CN114415802A - Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling - Google Patents
Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling Download PDFInfo
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- CN114415802A CN114415802A CN202111397868.6A CN202111397868A CN114415802A CN 114415802 A CN114415802 A CN 114415802A CN 202111397868 A CN202111397868 A CN 202111397868A CN 114415802 A CN114415802 A CN 114415802A
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 68
- 230000008878 coupling Effects 0.000 title claims abstract description 19
- 238000010168 coupling process Methods 0.000 title claims abstract description 19
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 13
- 238000001816 cooling Methods 0.000 claims abstract description 46
- 239000007788 liquid Substances 0.000 claims description 70
- 239000004519 grease Substances 0.000 claims description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 238000004064 recycling Methods 0.000 claims description 2
- 125000004122 cyclic group Chemical group 0.000 claims 2
- 239000012071 phase Substances 0.000 description 21
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000036760 body temperature Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F9/00—Arrangements for program control, e.g. control units
- G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
- G06F9/46—Multiprogramming arrangements
- G06F9/50—Allocation of resources, e.g. of the central processing unit [CPU]
- G06F9/5094—Allocation of resources, e.g. of the central processing unit [CPU] where the allocation takes into account power or heat criteria
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Abstract
A notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling are provided, wherein the heat dissipation system comprises an internal cooling circulation pipeline and an external cooling circulation pipeline, the internal cooling circulation pipeline comprises an internal evaporator and an internal condenser which is in circulation connection with the internal evaporator through an internal connecting pipeline, the external cooling circulation pipeline comprises an external condenser, the external condenser is in circulation connection with the internal evaporator through an external pipeline, the internal evaporator is connected with the external pipeline through an external pipeline connecting piece, and the external cooling circulation pipeline is detachably connected through an external pipeline connecting piece. And in the high load mode, the internal evaporator is connected with the external cooling circulation pipeline through the external pipeline connecting piece. The invention can effectively reduce the frequency reduction probability of the notebook chip under high load, reduce the surface temperature of the notebook keyboard and greatly reduce the noise of the fan.
Description
Technical Field
The invention belongs to the technical field of electronic equipment heat dissipation, and particularly relates to a notebook heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling.
Background
When the notebook is used, a large amount of heat can be generated due to the high-load operation of the display card, the processor and the power supply inductor, and the chip is generally cooled through the built-in heat dissipation module in order to prevent the failure of the electronic device at high temperature.
In the prior art, the heat dissipation of the notebook computer is realized by a built-in heat pipe and a fan, the heat dissipation capability of the mode is limited, and meanwhile, the temperature of the keyboard and the palm support position of the notebook computer is higher than the body temperature of a human body due to the large-area coverage of the heat pipe, so that the use feeling is influenced. Because the conventional built-in heat dissipation uses the centrifugal fan with high rotating speed, when the heat dissipation requirement is higher, the rotating speed of the fan can only be increased, the generated noise is larger, and the experience is poorer. With the continuous improvement of the power of the notebook computer chip, higher requirements are provided for the heat dissipation capability in the future, and the heat dissipation requirements are hardly met by the currently popular heat dissipation mode in the future.
Disclosure of Invention
The present invention is directed to solve the above problems in the prior art, and an object of the present invention is to provide a notebook computer heat dissipation system and method using internal and external heat dissipation cycle coupling, which effectively reduce the frequency reduction probability of a notebook computer chip under high load, reduce the surface temperature of a keyboard of the notebook computer, and greatly reduce the noise of a fan.
In order to achieve the purpose, the invention has the following technical scheme:
the first aspect provides a notebook computer heat dissipation system adopting internal and external two-phase heat dissipation circulation coupling, which comprises an internal cooling circulation pipeline and an external cooling circulation pipeline, wherein the internal cooling circulation pipeline comprises an internal evaporator and an internal condenser in circulation connection with the internal evaporator through an internal connecting pipeline, the external cooling circulation pipeline comprises an external condenser, the external condenser is in circulation connection with the internal evaporator through an external pipeline, the internal evaporator is connected with the external pipeline through an external pipeline connecting piece, and the external cooling circulation pipeline is detachably connected through an external pipeline connecting piece.
As a preferable scheme of the notebook computer heat dissipation system of the present invention, the built-in connection pipeline between the inlet of the built-in evaporator and the outlet of the built-in condenser is a built-in low temperature pipeline, the built-in connection pipeline between the outlet of the built-in evaporator and the inlet of the built-in condenser is a built-in high temperature pipeline, and the built-in low temperature pipeline is provided with a built-in liquid pump.
As a preferable scheme of the notebook computer cooling system, an internal fan is arranged in the internal condenser, an external fan is arranged in the external condenser, and the external fan is an axial fan.
As a preferred scheme of the notebook computer heat dissipation system, the built-in condenser is circularly connected with the micro-channel heat exchanger, the micro-channel heat exchanger is closely contacted with the processor chip, the display card chip and the power supply chip, and the contact surfaces of the micro-channel heat exchanger, the processor chip, the display card chip and the power supply chip are coated with silicone grease.
As a preferred scheme of the notebook computer cooling system, the external pipeline between the inlet of the internal evaporator and the outlet of the external condenser is an external low-temperature pipeline, the external pipeline between the outlet of the internal evaporator and the inlet of the external condenser is an external high-temperature pipeline, the external high-temperature pipeline is provided with an external liquid storage device, an external air pump is arranged between the external liquid storage device and the external condenser, and a second external liquid pump is arranged between the external liquid storage device and the internal evaporator.
As a preferable scheme of the notebook computer heat dissipation system of the present invention, the external low-temperature pipeline is provided with a first external liquid pump.
As a preferable scheme of the notebook computer cooling system of the present invention, the external pipeline connecting pieces at the inlet and the outlet of the internal evaporator are connected to one end of a third external liquid pump through branch pipelines, and the other end of the third external liquid pump is connected to an external high temperature pipeline between the external air pump and the external condenser.
In a second aspect, a heat dissipation method of a notebook computer heat dissipation system using internal and external two-phase heat dissipation cycle coupling is provided, which includes the following steps:
under a low-load mode, the built-in cooling circulation pipeline is independently opened, the liquid working medium is changed into a gas-liquid two-phase state through the built-in evaporator, then enters the built-in condenser through the built-in connecting pipeline, completes heat exchange with the outside, and then enters the built-in evaporator again through the built-in connecting pipeline for recirculation;
under the high load mode, the built-in evaporator is connected with the external cooling circulation pipeline through the external pipeline connecting piece, the liquid working medium absorbs heat through the built-in evaporator to become a gas-liquid two-phase working medium, then the gas working medium enters the external condenser through the external pipeline, the gas working medium is condensed into a liquid state through heat exchange with the environment, and then the gas working medium returns to the built-in evaporator again to circulate again.
As a preferred scheme of the heat dissipation method of the present invention, the liquid working medium absorbs heat through the internal evaporator to become a gas-liquid two-phase working medium, and then enters the external liquid storage device through the second external liquid pump, and the gas working medium enters the external air pump and is pumped into the external condenser through the external high temperature pipeline.
As a preferred scheme of the heat dissipation method, the low load mode is that the operation power consumption is less than or equal to 50W, the high load mode is that the operation power consumption is more than 50W, whether the system is connected with a power supply or not is judged in the high load mode, if not, the current operation power consumption is kept, if so, a user is prompted to be connected with the external cooling circulation pipeline, if the external cooling circulation pipeline is connected, the power consumption is improved, the full load is allowed, and if the external cooling circulation pipeline is not connected, the internal connection pipeline and the internal condenser are started to the maximum state.
Compared with the prior art, the invention has the following beneficial effects:
the built-in cooling circulation pipeline adopts double-phase cooling circulation to solve the heat dissipation of the notebook under the low load, utilizes external pipeline connecting piece to realize being connected of external cooling circulation pipeline and built-in cooling circulation pipeline through notebook rear interface simultaneously, when solving traditional notebook heat dissipation module and using through connecting external double-phase cooling circulation: 1. when the ambient temperature is high, the inlet air temperature is high, so that the cooling capacity of the heat pipe and the heat dissipation fins by the outlet air of the fan is poor under the high load of the notebook computer, the heat generated by the chip cannot be timely led out, the chip is in a high-temperature state, and finally the frequency of the processor and the display card is reduced, even the power supply chip is burnt out. 2. The independent liquid phase heat exchange capacity is limited, and meanwhile, the heat dissipation module is large in size, so that the portability of the notebook computer is reduced. The invention can effectively reduce the frequency reduction probability of the notebook chip under high load, effectively reduce the surface temperature of the notebook keyboard and greatly reduce the noise of the fan.
Drawings
FIG. 1 is a schematic diagram of a notebook computer cooling system using internal and external heat dissipation cycle coupling according to the present invention;
FIG. 2 is a flowchart of a heat dissipation method of the notebook computer heat dissipation system using the internal and external heat dissipation cycle coupling according to the present invention;
in the drawings: 1-built-in fan; 2-a built-in condenser; 3-built-in high-temperature pipeline; 4-built-in evaporator; 5, arranging a low-temperature pipeline inside; 6-built-in liquid pump; 7-built-in connecting pipeline; 8-external pipeline connecting piece; 9-a first external liquid pump; 10-external low-temperature pipeline; 11-external condenser; 12-external fan; 13-external high-temperature pipeline; 14-external air pump; 15-external reservoir; 16-a second external liquid pump; 17-third external liquid pump.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Referring to fig. 1, the notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling according to the embodiment of the present invention includes an internal cooling circulation pipeline and an external cooling circulation pipeline, the internal cooling circulation pipeline includes an internal evaporator 4 and an internal condenser 2 circularly connected with the internal evaporator 4 through an internal connection pipeline 7, wherein the internal connection pipeline 7 between an inlet of the internal evaporator 4 and an outlet of the internal condenser 2 is an internal low temperature pipeline 5, the internal connection pipeline 7 between an outlet of the internal evaporator 4 and an inlet of the internal condenser 2 is an internal high temperature pipeline 3, and an internal liquid pump 6 is disposed on the internal low temperature pipeline 5. The built-in condenser 2 is provided with a built-in fan 1. The external cooling circulation pipeline comprises an external condenser 11, the external condenser 11 is in circulation connection with the internal evaporator 4 through an external pipeline, the internal evaporator 4 is connected with the external pipeline through an external pipeline connecting piece 8, and the external cooling circulation pipeline is detachably connected through the external pipeline connecting piece 8. An external fan 12 is arranged in the external condenser 11, and an axial flow fan is adopted as the external fan 12. The external pipeline between the inlet of the internal evaporator 4 and the outlet of the external condenser 11 is an external low-temperature pipeline 10, and a first external liquid pump 9 is arranged on the external low-temperature pipeline 10. An external pipeline between an outlet of the internal evaporator 4 and an inlet of the external condenser 11 is an external high-temperature pipeline 13, an external liquid storage device 15 is arranged on the external high-temperature pipeline 13, an external air pump 14 is arranged between the external liquid storage device 15 and the external condenser 11, and a second external liquid pump 16 is arranged between the external liquid storage device 15 and the internal evaporator 4. External pipeline connecting pieces 8 on the inlet and the outlet of the internal evaporator 4 are connected to one end of a third external liquid pump 17 through branch pipelines, and the other end of the third external liquid pump 17 is connected to an external high-temperature pipeline 13 between an external air pump 14 and an external condenser 11. The built-in condenser 2 is circularly connected with the micro-channel heat exchanger, the micro-channel heat exchanger is closely contacted with the processor chip, the display card chip and the power supply chip, and the contact surfaces of the micro-channel heat exchanger, the processor chip, the display card chip and the power supply chip are coated with silicone grease with high heat conductivity coefficient.
Referring to fig. 2, a heat dissipation method of a notebook computer heat dissipation system using internal and external two-phase heat dissipation cycle coupling according to an embodiment of the present invention includes the following steps:
under a low load mode, specifically, the low load mode is that the operation power consumption is less than or equal to 50W, namely when the total load of the CPU and the GPU is 50W and lower, a built-in cooling circulation pipeline is independently opened, a liquid working medium is changed into a gas-liquid two-phase state through a built-in evaporator 4, then enters a built-in condenser 2 through a built-in connecting pipeline 7, completes heat exchange with the outside, and then enters the built-in evaporator 4 again through the built-in connecting pipeline 7 for recirculation;
under the high load mode, the specific high load mode is that the operation power consumption is more than 50W, namely when the total load of the CPU and the GPU is more than 50W, the built-in evaporator 4 is connected with the external cooling circulation pipeline through the external pipeline connecting piece 8, the liquid working medium absorbs heat through the built-in evaporator 4 to become a gas-liquid two-phase working medium, then the gas-liquid two-phase working medium enters the external condenser 11 through the external pipeline, and the gas working medium is condensed into a liquid state through heat exchange with the environment and then returns to the built-in evaporator 4 for recycling again.
In one embodiment, after the liquid working medium absorbs heat through the internal evaporator 4 to become a gas-liquid two-phase working medium, the liquid working medium enters the external liquid reservoir 15 through the second external liquid pump 16, and the gas working medium enters the external air pump 14 and is pumped into the external condenser 11 through the external high-temperature pipeline 13. And judging whether the system is connected with a power supply or not in a high-load mode, if not, keeping the current running power consumption, if so, prompting a user to access the external cooling circulation pipeline, if so, improving the power consumption, allowing full load, and if not, starting the built-in liquid pump 6 and the built-in fan 1 to the maximum state.
When the mobile office or notebook computer is in a low load state, the built-in liquid pump 6 can be independently started, the built-in liquid pump 6 is a micro liquid pump, a low-temperature circulating working medium enters the heat exchanger with the micro channel structure through the connecting pipeline under the pushing of the micro liquid pump, wherein the heat exchanger is closely contacted with the processor chip, the display card chip and the power supply chip, and meanwhile, silicone grease with high heat conductivity coefficient is coated on the contact surface of the heat exchanger and the chip. The temperature of the low-temperature working medium rises through the micro-channel heat exchanger which is in close contact with the chip, part of the liquid working medium evaporates and absorbs heat to become gaseous, and the surface temperature of the chip is reduced through boiling enhanced heat exchange, so that the chip is ensured to be at the normal working temperature. The working medium passing through the high-temperature side heat exchanger becomes a two-phase high-temperature working medium, and enters the low-temperature side heat exchanger through the connecting pipeline. The high-temperature two-phase working medium performs forced convection heat exchange with air at the outlet of the fan in the low-temperature side heat exchanger, heat is released to the environment, the temperature of the high-temperature two-phase working medium is reduced, and the gaseous working medium is condensed into a liquid state and participates in the two-phase heat exchange circulation again.
In a high-load mode, the external two-phase heat exchange radiator is connected with the internal two-phase heat exchange radiator through the reserved interface by using the external pipeline connecting piece 8. Working media in the external radiator and the internal radiator can freely flow through the pipeline. The external radiator is provided with a larger circulating pump and a lower-temperature side heat exchanger. Meanwhile, the external radiator fan is an axial flow fan with high wind power and low noise, so that the low-temperature heat exchanger can be effectively cooled, and the noise is reduced.
In the embodiment, when the total load of the CPU and the GPU is 50W and lower, internal heat dissipation circulation is started, when liquid refrigerant flows through heat exchangers at the CPU and the GPU through a circulation pipeline under the pushing of a liquid pump, the CPU and the GPU are at high temperature, and the working medium absorbs heat to cool the CPU and the GPU, and the target is controlled within 80 ℃. The high-temperature working medium flows to the fan side of the heat exchanger through the circulating pipeline, and the air discharged by the fan cools the high-temperature liquid in the heat exchanger and returns to the low-temperature working medium pipeline again to participate in heat dissipation circulation.
When the loads of the CPU and the GPU are high and the power supply and the external circulation heat dissipation system are connected, the internal and external heat dissipation circulation can be started simultaneously, the power consumption of the system is allowed to be increased to 300W, and the notebook can run fully without frequency reduction. When the loads of the CPU and the GPU are high, the external circulation heat dissipation system is connected, the power supply is connected, and the external circulation heat dissipation system is not connected, the rotating speed of a liquid pump and a fan in the internal circulation heat dissipation system is increased to the maximum allowable value, and the heat dissipation power consumption of the system is increased to 150W.
The above-mentioned embodiments are only preferred embodiments of the present invention, and are not intended to limit the technical solution of the present invention, and it should be understood by those skilled in the art that the technical solution can be modified and replaced by a plurality of simple modifications and replacements without departing from the spirit and principle of the present invention, and the modifications and replacements also fall into the protection scope covered by the claims.
Claims (10)
1. A notebook cooling system adopting internal and external two-phase cooling circulation coupling is characterized in that: including built-in cooling circulation pipeline and external cooling circulation pipeline, built-in cooling circulation pipeline includes built-in evaporimeter (4) and through built-in connecting tube (7) and built-in evaporimeter (4) cyclic connection's built-in condenser (2), external cooling circulation pipeline includes external condenser (11), external condenser (11) through external pipeline and built-in evaporimeter (4) cyclic connection, built-in evaporimeter (4) connect external pipeline through external pipeline connecting piece (8), external cooling circulation pipeline passes through external pipeline connecting piece (8) detachable connection.
2. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 1, wherein: the built-in low-temperature condenser is characterized in that a built-in connecting pipeline (7) between an inlet of the built-in evaporator (4) and an outlet of the built-in condenser (2) is a built-in low-temperature pipeline (5), a built-in connecting pipeline (7) between the outlet of the built-in evaporator (4) and the inlet of the built-in condenser (2) is a built-in high-temperature pipeline (3), and a built-in liquid pump (6) is arranged on the built-in low-temperature pipeline (5).
3. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 1, wherein: the condenser is characterized in that an internal fan (1) is arranged in the internal condenser (2), an external fan (12) is arranged in the external condenser (11), and the external fan (12) adopts an axial flow fan.
4. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 1, wherein: the built-in condenser (2) is circularly connected with the micro-channel heat exchanger, the micro-channel heat exchanger is closely contacted with the processor chip, the display card chip and the power supply chip, and the contact surfaces of the micro-channel heat exchanger, the processor chip, the display card chip and the power supply chip are coated with silicone grease.
5. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 1, wherein: the external low-temperature pipeline (10) is arranged between an inlet of the internal evaporator (4) and an outlet of the external condenser (11), the external high-temperature pipeline (13) is arranged between the outlet of the internal evaporator (4) and the inlet of the external condenser (11), an external liquid storage device (15) is arranged on the external high-temperature pipeline (13), an external air pump (14) is arranged between the external liquid storage device (15) and the external condenser (11), and a second external liquid pump (16) is arranged between the external liquid storage device (15) and the internal evaporator (4).
6. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 5, wherein: the external low-temperature pipeline (10) is provided with a first external liquid pump (9).
7. The notebook computer heat dissipation system adopting internal and external two-phase heat dissipation cycle coupling as claimed in claim 5, wherein: and external pipeline connecting pieces (8) on an inlet and an outlet of the internal evaporator (4) are connected to one end of a third external liquid pump (17) through branch pipelines, and the other end of the third external liquid pump (17) is connected to an external high-temperature pipeline (13) between an external air pump (14) and an external condenser (11).
8. A heat dissipation method of a notebook computer heat dissipation system using internal and external two-phase heat dissipation cycle coupling as claimed in any one of claims 1 to 7, comprising the steps of:
under a low-load mode, the built-in cooling circulation pipeline is independently opened, the liquid working medium is changed into a gas-liquid two-phase state through the built-in evaporator (4), then enters the built-in condenser (2) through the built-in connecting pipeline (7), exchanges heat with the outside, and then enters the built-in evaporator (4) again through the built-in connecting pipeline (7) for recirculation;
under the high load mode, the built-in evaporator (4) is connected with the external cooling circulation pipeline through the external pipeline connecting piece (8), liquid working medium absorbs heat through the built-in evaporator (4) to become gas-liquid two-phase working medium, then the liquid working medium enters the external condenser (11) through the external pipeline, and the gas working medium is condensed into liquid through heat exchange with the environment and then returns to the built-in evaporator (4) again for recycling.
9. The heat dissipation method according to claim 8, wherein: after the liquid working medium absorbs heat through the built-in evaporator (4) and becomes a gas-liquid two-phase working medium, the liquid working medium enters the external liquid storage device (15) through the second external liquid pump (16), and the gas working medium enters the external air pump (14) and is pumped into the external condenser (11) through the external high-temperature pipeline (13).
10. The heat dissipation method according to claim 8, wherein: the low load mode is that the operation power consumption is less than or equal to 50W, the high load mode is that the operation power consumption is more than 50W, whether the system is connected with a power supply or not is judged in the high load mode, if not, the current operation power consumption is kept, if yes, a user is prompted to be connected with the external cooling circulation pipeline, if the external cooling circulation pipeline is connected, the power consumption is improved, the full load is allowed, and if the external cooling circulation pipeline is not connected, the internal connection pipeline (7) and the internal condenser (2) are started to be in the maximum state.
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| CN117373784A (en) * | 2023-12-04 | 2024-01-09 | 福建三闽电子信息科技有限公司 | High-frequency transformer of spot welder |
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