CN112230740A

CN112230740A - Computer CPU cooling device

Info

Publication number: CN112230740A
Application number: CN202011391325.9A
Authority: CN
Inventors: 杨宇飞
Original assignee: Microchill Technologies Co ltd
Current assignee: Microchill Technologies Co ltd
Priority date: 2020-12-03
Filing date: 2020-12-03
Publication date: 2021-01-15

Abstract

The invention provides a computer CPU cooling device, which comprises a box body, a micro direct current refrigeration compressor, a condenser, a fan, a throttling element, an evaporator, a micro pump, a three-way valve, a water cooler, an air duct, a water return joint, a water outlet joint, an optical drive water tank, a water cooling plate, a fastening piece and the like, wherein the optical drive water tank is arranged at the optical drive installation position of a computer case, and the water cooling plate is attached to the surface of a CPU to be cooled through the fastening piece and is fixed on a computer mainboard in the computer case together with the CPU. After flowing into the box body from the air inlet of the box body, the air flows through the condenser and the water cooler in sequence and then flows out of the box body through the fan and the air outlet on the box body. When the heat load of the CPU is higher or the temperature of the CPU is required to be lower, the device works in a condensation heat dissipation mode to prepare cold water with the temperature lower than the ambient temperature so as to cool the CPU; when the heat load of the CPU is small, the device can be switched to a water-air heat dissipation mode, so that the energy consumption is saved.

Description

Computer CPU cooling device

Technical Field

The invention relates to a heat dissipation technology and a refrigeration technology.

Background

The CPU of the desktop computer usually adopts a heat dissipation method of a heat dissipation fin or a heat pipe radiator, and the heat of the CPU is firstly transferred to the heat dissipation fin or the heat pipe radiator, and then is dissipated to the air by forced convection of a fan. Although the heat dissipation method can satisfy the use of the computer under normal conditions, the phenomena of overlarge heat productivity and overhigh temperature often occur when the CPU is used in an over-frequency mode, and the CPU is damaged and cannot be used in a serious condition.

In order to enable the CPU to be used in the overclocking process, a water cooling heat dissipation mode is commonly adopted among vast overclocking fans, particularly game enthusiasts at present. Such a water-cooling heat dissipation method generally includes a water-cooling plate, a water pump, a heat dissipation row with a fan (water-air heat sink), a water tank, and the like. The water cooling plate is tightly attached to the surface of the CPU, the heat dissipation row is installed outside the computer case, and the water tank is usually installed at the CD-ROM position of the computer case, namely the installation position which is reserved on the computer case and is used for installing the CD-ROM. The water pump sucks water from the CD-ROM drive water tank and sends the water to the cold plate; the water absorbs the heat of the CPU in the cold plate, so that the temperature of the CPU is reduced; the temperature of the water after absorbing the heat of the CPU is increased and flows to the heat dissipation row, the water dissipates the heat to the air in the heat dissipation row, and the temperature is reduced; finally, the water flow returns to the CD-ROM drive water tank. It can be seen that although the heat dissipation capacity of the water-cooling heat dissipation method is superior to that of the conventional heat dissipation fin and heat pipe heat sink, the water-cooling heat dissipation method is still a passive heat dissipation method in nature, because the heat transfer requires a temperature difference, the water-cooling heat dissipation method can only reduce the temperature of the CPU to be higher than the ambient air temperature, and a large temperature gradient exists between the surface of the CPU and the ambient temperature, and when the ambient air temperature rises, the surface temperature of the CPU also rises. When the working temperature of the CPU is required to be lower and the working temperature of the CPU is required to be lower than the ambient temperature, the heat dissipation mode can not be used.

Still another cooling method for computer CPU is a method of direct evaporation of refrigerant. The method directly sticks the evaporator of the refrigeration system on the surface of the CPU, and the CPU is directly cooled by the evaporation of the refrigerant in the evaporator. This has the advantage that the temperature can be lower than the ambient air temperature, since the refrigerant evaporates directly in the evaporator. However, when the thermal load of the chip is small, the evaporation temperature is easily too low, and condensed water is easily generated on the surface of the evaporator and the chip, thereby easily causing short circuit between the chip and the main board. The cooling method using direct evaporation of refrigerant also does not easily achieve precise control of the CPU temperature, especially when the instantaneous thermal load of the CPU fluctuates greatly.

In summary, there are various drawbacks to the conventional cooling method for a desktop CPU, and improvements are needed.

Disclosure of Invention

The invention provides a novel computer CPU cooling device aiming at various problems in the existing computer water-cooling heat dissipation technology.

The computer CPU cooling device adopts a miniature vapor compression refrigeration cycle to prepare cold water with the temperature lower than the ambient air temperature, and utilizes the cold water to indirectly cool the CPU; meanwhile, the computer CPU cooling device can still cool the CPU by adopting a conventional mode of radiating heat to air under the conditions of lower CPU load and smaller heat productivity so as to maintain lower energy consumption. The invention is realized by the following technical approaches:

the invention relates to a computer CPU cooling device, which comprises a box body, a micro direct current refrigeration compressor, a condenser, a fan, a throttling element, an evaporator, a micro pump, a three-way valve, a water cooler, an air duct, a water return joint, a water outlet joint, a CD-ROM position water tank, a water cooling plate, a fastening piece and the like. Wherein miniature direct current refrigeration compressor, throttling element, evaporimeter, micropump, three-way valve, wind channel are installed in the box, condenser, fan, water cooler are installed in the wind channel, return water joint, play water joint are installed on the box, CD-ROM drive position water tank, water-cooling plate, fastener are installed in the computer machine case that needs the cooling.

An air inlet and an air outlet are arranged on the box body. The air duct is installed in the box body, and one end of the air duct is connected with the air outlet. The windward surfaces of the condenser and the water cooler are parallel to each other, and the normal directions of the windward surfaces of the condenser and the water cooler are consistent with the axial direction of the fan or the air channel.

The micro direct-current refrigeration compressor is provided with a compressor air suction port and a compressor exhaust port, the condenser is provided with a condenser inlet and a condenser outlet, the throttling element is provided with a throttling inlet and a throttling outlet, and the evaporator is provided with an evaporation inlet, an evaporation outlet, a water side inlet and a water side outlet; the air exhaust port of the compressor, the inlet of the condenser, the outlet of the condenser, the throttle inlet, the throttle outlet, the evaporation inlet of the evaporator, the evaporation outlet of the evaporator and the air suction port of the compressor are sequentially connected to form a closed refrigeration loop, and a refrigerant is filled in the refrigeration loop.

The micropump has a pump inlet and a pump outlet, and the three-way valve has a first port, a second port, and a third port. The three-way valve has a first conducting state and a second conducting state: in a first conduction state, the first valve port is communicated with the second valve port, and the third valve port is cut off; in the second conduction state, the first valve port and the third valve port are communicated, and the second valve port is closed. The water cooler has a cooling inlet and a cooling outlet. The pump inlet of the micropump is connected with a water return joint arranged on the box body, the pump outlet of the micropump is connected with a first valve port of the three-way valve, a second valve port of the three-way valve is connected with a cooling inlet of the water cooler, a third valve port of the three-way valve is connected with a water side inlet of the evaporator, and a water side outlet of the evaporator is connected with a water outlet joint arranged on the box body and a cooling outlet of the water cooler.

The fan is a direct current fan, preferably an axial direct current fan. After flowing into the box body from the air inlet of the box body, the air flows through the condenser and the water cooler in sequence and then flows out of the box body through the fan and the air outlet on the box body.

The water cooling plate is a heat exchanger only with one fluid participating in heat exchange, and is provided with a hollow structure, a first connector of the water cooling plate, a second connector of the water cooling plate and a smooth outer surface, and fins capable of enhancing the heat exchange of the fluid are arranged in the hollow structure and on the inner surface corresponding to the smooth outer surface. The smooth outer surface of the water cooling plate is attached to the surface of a CPU to be cooled on the computer mainboard, and the water cooling plate and the CPU are clamped on the computer mainboard by the fastening piece, so that the smooth outer surface of the water cooling plate is ensured to be in close contact with the surface of the CPU, the thermal contact resistance is reduced, and the thermal conductivity is increased.

The CD-ROM position water tank is arranged at any CD-ROM mounting position of the computer case. The CD-ROM drive water tank is provided with a water tank water outlet and a water tank water return port. The water outlet of the water tank is connected with a water return joint on the tank body through a pipeline, the water return port of the water tank is connected with a second interface of the water cooling plate through a pipeline, and the first interface of the water cooling plate is connected with a water outlet joint on the tank body through a pipeline.

When the CD-ROM drive water tank is used, a proper amount of water is contained in the CD-ROM drive water tank, and then the micropump and the fan are respectively started to operate. The computer CPU cooling device can work in two modes according to whether the micro direct current refrigeration compressor operates or not: a water-air heat dissipation mode and a condensation heat dissipation mode. The two operating modes can be freely switched.

When the heating value of the CPU is smaller or the allowable surface temperature of the CPU is higher, the computer CPU cooling device works in a water-air heat dissipation mode. At the moment, the three-way valve is in a first conduction state, namely the first valve port is communicated with the second valve port, the third valve port is closed, the micro pump and the fan run, and the micro refrigeration compressor does not run. Under the water-air heat dissipation mode, the micro pump sucks water with higher temperature from the CD-ROM drive water tank and pumps the water into the water cooler. In water coolers, the heat of the water is dissipated to the air in a convective manner. And the water with lower temperature after heat dissipation enters the water cooling plate to cool the water cooling plate. In the water-air heat dissipation mode, the surface temperature of the CPU is always higher than the ambient air temperature.

When the heating value of the CPU is larger or the surface temperature of the CPU is required to be lower than the ambient air temperature, the computer CPU cooling device works in a condensation heat dissipation mode. At this time, the three-way valve is in a second conduction state, namely the first valve port is communicated with the third valve port, the second valve port is closed, and the micro pump, the fan and the micro refrigeration compressor all operate. In the condensing and radiating mode, the micro pump absorbs water from the CD-ROM drive water tank and pumps the water into the evaporator, and in the evaporator, the water is cooled by the evaporated refrigerant to obtain low-temperature cold water. The low-temperature cold water enters the water cooling plate to cool the water cooling plate. In the condensation heat dissipation mode, the temperature of the CPU may be cooled below the ambient air temperature.

The CPU cooling device of the invention adopts the vapor compression refrigeration cycle taking the micro direct current refrigeration compressor as the core to prepare cold water, and then uses a cold water chamber to cool the cold plate, so that the CPU can be cooled to a lower temperature. Meanwhile, when the CPU has a small heat value, the CPU can still adopt a conventional water-air heat dissipation mode without starting a compressor for refrigeration, thereby greatly reducing the energy consumption. Because the water tank is installed in the device by using the CD-ROM installation position of a computer, the space is saved, and the buffer action of the water tank is used, so that the temperature fluctuation and the pressure fluctuation of a water channel in the device are smaller, and the accurate temperature control is easier to realize.

Drawings

FIG. 1 is a schematic flow chart of an embodiment of a cooling apparatus for a computer CPU according to the present invention.

FIG. 2 is a schematic flow chart of an alternative embodiment of the cooling apparatus for a computer CPU according to the present invention.

FIG. 3 is a schematic flow chart of a second alternative embodiment of the cooling apparatus for a computer CPU according to the present invention.

FIG. 4 is a schematic flow chart of a third alternative embodiment of the cooling apparatus for a computer CPU according to the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention will be further described with reference to the accompanying drawings.

As shown in fig. 1, according to an embodiment of the present invention, the computer CPU cooling device of the present invention comprises a box 1, a micro dc refrigeration compressor 2, a condenser 3, a fan 4, a throttling element 5, an evaporator 6, a micro pump 7, a three-way valve 8, a water cooler 9, an air duct 10, a water return joint 11, a water outlet joint 12, an optical drive water tank 13, a water cooling plate 14, and a fastening member 15.

An air inlet 1a and an air outlet 1b are arranged on the box body 1. The micro direct-current refrigeration compressor 2, the throttling element 5, the evaporator 6, the micro pump 7 and the three-way valve 8 are arranged in the box body 1. The air duct 10 is installed in the box body 1, and one end of the air duct 10 is connected with the air outlet 1 b. The condenser 3, the water cooler 9 and the fan 4 are arranged in the air duct 10, windward surfaces of the condenser 3 and the water cooler 9 are parallel to each other, and normal directions of the windward surfaces of the condenser 3 and the water cooler 9 are consistent with axial directions of the fan 4 and the air duct 10. The water return connector 11 and the water outlet connector 12 are installed on the box body 1, and the optical drive position water tank 13 and the water cooling plate 14 are installed in a computer case 20 to be cooled.

A computer main board 22 is mounted in the computer case 20, a CPU 23 requiring cooling is mounted on the computer main board 22, and one or more optical drive mounting positions 21 are provided on the computer case 20.

The micro direct-current refrigeration compressor 2 is provided with a compressor suction port 2a and a compressor discharge port 2b, the condenser 3 is provided with a condenser inlet 3a and a condenser outlet 3b, the throttling element 5 is provided with a throttling inlet 5a and a throttling outlet 5b, and the evaporator 6 is provided with an evaporation inlet 6a, an evaporation outlet 6b, a water side inlet 6c and a water side outlet 6 d; the compressor exhaust port 2b, the condenser inlet 3a, the condenser outlet 3b, the throttle inlet 5a, the throttle outlet 5b, the evaporation inlet 6a of the evaporator 6, the evaporation outlet 6b of the evaporator 6 and the compressor air suction port 2a are sequentially connected to form a closed refrigeration loop, and a refrigerant is filled in the refrigeration loop.

The micro pump 7 has a pump inlet 7a and a pump outlet 7b, and the three-way valve 8 has a first port 8a, a second port 8b and a third port 8 c. The three-way valve 8 has a first and a second conducting state: in the first conduction state, the first port 8a and the second port 8b are communicated, and the third port 8c is closed; in the second on state, the first port 8a and the third port 8c communicate with each other, and the second port 8b is blocked. The water cooler 9 has a cooling inlet 9a and a cooling outlet 9 b. The pump inlet 7a of the micro pump 7 is connected with a water return joint 11 arranged on the box body 1, the pump outlet 7b of the micro pump 7 is connected with a first valve port 8a of the three-way valve 8, a second valve port 8b of the three-way valve 8 is connected with a cooling inlet 9a of the water cooler 9, a third valve port 8c of the three-way valve 8 is connected with a water side inlet 6c of the evaporator 6, and a water side outlet 6d of the evaporator 6 is connected with a water outlet joint 12 arranged on the box body 1 and a cooling outlet 9b of the water cooler 9.

The fan 4 is a direct current fan, preferably an axial direct current fan. After flowing into the box 1 from the air inlet 1a of the box 1, the air flows through the condenser 3 and the water cooler 9 in sequence, and then flows out of the box 1 through the fan 4 and the air outlet 1b of the box 1.

The water-cooling plate 14 is a heat exchanger in which only one fluid participates in heat exchange, and has a hollow structure, and has a water-cooling plate first interface 14a, a water-cooling plate second interface 14b and a smooth outer surface 14c, and fins 14f for enhancing the heat exchange of the fluid are arranged inside the hollow structure and on the inner surface corresponding to the smooth outer surface 14 c. The smooth outer surface 14c of the water cooling plate 14 is attached to the surface of the CPU 23 on the computer main board 22, and the fastening piece 15 clamps the water cooling plate 14 and the CPU 23 on the main board 22 so as to ensure that the smooth outer surface 14c of the water cooling plate 14 is in close contact with the surface of the CPU 23, thereby reducing the contact thermal resistance and increasing the thermal conductivity. Normally, a heat conductive silicone grease is also filled between the smooth outer surface 14c of the water-cooled plate 14 and the surface in contact with the CPU 23 to further reduce the contact thermal resistance.

The optical drive position water tank 13 is installed on any optical drive installation position 21 of the computer case 20. The CD-ROM drive water tank 13 is provided with a water tank water outlet 13a and a water tank water return port 13 b. The water outlet 13a of the water tank is connected with a water return connector 11 on the tank body 1 through a pipeline, the water return port 13b of the water tank is connected with a second connector 14b of the water cooling plate through a pipeline, and the first connector 14a of the water cooling plate is connected with a water outlet connector 12 on the tank body 1 through a pipeline.

When the water-saving type CD-ROM drive water level control device is used, a proper amount of water is contained in the CD-ROM drive water level tank 13, and then the micropump 7 and the fan 4 are respectively started to operate. The computer CPU cooling device can work in two modes according to whether the micro direct current refrigeration compressor 2 runs or not: a water-air heat dissipation mode and a condensation heat dissipation mode. These are described below.

Water-air heat radiation mode

When the heating value of the CPU 23 is smaller or the allowable surface temperature of the CPU is higher, the computer CPU cooling device works in a water-air heat dissipation mode. At this time, the three-way valve 8 is in the first conduction state, that is, the first valve port 8a and the second valve port 8b are communicated, the third valve port 8c is closed, the micro pump 7 and the fan 4 are operated, and the micro refrigerant compressor 2 is not operated.

In the water-air heat dissipation mode, water with a high temperature stored in the optical drive position water tank 13 enters the micro pump 7 through the water inlet joint 11 and the pump inlet 7a, and after the water is pressurized in the micro pump 7, the water sequentially flows through the pump outlet 7b, the first valve port 8a, the second valve port 8b and the cooling inlet 9a and enters the water cooler 9. In the water cooler 9, the heat of the water is taken away by the air forced to flow by the fan 4, and the temperature is lowered. The cooled water with lower temperature flows out of the water cooler through the cooling outlet 9b and then sequentially enters the water cooling plate 14 through the water outlet joint 12 and the first interface 14a of the water cooling plate. In the water-cooled plate 14, water flows over the surface of the fins 14f, thereby carrying away the heat dissipated by the CPU 23 (the heat dissipated by the CPU 23 is first transferred by conduction to the fins 14f inside the water-cooled plate 14, and the fins 14f then transfer heat by convection to the water flowing over the fins 14 f). The temperature of the water after absorbing the heat of the CPU 23 is raised, and the water with the raised temperature flows out of the water cooling plate 14 through the second interface 14b of the water cooling plate, and then returns to the optical drive water tank 13 through the water tank return port 13b and is mixed with the water in the optical drive water tank 13, thereby forming a closed water path circulation. The water mixed in the CD-ROM drive water tank 13 is continuously sucked by the micro pump 7 and pumped into the water cooler 9 to be cooled again, so that the CPU of the computer can be continuously cooled. In the water-air heat dissipation mode, the CPU 23 is cooled, but the temperature of the CPU 23 is always higher than the ambient air temperature because the water temperature at the outlet of the water cooler 9 cannot be lower than the ambient air temperature.

(II) condensation heat dissipation mode

When the heat productivity of the CPU 23 is large or the surface temperature of the CPU is required to be lower than the ambient air temperature, the computer CPU cooling device works in a condensation heat dissipation mode. At this time, the three-way valve 8 is in the second conduction state, that is, the first valve port 8a and the third valve port 8c are communicated, the second valve port 8b is closed, and the micro pump 7, the fan 4, and the micro refrigeration compressor 2 are all operated.

In the condensation heat dissipation mode, the micropump 7 absorbs water from the CD-ROM position water tank 13 and pumps the water into the evaporator 6, namely, the water in the water tank flows through the water tank water outlet 13a, the water return joint 11, the pump inlet 7a, the micro tip 7, the pump outlet 7b, the first valve port 8a, the third valve port 8c and the water side inlet 6c in sequence so as to enter the evaporator 6.

When the micro dc refrigeration compressor 2 is operated, refrigerant gas introduced into the compressor through the compressor inlet port 2a is compressed into high-temperature and high-pressure gas, discharged from the compressor outlet port 2b, and introduced into the condenser 3. In the condenser 3, the refrigerant gas of high temperature and high pressure releases heat to the air flow forced to flow by the fan 4, and the refrigerant is condensed and turns into liquid of high temperature and high pressure. When the high-temperature and high-pressure refrigerant liquid passes through the throttling element 5, the pressure is reduced, and part of the refrigerant liquid flashes out to become a low-pressure gas-liquid mixture. The low-pressure refrigerant mixture enters the evaporator 6 through the evaporation inlet 6a, and in the evaporator 6, the low-pressure refrigerant mixture absorbs the heat of the water side, so that the temperature of the water flowing in from the water side inlet 6c and flowing out from the water side outlet 6d is reduced, and the water is changed into low-temperature cold water; the refrigerant mixture that has absorbed the heat of the water is totally vaporized and becomes a completely gaseous refrigerant. The gaseous refrigerant is sucked into the compressor from the suction port 2a of the micro dc refrigeration compressor and is compressed again. The operation is repeated in a circulating way.

The low-temperature cold water flowing out of the water side outlet 6d of the evaporator 6 sequentially enters the water cooling plate 14 through the water outlet joint 12 and the first interface 14a of the water cooling plate. In the water-cooled plate 14, cold water flows over the surface of the fins 14f, thereby carrying away the heat dissipated by the CPU 23 (the heat dissipated by the CPU 23 is first transferred by conduction to the fins 14f inside the water-cooled plate 14, and the fins 14f then transfer heat by convection to the cold water flowing over the fins 14 f). The temperature of the water after absorbing the heat of the CPU 23 rises, and the water flows out of the water cooling plate 14 through the second interface 14b of the water cooling plate, and then returns to the optical drive level water tank 13 through the water tank return port 13b and is mixed with the water in the optical drive level water tank 13, thereby forming a closed water path circulation. The water mixed in the CD-ROM drive water tank 13 is continuously sucked by the micro pump 7 and pumped into the evaporator 6 to be cooled again, so that the CPU of the computer can be continuously cooled.

In the condensation heat dissipation mode, the heat dissipated by the CPU 23 is firstly transferred to the fins 14f of the water cooling plate 14 in a heat conduction manner, the fins 14f then transfer the heat to the water in a convection manner, then the water transfers the heat to the refrigerant in the evaporator 6 in a manner of evaporating the refrigerant and absorbing heat, and finally the refrigerant finally dissipates the heat to the ambient air in a manner of condensation heat dissipation in the condenser 3, thereby cooling the CPU. Since the temperature at which the refrigerant evaporates can be lower than ambient temperature, cold water at a temperature lower than ambient temperature is available, allowing the CPU to be cooled below ambient air temperature.

As shown in fig. 2, according to the first alternative embodiment of the present invention, the water pipelines between the water inlet joint 11, the water outlet joint 12, the optical drive level water tank 13 and the water cooling plate 14 may also be connected as follows: the water outlet joint 12 is connected with a water tank return port 13b through a pipeline, a water tank water outlet 13a is connected with a water cooling plate second interface 14b through a pipeline, and a water cooling plate first interface 14a is connected with the water return joint 11 through a pipeline. In this embodiment, the water with a lower temperature from the water cooler 9 or the evaporator 6 enters the optical drive level tank 13, mixes with the water stored in the optical drive level tank 13, and enters the water cooling plate 14 to take away the heat of the CPU 23. In this embodiment, the temperature of the water entering the water-cooled panels 14 is increased compared to the first embodiment, but the advantage is that the temperature of the water entering the water-cooled panels 14 is more constant, thus contributing to the temperature stability of the CPU 23.

As shown in fig. 3, according to the second alternative embodiment of the present invention, the water pipelines between the water inlet joint 11, the water outlet joint 12, the optical drive level water tank 13 and the water cooling plate 14 may also be connected as follows: the water outlet joint 12 is connected with the second water-cooling plate interface 14b through a pipeline, the first water-cooling plate interface 14a is connected with the water return joint 11 through a pipeline, and the water outlet 13a of the water tank is connected with the pipeline between the water outlet joint 12 and the second water-cooling plate interface 14b through a pipeline. In this embodiment, the lower temperature water from the water cooler 9 or evaporator 6 directly enters the water cooling plate 14, and after absorbing heat from the CPU 23 in the water cooling plate 14, directly returns to the micro pump 7. In this embodiment, the cd-rom drive level water tank 13 functions as an expansion water tank: when the water temperature in the water pipeline is higher and the volume of the water expands, the redundant water is stored in the optical drive position water tank 13, and the water level in the optical drive position water tank 13 rises; when the water temperature in the water pipeline is lower and the volume of the water in the water pipeline is reduced, the CD-ROM drive water tank 13 supplements water to the water pipeline again, thereby maintaining the constant water pressure in the whole water pipeline.

As shown in fig. 4, the three-way valve 8 can also be replaced by two shut-off valves (shut-off valve 18 and shut-off valve 19) according to a third alternative embodiment of the invention. When the cut-off valve 18 is on and the cut-off valve 19 is off, corresponding to a first on state of the three-way valve 8; when the shut-off valve 18 is closed and the shut-off valve 19 is open, this corresponds to a second open state of the three-way valve 8. The operation is similar to that of the first embodiment and will not be described herein.

In all the above embodiments, the air duct 10 is an air circulation path that ensures that the air entering the cabinet 1 can all flow through the condenser 3 and the water cooler 9 to avoid short-circuiting of the air flow. The technical solution of the present invention does not limit the shape of the air duct 10. According to an alternative embodiment of the present invention, when one end of the air duct 10 is connected to the air inlet 1a of the box 1 and the other end is communicated with the inside of the box 1, and the condenser 3 and the water cooler 9 are still disposed in the air duct 10, the technical solution of the present invention can still work normally.

The computer CPU cooling device of the invention adopts the micro vapor compression refrigeration cycle which takes the micro direct current compressor as the core as the cold source, has the advantages of large refrigerating capacity, high refrigerating efficiency and compact equipment, solves the defects that the CPU can not be cooled below the environmental temperature and the heat dissipation capacity is limited by the conventional water cooling heat dissipation mode, and can also adopt the conventional heat dissipation mode without starting the compressor for refrigeration when the heat productivity of the CPU is not large, thereby greatly reducing the energy consumption. In addition, the computer CPU cooling device of the invention utilizes the reserved CD-ROM drive position on the computer case as the installation position of the water tank, thereby saving the installation space and leading the whole device to be more compact. Compared with the cooling method that the refrigerant is directly evaporated on the surface of the CPU, the technical scheme of the invention adopts the cold water for indirect cooling and adopts the water tank with large capacity as the buffer, so that the temperature fluctuation is smaller, the higher temperature control precision can be realized, the cold and hot impact on the CPU is avoided, and the phenomenon that the condensed water appears on the surface of the cold plate due to the over-low temperature is also avoided.

The technical proposal of the invention is not limited to the cooling of the computer CPU, and can also be used for cooling other chips with larger heat productivity, such as a GPU (graphic processing unit), a DSP (digital signal processor), an NPU (embedded neural network processor), an IGBT and the like.

In the above, any reference to "connection" of a refrigeration circuit or water circuit means connection through a hollow pipe. In this document, the terms inner, outer, middle, upper and lower are used to define the components in the drawings and the positions of the components relative to each other, and are only used for the sake of clarity and convenience in technical solution. It is to be understood that the use of the directional terms should not be taken to limit the scope of the claims.

The above description is only exemplary of the invention and should not be taken as limiting the invention, as any modification, equivalent replacement, or improvement made within the spirit and principle of the invention should be included in the protection scope of the invention.

Claims

1. The utility model provides a computer CPU cooling device comprises box, miniature direct current compressor, condenser, fan, throttling element, evaporimeter, micropump, three-way valve, water cooler, wind channel, return water joint, water connectors, CD-ROM position water tank, water-cooling board, fastener etc. characterized by: the miniature direct-current refrigeration compressor, the throttling element, the evaporator, the miniature pump, the three-way valve and the air channel are arranged in the box body, the condenser, the water cooler and the fan are arranged in the air channel, the water return joint and the water outlet joint are arranged on the box body, and the CD-ROM position water tank, the water cooling plate and the fastening piece are arranged in a computer case needing cooling; the water cooling plate is provided with a first water cooling plate interface and a second water cooling plate interface, and the water cooling plate is attached to the surface of the CPU to be cooled through the fastener and is fixed on a computer mainboard in the computer case together with the CPU; the box body is provided with an air inlet and an air outlet; one end of the air duct is connected with the air outlet, windward surfaces of the condenser and the water cooler are parallel to each other, and the normal directions of the windward surfaces of the condenser and the water cooler are consistent with the axial direction of the fan or the air duct; after flowing into the interior of the box body from the air inlet of the box body, the air flows through the condenser and the water cooler in sequence and then flows out of the box body through the fan and the air outlet on the box body.

2. The computer CPU cooling apparatus of claim 1, wherein: the micro direct-current refrigeration compressor is provided with a compressor air suction port and a compressor exhaust port, the condenser is provided with a condenser inlet and a condenser outlet, the throttling element is provided with a throttling inlet and a throttling outlet, and the evaporator is provided with an evaporation inlet, an evaporation outlet, a water side inlet and a water side outlet; the air exhaust port of the compressor, the inlet of the condenser, the outlet of the condenser, the throttle inlet, the throttle outlet, the evaporation inlet of the evaporator, the evaporation outlet of the evaporator and the air suction port of the compressor are sequentially connected to form a closed refrigeration loop, and a refrigerant is filled in the refrigeration loop.

3. The computer CPU cooling apparatus of claim 1, wherein: the micropump has a pump inlet and a pump outlet, the three-way valve has a first valve port, a second valve port and a third valve port, and the water cooler has a cooling inlet and a cooling outlet; the three-way valve has a first conduction state and a second conduction state, wherein in the first conduction state, the first valve port is communicated with the second valve port, the third valve port is closed, and in the second conduction state, the first valve port is communicated with the third valve port, and the second valve port is closed; the pump inlet of the micropump is connected with a water return joint arranged on the box body, the pump outlet of the micropump is connected with a first valve port of the three-way valve, a second valve port of the three-way valve is connected with a cooling inlet of the water cooler, a third valve port of the three-way valve is connected with a water side inlet of the evaporator, and a water side outlet of the evaporator is connected with a water outlet joint arranged on the box body and a cooling outlet of the water cooler.

4. The computer CPU cooling apparatus of claim 1, wherein: the CD-ROM position water tank is arranged at any CD-ROM mounting position of the computer case; the CD-ROM drive water tank is provided with a water tank water outlet and a water tank water return port; the water tank water outlet is connected with the water return connector on the tank body through a pipeline, the water tank water return port is connected with the water cooling plate second interface through a pipeline, and the water cooling plate first interface is connected with the water outlet connector on the tank body through a pipeline.

5. The computer CPU cooling apparatus according to claim 1 and claim 3, wherein: when the heat productivity of the CPU is smaller or the allowable surface temperature of the CPU is higher, the computer CPU cooling device works in a water-air heat dissipation mode, in the mode, the three-way valve is in a first conduction state, namely the first valve port is communicated with the second valve port, the third valve port is closed, the micro pump and the fan run, the micro refrigeration compressor does not run, the micro pump sucks water with higher temperature from the optical drive position water tank, the water is pumped into the water cooler through the first valve port and the second valve port, in the water cooler, the heat of the water with higher temperature is dissipated to the air in a convection mode to obtain water with lower temperature, and then the water with lower temperature flows into the water cooling plate to take away the heat of the CPU attached to the surface of the water cooling plate.

6. The computer CPU cooling apparatus according to claim 1 and claim 3, wherein: when the heat productivity of the CPU is larger or the surface temperature of the CPU is required to be lower than the ambient air temperature, the computer CPU cooling device works in a condensation heat dissipation mode, in the mode, the three-way valve is in a second conduction state, namely the first valve port is communicated with the third valve port, the second valve port is cut off, the micropump, the fan and the micro refrigeration compressor are all operated, the micropump sucks water from the CD driver position water tank and pumps the water into the evaporator through the first valve port and the third valve port, the water in the evaporator is cooled by the evaporated refrigerant to obtain low-temperature cold water with the temperature lower than the ambient temperature, and the low-temperature cold water with the temperature lower than the ambient temperature flows into the water cooling plate to take away the heat of the CPU attached to the surface of the.