by performing a via hole forming process and an inkjet printing process on the base layer; bonding an electronic paper film to the upper surface of the flexible substrate so that it is electrically connected to the segment electrode; and mounting a driving chip on the lower surface of the flexible substrate so that it is electrically connected to the pad unit.

Herein, the forming the flexible substrate may include forming a via that electrically connects the segment electrode to the wire layer by a plating process.

The forming the flexible substrate may indude forming a via that electrically connects the segment electrode to the wire layer by the inkjet printing process.

Still another object of the present invention is to provide an electronic paper display device. The electronic paper display device may be configured to include: an electronic paper panel that includes a flexible substrate that includes at least one segment electrode that is disposed on the upper surface of a base layer for defining an image, a wire layer that is disposed on the lower surface of the base layer and is electrically connected to the segment electrode, and a pad unit that is disposed on the lower surface of the flexible substrate and electrically connected to the wire layer an electronic paper film that is electrically connected to the segment electrode and is bonded to the upper surface of the flexible substrate; and a driving chip that is mounted on and electrically connected to the pad unit on the lower surface of the flecble substrate; and a case that receives the electronic paper panel having regions bent to face each other.

Herein, the electronic paper display device may further indude a main board that is electrically contacted to the flexible substrate and is disposed on the bottom surface of the case; and a reinforcing member that is interposed between the flexible substrate and the main board.

The electronic paper display device may further include a moisture shielding member that is interposed between the case and the electronic paper film along the edge of a display region disposed on the electronic paper panel.

The electronic paper display device may further include a via that electrically connects the segment electrode to the wire layer.

The electronic paper display device may further include a conductive adhesive member that is interposed between the electronic paper film and the segment electrode.

The driving chip may be disposed between the flexible substrate regions that are bent to face each other.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of an electronic paper panel according to a first embodiment of the present invention; FIG. 2 is a plan view of a flexible substrate of FIG. 1; FIG. 3 is a cross-sectional view of a portion of the electronic paper panel of FIG. 1; FlG 4 is a cross-sectional view of an electronic paper display device according to a second embodiment of the present invention; FIGS. 5 to 8 are cross-sectional views explaining manufacturing processes of an electronic paper panel according to a third embodiment of the present invention; and FIGS. 9 to 11 are cross-sectional views explaining manufacturing processes of an electronic paper panel according to a fourth embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, the exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings of an electronic paper display device. The exemplary embodiments of the present invention to be described below are provided so that those skilled in the art to which the present invention pertains can fully carry out the present invention. Therefore, the present invention may be modified in many different forms and it should not be limited to the embodiments set forth herein. In the drawings, the thickness and the size of the device may be exaggerated for convenience. Like reference numerals designate

like components throughout the specification.

FIG. 1 is a plan view of an electronic paper panel according to a first embodiment of the present invention.

FIG. 2 is a plan view of the flexible substrate of FIG. 1.

FIG. 3 is a cross-sectional view of a portion of the electronic paper panel of FIG. 1.

Refemng to FIGS. 1 to 3, an electronic paper panel according to a first embodiment of the present invention may be configured to include a flexible substrate 110, a segment electrode 111, a wire layer 114, an electronic paper film 120, and a driving chip 130.

The flexible substrate 110 may include a first region 11 Oa and a second region 11 Ob that is disposed at one side of the first region 11 Oa. Herein, the first region 11 Oa may be a display region on which an image is displayed.

Herein, the plurality of segment electrodes 111 are disposed on the upper surface of the first region 1 lOa. At least one segment electrode 111 is required for defining the shape of an image.

Further, the wire layer 114 that is electrically connected to the segment electrode 111 may be disposed on the lower surface of the first region llOa. At this time, the segment electrode 111 and the wire layer 114 may be electrically connected to each other through a via 115.

Further, a pad unit 113 that is electrically connected to the wire layer 114 is disposed on the lower surface of the second region 11 Ob. Herein, the pad unit 113 may be electncally connected to the driving chip 130 to be described later.

The flexible substrate 110 may use a flexible film as a base layer 116. Herein, as the material that forms the base layer 116, there may be, for example, polyethylene terephthalate (PET), polypropylene (PP), epoxy resin, glass epoxy (GE), cellulosic resin, polyester resin, ceramic resin, etc. However, the above-mentioned materials of the base layer are provided in the embodiment of the present invention by way of example. Therefore, any flexible material may be used.

In addition, the flexible substrate 110 may further include a common electrode pad 112 that is disposed on the upper surface of the second region 11 Ob. Further, the flexible substrate may further include a resist layer 150 that is disposed on the lower surface so as to protect the wire layer 114 and secure insulation between the flexible substrate 110 and a main board.

The electronic paper film 120 may be disposed on the upper surface of the first region 11 Oa. At this time, the electronic paper film 120 may be electrically connected to the segment electrode 111.

The electronic paper film 120 may include an electronic paper layer 121, a common electrode 122, and a protecting layer 123 that are stacked in sequence.

Herein, the electronic paper layer 121 may be driven by the voltage applied between the segment electrode 111 and the common electrode 122, thereby displaylng an image.

Herein, as the form of the electronic paper layer 121, there may be, for example, an electrophorec form, a microcapsule form, a twist ball form, etc. Further, the common electrode 122 may be formed of a transparent electrode, for example, an ITO. At this time, the common electrode 122 may be electrically connected to the common electrode pad 112, thereby being applied with common voltage from the outside.

Further, the protecting layer 123 can protect the surface of the electronic paper film 120 from the outside. At this time, the protecting layer 123 may be made of transparent material, As the transparent material, there may be, for example, polyethylene terephthalate (PET), polyvinyl alcohol (PVA), polyethylene (PE), polycarbonate (PC), polyacrylate, polymethylmethacrylate, polyurethane, cellulose acetate butyrate (CAB), etc. However, the above-mentioned materials of the protecng layer 123 are provided in the embodiment of the present invention by way of

example.

The electronic paper film 120 and the flexible substrate 110 may be electrically connected to each other by a conductive adhesive member 140 interposed therebetween.

Herein, as the conductive adhesive member 140, there may be, for example, an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), etc. The driving chip 130 may be electrically connected and mounted to the pad unit 113 that is formed on the lower surface of the second region 11 Ob of the flexible substrate 110.

Herein, the electrical connection between the driving chip 130 and the pad unit 113 may be made by a wire bonding method or a flip-chip bonding method.

Herein, when the electronic paper panel 100 is received in a case, the lower surface of the second region 11 Ob and the lower surface of the first region 11 Oa of the flexible substrate may be folded to face each other. At this me, the driving chip 130 is disposed on the lower surface of the flexible substrate 110, such that the driving chip 130 may be disposed between the regions of the flexible substrate 110 that are folded to face each other. As a result, the driving chip 130 can be protected from external impact or pollution.

Accordingly, with the first embodiment of the present invenUon as described above, the electronic paper film and the driving chip are mounted on one substrate, thereby making it possible to simplify a manufacturing process and reduce the manufacturing costs of the electronic paper panel due to the reduction in material costs.

Further, the electronic paper panel has the flexible substrate, thereby making it possible to implement a flexible display device.

Hereinafter, an electronic paper display device having the electronic paper panel according to the first embodiment of the present invention will be descnbed in detail. Herein, the repetitive description of the first embodiment will be omitted from a second embodiment and the same reference numerals will be given to the same constitutions.

FIG. 4 is a cross-sectional view of an electronic paper display device according to a second embodiment of the present invention.

Referring to FIG. 4, the electronic paper display device according to the second embodiment of the present invention may be configured to include an electronic paper panel and a case 200.

The electronic paper panel 100 may include a flexible substrate 110, an electronic paper film 120, and a driving chip 130.

Herein, the flexible substrate 110 may include a segment electrode 111 (FIG. 3) that is disposed on the upper surface thereof, a wire layer 114 (FIG. 3) that is disposed on the lower surface thereof and is electrically connected to the segment electrode 111, and a pad unit 113 * (FIG. 3). At this time, the segment electrode 111 and the wire layer 114 may be electrically connected to each other through a via 115 (FIG. 3) that penetrates through a base layer 116 of the flexible substrate 110.

Further, the electronic paper film 120 may be electrically connected to the segment * electrode 111 and be bonded to the upper surface of the flexible substrate 110.

Moreover, the driving chip 130 may be electrically connected to the pad unit 113 and be mounted on the lower surface of the flexible substrate 110.

The electronic paper panel 100 may be received inside the case 200, while a portion thereof being folded. Herein, the driving chip 130 is disposed on the lower surface of the flexible substrate 110, such that the driving chip 130 may be disposed between regions of the flexible substrate 110 that are folded to face each other. In other words, the driving chip 130 may be disposed inside the electronic paper panel 100, thereby making it possible to be protected from external environment or impact.

Herein, the driving chip 130 may be disposed to correspond to the side surface of the case 200, thereby making it possible to reduce electncal effects by the main board 300 to be described later and be stably fixed to the inside of the case 200. However, the position of the driving chip 130 inside the case 200 is provided in the embodiment of the present invention by way of example. Therefore, the driving chip 130 may be disposed to correspond to the bottom surface of the case 200.

In addition, the electronic paper display device may further indude the main board 300 that is electrically contacted to the flexible substrate 110 and is disposed on the bottom surface of the case 200. Herein, the lower surface of the folded flexible substrate 110 and the main board 300 may be electrically connected to each other by an ACF bonding method. Thereby, the main board 300 can apply a driving signal to the electronic paper film 120 by the driving chip 130.

Further, the electronic paper display device may further include a reinforcing member 400 that is interposed between the flexible substrate 110 and the main board 300. The reinforcing member 400 is disposed in a separate space between the flexible substrate 110 and the main board 300 so that may support and fix the flexible substrate 110 on the main board 300. Herein, the reinforcing member 400 may be made of material that may stably support the flexible substrate 110, for example, sponge.

Further, the electronic paper display device may further include a moisture shielding member 500 thatis interposed between the case 200 and the electronic paper panel 100 along the edge of a display region that is disposed on the electronic paper panel 100 and displays an image. The moisture shielding member 500 can prevent moisture from being infiltrated into the inside of the case 200 from a gap between the electronic paper panel 100 and the case 200.

Herein, the moisture shielding member 500 may be made of elastic material in order to completely seal the gap between the electronic paper panel 100 and the case 200. As the elastic material, there may be, for example, silicone rubber, acrylic rubber, epoxy rubber, urethane rubber, etc. Therefore, with the electronic paper display device according to the embodiment of the present invention, the driving chip is surrounded by the flexible substrate and is disposed inside the case so that the driving chip can be protected from the outside, thereby making it possible to secure reliability of the electronic paper panel.

Hereinafter, referring to FIGS. 5 to 8, a manufacturing process of an electronic paper panel according to a third embodiment of the present invention will be described.

FIGS. 5 to 8 are cross-sectional views explaining manufacturing processes of an electronic paper panel according to a third embodiment of the present invention.

Referring to FIG. 5, in order to manufacture the electronic paper panel, the base layer 116 having conductive layers 11 6a on both sides thereof is provided.

Herein, as the material that forms the base layer 116, there may be, for example, polyethylene terephthalate (PET), polypropylene (PP), epoxy resin, glass epoxy (GE), cellulosic resin, polyester resin, ceramic resin, etc. However, the above-mentioned materials of the base layer 116 are provided in the embodiment of the present invention by way of example.

Therefore, any flexible material may be used.

Then, a via hole 115a that penetrates through the conductive layer 116a and the base layer 116 is formed. At this time, the via hole 11 5a may be formed by laser processing by which fine processing can be performed. The via hole 11 5a may also be formed by a mechanical drilling method.

The conductive layer 11 6a is disposed on both sides of the base layer 116 in the embodiment of the present invention by way of example, but the present invention is not limited thereto. For example, the conductive layer 11 6a may also be disposed on one surface of the base layer 116.

Referring to FIG. 6, a plating layer 116b is formed, by a plating process, on the conductive layer 11 6a and the base layer 116 in which the via hole 11 5a is formed. A via 115 for an interiayer connection may also be formed dunng the process of forming the plating layer 11 6b. Herein, the plating layer 11 6b may be made of conductive material, for example, copper or silver. Thereafter, although not shown in the drawing, a resist pattern is formed on the plating layer 11 6b and then the plating layer 11 6b is selectively etched using the resist pattern as an etching mask, thereby making it possible to form a segment electrode 111, a wire layer 114, and a pad unit 113, as shown in FIG. 7. Thereby, a flexible substrate 110 may include the segment electrode 111 that is disposed on the upper surface of the base layer 116, and the wire layer 114 and the pad unit 113 that are disposed on the lower surface of the base layer 116, wherein the segment electrode 111, the wire layer 114, and the pad unit 113 are electrically connected to each other though the via 115.

Therefore, the process of forming the via hole, the plating process and the etching process are sequentially performed on the base layer 116 that includes the conductive layer 11 6a on at least one surface thereof, thereby making it possible to manufacture the flexible substrate 110.

In addition, a resist layer 150 may further be formed on the lower surface of the flexible substrate 110. The resist layer 150 may be formed by attaching a film of insulating material or by coating insulating resin.

Referring to FIG. 8, after the flexible substrate 110 is manufactured, a conductive adhesive member 140 is attached to the flexible substrate 110. Then, an electronic paper film is pressurized and compressed on the conductive adhesive member 140, thereby making it possible to bond the electronic paper film 120 to the flexible substrate 110. At this time, the segment electrode 111 and the electronic paper film 120 of the flexible substrate 110 may be electrically connected to each other by the conductive adhesive member 140.

Herein, as the conductive adhesive member 140, there may be, for example, an anisotropic conductive film (ACF), an anisotropic conductive paste (ACP), etc. Then, a driving chip 130 may be mounted so that it is electrically connected to the pad unit 113 on the lower surface of the flexible substrate 110. Herein, the electrical connection between the driving chip 130 and the pad unit 113 may be made by a wire bonding method or a flip-chip bonding method. Herein, in order to manufacture the electronic paper display device, a portion of the electronic paper panel 100 may be received inside a case, while the lower surfaces of the flexible substrate 110 are folded to face each other. At this time, the driving chip is disposed on the lower surface of the flexible substrate 110, such that it can be disposed inside the folded electronic paper panel 100. Therefore, the driving chip 130 can be suffideny protected from the outside, while or after the electronic paper display device is manufactured.

Therefore, with the embodiment of the present invention as descnbed above, the electronic paper film and the driving chip are mounted on one substrate, thereby making it possible to simplify the manufacturing process and reduce manufacturing costs due to reduction in ACF material.

Hereinafter, with reference to FIGS. 9 to 11, a manufacturing process of an electronic paper panel according to a fourth embodiment of the present invention will be described.

Herein, the fourth embodiment will perform the same manufacturing process as that in the aforementioned third embodiment, excepting the process of forming the segment electrode and the wire layer. Therefore, the repetitive description of the third embodiment will be omitted from the fourth embodiment.

FIGS. 9 to 11 are cross-sectional views explaining manufacturing processes of an electronic paper panel according to a fourth embodiment of the present invention.

Referring to FIG. 9, a base layer 116 is first provided in order to manufacture the electronic paper panel. As the material that forms the base layer 116, there may be, for example, polyethylene terephthalate (PET), polypropylene (PP), epoxy resin, glass epoxy (GE), cellulosic resin, polyester resin, ceramic resin, etc. However, the above-mentioned materials of the base layer are provided in the embodiment of the present invention by way of example.

Therefore, any flexible material may be used.

Then, a via hole 115a that penetrates through the base layer 116 is formed. The via hole 11 5a may be formed by laser processing by which fine processing can be performed.

Referring to FIG. 10, after the via hole 11 5a is formed, a via 115 that fills the via hole 11 5a is formed. The via 115 may be formed by a plating process.

Referring to FIG. 11, after the via 115 is formed, a segment electrode 111 may be formed on the upper surface of the base layer 116, and a wire layer 114 and a pad unit 113 that are electrically connected to the segment electrode 111 through the via 115 may be formed on the lower surface of the base layer 116.

Herein, the segment electrode 111, the wire layer 114, and the pad unit 113 may be formed by printing conductive ink on the upper and lower surfaces of the base layer 116 by an inkjet printing method. The inkjet printing method may form a thin film having a width of I urn or less. Herein, the wire layer 114 having a width of 4Oum or less and the pad unit 113 having a width of 2Oum or less may be sufficiently formed by the inkjet printing method. In other words, the fine wire layer 114 and the pad unit 113 can be formed by the inkjet printing method, thereby making it possible to manufacture an electronic paper display device with improved resolution.

Further, the segment electrode 111, the wire layer 114, and the pad unit 113 are formed by the conductive ink that is sinterable at low temperature, thereby making it possible to use the base layer 116 that is heat-sensitive and cheap. In other words, selectivity of the material of the base layer 116 can be improved.

The via 115 is formed by the plating process in the embodiment of the present invention by way of example, but the present invention is not limited thereto. For example, the ia 115 may also be formed by the inkjet printing method that forms the segment electrode 111, the wire layer 114, and the pad unit 113.

Then, the electronic paper film 120 and the driving chip 130 are mounted on the flexible substrate 110, thereby making it possible to manufacture the electronic paper display panel.

* Therefore, with the embodiment of the present invention as described above, the flexible substrate is manufactured by the inkjet printing method, thereby making it possible to * manufacture the electronic paper display device with excellent resolution and improve the selectivity of the material of the electronic paper display device.

The electronic paper panel according to the present invention can be manufactured by mounting the electronic paper film and the driving chip on one substrate, thereby making it possible to simplify a manufacturing process and reduce manufacturing costs.

Further, the substrate of the electronic paper display device according to the present invention is made of flexible material, thereby making it possible to implement the flexible display device.

Further, the electronic paper display device according to the present invention has the driving chip between the folded flexible substrate, thereby making it possible to naturally protect the driving chip from the outside.

PJthough the exemplary embodiments of the present invention have been disdosed for illustrative purposes, those skilled in the art will appreciate that various modifications, additions and substitutions are possible, without departing from the scope of the invention which is defined in the accompanying daims.

Claims

CLAIMS1. An electronic paper panel comprising: a flexible substrate that includes at least one segment electrode that is disposed on the upper surface of a base layer for defining an image, a wire layer that is disposed on the lower surface of the base layer and is electrically connected to the segment electrode, and a pad unit that is disposed on the lower surface of the flexible substrate and electrically connected to the wire layer an electronic paper film that is electhcally connected to the segment electrode and is bonded to the upper surface of the flexible substrate; and a driving chip that is mounted on and electrically connected to the pad unit on the lower surface of the flexible substrate.
2. The electronic paper panel according to daim I, further comprising: a via that penetrates through the base layer and electrically connects the segment electrode to the wire layer.
3. The electronic paper panel according to daim I or 2, further comprising: a conductive adhesive memberthat is interposed between the electronic paper film and the segment electrode.
4. The electronic paper panel according to daim 1, 2 or 3, wherein the electronic paper film includes: an electronic paper layer a common electrode that is disposed on the electronic paper layer; and a protecting layer that is disposed on the common electrode.
5. The electronic paper panel according to claim 1, 2, 3 or 4, further comprising: a resist layer that is attached to the lower surface of the flexible substrate.
6. A method of manufacturing an electronic paper panel, comprising: forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, a wire layer that is disposed on the lower surface of the base layer and is electrically connected to the segment electrode, and a pad unit that is electrically connected to the wire layer; bonding an electronic paper film to the upper surface of the flexible substrate so that it is electrically connected to the segment electrode; and mounting a driving chip on the lower surface of the flexible substrate so that it is electrically connected to the pad unit.
7. The method of manufactunng the electronic paper panel according to claim 6, wherein the forming the flexible substrate includes: providing the base layer that has a conductive layer on its both sides; forming a via hole that penetrates through the base tayer forming a via that has an interlayer connection with a plating layer on the both sides of the base layer including the via hole; and forming the segment electrode, the wire layer, and the pad unit by selectively etching the plating layer.
8. The method of manufacturing the electronic paper panel according to daim 6, wherein the forming the flexible substrate includes: forming a via hole that penetrates through the base layer; forming the via for the interlayer connection inside the via hole; and forming the segment electrode, the wire layer, and the pad unit by an inkjet printing method.
9. The method of manufacturing the electronic paper panel according to claim 6, 7 or 8, wherein the driving chip is mounted using any one of a flip-chip bonding method and a wire bonding method.
10. The method of manufacturing the electronic paper panel according to claim 6, 7, 8 or 9, wherein the bonding the electronic paper film includes using a conductive adhesive member.
11. The method of manufacturing the electronic paper panel according to any of claims 6 to 10, further comprising: forming a resist layer on the lower surface of the flexible substrate.
12. A method of manufactunng an electronic paper panel, comprising: forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, and a wire layer and a pad unit that are disposed on the lower surface of the base layer by performing a via hole forming process, a plating process, and an etching process on the base layer; bonding an electronic paper film to the upper surface of the flexible substrate so thatit is electrically connected to the segment electrode; and mounting a driving chip on the lower surface of the flexible substrate so that is electrically connected to the pad unit.
13. The method of manufacturing the electronic paper panel according to claim 12, wherein the base layer has a conductive layer on at least its one surface.
14. The method of manufacturing the electronic paper panel according to claim 12 or 13, wherein the via hole forming process is performed by laser processing.
15. A method of manufacturing an electronic paper panel, comprising: forming a flexible substrate that includes a segment electrode that is disposed on the upper surface of a base layer, and a wire layer and a pad unit that are disposed on the lower surface of the base layer by performing a via hole forming process and an inkjet printing process on the base layer; * bonding an electronic paper film to the upper surface Of the flexible substrate so that is electrically connected to the segment electrode; and * mounting a driving chip on the lower surface of the flexible substrate so that it is electrically connected to the pad unit.
16. The method of manufacturing the electronic paper panel according to claim 15, wherein the forming the flexible substrate includes forming a via that electrically connects the segment electrode to the wire layer by a plating process.
17. The method of manufacturing the electronic paper panel according to daim 15, wherein the forming the flexible substrate indudes forming a via that electrically connects the segment electrode to the wire layer by the inkjet printing process.
18. An electronic paper display device comprising: an electronic paper panel that includes at least one flexble substrate that includes a segment electrode that is disposed on the upper surface of a base layer for defining an image, a wire layer that is disposed on the lower surface of the base layer and is electrically connected to the segment electrode, and a pad unit that is disposed on the lower surface of the flexible substrate and electrically connected to the wire layen an electronic paper film that is electrically * connected to the segment electrode and is bonded to the upper surface of the flexible substrate; and a driving chip that is mounted on and electrically connected to the pad unit formed on the * lower surface of the flexible substrate; and a case That receives the electronic paper panel having regions bent to face each other.
19. The electronic paper display device according to claim 18, further comprising: a main board that is electrically contacted to the flexible substrate and is disposed on * the bottom surface of the case; and a reinforcing member that is interposed between the flexible substrate and the main board.
20. The electronic paper display device according to claim 18 or 19, further comprising: a moisture shielding member that is interposed between the case and the electronic paper film along the edge of a display region disposed on the electronic paper panel.

*
21. The electronic paper display device according to claim 18, 19 or 20, further comprising: * a via that electrically connects the segment electrode to the wire layer.
22. The electronic paper display device according to claim 18, 19, 20 or 21, further comprising: a conductive adhesive member that is interposed between the electronic paper film and the segment electrode.
23. The electronic paper display device according to any of claims 18 to 22, wherein the driving chip is disposed.between the flexible substrates that are bent to face each other.