JP2011097109A - Cooling device for electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a compact cooling device which uses refrigeration cycles, and to provide a notebook computer. <P>SOLUTION: The cooling device 40 for electronic apparatus includes: a compressor 41 which compresses a refrigerant; a condenser 42 which liquefies the refrigerant by dissipating heat from the refrigerant compressed by the compressor 41 to the outside; a capillary tube 43 in which the refrigerant liquefied by the condenser 42 is expanded; and an evaporator 44 which receives heat from a semiconductor element to evaporate the refrigerant expanded in the capillary tube 43, wherein at least part of piping connected to the evaporator 44 is positioned above the evaporator 44. Consequently, a liquid refrigerant is retained in the evaporator 44 to advantageously cool a CPU 36 with the retained liquid refrigerant (refrigerant in a liquid state). <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic device cooling device and an electronic device, and more particularly to an electronic device cooling device using a refrigeration cycle.

  In recent years, advances in functionality and miniaturization of notebook computers have been remarkable. With the increase in functionality of notebook computers, CPUs (Central Processing Units) have become faster and more multifunctional, and the amount of heat generated from the CPU has increased.

  Therefore, conventionally, in order to suppress an increase in the temperature of the CPU, a heat radiating fin having excellent heat radiating properties is attached to the surface of the CPU, and air is blown to the heat radiating fin by a rotating blower fan. Moreover, after performing heat transport using a heat pipe, heat was radiated by a radiation fin. By taking such measures, for example, the temperature rise of a CPU with power consumption of about 60 W can be suppressed to about 70 ° C. or less.

  However, the amount of heat generated by the recent CPU has increased to, for example, about 100 W, and there has been a problem that the CPU is not sufficiently cooled by the above-described heat dissipation method using a blower fan or a heat pipe. Furthermore, even if the CPU can be sufficiently cooled, there is a problem that the cooling device for cooling the CPU is enlarged.

Other methods for suppressing the temperature rise of the CPU include a method using a water cooling cycle and a method using a refrigeration cycle. Since these methods can cool the CPU more efficiently than the method using the blower fan described above, the temperature of the CPU that generates a large amount of heat can be kept below a certain level. Patent Document 1 listed below discloses technical matters for cooling a semiconductor device using a refrigeration cycle.
JP-A-2002-198478

  However, the cooling device using the above-described refrigeration cycle has a problem that it is difficult to incorporate the cooling device into a small notebook computer because of its complicated structure. Specifically, in a cooling device using a refrigeration cycle, a compressor that compresses the refrigerant, an evaporator that takes heat from the radiator, a condenser that takes heat from the refrigerant, an expansion means that expands the refrigerant, a blower fan, and the like are required. It is said. On the other hand, in a notebook computer, it is necessary to store a large number of electronic components such as an HDD (Hard Disk Drive) and a disk drive device in a small casing, and the space that can be used for the cooling device is limited. Therefore, it has been difficult to store a cooling device using a refrigeration cycle, which requires a large number of parts, in the case of a small notebook computer.

  Moreover, in a cooling device using a refrigeration cycle, heat is extracted from a compressed high-temperature refrigerant using a fan, so that the temperature of air discharged from the cooling device is, for example, about 50 ° C. to 60 ° C. or higher. . When a user who uses a computer touches such high-temperature air, the user may be burned. Therefore, there is a problem that the air discharged from the cooling device cannot be discharged in any direction.

  The present invention has been made in view of the above problems, and a main object of the present invention is to provide a small cooling device and electronic apparatus using a refrigeration cycle.

  The electronic device cooling apparatus according to the present invention includes a compression unit that compresses the refrigerant, a condensation unit that releases heat from the refrigerant compressed by the compression unit to liquefy, and the refrigerant liquefied by the condensation unit. And expansion means for receiving heat from a semiconductor element and evaporating the refrigerant expanded by the expansion means, and at least a part of a pipe connected to the evaporation means includes the evaporation means It is characterized by being located above.

  Furthermore, the electronic device cooling apparatus of the present invention is liquefied by the compression means for compressing the refrigerant, the condensation means for releasing heat from the refrigerant compressed by the compression means to liquefy, and the condensation means. An expansion unit configured to expand the refrigerant; and an evaporation unit configured to receive heat from a semiconductor element and evaporate the refrigerant expanded by the expansion unit. The compression unit, the condensing unit, and the evaporation unit are on one plane. The compression means is composed of a rotary compressor placed horizontally with respect to the one plane, and the rotary compressor has an introduction portion into which the refrigerant is introduced, and the refrigerant is led out. A derivation unit, wherein the derivation unit is provided above the rotational axis center of the rotary compressor.

  Furthermore, the electronic device cooling apparatus of the present invention is liquefied by the compression means for compressing the refrigerant, the condensation means for releasing heat from the refrigerant compressed by the compression means to liquefy, and the condensation means. An expansion unit configured to expand the refrigerant; and an evaporation unit configured to receive heat from a semiconductor element and evaporate the refrigerant expanded by the expansion unit. The compression unit, the condensing unit, and the evaporation unit are on one plane. The compression means is composed of a rotary compressor placed horizontally with respect to the one plane, and the rotary compressor has an introduction portion into which the refrigerant is introduced, and the refrigerant is led out. A lead-out part, and the introduction part is provided below the rotational axis center of the rotary compressor.

  According to the electronic apparatus cooling apparatus of the present invention, at least a part of the pipe connecting the capillary tube and the evaporator is positioned above the evaporator. Furthermore, at least a part of the pipe connecting the evaporator and the compressor is positioned above the evaporator. Thus, there is an advantage that the liquid refrigerant is stored inside the pipe and the evaporator, and the CPU 36 is cooled by the stored liquid refrigerant (liquid refrigerant).

(A) is a top view which shows the computer which concerns on embodiment of this invention, (B) is a top view which shows the cooling device which concerns on embodiment of this invention. (A) is the perspective view which shows the cooling device which concerns on embodiment of this invention, (B) is the perspective view which looked at the computer which concerns on embodiment of this invention from the downward direction. (A) is the figure which looked at the computer which concerns on embodiment of this invention from the front, (B) is sectional drawing of the part in which a cooling device is provided. (A) is a top view of the rotary compressor which concerns on embodiment of this invention, (B) is the sectional drawing. (A) And (B) is a top view which shows the cooling device which concerns on embodiment of this invention. It is a figure which shows the electrical constitution of the cooling device which concerns on embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the present invention, a notebook computer will be described as an example of an electronic apparatus. However, the present embodiment can also be applied to other electronic apparatuses. For example, the present embodiment can be applied to a desktop computer, a PDA (Personal Digital Assistant), or the like.

  FIG. 1 is a diagram showing a notebook computer 10 (hereinafter abbreviated as a computer) of this embodiment. FIG. 1A is a plan view of the computer 10 viewed from above, and FIG. 1B is a plan view showing a cooling device 40 built in the computer 10.

  Referring to FIG. 1A, a computer 10 according to the present embodiment includes a casing unit 30 in which a functional element with heat generation such as a CPU 36 is incorporated, and a display unit 20 that is rotatably connected to the casing unit 30. Consists of.

  The display unit 20 includes a display such as a liquid crystal display or an organic EL (Electro Luminescence) display.

The casing unit 30 contains electronic components that constitute the computer 10. Specifically, a motherboard 31, a CD (Compact Disc) ROM drive 32, a battery 33, an HDD 34, an FDD (Floppy (registered trademark) Disk Drive) 35, a cooling device 40, a CPU 36, and the like are built in the housing unit 30. These components built in the housing unit 30 are arranged at different positions in a plan view. In addition, a PC card reader, a semiconductor memory, a cable for connecting them to each other, and the like are also built in the housing unit 30. Among the electronic components built in the housing unit 30, the CPU 36 has a particularly large calorific value, and the cooling device 40 is provided to radiate heat from the CPU 36.

  The planar sizes of the display unit 20 and the housing unit 30 are substantially the same, and when the display unit 20 and the housing unit 30 are folded, a single housing is obtained as a whole. The planar size of the computer 10 in a state in which the housing unit 30 and the display unit 20 are folded is, for example, A4 size (210 mm × 290 mm) or B5 size (182 mm × 257 mm). Although not shown here, a pointing device such as a keyboard or a pad is disposed on the upper surface of the housing 30.

  The configuration of the cooling device 40 will be described with reference to FIG. The cooling device 40 includes a compressor 41 (compression unit), a condenser 42 (condensing unit), an evaporator 44 (evaporating unit), a capillary tube 43 (expansion unit), and a blower fan 45 (blower unit). Become. Further, these devices constituting the cooling device 40 are connected to each other by a tubular pipe 46.

  The compressor 41 has a function of compressing a refrigerant composed of introduced ammonia, chlorofluorocarbon, carbon dioxide, and the like. As the compressor 41, a rotary type (rotary type) compressor or a reciprocating type (reciprocating type) compressor is employed. In this embodiment, a rotary compressor arranged horizontally is adopted as the compressor 41. Since the rotary compressor is relatively small, it is suitable as the compressor 41 built in a notebook computer. Details of the compressor 41 will be described later.

  Further, the compressor 41 includes an introduction part 48 into which a refrigerant is introduced from the outside and a lead-out part 47 from which the refrigerant compressed inside is led out. In this embodiment, the lead-out portion 47 of the compressor 41 is disposed at a position closer to the condenser 42 than the introduction portion 48. By doing in this way, the derivation | leading-out part 47 of the compressor 41 and the condenser 42 approach. Therefore, the refrigerant compressed by the compressor 41 can be immediately supplied to the condenser 42.

  Here, the derivation unit 47 is not necessarily provided on the condenser 42 side, and the position of the derivation unit 47 may be changed according to the configuration of the compressor 41. That is, the lead-out part 47 may be provided farther from the condenser 42 than the introduction part 48. In this case, the lead-out part 47 is provided in the compressor 41 below the introduction part 48 on the paper surface.

  Here, the compressor 41 is arranged on the left side (near the left end) inside the casing 30 and is arranged so that its longitudinal direction is substantially parallel to the side of the casing 30. However, this arrangement can be changed. That is, the compressor 41 may be disposed in the right side (near the right end) in the housing 30 so that the longitudinal direction thereof is parallel to the side surface of the housing 30. .

The condenser 42 has a function of releasing heat from the refrigerant compressed by the compressor 41 to condense and liquefy the refrigerant. The condenser 42 is formed by arranging a plurality of metal plates in parallel with each other. And the metal plate which comprises the condenser 42 is thermally couple | bonded with the piping 46 through which a refrigerant | coolant passes. In the figure, the condenser 42 is disposed in the vicinity of the rear end portion inside the housing portion 30 and the longitudinal direction thereof is disposed substantially parallel to the side surface of the housing portion 30. You can also That is, the condenser 42 is disposed on the left side (near the left end) or the right side (near the right end) in the housing 30, and the longitudinal direction of the condenser 42 is the housing 30.
You may arrange | position so that it may become parallel to the side surface.

  The capillary tube 43 has a function of expanding the refrigerant. Here, the capillary tube 43 is disposed in a circular shape above the blower fan 45. By arranging the capillary tube 43 above the blower fan 45, the planar size of the cooling device 40 can be reduced.

  The evaporator 44 is thermally coupled to electronic components that generate heat, such as the CPU 36. Therefore, when the evaporator 44 receives the heat generated from the CPU 36, the refrigerant changes from a liquid state to a gas state in the evaporator 44. Here, the evaporator 44 is disposed at a position overlapping the CPU 36.

  The blower fan 45 has a function of taking in low-temperature air from the outside of the housing unit 30 and blowing this low-temperature air to the condenser 42 and the compressor 41. Air that has been heated to high temperatures by receiving heat from the condenser 42 and the compressor 41 is discharged to the outside from the side of the casing 30.

The operation of the cooling device 40 configured as described above is as follows. When the cooling device 40 is operated to cool the CPU 36 and the like, first, the refrigerant is brought into a high temperature and high pressure state by the compressor 41. The high-temperature and high-pressure refrigerant is sent to the condenser 42 through the pipe 46. In the condenser 42, the refrigerant is liquefied by the cooling action of the low-temperature air sent from the blower fan 45. The liquid state refrigerant is sent to the capillary tube 43 via the pipe 46. In the capillary tube 43, the refrigerant is expanded to a low pressure / low temperature state, and this refrigerant is sent to the evaporator 44. In the evaporator 44, the heat generated from the CPU 36 is received by the refrigerant. As a result, the refrigerant evaporates into a gaseous state, and the gaseous refrigerant is sent to the compressor 41 again.

  By operating the cooling device 40 as described above, the CPU 36 is cooled. In this embodiment, by adopting the cooling device 40 of the refrigeration system, for example, the CPU 36 whose power consumption is about 60 W to 200 W can be sufficiently cooled.

  In the cooling device 40 of this embodiment, the compressor 41, the condenser 42 and the blower fan 45 are arranged at different positions in a plane, and the longitudinal direction of the compressor 41 and the condenser 42 is in the vicinity of the blower fan 45. And arranged in an L shape. Thereby, the planar size of the cooling device 40 can be made compact, and the cooling device 40 can be prevented from obstructing the layout of other components built in the housing unit 30. Further, the longitudinal direction of the compressor 41 and the condenser 42 may be arranged in an L shape at a place other than the vicinity of the blower fan 45.

  Specifically, the compressor 41 and the condenser 42 are relatively large among the components constituting the cooling device 40. Therefore, when such a large component is arranged so as to protrude to the periphery, the area occupied by the cooling device 40 in the housing portion 30 increases, and the layout of other components is limited. . Accordingly, by arranging the longitudinal direction of the compressor 41 and the condenser 42 to be L-shaped, the planar size of the cooling device 40 becomes compact, and the protruding portion is eliminated.

  Further, the compressor 41 and the condenser 42 are parts cooled by the blower fan 45. Therefore, by arranging the compressor 41 and the condenser 42 in an L shape in the vicinity of the blower fan 45, there is an advantage that the effect of cooling by the blower fan can be increased.

  Furthermore, the cooling device 40 is arranged in an integrated manner at the left rear end in the housing 30. By disposing the cooling device 40 at such a position, it is possible to prevent other electronic components such as the HDD 34 from being adversely affected by the heat generated from the cooling device 40 due to the heat generated from the cooling device 40. . Here, the cooling device 40 may be disposed at a place other than the rear left side. That is, the place where the cooling device 40 is disposed may be the rear right side, the front left side, or the front right side inside the housing unit 30.

  Further, the arrangement of the condenser 42 and the compressor 41 may be switched. That is, the compressor 41 is disposed behind the interior of the housing 30 and the longitudinal direction thereof is disposed in parallel with the side surface of the housing 30. Further, the condenser 42 may be arranged on the right side or the left side inside the housing unit 30, and the longitudinal direction thereof may be arranged parallel to the side surface of the housing unit 30.

  Next, the structure of the computer 10 will be described with a focus on the blower fan 45 with reference to FIG. FIG. 2A is a perspective view showing a portion in which the cooling device 40 is built in the computer 10, and FIG. 2B is a perspective view of the computer 10 as viewed obliquely from below.

  Referring to FIG. 2A, the condenser 42 is disposed in the vicinity of the rear end portion inside the housing portion 30. Further, the longitudinal direction of the condenser 42 is disposed substantially parallel to the rear side surface of the housing unit 30. As a result, the air blown to the condenser 42 by the blower fan 45 receives heat from the condenser 42 and is heated to a high temperature, and then is discharged to the outside from the rear of the housing unit 30. Here, as described above, the positional relationship between the condenser 42 and the compressor 41 may be switched.

Further, the compressor 41 is disposed in the vicinity of the left end portion of the housing unit 30, and the longitudinal direction of the compressor 41 is disposed substantially parallel to the left side surface of the housing unit 30. Therefore, the air blown to the compressor 41 from the blower fan 45 is released to the outside of the housing unit 30 after receiving the heat of the compressor 41.

  As described above, the condenser 42 and the compressor 41 that generate heat in accordance with the operation of the cooling device 40 are disposed in the peripheral portion of the housing 30. By doing in this way, the air blown by the ventilation fan 45 and made high temperature can be immediately discharged | emitted to the exterior of the housing | casing part 30. FIG. Therefore, it is possible to prevent the entire casing 30 from being heated due to heat generated by the condenser 42 and the compressor 41.

  With reference to FIG. 2B, the blower fan 45 takes outside low-temperature air into the inside of the housing portion 30 from the air inlet 39 provided on the bottom surface of the housing portion 30. Further, the air heated to a high temperature by cooling the condenser 42 and the compressor 41 is discharged to the outside from the exhaust ports 37 and 38 provided on the side of the housing unit 30. In the intake port 39 and the exhaust ports 37 and 38, a large number of slits are provided in the housing 30.

  By providing the exhaust port 38 at the rear part of the housing unit 30, the hot air heated by receiving the heat of the condenser 42 is exhausted to the rear of the computer 10. Accordingly, since heated air is not discharged toward the user located in front of the computer 10, the user can be prevented from being injured such as a burn. In addition, the air that has been heated to receive heat from the condenser 42 may be discharged to the outside from the right side or the left side of the casing 30.

Further, by providing the exhaust port 37 on the left side of the housing unit 30, the air that has cooled the compressor 41 and has reached a high temperature is discharged to the outside from the left side of the computer 10. On the other hand, a normal user operates a pointing device such as a mouse with the right hand. Therefore, since the high-temperature air discharged from the exhaust port 37 does not touch the user's hand using the mouse, the user can be prevented from being burned. Further, the exhaust port 37 may be provided on the right side of the housing unit 30.

  As described above, the air discharged from the cooling device 40 using the refrigeration cycle is at a high temperature, for example, about 50 ° C to 60 ° C. Therefore, by providing the exhaust ports 37 and 38 through which the high-temperature gas is exhausted on the left side and the rear side of the housing unit 30, the user does not touch the exhaust, so that a computer configuration safe for the user can be obtained. it can.

  With reference to FIG. 3, the computer 10 will be described focusing on the configuration of the piping. 3A is a view of the computer 10 as viewed from the front, and FIG. 3B is a cross-sectional view of a portion where the cooling device 40 is disposed.

  Referring to FIGS. 3A and 3B, a compressor 41, a condenser 42, a capillary tube 43, and an evaporator 44 constituting the cooling device 40 are connected to each other by a pipe 46. The heat generated from the CPU 36 is transported to the condenser 42 via the refrigerant flowing through the pipe 46 and released to the outside.

  In this embodiment, at least a part of the pipe 46 </ b> A connecting the capillary tube 43 and the evaporator 44 is positioned above the evaporator 44. Further, at least a part of the pipe 46 </ b> B connecting the evaporator 44 and the compressor 41 is positioned above the evaporator 44. As a result, liquid refrigerant is stored inside the pipes 46A and 46B and the evaporator 44, and the CPU 36 is cooled by the stored liquid refrigerant (liquid refrigerant).

Specifically, the pipes 46A and 46B are manufactured by forming a metal such as copper into a pipe shape,
At least a portion thereof is located above the upper surface of the evaporator 44 that cools the CPU 36. While the cooling device 40 is operating, the refrigerant passes through the pipes 46A and 46B. When the computer 10 is shut down and the cooling device 40 is stopped, liquid refrigerant remains in the pipes 46 </ b> A and 46 </ b> B and the evaporator 44. When the computer 10 is operated again, the CPU 36 is cooled using the evaporator 44 by the liquid refrigerant remaining inside the pipes 46 </ b> A and 46 </ b> B and the evaporator 44.

  Specifically, when the computer 10 is started up, the CPU 36 is most actively operated and heated. This is because the CPU 36 is set to operate actively when the computer is started in response to a request from a user who wants to start the computer early.

  It is sufficient that the cooling device 40 immediately operates and the CPU 36 is cooled in synchronization with the activation of the computer 10, but in reality, there may be a time difference from the activation of the computer 10 to the operation of the cooling device 40. For this reason, if the CPU 36 operates actively immediately after the computer is started and the cooling device 40 does not perform cooling, the CPU 36 may become excessively hot. Therefore, in this embodiment, the pipes 46 </ b> A and 46 </ b> B that supply the refrigerant to the evaporator 44 that cools the CPU 36 are positioned above the evaporator 44. Thus, when the cooling device 40 is stopped, the liquid liquid refrigerant is stored in the pipes 46 </ b> A and 46 </ b> B and the evaporator 44. When the computer is restarted, the CPU 36 is cooled for a certain time by the liquid refrigerant stored in the pipes 46A and 46B and the evaporator 44 even if the cooling device 40 is not operating. Therefore, overheating of the CPU 36 when the computer is restarted is prevented.

  In the above description, both the pipes 46A and 46B are located above the evaporator 44, but only one of the pipes 46A and 46B may be located above the evaporator 44. In addition, when both the pipes 46A and 46B are positioned above the evaporator 44, a larger amount of liquid refrigerant is stored, which has the advantage of increasing the cooling effect described above.

  With reference to FIG. 4, the detail of the rotary compressor 41 employ | adopted as a compressor of this form is demonstrated. 4A is a plan view showing the structure of the rotary compressor 41, and FIG. 4B is a cross-sectional view of the pump portion of the rotary compressor.

  With reference to FIG. 4A, the rotary compressor 41 includes a motor unit 50 and a pump unit 51 driven by the motor unit 50. The motor unit 50 incorporates a motor that is rotated by the electric power supplied from the terminal 52. The pump unit 51 is a part that compresses refrigerant introduced from the outside, and is operated by the driving force of the motor unit 50. The introduction part 48 is a part where the expanded refrigerant is introduced into the rotary compressor 41 from the outside. The lead-out part 47 is a part from which the refrigerant compressed by the rotary compressor 41 is taken out. Each element constituting the motor unit 50 and the pump unit 51 is housed in a substantially cylindrical case 57.

  With reference to FIG. 4 (B), the structure of the pump part 51 is demonstrated. The pump unit 51 includes a cylinder 53 housed inside the case 57 and a roller 56 that is housed in the cylinder 53 and rotates. A cylinder chamber 55 is provided between the roller 53 and the inside of the cylinder 53. A shaft 62 having a circular cross section is provided inside the roller 56, and the position of the shaft 62 is fixed. In the inside of the cylinder 53, a vane 54 is provided to partition the cylinder chamber 55 in which the compressed refrigerant is located and the cylinder chamber 55 in which the uncompressed refrigerant is located. The vane 54 is provided so as to be able to perform a sliding motion in the vertical direction.

  Inside the cylinder 53, the roller 56 whose inner wall contacts the shaft 62 rotates eccentrically, whereby the refrigerant introduced from the introduction portion 48 is compressed. Then, the refrigerant compressed in the cylinder chamber 55 is filled into the case 57 from the notch 60 and discharged from the lead-out portion 47 to the outside. The notch 60 is a part in which a part of the cylinder 53 is notched in order to transfer the refrigerant inside the cylinder chamber 55 to the case 57. Further, in order to facilitate the rotation of the roller 56, lubricating oil is stored inside the case 57.

  In this embodiment, a lead-out portion 47 through which the compressed refrigerant is led out is provided above the rotation shaft center 58 of the rotary compressor 41. Here, the rotation axis center 58 is the center of the shaft 62, in other words, the center of the case 57. As a result, it is possible to prevent the lubricating oil from being mixed into the refrigerant discharged from the outlet 47 to the outside.

Specifically, as shown in FIG. 1, the rotary compressor 41 is disposed horizontally with respect to one plane on which the condenser 42, the blower fan 45, and the like are placed. Therefore, the lubricating oil located inside the case 57 is located below due to the influence of gravity. For this reason, if the outlet 47 for extracting the refrigerant to the outside is provided at the lower portion of the rotary compressor 41, a large amount of lubricating oil may be mixed into the extracted refrigerant. If a large amount of lubricating oil is mixed in the refrigerant to be taken out, the amount of lubricating oil in the rotary compressor 41 is lowered, the function of the compressor is lowered, and the CPU may not be sufficiently cooled. Therefore, in this embodiment, the lead-out portion 47 is provided on the upper portion of the case 57. This prevents a large amount of lubricating oil from being mixed into the derived refrigerant.

  Further, as described above, the cylinder chamber 55 is defined by the vane 54 so that the introduction portion 48 is disposed in the case 57 below the rotation shaft center 58.

  With reference to FIG. 5, the other form of the cooling device 40 is demonstrated. FIG. 5A and FIG. 5B are diagrams showing a cooling device 40 of another form.

  Referring to FIG. 5A, here, two blower fans 45A and 45B are provided. By providing the two blower fans 45A and 45B in this manner, the amount of air blown to the condenser 42 is increased, so that the function of cooling the cooling device 40 can be further improved. Here, the two blower fans 45A and 45B are arranged adjacent to each other, but may be arranged apart from each other. Further, three or more blower fans may be provided.

  Referring to FIG. 5B, here, a pipe 46 </ b> C connecting the compressor 41 and the evaporator 44 is in contact with the memory 49. As a result, the heat generated from the memory 49 is received by the refrigerant passing through the inside of the pipe 46C, and the memory 49 is cooled. Here, the memory 49 is cooled by the pipe 46C, but electrical equipment other than the memory can be cooled by the pipe 46C. For example, a chip set controlled by the CPU 36, an element that performs graphic control, and the like can be cooled by the pipe 46C.

  With reference to FIG. 6, the operation of the computer 10 will be described focusing on the cooling action of the CPU 36. Here, the microcomputer 59 controls the rotation of the compressor 41 and the blower fan 45 based on the temperature information of the CPU 36. As a result, the rotational speeds of the blower fan 45 and the compressor 41 are made different depending on whether the temperature of the CPU 36 is low or high.

  Specifically, as described above, the heat generated from the functional element that generates heat, such as the CPU 36, is received by the refrigerant through the evaporator 44 of the cooling device 40. Inside the cooling device 40, the refrigerant circulates between the evaporator 44, the compressor 41, the condenser 42, and the capillary tube 43 while repeating expansion and compression. Further, the blower fan 45 blows air onto the condenser 42 to release the heat of the refrigerant to the outside. Furthermore, the motor built in the compressor 41 is controlled by the inverter 61.

With the configuration of the present embodiment described above, the temperature of the CPU 36 can be kept constant or lower (for example, 70 ° C. or lower). However, the amount of heat generated by the CPU 36 is not constant. That is, the amount of heat generation increases when the CPU 36 operates actively, and the amount of heat generation decreases when the CPU 36 does not operate actively. For this reason, if the motor included in the compressor 41 and the rotation speed of the sending fan 45 are slow, when the amount of heat generated by the CPU 36 temporarily increases, the cooling capacity of the cooling device 40 becomes insufficient, and the temperature of the CPU 36 May rise. In order to prevent this phenomenon, if the rotation speed of the motor and the blower fan 45 included in the compressor 41 is always increased, the temperature rise of the CPU 36 can be suppressed, but the power consumed by the cooling device 40 increases. There is a risk.

  Therefore, in this embodiment, the rotation speed of the motor and the blower fan 45 included in the compressor 41 is controlled according to the temperature of the CPU 36. That is, as the temperature of the CPU 36 increases, these rotational speeds are increased. By doing in this way, the temperature of CPU36 can be made into between 50 degreeC-70 degreeC, for example. The details are as follows.

  The temperature of the CPU 36 is monitored by a sensor unit (monitoring means) built in the CPU 36 itself, and temperature information indicating the temperature of the CPU 36 is sent to the microcomputer 59 (control means). The microcomputer 59 controls the rotational speeds of the inverter 61 and the blower fan 45.

  For example, when the temperature of the CPU 36 is desired to be between 50 ° C. and 70 ° C. as described above, the rotational speeds of the inverter 61 and the blower fan 45 are controlled by the microcomputer 59 as follows.

  When the temperature of the CPU 36 is lower than 55 ° C. (first temperature), the rotational speeds of the inverter 61 and the blower fan 45 are kept constant based on instructions from the microcomputer 59. The rotation speed at this time is, for example, a rotation speed at which the operation sound generated from the blower fan 45 and the compressor 41 can operate within a quiet range.

  When the temperature of the CPU 36 is 55 ° C. to 65 ° C., the rotation speed of the inverter 61 and the blower fan 45 is increased in proportion to the temperature rise of the CPU 36. Thus, the cooling capacity of the cooling device 40 is adjusted between 55 ° C. and 65 ° C. according to the temperature change of the CPU 36. Therefore, as described above, the temperature of the CPU 36 can be controlled to 50 ° C. to 70 ° C.

  When the temperature of the CPU 36 is 65 ° C. (second temperature) or higher, the rotation speeds of the inverter 61 and the blower fan 45 are kept constant. That is, the motors included in the compressor 41 and the blower fan 45 are rotated at the maximum rotation speed. Thereby, the temperature rise of the CPU 36 can be suppressed.

  The above is the description of the operation of the computer 10 that cools the CPU 36.

DESCRIPTION OF SYMBOLS 10 Computer 20 Display part 30 Case part 31 Motherboard 32 CDROM drive 33 Battery 34 HDD
35 FDD
36 CPU
37 Exhaust port 38 Exhaust port 39 Intake port 40 Cooling device 41 Compressor 42 Condenser 43 Capillary tube 44 Evaporator 45 Blower fan 46 Piping 47 Lead-out part 48 Introduction part 49 Memory 50 Motor part 51 Pump part 52 Terminal 53 Cylinder 54 Vane 55 Cylinder chamber 56 Roller 57 Case 58 Center of rotation axis 59 Microcomputer 60 Notch 61 Inverter 62 Shaft

Claims (5)

  A compression means for compressing the refrigerant; a condensation means for releasing heat from the refrigerant compressed by the compression means to liquefy; an expansion means for expanding the refrigerant liquefied by the condensation means; and a semiconductor element. Evaporating means for receiving heat and evaporating the refrigerant expanded by the expanding means, and at least a part of a pipe connected to the evaporating means is located above the evaporating means, Cooling device for electronic equipment.   2. The electronic apparatus cooling apparatus according to claim 1, wherein the pipe is a pipe connecting the compression means and the evaporation means or / and a pipe connecting the evaporation means and the expansion means.   When the compression means stops, liquid refrigerant remains inside the evaporation means and / or the pipe, and heat from the semiconductor element is received by the evaporation means using the remaining liquid refrigerant. The cooling device for electronic equipment according to claim 1.   A compression means for compressing the refrigerant; a condensation means for releasing heat from the refrigerant compressed by the compression means to liquefy; an expansion means for expanding the refrigerant liquefied by the condensation means; and a semiconductor element. Evaporating means for receiving heat and evaporating the refrigerant expanded by the expansion means, the compression means, the condensing means and the evaporation means are arranged at different positions on one plane, The rotary compressor comprises a rotary compressor placed horizontally with respect to the one plane, and the rotary compressor includes an introduction portion into which the refrigerant is introduced and a lead-out portion from which the refrigerant is led out, A cooling device for electronic equipment, which is provided above the center of a rotary shaft of the rotary compressor. A compression means for compressing the refrigerant; a condensation means for releasing heat from the refrigerant compressed by the compression means to liquefy; an expansion means for expanding the refrigerant liquefied by the condensation means; and a semiconductor element. Evaporating means for receiving heat and evaporating the refrigerant expanded by the expansion means, the compression means, the condensing means and the evaporation means are arranged at different positions on one plane, The rotary compressor comprises a rotary compressor placed laterally with respect to the one plane, and the rotary compressor includes an introduction part into which the refrigerant is introduced, and a lead-out part from which the refrigerant is led out. A cooling apparatus for electronic equipment, which is provided below a rotational axis center of the rotary compressor.