1276365 玖、發明說明： 【發明所屬之技術領域】 本發明係關於一種電激發光元件用密封板及其製造方法、 以及該密封板多個削取用母玻璃基板。 【先前技術】 電激發光（以下稱為「EL」）元件，一般係包含有於表面形 成EL層疊膜之基板、及為了將其頂面介以黏著劑黏搔於基板 上之周邊突條部規定於周邊部而將中央部加工成凹狀，俾於 覆蓋形成於基板上之EL層疊膜的£1^元件用密封板。基板與密 封板，係介以由配設於基板與周邊突條部間之密封部份上的 黏著劑所構成的黏著層而黏接著。 作為該密封板之材料，係可採用金屬、玻璃、或樹脂等。 該等之中密封板由金屬構成的情況，由於以保持形成於基板 上之拉出電極部分的電絕緣性為目的，而有必要使絕緣性之 間隔物混在基板與周邊突條部間之密封部份中，所以基板與 周邊突條部之間隙會變大同間隔物之程度，且外部之水分從 該部分侵入的可能性會變高。又，在從密封板側取出始自發 光層之光的頂端發射構造中，由於對密封板要求透明性，所 以無法使用金屬構成的密封板。 因而’在EL元件採用頂端發射構造的情況，密封板係採用 具有絕緣性與透明性的塑膠或玻璃。但是，塑膠，因其本身 所具有的吸水性而很少當作密封板之材料來使用，相對於 此’玻璃由於絕緣性、透明性、及耐水性優所以常用作密封 板之材料。 86751 1276365 作為玻璃製之密封板的加工方法，有折彎玻璃素板本身並 加工的壓製法（H 3)、或除去玻璃素板之中央部的噴砂法⑽ 4)。 如圖3所示，以壓製法加工的密封板3〇,由於為了防止燒痕 而使用具有微小凹凸的模子，所以該凹凸會轉印在周邊突條 部頂面而使平坦部變低，且水分或氧容易從配設於基板 10與周邊突條部31間之密封部份上的黏著層4〇侵入。又，如 圖4所不，以喷砂法加工的密封板3〇，由於在中央凹部之表面 多發生喷砂法特有之微小的I請，所以為了將密封板％黏 接在基板1G上，而當施加壓力至配設於基板1()與周邊突條部 31間之密封部份上的黏著層4〇時就有密封板3〇遭破壞的情 況。 作為密封板30之加工方法，除了上述壓製法或喷砂法，尚 有蝕刻法，若依據該方法，則由於周邊突條部31之頂面的平 坦度會變高，且在中央凹部之表面不會發生微小的裂紋，所 以施加基板10與密封板3〇之黏接用壓力亦可在密封部份進行 均等的黏接。 又，即使在密封板30由耐水性優之玻璃構成的情況，當黏 著劑塗佈至基板10與周邊突條部3 1間之密封部份的塗佈量很 >時，因外部之水分或氧會從密封部份侵入並帶給el層疊膜 本身損傷，且EL元件之壽命會極端地變短。因此，塗佈至密 封4伤的黏著劑之量要受到嚴密控制。 然而，當周邊突條部3 1之頂面的凹凸有不均等時，除了在 “凹邛刀上谷易滞留黏著劑，而且當周邊突條部3 1之頂面的 86751 Ϊ276365 面積，即塗佈黏著劑的面積較大時，就很難均等形成黏著層 40之厚度。 曰 因而，即使只嚴密控制塗佈至基板10與周邊突條部31間之 密封部份的黏著劑之量，亦很難對密封部份形成一定厚度的 黏著層40，且有外部之水分或氧會從未滿足黏著層4〇之一定 厚度的部分侵入，並使EL元件之壽命變短的第一問題。 另一方面，EL元件，為人所周知者有二種類，其一為可藉 由選擇性地施加電壓至隔著發光層而相對的電極及背面電= 來使該發光層選擇性地發光，而適於矩陣顯示的被動型卜另 一為可利用高速開關功能而進行高速切換顯示，且適於動書 顯示的主動型。 上述被動型之EL元件，係採用單純矩陣構造，且包含有某 板；配設於該基板上的電極；含有發光層，且層疊於該電極 上面的EL層疊體；層疊於該EL層疊體上面的背面電極；以及 玻璃製密封板，其以將頂面黏接於層疊該£1^層疊體之基板上 的周邊突條部規定於周邊部的方式而將中央部加工成凹狀， 且介以周邊突條部之頂面的密封部黏接於基板上。 又，上述主動型之EL元件，係採用主動矩陣型構造，其與 TFT液晶元件之構造同樣，包含有基板；以每—像素形成於 該基板上的薄膜電晶體電路或二極體；含有發光層，且層疊 於該薄膜電晶體電路或該二極體之上面的£匕層疊體；以 璃製密封板，其以將頂面黏接於層疊該EL層疊體之基板上的 周邊突條部規定於周邊部的方式而將中央部加工成凹狀，且 介以周邊突條部之頂面的密封部黏接於基板上。 86751 -9- 1276365 上述後、封部’係構成將el元件内從水分或氧遮斷的密封 部。 在上述被動型之EL元件與上述主動型之EL元件中，頂端發 射型之EL元件，係藉由以透明構件構成上述發光層至上述密 封板側’而將始自發光層之光從密封板側取出者。 在該頂端發射型之EL元件中，雖為了將el元件内從水分或 氧遮斷而可利用密封板之密封部來密封，但是因長期間使用 而有降低密封部之密封性並因水分等混入EL元件内而使EL 層疊膜劣化的情形。為了抑制該EL層疊膜之劣化，而藉由在 被密封之EL元件内配設吸濕劑，以提高對混入之水分的耐水 性。該吸濕劑，一般係配設在與EL層疊體對峙之密封板的凹 部内面整體上。 然而’當吸濕劑配設在與EL層疊體對峙之密封板的凹部内 面整體上時，在從密封板側取出始自發光層之光的頂端發射 構造中就無法獲得充分的開口率，而有無法充分取出始自發 光層之光的第二問題。 本發明之第一目的’係在於提供一種可有效防止水分或氧 侵入EL元件内部並謀求EL元件之長壽命化的el元件用密封 板、以及該密封板多個削取用母玻璃基板。 更且’本發明之第二目的’係在於提供一種可一面抑制El 層疊膜之劣化，而一面充分取出始自發光層之光的頂端發射 型之EL元件用禮、封板及其製造方法、以及該密封板多個削取 用母玻璃基板。 【發明内容】 86751 -10- 1276365 為了達成上述第一目的，本發明第一態樣之電激發光元件 用在封板，其係玻璃製，且為了將其頂面介以黏著劑黏接於 上述基板上的周邊突條部規定於周邊部而將中央部加工成凹 狀’俾於覆蓋層疊於基板上的此層疊體者，其特徵為：上述 周邊突條部之頂面凹凸的最大值係IG/zm未滿。 在第一態樣之電激發光元件用密封板中，較佳者為，上述 中央部係使用钱刻法加工成凹狀。 更且’較佳者為’上述钱刻法係濕式㈣法。 為了達成上述第-目的，本發明第一態樣之密封板多個削 取用母玻璃基板，其特徵為：上述電激發光元件用密封板係 形成大致矩陳妝。 為了達成上述第二目的，本發明第二態樣之虹元件用密封 板，其係玻璃製，且以將頂面 肝頂面岫接在層豐EL層疊體之基板上 的周邊大條部規定於周邊部的 幻万式而將中央部加工成凹狀 者’其特徵為：在上述周邊突 ▲ 條邛之内側面配設有吸濕劑。 在第一恶樣之EL元件用密封板中 係分子篩。 住者為上述吸濕劑 較佳者為，在上述周邊 口部的同時保持上述吸 在第二態樣之EL元件用密封板中， 突條部之頂面，具備有㈣央具_ 濕劑的保持部。 係從上述周邊突 更且，較佳者為，上述保持部之開口緣 條部之内侧面朝内側突出。 係尽度為〇·〇5〜1·ι mm之無 更且，更佳者為，上述保持部 鹼性玻璃製。 86751 !276365 為了達成上述第二目的’本發明第二態樣之EL元件用密封 板多個削取用母玻璃基板，其特徵為：上述EL7t件用密封板 係形成大致矩陣狀。 為了達成上述第二目本發明第二態樣之EL元件用密封 板之製造方法’其特徵為：準備玻璃素板、及㈣速度慢於 上述玻璃素板之玻璃薄板，在上述玻璃素板上黏接上述玻璃 薄板’將黏接有上述玻璃薄板之玻璃素板，以在周邊部規定 周邊大條。卩之方式在中央部從上述玻璃薄板側開始钱刻加工 成凹狀，且在上述周邊突條部之内侧面配設吸濕劑。 車又佳者為’第二態樣之上述黏接係㈣加純接而進行者。 更且’較佳者為，上述加熱溶接，係在上述玻場素板斑上 述玻璃薄板之間介設低熔點玻璃而進行者。 為了達成上述第二目的’本發明第三態樣之EL元件用密封 板之製造方法’其特徵為：準備玻璃素板及玻璃薄板，以在 周邊部規定周邊突條部的方式在t央部將上述玻璃素板飯刻 加工成凹狀’以t央具有開口面積小於上述㈣加工之玻璃 素板之凹部的開口部之方式钱刻加工上述玻璃薄板，以使上鲁 述開口部之開口緣從上述周邊突條部之内側面朝内侧突出的. 方式黏接上述钱刻加工的玻璃素板與上述姓刻加I的玻璃薄 板且在上述周邊突條部之内側面配設吸濕劑。 在第三態樣之EL元件用密封板之製造方法中，較佳者為， 上述黏接係利用加熱熔接而進行者。 更且’較佳者為’上述加熱熔接，係在上述玻璃素板盥上 述玻璃薄板之間介設低熔點玻璃而進行者。 86751 -12- 1276365 更且，更佳者為，在上述第二態樣及第三態樣之元件用 密封板之製造方法中，上述黏接係使用黏著劑而進行者。 【實施方式】 T ° 本發明人，為了達成上述第一目的而進行專心研究後，結 果發現在為了將其頂面介以黏著劑黏接於上述基板上的周邊 突條部規定於周邊部的方式而將中央部加卫成凹狀，俾於覆 蓋層疊於基板上的EL層疊體之玻璃製的EL元件用密封板 中，當上述周邊突條部之了頁面凹凸的最大值未滿1〇_時， 將密封板之基板密封部份的黏接著厚度設為均等，即可有效 地防止水分或氧侵入EL元件内部並可謀求EL元件之長壽命 化。 又，本發明人，為了達成上述第一目的而進行專心研究後， 結果發現在以將頂面黏接在層疊£1^層疊體之基板上的周邊 犬條邛規疋於周邊部的方式而將中央部加工成凹狀之玻璃製 的EL元件用密封板中，當在上述周邊突條部之内侧面配設有 吸濕劑時’由於在周邊突條部之内側面配設有吸濕劑，所以 可一面抑制EL層疊膜之劣化，而一面充分地取出始自發光層 之光。 本發明’係根據上述研究結果而開發完成者。 以下’係一面參照圖式而一面說明本發明第一實施形態之 EL元件用密封板。 圖1係具備本發明第一實施形態之EL元件用密封板的EL元 件之剖面圖。 圖1 _，EL元件1〇〇，係採取底端發射構造，且包含有大小 86751 -13 - 1276365 7.0 cm角、厚度1·〇 mm之板狀透明的無驗性玻璃製之基板 10 ;形成於基板10上的有機EL層疊體20;及形成覆蓋該有機 EL層疊體20的密封板30。 密封板30，係例如利用濕式蝕刻法而由大小5.0 cm、厚度 0.70 mm之板狀透明的無鹼性玻璃（例如NA-35 : NH科技玻璃 股份有限公司製）製之玻璃素板所構成，且為了於凹部32之周 邊部規定寬2.0 mm之周邊突條部3 1而將中央部加工成凹狀， 而凹部32之底部的厚度為0.4 mm。基板1〇與周邊突條部31， 係介以配設在形成於基板1 0與周邊突條部3 1之頂部間的密封 部份上，例如由紫外線硬化型環氧樹脂製之黏著劑所構成的 黏著層40而黏接。 密封板30對基板10之黏接，首先係在周邊突條部31塗佈一 定量的黏著劑之後，將密封板30載置於基板1〇上，其次，以 在密封部份上施加980 N/m2(l〇〇kg/m2)左右之力的方式藉由 一面將密封板3 0按壓在基板1 〇上而一面對黏著劑照射紫外線 來進行。 在密封板30之凹部32的底部表面33上，為了使之吸附水分 而塗佈有分子篩50(優尼恩卡拜德（Uni〇nCarbide)公司製另 外，在塗佈分子篩50時及密封板30黏接至基板1〇時，為了消 除水分或氧之影響較佳者係在乾燥環境或減壓下進行。 又，在本實施形態中，吸濕劑雖係使用最佳的分子篩5〇， 但是並非被限定於此，例如亦可為氧化矽膠（Si〇2)、乾燥劑（克 萊系乾燥劑）、氣化鈣、氧化鈣、矽酸鈣等。 有機EL層疊體20,係包含有形成於基板1〇上，且由厚度3〇〇 86751 -14, 1276365 nm之ITO(氧化銦錫）膜構成的透明導電膜2 1 ;包含後述之發 光層，且層疊於該透明導電膜21之表面的有機EL層疊膜22; 形成於有機EL層疊膜22之表面，且由厚度3〇〇 nmiMg-Ag(鎂 -銀）合金構成的背面電極23 ;以及連接於背面電極23，且由 厚度300 nm之ITO膜構成的拉出電極24。 有機EL層疊膜22，係從透明導電膜21側開始依序層疊由三 本雙胺構成的咼度70 nm之電洞輸送層、接著由經基嗤嚇銘錯 合物構成的南度70nm之發光層。更且，在背面電極23與發光 層之間，亦可配設有由三唑或呤啩唑構成的透明之電子輸送 層。 在上述濕式钱刻法中所用的姓刻液，較佳者係在氟化氫酸 5〜50質量％中，適量含有選自硫酸、鹽酸、硝酸及磷酸構成 之無機酸之群中至少一種的酸。藉此，可增大餘刻力。另外， 選自該等無機酸之群的強酸，亦可為單體或2種類以上的混合 物0 又’上述餘刻液，較佳者係適量含有選自由竣酸類、二竣 酸類、胺類、及胺基酸類組成之群的1種或2種以上之有機酸 或鹽基之類。又’亦可在上述钱刻液中適當添加界面活性劑， 亦可適當變更所添加的界面活性劑。 如上述之勉刻液的成分與其濃度，係可依敍刻液之溫度、 及所姓刻之玻璃的組成或種類等而適當變更。又，在施行钱 刻處理時，對於使被蝕刻之玻璃搖動，或賦予輸出較弱之超 音波亦為有效。藉此，就可將蝕刻液形成均等的溶液。更且， 在施行姓刻處理時，對於從餘刻液取出並一旦浸潰於選自由 86751 -15- 1276365 機酸之群中之至少 胺類及胺基駿類構 類申亦為有效。藉 水、或硫酸、鹽酸、硝酸及磷酸構成的無 一種的酸、或選自由羧酸類、二羧酸類、 成之群之1種或2種以上的有機酸或鹽基之 此，可均等施行蝕刻處理。 在上述實施形態中，作為在玻璃素板上形成凹部32的方 法，雖係使用濕式㈣！法，但是亦可為乾式_法，或並用 乾式蝕刻法與濕式蝕刻法。 在濕式姓刻法中，可藉由選擇姓刻液之成分與姓刻溫度而 進行批次處理，且可提高密封板30之生產性。相對於此，在 乾式蝕刻法中，雖可精密地進行蝕刻處理，但是由於無法進 行批次處理，而不得已進行單片處理’所以密封板3〇之生產 性低。 又，密封板30,雖係使用無鹼性玻璃之玻璃素板，但是依 EL元件100之構成，亦可使用低鹼性玻璃’或使用蘇打石灰 玻璃或石英玻璃等。 密封板30之凹部32底部的厚度，較佳者為on」mm。厚 度未滿0·3 mm，則密封板30之凹部32底部的強度過小，當大 於1·1 mm時密封板30之強度雖十分大但是無法謀求E]L元件 100之薄型化。 若依據本實施形態，由於周邊突條部3 i之頂面凹凸的最大 值為10#m未滿，所以可將基板10與周邊突條部31間之密封 部份的黏著層40之厚度形成均等，並有效防止水分或氧侵入 EL元件1〇〇内部並謀求el元件1〇〇之長壽命化。 在本實施形態中，有機EL層疊膜22雖為採用被動構造，但 86751 -16- 1276365 疋亦可採用主動構造。又，在本實施形態中，有機EL元件【 雖係採用底端發射構造，但是亦可採用頂端發射構造。 又，有機EL層積膜22雖係採用由電洞輸送層與發光層構成 者’但是亦可使用由電洞輸送層、發光層及三唑或嘮啡唾組 成的電子輸送層所構成者。 更且，EL層豐膜’亦可為無機EL層疊膜，以取代有機el 層疊膜22。該情況，可採用從透明導電膜側依序為絕緣層、 發光層、絕緣層組成者、或電子障壁層、發光層、電流限制 層組成者。 用於圖1之EL元件100的密封板30，係如上所述除了單片處 理之製作，亦可從下述圖2之密封板多個削取用母玻璃基板切 出。 圖2係用於圖1之EL元件1〇〇之密封板30大致形成矩陣狀的 密封板多個削取用母玻璃基板之平面圖。 圖2中，縱30 cm、橫40 cm之密封板多個削取用母玻璃基板 200，係具有形成5 X 6之矩陣狀的密封板30。 作為在玻璃素板上形成5x6之矩陣狀的密封板3〇之方法，有 以包含濕式餃刻法之姓刻法將玻璃素板之指定部分除掉成凹 狀的方法。所使用的玻璃素板，其處理方面從厚度0.5 mm以 上、EL元件1〇〇之薄性化的觀點來看適合使用lel mm以下者。 在該方法中，首先，係在無鹼性玻璃（例如NA-35等）製之玻 璃素板上，為了將露出部形成5 X 6之矩陣狀而利用寬為2.5 mm之帶狀的光阻進行掩蔽處理，將該掩蔽處理之玻璃素板， 浸潰在上述蝕刻液中1〇〜180分鐘左右，並從玻璃素板殘留突 86751 17 1276365 條部1 Ο 1除掉成凹狀以形成凹部丨02者。在以純水充分洗淨該 玻璃素板之後玻璃光阻。 如此由於將玻璃素板之指定部分利用濕式姓刻法除掉成凹 狀’所以可確實使密封板3〇之凹部32的底部表面形成平坦， 且可對外部壓力增大密封板30之強度。 其次，如上所述將凹部102形成5 x 6之矩陣狀的密封板多 個削取用母玻璃基板2〇〇,在規定凹部1〇2之突條部1〇1的部位 切斷。藉此，可取得30(5 x 6)個例如用於後述之圖2的el元 件100的密封板30。 在上述實施形態中，作為在玻璃素板上形成凹部1 〇2的方 法，雖係使用濕式餘刻法，但是亦可使用乾式蝕刻法，或並 用乾式蝕刻法與濕式蝕刻法。 後封板多個削取用母玻璃基板2 〇 〇，雖係將密封板3 〇之排列 形成矩陣狀，但是若為適於多個削取之排列的話則亦可為矩 陣狀以外。 又’光阻之寬度，並未被限定於2.5 mm，只要所取得之密 封板30之周邊突條部3丨的寬度為該周邊突條部3丨之厚度以上 即可’為了確保作為密封板30之留量亦可為1 cm左右。 若依據圖2之密封板多個削取用母玻璃基板2〇〇，則可利用 切斷分離來取得各密封板30，且於切斷時對外部壓力增大強 度’且消除單片處理之進行而可提高密封板之生產性。 以下，一面參考圖式而一面說明本發明第二實施形態之El 元件用密封板。 本實施形態之EL元件基本上具有與第一實施形態之el元 86751 -18- 1276365 件同樣的構成。因而，在同一構成上附記同一元件符號並省 略說明。 圖5係具備本發明第二實施形態之EL元件用密封板的EL元 件之剖面圖。 圖5中’頂端發射型有機EL元件i 00a，係採用被動構造， 且包含大小7·0 em角、厚度1.〇 mm之板狀透明的蘇打石灰玻 璃之基板10a;形成於基板10a上之有機EL層疊體20;及形成 覆蓋該有機EL層疊體2〇的密封板3〇a。 密封板30a，係大小5·0 cm角、厚度1.1 mm之板狀透明的蘇 打石灰玻璃製’且以將頂面黏接在層疊El層疊體20之基板 l〇a上的寬2.0 mm之周邊突條部31 a規定於周邊部的方式而將 中央部加工成凹狀，而底部之厚度為〇. 8 mm。 更且’密封板30a，係在周邊突條部31a之頂面，具備大小 5.0 cm角、厚度0el mm之無鹼性玻璃製的玻璃薄板311。該玻 璃薄板3 11 ’係在中央具有經蝕刻加工之4·5 cm角的開口部， 同時保持上述分子篩50。 該玻璃薄板3 11之開口緣3 12，係從周邊突條部3 1 a之内侧面 3 13朝内侧突出。由該開口緣3 12保持的分子篩5〇，係配設於 周邊突條部3 1 a之内侧面3 13。 基板1 0a與密封板3 0a，係介以配設於密封部之上述黏著層 40而黏接。具體而言’在玻璃薄板311塗佈一定量的紫外線硬 化型環氧樹脂製之黏著劑之後，將密封板3〇a載置於基板1〇a 上，其次藉由一面將密封板30a以1〇〇 kg/m2左右之力按壓在 基板1 〇a上而一面在黏著劑上照射紫外線而進行。 86751 -19- 1276365 密封板30a之凹部32a的形成，係藉由將玻璃素板利用後述 之濕式姓刻法形成凹狀而進行。在測定利用該濕式㈣法而 蝕刻的玻璃素板之蝕刻深度時為3〇〇#m。又，在凹部32a之 底面角隅部具有彎曲部位，且其曲率半徑約為3〇〇#m。密封 板30a之凹部32a的底部厚度，較佳者為〇3〜i ^ 厚度未 滿0.3 mm，則密封板30a之強度不充分，且當大於limm時雖 可獲知充分的畨封板30a之強度，但是無法謀求EL元件丨〇〇a 之薄型化。 圖6係顯不圖5之密封板3〇a之製造方法的流程圖。 圖6中，首先，準備玻璃素板及玻璃薄板311 (步驟S21)。在 此，玻璃薄板3 11之材料，為了形成上述開口緣3丨2，而較佳 者為蝕刻速度慢於玻璃素板。 其次’在玻璃素板上黏接玻璃薄板311(步驟S22)。該玻璃 素板與玻璃薄板311黏接，係將玻璃薄板311加熱至玻璃素板 之軟化溫度附近’並藉由互相炼接而進行。 更且，將黏接有玻璃薄板3 11之玻璃素板，使用濕式蝕刻 法’以在周邊部規定周邊突條部31a的方式在中央部從玻璃薄 板311側姓刻加工成凹狀（步驟S23)，且在周邊突條部31a之内 側面3 13配設分子篩50(步驟S24)。 上述步驟S23之濕式蝕刻法，係在為了使黏接有玻璃薄板 3 11之玻璃素板的4·5 cm角之中央部露出的方式以耐酸性 ▼ ’即光阻掩敗之後’將該掩蔽之玻璃素板，浸潰在由例如 20質量。/〇氟化氫酸、1質量％十二笨磺酸鈉之混合液組成，且 保持於2 5 °C之姓刻液中者。 86751 -20- 1276365 另外，在上述濕式餘刻法中所用的姓刻液並非被限定於上 述姓刻液，亦可使用與第—實施形態同樣者。如上述之㈣ 液的成分與其濃度’係可依蝕刻液之溫度'及所蝕刻之玻璃 的組成或種類等而適當變更。又’在施行㈣處理時，對於 ，被钱刻之玻璃搖動，或賦予輸出較弱之超音波亦為有效。 藉此，就可將蝕刻液形成均等的溶液。更且，在施行蝕刻處 理時，對於從㈣液取出並-旦浸潰於選自由水、或硫酸、 鹽酸、硝酸及磷酸構成的無機酸之群中之至少一種的酸、或 選自由羧酸類、二羧酸類'胺類及胺基酸類構成之群之丨種或 2種以上的有機酸或鹽基之類中亦為有效。藉此，可均等施行 蝕刻處理。 圖7係顯示圖5之密封板3〇a之另一製造方法的流程圖。 圖7中’首先，準備玻璃素板及玻璃薄板3 n(步驟S31)。 其次’將玻璃素板，使用上述濕式蝕刻法，以在周邊部規 定周邊突條部31a之方式而在中央部蝕刻加工成凹狀（步驟 S32)，將玻璃薄板3 11，使用上述濕式蝕刻法，以中央具有開 口面積小於經蝕刻加工過之玻璃素板之凹部32a的開口部之 方式進行蝕刻加工（步驟S33)。 更且，將上述蝕刻加工過之玻璃素板及玻璃薄板311，以玻 璃薄板311之開口緣312從周邊突條部31a之内側面313朝内側 突出的方式黏接（步驟S34)，且在周邊突條部3 la之内側面313 配設分子篩50(步驟S35)。 若依據本實施形態，則由於在周邊突條部31a之内側面313 配設有分子篩50，所以可一面抑制有機EL層疊膜22a之劣 86751 -21 - 1276365 化，而一面充分取出始自發光層之光。 在本實施形態中，雖係使用被動型以作為有機此元件 l〇〇a’但是並非被限定於此，亦可為主動型。 在本實施形態中，密封板30&雖係依設於周邊突條部3u之 頂面的玻璃薄板3U而在周邊突條部313之内側面313保持分 子筛50,但是並非被限定於此，例如，亦可如圖8所示不設置 玻璃薄板，而將黏著層40當作保持機構。 在本實施形態中，雖係使用蘇打石灰玻璃以作為密封板3〇a 用玻璃素板，但是亦可按照有機EL元件10〇3之構成而使用低 驗性玻璃、無驗性玻璃、石英玻璃等。 在本實施形悲中，雖係使用厚度〇 ·丨mm之無鹼性玻璃以作 為玻璃薄板3 11 ’但疋並非被限定於此，例如亦可為厚度 〇·05〜1.1 mm之無驗性玻璃。 在本實施形態中，雖係使用無鹼性玻璃以作為玻璃薄板 3 11，但是並非被限定於此，例如亦可為低鹼性玻璃、蘇打石 灰玻璃、石英玻璃等。 在本實施形態中，雖係使用最佳的分子篩50以作為吸濕 劑，但是與第一實施形態同樣，並非被限定於此。 在本實施形態中，雖然玻璃素板與玻璃薄板3 11之黏接係藉 由將玻璃薄板3 11加熱至玻璃素板之軟化溫度附近，以使之互 相熔接而黏接著，但是並非被限定於此，亦可在玻璃薄板與 玻璃薄板3 11之間介設低熔點玻璃，且可使用黏著劑來黏接。 在本實施形態中，作為在玻璃素板上形成凹部32a的方法， 雖係使用濕式蝕刻法，但是與第一實施形態同樣亦可為乾式 86751 -22- 1276365 餘刻法，或並用乾式姓刻法與濕式钱刻法。 在本實施形態中，雖係使用有機EL層疊膜22以作為EL層疊 膜，但是與第一實施形態同樣，並非被限定於此。 用於圖8之有機EL元件l〇〇a的密封板3〇a，如上所述除了單 片處理之製作’其餘與弟一實施形態同樣，可從密封板多個 削取用母玻璃基板200中切出。 又，切斷密封板多個削取用母玻璃基板2〇〇後之形狀較佳者 為與上述密封板30a同樣的形狀。 又，亦可將在上述玻璃素板上形成5 χ 6之矩陣狀之密封 板30a的方法，適用於黏接沒有形成開口部之玻璃薄板311的 玻璃素板上，或可在圖5之凹部32a形成矩陣狀的玻璃素板上 黏接形成矩陣狀開口部之玻璃薄板。 若依據圖5之密封板多個削取用母玻璃基板2〇〇，則可利用 切斷分離來取得各密封板3〇a，於切斷時對外部壓力增大強 度，且消除單片處理之進行以提高密封板3〇a之生產性。 以下，係說明本發明之第一實施形態的實施例。 本發明人，從玻璃素板t，分別利用濕式蝕刻法（實施例 1)、壓製法（比較例1}、噴砂法（比較例2)，製作為了在中央部 規定凹部而於周邊部具備周邊突條部的密封板之實驗片、(實 施例1及比較例1〜2)如下（表丨）。 、 86751 -23- 1276365 表1 凹部加工方 法 凹凸最大 值 亮度減半壽命 驅動電壓上升 實施例 1 濕式蝕刻法 10 // m 未 滿 5000小時 小（12 V) 比較例 1 壓製法 10 μ m 以 上 2000小時 大（25 V) 比較例 2 喷砂法 2500小時 大（25 V) 首先，調製20質量％氟化氫酸、1質量％十二苯磺酸鈉之混 合液组成的蝕刻液，且以覆蓋由大小5·0 cm角、厚度0.70 mm 大小之無鹼性玻璃（NA-3 5)組成的玻璃素板之外面、周邊面、 及周邊突條部的耐酸性帶施行掩蔽處理進而將該玻璃素板浸 潰在保持於25 °C之上述蝕刻液中60分鐘，並從蝕刻液中取 出’藉由在以純水充分洗淨之後剝離耐酸性帶，以將深度3〇〇 //m之凹部與寬2·5 mm之周邊突條部形成於玻璃素板上，而 取得密封板之實驗片。 從該等取得之密封板的實驗片中，將周邊突條部之頂面凹 凸的最大值1 〇 # m未滿者當作實施例1。 接者，一面將厚度〇.5〇mm之NA-35的玻璃基板加熱至作業 溫度附近而一面利用碳製鑄模加以按壓，且在該NA-35之玻 璃基板上形成深度300 // m之凹部與寬2.0 mm之周邊突條 部’以取得密封板之實驗片，且將該等當作比較例1。作為碳 86751 -24- 1276365 衣鑄模，由於係使用為了防止燒痕而具有微小凹凸者，所以 在比較例1之密封板的實驗片中，碳製鑄模之微小凹凸並不限 於中央凹部而亦可轉印至周邊突條部之頂面，且周邊突條部 之頂面凹凸的最大值超過1〇#m。 更且，對厚度0.70mm之NA_35的玻璃基板施行喷砂處理， 並在該NA-35的玻璃基板上形成深度3〇〇# m之凹部與寬2 〇 mm之周邊突條部，以取得密封板之實驗片，且將該等當作比 較例2在比較例2之搶封板的實驗片中，雖會於中央凹部發 生噴砂法特有的微小裂紋等，但是周邊突條部之頂面凹凸的 _ 最大值，可維持NA-35之玻璃基板的凹凸，且不一定為1〇//m 未滿。 接著，在實施例1及比較例丨〜2之密封板之實驗片的周邊突 條部，分別塗佈適量的紫外線硬化型之環氧樹脂製之黏著 劑，且對於從玻璃基板與密封板之實驗片的兩侧形成於玻璃 基板2與周邊突條部之間的密封部份藉由一面施加98〇 N/m (IGOkg/m2)左右之力而—面對黏著劑照射紫外線，以在 玻璃基板與周邊突條部間之密封部份形成黏著層，並製作有 · 機EL元件。 將如此製作成的有機EL元件利用驅動電流l〇 mA/cm2進行 連續驅動並測定焭度之減半壽命。將該測定結果顯示於表1 中。 從表1可明白如下事情。 (實施例1) 在實施例1中在基板與周邊突條部間之密封部份的全區 86751 -25- 1276365 域，黏著層之厚度為均等，而亮度之減半壽命可非常地增加 壽命長至5000小時。 又，初期的驅動電壓8 V會隨著驅動時間之增加而降低亮 度，雖然為了要維持亮度而需要使驅動電壓上升，但是只要 使初期的驅動電壓上升至12 V即可維持亮度。 (比較例1) 在比較例1中，因轉印至周邊突條部之頂面的碳製鑄模之微 J凹凸，而無法在基板與周邊突條部間之密封部份上均等形 成黏著層，且減半壽命會減短至2000小時。又，初期的驅動 電壓，雖與實施例i同樣為8 V，但是為了維持亮度而有必要 使初期的驅動電壓上升至25 V以上。 (比較例2) 在比較例2中，0喷砂所產生的細裂紋，使實驗片在黏著層 形成時之按壓下破裂，且無法製作有機EL元件。 因此，在形成黏著層時施加49〇N/m2(5〇kg/m2)左右之力以 衣作有機ELtc#。但是，在該條件下如圖3之黏著層所示 無法在密封部份上形成均等，且亮度之減半壽命會減短至 250:小時。又’初期的驅動電壓，雖與實施例}同樣為8 V， 但是為了維持亮度而有必要使初期的驅動電壓上升至乃v以 上。 若依據本實施例，則可明白當周邊突條部之頂面凹凸的最 大值為1G”未滿時’就可因將基板與周邊突條部間之密封 邛伤的黏者層之厚度形成均等，而有效防止水分或氧侵入此 兀件内並謀求EL元件之長壽命化。 86751 -26- 1276365 以下，說明本發明第二實施形態之實施例。 本發明人，有製作在周邊突條部3 1 a之内側面3 13配設分子 篩50的有機EL元件l〇〇a(實施例2(圖5)及實施例3(圖8)、以及 在周邊突條部31 a之内側面313未配設分子篩50的有機EL元 件100a(比較例3)。在此，實施例2之有機EL元件100a，係在 周邊突條部31a之頂面具備用以保持分子篩5〇的玻璃薄板 311。 對如此所製作的有機EL元件1 〇〇a照射紫外線，且以驅動電 流1 0 mA/cm2進行連續驅動並測定維持初期亮度用的驅動電 壓上升（V)及亮度之減半壽命（小時），進而將其測定結果顯示 於表2中。 表2 分子篩 玻璃薄板 党度減半壽命 驅動電壓上升 實施例2 有 有 6000小時 小（4 V) 實施例3 有 無 4000小時 小（7 V) 比較例3 無 無 5 00小時 大（12V) 從表2中可明白，當在周邊突條部3 1 a之内側面3 13配設分子 篩50時，可一面抑制有機EL層疊膜22a之劣化，而一面充分 取出始自發光層之光。 又’可明白當使用在周邊突條部31a之頂面具備保持分子筛 50之玻璃薄板311的密封板30a時，可確實地一面抑制有機EL 層疊膜22 a之劣化，而一面充分取出始自發光層之光。 86751 -27- 1276365 (產業上之可利用性） 如以上詳細說明，若依據本發明第一態樣之el元件用密封 板，則由於周邊突條部之頂面凹凸的最大值為丨〇 # m未滿， 所以可將基板與周邊突條部間之密封部份的黏著層之厚度設 在均等，可有效防止水分或氧侵入el元件内部並謀求EL元件 之長壽命化。 若依據第一態樣之EL元件用密封板，則由於中央部使用蝕 刻法加工成凹部，所以可平滑地加工中央凹部之底面。 若依據第一態樣之EL元件用密封板，則由於蝕刻法係濕式 钱刻法，所以更可平滑地加工中央凹部之底面。 若依據第一態樣之密封板多個削取用母玻璃基板，則由於 上述玻璃製EL元件用密封板大致形成矩陣狀，所以可提高el 元件用密封板之生產性。 又，如以上詳細說明，若依據本發明第二態樣之EL元件用 密封板，則由於在周邊突條部之内侧面配設有吸濕劑，所以 可一面抑制EL層疊膜之劣化，而一面充分取出始自發光層之 光。 若依據第二態樣之EL元件用密封板，則由於在周邊突條部 之頂面，具備有於中央具有開口部的同時保持吸濕劑的保持 部，所以可確實抑制EL層疊膜之劣化。 若依據第二態樣之EL元件用密封板，則由於保持部之開口 緣係從周邊突條部之内側面朝内侧突出，所以可確實保持吸 濕劑。 若依據第二態樣之EL元件用密封板多個削取用母玻璃基 86751 -28- 1276365 板，則由於上述密封板大致形成矩陣狀，所以可達成與上述 效果同等的效果。 若依據第二態樣之EL元件用密封板之製造方法，則由於準 備玻璃素板、及蝕刻速度慢於玻璃素板之玻璃薄板，在玻璃 素板上黏接玻璃薄板，將黏接有玻璃薄板之玻璃素板，以在 周邊部規定周邊突條部之方式在中央部從玻璃薄板側開始蝕 刻加工成凹狀，所以可同時進行玻璃素板與玻璃薄板之蝕 刻，且可容易製造EL元件用密封板。 若依據第二態樣之EL元件用密封板之製造方法，則由於玻 璃素板與玻璃薄板之黏接係利用加熱熔接而進行，所以可確 實黏接玻璃素板與玻璃薄板。 右依據第二態樣之EL元件用密封板之製造方法，則由於加 熱熔接係在玻璃素板與玻璃薄板之間介設低熔點玻璃而進行 者，所以更可確實黏接玻璃素板與玻璃薄板。 若依據第二態樣之EL元件用密封板之製造方法，則由於黏 接係使用黏著劑而進行，所以無須加熱，即可黏接玻璃素板 與玻璃薄板。 【圖式簡單說明】 圖1係具備本發明第一實施形態之EL元件用密封板的EL元 件之剖面圖。 圖2係用於圖1之EL元件100之密封板30大致形成矩陣狀的 密封板多個削取用母玻璃基板之平面圖。 圖3係具備使用壓製法而加工之EL元件用密封板的EL元件 之剖面圖。 86751 -29- 1276365 圖4係具備使用噴砂法而加工之EL元件用密封板的EL元件 之剖面圖。 圖5係具備本發明第二實施形態之EL元件用密封板的EL元 件之剖面圖。 圖6係顯示圖5之密封板3〇a之製造方法的流程圖。 圖7係顯不圖5之密封板3 〇 a之另^一製造方法的流程圖。 圖8係圖5之有機EL元件100a之變化例的剖面圖。 【圖式代表符號說明】 10、 10a 基板 20 有機EL層疊體 21 透明導電膜 11、 22a 有機EL層疊膜 23 背面電極 24 拉出電極 30、 30a 密封板 3卜 31a、101 周邊突條部 32、 32a 、 102 凹部 33 底部表面 40 黏著層 50 分子篩 60 裂紋 100 、100a EL元件 200 密封板多個削取用母玻璃基板 311 玻璃薄板 86751 -30- 1276365 312 開口緣 313 内側面 -31 - 867511276365 发明Invention Description: [Technical Field] The present invention relates to a sealing plate for an electroluminescence element, a method of manufacturing the same, and a plurality of mother glass substrates for cutting the sealing plate. [Prior Art] An electroluminescence (hereinafter referred to as "EL") element generally includes a substrate on which an EL laminate film is formed, and a peripheral protrusion portion on which a top surface is adhered to the substrate by an adhesive. In the peripheral portion, the central portion is processed into a concave shape, and the sealing plate for covering the EL laminated film formed on the substrate is covered. The substrate and the sealing plate are adhered by an adhesive layer composed of an adhesive disposed on the sealing portion between the substrate and the peripheral ridge portion. As the material of the sealing plate, metal, glass, resin, or the like can be used. In the case where the sealing plate is made of a metal, it is necessary to keep the insulating spacer mixed between the substrate and the peripheral ridge portion for the purpose of maintaining electrical insulation of the drawn electrode portion formed on the substrate. In some cases, the gap between the substrate and the peripheral ridge portion becomes larger than that of the spacer, and the possibility of external moisture intruding from the portion becomes high. Further, in the top emission structure in which the light from the light-emitting layer is taken out from the sealing plate side, since the sealing plate is required to have transparency, a sealing plate made of metal cannot be used. Therefore, in the case where the EL element employs the top emission structure, the sealing plate is made of plastic or glass having insulation and transparency. However, plastics are rarely used as a material for a sealing plate because of their water absorption properties, and are often used as a material for a sealing plate because of their excellent insulating properties, transparency, and water resistance. 86751 1276365 As a method of processing a glass sealing plate, there is a pressing method (H 3) for bending a glass plate itself and a sandblasting method (10) 4) for removing a central portion of the glass plate. As shown in FIG. 3, in the sealing plate 3 which is processed by the press method, since the mold having minute irregularities is used to prevent burn marks, the unevenness is transferred to the top surface of the peripheral ridge portion to lower the flat portion, and Moisture or oxygen easily enters from the adhesive layer 4〇 disposed on the sealing portion between the substrate 10 and the peripheral ridge portion 31. Moreover, as shown in FIG. 4, the sealing plate 3〇 processed by the blasting method has a small number of I unique to the blasting method on the surface of the central concave portion, so in order to adhere the sealing plate to the substrate 1G, On the other hand, when the pressure is applied to the adhesive layer 4〇 disposed on the sealing portion between the substrate 1 () and the peripheral ridge portion 31, the sealing plate 3 is broken. As the processing method of the sealing plate 30, in addition to the above-described pressing method or sand blasting method, there is an etching method, and according to this method, since the flatness of the top surface of the peripheral ridge portion 31 becomes high, and the surface of the central concave portion Since the minute crack does not occur, the pressure for bonding the substrate 10 and the sealing plate 3 can be uniformly adhered to the sealing portion. Further, even in the case where the sealing plate 30 is made of glass having excellent water resistance, when the amount of application of the adhesive to the sealing portion between the substrate 10 and the peripheral ridge portion 31 is very large, due to external moisture Or oxygen may intrude from the sealing portion and bring damage to the el laminated film itself, and the life of the EL element may be extremely shortened. Therefore, the amount of the adhesive applied to the seal 4 is tightly controlled. However, when the unevenness of the top surface of the peripheral ridge portion 31 is uneven, the adhesive is easily retained on the "recessed trowel, and the area of the top surface of the peripheral ridge portion 31 is 86751 Ϊ 276365, that is, coating. When the area of the adhesive is large, it is difficult to uniformly form the thickness of the adhesive layer 40. Therefore, even if only the amount of the adhesive applied to the sealing portion between the substrate 10 and the peripheral ridge portion 31 is tightly controlled, It is difficult to form the adhesive layer 40 of a certain thickness to the sealing portion, and there is a first problem that external moisture or oxygen may intrude from a portion having a certain thickness of the adhesive layer 4〇 and shorten the life of the EL element. In view of the above, there are two types of EL elements which are well known, one of which is that the light-emitting layer can be selectively illuminated by selectively applying a voltage to the opposite electrode and the back surface of the light-emitting layer. The passive type displayed on the matrix is another active type that can be switched at high speed by using a high-speed switching function and is suitable for moving book display. The passive EL element is a simple matrix structure and includes a certain plate; Equipped with the base An electrode on a plate; an EL laminate including a light-emitting layer laminated on the electrode; a back electrode laminated on the EL laminate; and a glass sealing plate for bonding the top surface to the laminate The peripheral ridge portion on the substrate of the laminate is formed into a concave shape in a manner defined by the peripheral portion, and the sealing portion on the top surface of the peripheral ridge portion is adhered to the substrate. The EL element adopts an active matrix type structure, which, like the structure of the TFT liquid crystal element, includes a substrate; a thin film transistor circuit or a diode formed on the substrate per pixel; and a light-emitting layer, and is laminated thereon a thin film transistor circuit or a laminate on the upper surface of the diode; and a glass sealing plate in which a peripheral protrusion is adhered to a peripheral portion of a substrate on which the EL laminate is laminated. The central portion is processed into a concave shape, and the sealing portion of the top surface of the peripheral protruding portion is adhered to the substrate. 86751 -9- 1276365 The above-mentioned rear and sealing portions are configured to cover the interior of the el element from moisture or oxygen. Broken seal. In the EL element of the type and the EL element of the above-described active type, the EL element of the top emission type is formed by removing the light from the light-emitting layer from the side of the sealing plate by forming the light-emitting layer to the side of the sealing plate by a transparent member. In the EL element of the top emission type, the sealing element of the sealing plate can be sealed by blocking the moisture or oxygen from the inside of the el element, but the sealing property of the sealing portion is lowered and used due to the long-term use. When the EL laminated film is mixed in the EL element, the EL laminated film is deteriorated. In order to suppress the deterioration of the EL laminated film, a moisture absorbent is disposed in the sealed EL element to improve the water resistance to the mixed moisture. The moisture absorbent is generally disposed on the entire inner surface of the concave portion of the sealing plate facing the EL laminate. However, when the moisture absorbent is disposed on the entire inner surface of the concave portion of the sealing plate facing the EL laminate, the sealing is performed. In the top emission structure in which the light from the light-emitting layer is taken out from the plate side, a sufficient aperture ratio cannot be obtained, and there is a second problem that the light from the light-emitting layer cannot be sufficiently taken out. The first object of the present invention is to provide an EL element sealing plate which can effectively prevent moisture or oxygen from entering the EL element and to extend the life of the EL element, and a plurality of mother glass substrates for the sealing plate. Further, the second object of the present invention is to provide a top-emission type EL element ritual and sealing sheet and a method for producing the same, which are capable of sufficiently extracting light from a light-emitting layer while suppressing deterioration of an El laminated film. And a plurality of mother glass substrates for cutting the sealing plate. SUMMARY OF THE INVENTION 86751 -10- 1276365 In order to achieve the above first object, the first embodiment of the electroluminescent device of the present invention is used for sealing a plate, which is made of glass, and is bonded to the top surface thereof by an adhesive. The peripheral ridge portion on the substrate is defined in the peripheral portion, and the central portion is processed into a concave shape. The laminated body laminated on the substrate is characterized in that the maximum value of the top surface unevenness of the peripheral protruding portion is The system IG/zm is not full. In the sealing plate for an electroluminescence element according to the first aspect, preferably, the central portion is processed into a concave shape by a money engraving method. Further, 'better' is the above-mentioned method of the wet method. In order to achieve the above-described first object, a plurality of mother glass substrates for a sealing plate according to a first aspect of the present invention are characterized in that the sealing plate for an electroluminescent device is formed into a substantially rectangular coating. In order to achieve the above second object, a sealing plate for a rainbow element according to a second aspect of the present invention is made of glass, and is defined by a peripheral portion of a top surface of the top surface of the laminated EL laminate. The central portion is processed into a concave shape in the peripheral portion of the phantom type, and is characterized in that a moisture absorbent is disposed on the inner side surface of the peripheral protruding rib. A molecular sieve is used in the sealing plate for the EL element of the first impurity. Preferably, the moisture absorber is the same as the moisture absorption agent, and the top surface of the EL element sealing plate is held in the second aspect, and the top surface of the ridge portion is provided with (4) a central device _ a wet agent Keeping section. Further, it is preferable that the inner side surface of the opening edge portion of the holding portion protrudes inward from the periphery. The degree of exhaustion is 〇·〇5~1·ι mm. Further, the above-mentioned holding portion is made of alkaline glass. In order to achieve the above-mentioned second object, the above-mentioned EL7t sealing plate is formed in a substantially matrix shape. In order to achieve the second aspect of the present invention, a method for producing a sealing plate for an EL element according to a second aspect of the present invention is characterized in that: a glass plate is prepared, and (4) a glass plate having a slower speed than the glass plate, on the glass plate The glass sheet to which the glass sheet is adhered is adhered to the glass sheet of the glass sheet to define a peripheral strip at the peripheral portion. In the center portion, the concave portion is formed in a concave shape from the side of the glass sheet, and a moisture absorbent is disposed on the inner side surface of the peripheral ridge portion. The car is also good for the second aspect of the above-mentioned bonding system (four) plus pure connection. Further, it is preferable that the heat-melting is carried out by interposing a low-melting glass between the glass sheets of the glass field plate. In order to achieve the second object of the present invention, a method for producing a sealing plate for an EL element according to a third aspect of the present invention is characterized in that a glass plate and a glass plate are prepared, and a peripheral ridge portion is defined in a peripheral portion at a portion of the center portion. The glass plate is processed into a concave shape by the rice sheet, and the glass sheet is processed in such a manner that the opening area of the glass plate having the opening area smaller than that of the (4) processed glass plate is cut so as to open the opening edge of the opening portion. 4. The inner side of the peripheral ridge portion protrudes toward the inner side. The glass plate which has been processed by the above-mentioned money is bonded to the glass plate of the above-mentioned name and the surface of the peripheral ridge portion is provided with a moisture absorbent. In the third aspect of the method for producing an EL element sealing plate, it is preferable that the bonding system is performed by heat welding. Further, the above-mentioned heat-welding is carried out by interposing a low-melting glass between the glass sheets of the glass plate. Further, more preferably, in the method of manufacturing a sealing plate for a component according to the second aspect and the third aspect, the bonding is performed using an adhesive. [Embodiment] The inventors of the present invention conducted intensive studies to achieve the above first object, and found that the peripheral ridge portion for adhering the top surface thereof to the substrate via an adhesive is defined in the peripheral portion. In the sealing plate for the EL element made of glass, which covers the EL laminated body laminated on the substrate, the maximum value of the page unevenness of the peripheral ridge portion is less than 1 〇. In the case where the thickness of the sealing portion of the sealing plate of the sealing plate is made uniform, it is possible to effectively prevent moisture or oxygen from entering the EL element and to extend the life of the EL element. In addition, the inventors of the present invention conducted intensive studies to achieve the above-described first object, and as a result, found that the peripheral dog strips on the substrate on which the top surface is bonded to the laminated body are attached to the peripheral portion. In the sealing plate for an EL element in which the central portion is processed into a concave glass, when the moisture absorbing agent is disposed on the inner side surface of the peripheral ridge portion, 'the inner side surface of the peripheral ridge portion is provided with moisture absorption. Since the agent can suppress the deterioration of the EL laminated film, the light from the light-emitting layer can be sufficiently taken out. The present invention has been developed based on the above findings. In the following, the EL element sealing plate according to the first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a cross-sectional view showing an EL element including a sealing plate for an EL element according to a first embodiment of the present invention. Figure 1 _, EL element 1 〇〇, takes the bottom end emission structure, and contains the size 86751 -13 - 1276365 7. A plate-shaped transparent glass substrate 10 having a thickness of 1 cm and a thickness of 1 mm, an organic EL laminate 20 formed on the substrate 10, and a sealing plate 30 covering the organic EL laminate 20. The sealing plate 30 is made of, for example, a wet etching method by a size of 5. 0 cm, thickness 0. A 70 mm plate-shaped transparent alkali-free glass (for example, NA-35: manufactured by NH Tech Glass Co., Ltd.) is formed of a glass plate, and a width of 2 is specified for the peripheral portion of the concave portion 32. The peripheral portion of the 0 mm portion is formed into a concave shape, and the thickness of the bottom portion of the concave portion 32 is 0. 4 mm. The substrate 1A and the peripheral ridge portion 31 are disposed on a sealing portion formed between the substrate 10 and the top of the peripheral ridge portion 31, for example, an adhesive made of an ultraviolet curing epoxy resin. The adhesive layer 40 is formed to be bonded. The sealing plate 30 is bonded to the substrate 10 first, after the peripheral rib portion 31 is coated with a certain amount of adhesive, the sealing plate 30 is placed on the substrate 1 ,, and secondly, 980 N is applied to the sealing portion. The force of /m2 (l〇〇kg/m2) is performed by pressing the sealing plate 30 against the substrate 1 while irradiating the adhesive with ultraviolet rays. On the bottom surface 33 of the concave portion 32 of the sealing plate 30, a molecular sieve 50 is applied to adsorb moisture (manufactured by Uni〇n Carbide Co., Ltd., and when the molecular sieve 50 is applied and the sealing plate 30 is applied When the substrate is bonded to the substrate, it is preferably carried out in a dry environment or under reduced pressure in order to eliminate the influence of moisture or oxygen. Further, in the present embodiment, the moisture absorbent is the best molecular sieve 5 〇, but The present invention is not limited thereto, and may be, for example, cerium oxide (Si〇2), a desiccant (Clay desiccant), calcium carbonate, calcium oxide, calcium citrate, etc. The organic EL laminate 20 is formed to be formed. a transparent conductive film 2 1 made of an ITO (Indium Tin Oxide) film having a thickness of 3 〇〇 86751 -14 and 1276 365 nm on a substrate 1 , comprising a light-emitting layer described later, and laminated on the surface of the transparent conductive film 21 An organic EL laminated film 22; a back electrode 23 formed on the surface of the organic EL laminated film 22 and composed of a thickness of 3〇〇nmiMg-Ag (magnesium-silver) alloy; and a back electrode 23 connected to the back surface electrode 23 and having a thickness of 300 nm The pull-out electrode 24 composed of the ITO film. The organic EL laminate film 22 is transparent On the side of the electro-membrane 21, a hole transport layer of 70 nm in thickness composed of three bisamines, followed by a 70 nm-thickness light-emitting layer composed of a base complex and a complex mixture, and a back electrode are further laminated. Between 23 and the luminescent layer, a transparent electron transport layer composed of triazole or carbazole may be disposed. The surname engraving used in the above wet money engraving method is preferably hydrogen fluoride 5~ 50% by mass of an acid containing at least one selected from the group consisting of sulfuric acid, hydrochloric acid, nitric acid, and phosphoric acid, thereby increasing the residual force. Further, a strong acid selected from the group of the inorganic acids Further, it may be a monomer or a mixture of two or more types, and the above-mentioned residual solution may preferably contain one or two selected from the group consisting of tannic acid, diterpenic acid, amines, and amino acids. An organic acid or a salt group or the like may be added. Further, a surfactant may be appropriately added to the above-mentioned money engraving liquid, and the added surfactant may be appropriately changed. For example, the composition and concentration of the engraving liquid described above are According to the temperature of the engraving liquid, and the composition or type of the glass of the name Further, when the money engraving is performed, it is also effective to shake the etched glass or to provide a super-sound ultrasonic wave, whereby the etching solution can be formed into an equal solution. When the surname treatment is carried out, it is also effective for taking out from the residual liquid and once impregnating at least the amines and amine-based structures selected from the group consisting of 86751 -15-1276365 acid. By water, or sulfuric acid An acid which is not composed of one of hydrochloric acid, nitric acid and phosphoric acid, or an organic acid or a salt group selected from the group consisting of a carboxylic acid, a dicarboxylic acid, or a group of two or more, can be uniformly subjected to an etching treatment. In the embodiment, as a method of forming the concave portion 32 on the glass plate, a wet type (four) is used! The method, but it may be a dry method or a dry etching method or a wet etching method. In the wet type engraving method, batch processing can be performed by selecting the composition of the surname engraving and the engraving temperature, and the productivity of the sealing sheet 30 can be improved. On the other hand, in the dry etching method, although the etching treatment can be performed precisely, the batch processing cannot be performed, and the single-chip processing must be performed. Therefore, the productivity of the sealing sheet 3 is low. Further, although the sealing plate 30 is made of a glass plate having no alkali glass, depending on the configuration of the EL element 100, a low alkali glass or a soda lime glass or quartz glass may be used. The thickness of the bottom of the recess 32 of the sealing plate 30 is preferably on" mm. When the thickness is less than 0.3 mm, the strength of the bottom portion of the concave portion 32 of the sealing plate 30 is too small. When the thickness is larger than 1.1 mm, the strength of the sealing plate 30 is extremely large, but the thickness of the E] L element 100 cannot be made thin. According to the present embodiment, since the maximum value of the top surface unevenness of the peripheral ridge portion 3 i is less than 10 #m, the thickness of the adhesive layer 40 of the sealing portion between the substrate 10 and the peripheral ridge portion 31 can be formed. It is uniform, and it is effective to prevent moisture or oxygen from intruding into the interior of the EL element 1 and to prolong the life of the el element 1 . In the present embodiment, the organic EL laminated film 22 has a passive structure, but the 86751 -16-1276365 can also adopt an active structure. Further, in the present embodiment, the organic EL element has a bottom end emission structure, but a top emission structure may be employed. Further, the organic EL laminated film 22 is composed of a hole transport layer and a light-emitting layer, but an electron transport layer composed of a hole transport layer, a light-emitting layer, and triazole or morphine can also be used. Further, the EL layer film 'may also be an inorganic EL laminated film instead of the organic el laminated film 22. In this case, those which are composed of an insulating layer, a light-emitting layer, an insulating layer, or an electron barrier layer, a light-emitting layer, and a current limiting layer may be used from the side of the transparent conductive film. The sealing plate 30 used for the EL element 100 of Fig. 1 can be cut out from a plurality of cutting mother glass substrates of the sealing plate shown in Fig. 2 as described above except for the single-piece processing. Fig. 2 is a plan view showing a plurality of mother glass substrates for cutting which are used for the sealing plates of the EL elements 1 of Fig. 1 in a substantially matrix shape. In Fig. 2, a plurality of cutting mother glass substrates 200 for a sealing plate having a length of 30 cm and a width of 40 cm are provided with a sealing plate 30 having a matrix shape of 5 × 6. As a method of forming a 5x6 matrix-shaped sealing plate 3 on a glass plate, there is a method of removing a designated portion of the glass plate into a concave shape by a wet etching method. The glass plate used, its processing aspect from the thickness of 0. For a thickness of 5 mm or more and a thin element of the EL element, it is suitable to use a l l mm or less. In this method, first, in a glass plate made of an alkali-free glass (for example, NA-35 or the like), a width of 2. is used in order to form an exposed portion into a matrix of 5×6. The mask of the 5 mm band is masked, and the masked glass plate is immersed in the etching solution for about 1 to 180 minutes, and remains from the glass plate. 86751 17 1276365 1 1 Ο 1 It is removed into a concave shape to form a concave portion 丨02. The glass resist was after the glass plate was sufficiently washed with pure water. Thus, since the designated portion of the glass plate is removed into a concave shape by the wet-type method, the bottom surface of the recess 32 of the sealing plate 3 can be surely formed flat, and the strength of the sealing plate 30 can be increased against external pressure. . Then, as described above, the concave portion 102 is formed into a plurality of the mother glass substrates 2 for the sealing plates of the matrix shape of 5 x 6 and cut at the portions of the ridge portions 1〇1 of the predetermined concave portion 1〇2. Thereby, 30 (5 x 6) sealing plates 30, for example, for the el element 100 of Fig. 2 to be described later can be obtained. In the above embodiment, as the method of forming the concave portion 1 〇 2 on the glass plate, a wet etching method is used, but a dry etching method or a dry etching method or a wet etching method may be used in combination. The rear sealing plate has a plurality of mother glass substrates 2 for dicing, and although the sealing plates 3 are arranged in a matrix, they may be in the form of a matrix if they are arranged for a plurality of dicing. Also the width of the photoresist is not limited to 2. 5 mm, as long as the width of the peripheral ridge portion 3' of the obtained sealing plate 30 is equal to or greater than the thickness of the peripheral ridge portion 3', it is also possible to ensure the remaining amount of the sealing plate 30 to be about 1 cm. According to the plurality of mother glass substrates 2 for cutting according to the sealing plate of Fig. 2, the sealing plates 30 can be obtained by cutting separation, and the strength is increased to external pressure at the time of cutting, and the single-piece processing is eliminated. This improves the productivity of the sealing plate. Hereinafter, a sealing plate for an EL element according to a second embodiment of the present invention will be described with reference to the drawings. The EL element of the present embodiment basically has the same configuration as that of the el element 86751 -18-1276536 of the first embodiment. Therefore, the same components are attached to the same components and the description is omitted. Fig. 5 is a cross-sectional view showing an EL element including a sealing plate for an EL element according to a second embodiment of the present invention. In Fig. 5, the top emission type organic EL element i 00a adopts a passive structure and includes a size of 7·0 em and a thickness of 1. A plate-shaped transparent soda lime glass substrate 10a; an organic EL laminate 20 formed on the substrate 10a; and a sealing plate 3a covering the organic EL laminate 2A. The sealing plate 30a has a size of 5.0 cm and a thickness of 1. 1 mm of plate-shaped transparent soda lime glass made by the width of the top surface bonded to the substrate l〇a of the laminated El laminate 20. The peripheral ridge portion 31a of 0 mm is defined in the peripheral portion to process the central portion into a concave shape, and the thickness of the bottom portion is 〇. 8 mm. Further, the sealing plate 30a is provided on the top surface of the peripheral ridge portion 31a and has a size of 5. A glass plate 311 made of alkali-free glass having a 0 cm angle and a thickness of 0 el mm. The glass sheet 3 11 ' has an opening portion having an etched angle of 4·5 cm at the center while holding the molecular sieve 50 described above. The opening edge 3 12 of the glass sheet 3 11 protrudes inward from the inner side surface 3 13 of the peripheral ridge portion 31a. The molecular sieve 5's held by the opening edge 3 12 is disposed on the inner side surface 3 13 of the peripheral ridge portion 31a. The substrate 10a and the sealing plate 30a are bonded to each other via the adhesive layer 40 disposed in the sealing portion. Specifically, after the glass thin plate 311 is coated with a certain amount of the adhesive of the ultraviolet curable epoxy resin, the sealing plate 3〇a is placed on the substrate 1〇a, and then the sealing plate 30a is 1 by one side. The force of about 〇〇kg/m2 is pressed against the substrate 1a, and the ultraviolet rays are irradiated onto the adhesive. 86751 -19- 1276365 The formation of the concave portion 32a of the sealing plate 30a is performed by forming the glass plate into a concave shape by a wet type method described later. When the etching depth of the glass plate etched by the wet method was measured, it was 3 〇〇 #m. Further, the bottom portion of the concave portion 32a has a curved portion and a radius of curvature of about 3 〇〇 #m. The thickness of the bottom of the recess 32a of the sealing plate 30a is preferably 〇3~i ^ and the thickness is less than 0. When the thickness is 3 mm, the strength of the sealing plate 30a is insufficient, and when it is larger than limm, the strength of the sealing plate 30a is sufficiently obtained, but the thickness of the EL element 丨〇〇a cannot be reduced. Fig. 6 is a flow chart showing a method of manufacturing the sealing plate 3A of Fig. 5. In Fig. 6, first, a glass plate and a glass plate 311 are prepared (step S21). Here, the material of the glass sheet 3 11 is preferably slower than the glass plate in order to form the above-mentioned opening edge 3丨2. Next, the glass sheet 311 is bonded to the glass plate (step S22). The glass plate is bonded to the glass thin plate 311, and the glass thin plate 311 is heated to the vicinity of the softening temperature of the glass plate, and is performed by mutually refining. Further, the glass plate to which the glass thin plate 3 11 is adhered is processed into a concave shape from the side of the glass thin plate 311 at the center portion by the wet etching method to define the peripheral ridge portion 31a in the peripheral portion. S23), the molecular sieve 50 is disposed on the inner side surface 3 13 of the peripheral ridge portion 31a (step S24). The wet etching method in the above step S23 is performed after the acid resistance ▼ 'that is, the photoresist is masked so as to expose the central portion of the 4·5 cm angle of the glass plate to which the glass sheet 3 11 is adhered. The masked glass plate is impregnated with, for example, 20 mass. / Mixture of hydrazine hydrofluoric acid, 1% by mass of sodium dodecanoyl sulfonate, and kept at a temperature of 25 ° C. 86751 -20- 1276365 Further, the surname engraving used in the above wet remnant method is not limited to the above-mentioned surname engraving, and the same as in the first embodiment may be used. The composition of the liquid (4) and the concentration thereof may be appropriately changed depending on the temperature of the etching liquid and the composition or type of the glass to be etched. In the case of the implementation of (4), it is also effective to be shaken by the glass of money, or to give a weaker ultrasonic output. Thereby, the etching solution can be formed into an equal solution. Further, at the time of performing the etching treatment, the acid extracted from the (four) liquid and impregnated with at least one selected from the group consisting of water or sulfuric acid, hydrochloric acid, nitric acid, and phosphoric acid, or selected from the group consisting of carboxylic acids It is also effective in the group of the dicarboxylic acid 'amines and amino acids', or two or more types of organic acids or salts. Thereby, the etching treatment can be performed equally. Fig. 7 is a flow chart showing another manufacturing method of the sealing plate 3A of Fig. 5. In Fig. 7, first, a glass plate and a glass plate 3 n are prepared (step S31). Next, the glass plate is etched into a concave shape at the center portion so as to define the peripheral ridge portion 31a in the peripheral portion by the above-described wet etching method (step S32), and the glass sheet 3 11 is used in the above wet type. The etching method is performed by etching at a center having an opening area smaller than the opening of the recessed portion 32a of the etched glass plate (step S33). Further, the glass plate and the glass thin plate 311 which have been subjected to the etching process are adhered so that the opening edge 312 of the glass thin plate 311 protrudes inward from the inner side surface 313 of the peripheral protruding portion 31a (step S34), and is in the periphery. The inner side surface 313 of the ridge portion 3 la is provided with a molecular sieve 50 (step S35). According to the present embodiment, since the molecular sieve 50 is disposed on the inner side surface 313 of the peripheral ridge portion 31a, it is possible to sufficiently remove the initial light-emitting layer while suppressing the inferiority of the organic EL laminated film 22a from 86751 - 21 to 1276365. Light. In the present embodiment, a passive type is used as the organic element l〇〇a', but it is not limited thereto, and may be an active type. In the present embodiment, the sealing plate 30& while holding the molecular sieve 50 on the inner side surface 313 of the peripheral protruding portion 313 depending on the glass thin plate 3U provided on the top surface of the peripheral protruding portion 3u, is not limited thereto, for example. Alternatively, as shown in Fig. 8, the glass sheet may not be provided, and the adhesive layer 40 may be used as a holding mechanism. In the present embodiment, the soda lime glass is used as the sealing plate 3〇a for the glass plate, but the low-inspection glass, the non-authentic glass, and the quartz glass may be used in accordance with the configuration of the organic EL element 10〇3. Wait. In the present embodiment, although the alkali-free glass having a thickness of 〇·丨mm is used as the glass sheet 3 11 ′, the enthalpy is not limited thereto, and may be, for example, a thickness of 〇·05 〜1. 1 mm of non-test glass. In the present embodiment, the alkali-free glass is used as the glass sheet 3 11, but it is not limited thereto, and may be, for example, a low-alkali glass, a soda ash glass, a quartz glass or the like. In the present embodiment, the optimum molecular sieve 50 is used as the moisture absorbent, but the present invention is not limited thereto as in the first embodiment. In the present embodiment, the adhesion between the glass plate and the glass sheet 3 11 is performed by heating the glass sheet 3 11 to the vicinity of the softening temperature of the glass sheet to bond them to each other, but is not limited thereto. Therefore, a low-melting glass can be interposed between the glass sheet and the glass sheet 3 11 and can be bonded using an adhesive. In the present embodiment, as a method of forming the concave portion 32a on the glass plate, a wet etching method is used. However, as in the first embodiment, the dry type 86751 -22-1276365 or the dry type may be used in combination. Engraving and wet money carving. In the present embodiment, the organic EL laminated film 22 is used as the EL laminated film. However, the present invention is not limited thereto as in the first embodiment. The sealing plate 3A for the organic EL element 10a of Fig. 8 is produced as described above except for the single-piece process. The rest of the mother glass substrate 200 can be removed from the sealing plate. Cut out in the middle. Further, it is preferable that the shape of the plurality of cutting mother glass substrates 2 for cutting the sealing plate is the same as that of the sealing plate 30a. Further, a method of forming a matrix-shaped sealing plate 30a of 5 χ 6 on the above-mentioned glass plate may be applied to a glass plate on which a glass thin plate 311 having no opening portion is formed, or may be in the concave portion of FIG. 32a forms a glass sheet on which a matrix-shaped glass plate is bonded to form a matrix-shaped opening. According to the plurality of mother glass substrates 2 for cutting according to the sealing plate of Fig. 5, each of the sealing plates 3a can be obtained by cutting and separating, and the external pressure is increased in strength at the time of cutting, and the single-piece processing is eliminated. This is carried out to improve the productivity of the sealing plate 3〇a. Hereinafter, an embodiment of the first embodiment of the present invention will be described. The present inventors made the glass plate t by a wet etching method (Example 1), a pressing method (Comparative Example 1), and a sandblasting method (Comparative Example 2) to prepare a concave portion in the center portion and a peripheral portion. The test piece of the sealing plate of the peripheral ridge portion, (Example 1 and Comparative Examples 1 and 2) is as follows (Table 丨). 86751 -23- 1276365 Table 1 Concave portion processing method Concavity and convexity maximum brightness minus half life Driving voltage increase Example 1 Wet etching method 10 // m Less than 5000 hours small (12 V) Comparative example 1 Press method 10 μ m or more 2000 hours large (25 V) Comparative example 2 Sandblasting method 2500 hours large (25 V) First, An etchant consisting of a mixture of 20% by mass of hydrogen fluoride acid and 1% by mass of sodium dodecylsulfonate is prepared, and is covered by an angle of 5.0 cm and a thickness of 0. The acid-resistant belt of the outer surface of the glass plate consisting of 70 mm of alkali-free glass (NA-3 5), the peripheral surface, and the peripheral ridges is masked and the glass plate is immersed at 25 °. C in the above etching solution for 60 minutes, and taken out from the etching solution. By peeling off the acid-resistant tape after sufficiently washing with pure water, the concave portion having a depth of 3 〇〇//m and the periphery of a width of 2.5 mm were obtained. The ridge portion was formed on a glass plate, and a test piece of the sealing plate was obtained. From the test piece of the seal plate obtained in the above, the maximum value 1 〇 # m of the top surface convex portion of the peripheral ridge portion was regarded as the first embodiment. Pick up, one side will be thicker. The glass substrate of the NA-35 of 5 mm was heated to a temperature near the working temperature, and pressed with a carbon mold, and a recess of 300 / m depth and width was formed on the glass substrate of the NA-35. The peripheral ridge portion of 0 mm was taken to obtain a test piece of a sealing plate, and these were regarded as Comparative Example 1. In the test piece of the sealing plate of the comparative example 1, the micro-concavity of the carbon mold is not limited to the central recess, and it is also used as a carbon-coated mold of the 86751 -24-1276365. Transfer to the top surface of the peripheral ridge portion, and the maximum value of the top surface unevenness of the peripheral ridge portion exceeds 1 〇 #m. Moreover, the thickness is 0. 70 mm of the glass substrate of NA_35 was subjected to sand blasting, and a concave portion having a depth of 3 〇〇 #m and a peripheral ridge portion having a width of 2 mm were formed on the glass substrate of the NA-35 to obtain a test piece of the sealing plate, and In Comparative Example 2, in the test piece of the seal plate of Comparative Example 2, micro cracks unique to the sandblasting method were generated in the central concave portion, but the maximum value of the top surface unevenness of the peripheral protruding portion was The unevenness of the glass substrate of NA-35 is maintained, and it is not necessarily 1 〇//m. Next, an appropriate amount of an ultraviolet curable epoxy resin adhesive was applied to the peripheral ridge portions of the test sheets of the sealing sheets of Example 1 and Comparative Examples 丨 2, and for the glass substrate and the sealing plate. The sealing portion formed on both sides of the test piece between the glass substrate 2 and the peripheral ridge portion is irradiated with ultraviolet rays to face the adhesive by applying a force of about 98 〇N/m (IGOkg/m2) on one side to the glass. The sealing portion between the substrate and the peripheral ridge portion forms an adhesive layer, and an EL element is fabricated. The organic EL device thus fabricated was continuously driven by a driving current of 10 mA/cm 2 and the half life of the twist was measured. The measurement results are shown in Table 1. The following things can be understood from Table 1. (Embodiment 1) In the first region of the sealing portion between the substrate and the peripheral ridge portion in the first embodiment, the thickness of the adhesive layer is equal, and the half life of the brightness can greatly increase the life. Up to 5000 hours. Further, the initial driving voltage of 8 V decreases the luminance as the driving time increases, and the driving voltage needs to be increased in order to maintain the luminance. However, the luminance can be maintained by raising the initial driving voltage to 12 V. (Comparative Example 1) In Comparative Example 1, the micro-J unevenness of the carbon mold transferred to the top surface of the peripheral ridge portion was not able to form an adhesive layer uniformly on the sealed portion between the substrate and the peripheral ridge portion. And the half life will be reduced to 2000 hours. Further, the initial driving voltage is 8 V as in the case of the embodiment i. However, in order to maintain the brightness, it is necessary to increase the initial driving voltage to 25 V or more. (Comparative Example 2) In Comparative Example 2, the fine cracks generated by the 0 sand blasting caused the test piece to be broken under the pressure at the time of forming the adhesive layer, and the organic EL element could not be produced. Therefore, a force of about 49 〇N/m2 (5 〇kg/m2) was applied to form the organic ELtc# when the adhesive layer was formed. However, under this condition, as shown by the adhesive layer of Fig. 3, it is impossible to form an equalization on the sealing portion, and the halving life of the luminance is shortened to 250: hour. Further, the initial driving voltage is 8 V as in the embodiment. However, in order to maintain the brightness, it is necessary to increase the initial driving voltage to more than or equal to v. According to the present embodiment, it can be understood that when the maximum value of the top surface unevenness of the peripheral ridge portion is 1 G" is not full, the thickness of the adhesive layer which is caused by the seal between the substrate and the peripheral ridge portion can be formed. In the meantime, it is effective to prevent moisture or oxygen from intruding into the element and to extend the life of the EL element. 86751 -26- 1276365 Hereinafter, an embodiment of the second embodiment of the present invention will be described. The inner side surface 3 13 of the portion 3 1 a is provided with the organic EL element 10a of the molecular sieve 50 (the second embodiment (Fig. 5) and the third embodiment (Fig. 8), and the inner side surface 313 of the peripheral ridge portion 31a. The organic EL element 100a of the molecular sieve 50 is not disposed (Comparative Example 3). Here, the organic EL element 100a of the second embodiment is placed on the top of the peripheral ridge portion 31a to reserve the glass thin plate 311 of the molecular sieve 5'. The organic EL element 1 〇〇a thus produced is irradiated with ultraviolet light, and is continuously driven at a driving current of 10 mA/cm 2 to measure a driving voltage increase (V) for maintaining the initial luminance and a half life (hour) for the luminance. Further, the measurement results thereof are shown in Table 2. Table 2 Molecular sieve glass Thin plate party halving life drive voltage rise Example 2 There are 6000 hours small (4 V) Example 3 With or without 4000 hours small (7 V) Comparative Example 3 No 00 hours large (12V) As can be seen from Table 2 When the molecular sieve 50 is disposed on the inner side surface 3 13 of the peripheral ridge portion 31a, the light from the light-emitting layer can be sufficiently taken out while suppressing the deterioration of the organic EL laminated film 22a. When the top surface of the peripheral ridge portion 31a is provided with the sealing plate 30a for holding the glass thin plate 311 of the molecular sieve 50, the deterioration of the organic EL laminated film 22a can be surely suppressed, and the light from the light-emitting layer can be sufficiently taken out. 86751-27 - 1276365 (Industrial Applicability) As described in detail above, according to the sealing plate for an el element according to the first aspect of the present invention, the maximum value of the top surface unevenness of the peripheral ridge portion is 丨〇#m Therefore, the thickness of the adhesive layer of the sealing portion between the substrate and the peripheral ridge portion can be made uniform, and it is possible to effectively prevent moisture or oxygen from intruding into the interior of the el element and to achieve a long life of the EL element. Sealing plate for EL components, Since the central portion is processed into a concave portion by an etching method, the bottom surface of the central concave portion can be smoothly processed. According to the sealing plate for an EL element according to the first aspect, since the etching method is wet-type etching, it can be smoothly processed. In the bottom surface of the central recessed portion, the plurality of sealing mother glass substrates for the sealing plate according to the first aspect are formed in a matrix shape in the sealing member for the EL element, so that the productivity of the sealing member for the el element can be improved. Further, as described in detail above, according to the sealing plate for an EL element according to the second aspect of the present invention, since the moisture absorbent is disposed on the inner side surface of the peripheral ridge portion, deterioration of the EL laminated film can be suppressed. The light from the light-emitting layer is sufficiently taken out on one side. According to the sealing plate for an EL element according to the second aspect, since the holding portion having the opening portion and the moisture absorbent is provided on the top surface of the peripheral ridge portion, the deterioration of the EL laminated film can be surely suppressed. . According to the sealing plate for an EL element according to the second aspect, since the opening edge of the holding portion protrudes inward from the inner side surface of the peripheral ridge portion, the moisture retaining agent can be surely held. According to the second aspect of the EL element sealing plate, a plurality of the mother glass bases 86751 -28 to 1276365 are used for cutting, since the sealing plates are substantially formed in a matrix shape, the same effects as those described above can be obtained. According to the manufacturing method of the sealing plate for an EL element according to the second aspect, since the glass plate is prepared and the glass sheet having the etching rate is slower than the glass plate, the glass plate is bonded to the glass plate, and the glass is adhered. The glass plate of the thin plate is etched into a concave shape from the side of the glass sheet at the center portion so as to define the peripheral ridge portion in the peripheral portion. Therefore, the glass plate and the glass plate can be simultaneously etched, and the EL element can be easily manufactured. Use a sealing plate. According to the method for producing a sealing plate for an EL element according to the second aspect, since the adhesion between the glass plate and the glass plate is performed by heat welding, the glass plate and the glass plate can be surely bonded. According to the manufacturing method of the EL element sealing plate according to the second aspect, since the heat fusion bonding is performed by interposing a low-melting glass between the glass plate and the glass thin plate, the glass plate and the glass can be surely bonded. sheet. According to the method for producing a sealing plate for an EL element according to the second aspect, since the bonding is carried out using an adhesive, the glass plate and the glass sheet can be bonded without heating. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a cross-sectional view showing an EL element including a sealing plate for an EL element according to a first embodiment of the present invention. Fig. 2 is a plan view showing a plurality of mother glass substrates for use in a sealing plate in which a sealing plate 30 of the EL element 100 of Fig. 1 is formed substantially in a matrix. Fig. 3 is a cross-sectional view showing an EL element including a sealing plate for an EL element processed by a pressing method. 86751 -29- 1276365 Fig. 4 is a cross-sectional view showing an EL element including a sealing plate for an EL element processed by a sand blast method. Fig. 5 is a cross-sectional view showing an EL element including a sealing plate for an EL element according to a second embodiment of the present invention. Fig. 6 is a flow chart showing a method of manufacturing the sealing plate 3A of Fig. 5. Fig. 7 is a flow chart showing another manufacturing method of the sealing plate 3 〇 a of Fig. 5. Fig. 8 is a cross-sectional view showing a modification of the organic EL element 100a of Fig. 5. 10, 10a substrate 20 organic EL laminate 21 transparent conductive film 11, 22a organic EL laminated film 23 back electrode 24 pull-out electrode 30, 30a sealing plate 3 32a, 102 recess 33 bottom surface 40 adhesive layer 50 molecular sieve 60 crack 100, 100a EL element 200 sealing plate multiple cutting mother glass substrate 311 glass sheet 86751 -30- 1276365 312 opening edge 313 inner side -31 - 86751