TW200800478A - Electrostatic chuck - Google Patents
Electrostatic chuck Download PDFInfo
- Publication number
- TW200800478A TW200800478A TW096110483A TW96110483A TW200800478A TW 200800478 A TW200800478 A TW 200800478A TW 096110483 A TW096110483 A TW 096110483A TW 96110483 A TW96110483 A TW 96110483A TW 200800478 A TW200800478 A TW 200800478A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrostatic chuck
- dielectric layer
- elastic layer
- electrostatic
- item
- Prior art date
Links
- 238000001179 sorption measurement Methods 0.000 claims description 31
- 239000000463 material Substances 0.000 claims description 21
- 229920000728 polyester Polymers 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 6
- 229920005989 resin Polymers 0.000 claims description 6
- 239000013589 supplement Substances 0.000 claims description 6
- 229920001971 elastomer Polymers 0.000 claims description 4
- 239000005060 rubber Substances 0.000 claims description 4
- 244000043261 Hevea brasiliensis Species 0.000 claims description 2
- 229920003052 natural elastomer Polymers 0.000 claims description 2
- 229920001194 natural rubber Polymers 0.000 claims description 2
- 239000004575 stone Substances 0.000 claims description 2
- 229920003051 synthetic elastomer Polymers 0.000 claims description 2
- 239000005061 synthetic rubber Substances 0.000 claims description 2
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims 1
- 239000011521 glass Substances 0.000 abstract description 24
- 239000000758 substrate Substances 0.000 abstract description 23
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000002156 adsorbate Substances 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000003068 static effect Effects 0.000 description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 229920002379 silicone rubber Polymers 0.000 description 3
- 239000004945 silicone rubber Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000013013 elastic material Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 101100290380 Caenorhabditis elegans cel-1 gene Proteins 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CQBLUJRVOKGWCF-UHFFFAOYSA-N [O].[AlH3] Chemical compound [O].[AlH3] CQBLUJRVOKGWCF-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000003110 anti-inflammatory effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229920001973 fluoroelastomer Polymers 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006090717 | 2006-03-29 | ||
| JP2006341355A JP4808149B2 (ja) | 2006-03-29 | 2006-12-19 | 静電チャック |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW200800478A true TW200800478A (en) | 2008-01-01 |
Family
ID=38765131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW096110483A TW200800478A (en) | 2006-03-29 | 2007-03-27 | Electrostatic chuck |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4808149B2 (enrdf_load_stackoverflow) |
| KR (1) | KR20070098566A (enrdf_load_stackoverflow) |
| TW (1) | TW200800478A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI560803B (en) * | 2014-06-13 | 2016-12-01 | Mobile electrostatic chuck and manufacturing method of the same | |
| CN110228787A (zh) * | 2018-03-05 | 2019-09-13 | 夏普株式会社 | Mems元件及微型物体的操控方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010182866A (ja) * | 2009-02-05 | 2010-08-19 | Nikon Corp | 静電吸着保持装置、露光装置、露光方法及びデバイスの製造方法 |
| JP5846186B2 (ja) * | 2010-01-29 | 2016-01-20 | 住友大阪セメント株式会社 | 静電チャック装置および静電チャック装置の製造方法 |
| DE102015210736B3 (de) * | 2015-06-11 | 2016-10-27 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Vorrichtung mit folie zum elektrostatischen koppeln eines substrats mit einem substratträger |
| JP6642170B2 (ja) * | 2016-03-23 | 2020-02-05 | 住友大阪セメント株式会社 | 静電チャック装置及びその製造方法 |
| JP6808979B2 (ja) * | 2016-06-01 | 2021-01-06 | 株式会社リコー | 入力素子及び入力装置 |
| KR102093991B1 (ko) * | 2018-08-31 | 2020-04-23 | 이지스코 주식회사 | 고무 탄성체 다이아프램 타입 정전척 및 그 제조방법 |
| KR102292501B1 (ko) * | 2019-01-24 | 2021-08-23 | 김순훈 | 정전척 |
| JP7128534B2 (ja) * | 2020-05-26 | 2022-08-31 | Ａｉメカテック株式会社 | 基板組立装置及び基板組立方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0422153A (ja) * | 1990-05-17 | 1992-01-27 | Tokyo Electron Ltd | 静電吸着装置 |
| JP3805134B2 (ja) * | 1999-05-25 | 2006-08-02 | 東陶機器株式会社 | 絶縁性基板吸着用静電チャック |
| JP3599634B2 (ja) * | 2000-04-10 | 2004-12-08 | 信越化学工業株式会社 | イオン注入機用静電チャック |
| US20070223173A1 (en) * | 2004-03-19 | 2007-09-27 | Hiroshi Fujisawa | Bipolar Electrostatic Chuck |
-
2006
- 2006-12-19 JP JP2006341355A patent/JP4808149B2/ja active Active
-
2007
- 2007-03-26 KR KR1020070029275A patent/KR20070098566A/ko not_active Ceased
- 2007-03-27 TW TW096110483A patent/TW200800478A/zh unknown
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI560803B (en) * | 2014-06-13 | 2016-12-01 | Mobile electrostatic chuck and manufacturing method of the same | |
| CN110228787A (zh) * | 2018-03-05 | 2019-09-13 | 夏普株式会社 | Mems元件及微型物体的操控方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007294852A (ja) | 2007-11-08 |
| KR20070098566A (ko) | 2007-10-05 |
| JP4808149B2 (ja) | 2011-11-02 |
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