KR20070096939A - Process for preparing flat panel display and transfer film - Google Patents

Abstract

A process for preparing a flat panel display and a transfer film are provided to improve production efficiency by reducing the number of manufacturing processes. A lamination layer is formed on a transparent substrate. The lamination layer includes a resin layer including an inorganic powder and a photosensitive resin layer having a composition different from the composition of the resin layer. An exposing process is performed on the transparent substrate side and the lamination layer side of the transparent substrate. The lamination layer is developed and etched in order to form a lamination layer pattern. A bake process for the lamination layer is performed.

Description

Manufacturing Method and Transfer Film of Flat Panel Display {PROCESS FOR PREPARING FLAT PANEL DISPLAY AND TRANSFER FILM}

1 is a schematic diagram showing a cross-sectional shape of an AC plasma display panel.

Explanation of symbols for the main parts of the drawings

101: glass substrate

102: glass substrate

103: rear bulkhead

104: transparent electrode

105: bus electrode

106: address electrode

107: fluorescent material

108: dielectric layer

109: dielectric layer

110: protective layer

111: front bulkhead

[Patent Document 1] Japanese Patent Application Laid-Open No. 11-44949

[Patent Document 2] Japanese Patent Application Laid-Open No. 11-283495

This invention relates to the manufacturing method of a flat panel display, and the transfer film used suitably for the said manufacturing method.

In recent years, attention has been paid to flat panel displays (hereinafter also referred to as "FPD") such as plasma display panels (hereinafter referred to as "PDP") and field emission displays (hereinafter also referred to as "FED") as flat fluorescent displays. PDP is a display which forms a transparent electrode, seals inert gas, such as argon or neon, between two adjacent glass plates, and makes plasma discharge and makes a gas shine, and light-emitting fluorescent substance and display information. On the other hand, FED is a display which emits an electron in vacuum from an anode by applying an electric field, and irradiates the electron on the phosphor on the anode, thereby emitting a phosphor to display information.

1 is a schematic diagram showing a cross-sectional shape of an AC plasma display panel. In Fig. 1, reference numerals 101 and 102 are glass substrates arranged oppositely, 103 and 111 are partition walls, and the glass substrate 101, glass substrate 102, back partition 103, and front partition walls The cell is partitioned by 111. As shown in FIG. Numeral 104 is a transparent electrode fixed to the glass substrate 101, 105 is a bus electrode formed on the transparent electrode 104 for the purpose of lowering the resistance of the transparent electrode 104, and 106 is a glass substrate. It is an address electrode fixed to 102. 107 is a fluorescent material retained in the cell, 108 is a dielectric layer formed on the surface of the glass substrate 101 to cover the transparent electrode 104 and the bus electrode 105, and 109 is the address electrode 106 ) Is a dielectric layer formed on the surface of the glass substrate 102, and (110) is a protective film containing, for example, magnesium oxide. In the color PDP, a color filter (red, green, blue), a black matrix, or the like can be provided between the glass substrate and the dielectric layer in order to obtain a high contrast image.

As a method of manufacturing such a dielectric, partition, electrode, phosphor, color filter, and black stripe (matrix) of such a PDP, a photosensitive inorganic powder-containing resin layer is formed on a substrate, and ultraviolet rays are irradiated to a film corresponding to a portion to form a pattern. The photolithographic method in which a pattern is left on a substrate by developing later and calcined is preferably used (see, for example, Japanese Patent Laid-Open No. 11-44949).

However, in the conventional photolithography method as described above, when a pattern having a film thickness of 5 µm or more is formed, sensitivity to the depth direction of the inorganic powder-containing resin layer is insufficient, and a material having a wide development margin is not obtained. There is.

The present applicant has proposed a method for producing a PDP using a transfer film in Japanese Patent Laid-Open No. 11-283495 (Patent Document 2) as a means for solving such a problem in the photolithography method. The manufacturing method of PDP of Unexamined-Japanese-Patent No. 11-44949 forms the laminated film of an inorganic powder containing resin layer and a resist layer on a support film, transfers the laminated film on a board | substrate, and exposes the said resist film. A latent image of the resist pattern is formed, the resist film is developed to present the resist pattern, and the inorganic powder-containing resin layer is etched to form an inorganic powder-containing resin layer corresponding to the resist pattern. And forming the inorganic pattern on the surface of the substrate by firing the pattern.

However, in the above conventional method, for example, after forming a black matrix on a substrate, it is necessary to again form an electrode pattern by the same method, and further improvement in production efficiency was calculated | required.

The present invention aims to solve the above problems, and is preferably used in the method for producing FPD and the method for producing the FPD capable of efficiently forming a plurality of elements (for example, a black matrix and an electrode pattern) constituting the FPD. It is an object to provide a transfer film.

MEANS TO SOLVE THE PROBLEM As a result of earnestly examining in order to solve the said subject, when forming a laminated film containing an inorganic powder containing resin layer on a transparent substrate, it exposes and develops both sides of the transparent substrate in which the said laminated film was formed, and comprises a FPD. The present invention has been accomplished by discovering that a plurality of elements (for example, a black matrix and an electrode pattern, etc.) can be collectively formed.

That is, the manufacturing method of FPD which concerns on this invention is (1) the photosensitive inorganic powder containing resin layer (A) which contact | connects the said transparent substrate on a transparent substrate, and the photosensitive resin layer (B) differing in layer composition from the said resin layer (A). (2) pattern exposure of the transparent substrate on which the said laminated film was formed from the transparent substrate surface side and the laminated film formation surface side, respectively, (3) the said laminated film developing process or etching process, and a laminated film pattern And a step of firing the laminated film pattern.

As said photosensitive resin layer (B), the photosensitive inorganic powder containing resin layer or the resist layer which does not contain an inorganic powder is mentioned, for example. In addition, the laminated film may further include a non-photosensitive inorganic powder-containing resin layer (C).

The step (1) includes a step of transferring the photosensitive inorganic powder-containing resin layer (A) formed on the supporting film and / or the photosensitive resin layer (B) formed on the supporting film onto the transparent substrate;

A method comprising transferring a laminated film comprising said photosensitive inorganic powder-containing resin layer (A) formed on a supporting film and / or said photosensitive resin layer (B) formed on a supporting film onto said transparent substrate; or

It is preferable to perform the lamination | stacking film containing all the layers formed on the said transparent substrate on the support film by the method of carrying out the batch transfer on the said transparent substrate.

The photosensitive inorganic powder-containing resin layer (A) preferably contains metal powder and / or inorganic pigment powder, more preferably black pigment powder. As a preferable aspect of this invention, the said photosensitive inorganic powder containing resin layer (A) contains black pigment powder, and the said photosensitive resin layer (B) contains metal powder; And the photosensitive inorganic powder-containing resin layer (A) contains black pigment powder, the non-photosensitive inorganic powder-containing resin layer (C) contains a metal powder, and the photosensitive resin layer (B) contains an inorganic powder. The aspect which is a resist layer which is not used is mentioned. In addition, it is preferable that the said metal powder is silver powder.

In the FPD manufacturing method of the present invention, a black matrix pattern and an electrode pattern may be collectively formed on the black matrix pattern. In addition, the FPD is preferably a plasma display panel.

The transfer film according to the present invention is characterized in that a laminated film including a photosensitive inorganic powder-containing resin layer (A) and a photosensitive resin layer (B) having a different layer composition from the resin layer (A) is formed on a supporting film. . In addition, the transfer film of the present invention may further include a non-photosensitive inorganic powder-containing resin layer (C). In this case, the photosensitive resin layer (B), the non-photosensitive inorganic powder containing resin layer (C), and the photosensitive inorganic powder containing resin layer (A) are laminated | stacked and formed in the said order on the support film, and the said photosensitive resin layer (B) ) Is preferably a resist layer containing no inorganic powder.

In the transfer film of the present invention, the laminated film formed on the supporting film is preferably laminated by lamination. Moreover, the transfer film of this invention can be used suitably for the manufacturing method of the FPD of this invention.

Hereinafter, the manufacturing method of FPD which concerns on this invention, and the transfer film used preferably for the said manufacturing method are demonstrated in detail.

[Production method of FPD]

The manufacturing method of the FPD of this invention is a process of (1) forming the laminated | multilayer film containing the photosensitive inorganic powder containing resin layer (A) on a transparent substrate, and (2) exposing the transparent substrate surface side and laminated film formation surface side of a transparent substrate. Forming a pattern on the transparent substrate by a process comprising the steps of: (3) developing or etching each layer of the laminated film to form a laminated film pattern, and (4) baking the laminated film pattern. Characterized in that.

According to the FPD manufacturing method of the present invention, a plurality of elements constituting the FPD on the transparent substrate, preferably a black matrix pattern on the transparent substrate, and an electrode pattern on the black matrix pattern can be collectively formed. Moreover, the manufacturing method of this invention is suitable for manufacture of PDP, more specifically, the batch formation of the black matrix pattern and electrode pattern which comprise PDP. Hereinafter, each process is demonstrated.

(1) laminated film forming process

In this step, a laminated film including a photosensitive inorganic powder-containing resin layer (A) in contact with the transparent substrate and a photosensitive resin layer (B) different in layer composition from the resin layer (A) is formed on the transparent substrate.

As said photosensitive resin layer (B), the photosensitive inorganic powder containing resin layer (B-1) or the resist layer (B-2) which does not contain an inorganic powder is mentioned. In addition, the laminated film may further include a non-photosensitive inorganic powder-containing resin layer (C). In this case, the said non-photosensitive inorganic powder containing resin layer (C) is formed between the said photosensitive inorganic powder containing resin layer (A) and the photosensitive resin layer (B), and this resin layer (B) does not contain an inorganic powder. It is preferable that it is a resist layer.

The photosensitive inorganic powder-containing resin layer (A) preferably contains metal powder and / or inorganic pigment powder, more preferably black pigment powder. In the case of forming a preferred embodiment of the present invention, that is, a black matrix pattern and an electrode pattern, the photosensitive inorganic powder-containing resin layer (A) contains black pigment powder, and the photosensitive inorganic powder-containing resin layer (B-1). ) Contains a metal powder, or the photosensitive inorganic powder-containing resin layer (A) contains a black pigment powder, and the non-photosensitive inorganic powder-containing resin layer (C) contains a metal powder. In addition, it is preferable that the said metal powder is silver powder.

Although the said laminated | multilayer film can be formed by apply | coating and drying the liquid composition containing the component which comprises each layer by various methods, such as a screen printing method, a roll coating method, a rotary coating method, a flexible coating method, for each layer, In view of thickness uniformity and work efficiency, it is preferable to form on a transparent substrate using a transfer film.

Formation of the laminated film is, for example

Transferring the photosensitive inorganic powder-containing resin layer (A) formed on the supporting film and / or the photosensitive resin layer (B) formed on the supporting film onto the transparent substrate;

A method comprising transferring a laminated film comprising the photosensitive inorganic powder-containing resin layer (A) formed on the supporting film and / or the photosensitive resin layer (B) formed on the supporting film onto the transparent substrate; or

The laminated film containing all the layers formed on the said transparent substrate on the support film can be performed by the method of carrying out the package | transferring collectively on the said transparent substrate.

That is, the photosensitive inorganic powder containing resin layer (A), the non-photosensitive inorganic powder containing resin layer (C), and the photosensitive resin layer (B) may be transferred and formed for each layer on a transparent substrate as needed;

After transfer | transforming and forming layer (A) independently, you may transfer and form the laminated | multilayer film containing layer (C) and layer (B);

The laminated film including the layer (A) and the layer (C) may be transferred and formed, followed by the transfer of the layer (B) alone.

The laminated film including all the layers formed on the transparent substrate may also be collectively transferred.

An example of the transfer process is as follows. After peeling the protective film layer of the transfer film used as needed, the transfer film is superposed so that the surface of the photosensitive inorganic powder containing resin layer (A) may contact the surface of a transparent substrate, and this transfer film is heated with a heating roller etc. After crimping | bonding, the support film is peeled off from a resin layer (A). Thereby, the laminated film containing the resin layer (A) or the resin layer (A) is transferred to the surface of a transparent substrate, and it will be in the state stuck.

As transfer conditions, the surface temperature of a heating roller can be 80-140 degreeC, the roll linear pressure by a heating roller is 1-5 kg / cm, and the moving speed of a heating roller can be 0.1-10.0 m / min. In addition, the transparent substrate may be preheated, and the preheating temperature may be 40 to 120 ° C, for example.

The transparent substrate used by the manufacturing method of this invention will not be specifically limited if the photosensitive inorganic powder containing resin layer (A) which contacts on a transparent substrate can be exposed from the transparent substrate surface side opposite to a laminated film formation surface. Specifically, the plate-shaped transparent member containing heat resistant insulating materials, such as glass and quartz, is mentioned. Chemical treatment with a silane coupling agent etc. as needed with respect to the surface of this plate-shaped transparent member; Plasma treatment; Pretreatment, such as a thin film formation process by the ion plating method, the sputtering method, the vapor phase reaction method, the vacuum vapor deposition method, etc., can also be performed suitably.

(2) exposure process

In this step, radiation such as ultraviolet rays is selectively irradiated (exposured) to the photosensitive inorganic powder-containing resin layer (A) and the photosensitive resin layer (B) formed on the transparent substrate to form a latent image of each pattern. On the other hand, exposure from the transparent substrate surface side and the laminated film formation surface side may be performed simultaneously, or may be performed separately.

As an exposure method, the photosensitive inorganic powder containing resin layer (A) is irradiated selectively by irradiating radiation, such as an ultraviolet-ray, through an exposure mask from the transparent substrate surface side, and the photosensitive resin layer (B) from the laminated film formation surface side, respectively, and the latent image of each pattern And a method of forming a latent image of each pattern by scanning a laser beam without passing through an exposure mask.

It does not specifically limit as a radiation irradiation apparatus, Exposure using the exposure apparatus, solid-state laser, gas laser, semiconductor laser, or liquid laser which are used when manufacturing the ultraviolet irradiation device, semiconductor, and liquid crystal display device which are used by the conventional photolithographic method. A device etc. are mentioned.

(3) Developing process and etching process

In this step, each layer constituting the exposed laminated film is developed or etched to form a pattern of each layer (hereinafter referred to as a "laminated film pattern"). For example, when the laminated film containing the photosensitive inorganic powder containing resin layer (A) and the photosensitive inorganic powder containing resin layer (B-1) was formed, the pattern of the resin layer (A) and the resin layer ( By forming the pattern of B-1), a laminated film pattern is formed. In addition, when the laminated film containing the photosensitive inorganic powder containing resin layer (A), the non-photosensitive inorganic powder containing resin layer (C), and the resist layer (B-2) is formed, first, a resist process (B) is carried out by image development processing. The laminated film pattern is formed by forming the pattern of -2), forming the pattern of the resin layer (C) by the subsequent etching treatment, and forming the pattern of the resin layer (A) by the subsequent development treatment.

As the developing and etching treatment conditions, the type, composition, and concentration of the developing solution, the developing time, the developing temperature, and the developing method (for example, the dipping method, the shaking method, the shower method, the spray method, and the puddle method) according to the kind of the constituents of each layer, etc. , A developing device, etc. can be selected suitably.

By this development and etching process, in the case of a resin layer, the resin layer pattern which consists of a resin layer remainder and a resin layer removal part is formed, and also in the case of a resist layer, the resist pattern comprised by a resist remainder and a resist removal part is similarly carried out. Is formed.

The said resist pattern acts as an etching mask in the etching process of a non-photosensitive inorganic powder containing resin layer (C), for example. That is, the part corresponding to the resist removal part in the resin layer C when the part corresponding to the resist removal part of a resist pattern in a resin layer C melt | dissolves in an etching liquid, and is selectively removed, and continues etching process. The photosensitive inorganic powder containing resin layer (A) is exposed. Thereby, the resin layer (C) pattern which consists of a residual part and a removal part of the resin layer (C) is formed.

Therefore, it is necessary for the constituent material of the resist remaining portion (photocured resist) to have a smaller dissolution rate in the etching liquid than the constituent material of the resin layer (C). That is, it is preferable that the resist remaining portion constituting the resist pattern is gradually dissolved during the etching process and completely removed at the step (at the end of the etching process) in which the resin layer (C) pattern is formed. On the other hand, even if some or all of the resist remaining portion remains after the etching treatment, the resist remaining portion is removed in the following firing step.

Although different developing solution and etching solution can be used in the said developing process and the etching process, it is preferable to use the same solution as a developing solution and an etching solution. Thereby, the developing process and the etching process can be performed in a series of steps, and the production efficiency can be improved by simplifying the steps.

As said developing solution (etching solution), it is preferable that it is an alkaline solution (henceforth simply an "alkali developing solution"). Thereby, alkali-soluble resin contained in a resin layer and a resist layer can be easily dissolved and removed. On the other hand, since the inorganic powder contained in the inorganic powder-containing resin layer is uniformly dispersed by the alkali-soluble resin, the inorganic powder is also removed simultaneously by dissolving and washing the alkali-soluble resin, which is the binder resin, with an alkaline developer.

As active ingredients of the alkaline developer, for example, lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, diammonium hydrogen phosphate, dipotassium hydrogen phosphate, disodium hydrogen phosphate, ammonium dihydrogen phosphate, potassium dihydrogen phosphate, sodium dihydrogen phosphate Inorganic alkaline compounds such as lithium silicate, sodium silicate, potassium silicate, lithium carbonate, sodium carbonate, potassium carbonate, lithium borate, sodium borate, potassium borate and ammonia; Tetramethylammonium Hydroxide, Trimethylhydroxyethylammonium Hydroxide, Monomethylamine, Dimethylamine, Trimethylamine, Monoethylamine, Diethylamine, Triethylamine, Monoisopropylamine, Diisopropylamine, Ethanolamine Organic alkaline compounds, such as these, etc. are mentioned.

The alkaline developer can be prepared by dissolving one or two or more kinds of the alkaline compounds in water or the like. The concentration of the alkaline compound in the alkaline developer is usually 0.001 to 10 mass%, preferably 0.01 to 5 mass%. On the other hand, after the image development and etching process by alkaline developing solution is performed, the water washing process is performed normally.

(4) firing process

In this process, the laminated film pattern obtained by the said process (3) is baked. Thereby, the organic material in an inorganic powder containing resin layer remainder disappears, for example, the black matrix pattern is formed in the surface of a transparent substrate, and the panel material by which the electrode pattern is formed on the said black matrix pattern can be obtained. As described above, according to the present invention, a plurality of elements constituting the FPD, specifically, a black matrix pattern and an electrode pattern can be formed collectively, and the production efficiency can be improved by reducing the number of steps.

The baking treatment temperature is required to be a temperature at which the organic substance in the resin layer remaining portion disappears and the inorganic powder is fused, and is usually 400 to 600 ° C. Moreover, baking time is 10 to 90 minutes normally.

[Transfer film]

In the transfer film of the present invention, a laminated film including a photosensitive inorganic powder-containing resin layer (A) and a photosensitive resin layer (B) different in layer composition from the resin layer (A) is formed. In this case, it is more preferable that the said resin layer (B) and the said resin layer (A) are laminated | stacked and formed in the said order on a support film.

The laminated film in the transfer film of this invention can further contain the non-photosensitive inorganic powder containing resin layer (C) other than the said resin layer (A) and resin layer (B). In this case, it is preferable that the resist layer (B-2), the resin layer (C), and the resin layer (A) are laminated | stacked and formed in the said order on a support film.

On the other hand, in the FPD manufacturing method of the present invention as described above, in addition to the transfer film of the present invention, using the transfer film provided with the resin layers (A), (B), and (C) each on the support film alone, Each layer may be transferred onto a transparent substrate to form a laminated film. Moreover, using the transfer film in which the said resin layer (A) was provided independently on the support film, and the transfer film in which the laminated film containing a resin layer (C) and a resist layer (B-2) is formed, it forms on a transparent substrate. After the resin layer (A) is transferred to and formed on the resin layer (A), a laminated film including the resin layer (C) and the resist layer (B-2) may be transferred and formed on the resin layer (A). Moreover, using the transfer film in which the laminated | multilayer film containing the said resin layer (A) and the resin layer (C) is formed on a support film, and the transfer film in which the resist layer (B-2) was provided independently, it uses an image on a transparent substrate. After transfer | transferring and forming the laminated | multilayer film containing a resin layer (A) and a resin layer (C), the resist layer (B-2) can be transferred and formed on this resin layer (C).

<Support film>

It is preferable that the support film which comprises the said transfer film is a resin film which has heat resistance and solvent resistance, and has flexibility. As a support film has flexibility, a paste composition can be apply | coated by a roll coater, and an inorganic powder containing resin layer can be preserve | saved and supplied in the state wound up to roll shape.

Examples of the resin forming the support film include fluorine-containing resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, polyfluoroethylene, nylon, cellulose, and the like. Can be mentioned. The thickness of a support film becomes 20-100 micrometers, for example. On the other hand, it is preferable that the mold release process is given to the surface of a support film. Thereby, peeling operation of a support film can be performed easily in the transfer process mentioned above.

<Protective film>

In the transfer film of this invention, in order to protect the surface of the inorganic powder containing resin layer (A), a protective film (cover film) may be provided on the surface of this resin layer (A). It is preferable that this protective film is a flexible resin film, and it can preserve | save or supply the transfer film obtained by this in the state wound up to roll shape.

As resin which comprises the said protective film, a polyethylene terephthalate film, a polyethylene film, a polyvinyl alcohol-type film, etc. are mentioned. Moreover, the said support film can be used as said protective film. The thickness of a protective film is 20-100 micrometers, for example. In addition, a release treatment may be performed on the surface of the cover film.

<Photosensitive inorganic powder containing resin layer (A)>

The photosensitive inorganic powder containing resin layer (A) which comprises the transfer film of this invention is (a) inorganic powder, (b) binder resin, (c) photopolymerizable monomer, (d) photoinitiator, and (e) solvent It is formed using the paste-form photosensitive inorganic powder containing resin composition A containing. On the other hand, the composition A may further contain (f) a silane coupling agent or (g) other components.

The said resin layer (A) can be formed by apply | coating the said composition A on the resin layer (B) or resin layer (C) formed on the said support film, drying a coating film, and removing some or all of a solvent. Furthermore, the said composition A is apply | coated on a protective film, a coating film is dried and a part or all of a solvent is removed, and a resin layer (A) is formed on a support film, and the resin layer (B) is carried out separately from a support film. Or it can form also preferably by the method (laminating) which forms the resin layer (C), superimposes the surface of the obtained resin layer (A), and the obtained resin layer (B) or the resin layer (C) by pressing. . By lamination by lamination, it is possible to prevent deterioration of the photosensitive performance caused by intermixing of each layer. Meanwhile, a resist layer (B-2) may be formed between the resin layer (C) and the support film as necessary.

As a coating method of the said composition A, if the coating film with a large film thickness (for example, 10 micrometers or more) excellent in the uniformity of film thickness can be formed efficiently, it will not specifically limit, A well-known method can be employ | adopted. Examples of preferred coating methods include nozzle coaters, roll coaters, gravure coaters, blade coaters, knife coaters, bar coaters, doctor coaters, dip coaters, die coaters, reverse coaters, curtain coaters, wire coaters, orifice coaters, and the like. The film thickness of the said resin layer (A) is 1-20 micrometers normally. Drying conditions of a coating film are about 0.5 to 30 minutes at 50-150 degreeC, for example, and the residual ratio (content in resin layer A) of the solvent after drying is usually 2 mass% or less.

The composition A is an inorganic powder (a), a binder resin (b), a photopolymerizable monomer (c), a photopolymerization initiator (d), a solvent (e), and a silane coupling agent (f) or other component used as necessary. (g) can be manufactured by kneading | mixing using kneading | dispersing machines, such as a roll kneader, a mixer, a homo mixer, and a sand mill. On the other hand, it is preferable that the viscosity of the said composition A is 0.1-10 Pa.s.

(a) inorganic powder

Although the said inorganic powder (a) changes with kinds of forming material, a metal powder, an inorganic pigment powder, fluorescent substance powder, glass powder, etc. are mentioned, for example. As the inorganic powder used for the black matrix forming material which is a preferred embodiment of the present invention, black pigment powder, specifically tricobalt tetraoxide (Co ₃ O ₄ ) is preferable. Moreover, glass powder can also be used together.

The specific surface area of the tricobalt tetraoxide is preferably 7.5 m 2 / g or more and 20 m 2 / g or less, more preferably 10 m 2 / g or more and 20 m 2 / g or less. If the specific surface area of tricobalt tetraoxide is less than 7.5 m 2 / g, a black matrix having a low light transmittance cannot be obtained. Moreover, when it exceeds 20 m <2> / g, the black matrix which has favorable black may be unable to be obtained, for example, a black matrix of reddish color will be formed. In addition, the said specific surface area means the average value of the specific surface area calculated | required by the BET method of the tricobalt tetraoxide contained in the said composition. In addition, the average particle diameter of the tricobalt tetraoxide is usually 0.05 to 5.0 탆, preferably 0.1 to 0.5 탆.

As said glass powder, the glass powder whose softening point is 400-600 degreeC is preferable. If the softening point of the glass powder is less than 400 ° C, the glass powder melts in a step in which organic substances such as binder resin are not completely decomposed and removed in the firing step. Therefore, a part of organic substance remains in the formed black matrix, and there exists a possibility that the lifetime of fluorescent substance may be reduced as a result of outgas spreading in the obtained PDP. On the other hand, when the softening point of glass powder exceeds 600 degreeC, since an inorganic powder containing resin layer needs to be baked at higher temperature than 600 degreeC, a deformation | transformation etc. may occur in the transparent substrate which is a to-be-transferred body of the said resin layer.

Preferable specific examples of the glass powder include zinc oxide, boron oxide, and silicon oxide (ZnO-B ₂ O ₃ -SiO ₂ ); Lead oxide, boron oxide, silicon oxide (PbO-B ₂ O ₃ -SiO ₂ ); Lead oxide, boron oxide, silicon oxide, aluminum oxide (PbO-B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ); Lead oxide, zinc oxide, boron oxide, silicon oxide (PbO-ZnO-B ₂ O ₃ -SiO ₂ ); Bismuth oxide, boron oxide, silicon oxide (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ ) system; Lead-free glass containing bismuth oxide, boron oxide, silicon oxide, aluminum oxide (Bi ₂ O ₃ -B ₂ O ₃ -SiO ₂ -Al ₂ O ₃ ), etc., but not containing PbO in terms of environmental load It is preferable that it is powder. It is preferable that the average particle diameter of the said glass powder is 0.1-3.0 micrometers.

The content of tricobalt tetraoxide and the free powder in the inorganic powder (a) is preferably 30 to 50 mass% and 50 to 70 mass% of tricobalt tetraoxide based on the total amount of the inorganic powder. As the ratio of tricobalt tetraoxide is the above ratio, the tricobalt tetraoxide is embedded in the film together with the glass powder without depositing on the surface even after firing, thereby obtaining a black matrix having excellent surface smoothness and light shielding properties. Moreover, when the ratio of glass powder is the said ratio, the black matrix excellent in light-shielding property is obtained, and the effect that adhesiveness with respect to the board | substrate after baking, and film strength becomes favorable is obtained.

In addition, the composition A may include inorganic powders other than tri-cobalt tetraoxide and free powder. Specifically, inorganic pigments such as colored pigments other than tricobalt tetraoxide such as Mn, Fe, Cr, Ni, Co, oxides and composite oxides thereof, and aluminum oxide, titanium oxide, zirconium oxide, silicon oxide, cerium oxide, and the like Can be mentioned. It is preferable that content of another inorganic powder is 30 mass% or less of an inorganic powder whole quantity.

(b) binder resin

Although various resin can be used as binder resin (b) which comprises the said composition A, It is preferable to use resin containing alkali-soluble resin in the ratio of 20-100 mass%. As used herein, "alkali soluble" refers to a property of being solubilized to the extent that it is dissolved by an alkaline developer and the target development treatment is performed.

As such alkali-soluble resin, (meth) acrylic-type resin, hydroxy styrene resin, a novolak resin, a polyester resin etc. are mentioned, for example. In these, (meth) acrylic-type resin is preferable. In particular, the total ratio of the structural unit derived from (meth) acrylic acid and the structural unit derived from (meth) acrylate is preferably 70% by mass or more, preferably 90% by mass or more of the total structural units.

When the said composition A contains (meth) acrylic-type resin as binder resin (b), the inorganic powder containing resin layer (A) formed from the said composition A exhibits the outstanding (heating) adhesiveness to a board | substrate. Therefore, the transfer film produced by applying the composition A on the support film is excellent in the transferability (heat adhesion to the substrate) of the resin layer (A).

As said (meth) acrylic-type resin, it is preferable that it is a (co) polymer which has an appropriate adhesiveness, can bind an inorganic powder, and is fully oxidized and removed by the baking process (400 degreeC-600 degreeC) of a laminated film pattern.

Among these (meth) acrylic resins, preferred are (meth) acrylic resins such as copolymers of the following monomers (I) and (II), copolymers of monomers (I), monomers (II) and monomers (III). Can be mentioned.

Examples of the monomer (I) include acrylic acid, methacrylic acid, maleic acid, fumaric acid, crotonic acid, itaconic acid, citraconic acid, mesaconic acid, cinnamic acid, and succinic acid mono (2- (meth) acryloyloxyethyl and carboxyl group-containing monomers, such as (omega)-carboxy- polycaprolactone mono (meth) acrylate.

As said monomer (II), for example, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth Hydroxyalkyl (meth) acrylates such as) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate; and hydroxyl group-containing monomers such as phenolic hydroxyl group-containing monomers such as o-hydroxy styrene, m-hydroxy styrene, and p-hydroxy styrene.

As monomer (III), for example

Methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, n-butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl ( Meth) acrylate, pentyl (meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (Meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylic Alkyl (meth) acrylates such as acrylate, lauryl (meth) acrylate, stearyl (meth) acrylate, and isostearyl (meth) acrylate;

Phenoxyalkyl (meth) acrylates such as phenoxyethyl (meth) acrylate and 2-hydroxy-3-phenoxypropyl (meth) acrylate;

2-methoxyethyl (meth) acrylate, 2-ethoxyethyl (meth) acrylate, 2-propoxyethyl (meth) acrylate, 2-butoxyethyl (meth) acrylate, 2-methoxybutyl ( Alkoxyalkyl (meth) acrylates such as meth) acrylate;

Polyethylene glycol mono (meth) acrylate, ethoxydiethylene glycol (meth) acrylate, methoxypolyethylene glycol (meth) acrylate, phenoxypolyethylene glycol (meth) acrylate, nonylphenoxypolyethylene glycol (meth) acrylate, Polyalkylene glycols such as polypropylene glycol mono (meth) acrylate, methoxypolypropylene glycol (meth) acrylate, ethoxy polypropylene glycol (meth) acrylate, and nonylphenoxypolypropylene glycol (meth) acrylate ( Meth) acrylates;

Benzyl (meth) acrylate, phenyl (meth) acrylate, cyclohexyl (meth) acrylate, 4-butylcyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, dicyclopentenyl (meth) acrylic Cyclic (meth) acrylates such as late, dicyclopentadienyl (meth) acrylate, bornyl (meth) acrylate, isobornyl (meth) acrylate and tricyclodecanyl (meth) acrylate; Vinyl group-containing radically polymerizable compounds such as vinyl benzyl methyl ether, vinyl glycidyl ether, styrene, α-methyl styrene, butadiene and isoprene

Other copolymerizable monomers, such as these, are mentioned.

In particular, acrylic acid and methacrylic acid are preferably used as the monomer (I). As the monomer (II), hydroxyalkyl (meth) acrylates are preferably used. As the monomer (III), alkyl (meth) acrylates and alicyclic (meth) acrylates are preferably used.

As for the ratio of the structural unit derived from each monomer in the said (meth) acrylic-type resin, the structural unit derived from monomer (I) (carboxyl group-containing monomers) is 5-50 mass% normally, Preferably it is 10-40 mass%, and a monomer The structural unit derived from (II) (hydroxyl group-containing monomers) is 40 mass% or less normally, Preferably it is 5-30 mass%, and the structural unit derived from monomer (III) (other copolymerizable monomers) is 95 mass normally % Or less, Preferably it is 40-80 mass%.

In particular, resin which contains 5-30 parts of structural units derived from (meth) acrylic acid, and 5-30 parts of structural units derived from a hydroxyl-containing monomer is preferable at the point from which the favorable adhesiveness with the board | substrate in image development, and the favorable pattern shape after image development are obtained. Is used.

The acid value of the said binder resin (b) is 30-250 in terms of KOH mg / g, Preferably it is 50-200.

The molecular weight of the binder resin (b) is 3,000 to 300,000, preferably 10,000 to 100,000, in terms of the weight average molecular weight (hereinafter, simply referred to as "weight average molecular weight" or "Mw") in terms of polystyrene by GPC. Moreover, dispersion degree (weight average molecular weight / number average molecular weight) of resin is 1.0-5.0, Preferably it is 1.0-3.0.

(c) photopolymerizable monomer

The said composition A is a photosensitive composition containing a photopolymerizable monomer (c) and a photoinitiator (d). The photopolymerizable monomer (c) is polymerized by exposure and has the property of making the exposed portion alkaline insoluble or alkali poorly soluble, and polyfunctional (meth) acrylate is mentioned as a preferable one.

As a specific example of polyfunctional (meth) acrylate, For example, Di (meth) acrylates of alkylene glycol, such as ethylene glycol and propylene glycol; Di (meth) acrylates of polyalkylene glycols such as polyethylene glycol and polypropylene glycol; Di (meth) acrylates of both terminal hydroxylated polymers such as both terminal hydroxypolybutadiene, both terminal hydroxypolyisoprene and both terminal hydroxypolycaprolactone; Poly (meth) acrylates of trivalent or higher polyhydric alcohols such as glycerin, 1,2,4-butanetriol, trimethylolalkane, tetramethylolalkane, pentaerythritol, dipentaerythritol; Poly (meth) acrylates of polyalkylene glycol adducts of trivalent or higher polyhydric alcohols; Poly (meth) acrylates of cyclic polyols such as 1,4-cyclohexanediol and 1,4-benzenediols; Oligos, such as polyester (meth) acrylate, epoxy (meth) acrylate, urethane (meth) acrylate, alkyd resin (meth) acrylate, silicone resin (meth) acrylate, and spiran resin (meth) acrylate ( Meth) acrylates and the like.

These may be used individually by 1 type and may be used in combination of 2 or more type. Among these, di (meth) acrylates of alkylene glycol, trimethylolpropane triacrylate and polyalkylene glycol adducts thereof, pentaerythritol triacrylate and polyalkylene glycol adducts thereof and the like are particularly preferably used. do. Moreover, it is preferable that the molecular weight of the said polyfunctional (meth) acrylate is 100-2,000.

The total compounding quantity of the said binder resin (b) and a photopolymerizable monomer (c) is 5-1000 mass parts normally with respect to 100 mass parts of inorganic powder (a), Preferably it is the range of 10-500 mass parts. The photopolymerizable monomer (c) is used in an amount in the range of 10 to 200 parts by mass, preferably 20 to 150 parts by mass with respect to 100 parts by mass of the binder resin (b). If the amount of the binder resin is too small, the inorganic powder may not be reliably bound or damaged, which may impair the flexibility and transferability required as the transfer film. On the other hand, if the sintered body is formed for a long time or may be formed, It may not have sufficient strength or film thickness.

(d) photoinitiator

As a photoinitiator (d) used for the said composition A, for example, benzyl, benzoin, benzophenone, camphorquinone, 2, 2- dimethoxy- 1, 2- diphenyl ethane- 1-one, 4, 4 '-Bis (dimethylamino) benzophenone, 4,4'-bis (diethylamino) benzophenone, 2-hydroxy-2-methyl-1-phenylpropan-1-one, 1-hydroxycyclohexylphenylketone , 2,2-dimethoxy-2-phenylacetophenone, 2-methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propaneone, 2-benzyl-2-dimethylamino-1 -(4-morpholinophenyl) -butan-1-one, 2,4,6-trimethylbenzoyl-diphenylphosphineoxide, 1- [9-ethyl-6- (2-methylbenzoyl) -9.H Carbonyl compounds such as .-carbazol-3-yl] -ethane-1-one oxime-O-acetate; Azo compounds or azide compounds such as azoisobutyronitrile and 4-azide benzaldehyde; Organic sulfur compounds such as 2-mercaptobenzothiazole and mercaptan disulfide; Organic peroxides such as benzoyl peroxide, di-tert-butyl peroxide, tert-butylhydroperoxide, cumene hydroperoxide and paramethane hydroperoxide; 1,3-bis (trichloromethyl) -5- (2'-chlorophenyl) -1,3,5-triazine, 2- [2- (2-furanyl) ethylenyl] -4,6-bis Trihalo methanes such as (trichloromethyl) -1,3,5-triazine; And imidazole dimers such as 2,2'-bis (2-chlorophenyl) 4,5,4 ', 5'-tetraphenyl 1,2'-biimidazole.

These may be used individually by 1 type and may be used in combination of 2 or more type. Among these, 2,2-dimethoxy-1,2-diphenylethan-1-one, 2-methyl- [4 '-(methylthio) phenyl] -2-morpholino-1-propaneone, 2- Benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one, 4,4'-bis (diethylamino) benzophenone, 2,4,6-trimethylbenzoyl-diphenylforce Pinoxide and the like are particularly preferably used.

The said photoinitiator (d) is used in the quantity of the range of 0.1-100 mass parts normally, Preferably it is 1.0-60 mass parts with respect to 100 mass parts of said photopolymerizable monomers (c).

(e) solvent

The composition A usually contains a solvent. As such a solvent, it is preferable that the affinity with inorganic powder and the solubility of binder resin are favorable, the viscosity can be provided to an inorganic powder containing resin composition, and it can evaporate easily by drying. Moreover, as a especially preferable solvent, ketones, alcohols, and esters (hereinafter, these are referred to as "specific solvent") whose standard boiling point (boiling point at 1 atmosphere) are 60-200 degreeC.

As said specific solvent, For example, ketones, such as methyl ethyl ketone, diethyl ketone, methyl butyl ketone, dipropyl ketone, cyclohexanone;

alcohols such as n-pentanol, 4-methyl-2-pentanol, cyclohexanol and diacetone alcohol;

Ether alcohols such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether and propylene glycol monoethyl ether;

Saturated aliphatic monocarboxylic acid alkyl esters such as acetic acid-n-butyl and amyl acetate;

Lactic acid esters such as ethyl lactate and lactic acid-n-butyl;

Ether esters such as methyl cellosolve acetate, ethyl cellosolve acetate, propylene glycol monomethyl ether acetate, and ethyl-3-ethoxypropionate, and the like. Among these, methylbutyl ketone, cyclohexanone, diacetone alcohol, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, ethyl lactate, ethyl-3-ethoxy propionate, and the like are preferable. These specific solvents may be used alone, or may be used in combination of two or more thereof.

Moreover, as a solvent which can be used other than the said specific solvent, terbin oil, ethyl cellosolve, methyl cellosolve, terpineol, butyl carbitol acetate, butyl carbitol, isopropyl alcohol, benzyl alcohol, etc. are mentioned, for example. Can be.

The said solvent (e) is used in the range of 5-5000 mass parts with respect to 100 mass parts of inorganic powder (a), Preferably it is 10-500 mass parts with respect to maintaining the viscosity of composition A in a preferable range. Moreover, the ratio of the specific solvent with respect to all the solvent is 50 mass% or more, Preferably it is 70 mass% or more.

(f) silane coupling agent

The said composition A can contain a silane coupling agent (f) for the purpose of the improvement of the dispersibility of the said inorganic powder (a), especially glass powder, and the plasticization of the transfer film to form. As such a silane coupling agent (f), the compound represented by following formula (1) and the compound represented by general formula (2) are mentioned.

(In formula 1, p is 3-20, Preferably it is an integer of 4-16, m is an integer of 1-3, n is an integer of 1-3, a is an integer of 1-3)

In formula (2), R represents a methylene group or an alkylene group having 2 to 100 carbon atoms, Y represents a vinyl group, an epoxy group, an acryloxy group, a methacryloxy group, a mercapto group or an amino group, X represents a hydrolyzable group, r is an integer from 0 to 3)

In the said Formula (1), when using the silane coupling agent whose value of p is less than 3, sufficient flexibility may not be expressed in the inorganic powder containing resin layer obtained. On the other hand, since the silane coupling agent having a p value of more than 20 has a high decomposition temperature, in the firing step of the inorganic powder-containing resin layer, the glass powder is not completely decomposed and removed in the organic material (the silane derivative). It melt | dissolves and a part of organic substance remains in the pattern formed, and may adversely affect panel characteristics.

Specific examples of the silanes used as the silane coupling agent represented by the formula (1) are shown below.

As saturated alkyldimethylmethoxysilanes (a = 1, m = 1, n = 1), for example, n-propyldimethylmethoxysilane, n-butyldimethylmethoxysilane, n-decyldimethylmethoxysilane, n -Hexadecyl dimethyl methoxysilane, n-di-acid dimethyl methoxysilane, etc. are mentioned.

As saturated alkyldiethyl methoxysilanes (a = 1, m = 1, n = 2), for example, n-propyldiethylmethoxysilane, n-butyldiethylmethoxysilane, n-decyldiethyl methoxy Oxysilane, n-hexadecyldiethyl methoxysilane, n-diacid diethyl methoxysilane, etc. are mentioned.

As saturated alkyldipropylmethoxysilane (a = 1, m = 1, n = 3), for example, n-butyldipropylmethoxysilane, n-decyldipropylmethoxysilane, n-hexadecyldipropyl Methoxysilane, n-icosane dipropyl methoxysilane, etc. are mentioned.

As saturated alkyl dimethyl ethoxysilane (a = 1, m = 2, n = 1), for example, n-propyldimethylethoxysilane, n-butyldimethylethoxysilane, n-decyldimethylethoxysilane, n -Hexadecyl dimethyl ethoxy silane, n-diacid dimethyl ethoxy silane, etc. are mentioned.

As saturated alkyldiethyl ethoxysilanes (a = 1, m = 2, n = 2), for example, n-propyldiethylethoxysilane, n-butyldiethylethoxysilane, n-decyldiethyl Oxysilane, n-hexadecyl diethyl ethoxysilane, n- icosane diethyl ethoxysilane, etc. are mentioned.

As saturated alkyldipropylethoxysilanes (a = 1, m = 2, n = 3), for example, n-butyldipropylethoxysilane, n-decyldipropylethoxysilane, n-hexadecyldipropyl Ethoxysilane, n-icosane dipropyl ethoxysilane, etc. are mentioned.

As saturated alkyldimethylpropoxysilanes (a = 1, m = 3, n = 1), for example, n-propyldimethylpropoxysilane, n-butyldimethylpropoxysilane, n-decyldimethylpropoxysilane, n -Hexadecyl dimethyl propoxy silane, n-di-acid dimethyl propoxy silane, etc. are mentioned.

As saturated alkyldiethyl propoxysilanes (a = 1, m = 3, n = 2), for example, n-propyldiethylpropoxysilane, n-butyldiethylpropoxysilane, n-decyldiethylprop Foxy silane, n-hexadecyl diethyl propoxy silane, n- icosane diethyl propoxy silane, etc. are mentioned.

As saturated alkyldipropyl propoxysilanes (a = 1, m = 3, n = 3), for example, n-butyldipropyl propoxysilane, n-decyldipropyl propoxysilane, n-hexadecyldipropyl Propoxysilane, n-icosane dipropyl propoxysilane, etc. are mentioned.

As saturated alkylmethyldimethoxysilane (a = 2, m = 1, n = 1), for example, n-propylmethyldimethoxysilane, n-butylmethyldimethoxysilane, n-decylmethyldimethoxysilane, n -Hexadecylmethyldimethoxysilane, n-methyl dimethoxysilane, etc. are mentioned.

As saturated alkylethyl dimethoxysilane (a = 2, m = 1, n = 2), for example, n-propylethyldimethoxysilane, n-butylethyldimethoxysilane, n-decylethyldimethoxysilane, n -Hexadecyl ethyl dimethoxy silane, n-ethyl diethyl silane, etc. are mentioned.

As saturated alkyl propyl dimethoxysilane (a = 2, m = 1, n = 3), For example, n-butylpropyldimethoxysilane, n-decylpropyldimethoxysilane, n-hexadecylpropyldimethoxysilane, n-icosane propyldimethoxysilane, etc. are mentioned.

As saturated alkylmethyl diethoxysilane (a = 2, m = 2, n = 1), for example, n-propylmethyl diethoxysilane, n-butylmethyl diethoxysilane, n-decylmethyl diethoxysilane, n -Hexadecyl methyl diethoxysilane, n-methyl diethoxysilane, etc. are mentioned.

As saturated alkylethyl diethoxysilanes (a = 2, m = 2, n = 2), for example, n-propylethyl diethoxysilane, n-butylethyl diethoxysilane, n-decylethyl diethoxysilane, n -Hexadecyl ethyl diethoxysilane, n-diethyl ethyl diethoxysilane, etc. are mentioned.

As saturated alkylpropyl diethoxysilanes (a = 2, m = 2, n = 3), For example, n-butylpropyl diethoxysilane, n-decylpropyl diethoxysilane, n-hexadecylpropyl diethoxysilane, n-isoacid propyl diethoxysilane etc. are mentioned.

As saturated alkylmethyl dipropoxysilanes (a = 2, m = 3, n = 1), for example, n-propylmethyldipropoxysilane, n-butylmethyldipropoxysilane, n-decylmethyldiprop Foxy silane, n-hexadecyl methyl dipropoxy silane, n- methyl di-propoxy silane, etc. are mentioned.

As saturated alkylethyl dipropoxysilanes (a = 2, m = 3, n = 2), for example, n-propylethyldipropoxysilane, n-butylethyldipropoxysilane, n-decylethyldiprop Foxy silane, n-hexadecyl ethyl dipropoxy silane, n- icosyl ethyl dipropoxy silane, etc. are mentioned.

As saturated alkyl propyl dipropoxy silanes (a = 2, m = 3, n = 3), for example, n-butylpropyl dipropoxy silane, n-decyl propyl dipropoxy silane, n-hexadecyl propyl dip Lopoxysilane, n-icosane propyldipropoxy silane, etc. are mentioned.

As saturated alkyl trimethoxysilanes (a = 3, m = 1), for example, n-propyltrimethoxysilane, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyl tree Methoxysilane, n-icosane trimethoxysilane, etc. are mentioned.

As saturated alkyl triethoxysilanes (a = 3, m = 2), for example, n-propyl triethoxysilane, n-butyl triethoxysilane, n-decyl triethoxysilane, n-hexadecyl tree Ethoxysilane, n-icosane triethoxysilane, etc. are mentioned.

As saturated alkyl tripropoxy silanes (a = 3, m = 3), for example, n-propyl tripropoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tree Propoxysilane, n-icosane tripropoxysilane, etc. are mentioned.

As the silane coupling agent represented by the formula (2), for example

Vinyl group-containing silane compounds such as vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, and vinyltriacetoxysilane;

3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) Amino group-containing silane compounds such as aminopropylmethyldimethoxysilane;

3-acryloxypropyltrimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltri (Meth) acryloxy group containing silane compounds, such as ethoxysilane;

Epoxy group-containing silane compounds such as 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldimethoxysilane and 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane;

Mercapto-group containing silane compounds, such as 3-mercaptopropyl trimethoxysilane and 3-mercaptopropyl triethoxysilane, etc. are mentioned.

The said silane coupling agent (f) may be used individually by 1 type, and may be used in combination of 2 or more type. Among the above silanes, n-butyltrimethoxysilane, n-decyltrimethoxysilane, n-hexadecyltrimethoxysilane, n-decyldimethylmethoxysilane, n-hexadecyldimethylmethoxysilane, n-butyl Triethoxysilane, n-decyltriethoxysilane, n-hexadecyltriethoxysilane, n-decylethyldiethoxysilane, n-hexadecylethyldiethoxysilane, n-butyltripropoxysilane, n-decyl Tripropoxysilane, n-hexadecyltripropoxysilane, vinyltrichlorosilane, vinyltrimethoxysilane, vinyltriethoxysilane, vinyltriacetoxysilane, 3-methacryloxypropyltrimethoxysilane are particularly preferred. Do.

The silane coupling agent (f) is usually used in an amount of 10 parts by mass or less, preferably 0.001 to 5 parts by mass with respect to 100 parts by mass of the inorganic powder (a). When the amount of the silane coupling agent (f) is too large, the viscosity may increase with time when the composition A is preserved, or the silane coupling agents may react with each other, causing plastic residues to remain in the formed panel member. There is a case.

(g) other ingredients

The composition A may contain a plasticizer as an adjuvant of the binder resin (b) to provide good flexibility to the transfer film. Since the inorganic powder-containing resin layer formed from the composition containing the plasticizer has sufficient flexibility, even if the transfer film having the resin layer is bent, no minute cracking (cracking) occurs on the surface of the resin layer, and the roll type It can be wound up easily.

Examples of the plasticizer include polypropylene glycol, copolymerizable monomers such as the above-mentioned (meth) acrylate compounds, dibutyl adipate, diisobutyl adipate, di-2-ethylhexyl adipate, di-2- Ethyl hexyl azelate, dibutyl sebacate, dibutyl diglycol adipate, propylene glycol monolaurate, propylene glycol glycol monooleate, and the like. In these, it is preferable that boiling point is 150 degreeC or more. These plasticizers may be used individually by 1 type, and may be used in combination of 2 or more type.

In addition, the composition A may contain various additives such as a dispersant, a development accelerator, an adhesion aid, an antihalation agent, a leveling agent, a storage stabilizer, an antifoaming agent, an antioxidant, a UV absorber, a sensitizer, and a chain transfer agent as an optional component. On the other hand, as the dispersant, organic fatty acids such as stearic acid and oleic acid are preferably used.

<Photosensitive inorganic powder containing resin layer (B-1) and nonphotosensitive inorganic powder containing resin layer (C)>

The photosensitive inorganic powder containing resin layer (B-1) which comprises the transfer film of this invention is (a ') inorganic powder, (b') binder resin, (c ') photopolymerizable monomer, (d') photoinitiator. And (e ') solvent, and are formed using the pasty photosensitive inorganic powder containing resin composition B-1 different from the said composition A. Moreover, the non-photosensitive inorganic powder containing resin layer (C) which comprises the transfer film of this invention is a paste-type nonphotosensitive inorganic powder containing (a ') inorganic powder, (b') binder resin, and (e ') solvent. It is formed using the containing resin composition C. The compositions B-1 and C may further contain (f) silane coupling agents and (g) other components as exemplified in the composition A.

The said resin layer (B-1) can be formed by apply | coating the said composition B-1 on the said support film, drying a coating film, and removing a part or all of a solvent.

The said resin layer (C) can be formed by apply | coating the said composition C on the said support film or the resist layer (B-2) formed on the said support film, drying a coating film, and removing a part or all of a solvent. . In addition, the said resin layer (C) forms the resin layer (C) using the said composition C on the said support film, and forms the resist layer (B-2) on a support film separately from this resin layer, and this resin layer It can also manufacture suitably by the method (laminating) which overlaps the surface of (C) and the surface of this resist layer (B-2), and is crimped | bonded.

The application of the compositions B-1 and C and the drying of the coating film can be performed by the same method as the coating method of the composition A and the drying method of the coating film. The film thickness of the said resin layer (B-1) or (C) is 10-300 micrometers normally. In addition, the composition B-1 and C can be prepared in the same manner as the composition A. On the other hand, it is preferable that the viscosity of the said compositions B-1 and C is 0.3-30 Pa.s. Hereinafter, each component of the said composition B-1 or C is demonstrated.

(a ') inorganic powder

The inorganic powder (a ') depends on the type of forming material as the inorganic powder (a) described above, but the inorganic powder used for the electrode forming material which is a preferred embodiment of the present invention may be a metal powder, specifically, Ag, Au, Al, Ni, Ag-Pd alloy, Cu, Cr, Co, etc. are mentioned, A silver (Ag) powder is preferable. Moreover, the glass powder illustrated by the said composition A can also be used together with these metal powders. It is preferable that it is 30 mass% or less of the inorganic powder (a ') whole quantity, and, as for the content rate of the glass powder to use together, it is especially preferable that it is 20 mass% or less.

(b ') binder resin

Although the (meth) acrylic-type resin can be used for the said binder resin (b ') similarly to the said composition A, the resin from which the composition differs from the binder resin (b) used by the said composition A is preferable. In the said development and etching process, the said resin layer (B-1) or (C) contacts an alkali developing solution before the said resin layer (A), and a pattern is formed. Therefore, it is preferable that the said resin layer (B-1) or (C) is smaller in melt | dissolution rate with respect to alkaline developing solution than the said resin layer (A).

Specifically, the acid value of the binder resin (b ') is preferably smaller than the acid value of the binder resin (b), and the amount of the structural unit derived from (meth) acrylic acid as a preferable structural unit in the binder resin is greater than that of the binder resin (b). It is preferable that binder resin (b ') is smaller. Moreover, it is preferable that Mw of binder resin (b ') is larger than Mw of binder resin (b).

The Mw of the binder resin (b ') is 4,000 to 300,000, preferably 10,000 to 200,000. In addition, the glass transition temperature (Tg) of the binder resin (b ') is preferably -30 to 100 ° C, particularly preferably -10 to 100 ° C in view of both handleability and heat transferability.

The total compounding quantity of the said binder resin (b ') and a photopolymerizable monomer (c') is 5-1000 mass parts normally with respect to 100 mass parts of inorganic powder (a '), Preferably it is the range of 10-500 mass parts. The photopolymerizable monomer (c ') is used in an amount in the range of 10 to 200 parts by mass, preferably 20 to 150 parts by mass, based on 100 parts by mass of the binder resin (b'). When the amount of the binder resin is too small, the inorganic powder can not be reliably bound and the flexibility and the transferability required as the transfer film can be impaired. On the other hand, when the amount of the binder resin is too large, the baking process requires a long time or is formed. The sintered body may not have sufficient strength or film thickness.

(c ') photopolymerizable monomer

As said photopolymerizable monomer (c '), the thing similar to the photopolymerizable monomer (c) illustrated by the said composition A can be used. The photopolymerizable monomer (c ') is usually used in an amount in the range of 1 to 50 parts by mass, preferably 5 to 40 parts by mass with respect to 100 parts by mass of the inorganic powder (a').

(d ') photoinitiator

Similarly, for the photoinitiator (d ') used by the said composition B, the photoinitiator (d) illustrated by the said composition A can be used. The photoinitiator (d ') is usually used in an amount in the range of 0.1 to 100 parts by mass, preferably 1.0 to 60 parts by mass with respect to 100 parts by mass of the photopolymerizable monomer (c').

(e ') solvent

The solvent (e) illustrated by the said composition A can be used similarly about the solvent (e ') used by the said composition B or C. The solvent (e ') is used in the range of 5 to 5000 parts by mass, preferably 20 to 1000 parts by mass with respect to 100 parts by mass of the inorganic powder (a') in terms of maintaining the viscosity of the composition in a preferred range.

<Resist layer (B-2)>

The resist layer (B-2) which comprises the transfer film of this invention as needed usually contains (b ") binder resin, (c") photopolymerizable monomer, and (d ") photoinitiator, and is an inorganic powder. The resist composition B-2 which does not contain can be formed by apply | coating on the said support film, drying a coating film, and removing a part or all of the solvent. It can carry out by the method similar to the coating method of A and the drying method of a coating film .. The film thickness of the resist layer (B-2) is 5-15 micrometers, for example.

(b ") binder resin

As the binder resin (b ") used for the said resist composition B-2, alkali-soluble resin is used and the ethylenically unsaturated carboxyl group-containing monomer which has at least 1 or more carboxyl groups in a molecule | numerator, and the copolymerizable monomer copolymerizable with this carboxyl group-containing monomer are used. It is preferable that it is a carboxyl group-containing copolymer obtained by superposing | polymerizing the monomer composition to contain.

The copolymerization ratio of the carboxyl group-containing monomer in the binder resin (b ") is 5-50 mass% with respect to monomer whole quantity, Preferably it is 10-40 mass%. When the copolymerization ratio of a carboxyl group-containing monomer is lower than the said range, it will be obtained. Resist composition B-2 tends to have low solubility in alkaline developing solutions, while on the other hand, when the copolymerization ratio of the carboxyl group-containing monomer exceeds the above range, the resist pattern tends to fall off from the inorganic powder-containing resin layer during development. .

The copolymer which has a structural unit derived from the said carboxyl group-containing monomer has alkali solubility, and especially the copolymer which has the said structural unit in the quantity of the said range shows the outstanding solubility with respect to alkaline developing solution. Therefore, by using such a copolymer as the binder resin (b ") in the resist composition B-2, the amount of undissolved substance to an alkali developing solution is essentially reduced, and the part other than the resist pattern formation part of a board | substrate in image development processing is carried out. It is possible to reduce the occurrence of background contamination, film residues, and the like.

Moreover, since the resist pattern obtained from the resist composition B-2 containing the said copolymer as a binder resin (b ") does not melt | dissolve excessively in alkaline developing solution, and has the outstanding adhesiveness with respect to an inorganic powder containing resin layer, the said number It is difficult to fall off from the strata.

As said carboxyl group-containing monomer, For example, unsaturated monocarboxylic acids, such as acrylic acid, methacrylic acid, and crotonic acid; Unsaturated dicarboxylic acids such as itaconic acid, maleic acid and fumaric acid; And other unsaturated carboxylic acids. These may be used individually by 1 type and may be used in combination of 2 or more type.

Moreover, as said copolymerizable monomer, for example

Aromatic vinyl compounds such as styrene, α-methylstyrene, and vinyltoluene;

Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, 2-hydroxypropyl acryl Unsaturated carboxylic acid alkyl esters such as latex, 2-hydroxypropyl methacrylate, benzyl acrylate, benzyl methacrylate, cyclohexyl acrylate and cyclohexyl methacrylate;

Unsaturated carboxylic acid aminoalkyl esters such as aminoethyl acrylate;

Unsaturated carboxylic acid glycidyl esters such as glycidyl acrylate and glycidyl methacrylate;

Carboxylic acid vinyl esters, such as vinyl acetate and a vinyl propionate;

Vinyl cyanide compounds such as acrylonitrile, methacrylonitrile and α-chloroacrylonitrile;

Aliphatic conjugated dienes such as 1,3-butadiene and isoprene;

And macromonomers such as polystyrene, polymethyl acrylate, polymethyl methacrylate, polybutyl acrylate, polybutyl methacrylate, and polysilicon having acryloyl group or methacryloyl group at the terminals. These can be used individually by 1 type or in combination of 2 or more types.

The binder resin (b ″) has a Mw of 3,000 to 300,000, preferably 5,000 to 200,000. By using the binder resin (b ″) having such a molecular weight, a highly developable resist composition is obtained, and thus a sharp pattern. A resist pattern having an end portion can be formed, and a panel member having a uniform pattern can be formed.

(c ") photopolymerizable monomer

As a photopolymerizable monomer (c ") used for the said resist composition B-2, the polyfunctional (meth) acrylate illustrated by the said composition A etc. is used preferably. The said photopolymerizable monomer (c") is a binder resin ( b ") in an amount in the range of usually 5 to 100 parts by mass, preferably 10 to 70 parts by mass with respect to 100 parts by mass. If the amount of the photopolymerizable monomer (c") is lower than the above range, the resist pattern The strength tends to be insufficient, and if it exceeds the above range, alkali resolution may decrease, or background contamination other than the resist pattern forming portion, film residue, etc. may occur.

(d ") photoinitiator

As a photoinitiator (d ") used for the said resist composition B-2, the photoinitiator (d) illustrated by the said composition A etc. are mentioned. The use ratio of the said photoinitiator (d") is said photopolymerizable. It is normally used in the range of 0.1-100 mass parts, preferably 1.0-60 mass parts with respect to 100 mass parts of monomers (c ").

(e ") solvent

The resist composition B-2 usually contains a solvent in order to impart proper fluidity or plasticity and good film formability. It does not restrict | limit especially as such a solvent, The specific solvent mentioned above is used preferably.

(g ") other ingredients

In addition, the resist composition B-2 may contain various additives such as a development accelerator, an adhesion aid, an antihalation agent, a storage stabilizer, an antifoaming agent, an antioxidant, an ultraviolet absorber, a filler, a phosphor, a pigment, and a dye as an optional component.

EXAMPLE

EMBODIMENT OF THE INVENTION Hereinafter, although this invention is demonstrated concretely based on an Example, this invention is not limited by these. In addition, "part" shows a "mass part" below.

Example 1

(1) Preparation of Photosensitive Inorganic Powder-Containing Resin Composition A

As the inorganic powder (a), 40 parts of tricobalt tetraoxide (Co ₃ O ₄ ) having a specific surface area of 11.2 m 2 / g, an average particle diameter of 0.3 μm, and a Bi ₂ O ₃ -B ₂ O ₃ -SiO _{2 type} glass frit having an average particle diameter of 1.5 μm. (Amorphous type, softening point 470 degreeC) Benzyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (mass%) copolymer (KOH mg / g) as 60 parts and binder resin (b) = 130, Mw = 50,000) 200 parts of trimethylolpropane triacrylate as a photopolymerizable monomer (c) and 2-benzyl-2- dimethylamino-1- (4-morpholi) as a photoinitiator (d) 5 parts of nophenyl) -butan-1-one, 1 part of 3-methacryloxypropylmethoxysilane as silane coupling agent (f), 1 part of oleic acid as other optional components, and propylene glycol monomethyl ether as solvent (e) 200 parts were kneaded with a bead mill. Subsequently, the obtained mixture was filtered with a stainless mesh (500 mesh, 25 micrometer diameter), and the photosensitive inorganic powder containing resin composition A for black matrices was obtained.

(2) Preparation of Photosensitive Inorganic Powder-Containing Resin Composition B-1

As the inorganic powder (a '), a specific surface area of 0.5 ㎡ / g, the average particle diameter of 2.3 to 100 parts ㎛ powder, average particle size _{3 ㎛ Bi 2 O 3 -B 2} O 3 -SiO 2 based glass frit (irregular, a softening point of 520 Benzyl methacrylate / n-butyl methacrylate / 2-hydroxypropyl methacrylate / mono succinate (2-methacryloyloxyethyl) / methacrylic acid = 3 parts, binder resin (b ') 30 parts of 30/20/20/20/10 (mass%) copolymer (KOH mg / g = 114, Mw = 100,000), 10 parts of trimethylolpropane triacrylate as a photopolymerizable monomer (c '), photopolymerization 5 parts 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one as initiator (d '), 1 part oleic acid as other optional components, and propylene as solvent (e') 150 parts of glycol monomethyl ether were kneaded with a bead mill. Subsequently, the obtained mixture was filtered with a stainless mesh (400 mesh, 38 micrometer diameter), and the photosensitive inorganic powder containing resin composition B-1 for electrode patterns was obtained.

(3) Preparation of Transfer Film

The photosensitive inorganic powder containing resin composition A manufactured by said (1) was apply | coated using the roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET films which carried out the mold release process previously, and a coating film Was dried at 100 ° C. for 5 minutes to completely remove the solvent. This obtained the transfer film (i) in which the photosensitive inorganic powder containing resin layer (A) of thickness 8micrometer was formed on the support film.

Similarly, using the roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET film which pre-release-processed the photosensitive inorganic powder containing resin composition B-1 manufactured by said (2). It applied and the coating film was dried at 100 degreeC for 5 minutes, and the solvent was completely removed. This obtained the transfer film (ii) in which the photosensitive inorganic powder containing resin layer (B-1) of thickness 12micrometer was formed on the support film.

(4) film transfer process

The transfer film (i) was superposed so that the surface of the photosensitive inorganic powder containing resin layer (A) might contact the surface of the transparent glass substrate for 6-inch panels, and it was thermocompression-bonded with the heating roller. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After completion of the thermocompression treatment, the support film was peeled off. Thereby, the resin layer A was transferred and adhered to the surface of the transparent glass substrate.

Next, the transfer film (ii) was superposed on the photosensitive inorganic powder containing resin layer (A) so that the surface of the photosensitive inorganic powder containing resin layer (B-1) contacted, and it was thermocompression-bonded with the heating roller. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. Thereby, the resin layer (A), the resin layer (B-1), and the support film adhered to the surface of the transparent glass substrate.

(5) Exposure process of photosensitive inorganic powder containing resin layer (A)

I-line using an ultra-high pressure mercury lamp from the surface of the transparent glass substrate through the mask for exposure to the photosensitive inorganic powder-containing resin layer (A) in contact with the transparent glass substrate (striping portion / light shielding portion = 150 µm / 300 µm). (Ultraviolet rays having a wavelength of 365 nm) was irradiated. The irradiation amount was 200 mJ / cm 2.

(6) Exposure process of photosensitive inorganic powder containing resin layer (B-1)

The photosensitive inorganic powder-containing resin layer (B-1) on the photosensitive inorganic powder-containing resin layer (A-1) through an exposure mask (transmitting portion / light shielding portion = 50 μm / 50 μm / 50 μm / 300 μm repeated stripe pattern) The i-line (ultraviolet light of 365 nm wavelength) was irradiated from the support film surface side using the ultrahigh pressure mercury lamp. The irradiation amount was 400 mJ / cm 2.

(7) developing process

After peeling a support film from a resin layer (B-1), the shower method using 0.5 mass% sodium carbonate aqueous solution (30 degreeC) as a developing solution with respect to the exposed resin layer (B-1) and resin layer (A) was carried out. Development was carried out for 60 seconds. Thereby, the uncured resin layer (B-1) and resin layer (A) which were not irradiated with ultraviolet rays are removed, and the pattern of the resin layer (A) formed on the transparent glass substrate, and the pattern of the said resin layer (A) The pattern of the resin layer (B-1) formed on it was obtained.

(8) firing process

The transparent glass substrate in which the pattern of the resin layer (B-1) was formed on the pattern of the resin layer (A) was baked for 30 minutes in the baking furnace in the temperature atmosphere of 550 degreeC. As a result, a black matrix having a pattern width of 150 μm and a thickness of 1 μm is formed on the surface of the transparent glass substrate, and an electrode pattern having a pattern width of 50 μm and a height of 5 μm on the black matrix has a space width of 300 μm. The panel material was obtained.

Example 2

(3) Preparation of Transfer Film

The photosensitive inorganic powder-containing resin layer (A) of the transfer film (i) and the photosensitive inorganic powder-containing resin layer (B-1) of the transfer film (ii) prepared in Example 1 were superposed so as to contact each layer surface. It was thermocompression bonded with a heating roller. This obtained the transfer film (henceforth "transfer film (iii)") of this invention in which the laminated film of the resin layer (B-1) and the resin layer (A) was formed on the support film. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(4) film transfer process

After peeling the support film of the resin layer (A) side of the transfer film (iii), the said transfer film (ii) is superposed so that the surface of the said resin layer (A) may contact the surface of the transparent glass substrate for 6-inch panels, It was thermocompression bonded with a heating roller. As pressure reduction conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. Thereby, the resin layer (A), the resin layer (B-1), and the support film adhered to the surface of the transparent glass substrate.

Then, the exposure process of the resin layer (A) and resin layer (B-1), the image development process, and the baking process were performed like Example 1 after that. As a result, a black matrix having a pattern width of 150 μm and a thickness of 1 μm is formed on the surface of the transparent glass substrate, and an electrode pattern having a pattern width of 50 μm and a height of 5 μm on the black matrix has a space width of 300 μm. The panel material was obtained.

Example 3

(1) Preparation of non-photosensitive inorganic powder containing resin composition C

As the inorganic powder (a '), a specific surface area of 0.5 ㎡ / g, the average particle diameter of 2.3 to 100 parts ㎛ powder, average particle size _{3 ㎛ Bi 2 O 3 -B 2} O 3 -SiO 2 based glass frit (irregular, a softening point of 520 Benzyl methacrylate / n-butyl methacrylate / 2-hydroxypropyl methacrylate / succinic acid mono (2-methacryloyloxyethyl) / methacrylic acid as 3 parts of binder resin (b ') 30 parts of 30/20/20/20/10 (mass%) copolymer (KOH mg / g = 114, Mw = 100,000), 10 parts of trimethylolpropane triacrylate, 1 part of oleic acid, and a solvent as other optional components As (e '), 150 parts of propylene glycol monomethyl ethers were kneaded with a bead mill. Subsequently, the obtained mixture was filtered with a stainless mesh (400 mesh, 38 micrometer diameter), and the non-photosensitive inorganic powder containing resin composition C for electrode patterns was obtained.

(2) Preparation of Resist Composition B-2

Benzyl methacrylate / 2-hydroxypropyl methacrylate / methacrylic acid = 60/20/20 (mass%) copolymer (KOH mg / g = 130, Mw = 35,000) as binder resin (b ") 60 parts , 40 parts of trimethylolpropane triacrylate as the photopolymerizable monomer (c ") and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butane-1 as the photoinitiator (d") 150 parts of propylene glycol monomethyl ether were mixed and stirred as 5 parts of -ON and as a solvent (e "). Next, the obtained kneaded material was filtered with a cartridge filter (2 micrometer diameter), and the resist composition B-2 was obtained.

(3) Preparation of Transfer Film

The composition C prepared in the above (1) was applied onto a support film (200 mm in width, 30 m in length, 38 μm in thickness) made of a PET film subjected to release treatment in advance using a roll coater, and the coating film was coated at 5 ° C. at 5 ° C. Drying was performed to remove the solvent completely. This obtained the transfer film (iv) in which the non-photosensitive inorganic powder containing resin layer (C) of thickness 12micrometer was formed on the support film.

Similarly, the resist composition B-2 manufactured in said (2) is apply | coated using the roll coater on the support film (200 mm in width, 30 m in length, 38 micrometers in thickness) which consists of PET films previously mold-processed, and a coating film Was dried at 100 ° C. for 5 minutes to completely remove the solvent. This obtained the transfer film v in which the resist layer (B-2) of thickness 5micrometer was formed on the support film.

Next, the non-photosensitive inorganic powder containing resin layer (C) of the transfer film (iv) and the resist layer (B-2) of the transfer film (v) were superposed so that the surface of each layer could contact, and it was thermocompression-bonded with the heating roller. . This obtained the transfer film (vi) in which the laminated | multilayer film of the resist layer (B-2) and the non-photosensitive resin layer (C) was formed on the support film. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(4) film transfer process

In the same manner as in Example 1, the transfer film (i) was superposed so that the surface of the resin layer (A) was in contact with the surface of the transparent glass substrate for 6-inch panel, and thermally crimped with a heating roller. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. After completion of the thermocompression treatment, the support film was peeled off. Thereby, the resin layer A was transcribe | transferred and adhered to the surface of the transparent glass substrate.

Next, the support film on the resin layer (C) side of the transfer film (vi) is peeled off, and the transfer film (vi) is superposed so as to contact the surface of the resin layer (C) on the resin layer (A) and heated. Thermal compression was performed with a roller. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. Thereby, the resin layer (A), the resin layer (C), the resist layer (B-2), and the support film adhered to the surface of the transparent glass substrate.

(5) Exposure process of photosensitive inorganic powder containing resin layer (A)

In the same manner as in Example 1, an ultra-high pressure mercury lamp was used from the surface of the transparent glass substrate through the exposure mask (transmitting portion / shielding portion = 150 µm / 300 µm) with respect to the resin layer A in contact with the transparent glass substrate. Was irradiated with i-rays (ultraviolet light having a wavelength of 365 nm). The irradiation amount was 200 mJ / cm 2.

(6) Exposure process of resist layer (B-2)

The resist layer (B-2) formed on the resin layer (A) and the resin layer (C) through an exposure mask (repeating stripe pattern of light transmitting portion / light shielding portion = 50 µm / 50 µm / 50 µm / 300 µm). The i-line (ultraviolet light of 365 nm wavelength) was irradiated from the support film surface side using the ultrahigh pressure mercury lamp. The irradiation amount was 400 mJ / cm 2.

(7) Developing and etching process

After peeling a support film from the resist layer (B-2), the developing process by the shower method using 0.5 mass% sodium carbonate aqueous solution (30 degreeC) as a developing solution was carried out for 30 second with respect to the exposed resist layer (B-2). It was done. Thereby, the uncured resist layer (B-2) which was not irradiated with ultraviolet rays was removed to obtain a pattern of the resist layer (B-2).

Subsequently to the said process, the etching process by the shower method which makes 0.5 mass% aqueous sodium carbonate aqueous solution (30 degreeC) an etching liquid with respect to the resin layer (C) was performed for 40 second. This obtained the pattern of the resin layer (C) corresponding to the pattern of the resist layer (B-2).

Furthermore, the developing process by the shower method which made 0.5 mass% aqueous sodium carbonate aqueous solution (30 degreeC) the developing solution with respect to the exposed resin layer A was performed for 20 second continuously. Thereby, the uncured resin layer (A) which was not irradiated with ultraviolet light was removed, and the pattern of the resin layer (A) and the pattern of the resin layer (C) formed on the pattern of the said resin layer (A) were obtained.

(8) firing process

The transparent glass substrate in which the pattern of the resin layer (A) and the pattern of the resin layer (C) were formed was baked for 30 minutes in the baking furnace in the temperature atmosphere of 550 degreeC. Accordingly, a panel having a space width of 300 μm, in which a black matrix having a pattern width of 150 μm and a thickness of 1 μm is formed on the surface of the transparent glass substrate, and an electrode pattern having a pattern width of 50 μm and a height of 5 μm is formed on the black matrix. Could get the material

Example 4

(3) Preparation of Transfer Film

The support film on the resin layer (C) side of the transfer film (vi) manufactured in Example 3 was peeled off, and the resin layer (C) of the transfer film (vi) and the transfer film (i) produced in Example 1 were removed. The resin layer (A) was superimposed so that the surface of each layer could contact, and it thermocompressed with the heating roller. Thus, the transfer film of the present invention (hereinafter referred to as "transfer film") having a laminated film of a resist layer (B-2), a non-photosensitive inorganic powder-containing resin layer (C) and a photosensitive inorganic powder-containing resin layer (A) formed on a supporting film. vii) "). As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min.

(4) film transfer process

The support film on the resin layer (A) side of the transfer film (vii) is peeled off, and the transfer film (vii) is superposed so that the surface of the resin layer (A) is in contact with the surface of the transparent glass substrate for 6-inch panel, It was thermocompressed with a heating roller. As crimping conditions, the surface temperature of the heating roller was 120 degreeC, the roll pressure was 4 kg / cm, and the moving speed of the heating roller was 0.5 m / min. Thereby, the resin layer (A), the resin layer (C), the resist layer (B-2), and the support film adhered to the surface of the transparent glass substrate.

Subsequently, in the same manner as in Example 3, the exposure step of the resin layer (A) and the resist layer (B-2), the developing step of the resist layer (B-2), the etching step of the resin layer (C), and the resin layer The developing process of (A) and the baking process were performed. Accordingly, a black matrix having a pattern width of 150 μm and a thickness of 1 μm is formed on the surface of the transparent glass substrate, and an electrode pattern having a pattern width of 50 μm and a height of 5 μm on the black matrix has a space width of 300 μm. The panel material was obtained.

According to the present invention, a plurality of elements (for example, a black matrix, an electrode pattern, etc.) constituting the FPD can be collectively formed on a transparent substrate, so that the number of steps can be reduced as compared with the conventional method for manufacturing FPD. There is improved production efficiency.

Claims (19)

(1) forming a laminated film comprising a photosensitive inorganic powder-containing resin layer (A) in contact with the transparent substrate and a photosensitive resin layer (B) having a different layer composition from the resin layer (A) on the transparent substrate; (2) pattern-exposing the transparent substrate on which the said laminated film was formed from the transparent substrate surface side and the laminated film formation surface side, respectively, (3) a step of forming a laminated film pattern by developing or etching the laminated film, and (4) baking the laminated film pattern Method of manufacturing a flat panel display comprising a. The said photosensitive resin layer (B) is a photosensitive inorganic powder containing resin layer, The manufacturing method of the flat panel display of Claim 1 characterized by the above-mentioned. The method of manufacturing a flat panel display according to claim 1, wherein the photosensitive resin layer (B) is a resist layer containing no inorganic powder. The said laminated film further contains a non-photosensitive inorganic powder containing resin layer (C), The manufacturing method of the flat panel display in any one of Claims 1-3 characterized by the above-mentioned. The said photosensitive resin layer (B) in any one of Claims 1-4 in which the said process (1) was formed on the said photosensitive inorganic powder containing resin layer (A) and / or the support film formed on the support film. A method for manufacturing a flat panel display, characterized in that the method is carried out by a method including the step of transferring a) onto the transparent substrate. The said photosensitive resin layer (B) in any one of Claims 1-4 in which the said process (1) was formed on the said photosensitive inorganic powder containing resin layer (A) and / or the support film formed on the support film. A method for manufacturing a flat panel display comprising the step of transferring a laminated film containing a layer) onto the transparent substrate. The method according to any one of claims 1 to 4, wherein the step (1) collectively transfers a laminated film including all the layers formed on the transparent substrate, formed on the supporting film, onto the transparent substrate. The manufacturing method of the flat panel display characterized by the above-mentioned. The said photosensitive inorganic powder containing resin layer (A) contains metal powder and / or inorganic pigment powder, The manufacturing method of the flat panel display in any one of Claims 1-7 characterized by the above-mentioned. The said photosensitive inorganic powder containing resin layer (A) contains black pigment powder, The manufacturing method of the flat panel display in any one of Claims 1-7 characterized by the above-mentioned. The manufacturing method of the flat panel display of Claim 2 in which the said photosensitive inorganic powder containing resin layer (A) contains black pigment powder, and the said photosensitive resin layer (B) contains metal powder. The flat panel display according to claim 4, wherein the photosensitive inorganic powder-containing resin layer (A) contains black pigment powder, and the non-photosensitive inorganic powder-containing resin layer (C) contains metal powder. Way. The method for manufacturing a flat panel display according to any one of claims 8, 10 and 11, wherein the metal powder is silver powder. The flat panel display manufacturing method according to any one of claims 1 to 12, wherein a black matrix pattern and an electrode pattern are collectively formed on the black matrix pattern. The flat panel display manufacturing method according to any one of claims 1 to 13, wherein the flat panel display is a plasma display panel. A transfer film, comprising a laminated film comprising a photosensitive inorganic powder-containing resin layer (A) and a photosensitive resin layer (B) different in layer composition from the resin layer (A) on a supporting film. The transfer film according to claim 15, wherein the laminated film further comprises a non-photosensitive inorganic powder-containing resin layer (C). The photosensitive resin layer (B), the non-photosensitive inorganic powder containing resin layer (C), and the photosensitive inorganic powder containing resin layer (A) are laminated | stacked in the said order, and the said photosensitive number is carried out on a support film. The base layer (B) is a resist layer containing no inorganic powder. The transfer film according to any one of claims 15 to 17, wherein the laminated film formed on the support film is laminated by lamination. It is used for the manufacturing method of the flat panel display in any one of Claims 1-14, The transfer film as described in any one of Claims 15-18.

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