JPS6276187A - Manufacturing thin film el panel - Google Patents
Manufacturing thin film el panelInfo
- Publication number
- JPS6276187A JPS6276187A JP60213682A JP21368285A JPS6276187A JP S6276187 A JPS6276187 A JP S6276187A JP 60213682 A JP60213682 A JP 60213682A JP 21368285 A JP21368285 A JP 21368285A JP S6276187 A JPS6276187 A JP S6276187A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- substrates
- thin film
- uneven surface
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- 239000000758 substrate Substances 0.000 claims description 41
- 239000000853 adhesive Substances 0.000 claims description 12
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 11
- 229920005989 resin Polymers 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 10
- -1 polysiloxane Polymers 0.000 claims description 10
- 229920001296 polysiloxane Polymers 0.000 claims description 10
- 230000000694 effects Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004873 anchoring Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000006059 cover glass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Landscapes
- Electroluminescent Light Sources (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
〔擾既要〕
本発明は薄膜ＥＬパネルの基板接合部分からの水分侵入
を防止することを目的をしたもので、パネル基板、背面
基板の内面周辺の接合部分にそれぞれポリシロキサン系
樹脂を噴射状に吹゛きかけ硬化させて凹凸面を形成し、
該両基板の接合部分を接着剤を介し接合することにより
目的の達成を図っている。[Detailed Description of the Invention] [Required] The purpose of the present invention is to prevent moisture intrusion from the substrate bonding portion of a thin film EL panel. A polysiloxane resin is sprayed and cured to form an uneven surface.
This objective is achieved by bonding the bonded portions of both substrates with an adhesive.
本発明は平面形ディスプレイパネルに適用される薄膜Ｅ
Ｌパネルの製造方法に係り、特にＥＬ素子が形成された
パネル基板に対するパッシベーション用カバーガラス（
背面基板）の接合方法の改良に関する。The present invention is a thin film E applied to a flat display panel.
Regarding the manufacturing method of the L panel, especially the passivation cover glass (
This invention relates to improvements in bonding methods for rear substrates).
薄膜ＢＬパネルは、第３図に示すように、パネル基板１
に背面基板２の凸状周辺部（接合部分）３を接着剤を介
し接合して密閉空間４を形成し、該密閉空間４内にオイ
ル等の保護流体５を封入して構成されている。この保護
流体５は、パネル基板１の内面に形成された透明電極２
発光層、誘電層よりなるＥＬ素子（図示省略）を保護す
るためのもので、注入口６より密閉空間４内に注入され
る。注入口６は注入完了後に千ツブ７により封止される
。この種の薄膜ＥＬパネルにおいては、両基板の接合部
分（イ）から密閉空間４内に水分が侵入するとＥＬ素子
が劣化してパネルの信頼度が低下する。従って、基板接
合を完全に行えるようにすることが重要な課題となる。As shown in FIG. 3, the thin film BL panel has a panel substrate 1.
A convex peripheral portion (joint portion) 3 of the rear substrate 2 is bonded to the rear substrate 2 via an adhesive to form a sealed space 4, and a protective fluid 5 such as oil is sealed in the sealed space 4. This protective fluid 5 is applied to transparent electrodes 2 formed on the inner surface of the panel substrate 1.
It is used to protect an EL element (not shown) consisting of a light emitting layer and a dielectric layer, and is injected into the sealed space 4 through an injection port 6. The injection port 6 is sealed with a spout 7 after injection is completed. In this type of thin film EL panel, if moisture intrudes into the sealed space 4 from the joint portion (a) of both substrates, the EL element will deteriorate and the reliability of the panel will decrease. Therefore, it is an important issue to be able to completely bond the substrates.
従来の両基板接合要領は第４図に示す通りで、両基板の
接合は、背面基板２の周辺部３の端面に４１′ンドエノ
チング等により凹凸面８を形成しておいて接着剤９を介
し両基板を張り合わせることにより行われる。The conventional procedure for joining both substrates is as shown in FIG. This is done by bonding both substrates together.
このような従来の接合方式では、背面基板側は、端面に
凹凸面が形成されているため、接着力が強化されかつ水
分の侵入経路も長くなって水分侵入防止効果を高めるこ
とができるが、パネル基板側は、凹凸面が形成されてい
ない（サンドエツチングによる凹凸面の形成はＥＬ素子
が破壊するため困難）ため、水分の侵入経路が短絡的で
十分な水分侵入防止効果は得られない。また、このよう
な従来の接合方式の場合、接着剤の塗布は通常スクリー
ン印刷法により背面基板の周辺部の凹凸面形成端面に対
し行われ、この接着剤を介し両基板を接合する際に、パ
ネル基板は凹凸面が形成されずに平滑であるため、第５
図に示すようにパネル基板１例の接合面に空泡１ｏが混
入し易く、水分がより一層侵入し易くなる。In such conventional bonding methods, the rear substrate side has an uneven surface formed on the end face, which strengthens the adhesive force and lengthens the path for moisture intrusion, which can enhance the effect of preventing moisture intrusion. Since no uneven surface is formed on the panel substrate side (it is difficult to form an uneven surface by sand etching because it destroys the EL element), the path for moisture intrusion is short-circuited, and a sufficient effect of preventing moisture intrusion cannot be obtained. In addition, in the case of such conventional bonding methods, the adhesive is usually applied to the uneven surface forming edge of the peripheral part of the back substrate by screen printing method, and when the two substrates are bonded via this adhesive, Since the panel substrate is smooth and has no uneven surface, the fifth
As shown in the figure, air bubbles 1o are likely to be mixed into the bonding surface of one example of the panel substrate, making it even easier for moisture to enter.
本発明は上述の問題点を解決することのできる薄膜ＥＬ
パネルの製造方法を提供するもので、そのための手段と
して、第１図（ａｌにパネル基板について例示したよう
に、パネル基板、背面基板をそれぞれ加熱し、加熱され
た該両基板の接合部分にそれぞれポリシロキサン系樹脂
を噴霧状に吹きかけ硬化させて凹凸面を形成した後、第
１図（ｂｌに示すように、咳両基板の接合部分を接着剤
を介し互いに接合する工程を採用している。The present invention is a thin film EL device that can solve the above-mentioned problems.
The present invention provides a method for manufacturing a panel, and as a means for that purpose, as illustrated for the panel substrate in FIG. After a polysiloxane-based resin is sprayed and cured to form an uneven surface, the joining parts of both substrates are joined to each other with an adhesive, as shown in FIG.
両基板の接合部分にそれぞれ凹凸面が形成されているた
め、アンカー効果による十分な接着強度が得られ、しか
も水の侵入経路も短絡部のない十分長いものとなる。従
って、信転度の高いＥＬパネルを得ることができる。Since uneven surfaces are formed at the joint portions of both substrates, sufficient adhesion strength can be obtained due to the anchor effect, and the water intrusion path is also sufficiently long without short circuits. Therefore, an EL panel with high reliability can be obtained.
以下、第１図及び第２図に関連して本発明の詳細な説明
する。The present invention will now be described in detail with reference to FIGS. 1 and 2.
本発明では、ポリシロキサン系樹脂によりパネル基板、
背面基板の接合部分にそれぞれ凹凸面を一体的に形成し
、該凹凸面同士を接着剤を介し接きする。In the present invention, panel substrates,
A concavo-convex surface is integrally formed at each joint portion of the rear substrate, and the concave-convex surfaces are brought into contact with each other via an adhesive.
第１図（ａ）は、パネル基板を例にとった凹凸面形成要
領を示すもので、凹凸面形成は、パネル基板１１をあら
かじめ所定温度に加熱しておき、該パネル基板１１の接
合部分に、スプレーガン１２で、ン容斉１１Ｔ：薄めら
れたロルコート等のポリシロキサン系樹脂１３を噴霧状
に吹きかけることにより行われる。１４は接合部分以外
をしゃへいするためのマスクである。パネル基１反１１
の予熱温度はン容剤の沸点以上とすることが望ましい。FIG. 1(a) shows a procedure for forming an uneven surface using a panel substrate as an example. In order to form an uneven surface, the panel substrate 11 is heated to a predetermined temperature in advance, and then the bonding portion of the panel substrate 11 is heated. This is carried out by spraying a diluted polysiloxane resin 13 such as Rollcoat in the form of a spray using a spray gun 12. 14 is a mask for shielding areas other than the joint portion. Panel base 1x11
It is desirable that the preheating temperature is higher than the boiling point of the container.
噴霧状に吹きかけられて基１反１１の接合部分に付着し
た樹脂：；１７５板１１が予熱されているため溶剤を失
い速やかに硬化し、接合部分には凹凸面１５が形成され
る。背面基板の接合部分にも同様に凹凸面が形成される
。Since the resin 175 plate 11 is sprayed and attached to the joint portion of the base 1 sheet 11 and is preheated, it loses the solvent and hardens quickly, and an uneven surface 15 is formed at the joint portion. Similarly, an uneven surface is formed at the joint portion of the rear substrate.
このように接合部分にそれぞれ凹凸面が形成されたパネ
ル基板１１と背面基板１６とを第１図（ｂ）に示すよう
に対向させ、接着剤１７を介し接合する。これにより両
基板の間には密閉空間１８が形成され、該密閉空間１８
内に保護流体を封入することにより薄膜Ｅ Ｌパネルが
構成される。１９は背面基板１６の接合部分に形成され
た凹凸面である。第２図は接合部分の拡大図で、２０．
２１は硬化したポリシロキサン系樹脂である。ところで
、ポリシロキサン系樹脂は、焼成後ガラスとほぼ同質な
ので、ガラスとの密着度は極めて高く、しかも残留水酸
基により接着剤としての高分子材料とも水素結合してガ
ラス直接よりも大きな密着度が得られる。またポリシロ
キサン系樹脂による凹凸面は、そのアンカー効果により
接着力を高めるとともに、水分の侵入経路を十分長くし
ている。The panel substrate 11 and the rear substrate 16, each of which has an uneven surface formed at the joint portion, are placed facing each other as shown in FIG. As a result, a sealed space 18 is formed between both substrates, and the sealed space 18
A thin film EL panel is constructed by enclosing a protective fluid within. Reference numeral 19 denotes an uneven surface formed at the joint portion of the rear substrate 16. Figure 2 is an enlarged view of the joint part, 20.
21 is a cured polysiloxane resin. By the way, polysiloxane resin is almost the same as the glass after firing, so it has extremely high adhesion to the glass, and the residual hydroxyl groups also hydrogen bond with the polymer material as an adhesive, resulting in a greater adhesion than directly to the glass. It will be done. Furthermore, the uneven surface made of polysiloxane resin increases adhesive strength due to its anchoring effect, and also provides a sufficiently long path for moisture to enter.
従って両基板１１．１６をポリシロキサン系樹脂の凹凸
面１５．１６を利用して上記のような接合を行うことに
より、十分な接合強度を持った信頼度の高いＥＬパネル
を得ることができる。Therefore, by bonding both substrates 11.16 as described above using the uneven surfaces 15.16 of the polysiloxane resin, a highly reliable EL panel with sufficient bonding strength can be obtained.
以上述べたように、本発明によれば、パネル基板、背面
基板の両方の接合部分に、これらの基板との密着性の良
いポリシロキサン系樹脂によりそれぞれ凹凸面を形成し
、これらの凹凸面同士を接着剤を介し接合するようにな
っているため、接合強度を高めるとともに水侵入経路を
大とすることができ、パネルの信頼性を高めることが可
能である。As described above, according to the present invention, uneven surfaces are formed on the joint portions of both the panel substrate and the rear substrate using polysiloxane resin that has good adhesion to these substrates, and these uneven surfaces are bonded to each other. Since the panels are bonded using adhesive, it is possible to increase the bonding strength and increase the water intrusion route, making it possible to increase the reliability of the panel.
第１図（ａ）、 （ｂｌは本発明の実施例の薄膜ＥＬパ
ネルの製造工程図、
第２図は間両基板接合部分の拡大図、
第３図は薄膜ＥＬパネルの構造を示す断面図、第４図は
従来の薄膜ＥＬパネルの基板接合要領説明図、
第５図は従来の接合方式の場合の不具合発生説明図で、
図中、
１１はパネル基十反、
１２はスプレーガン、
１３は噴霧状のポリシロキサン系樹脂、１５．１９は凹
凸面、
１６は背面基板、
１７は接着剤、
１８は密閉空間、
２０．２１は硬化したポリシロキサン系樹脂である。Figures 1(a) and (bl are manufacturing process diagrams of a thin-film EL panel according to an embodiment of the present invention, Figure 2 is an enlarged view of the bonding area between the two substrates, and Figure 3 is a cross-sectional view showing the structure of the thin-film EL panel. , Fig. 4 is an explanatory diagram of the procedure for bonding the substrates of a conventional thin-film EL panel, and Fig. 5 is an explanatory diagram of the occurrence of defects in the conventional bonding method. In the figure, 11 is a panel base, 12 is a spray gun, 13 15.19 is an uneven surface; 16 is a rear substrate; 17 is an adhesive; 18 is a closed space; 20.21 is a cured polysiloxane resin.
Claims (1)
れ加熱し、 次に前記両基板の接合部分にそれぞれポリシロキサン系
樹脂を噴霧状に吹きかけ硬化させて凹凸面を形成した後
、 前記両基板の接合部分を接着剤を介し互いに接合するこ
とを特徴とする薄膜ＥＬパネルの製造方法。[Claims] The panel substrate and the back substrate on which the EL elements are formed are heated, and then a polysiloxane resin is sprayed onto the joint portion of both substrates and cured to form an uneven surface. . A method for manufacturing a thin film EL panel, characterized in that the bonded portions of both substrates are bonded to each other via an adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60213682A JPS6276187A (en) | 1985-09-28 | 1985-09-28 | Manufacturing thin film el panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60213682A JPS6276187A (en) | 1985-09-28 | 1985-09-28 | Manufacturing thin film el panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6276187A true JPS6276187A (en) | 1987-04-08 |
Family
ID=16643232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60213682A Pending JPS6276187A (en) | 1985-09-28 | 1985-09-28 | Manufacturing thin film el panel |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6276187A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110199U (en) * | 1989-02-20 | 1990-09-04 | ||
| WO2004008810A1 (en) * | 2002-07-12 | 2004-01-22 | Nippon Sheet Glass Co., Ltd. | Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate |
-
1985
- 1985-09-28 JP JP60213682A patent/JPS6276187A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02110199U (en) * | 1989-02-20 | 1990-09-04 | ||
| WO2004008810A1 (en) * | 2002-07-12 | 2004-01-22 | Nippon Sheet Glass Co., Ltd. | Sealing plate for electroluminescent device, method for manufacturing same, and mother glass substrate for multi-production of sealing plate |
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