KR20070078387A - Ａｇ 배선 기판 - Google Patents

Ａｇ 배선 기판 Download PDF

Info

Publication number
KR20070078387A
KR20070078387A KR1020070007848A KR20070007848A KR20070078387A KR 20070078387 A KR20070078387 A KR 20070078387A KR 1020070007848 A KR1020070007848 A KR 1020070007848A KR 20070007848 A KR20070007848 A KR 20070007848A KR 20070078387 A KR20070078387 A KR 20070078387A
Authority
KR
South Korea
Prior art keywords
wiring board
metal
resin layer
particles
migration
Prior art date
Application number
KR1020070007848A
Other languages
English (en)
Korean (ko)
Inventor
기요시 야마우라
히로유끼 구마꾸라
Original Assignee
소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 filed Critical 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤
Publication of KR20070078387A publication Critical patent/KR20070078387A/ko

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/053—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an inorganic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0753—Insulation
    • H05K2201/0769—Anti metal-migration, e.g. avoiding tin whisker growth
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Conductive Materials (AREA)
KR1020070007848A 2006-01-26 2007-01-25 Ａｇ 배선 기판 KR20070078387A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2006017488A JP2007201142A (ja) 2006-01-26 2006-01-26 Ａｇ配線基板
JPJP-P-2006-00017488 2006-01-26

Publications (1)

Publication Number Publication Date
KR20070078387A true KR20070078387A (ko) 2007-07-31

Family

ID=38455425

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070007848A KR20070078387A (ko) 2006-01-26 2007-01-25 Ａｇ 배선 기판

Country Status (2)

Country Link
JP (1) JP2007201142A (ja)
KR (1) KR20070078387A (ja)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02245070A (ja) * 1989-03-17 1990-09-28 Hitachi Chem Co Ltd 導電性ペースト組成物
JP2964730B2 (ja) * 1991-09-30 1999-10-18 日本電気株式会社 プラズマディスプレイパネル
JP2004004947A (ja) * 1997-04-30 2004-01-08 Matsushita Electric Ind Co Ltd プラズマディスプレイパネル
JP3633422B2 (ja) * 2000-02-22 2005-03-30 ソニーケミカル株式会社 接続材料
JP2001273816A (ja) * 2000-03-27 2001-10-05 Asahi Chem Res Lab Ltd 導電性ペースト
JP2004319882A (ja) * 2003-04-18 2004-11-11 Alps Electric Co Ltd 配線基材およびそれを備えた電気機器およびスイッチ装置

Also Published As

Publication number Publication date
JP2007201142A (ja) 2007-08-09

Similar Documents

Publication Publication Date Title
Lu et al. Mechanisms underlying the unstable contact resistance of conductive adhesives
KR100728852B1 (ko) 반도체 장치
DE60118853T2 (de) Leitfähiges Bindemittel und Verpackungsstruktur daraus
WO2013161125A1 (ja) コネクタ用めっき端子
Zhu et al. Electrochemical migration behavior of Ag-plated Cu-filled electrically conductive adhesives
JP2008097949A (ja) 導電性ペースト
Chaikin et al. Silver migration and printed wiring
KR100698662B1 (ko) 주석-은-구리 3원합금으로 이루어지는 표면을 형성한단자, 그것을 갖는 부품 및 제품
KR20070078387A (ko) Ａｇ 배선 기판
JP5296116B2 (ja) 半導体装置
EP3094697B1 (de) Schaltungsträger mit einer silikonpolymer-beschichtung
JP2008098646A (ja) 半導体装置
Vu Silver migration–The mechanism and effects on thick-film conductors
JP3450839B2 (ja) 導電性接着剤を用いた実装構造体
TW201542831A (zh) 導電性顆粒、導電性粉體、導電性高分子組成物及各向異性導電片
JPS6345702A (ja) 金属含有ペ−スト
JPH10245528A (ja) 異方導電性接続部材
JP7186583B2 (ja) 銅微粒子分散液及び透明導電回路の作製方法
JP6681114B2 (ja) 導電回路の作製方法及び導電回路
JP3023554B2 (ja) プリント配線板用被覆材及びプリント配線板
JP3618441B2 (ja) 導電性金属複合粉及びその製造法
US20150093923A1 (en) Terminal
JP2001273816A (ja) 導電性ペースト
KR20200009583A (ko) 갈바닉 부식 방지 및 산화 방지 효과가 우수한 알루미늄 소재용 도전성 테이프
KR102449786B1 (ko) 무전해 도금 처리된 pcb 배선의 부식 방지 첨가제

Legal Events

Date Code Title Description
N231 Notification of change of applicant
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
J201 Request for trial against refusal decision
E90F Notification of reason for final refusal
B601 Maintenance of original decision after re-examination before a trial
J301 Trial decision

Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20131025

Effective date: 20150320

Free format text: TRIAL NUMBER: 2013101007667; TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20131025

Effective date: 20150320