CN114415802A - Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling - Google Patents

Notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling Download PDF

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CN114415802A
CN114415802A CN202111397868.6A CN202111397868A CN114415802A CN 114415802 A CN114415802 A CN 114415802A CN 202111397868 A CN202111397868 A CN 202111397868A CN 114415802 A CN114415802 A CN 114415802A
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condenser
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CN114415802B (en
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吴建华
钟华
赵子博
乔童童
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Xian Jiaotong University
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F9/00—Arrangements for program control, e.g. control units
    • G06F9/06—Arrangements for program control, e.g. control units using stored programs, i.e. using an internal store of processing equipment to receive or retain programs
    • G06F9/46—Multiprogramming arrangements
    • G06F9/50—Allocation of resources, e.g. of the central processing unit [CPU]
    • G06F9/5094—Allocation of resources, e.g. of the central processing unit [CPU] where the allocation takes into account power or heat criteria
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract

A notebook computer heat dissipation system and method adopting internal and external two-phase heat dissipation circulation coupling are provided, wherein the heat dissipation system comprises an internal cooling circulation pipeline and an external cooling circulation pipeline, the internal cooling circulation pipeline comprises an internal evaporator and an internal condenser which is in circulation connection with the internal evaporator through an internal connecting pipeline, the external cooling circulation pipeline comprises an external condenser, the external condenser is in circulation connection with the internal evaporator through an external pipeline, the internal evaporator is connected with the external pipeline through an external pipeline connecting piece, and the external cooling circulation pipeline is detachably connected through an external pipeline connecting piece. And in the high load mode, the internal evaporator is connected with the external cooling circulation pipeline through the external pipeline connecting piece. The invention can effectively reduce the frequency reduction probability of the notebook chip under high load, reduce the surface temperature of the notebook keyboard and greatly reduce the noise of the fan.

Description

一种采用内外两相散热循环耦合的笔记本散热系统及方法A notebook cooling system and method using inner and outer two-phase cooling cycle coupling

技术领域technical field

本发明属于电子设备散热技术领域，具体涉及一种采用内外两相散热循环耦合的笔记本散热系统及方法。The invention belongs to the technical field of heat dissipation of electronic equipment, and in particular relates to a notebook heat dissipation system and method adopting internal and external two-phase heat dissipation cyclic coupling.

背景技术Background technique

笔记本在使用时，由于显卡、处理器以及供电电感高负载运行会产生大量热量，为了防止电子器件在高温下失效，通常需要通过内置散热模组对芯片进行降温。When the notebook is in use, a large amount of heat will be generated due to the high load operation of the graphics card, the processor and the power supply inductor. In order to prevent the electronic device from failing at high temperature, it is usually necessary to cool the chip through the built-in cooling module.

之前，笔记本的散热通常是通过内置热管、风扇来实现内部热量的排出，这种方式的散热能力有限，同时热管大面积覆盖容易造成笔记本键盘以及掌托位置温度高于人体体温，影响使用感受。由于常规的内置散热使用高转速的离心风扇，当散热要求较高时，只能通过增加风扇转速，产生的噪音较大，体验较差。随着笔记本芯片功率的不断提升，未来对散热能力提出了更高的要求，当前流行的散热方式在未来很难满足散热要求。Previously, the heat dissipation of notebooks was usually achieved through built-in heat pipes and fans to discharge internal heat. This method has limited heat dissipation capacity, and at the same time, the large-area coverage of heat pipes can easily cause the temperature of the notebook keyboard and palm rest to be higher than the body temperature, which affects the experience of use. Since the conventional built-in heat dissipation uses a high-speed centrifugal fan, when the heat dissipation requirement is high, the only way to increase the fan speed is to increase the noise and experience a poorer experience. With the continuous improvement of notebook chip power, higher requirements for heat dissipation will be put forward in the future, and the current popular heat dissipation methods will be difficult to meet the heat dissipation requirements in the future.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于针对上述现有技术中的问题，提供一种采用内外两相散热循环耦合的笔记本散热系统及方法，有效减少高负载下笔记本芯片发生降频的概率，降低笔记本键盘表面温度，同时能够大大降低风扇噪音。The purpose of the present invention is to solve the above problems in the prior art, to provide a notebook cooling system and method adopting the internal and external two-phase cooling cycle coupling, which can effectively reduce the probability of frequency reduction of notebook chips under high load, and reduce the surface temperature of notebook keyboards. At the same time, the fan noise can be greatly reduced.

为了实现上述目的，本发明有如下的技术方案：In order to achieve the above object, the present invention has the following technical solutions:

第一方面，提供一种采用内外两相散热循环耦合的笔记本散热系统，包括内置冷却循环管路和外置冷却循环管路，内置冷却循环管路包括内置蒸发器以及通过内置连接管路与内置蒸发器循环连接的内置冷凝器，外置冷却循环管路包括外置冷凝器，外置冷凝器通过外置管路与内置蒸发器循环连接，所述的内置蒸发器通过外置管路连接件连接外置管路，外置冷却循环管路通过外置管路连接件可拆卸式连接。In a first aspect, a notebook cooling system using an internal and external two-phase heat dissipation cycle coupling is provided, including a built-in cooling cycle pipeline and an external cooling cycle pipeline, the built-in cooling cycle pipeline includes a built-in evaporator, and a built-in connecting pipeline is The built-in condenser cyclically connected to the evaporator, the external cooling circulation pipeline includes an external condenser, the external condenser is cyclically connected to the built-in evaporator through the external pipeline, and the built-in evaporator is connected through the external pipeline connection Connect the external pipeline, and the external cooling circulation pipeline is detachably connected through the external pipeline connector.

作为本发明笔记本散热系统的一种优选方案，所述的内置蒸发器的入口与内置冷凝器出口之间的内置连接管路为内置低温管路，内置蒸发器的出口与内置冷凝器入口之间的内置连接管路为内置高温管路，所述内置低温管路上设置有内置液泵。As a preferred solution of the notebook cooling system of the present invention, the built-in connecting pipeline between the inlet of the built-in evaporator and the outlet of the built-in condenser is a built-in low-temperature pipeline, and between the outlet of the built-in evaporator and the inlet of the built-in condenser The built-in connecting pipeline is a built-in high-temperature pipeline, and a built-in liquid pump is arranged on the built-in low-temperature pipeline.

作为本发明笔记本散热系统的一种优选方案，所述的内置冷凝器中设置有内置风扇，外置冷凝器中设置有外置风扇，且所述的外置风扇采用轴流式风扇。As a preferred solution of the notebook cooling system of the present invention, the built-in condenser is provided with a built-in fan, the external condenser is provided with an external fan, and the external fan is an axial fan.

作为本发明笔记本散热系统的一种优选方案，所述的内置冷凝器循环连接微通道换热器，微通道换热器与处理器芯片、显卡芯片以及供电芯片密切接触，且微通道换热器与处理器芯片、显卡芯片以及供电芯片的接触面涂有硅脂。As a preferred solution of the notebook cooling system of the present invention, the built-in condenser is cyclically connected to the microchannel heat exchanger, the microchannel heat exchanger is in close contact with the processor chip, the graphics card chip and the power supply chip, and the microchannel heat exchanger is in close contact with the processor chip, the graphics card chip and the power supply chip. The contact surface with the processor chip, graphics card chip and power supply chip is coated with silicone grease.

作为本发明笔记本散热系统的一种优选方案，所述的内置蒸发器的入口与外置冷凝器出口之间的外置管路为外置低温管路，内置蒸发器的出口与外置冷凝器入口之间的外置管路为外置高温管路，外置高温管路上设置有外置储液器，外置储液器与外置冷凝器之间设置外置气泵，外置储液器与内置蒸发器之间设置第二外置液泵。As a preferred solution of the notebook cooling system of the present invention, the external pipeline between the inlet of the built-in evaporator and the outlet of the external condenser is an external low-temperature pipeline, and the outlet of the built-in evaporator is connected to the external condenser. The external pipeline between the inlets is an external high temperature pipeline, an external liquid accumulator is set on the external high temperature pipeline, an external air pump is set between the external liquid accumulator and the external condenser, and an external liquid accumulator is installed. A second external liquid pump is arranged between the built-in evaporator.

作为本发明笔记本散热系统的一种优选方案，所述的外置低温管路上设置有第一外置液泵。As a preferred solution of the notebook cooling system of the present invention, the external low temperature pipeline is provided with a first external liquid pump.

作为本发明笔记本散热系统的一种优选方案，所述内置蒸发器入口和出口上的外置管路连接件通过分支管路连接至第三外置液泵的一端，第三外置液泵的另一端连接在外置气泵与外置冷凝器之间的外置高温管路上。As a preferred solution of the notebook cooling system of the present invention, the external pipeline connectors on the inlet and outlet of the built-in evaporator are connected to one end of the third external liquid pump through a branch pipeline, and the third external liquid pump The other end is connected to the external high temperature pipeline between the external air pump and the external condenser.

第二方面，提供一种所述采用内外两相散热循环耦合的笔记本散热系统的散热方法，包括以下步骤：In a second aspect, a heat dissipation method for a notebook heat dissipation system using the internal and external two-phase heat dissipation cycle coupling is provided, comprising the following steps:

在低负载模式下，所述的内置冷却循环管路单独开启，液态工质经过内置蒸发器变化为气液两相状态，然后经过内置连接管路进入到内置冷凝器中，完成与外界换热后，再经过内置连接管路重新进入内置蒸发器中再次循环；In the low load mode, the built-in cooling circulation pipeline is opened separately, the liquid working medium changes to a gas-liquid two-phase state through the built-in evaporator, and then enters the built-in condenser through the built-in connecting pipeline to complete the heat exchange with the outside world. After that, it re-enters the built-in evaporator through the built-in connecting pipeline and circulates again;

在高负载模式下，通过外置管路连接件将内置蒸发器与外置冷却循环管路连接起来，液态工质经过内置蒸发器吸热成为气液两相工质，然后经过外置管路进入到外置冷凝器当中，气态工质经过与环境换热冷凝为液态，再重新回到内置蒸发器中再次循环。In high load mode, the built-in evaporator and the external cooling circulation pipeline are connected through the external pipeline connection, the liquid working medium absorbs heat through the built-in evaporator to become a gas-liquid two-phase working medium, and then passes through the external pipeline. After entering the external condenser, the gaseous working medium is condensed into a liquid state through heat exchange with the environment, and then returned to the built-in evaporator to circulate again.

作为本发明散热方法的一种优选方案，所述液态工质经过内置蒸发器吸热成为气液两相工质之后，通过第二外置液泵进入外置储液器中，其中的气态工质进入外置气泵并经外置高温管路被泵送到外置冷凝器中。As a preferred solution of the heat dissipation method of the present invention, after the liquid working medium absorbs heat through the built-in evaporator to become a gas-liquid two-phase working medium, it enters the external liquid accumulator through the second external liquid pump, and the gaseous working medium enters the external accumulator through the second external liquid pump. The mass enters the external air pump and is pumped to the external condenser through the external high temperature pipeline.

作为本发明散热方法的一种优选方案，所述的低负载模式为运行功耗≤50W，高负载模式为运行功耗＞50W，在高负载模式下判断系统是否接入电源，若否则保持当前运行功耗，若是则提示用户可接入外置冷却循环管路，如果已接入外置冷却循环管路则提高功耗，允许满载，如果未接入则将内置连接管路和内置冷凝器开启到最大状态。As a preferred solution of the heat dissipation method of the present invention, the low load mode is that the operating power consumption is less than or equal to 50W, and the high load mode is that the operating power consumption is greater than 50W. In the high load mode, it is judged whether the system is connected to the power supply, if not, the current Running power consumption, if it is, it will prompt the user to connect to the external cooling circuit. If the external cooling circuit is connected, the power consumption will be increased, and full load is allowed. If it is not connected, the built-in connecting pipe and the built-in condenser will be open to the maximum state.

相较于现有技术，本发明至少具有如下的有益效果：Compared with the prior art, the present invention at least has the following beneficial effects:

内置冷却循环管路采用两相散热循环解决低负载下笔记本的散热，同时通过笔记本后方接口利用外置管路连接件实现外置冷却循环管路与内置冷却循环管路的连接，通过连接外置两相散热循环解决传统笔记本散热模组使用时：1、环境温度高时，进风温度高，造成笔记本高负载下，风扇出风对热管及散热鳍片的冷却能力差，导致芯片产生的热量无法及时导出，芯片处于高温状态，最终处理器和显卡降频，甚至出现烧毁供电芯片的情况发生。2、单独的液相换热能力有限，同时散热模组体积大，降低了笔记本的便携性。本发明可有效减少高负载下笔记本芯片发生降频的概率，有效降低笔记本键盘表面温度，同时可大大降低风扇噪音。The built-in cooling circuit adopts a two-phase heat dissipation cycle to solve the heat dissipation of the notebook under low load. At the same time, the connection between the external cooling circuit and the built-in cooling circuit is realized by using the external pipe connector through the rear interface of the notebook. Two-phase cooling cycle solves the problem of using traditional notebook cooling modules: 1. When the ambient temperature is high, the inlet air temperature is high, resulting in the poor cooling ability of the fan outlet air to the heat pipe and cooling fins under high notebook load, resulting in the heat generated by the chip It cannot be exported in time, the chip is in a high temperature state, the final processor and graphics card are down-clocked, and even the power supply chip is burned. 2. The heat exchange capacity of the separate liquid phase is limited, and the heat dissipation module is bulky, which reduces the portability of the notebook. The invention can effectively reduce the probability of frequency reduction of the notebook chip under high load, effectively reduce the surface temperature of the notebook keyboard, and at the same time can greatly reduce the fan noise.

附图说明Description of drawings

图1本发明采用内外两相散热循环耦合的笔记本散热系统结构示意图；1 is a schematic structural diagram of a notebook cooling system using an internal and external two-phase cooling cycle coupling according to the present invention;

图2本发明采用内外两相散热循环耦合的笔记本散热系统的散热方法流程图；2 is a flow chart of the heat dissipation method of the notebook heat dissipation system using the internal and external two-phase heat dissipation cycle coupling according to the present invention;

附图中：1-内置风扇；2-内置冷凝器；3-内置高温管路；4-内置蒸发器；5-内置低温管路；6-内置液泵；7-内置连接管路；8-外置管路连接件；9-第一外置液泵；10-外置低温管路；11-外置冷凝器；12-外置风扇；13-外置高温管路；14-外置气泵；15-外置储液器；16-第二外置液泵；17-第三外置液泵。In the drawings: 1-built-in fan; 2-built-in condenser; 3-built-in high-temperature pipeline; 4-built-in evaporator; 5-built-in low-temperature pipeline; 6-built-in liquid pump; 7-built-in connecting pipeline; 8- External pipeline connector; 9-The first external liquid pump; 10-External low temperature pipeline; 11-External condenser; 12-External fan; 13-External high temperature pipeline; 14-External air pump ; 15 - external reservoir; 16 - second external liquid pump; 17 - third external liquid pump.

具体实施方式Detailed ways

下面结合附图对本发明做进一步的详细说明。The present invention will be further described in detail below in conjunction with the accompanying drawings.

参见图1，本发明实施例提出的一种采用内外两相散热循环耦合的笔记本散热系统，包括内置冷却循环管路和外置冷却循环管路，内置冷却循环管路包括内置蒸发器4以及通过内置连接管路7与内置蒸发器4循环连接的内置冷凝器2，其中，内置蒸发器4的入口与内置冷凝器2出口之间的内置连接管路7为内置低温管路5，而内置蒸发器4的出口与内置冷凝器2入口之间的内置连接管路7为内置高温管路3，内置低温管路5上设置有内置液泵6。内置冷凝器2中设置有内置风扇1。外置冷却循环管路包括外置冷凝器11，外置冷凝器11通过外置管路与内置蒸发器4循环连接，内置蒸发器4通过外置管路连接件8连接外置管路，且外置冷却循环管路通过外置管路连接件8可拆卸式连接。外置冷凝器11中设置有外置风扇12，外置风扇12采用轴流式风扇。其中，内置蒸发器4的入口与外置冷凝器11出口之间的外置管路为外置低温管路10，外置低温管路10上设置有第一外置液泵9。内置蒸发器4的出口与外置冷凝器11入口之间的外置管路为外置高温管路13，外置高温管路13上设置有外置储液器15，外置储液器15与外置冷凝器11之间设置外置气泵14，外置储液器15与内置蒸发器4之间设置第二外置液泵16。内置蒸发器4入口和出口上的外置管路连接件8通过分支管路连接至第三外置液泵17的一端，将第三外置液泵17的另一端连接在外置气泵14与外置冷凝器11之间的外置高温管路13上。本发明的上述内置冷凝器2循环连接微通道换热器，微通道换热器与处理器芯片、显卡芯片以及供电芯片密切接触，且微通道换热器与处理器芯片、显卡芯片以及供电芯片的接触面涂有高导热系数的硅脂。Referring to FIG. 1 , a notebook cooling system using an internal and external two-phase heat dissipation cycle coupling proposed by an embodiment of the present invention includes a built-in cooling cycle pipeline and an external cooling cycle pipeline. The built-in cooling cycle pipeline includes a built-in evaporator 4 and passes through The built-in condenser 2 in which the built-in connecting pipeline 7 is cyclically connected to the built-in evaporator 4, wherein the built-in connecting pipeline 7 between the inlet of the built-in evaporator 4 and the outlet of the built-in condenser 2 is the built-in low temperature pipeline 5, and the built-in evaporation The built-in connecting pipeline 7 between the outlet of the condenser 4 and the inlet of the built-in condenser 2 is the built-in high-temperature pipeline 3 , and the built-in low-temperature pipeline 5 is provided with a built-in liquid pump 6 . A built-in fan 1 is provided in the built-in condenser 2 . The external cooling circulation pipeline includes an external condenser 11, the external condenser 11 is cyclically connected to the built-in evaporator 4 through the external pipeline, and the built-in evaporator 4 is connected to the external pipeline through the external pipeline connector 8, and The external cooling circulation pipeline is detachably connected through the external pipeline connecting piece 8 . The external condenser 11 is provided with an external fan 12, and the external fan 12 adopts an axial flow fan. The external pipeline between the inlet of the built-in evaporator 4 and the outlet of the external condenser 11 is the external low temperature pipeline 10 , and the external low temperature pipeline 10 is provided with a first external liquid pump 9 . The external pipeline between the outlet of the built-in evaporator 4 and the inlet of the external condenser 11 is the external high-temperature pipeline 13 , and the external high-temperature pipeline 13 is provided with an external accumulator 15 . An external air pump 14 is provided between the external condenser 11 , and a second external liquid pump 16 is provided between the external liquid accumulator 15 and the built-in evaporator 4 . The external pipeline connectors 8 on the inlet and outlet of the built-in evaporator 4 are connected to one end of the third external liquid pump 17 through a branch pipeline, and the other end of the third external liquid pump 17 is connected to the external air pump 14 and the external pump 17. It is placed on the external high temperature pipeline 13 between the condensers 11 . The above-mentioned built-in condenser 2 of the present invention is cyclically connected to the microchannel heat exchanger, the microchannel heat exchanger is in close contact with the processor chip, the graphics card chip and the power supply chip, and the microchannel heat exchanger is in contact with the processor chip, the graphics card chip and the power supply chip. The contact surface is coated with high thermal conductivity silicone grease.

参见图2，本发明实施例一种采用内外两相散热循环耦合的笔记本散热系统的散热方法，包括以下步骤：Referring to FIG. 2 , a heat dissipation method for a notebook heat dissipation system using an internal and external two-phase heat dissipation cycle coupling according to an embodiment of the present invention includes the following steps:

在低负载模式下，具体的低负载模式为运行功耗≤50W，即CPU和GPU总负载为50W以及更低负载时，内置冷却循环管路单独开启，液态工质经过内置蒸发器4变化为气液两相状态，然后经过内置连接管路7进入到内置冷凝器2中，完成与外界换热后，再经过内置连接管路7重新进入内置蒸发器4中再次循环；In the low load mode, the specific low load mode is that the operating power consumption is ≤50W, that is, when the total load of the CPU and GPU is 50W or lower, the built-in cooling circuit is opened separately, and the liquid working medium passes through the built-in evaporator 4. Change to The gas-liquid two-phase state, then enters the built-in condenser 2 through the built-in connecting pipeline 7, and after completing the heat exchange with the outside world, re-enters the built-in evaporator 4 through the built-in connecting pipeline 7 and circulates again;

在高负载模式下，具体的高负载模式为运行功耗＞50W，即CPU和GPU总负载大于50W时，通过外置管路连接件8将内置蒸发器4与外置冷却循环管路连接起来，液态工质经过内置蒸发器4吸热成为气液两相工质，然后经过外置管路进入到外置冷凝器11当中，气态工质经过与环境换热冷凝为液态，再重新回到内置蒸发器4中再次循环。In the high-load mode, the specific high-load mode is that the running power consumption is greater than 50W, that is, when the total load of the CPU and GPU is greater than 50W, the built-in evaporator 4 is connected to the external cooling circulation pipeline through the external pipeline connector 8 , the liquid working medium absorbs heat through the built-in evaporator 4 to become a gas-liquid two-phase working medium, and then enters the external condenser 11 through an external pipeline, and the gaseous working medium is condensed into a liquid state through heat exchange with the environment, and then returns to The built-in evaporator 4 circulates again.

在一种实施方式中，液态工质经过内置蒸发器4吸热成为气液两相工质之后，通过第二外置液泵16进入外置储液器15中，其中的气态工质进入外置气泵14并经外置高温管路13被泵送到外置冷凝器11中。在高负载模式下判断系统是否接入电源，若否则保持当前运行功耗，若是则提示用户可接入外置冷却循环管路，如果已接入外置冷却循环管路则提高功耗，允许满载，如果未接入则将内置液泵6和内置风扇1开启到最大状态。In one embodiment, after the liquid working medium absorbs heat through the built-in evaporator 4 to become a gas-liquid two-phase working medium, it enters the external accumulator 15 through the second external liquid pump 16, and the gaseous working medium enters the external liquid storage tank 15. The air pump 14 is installed and pumped to the external condenser 11 through the external high temperature pipeline 13 . In high load mode, judge whether the system is connected to the power supply, if not, keep the current operating power consumption, if so, it will prompt the user to connect to the external cooling circuit, if it has been connected to the external cooling circuit, the power consumption will be increased, allowing Full load, if not connected, turn on the built-in liquid pump 6 and the built-in fan 1 to the maximum state.

本发明在移动办公或者笔记本处于低负载时，可单独将内置液泵6开启，内置液泵6为微型液体泵，低温循环工质在该微型液体泵的推动下，通过连接管路进入具有微型通道结构的换热器中，其中换热器与处理器芯片、显卡芯片以及供电芯片密切接触，同时在换热器与芯片接触面涂有高导热系数的硅脂。低温工质在经过与芯片密切接触的微通道换热器温度升高，部分液态工质蒸发吸热成为气态，通过沸腾强化换热，降低芯片表面温度，保证芯片处于正常工作温度。经过高温侧换热器的工质成为两相高温工质，通过连接管路进入低温侧换热器。高温两相工质在低温侧换热器中与风扇出口的空气进行强制对流换热，将热量释放到环境中去，实现自身温度降低，气态工质冷凝为液态，重新参与两相换热循环。In the present invention, when the mobile office or notebook is under low load, the built-in liquid pump 6 can be turned on independently. The built-in liquid pump 6 is a micro-liquid pump. In the heat exchanger of the channel structure, the heat exchanger is in close contact with the processor chip, the graphics card chip and the power supply chip, and at the same time, the contact surface of the heat exchanger and the chip is coated with high thermal conductivity silicone grease. The temperature of the low-temperature working medium increases after passing through the micro-channel heat exchanger that is in close contact with the chip, and part of the liquid working medium evaporates and absorbs heat into a gaseous state. The heat exchange is enhanced by boiling, and the surface temperature of the chip is reduced to ensure that the chip is at normal working temperature. The working fluid passing through the high temperature side heat exchanger becomes a two-phase high temperature working fluid, and enters the low temperature side heat exchanger through the connecting pipeline. The high-temperature two-phase working medium performs forced convection heat exchange with the air at the outlet of the fan in the low-temperature side heat exchanger, and releases heat to the environment to reduce its own temperature. .

在高负载模式下，通过预留接口，利用外置管路连接件8将外置两相换热散热器与内置两相换热散热器相连。外置散热器与内置散热器中的工质可通过管路自由流动。外置散热器中拥有更大的循环泵和低温侧换热器。同时，将外置散热器风扇采用风力大且噪声小的轴流式风扇，对低温测换热器可进行有效冷却，同时降低噪声。In the high-load mode, the external two-phase heat exchange radiator is connected to the built-in two-phase heat exchange radiator by using the external pipeline connector 8 through the reserved interface. The working fluid in the external radiator and the built-in radiator can flow freely through the pipeline. The external radiator has a larger circulating pump and low temperature side heat exchanger. At the same time, the external radiator fan adopts an axial flow fan with large wind power and low noise, which can effectively cool the low temperature heat exchanger and reduce the noise at the same time.

实施例中，CPU和GPU总负载为50W以及更低负载时，开启内部散热循环，液态制冷剂在液泵推动下通过循环管路流经CPU和GPU处换热器时，由于CPU和GPU处于高温，工质吸热使CPU和GPU降温，目标控制在80℃以内。高温工质通过循环管路流至换热器风扇侧，风扇出风对换热器内的高温液体降温，重新回到低温工质管路中参与散热循环。In the embodiment, when the total load of the CPU and GPU is 50W or lower, the internal heat dissipation cycle is turned on, and the liquid refrigerant flows through the heat exchanger at the CPU and GPU through the circulation pipeline under the push of the liquid pump. High temperature, the working fluid absorbs heat to cool down the CPU and GPU, and the target is controlled within 80 °C. The high-temperature working fluid flows to the fan side of the heat exchanger through the circulation pipeline, and the air out of the fan cools the high-temperature liquid in the heat exchanger, and returns to the low-temperature working fluid pipeline to participate in the heat dissipation cycle.

当CPU和GPU的负载较高且连接了电源和外部循环散热系统时，内外散热循环可同时开启，此时允许系统功耗提升到300W，笔记本可满载运行不降频。当CPU和GPU的负载较高且连接了外部循环散热系统且连接了电源时，但并未连接外部循环散热系统时，内循环散热系统中的液体泵和风扇转速增加到可允许的最大值，此时系统散热功耗提升到150W。When the load of the CPU and GPU is high and the power supply and the external circulation cooling system are connected, the internal and external cooling circulation can be turned on at the same time. At this time, the system power consumption is allowed to increase to 300W, and the notebook can run at full load without frequency reduction. When the CPU and GPU are under high load and the external circulating cooling system is connected and the power supply is connected, but the external circulating cooling system is not connected, the liquid pump and fan speed in the internal circulating cooling system is increased to the maximum allowable value, At this time, the cooling power consumption of the system is increased to 150W.

以上所述的仅仅是本发明的较佳实施例，并不用以对本发明的技术方案进行任何限制，本领域技术人员应当理解的是，在不脱离本发明精神和原则的前提下，该技术方案还可以进行若干简单的修改和替换，这些修改和替换也均属于权利要求书所涵盖的保护范围之内。The above are only preferred embodiments of the present invention, and are not intended to limit the technical solutions of the present invention. Those skilled in the art should understand that, without departing from the spirit and principles of the present invention, the technical solutions Several simple modifications and substitutions can also be made, and these modifications and substitutions also fall within the protection scope covered by the claims.

Claims (10)

1.一种采用内外两相散热循环耦合的笔记本散热系统，其特征在于：包括内置冷却循环管路和外置冷却循环管路，内置冷却循环管路包括内置蒸发器(4)以及通过内置连接管路(7)与内置蒸发器(4)循环连接的内置冷凝器(2)，外置冷却循环管路包括外置冷凝器(11)，外置冷凝器(11)通过外置管路与内置蒸发器(4)循环连接，所述的内置蒸发器(4)通过外置管路连接件(8)连接外置管路，外置冷却循环管路通过外置管路连接件(8)可拆卸式连接。1. A notebook cooling system adopting internal and external two-phase heat dissipation circulation coupling is characterized in that: comprising a built-in cooling circulation pipeline and an external cooling circulation pipeline, and the built-in cooling circulation pipeline comprises a built-in evaporator (4) and is connected by a built-in The pipeline (7) is cyclically connected to the built-in condenser (2) with the built-in evaporator (4). The external cooling circulation pipeline includes an external condenser (11), and the external condenser (11) is connected with The built-in evaporator (4) is cyclically connected, the built-in evaporator (4) is connected to the external pipeline through the external pipeline connector (8), and the external cooling circulation pipeline is connected through the external pipeline connector (8) Detachable connection. 2.根据权利要求1所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述的内置蒸发器(4)的入口与内置冷凝器(2)出口之间的内置连接管路(7)为内置低温管路(5)，内置蒸发器(4)的出口与内置冷凝器(2)入口之间的内置连接管路(7)为内置高温管路(3)，所述内置低温管路(5)上设置有内置液泵(6)。2. The notebook cooling system adopting internal and external two-phase cooling cycle coupling according to claim 1, characterized in that: a built-in connecting pipeline between the inlet of the built-in evaporator (4) and the outlet of the built-in condenser (2) (7) is a built-in low-temperature pipeline (5), and the built-in connecting pipeline (7) between the outlet of the built-in evaporator (4) and the inlet of the built-in condenser (2) is a built-in high-temperature pipeline (3). A built-in liquid pump (6) is arranged on the low temperature pipeline (5). 3.根据权利要求1所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述的内置冷凝器(2)中设置有内置风扇(1)，外置冷凝器(11)中设置有外置风扇(12)，且所述的外置风扇(12)采用轴流式风扇。3. The notebook cooling system adopting internal and external two-phase cooling cycle coupling according to claim 1, characterized in that: the built-in condenser (2) is provided with a built-in fan (1), and the external condenser (11) is provided with a built-in fan (1). An external fan (12) is provided, and the external fan (12) adopts an axial flow fan. 4.根据权利要求1所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述的内置冷凝器(2)循环连接微通道换热器，微通道换热器与处理器芯片、显卡芯片以及供电芯片密切接触，且微通道换热器与处理器芯片、显卡芯片以及供电芯片的接触面涂有硅脂。4. The notebook cooling system adopting internal and external two-phase heat dissipation cyclic coupling according to claim 1 is characterized in that: the built-in condenser (2) is cyclically connected to a microchannel heat exchanger, and the microchannel heat exchanger and the processor chip , the graphics card chip and the power supply chip are in close contact, and the contact surfaces of the microchannel heat exchanger and the processor chip, the graphics card chip and the power supply chip are coated with silicone grease. 5.根据权利要求1所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述的内置蒸发器(4)的入口与外置冷凝器(11)出口之间的外置管路为外置低温管路(10)，内置蒸发器(4)的出口与外置冷凝器(11)入口之间的外置管路为外置高温管路(13)，外置高温管路(13)上设置有外置储液器(15)，外置储液器(15)与外置冷凝器(11)之间设置外置气泵(14)，外置储液器(15)与内置蒸发器(4)之间设置第二外置液泵(16)。5. The notebook cooling system adopting internal and external two-phase cooling cycle coupling according to claim 1, characterized in that: an external pipe between the inlet of the built-in evaporator (4) and the outlet of the external condenser (11) The pipeline is an external low temperature pipeline (10), the external pipeline between the outlet of the built-in evaporator (4) and the inlet of the external condenser (11) is an external high temperature pipeline (13), and the external high temperature pipeline (13) is provided with an external liquid accumulator (15), an external air pump (14) is arranged between the external liquid accumulator (15) and the external condenser (11), and the external liquid accumulator (15) is connected to the external condenser (11). A second external liquid pump (16) is arranged between the built-in evaporators (4). 6.根据权利要求5所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述的外置低温管路(10)上设置有第一外置液泵(9)。6. The notebook cooling system adopting internal and external two-phase cooling cycle coupling according to claim 5, characterized in that: the external low temperature pipeline (10) is provided with a first external liquid pump (9). 7.根据权利要求5所述采用内外两相散热循环耦合的笔记本散热系统，其特征在于：所述内置蒸发器(4)入口和出口上的外置管路连接件(8)通过分支管路连接至第三外置液泵(17)的一端，第三外置液泵(17)的另一端连接在外置气泵(14)与外置冷凝器(11)之间的外置高温管路(13)上。7. The notebook cooling system adopting internal and external two-phase cooling cycle coupling according to claim 5, characterized in that: the external pipeline connectors (8) on the inlet and outlet of the built-in evaporator (4) pass through branch pipelines Connect to one end of the third external liquid pump (17), and the other end of the third external liquid pump (17) is connected to the external high temperature pipeline ( 13) on. 8.一种如权利要求1至7中任意一项所述采用内外两相散热循环耦合的笔记本散热系统的散热方法，其特征在于，包括以下步骤：8. A heat dissipation method for a notebook heat dissipation system employing an internal and external two-phase heat dissipation cycle coupling according to any one of claims 1 to 7, characterized in that, comprising the following steps: 在低负载模式下，所述的内置冷却循环管路单独开启，液态工质经过内置蒸发器(4)变化为气液两相状态，然后经过内置连接管路(7)进入到内置冷凝器(2)中，完成与外界换热后，再经过内置连接管路(7)重新进入内置蒸发器(4)中再次循环；In the low load mode, the built-in cooling circulation pipeline is opened separately, and the liquid working medium changes into a gas-liquid two-phase state through the built-in evaporator (4), and then enters the built-in condenser (7) through the built-in connecting pipeline (7). In 2), after completing the heat exchange with the outside world, it re-enters the built-in evaporator (4) through the built-in connecting pipeline (7) and circulates again; 在高负载模式下，通过外置管路连接件(8)将内置蒸发器(4)与外置冷却循环管路连接起来，液态工质经过内置蒸发器(4)吸热成为气液两相工质，然后经过外置管路进入到外置冷凝器(11)当中，气态工质经过与环境换热冷凝为液态，再重新回到内置蒸发器(4)中再次循环。In the high load mode, the built-in evaporator (4) is connected with the external cooling circulation pipeline through the external pipeline connector (8), and the liquid working medium absorbs heat through the built-in evaporator (4) and becomes a gas-liquid two-phase The working medium then enters the external condenser (11) through the external pipeline, and the gaseous working medium is condensed into a liquid state through heat exchange with the environment, and then returns to the built-in evaporator (4) for recirculation. 9.根据权利要求8所述的散热方法，其特征在于：所述液态工质经过内置蒸发器(4)吸热成为气液两相工质之后，通过第二外置液泵(16)进入外置储液器(15)中，其中的气态工质进入外置气泵(14)并经外置高温管路(13)被泵送到外置冷凝器(11)中。9. The heat dissipation method according to claim 8, characterized in that: after the liquid working medium absorbs heat into a gas-liquid two-phase working medium through a built-in evaporator (4), it enters through the second external liquid pump (16). In the external liquid accumulator (15), the gaseous working medium therein enters the external air pump (14) and is pumped to the external condenser (11) through the external high temperature pipeline (13). 10.根据权利要求8所述的散热方法，其特征在于：所述的低负载模式为运行功耗≤50W，高负载模式为运行功耗＞50W，在高负载模式下判断系统是否接入电源，若否则保持当前运行功耗，若是则提示用户可接入外置冷却循环管路，如果已接入外置冷却循环管路则提高功耗，允许满载，如果未接入则将内置连接管路(7)和内置冷凝器(2)开启到最大状态。10. The heat dissipation method according to claim 8, characterized in that: the low load mode is that the operating power consumption is less than or equal to 50W, the high load mode is that the operating power consumption is greater than 50W, and whether the system is connected to the power supply is judged in the high load mode. , if not, keep the current running power consumption, if so, it will prompt the user to connect to the external cooling circuit, if it has been connected to the external cooling circuit, increase the power consumption and allow full load, if not, connect the built-in connection pipe The circuit (7) and the built-in condenser (2) are opened to the maximum state.
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