JP2008057425A - Fluid machine and heat pump device - Google Patents

Fluid machine and heat pump device Download PDF

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Publication number
JP2008057425A
JP2008057425A JP2006235179A JP2006235179A JP2008057425A JP 2008057425 A JP2008057425 A JP 2008057425A JP 2006235179 A JP2006235179 A JP 2006235179A JP 2006235179 A JP2006235179 A JP 2006235179A JP 2008057425 A JP2008057425 A JP 2008057425A
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Japan
Prior art keywords
casing
gap semiconductor
wide gap
sic
refrigerant
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JP2006235179A
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Japanese (ja)
Inventor
Yoshinari Asano
Koichi Harada
Mitsuhiro Tanaka
Jiyunichi Teraki
浩一 原田
潤一 寺木
能成 浅野
三博 田中
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Daikin Ind Ltd
ダイキン工業株式会社
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Priority to JP2006235179A priority Critical patent/JP2008057425A/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C23/00Combinations of two or more pumps, each being of rotary-piston or oscillating-piston type, specially adapted for elastic fluids; Pumping installations specially adapted for elastic fluids; Multi-stage pumps specially adapted for elastic fluids
    • F04C23/008Hermetic pumps
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C29/00Component parts, details or accessories of pumps or pumping installations, not provided for in groups F04C18/00 - F04C28/00
    • F04C29/04Heating; Cooling; Heat insulation
    • F04C29/047Cooling of electronic devices installed inside the pump housing, e.g. inverters
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04CROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; ROTARY-PISTON, OR OSCILLATING-PISTON, POSITIVE-DISPLACEMENT PUMPS
    • F04C2240/00Components
    • F04C2240/80Other components
    • F04C2240/808Electronic circuits (e.g. inverters) installed inside the machine

Abstract

In a fluid machine in which a drive motor is driven and controlled by an inverter device, elements provided in the inverter device are prevented from being damaged by heat.
A casing (30) of a compressor (20) is filled with a high-pressure refrigerant discharged from a compression mechanism (50), and an SiC element (62) of an inverter device (60) is disposed in the casing (30). .
[Selection] Figure 2

Description

  The present invention relates to a compression mechanism that compresses a refrigerant, a fluid machine having the compression mechanism and a drive motor, and a heat pump device including the fluid machine.

  Conventionally, a compressor that compresses a refrigerant by a compression mechanism is known as a fluid machine connected to a refrigerant circuit such as a heat pump device. For example, Patent Document 1 discloses a rotary compressor as this type of compressor.

  The rotary compressor disclosed in Patent Document 1 includes a double-structure casing, and a compression mechanism and a drive motor are accommodated in the inner casing. The compression mechanism is a so-called rotary type compression mechanism, and is connected to a drive motor via a drive shaft. Further, the rotary compressor is provided with an inverter device for controlling the rotational speed of the drive motor. That is, this rotary compressor is composed of an inverter compressor having a variable capacity.

  By the way, at the time of drive control of the drive motor by the inverter device, electromagnetic wave noise due to high frequency magnetic flux is generated from the inverter device. For this reason, as a countermeasure against the electromagnetic wave noise of the inverter device, it is necessary to store the inverter device in a dedicated case or the like and provide a shield. However, if a case for the inverter device is separately provided, the installation space is increased.

Therefore, in the rotary compressor disclosed in Patent Document 1, the inverter device is housed in an outer casing. As a result, in this rotary compressor, the inverter device can be protected against electromagnetic wave noise while being compactly housed in the casing.
JP 2004-232523 A

  By the way, general elements (for example, silicon elements) such as switching elements provided in the inverter device have a relatively low heat-resistant temperature and are easily damaged by heat. On the other hand, in the rotary compressor disclosed in Patent Document 1, the refrigerant of the refrigerant circuit is introduced into the space in which the inverter device is accommodated. For this reason, when the temperature of the refrigerant | coolant around an inverter apparatus becomes high according to the driving | running conditions of the refrigerating cycle etc. which are performed with a refrigerant circuit, there exists a possibility that the above elements may be damaged by heat.

  The present invention has been made in view of such a point, and an object thereof is to prevent an element provided in the inverter device from being damaged by heat in a fluid machine that drives and controls the drive motor by the inverter device. It is.

  The first invention accommodates a compression mechanism (50) for compressing refrigerant, a drive motor (40) for driving the compression mechanism (50), the compression mechanism (50) and the drive motor (40). A fluid machine including a casing (30) filled with a refrigerant and an inverter device (60) for driving and controlling the drive motor (40) is assumed. The inverter device (60) of the fluid machine is provided with a wide gap semiconductor element (62), and the wide gap semiconductor element (62) is disposed in the casing (30). Is.

  The “wide gap semiconductor element” is a semiconductor element having a relatively large band gap, represented by silicon carbide (SiC) element, gallium nitride (GaN), diamond element, etc., and has excellent heat resistance. Have

  In the first invention, the compression mechanism (50) and the drive motor (40) are provided in the casing (30). The drive motor (40) drives the compression mechanism (50) via the drive shaft. As a result, the compression mechanism (50) performs the refrigerant compression operation. Further, the rotational speed of the drive motor (40) is variable by frequency control by the inverter device (60).

  In the present invention, the wide gap semiconductor element (62) is provided in the inverter device (60), and the wide gap semiconductor element (62) is disposed in the casing (30). The wide gap semiconductor element (62) is excellent in heat resistance as compared with a general element (for example, Si element). For this reason, even if the refrigerant | coolant temperature around a wide gap semiconductor element (62) becomes comparatively high, it can avoid reliably that this wide gap semiconductor element (62) is damaged with a heat | fever.

  Moreover, since the wide gap semiconductor element (62) has a high heat-resistant temperature, its operating temperature is also relatively high. For this reason, the surface temperature of the wide gap semiconductor element (62) becomes higher than the temperature of the refrigerant. Therefore, the heat generated from the wide gap semiconductor element (62) is released to the refrigerant. As a result, in the present invention, the wide gap semiconductor element (62) is cooled by the refrigerant.

  Further, in the present invention, the wide gap semiconductor element (62) is disposed in the casing (30), so that the electromagnetic wave noise generated from the wide gap semiconductor element (62) is shielded by the casing (30).

  According to a second invention, in the fluid machine according to the first invention, the compression mechanism (50) is configured to discharge a high-pressure refrigerant into the casing (30). A discharge pipe (35) through which high-pressure refrigerant flows out of the casing (30) is connected.

  In the second invention, the high-pressure refrigerant compressed by the compression mechanism (50) is discharged into the casing (30). The high-pressure refrigerant in the casing (30) is sent to the outside of the casing (30) through the discharge pipe (35). That is, the fluid machine of the present invention is a so-called high-pressure dome type in which the inside of the casing (30) is filled with the high-pressure refrigerant. On the other hand, the wide gap semiconductor element (62) is exposed to the high-pressure refrigerant atmosphere in the casing (30). However, since the wide gap semiconductor element (62) is excellent in heat resistance, it is not damaged by heat even if the surroundings are in a high-pressure refrigerant atmosphere. In addition, since the wide gap semiconductor element (62) has a high heat-resistant temperature and a high operating temperature, the surface temperature of the wide gap semiconductor element (62) is higher than the temperature of the high-pressure refrigerant. Accordingly, the heat generated from the wide gap semiconductor element (62) is released to the high-pressure refrigerant, whereby the wide gap semiconductor element (62) is cooled.

  Furthermore, in the present invention, for example, the compression efficiency of the compression mechanism (50) is improved compared to the case where the inside of the casing (30) is filled with the suction refrigerant (low-pressure refrigerant) of the compression mechanism (50). This is because when the periphery of the wide gap semiconductor element (62) is in a low-pressure refrigerant atmosphere, the heat generated from the wide gap semiconductor element (62) is released to the low-pressure refrigerant, so that the refrigerant temperature sucked into the compression mechanism (50) Because it will rise. On the other hand, in the present invention, the wide gap semiconductor element (62) is cooled by the refrigerant discharged from the compression mechanism (50). For this reason, in the present invention, the refrigerant temperature sucked into the compression mechanism (50) does not rise, and the compression mechanism (50) can obtain a desired compression efficiency.

  According to a third invention, in the fluid machine according to the second invention, the inverter device (60) is provided with a low heat resistant element (63) having a heat resistant temperature lower than that of the wide gap semiconductor element (62). The heat resistant element (63) is arranged outside the casing (30).

  In the inverter device (60) of the third invention, the low heat resistant element (63) having a heat resistant temperature lower than that of the wide gap semiconductor element (62) is disposed outside the casing (30). Examples of the low heat resistance element (63) include Si elements used for drivers and the like, electronic parts such as capacitors, resistors, and diodes. In the present invention, by arranging the low heat resistant element (63) outside the casing (30), the ambient temperature of the low heat resistant element (63) is lower than the high pressure refrigerant atmosphere. As a result, the low heat resistance element (63) having a lower heat resistance temperature than the wide gap semiconductor element (62) can be reliably prevented from being damaged by heat.

  According to a fourth invention, in the fluid machine of the third invention, the inverter device (60) has the wide gap semiconductor element (62) disposed on one surface and the low heat resistance element ( 63) on which the wide gap semiconductor element (62) is located inside the casing (30), and the low heat resistance element (63) is the casing (30). ) And is fitted into the casing (30) so as to be located outside.

  In the fourth invention, the wide gap semiconductor element (62) is disposed on one surface of the substrate (61), and the low heat resistance element (63) is disposed on the other surface. That is, the wide gap semiconductor element (62) and the low heat resistance element (63) share one substrate (61). And when this board | substrate (61) is engage | inserted by a casing (30), a wide gap semiconductor element (62) is located in a casing (30), and a low heat resistant element (63) is outside the casing (30). To position.

  According to a fifth aspect of the invention, in the fluid machine of the third aspect of the invention, the fluid machine includes a resin member (65) that covers the low heat resistance element (63).

  In the fifth invention, the low heat resistance element (63) located outside the casing (30) is covered with the resin member (65). As a result, the low heat resistance element (63) is insulated by the resin member (65).

  A sixth invention is characterized in that, in the fluid machine of the first or second invention, a radiating fin (64) is attached to the wide gap semiconductor element (62).

  In the sixth invention, the heat radiation fin (64) is attached to the wide gap semiconductor element (62), so that the amount of heat released from the wide gap semiconductor element (62) to the high-pressure refrigerant is increased. As a result, the cooling effect of the wide gap semiconductor element (62) is also increased.

  A seventh invention is the fluid machine according to the first or second invention, wherein the drive motor (40) includes a stator core portion (42a) fixed to an inner wall of the casing (30), and the stator core portion. (42a) having an insulating portion (42c) formed on the axial end face, and the wide gap semiconductor element (62) is supported by the insulating portion (42c). .

  In the seventh invention, the wide gap semiconductor element (62) is supported by the insulating portion (42c) formed on the axial end surface of the stator core portion (42a).

  In the present invention, the insulating part (42c) of the drive motor (40) is used as the substrate of the wide gap semiconductor element (62). In addition, heat of the wide gap semiconductor element (62) is transferred to the stator core part (42a) through the insulating part (42c), so that the heat dissipation amount of the wide gap semiconductor element (62) is increased.

  An eighth invention is characterized in that, in the fluid machine of the second invention, the wide gap semiconductor element (62) is disposed between the compression mechanism (50) and the discharge pipe (35). To do.

  In the eighth invention, the wide gap semiconductor element (62) is disposed in the space between the compression mechanism (50) and the discharge pipe (35). Here, the high-pressure refrigerant discharged from the compression mechanism (50) surely flows into the space between the compression mechanism (50) and the discharge pipe (35). For this reason, by disposing the wide gap semiconductor element (62) in this space, the high-pressure refrigerant sequentially flows around the wide gap semiconductor element (62). Further increases heat dissipation.

  According to a ninth invention, in the fluid machine according to any one of the first to eighth inventions, the wide gap semiconductor element is a SiC element (62).

  In the ninth invention, a SiC element (62) having excellent heat resistance is used as the wide gap semiconductor element.

  The tenth invention is premised on a heat pump device including a refrigerant circuit (10) in which a refrigerant circulates and performs a refrigeration cycle. The heat pump device is characterized in that the fluid machine (20) of any one of the first to ninth inventions is connected to the refrigerant circuit (10).

  In the tenth invention, any one of the first to ninth fluid machines (20) is connected to the refrigerant circuit (10) to constitute a heat pump device used for indoor heating, hot water supply or the like.

  According to the present invention, the wide gap semiconductor element (62) is provided in the inverter device (60), and the wide gap semiconductor element (62) is disposed in the casing (30) filled with the refrigerant. Here, since the wide gap semiconductor element (62) is superior in heat resistance as compared with a general element, the wide gap semiconductor element (62) can be used even when the refrigerant temperature in the casing (30) is relatively high. Can be reliably prevented from being damaged by heat.

  Further, since the wide gap semiconductor element (62) has a relatively high operating temperature, the wide gap semiconductor element (62) can be cooled by the refrigerant in the casing (30).

  Furthermore, by disposing the wide gap semiconductor element (62) in the casing (30), electromagnetic noise generated from the wide gap semiconductor element (62) can be shielded by the casing (30), and further, the wide gap semiconductor element. (62) can be stored compactly in the casing (30). Further, by disposing the wide gap semiconductor element (62) in the casing (30) as described above, the wide gap semiconductor element (62) can be insulated from the outside of the casing (30), and further, the surface temperature is relatively high. It is possible to reliably prevent the wide gap semiconductor element (62) from touching human hands.

  In particular, in the second invention, the casing (30) is filled with a high-pressure refrigerant, and the periphery of the wide gap semiconductor element (62) is a high-pressure refrigerant atmosphere. Thus, even if the inside of the casing (30) is a high pressure refrigerant, the heat resistance temperature of the wide gap semiconductor element (62) is higher than the high pressure refrigerant temperature, so that the wide gap semiconductor element (62) is not damaged by heat, and Can cool the wide gap semiconductor element (62) using a high-pressure refrigerant.

  Further, when the wide gap semiconductor element (62) is cooled by the suction refrigerant of the compression mechanism (50), the compression efficiency of the compression mechanism (50) may be reduced, whereas in the present invention, the compression mechanism (50 The wide gap semiconductor element (62) is cooled with the discharged refrigerant. Therefore, according to the present invention, the wide gap semiconductor element (62) can be cooled without reducing the compression efficiency of the compression mechanism (50).

  Furthermore, in the present invention, the heat released from the wide gap semiconductor element (62) is applied to the high-pressure refrigerant. For this reason, according to this invention, indoor heating capability and hot water supply capability can be improved by utilizing the refrigerant | coolant discharged from the fluid machine (20) for indoor heating, hot water supply, etc.

  In the third aspect of the invention, the low heat resistant element (63) having a heat resistant temperature lower than that of the wide gap semiconductor element (62) is arranged outside the casing (30). For this reason, even when the heat-resistant temperature of the low heat-resistant element (63) is lower than the temperature of the high-pressure refrigerant, damage to the low heat-resistant element (63) due to heat can be reliably avoided. As a result, the reliability of the inverter device (60) can be improved.

  In the fourth invention, the wide gap semiconductor element (62) is disposed on one surface of the substrate (61), the low heat resistance element (63) is disposed on the other surface, and the wide gap semiconductor element (62) is provided. The substrate (61) is fitted into the casing (30) so that the low heat resistance element (63) is positioned outside the casing (30) inside the casing (30). For this reason, it is possible to share the substrate (61) of the wide gap semiconductor element (62) and the low heat resistance element (63). Also, with such a configuration, heat generated from the wide gap semiconductor element (62) can be released to the outside of the casing (30) through the substrate (61), and the surface of the wide gap semiconductor element (62) The temperature can be further reduced.

  In the fifth invention, the low heat resistance element (63) disposed outside the casing (30) is covered with the resin member (65). For this reason, according to the present invention, the low heat resistance element (63) can be insulated by the resin member (65), and further, the generated low heat resistance element (63) can be touched by human hands. It can be surely prevented.

  According to the sixth aspect of the invention, since the heat dissipating fin (64) is attached to the wide gap semiconductor element (62), the amount of heat dissipated from the wide gap semiconductor element (62) to the high-pressure refrigerant increases, and the wide gap semiconductor element (62) can be cooled more effectively.

  In the seventh aspect of the invention, the wide gap semiconductor element (62) is supported by the insulating portion (42c) of the drive motor (40). For this reason, according to this invention, the insulation part (42c) of a drive motor (40) can be utilized as a board | substrate of a wide gap semiconductor element (62). Moreover, the cooling effect of the wide gap semiconductor element (62) can be further enhanced by releasing the heat generated from the wide gap semiconductor element (62) to the high-pressure refrigerant through the stator core portion (42a). Furthermore, the distance from the coil part of the drive motor (40) to the wide gap semiconductor element (62) can be shortened by attaching the wide gap semiconductor element (62) to the insulating part (42c). That is, according to the present invention, the wiring length between the wide gap semiconductor element (62) and the coil portion can be shortened.

  According to the eighth aspect of the invention, since the wide gap semiconductor element (62) is disposed between the compression mechanism (50) and the discharge pipe (35), the wide gap semiconductor element (62) is changed to a high-pressure refrigerant. Heat dissipation can be promoted, and the cooling effect of the wide gap semiconductor element (62) can be enhanced.

  According to the ninth aspect, since the SiC element (62) is used as the wide gap semiconductor element, the heat resistance of the wide gap semiconductor element can be sufficiently secured.

  According to the tenth aspect of the invention, the first to ninth fluid machines (20) are applied to the heat pump device. For this reason, according to this invention, the heat pump apparatus which has a fluid machine (20) with high reliability can be provided.

  In particular, the heat generated from the wide gap semiconductor element (62) can be applied to the refrigerant discharged from the compression mechanism (50) by filling the casing (30) with a high-pressure refrigerant as in the second invention. For this reason, the heat generated from the wide gap semiconductor element (62) can be used for indoor heating and hot water supply, and the energy saving performance of the heat pump device can be improved.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Embodiment 1
The heat pump device according to Embodiment 1 of the present invention constitutes an air conditioner (1) that switches between indoor cooling and heating. As shown in FIG. 1, the air conditioner (1) includes a refrigerant circuit (10). The refrigerant circuit (10) is filled with a chlorofluorocarbon refrigerant as a refrigerant. In the refrigerant circuit (10), a refrigerant is circulated to perform a vapor compression refrigeration cycle.

<Configuration of refrigerant circuit>
The refrigerant circuit (10) is connected to a compressor (20), an indoor heat exchanger (21), an expansion valve (22), an outdoor heat exchanger (23), and a four-way switching valve (24). The compressor (20) of Embodiment 1 is a rotary type compressor and constitutes a fluid machine of the present invention. Details of the compressor (20) will be described later. The indoor heat exchanger (21) is installed indoors. In the indoor heat exchanger (21), heat is exchanged between the refrigerant and the room air. The outdoor heat exchanger (23) is installed outdoors. In the outdoor heat exchanger (23), heat is exchanged between the refrigerant and the outdoor air. The expansion valve (22) is a pressure reducing means for reducing the pressure of the refrigerant, and is constituted by, for example, an electronic expansion valve. The four-way selector valve (24) has four ports from first to fourth. The four-way switching valve (24) has a first port on the discharge side of the compressor (20), a second port on the indoor heat exchanger (21), a third port on the suction side of the compressor (20), The fourth port is connected to the outdoor heat exchanger (23). The four-way switching valve (24) includes a state in which the first port and the second port are connected and at the same time the third port and the fourth port are connected (indicated by a solid line in FIG. 1), the first port and the fourth port. At the same time that the second port and the third port are connected to each other (the state indicated by the broken line in FIG. 1).

<Compressor configuration>
As shown in FIG. 2, the compressor (20) includes a hollow and sealed casing (30). The casing (30) includes a cylindrical barrel (31), a top plate (32) provided at the upper end of the barrel (31), and a bottom plate (33) provided at the lower end of the barrel (31). ). In the casing (30), the suction pipe (34) is connected to the lower side of the body part (31), and the discharge pipe (35) is connected to the top plate part (32). The discharge pipe (35) penetrates the top plate part (32) up and down, and the lower end thereof opens into the internal space of the casing (30). The casing (30) is made of a metal material such as iron.

  A drive motor (40), a drive shaft (45), and a compression mechanism (50) are accommodated in the casing (30).

  The drive motor (40) is arranged in a space near the upper part in the casing (30). The drive motor (40) includes a rotor (41) and a stator (42). The rotor (41) is fixed around the drive shaft (45). The stator (42) is provided on the outer peripheral side of the rotor (41). The stator (42) includes a stator core portion (42a) that is fixed to the inner wall of the body portion (31) of the casing (30), and coil portions that are respectively provided on the upper side and the lower side of the stator core portion (42a). 42b). The stator core portion (42a) is provided with insulators (42c) on both upper and lower end surfaces in the axial direction. The insulator (42c) is made of an insulating material and constitutes an insulating part for insulating the stator core part (42a) and the coil part (42b).

  The drive shaft (45) is formed by extending the axis of the casing (30) in the vertical direction. The drive shaft (45) is formed with an eccentric portion (46) at a lower portion. The eccentric part (46) has a larger diameter than the drive shaft (45) and is eccentric by a predetermined amount from the axis of the drive shaft (45). The drive shaft (45) is provided with an oil pump (47) at its lower end. The oil pump (47) has a structure for pumping up oil accumulated at the bottom of the casing (30) by centrifugal force. The oil pumped up by the oil pump (47) is passed through an oil supply passage (not shown) formed in the drive shaft (45) to the interior of the compression mechanism (50), the bearing of the drive shaft (45), etc. Supplied to the sliding part.

  The compression mechanism (50) is arranged in a space near the lower part in the casing (30). The compression mechanism (50) includes a cylinder (51), a front head (52), a rear head (53), and a piston (54).

  The cylinder (51) is formed in an annular shape, and its outer peripheral surface is fixed to the inner wall of the casing (30). A cylindrical cylinder chamber (55) is formed inside the cylinder (51). The cylinder (51) is formed with a suction passage (51a) extending in the radial direction. The suction passage (51a) connects the cylinder chamber (55) and the suction pipe (34).

  The front head (52) is attached to the upper side of the cylinder (51), and the rear head (53) is attached to the lower side of the cylinder (51). The front head (52) closes the upper end opening of the cylinder chamber (55), and the rear head (53) closes the lower end opening of the cylinder chamber (55). The front head (52) is provided with an upper bearing (56), and the rear head (53) is provided with a lower bearing (57). The drive shaft (45) is rotatably supported by the upper bearing (56) and the lower bearing (57) while penetrating the front head (52) and the rear head (53).

  The front head (52) is formed with a discharge port (52a) that allows communication between the cylinder chamber (55) and the internal space of the casing (30). The discharge port (52a) is provided with a discharge valve (not shown). Furthermore, a muffler muffler (58) is attached to the front head (52) so as to cover the discharge port (52a).

  The piston (54) is disposed in the cylinder chamber (55). The eccentric part (46) is fitted into the piston (54). When the drive shaft (45) rotates, the piston (54) rotates in the cylinder chamber (55) while being eccentric from the axis of the drive shaft (45). As a result, in the compression mechanism (50), the volume of the compression chamber formed in the cylinder chamber (55) is changed, and the refrigerant is compressed.

  The compression mechanism (50) is configured to discharge the compressed high-pressure refrigerant into the casing (30) through the discharge port (52a). That is, the compressor (20) of Embodiment 1 constitutes a so-called high-pressure dome type compressor in which the internal space of the casing (30) is filled with the high-pressure refrigerant.

<Inverter circuit configuration>
The compressor (20) includes an inverter device (60) for driving and controlling the drive motor (40). In the inverter device (60), a silicon carbide (SiC) element (62) constituting a switching element, a silicon (Si) element (63) constituting a driver, and the like are mounted as various electronic components. The SiC element (62) constitutes a wide gap semiconductor element having a band gap of about 2.2 to 3.0 eV and a heat resistant temperature of about 400 ° C. On the other hand, the Si element (63) constitutes the low heat resistance element of the present invention having a band gap of about 1.1 eV and a heat resistance temperature of about 120 ° C. That is, the heat resistance temperature of the Si element (63) is lower than that of the SiC element (62).

  As shown in FIG. 2, the inverter device (60) is provided on the upper portion of the casing (30). The inverter device (60) has a substrate (61), and the substrate (61) is fitted in the through hole of the body (31) of the casing (30). One side of the substrate (61) faces the internal space of the casing (30), and the SiC element (62) is placed on this side. In the substrate (61), the other surface faces the external space of the casing (30), and the Si element (63) is placed on this surface. That is, the substrate (61) is attached to the casing (30) such that the SiC element (62) is located inside the casing (30) and the Si element (63) is located outside the casing (30). . In the present embodiment, the SiC element (62) is disposed in the space between the compression mechanism (50) and the discharge pipe (35).

  A radiation fin (64) and a resin cover (65) are attached to the inverter device (60).

  The heat radiation fin (64) includes a plate portion (64a) fixed to the surface of the SiC element (62) and a plurality of pin portions (64b) protruding from the surface of the plate portion (64a). The heat radiation fin (64) constitutes a heat radiation means for promoting heat radiation from the SiC element (62) to the high-pressure refrigerant.

  The resin cover (65) is formed in a box shape with one end opened. And the resin cover (65) is attached to the trunk | drum (31) of a casing (30) so that Si element (63) may be accommodated in the inside. That is, the resin cover (65) constitutes a resin member for insulating the Si element (63) by covering the Si element (63) from the outside.

-Driving action-
Next, the operation of the air conditioner (1) will be described. The air conditioner (1) can perform a cooling operation and a heating operation. In these operations, the drive motor (40) of the compressor (20) is driven by the inverter device (60), whereby the drive shaft (45) rotates. As a result, in the compression mechanism (50), the volume of the compression chamber is expanded and contracted with the rotation of the piston (54), and the compression operation of the refrigerant is performed in the compression mechanism (50).

<Heating operation>
In the heating operation, the four-way switching valve (24) is in the state indicated by the solid line in FIG. Further, the opening degree of the expansion valve (22) is appropriately adjusted.

  In the compressor (20) shown in FIG. 2, the refrigerant compressed by the compression mechanism (50) becomes high-pressure refrigerant and flows out from the discharge port (52a) to the internal space of the casing (30). This high-pressure refrigerant flows upward in the casing (30).

  On the other hand, the SiC element (62) and the radiating fin (64) are located in a space near the upper part in the casing (30). The SiC element (62) generates heat with the switching operation. For this reason, the heat generated from the SiC element (62) is applied to the high-pressure refrigerant through the heat radiation fin (64). As a result, the SiC element (62) is cooled, while the high-pressure refrigerant is heated. In the present embodiment, part of the heat generated from the SiC element (62) is transferred to the outside of the casing (30) through the substrate (61). For this reason, the SiC element (62) is further cooled.

  The high-pressure refrigerant that has taken the heat of the SiC element (62) flows out of the casing (30) through the discharge pipe (35). This refrigerant flows through the indoor heat exchanger (21). In the indoor heat exchanger (21), the refrigerant radiates heat to the indoor air. As a result, the room is heated. At this time, in the indoor heat exchanger (21), the heat taken from the SiC element (62) as described above is also released into the room. That is, in this heating operation, the heat recovered from the SiC element (62) is used for indoor heating.

  The refrigerant having radiated heat in the indoor heat exchanger (21) is depressurized when passing through the expansion valve (22) and flows through the outdoor heat exchanger (23). In the outdoor heat exchanger (23), the refrigerant absorbs heat from the outdoor air and evaporates. The refrigerant evaporated in the outdoor heat exchanger (23) is sucked into the compression mechanism (50) of the compressor (20) through the suction pipe (34).

<Cooling operation>
In the cooling operation, the four-way switching valve (24) is in a state indicated by a broken line in FIG. Further, the opening degree of the expansion valve (22) is appropriately adjusted.

In the compressor (20) shown in FIG. 2, the refrigerant compressed by the compression mechanism (50) becomes high-pressure refrigerant and flows out from the discharge port (52a) into the casing (30). This high-pressure refrigerant flows upward in the casing (30). The heat generated from the SiC element (62) is applied to the high-pressure refrigerant through the heat radiation fin (64) as in the heating operation described above. As a result, the SiC element (62) is cooled. Further, part of the heat generated from the SiC element (62) is released to the outside of the casing (30) through the substrate (61).

  The high-pressure refrigerant used for cooling the SiC element (62) flows out of the casing (30) through the discharge pipe (35). This refrigerant flows through the outdoor heat exchanger (23). In the outdoor heat exchanger (23), the refrigerant radiates heat to the outdoor air. At this time, in the outdoor heat exchanger (23), the heat taken from the SiC element (62) as described above is also released to the outside.

  The refrigerant having radiated heat in the outdoor heat exchanger (23) is decompressed when passing through the expansion valve (22) and flows through the indoor heat exchanger (21). In the indoor heat exchanger (21), the refrigerant absorbs heat from the indoor air and evaporates. As a result, the room is cooled. The refrigerant evaporated in the indoor heat exchanger (21) is sucked into the compression mechanism (50) of the compressor (20) through the suction pipe (34).

-Effect of Embodiment 1-
In the first embodiment, the inverter device (60) is provided with the SiC element (62) which is a wide gap semiconductor element, and the SiC element (62) is disposed in the casing (30) filled with the high-pressure refrigerant. . Here, since the SiC element (62) is excellent in heat resistance as compared with, for example, the Si element (63), the SiC element (62) is damaged by heat even if the inside of the casing (30) is in a high-pressure refrigerant atmosphere. Can be avoided. Moreover, since the operating temperature of the SiC element (62) is higher than the temperature of the high-pressure refrigerant, the SiC element (62) can be cooled using the high-pressure refrigerant.

  On the other hand, when the SiC element (62) is arranged in the casing (30) in this way, electromagnetic wave noise emitted from the SiC element (62) can be shielded by the casing (30), and further, the SiC element (62) is shielded from the casing. (30) can be stored compactly. Moreover, by arranging the SiC element (62) in the casing (30) in this way, the SiC element (62) can be insulated from the outside of the casing (30), and further, the SiC element (62 having a relatively high surface temperature) ) Can be reliably prevented from touching human hands.

  In the first embodiment, the heat released from the SiC element (62) is given to the high-pressure refrigerant. For this reason, at the time of the heating operation mentioned above, the heat collect | recovered from the SiC element (62) can be utilized for indoor heating.

  In the first embodiment, the Si element (63) having a lower heat resistance temperature than the SiC element (62) is arranged outside the casing (30). For this reason, the amount of heat applied from the high-pressure refrigerant to the Si element (63) can be kept to a minimum, and the Si element (63) can be reliably prevented from being damaged by heat. As a result, the reliability of the inverter device (60) can be improved.

  In the first embodiment, the SiC element (62) is disposed on one surface of the substrate (61), the Si element (63) is disposed on the other surface, and the SiC element (62) is disposed on the casing (30). The substrate (61) is fitted into the casing (30) so that the Si element (63) is located outside the casing (30). For this reason, the substrate (61) of the SiC element (62) and the Si element (63) can be shared. Further, with such a configuration, heat generated from the SiC element (62) can be released to the outside of the casing (30) through the substrate (61), and the heat dissipation effect of the SiC element (62) is enhanced. Can do.

  Furthermore, in the said Embodiment 1, the Si element (63) arrange | positioned outside the casing (30) is covered with the resin cover (65). For this reason, according to the first embodiment, the Si element (63) can be insulated by the resin cover (65), and further, the heated Si element (63) is surely touched by human hands. Can be prevented.

  Moreover, according to the said Embodiment 1, since the radiation fin (64) is attached to a SiC element (62), the thermal radiation amount from a SiC element (62) to a high pressure refrigerant | coolant increases, and a SiC element (62) is made. Cooling can be performed more effectively. Moreover, the heating capacity of the air conditioner (1) can be improved by the amount of heat applied to the high-pressure refrigerant.

  Furthermore, according to the first embodiment, since the SiC element (62) is arranged between the compression mechanism (50) and the discharge pipe (35), the heat radiation from the SiC element (62) to the high-pressure refrigerant is achieved. Can be further increased. For this reason, while further improving the cooling effect of the SiC element (62), the heating capacity of the air conditioner (1) can be further improved.

-Modification of Embodiment 1-
About the said Embodiment 1, it is good also as a structure like the following modifications.

<Modification 1>
As shown in FIG. 3, you may make it provide the inverter apparatus (60) of the said Embodiment 1 in the top-plate part (32) of a casing (30). Specifically, in the inverter device (60) of the first modification, the substrate (61) is fitted in the through hole of the top plate portion (32) of the casing (30). An SiC element (62) is provided on the lower surface side of the substrate (61), and the SiC element (62) is located in the internal space of the casing (30). Further, an Si element (63) is provided on the upper surface side of the substrate (61), and the Si element (63) is located in an external space of the casing (30). Moreover, the radiation fin (64) and the resin cover (65) are attached to the inverter device (60) as in the above-described embodiment.

  Also in the first modification, the SiC element (62) is made to have a high pressure while preventing the SiC element (62) from being damaged due to heat by making the surroundings of the SiC element (62) excellent in heat resistance into a high-pressure refrigerant atmosphere. It can be cooled with a refrigerant. Moreover, in this modification 1, since the SiC element (62) is arrange | positioned in the discharge pipe (35) vicinity which a high pressure refrigerant | coolant finally flows out, a high pressure refrigerant | coolant is reliably flowed around a SiC element (62). The amount of heat radiation of the SiC element (62) can be increased.

<Modification 2>
As shown in FIG. 4, you may make it arrange | position the SiC element (62) and Si element (63) of the inverter apparatus (60) of embodiment separately. Specifically, in the second modification, the support member (66) is attached to the inner wall of the body (31) of the casing (30). The SiC element (62) is supported on the support member (66) via the first substrate (61a).

  On the other hand, the second substrate (61b) is supported on the outer wall of the body (31) of the casing (30) so as to be adjacent to the first substrate (61a). The Si element (63) is attached to the second substrate (61b). As described above, in Modification 2, the SiC element (62) is located inside the casing (30), and the Si element (63) is located outside the casing (30). The first substrate (61a) and the second substrate (61b) are electrically connected by a wiring (not shown).

  Also in the second modification, the SiC element (62) having excellent heat resistance is surrounded by a high-pressure refrigerant atmosphere, so that the SiC element (62) is prevented from being damaged by heat, and the SiC element (62) is kept at a high pressure. It can be cooled with a refrigerant. In the second modification, the SiC substrate (62) is separated from the first substrate (61a) provided with the SiC device (62) and the second substrate (61b) provided with the Si device (63). It is possible to reliably avoid the heat generated from the transfer to the Si element (63). As a result, in the second modification, it is possible to reliably prevent the Si element (63) having poor heat resistance from being damaged by heat.

  The inverter device (60) of the second modified example is not provided with the heat dissipating fins (64) and the resin cover (65) of the above-described embodiment. Of course, the fin (64) and the resin cover (65) may be provided.

<Modification 3>
As shown in FIG. 5, in the inverter device (60) of the third modification, the SiC element (62) and the Si element (63) are configured separately as in the second modification described above, while the SiC element (62) ) Is supported by the insulator (42c) of the drive motor (40). Specifically, in Modification 3, the SiC element (62) is supported by the upper insulator (42c) among the insulators formed on the upper and lower end surfaces of the stator core portion (42a). On the other hand, the Si element (63) is attached to the outer wall of the body (31) of the casing (30) via the second substrate (61b) in the same manner as in the second modification.

  Also in the third modification example, the SiC element (62) having excellent heat resistance is surrounded by a high-pressure refrigerant atmosphere, so that the SiC element (62) is prevented from being damaged by heat, and the SiC element (62) is kept at a high pressure. It can be cooled with a refrigerant. Also in the third modification, as in the second modification, by separating the SiC element (62) and the Si element (63), the heat generated from the SiC element (62) is transferred to the Si element (63). It is possible to reliably avoid transmission.

  Furthermore, in this modification 3, the insulator (42c) can be used as a substrate for the SiC element (62) by supporting the SiC element (62) on the insulator (42c) which is an insulating portion. Moreover, since the heat generated from the SiC element (62) is transferred to the stator core part (42a) via the insulator (42c), this heat is released to the high-pressure refrigerant flowing around the stator core part (42a). It becomes easy. Therefore, in the third modification, the cooling effect of the SiC element (62) can be further enhanced.

  Moreover, the distance from the coil part (42b) of a drive motor (40) to a SiC element (62) can be shortened by attaching a SiC element (62) to an insulator (42c). That is, in the third modification, the length of the wiring connecting the SiC element (62) and the coil part (42b) can be shortened.

  In the third modification, it is needless to say that the heat dissipating fins (64) and the resin cover (65) may be provided as in the above embodiment.

<Modification 4>
As shown in FIG. 6, in the inverter device (60) of the fourth modification, the SiC element (62) is disposed in the lower space in the casing (30). Specifically, the SiC element (62) is located slightly above the oil level of the oil sump formed at the bottom in the casing (30). The SiC element (62) is provided on the lower surface side of the first substrate (61a), and the radiation fin (64) is attached to the lower part of the SiC element (62) in the same manner as in the above embodiment. Yes. And the pin part (64b) of the radiation fin (64) is immersed in the oil sump. On the other hand, the Si element (63) is attached to the outer wall of the body (31) of the casing (30) via the second substrate (61b) in the same manner as in the second modification.

  In this modified example 4, the SiC element (62) is disposed in the vicinity of the oil reservoir, and the heat generated from the SiC element (62) is transferred to the oil through the radiation fin (64). For this reason, according to the modification 4, the cooling effect of a SiC element (62) can be heightened.

<< Embodiment 2 >>
As shown in FIG. 7, the fluid machine according to the second embodiment of the present invention is configured by a so-called low-pressure dome type scroll compressor. Below, a different point from the said embodiment is demonstrated.

  In the compressor (20), the compression mechanism (50) is disposed near the upper part of the internal space of the casing (30), and the drive motor (40) is disposed near the lower part. In the compression mechanism (50), the fixed scroll (71) is attached to the upper side of the housing (70), and the movable scroll (72) is provided between the housing (70) and the fixed scroll (71). The fixed scroll (71) and the movable scroll (72) are each formed with a spiral wrap, and the wraps of the scrolls (71, 72) mesh with each other. When the drive motor (40) drives the drive shaft (45), in the compression mechanism (50), the movable scroll (72) orbits and the volume of the compression chamber between the scrolls (71, 72) expands or contracts. Then, the refrigerant compression operation is performed. The refrigerant compressed by the compression mechanism (50) flows out of the casing (30) through the discharge port (52a) and the discharge pipe (35).

  In the compressor (20), the suction pipe (34) is connected to the space around the drive motor (40). That is, the space around the drive motor (40) in the casing (30) is filled with the low-pressure refrigerant. The SiC element (62) is supported by the upper end portion of the stator core portion (42d) of the drive motor (40).

  In the second embodiment, the surface temperature of the SiC element (62) can be positively cooled by surrounding the SiC element (62) with a low-pressure refrigerant atmosphere, and the SiC element (62) is reliably damaged by heat. Can be prevented.

<< Other Embodiments >>
About each said embodiment, it is good also as the following structures.

  In each of the above embodiments, the SiC element (62) is used as the wide gap semiconductor element. However, other wide gap semiconductor elements such as a gallium nitride (GaN) element and a diamond element may be used. The wide gap semiconductor element preferably has a band gap of at least 1.2 eV or more, more preferably 2.0 eV or more.

  In each of the above embodiments, the Si element (63) as the low heat resistance element is disposed outside the casing (30). However, the low heat resistance element is not limited to the Si element, and any element may be used as long as the element has a heat resistance temperature lower than that of the wide gap semiconductor element such as a capacitor, a diode, and a resistor.

  In the above embodiment, chlorofluorocarbon is used as the refrigerant filled in the refrigerant circuit (10), but other refrigerants such as carbon dioxide may be used.

  In the first embodiment, for example, the radiating fin (64) shown in FIG. In this case, the heat of the wide gap semiconductor element (62) can be released to the outside of the casing (30) through the wall surface of the casing (30) and the radiation fins (64).

  In each of the above embodiments, the present invention is applied to a rotary type compressor and a scroll type compressor. However, the present invention may be applied to a swing swing type compressor and other types of compressors. Further, the present invention may be applied to a fluid machine constituting a so-called uniaxially connected expansion compressor in which a compression mechanism and an expansion mechanism are connected to each other through a drive shaft in the casing.

  In the above embodiments, the present invention is applied to an air conditioner that switches between indoor cooling and heating. However, the present invention may be applied to a water heater or other heat pump device that heats water while performing a refrigeration cycle in the refrigerant circuit (10).

  In addition, the above embodiment is an essentially preferable illustration, Comprising: It does not intend restrict | limiting the range of this invention, its application thing, or its use.

  As described above, the present invention is useful for a fluid machine having a compression mechanism for compressing a refrigerant, a drive motor for the compression mechanism, and a heat pump apparatus including the fluid machine.

FIG. 3 is a piping system diagram of a refrigerant circuit of the heat pump device according to the first embodiment. 1 is a longitudinal sectional view illustrating a schematic configuration of a fluid machine according to a first embodiment. FIG. 10 is a longitudinal sectional view showing a schematic configuration of a fluid machine according to Modification 1. FIG. 10 is a longitudinal sectional view showing a schematic configuration of a fluid machine according to Modification 2. 10 is a longitudinal sectional view showing a schematic configuration of a fluid machine according to Modification 3. FIG. FIG. 10 is a longitudinal sectional view showing a schematic configuration of a fluid machine according to Modification Example 4. 6 is a longitudinal sectional view showing a schematic configuration of a fluid machine according to Embodiment 2. FIG.

Explanation of symbols

1 Air conditioner (heat pump device)
10 Refrigerant circuit
20 Compressor (fluid machine)
30 casing
35 Discharge pipe
40 Drive motor
42a Stator core
42c Insulator (insulation)
50 Compression mechanism
60 Inverter device
61 substrate
62 SiC devices (wide gap semiconductor devices)
63 Si element (low heat resistance element)
64 Heat dissipation fin
65 Resin cover (resin material)

Claims (10)

  1. The compression mechanism (50) for compressing the refrigerant, the drive motor (40) for driving the compression mechanism (50), the compression mechanism (50) and the drive motor (40) are accommodated, and the refrigerant is filled therein. A fluid machine including a casing (30) and an inverter device (60) for driving and controlling the drive motor (40),
    The inverter device (60) is provided with a wide gap semiconductor element (62),
    The fluid machine according to claim 1, wherein the wide gap semiconductor element (62) is disposed in a casing (30).
  2. In claim 1,
    The compression mechanism (50) is configured to discharge high-pressure refrigerant into the casing (30),
    A fluid machine, wherein a discharge pipe (35) for allowing the high-pressure refrigerant in the casing (30) to flow out of the casing (30) is connected to the casing (30).
  3. In claim 2,
    The inverter device (60) is provided with a low heat resistance element (63) having a lower heat resistance temperature than the wide gap semiconductor element (62),
    The fluid machine, wherein the low heat resistance element (63) is arranged outside the casing (30).
  4. In claim 3,
    The inverter device (60) has a substrate (61) on which the wide gap semiconductor element (62) is disposed on one surface and the low heat resistance element (63) is disposed on the other surface,
    The substrate (61) is placed on the casing (30) such that the wide gap semiconductor element (62) is located inside the casing (30) and the low heat resistance element (63) is located outside the casing (30). A fluid machine characterized by being fitted.
  5. In claim 3,
    A fluid machine comprising a resin member (65) covering the low heat resistance element (63).
  6. In claim 1 or 2,
    A fluid machine, wherein a heat radiating fin (64) is attached to the wide gap semiconductor element (62).
  7. In claim 1 or 2,
    The drive motor (40) includes a stator core portion (42a) fixed to the inner wall of the casing (30), and an insulating portion (42c) formed on the axial end surface of the stator core portion (42a). Have
    The fluid machine according to claim 1, wherein the wide gap semiconductor element (62) is supported by the insulating portion (42c).
  8. In claim 2,
    The fluid machine according to claim 1, wherein the wide gap semiconductor element (62) is disposed between the compression mechanism (50) and the discharge pipe (35).
  9. In any one of Claims 1 thru | or 8,
    The fluid machine according to claim 1, wherein the wide gap semiconductor element is a SiC element (62).
  10. A heat pump device including a refrigerant circuit (10) that performs a refrigeration cycle by circulating refrigerant,
    A heat pump apparatus, wherein the fluid circuit (20) according to any one of claims 1 to 9 is connected to the refrigerant circuit (10).
JP2006235179A 2006-08-31 2006-08-31 Fluid machine and heat pump device Pending JP2008057425A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006235179A JP2008057425A (en) 2006-08-31 2006-08-31 Fluid machine and heat pump device

Publications (1)

Publication Number Publication Date
JP2008057425A true JP2008057425A (en) 2008-03-13

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JP2006235179A Pending JP2008057425A (en) 2006-08-31 2006-08-31 Fluid machine and heat pump device

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Country Link
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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010070927A1 (en) * 2008-12-18 2010-06-24 サンデン株式会社 Electric compressor having drive circuit integrated thereinto
JP2012137243A (en) * 2010-12-27 2012-07-19 Mitsubishi Electric Corp Heat pump apparatus and control method thereof
WO2012107987A1 (en) * 2011-02-07 2012-08-16 三菱電機株式会社 Heat pump device, heat pump system, and control method for three-phase inverter
JP2012247136A (en) * 2011-05-27 2012-12-13 Mitsubishi Electric Corp Booster unit, and air conditioning apparatus combined with water heater including the same
JP2013204935A (en) * 2012-03-28 2013-10-07 Mitsubishi Electric Corp Refrigeration cycle apparatus and outdoor heat source unit
JP2014084779A (en) * 2012-10-23 2014-05-12 Asmo Co Ltd Electric pump
JP2015121196A (en) * 2013-12-25 2015-07-02 株式会社豊田自動織機 Semiconductor device for motor compressor
US9810223B2 (en) 2012-09-20 2017-11-07 Asmo Co., Ltd. Electric pump

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004293445A (en) * 2003-03-27 2004-10-21 Mitsubishi Heavy Ind Ltd Motor-driven compressor
JP2005188420A (en) * 2003-12-26 2005-07-14 Daikin Ind Ltd Compressor
JP2005294116A (en) * 2004-04-01 2005-10-20 Nissan Motor Co Ltd Fuel cell system
JP2006042529A (en) * 2004-07-28 2006-02-09 Mitsubishi Electric Corp Inverter control device of air conditioner

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004293445A (en) * 2003-03-27 2004-10-21 Mitsubishi Heavy Ind Ltd Motor-driven compressor
JP2005188420A (en) * 2003-12-26 2005-07-14 Daikin Ind Ltd Compressor
JP2005294116A (en) * 2004-04-01 2005-10-20 Nissan Motor Co Ltd Fuel cell system
JP2006042529A (en) * 2004-07-28 2006-02-09 Mitsubishi Electric Corp Inverter control device of air conditioner

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010070927A1 (en) * 2008-12-18 2010-06-24 サンデン株式会社 Electric compressor having drive circuit integrated thereinto
JP2010144607A (en) * 2008-12-18 2010-07-01 Sanden Corp Drive circuit integral-type electric compressor
CN102245899A (en) * 2008-12-18 2011-11-16 三电有限公司 Electric compressor having drive circuit integrated thereinto
JP2012137243A (en) * 2010-12-27 2012-07-19 Mitsubishi Electric Corp Heat pump apparatus and control method thereof
WO2012107987A1 (en) * 2011-02-07 2012-08-16 三菱電機株式会社 Heat pump device, heat pump system, and control method for three-phase inverter
JP5693617B2 (en) * 2011-02-07 2015-04-01 三菱電機株式会社 Heat pump device, heat pump system, and control method for three-phase inverter
US9077274B2 (en) 2011-02-07 2015-07-07 Mitsubishi Electric Corporation Heat pump device, heat pump system, and method for controlling three-phase inverter
JP2012247136A (en) * 2011-05-27 2012-12-13 Mitsubishi Electric Corp Booster unit, and air conditioning apparatus combined with water heater including the same
JP2013204935A (en) * 2012-03-28 2013-10-07 Mitsubishi Electric Corp Refrigeration cycle apparatus and outdoor heat source unit
US9810223B2 (en) 2012-09-20 2017-11-07 Asmo Co., Ltd. Electric pump
US10385855B2 (en) 2012-09-20 2019-08-20 Denso Corporation Electric pump
JP2014084779A (en) * 2012-10-23 2014-05-12 Asmo Co Ltd Electric pump
JP2015121196A (en) * 2013-12-25 2015-07-02 株式会社豊田自動織機 Semiconductor device for motor compressor

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