KR20070037300A - Electronic equipment cooling device and electronic equipment - Google Patents

Abstract

It is an object of the present invention to provide a small cooling device and a notebook computer using a refrigeration cycle.

The cooling device 40 incorporated in the housing portion 30 of the computer 10 includes a compressor 41, a condenser 42, an evaporator 44, a capillary tube 43 serving as an expansion means, and a blowing air. It consists of a fan 45. Moreover, these apparatuses which comprise the cooling apparatus 40 are mutually connected by the tubular piping 46. As shown in FIG. In addition, in this invention, the compressor 41, the condenser 42, and the blowing fan 45 are arrange | positioned in the plane different position, and the longitudinal direction of the condenser 41 and the condenser 42 is near the blowing fan 45. FIG. It is arranged in an L shape in the. Thereby, the planar size of the cooling device 40 can be made compact, and it can suppress that the cooling device 40 inhibits the layout of the other components integrated in the housing part 30. FIG.

Electronic equipment, cooling system, compressor, condenser, blowing fan

Description

ELECTRONIC EQUIPMENT COOLING DEVICE AND ELECTRONIC EQUIPMENT}

1A is a plan view showing a computer according to an embodiment of the present invention, and (b) is a plan view showing a cooling device according to an embodiment of the present invention.

Fig. 2A is a perspective view showing a cooling apparatus according to an embodiment of the present invention, and Fig. 2B is a perspective view of the computer according to the embodiment of the present invention as seen from below.

Fig. 3A is a view of the computer according to the embodiment of the present invention from the front, and Fig. 3B is a sectional view of a portion where a cooling device is installed.

Fig. 4A is a plan view of the rotary compressor according to the embodiment of the present invention, and Fig. 4B is a sectional view thereof.

5 (a) and 5 (b) are plan views illustrating a cooling device according to an embodiment of the present invention.

6 is a diagram showing an electrical configuration of a cooling device according to an embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

10: computer

20: display unit

30: housing part

31: Motherboard

32: CD ROM Drive

33: battery

34: HDD

35: FDD

36: CPU

37, 38: exhaust port

39: intake vent

40: cooling unit

41: compressor

42: condenser

43: capillary tube

44: evaporator

45: blower fan

46: piping

47: derivation unit

48: Introduction

49: memory

50: motor unit

51 pump

52: terminal

53: cylinder

54: vane

55: cylinder chamber

56: roller

57: case

58: rotation axis center

59: microcomputer

60: notch

61: inverter

62: shaft

[Document 1] Japanese Unexamined Patent Publication No. 2002-198478

TECHNICAL FIELD The present invention relates to a cooling device and an electronic device of an electronic device, and more particularly, to a cooling device and an electronic device of an electronic device using a refrigeration cycle.

In recent years, advances in high functionality and miniaturization of notebook computers have been remarkable. Along with the high performance of notebook computers, the CPU (Central Processing Unit) has been increasing in speed and versatility to increase the amount of heat generated from the CPU.

Therefore, in order to suppress the temperature rise of a CPU conventionally, the heat radiation fin which was excellent in heat dissipation was provided in the surface of a CPU, and air was blown out to the heat radiation fin by the rotating blower fan. Moreover, after heat-transporting using the heat pipe, the heat radiation by the heat radiation fin was performed. By taking such countermeasures, for example, the temperature rise of the CPU with a power consumption of about 60 W can be suppressed to about 70 ° C or less.

However, in recent years, the amount of heat generated by the CPU has increased to, for example, about 100 W, and a problem has arisen in that the CPU is not sufficiently cooled in the method of heat dissipation using the blower fan and the heat pipe. In addition, even if the CPU can be sufficiently cooled, there has been a problem that the cooling device for cooling the CPU becomes large.

As another method of suppressing the temperature rise of the CPU, there is a method using a water cooling cycle or a method using a refrigeration cycle. These methods can cool the CPU more efficiently than the above-described method using the blower fan, so that the temperature of the CPU with a large amount of heat generated can be kept below a certain level. The following patent document 1 discloses the technical matter of cooling a semiconductor device using a refrigerating cycle.

[Patent Document 1] Japanese Unexamined Patent Application Publication No. 2002-198478

However, since the structure of the cooling device using the above-mentioned refrigeration cycle is complicated, it is difficult to incorporate it into a small notebook computer. Specifically, in a cooling apparatus using a refrigerating cycle, a compressor for compressing a refrigerant, an evaporator that takes in heat from the heat sink, a condenser that takes out heat from the refrigerant, an expansion means for expanding the refrigerant, a blowing fan, and the like are required. On the other hand, in a notebook computer, a large number of electronic components such as a hard disk drive (HDD) or a disk drive device need to be accommodated in a compact housing, and there is a limit to the space that can be used due to the cooling device. Therefore, it has been difficult to accommodate a cooling device using a refrigeration cycle that requires a large number of parts in a housing of a small notebook computer.

In addition, in the cooling apparatus using a refrigerating cycle, since a heat is taken out using a fan from the compressed high temperature refrigerant | coolant, the temperature of the air discharged from a cooling apparatus becomes high temperature, for example about 50 to 60 degreeC or more. If a user using a computer contacts such hot air, the user may be burned. Therefore, there was a problem that air discharged from the cooling device cannot be discharged in any direction.

The present invention has been made in view of the above problems, and a main object of the present invention is to provide a compact cooling device and an electronic device using a refrigeration cycle.

The cooling apparatus of the electronic apparatus of the present invention includes compression means for compressing a refrigerant, condensation means for releasing heat to the outside by liquefying heat from the refrigerant compressed by the compression means, and expanding the refrigerant liquefied by the condensation means. Expansion means for receiving, evaporation means for receiving heat from the semiconductor element and evaporating the refrigerant expanded by the expansion means, and blowing means, wherein the compression means and the condensing means are arranged at different positions in a plane, The longitudinal direction of the condensation means and the longitudinal direction of the compression means is characterized in that arranged in an L shape.

In addition, the cooling apparatus of the electronic apparatus of the present invention includes a compression means for compressing a refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside, and the refrigerant liquefied by the condensation means. Expansion means for expanding the air, evaporation means for receiving heat from the semiconductor element and evaporating the refrigerant expanded by the expansion means, and blowing means, wherein the compression means, the condensing means, and the blowing means It is arrange | positioned in another position, The said compression means and the said condensation means are arrange | positioned in the vicinity of the said blowing means, It is characterized by the above-mentioned.

In addition, the cooling apparatus of the electronic apparatus of the present invention includes a compression means for compressing a refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside, and the refrigerant liquefied by the condensation means. Expansion means for inflating the gas, and evaporation means for receiving heat from the semiconductor element and evaporating the refrigerant expanded by the expansion means, wherein at least a portion of the pipe connected to the evaporation means is located above the evaporation means. Characterized in that.

In addition, the cooling apparatus of the electronic apparatus of the present invention includes a compression means for compressing a refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside, and the refrigerant liquefied by the condensation means. Expansion means for expanding the heat sink, and evaporation means for receiving heat from the semiconductor element and evaporating the refrigerant expanded by the expansion means, wherein the compression means, the condensation means, and the evaporation means are located at different positions on one plane. And the compression means comprises a rotary compressor horizontally disposed with respect to the one plane, the rotary compressor having an introduction portion through which the refrigerant is introduced, and a discharge portion through which the refrigerant is drawn out, and the extraction portion of the rotary compressor. It is characterized by being installed above the center of the rotation shaft.

In addition, the cooling apparatus of the electronic apparatus of the present invention includes a compression means for compressing a refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside, and the refrigerant liquefied by the condensation means. Expansion means for expanding the heat sink, and evaporation means for receiving heat from the semiconductor element and evaporating the refrigerant expanded by the expansion means, wherein the compression means, the condensation means, and the evaporation means are located at different positions on one plane. And the compression means comprises a rotary compressor transversely disposed with respect to the one plane, the rotary compressor having an introduction portion through which the refrigerant is introduced and an egress portion from which the refrigerant is derived, and the introduction portion of the rotary compressor It is characterized in that it is provided below the center of the rotating shaft.

The present invention provides an electronic apparatus having a housing portion in which a functional element operating with heat generation is accommodated, wherein a cooling device for cooling the functional element using a refrigeration cycle is incorporated in the housing portion.

In addition, the present invention provides an electronic device having a housing portion in which a functional element operating with heat generation is accommodated, wherein the housing portion includes compression means for compressing a refrigerant and heat from the refrigerant compressed by the compression means. Condensing means for releasing and liquefying outside of the negative portion, expansion means for expanding the refrigerant liquefied by the condensation means, evaporation means for receiving heat from the functional element and evaporating the refrigerant expanded by the expansion means; And a cooling device made of a blowing means, and the longitudinal direction of the condensing means and the compression means is disposed substantially parallel to the side surface of the housing part.

In addition, the present invention provides an electronic device having a housing portion in which a functional element operating with heat generation is accommodated, wherein the housing portion includes compression means for compressing a refrigerant and heat from the refrigerant compressed by the compression means. Condensing means for releasing and liquefying outside of the negative portion, expansion means for expanding the refrigerant liquefied by the condensation means, evaporation means for receiving heat from the functional element and evaporating the refrigerant expanded by the expansion means; And a cooling means comprising a blower means for monitoring the temperature of the functional element, and a control means for controlling the cooling capacity of the cooling device based on the output of the monitoring means.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described in detail with reference to drawings. In the present invention, a notebook computer is described as an example of an electronic device, but the present embodiment can be applied to other electronic devices. For example, the present invention can be applied to a desktop computer, a personal digital assistant (PDA), or the like.

1A and 1B are diagrams showing a notebook computer 10 (hereinafter referred to as a computer) of this embodiment. FIG. 1A is a plan view of the computer 10 viewed from above, and FIG. 1B is a plan view of the cooling device 40 incorporated in the computer 10.

With reference to FIG. 1A, the computer 10 of the present embodiment is rotatably connected to a housing portion 30 in which a functional element with heat generation such as a CPU 36 is embedded, and a housing portion 30. The display unit 20 is formed.

The display part 20 is equipped with displays, such as a liquid crystal display and an organic electroluminescent (EL) display.

The housing part 30 contains electronic components constituting the computer 10. Specifically, the motherboard 31, the CD (Compact Disc) ROM drive 32, the battery 33, the HDD 34, the FDD (Floppy (registered trademark) Disk Drive) 35, the cooling device 40. And the CPU 36 are incorporated in the housing portion 30. These parts embedded in the housing part 30 are arranged at different positions in a plane. In addition, inside the housing part 30, a PC card reader, a semiconductor memory, a cable connecting them to each other, and the like are incorporated. Among the electronic components incorporated in the housing part 30, the CPU 36 is particularly high in heat generation amount, and a cooling device 40 is provided to dissipate the CPU 36.

The planar size of the display portion 20 and the housing portion 30 are substantially the same, and when the display portion 20 and the housing portion 30 are folded, the entire housing becomes one housing. The planar size of the computer 10 in the state where the housing portion 30 and the display portion 20 are folded is, for example, A4 size (210 mm x 290 mm) or B5 size (182 mm x 257 mm). Although not shown here, a pointing device such as a keyboard or a pad is disposed on the upper surface of the housing portion 30.

The configuration of the cooling device 40 will be described with reference to Fig. 1B. The cooling device 40 includes a compressor 41 (compression means), a condenser 42 (condensation means), an evaporator 44 (evaporation means), a capillary tube 43 (expansion means), and blowing air It consists of the fan 45 (blowing means). Moreover, these apparatus which comprise the cooling apparatus 40 are mutually connected by the tubular piping 46. As shown in FIG.

The compressor 41 has a function of compressing a refrigerant made of introduced ammonia, prolon, carbon dioxide and the like. As the compressor 41, a rotary (rotary) compressor or a reciprocal (reciprocating) compressor is adopted. As the compressor 41, the rotary compressor arrange | positioned by the horizontal arrangement is employ | adopted in this form. Since the rotary compressor is relatively small, it is suitable as the compressor 41 incorporated in a notebook computer. The details of the compressor 41 will be described later.

In addition, the compressor 41 includes an introduction portion 48 through which refrigerant is introduced from the outside, and a discharge portion 47 through which the refrigerant compressed therein is led out. In this embodiment, the lead portion 47 of the compressor 41 is disposed at a position closer to the condenser 42 than the inlet portion 48. In this way, the lead portion 47 of the compressor 41 and the condenser 42 approach. Therefore, the refrigerant compressed by the compressor 41 can be immediately supplied to the condenser 42.

Here, the lead-out part 47 does not necessarily need to be provided in the condenser 42 side, and you may change the position of the lead-out part 47 according to the structure of the compressor 41. That is, the lead-out part 47 may be provided farther from the condenser 42 than the inlet part 48. In this case, on the paper surface, the lead-out part 47 is provided in the compressor 41 lower than the introduction part 48. As shown in FIG.

Here, the compressor 41 is arranged in the left part (near the left end part) in the inside of the housing part 30, and the longitudinal direction is arrange | positioned so that it may become substantially parallel with the side surface of the housing part 30, but this arrangement is carried out. You can change it. That is, the compressor 41 may be arrange | positioned in the inside of the housing part 30 in the right part (near the right end part), and may be arrange | positioned so that the longitudinal direction may become parallel to the side surface of the housing part 30. As shown in FIG.

The condenser 42 has a function of releasing heat from the refrigerant compressed by the compressor 41 to the outside and condensing and liquefying the refrigerant. The condenser 42 is formed by arranging a plurality of metal plates in parallel with each other. The metal plate constituting the condenser 42 is thermally coupled to the pipe 46 through which the refrigerant passes. In the figure, although the condenser 42 is arrange | positioned near the rear end inside the housing part 30, and the longitudinal direction is arrange | positioned substantially parallel to the side surface of the housing part 30, you may change this arrangement | positioning. . That is, the condenser 42 is disposed in the left side (near the left end) or the right side (near the right end) in the housing part 30, so that the longitudinal direction thereof is parallel to the side surface of the housing part 30. It may be arranged.

The capillary tube 43 has a function of expanding the refrigerant. Here, the capillary tube 43 is wound up and arrange | positioned circularly above the blowing fan 45, and is arrange | positioned. By arranging the capillary tube 43 above the blowing fan 45, the planar size of the cooling device 40 can be reduced.

The evaporator 44 is thermally coupled with an electronic component accompanied by heat generation such as the CPU 36. Therefore, the evaporator 44 receives heat generated from the CPU 36, so that the refrigerant becomes a gaseous state from the liquid state in the evaporator 44. Here, the evaporator 44 is arrange | positioned in the position which overlaps with CPU36.

The blowing fan 45 has a function of blowing low temperature air from the outside of the housing part 30 and blowing out the low temperature air to the condenser 42 and the compressor 41. The air which has become hot by receiving heat from the condenser 42 and the compressor 41 is discharged to the outside from the side of the housing part 30.

The operation of the cooling device 40 configured as described above is as follows. When the cooling device 40 is operated to cool the CPU 36 or the like, the refrigerant is first brought into a state of high temperature and high pressure by the compressor 41. The refrigerant at high temperature and high pressure is transferred to the condenser 42 via the pipe 46. In the condenser 42, the refrigerant is liquefied by the cooling action of the low-temperature air transferred from the blowing fan 45. The refrigerant in the liquid state is transferred to the capillary tube 43 via the pipe 46. In the capillary tube 43, the refrigerant is expanded to a state of low pressure and low temperature, and the refrigerant is transferred to the evaporator 44. In the evaporator 44, heat generated from the CPU 36 is taken in by the refrigerant. As a result, the refrigerant evaporates to a gaseous state, and the gaseous refrigerant is transferred to the compressor 41 again.

As the cooling device 40 operates as described above, the CPU 36 is cooled. In this embodiment, by employing the cooling device 40 of the refrigerating system, for example, the CPU 36 having a power consumption of about 60 W to 200 W can be sufficiently cooled.

In the cooling device 40 of this embodiment, the compressor 41, the condenser 42, and the blowing fan 45 are arranged at different positions in a plane, and the longitudinal direction of the compressor 41 and the condenser 42 is the blowing fan ( It is arranged in an L shape in the vicinity of 45). Thereby, the planar size of the cooling device 40 can be made compact, and it can suppress that the cooling device 40 inhibits the layout of the other components integrated in the housing part 30. FIG. Moreover, in the place other than the vicinity of the blowing fan 45, the longitudinal direction of the compressor 41 and the condenser 42 may be arrange | positioned in L shape.

Specifically, the compressor 41 and the condenser 42 are relatively large among the components constituting the cooling device 40. Therefore, when such a large component is arranged to protrude to the circumference, the area occupied by the cooling device 40 in the housing portion 30 becomes large, thereby limiting the layout of other components. Therefore, by arrange | positioning so that the longitudinal direction of the compressor 41 and the condenser 42 may be L-shape, the planar size of the cooling apparatus 40 becomes compact and there is no protruding part.

In addition, the compressor 41 and the condenser 42 are components cooled by the blowing fan 45. Therefore, the compressor 41 and the condenser 42 are arranged in the L-shape in the vicinity of the blower fan 45, which also has the advantage of increasing the effect of cooling by the blower fan.

Moreover, the cooling device 40 is arrange | positioned at the edge part of the left back side inside the housing part 30, and is arrange | positioned. By arranging the cooling device 40 in such a position, the heat generated from the cooling device 40 can prevent other electronic components such as the HDD 34 from being adversely affected by the heat generated from the cooling device 40. . Here, the cooling device 40 may be arrange | positioned in places other than the left rear. That is, the place where the cooling device 40 is arrange | positioned may be right rear, left front, and right front inside the housing part 30. As shown in FIG.

In addition, the arrangement of the condenser 42 and the compressor 41 may be changed. That is, the compressor 41 is arrange | positioned behind the inside of the housing part 30, and the longitudinal direction is arrange | positioned in parallel with the side surface of the housing part 30. As shown in FIG. Moreover, you may arrange | position the condenser 42 to the right side or left side inside the housing part 30, and the longitudinal direction may be arrange | positioned in parallel with the side surface of the housing part 30. As shown in FIG.

Next, with reference to Figs. 2A and 2B, the structure of the computer 10 will be described centering on the blowing fan 45. Figs. FIG. 2A is a perspective view showing a portion in which the cooling device 40 is incorporated in the computer 10, and FIG. 2B is a perspective view of the computer 10 viewed from a downward slope.

Referring to Fig. 2A, the condenser 42 is disposed near the rear end inside the housing portion 30. Figs. Moreover, the longitudinal direction of the condenser 42 is arrange | positioned substantially parallel with the side surface of the back of the housing part 30. As shown in FIG. As a result, the air blown out by the blower fan 45 to the condenser 42 is discharged to the outside from the rear of the housing part 30 after receiving heat from the condenser 42 and becoming a high temperature. As described above, the positional relationship between the condenser 42 and the compressor 41 may be changed.

Moreover, the compressor 41 is arrange | positioned near the left end part of the housing part 30, and the longitudinal direction of the compressor 41 is arrange | positioned substantially parallel to the side surface of the left side of the housing part 30. As shown in FIG. Therefore, the air blown out from the blower fan 45 to the compressor 41 is discharged to the outside of the housing part 30 after receiving the heat of the compressor 41.

As mentioned above, the condenser 42 and the compressor 41 which generate | occur | produce with the operation | movement of the cooling device 40 are arrange | positioned at the periphery of the housing part 30. As shown in FIG. By doing in this way, the air blown out by the blowing fan 45 and it became high temperature can be immediately discharge | released to the exterior of the housing part 30. Therefore, it can suppress that the whole housing part 30 becomes high temperature by the heat_generation | fever of the condenser 42 and the compressor 41. FIG.

Referring to FIG. 2B, the blowing fan 45 blows outside low temperature air into the housing 30 from the intake port 39 provided on the bottom surface of the housing 30. Moreover, the air which became high by cooling the condenser 42 and the compressor 41 is discharged | emitted from the exhaust ports 37 and 38 provided in the side of the housing part 30 to the outside. In the inlet port 39 and the exhaust port 37, 38, a plurality of holes are provided in the housing part 30 in a slit shape.

By providing the exhaust port 38 in the rear part of the housing part 30, the hot air heated by receiving the heat of the condenser 42 and exhausted is exhausted to the back of the computer 10. As shown in FIG. Therefore, since heated air is not discharged toward the user located in front of the computer 10, it is possible to prevent the user from being injured such as an burn. In addition, the air which has become hot due to the heat of the condenser 42 may be discharged to the outside from the right side or the left side of the housing part 30.

In addition, by providing the exhaust port 37 on the left side of the housing part 30, the air cooled to the high temperature by cooling the compressor 41 is discharged from the left side of the computer 10 to the outside. On the other hand, a normal user operates a pointing device such as a mouse with his right hand. Therefore, the hot air discharged from the exhaust port 37 does not come into contact with the user's hand using the mouse, thereby preventing the user from getting burned. In addition, the exhaust port 37 may be provided on the right side of the housing part 30.

As mentioned above, the air discharged | emitted from the cooling device 40 using a refrigerating cycle is high temperature about 50 degreeC-60 degreeC, for example. Therefore, by providing the exhaust ports 37 and 38 through which the hot gas is discharged to the left side and the rear of the housing portion 30, the user does not come into contact with the exhaust gas, so that a safe computer configuration can be obtained for the user.

Referring to Figs. 3A and 3B, the computer 10 will be described, particularly with reference to the piping configuration. FIG. 3A is a view of the computer 10 from the front, and FIG. 3B is a sectional view of a portion where the cooling device 40 is disposed.

3 (a) and 3 (b), the compressor 41, the condenser 42, the capillary tube 43 and the evaporator 44 constituting the cooling device 40 are piped to each other. It is connected by (46). Heat generated from the CPU 36 is transported to the condenser 42 through the refrigerant flowing through the pipe 46 and discharged to the outside.

In this embodiment, at least a part of the pipe 46A connecting the capillary tube 43 and the evaporator 44 is located above the evaporator 44. In addition, at least a part of the pipe 46B connecting the evaporator 44 and the compressor 41 is located above the evaporator 44. Thereby, there exists an advantage that liquid refrigerant | coolant is stored in the piping 46A, 46B and the evaporator 44, and cooling of CPU36 is performed by this stored liquid refrigerant (liquid refrigerant).

Specifically, piping 46A, 46B is manufactured by shape | molding metal, such as copper, into a pipe shape, for example, At least one part is located above the upper surface of the evaporator 44 which cools CPU36. . While the cooling device 40 is operating, the refrigerant passes through the interior of the pipes 46A and 46B. When the computer 10 is shut down and the cooling device 40 is stopped, liquid refrigerant remains inside the pipes 46A and 46B and the evaporator 44. When the computer 10 is operated again, the CPU 36 is cooled using the evaporator 44 by the liquid refrigerant remaining in the pipes 46A and 46B and the evaporator 44.

Specifically, when the computer 10 starts up, the CPU 36 is most actively operated and heated. The reason for this is that the CPU 36 is set to be actively operated at computer startup in response to a user's request for early startup of the computer.

In synchronism with the startup of the computer 10, the cooling device 40 may be operated immediately and cooling of the CPU 36 may be performed, but in practice, the time difference from the startup of the computer 10 until the cooling device 40 operates. There may be. For this reason, if the CPU 36 is actively operated immediately after the computer is started and the cooling by the cooling device 40 is not performed, the CPU 36 may be excessively high temperature. Therefore, in this embodiment, piping 46A, 46B which supplies a refrigerant | coolant to the evaporator 44 which cools CPU36 is located above the evaporator 44. FIG. As a result, when the cooling device 40 is stopped, the liquid liquid refrigerant is stored in the pipes 46A and 46B and the evaporator 44. And even if the cooling device 40 does not operate at the time of restart of a computer, the CPU 36 is cooled by the liquid refrigerant stored in the piping 46A, 46B and the evaporator 44 for a fixed time. Thus, overheating of the CPU 36 when the computer is restarted is prevented.

In the above description, both of the pipes 46A and 46B are located above the evaporator 44, but only one of the pipes 46A and 46B may be located above the evaporator 44. In addition, when both of the pipes 46A and 46B are positioned above the evaporator 44, a larger amount of liquid refrigerant is stored, and therefore, there is an advantage that the effect of the cooling described above is increased.

The details of the rotary compressor 41 employed as the compressor of this embodiment will be described with reference to Figs. 4A and 4B. Fig. 4A is a plan view showing the structure of the rotary compressor 41, and Fig. 4B is a sectional view of the pump section of the rotary compressor.

Referring to FIG. 4A, the rotary compressor 41 includes a motor unit 50 and a pump unit 51 driven by the motor unit 50. The motor unit 50 includes a motor that rotates by electric power supplied from the terminal 52. The pump portion 51 is a portion for compressing the refrigerant introduced from the outside, and is operated by the driving force of the motor portion 50. The introduction portion 48 is a portion where the refrigerant after expansion is introduced into the rotary compressor 41 from the outside. The lead-out part 47 is a site where the refrigerant compressed by the rotary compressor 41 is taken out. Moreover, each element which comprises the motor part 50 and the pump part 51 is accommodated in the inside of the substantially cylindrical case 57. As shown in FIG.

The structure of the pump part 51 is demonstrated with reference to FIG.4 (b). The pump part 51 has the cylinder 53 accommodated in the case 57, and the roller 56 built in the cylinder 53 and rotating. The cylinder chamber 55 is installed between the rollers 56 inside the cylinder 53. Moreover, the shaft 62 which has a circular cross section is provided in the roller 56, and the position of this shaft 62 is being fixed. And inside the cylinder 53, the vane 54 is provided in order to partition the cylinder chamber 55 in which the compressed refrigerant | coolant is located, and the cylinder chamber 55 in which the uncompressed refrigerant | coolant is located. . The vane 54 is provided so that a sliding movement can be performed in a vertical direction.

In the cylinder 53, the refrigerant | coolant introduced from the introduction part 48 is compressed because the roller 56 which the inner wall contacts the shaft 62 rotates eccentrically. The refrigerant compressed in the cylinder chamber 55 is filled into the case 57 from the cutout portion 60 and discharged to the outside from the lead portion 47. The cutout portion 60 is a portion cut out of a portion of the cylinder 53 in order to transfer the refrigerant inside the cylinder chamber 55 to the case 57. In addition, in order to facilitate the rotation of the roller 56, the lubricating oil is stored inside the case 57.

In this embodiment, the lead-out part 47 in which the compressed refrigerant is led to the outside is provided above the center of the rotation shaft 58 of the rotary compressor 41. Here, the center of rotation axis 58 is the center of shaft 62, in other words, the center of case 57. Thereby, mixing of lubricating oil in the refrigerant | coolant discharged | emitted from the discharge | release part 47 to the outside can be suppressed.

Specifically, as shown in FIG. 1, the rotary compressor 41 is arrange | positioned in the horizontal arrangement with respect to the one plane on which the condenser 42, the blowing fan 45, etc. are mounted. Therefore, the lubricating oil located inside the case 57 is located under the influence of gravity. For this reason, when the lead-out part 47 which coolant is taken out outside is provided in the lower part of the rotary compressor 41, there exists a possibility that a large amount of lubricating oil may mix in the taken-out coolant. If a large amount of lubricating oil is mixed in the refrigerant to be taken out, the amount of lubricating oil of the rotary compressor 41 is lowered, the function of the compressor is lowered, and the CPU may not be sufficiently cooled. Thus, in this embodiment, the lead portion 47 is provided above the case 57. Thereby, mixing of a large amount of lubricating oil is prevented in the refrigerant | coolant drawn out.

In addition, since the cylinder chamber 55 is partitioned by the vane 54 about the introduction part 48 as mentioned above, it is arrange | positioned in the case 57 lower than the center of the rotation shaft 58.

Another form of the cooling apparatus 40 is demonstrated with reference to FIG.5 (a) and (b). 5 (a) and 5 (b) are diagrams showing another type of cooling device 40. As shown in FIG.

Referring to Fig. 5A, two blowing fans 45A and 45B are provided here. By providing two blowing fans 45A and 45B in this manner, the amount of air blown into the condenser 42 is increased, so that the function of cooling the cooling device 40 can be further improved. Here, although two blowing fans 45A and 45B are arrange | positioned adjacently, you may arrange | position spaced apart. In addition, three or more blowing fans may be provided.

Referring to FIG. 5B, a pipe 46C connecting the compressor 41 and the evaporator 44 is in contact with the memory 49. As a result, the heat generated from the memory 49 is taken in by the refrigerant passing through the inside of the pipe 46C, and the memory 49 is cooled. The memory 49 is cooled by the pipe 46C here, but electrical equipment other than the memory can be cooled by the pipe 46C. For example, the chip set controlled by the CPU 36, the element for performing the graphic control, and the like can be cooled by the piping 46C.

Referring to Fig. 6, the operation of the computer 10 will be described focusing on the cooling action of the CPU 36. Here, the microcomputer 59 controls the rotation of the compressor 41 and the blowing fan 45 based on the temperature information of the CPU 36. Thereby, when the temperature of CPU36 is low temperature and high temperature, the rotation speed of the blowing fan 45 and the compressor 41 is changed.

Specifically, as described above, the heat generated from the functional element accompanying the heat generation such as the CPU 36 is received by the refrigerant via the evaporator 44 of the cooling device 40. In the cooling device 40, the refrigerant circulates while repeating expansion and compression between the evaporator 44, the compressor 41, the condenser 42, and the capillary tube 43. In addition, the blower fan 45 blows air out of the condenser 42, thereby releasing heat of the refrigerant to the outside. In addition, the motor built in the compressor 41 is controlled by the inverter 61.

By the structure of this aspect mentioned above, the temperature of CPU36 can be made into fixed or less (for example, 70 degrees C or less). However, the heat generation amount of the CPU 36 is not constant. In other words, the heat generation amount increases when the CPU 36 actively operates, and the heat generation amount decreases when the CPU 36 does not actively operate. For this reason, when the rotation speed of the motor and sending fan 45 which the compressor 41 has is delayed, when the heat generation amount of CPU 36 temporarily increases, the cooling capacity of the cooling device 40 will become inadequate, and the CPU 36 There is a fear that the temperature of is raised. In order to prevent this phenomenon, if the rotational speeds of the motor and blower fan 45 included in the compressor 41 are always high, the temperature rise of the CPU 36 can be suppressed, but the cooling device 40 There is a fear that the power consumption will increase.

Therefore, in this embodiment, the rotation speed of the motor and the blowing fan 45 which the compressor 41 has is controlled according to the temperature of CPU36. In other words, as the temperature of the CPU 36 increases, these rotation speeds are increased. By doing in this way, the temperature of CPU36 can be made into 50 to 70 degreeC, for example. The details are as follows.

The temperature of the CPU 36 is monitored by a sensor unit (monitoring means) built in the CPU 36 itself, and temperature information indicating the temperature of the CPU 36 is transferred to the microcomputer 59 (control means). The microcomputer 59 controls the rotation speed of the inverter 16 and the blowing fan 45.

For example, as described above, when the temperature of the CPU 36 is to be set between 50 ° C and 70 ° C, the rotation speeds of the inverter 61 and the blower fan 45 are controlled by the microcomputer 59 as follows. I'm in control.

When the temperature of the CPU 36 is less than 55 ° C. (first temperature), the rotation speeds of the inverter 61 and the blowing fan 45 are kept constant based on the instructions of the microcomputer 59. The rotation speed at this time is the rotation speed which the operation sound which generate | occur | produces, for example from the blowing fan 45 and the compressor 41 can operate in the range of a quiet sound.

When the temperature of the CPU 36 is 55 ° C to 65 ° C, the rotation speed of the inverter 61 and the blower fan 45 is increased in proportion to the increase in the temperature of the CPU 36. Thereby, between 55 degreeC and 65 degreeC, the cooling capacity of the cooling apparatus 40 is adjusted according to the temperature change of CPU36. Therefore, as described above, the temperature of the CPU 36 can be controlled to 50 ° C to 70 ° C.

When the temperature of the CPU 36 is equal to or higher than 65 ° C. (second temperature), the rotation speeds of the inverter 61 and the blowing fan 45 are kept constant. That is, the motor provided by the compressor 41 and the blowing fan 45 is rotated at the maximum rotational speed. As a result, the temperature rise of the CPU 36 can be suppressed.

The above is the description of the operation of the computer 10 that cools the CPU 36.

According to the cooling apparatus of the electronic device of this invention, the cooling apparatus using a refrigeration cycle can be miniaturized. Specifically, the condenser and the compressor constituting the cooling device are relatively large parts. Therefore, by arrange | positioning the longitudinal direction of such a large sized condenser and a compressor in L shape, the whole cooling apparatus can be made small.

According to the present invention, the liquid refrigerant is stored in the evaporator or the inside of the pipe by arranging the pipe connected to the evaporator above the evaporator. Therefore, even when the cooling device is not operating, heat generated from a heating element such as a CPU can be absorbed by the liquid refrigerant stored in the evaporator and / or the pipe.

Moreover, according to this invention, the extraction | extraction part which coolant is taken out from the rotary compressor arrange | positioned by the horizontal arrangement was provided above the center of the rotating shaft of a rotary compressor. Therefore, the lubricating oil used in the inside of a rotary compressor can be suppressed from mixing in the refrigerant taken out.

According to the electronic device of the present invention, by storing a cooling device using a refrigeration cycle in a housing, the CPU can be sufficiently cooled even when a CPU with a large amount of heat is stored in an electronic device such as a notebook computer.

Moreover, according to the electronic device of this invention, the longitudinal direction of the condenser and compressor of a cooling apparatus is arrange | positioned substantially parallel to the side surface of a housing part. Therefore, the condenser and the compressor, which are relatively large components, can be compactly accommodated, so that the space occupied by the cooling device in the housing can be reduced.

In addition, according to the electronic device of the present invention, the cooling capacity of the cooling device can be controlled according to the temperature change of the functional element incorporated in the housing part. Therefore, the functional element can be cooled without excess and deficiency, so that power related to cooling of the functional element can be saved, and the functional element can be sufficiently cooled.

Claims (24)

Compression means for compressing the refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside to liquefy, expansion means for expanding the refrigerant liquefied by the condensation means, and heat from the semiconductor element. And evaporating means for evaporating the refrigerant expanded by the expansion means and blowing means, The compression means and the condensation means are arranged in different positions in a plane; The longitudinal direction of the said condensation means and the longitudinal direction of the said compression means are arrange | positioned in L shape, The cooling apparatus of the electronic device characterized by the above-mentioned. The cooling device according to claim 1, wherein the blower means blows the air to the condensation means and the compression means. The cooling device of an electronic device as set forth in claim 1, wherein said compression means is a rotary compressor. The method of claim 1, wherein the compression means has an introduction portion through which the refrigerant is introduced from the evaporation means, and a derivation portion through which the refrigerant is led out to the condensation means, And the lead-out portion is disposed closer to the condensing means than the inlet portion. Compression means for compressing the refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside to liquefy, expansion means for expanding the refrigerant liquefied by the condensation means, and heat from the semiconductor element. And evaporating means for evaporating the refrigerant expanded by the expansion means and blowing means, The compression means, the condensation means and the blowing means are arranged at different positions in a plane; And said compressing means and said condensing means are arranged near said blowing means. 6. The cooling device according to claim 5, wherein the blowing means blows the condensing means and the compressing means. 6. The cooling device of an electronic device as set forth in claim 5, wherein said compression means is a rotary compressor. The method of claim 5, wherein the compression means has an introduction portion through which the refrigerant is introduced from the evaporation means, and a lead-out portion through which the refrigerant is led out to the condensation means, And the lead-out portion is disposed closer to the condensing means than the inlet portion. The cooling apparatus of the electronic device of Claim 5 WHEREIN: The longitudinal direction of the said condensation means, and the longitudinal direction of the said compression means are arrange | positioned in L shape. Compression means for compressing the refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside to liquefy, expansion means for expanding the refrigerant liquefied by the condensation means, and heat from the semiconductor element. Evaporation means for receiving the water and evaporating the refrigerant expanded by the expansion means, At least a part of piping connected to the said evaporation means is located above the said evaporation means, The cooling apparatus of the electronic device characterized by the above-mentioned. The cooling device according to claim 10, wherein the pipe is a pipe connecting the compression means and the evaporation means and / or a pipe connecting the evaporation means and the expansion means. The liquid refrigerant according to claim 10, wherein when the compression means stops, liquid refrigerant remains inside the evaporation means and / or the pipe, And the heat from the semiconductor element is taken in by the evaporation means by using the remaining liquid refrigerant. Compression means for compressing the refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside to liquefy, expansion means for expanding the refrigerant liquefied by the condensation means, and heat from the semiconductor element. Evaporation means for receiving the water and evaporating the refrigerant expanded by the expansion means, The compression means, the condensation means and the evaporation means are arranged at different positions on one plane, The compression means consists of a rotary compressor transversely disposed with respect to the one plane, The rotary compressor has an introduction portion through which the refrigerant is introduced, and an extraction portion through which the refrigerant is derived. And the lead-out unit is provided above the center of the rotary shaft of the rotary compressor. Compression means for compressing the refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside to liquefy, expansion means for expanding the refrigerant liquefied by the condensation means, and heat from the semiconductor element. Evaporation means for receiving the water and evaporating the refrigerant expanded by the expansion means, The compression means, the condensation means and the evaporation means are arranged at different positions on one plane, The compression means consists of a rotary compressor transversely disposed with respect to the one plane, The rotary compressor has an introduction portion through which the refrigerant is introduced, and an extraction portion through which the refrigerant is derived. And the introduction portion is provided below the center of the rotary shaft of the rotary compressor. An electronic device having a housing portion in which a functional element operating with heat generation is accommodated, An electronic device characterized in that a cooling device for cooling the functional element using a refrigeration cycle is built in the housing part. The method of claim 15, wherein the cooling device blows outside air from the bottom surface of the housing portion, And the air that absorbs heat generated from the functional element is discharged from the rear side and / or the side of the housing portion. An electronic device having a housing portion in which a functional element operating with heat generation is accommodated, The housing portion includes compression means for compressing a refrigerant, condensation means for releasing and liquefying heat from the refrigerant compressed by the compression means to the outside of the housing portion, and expansion for expanding the refrigerant liquefied by the condensation means. A cooling device comprising means, evaporation means for receiving heat from the functional element and evaporating the refrigerant expanded by the expansion means, and blowing means; The longitudinal direction of the condensation means and the compression means is disposed substantially parallel to the side of the housing portion. 18. The apparatus of claim 17, wherein the condensing means is disposed near the rear of the housing portion, and the longitudinal direction thereof is disposed substantially parallel to the side surface of the housing portion. And said compressing means is arranged near the left side or the right side of the housing portion, and its longitudinal direction is disposed substantially parallel to the side surface of the housing portion. 18. The method of claim 17, wherein the condensing means is disposed near the left side or the right side of the housing portion, and the longitudinal direction thereof is disposed substantially parallel to the side surface of the housing portion, And said compression means is arranged near the rear of said housing portion, and its longitudinal direction is disposed substantially parallel to the side surface of said housing portion. The method of claim 17, wherein the blowing means blows outside air from the bottom surface of the housing portion, The air passing through the condensation means is discharged to the outside from the rear of the housing portion. The method of claim 17, wherein the blowing means blows outside air from the bottom surface of the housing portion, The air passing through the compression means is discharged to the outside from the left side or the right side of the housing portion. An electronic device having a housing portion in which a functional element operating with heat generation is accommodated, The housing portion includes compression means for compressing a refrigerant, condensation means for releasing heat from the refrigerant compressed by the compression means to the outside of the housing portion to liquefy, and expansion for expanding the refrigerant liquefied by the condensation means. A cooling device comprising means, evaporation means for receiving heat from the functional element and evaporating the refrigerant expanded by the expansion means, and blowing means; Monitoring means for monitoring the temperature of the functional element; And control means for controlling the cooling capability of the cooling device based on the output of the monitoring means. 23. The apparatus of claim 22, wherein the control means is based on the output of the monitoring means, And the rotational speed of the motor and / or the blowing means provided in the compression means. 23. The apparatus according to claim 22, wherein said control means increases the rotational speed of said motor and / or said blowing means based on an output of said monitoring means indicating that the temperature of said functional element is higher than said first temperature, The rotation speed of the said motor and / or the said blowing means is made constant based on the output of the said monitoring means which shows that the temperature of the said functional element is higher than a 2nd temperature.

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