JPH02310613A - Method and device for cooling electronic computer - Google Patents

Abstract

PURPOSE:To reduce a waiting time at the time of starting a computer by using a flow liquid film evaporator for the evaporator of a refrigerating cycle. CONSTITUTION:The evaporator 6 of the refrigerating cycle is set to be the flow liquid film type evaporator. Since, coolant evaporates on the outer surface of a heating tube at the inner part of the dropping liquid film type evaporator, evaporated coolant gas immediately flows into a compressor 7 by piping 5 through the compressor 7 provided in the shell of the evaporator 6. Consequently, coolant gas does not reside in the shell of the evaporator 6, responsiveness is quick, and a system immediately rises at the time of starting a cooler, whereby a cooling quantity in a normal stable state after starting can be quickly obtained. A temperature sensor 30 detects the water temperature of cooling water and an invertor 11 controls the number of revolution of the motor of the compressor 7.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for cooling an LSI that generates heat under a high thermal load, and in particular to an LS device that improves the start-up performance of the cooling device.
This relates to the cooling device of I.

[Conventional technology]

Since a large number of LSIs are used in large-sized computers, the amount of heat dissipated from the LSIs is large, resulting in a large heat load. It has been proposed that this LSI be cooled by direct water cooling by passing cooling water through the back surface of the LSI substrate.

In this case, cooling water is often cooled through a refrigerant such as fluorocarbon, rather than a device consisting of a compressor, a condenser, an evaporator, and an expansion valve.

Cooling systems for cooling computers are often operated in multiple units so that there can be backup measures in the unlikely event of a failure of the cooling system. In addition, in conventional cooling devices, it is considered to use a multi-tube evaporator as equipment that makes up the refrigeration cycle, for example, in the evaporator, refrigerant flows inside the tube and LSI cooling water passes outside the tube. .

This type of technology includes ``Water-cooled multi-chip package, supercomputer sX series implementation wave #J'' (Nikkei Electronics).

” June 17, 1985 issue, pp. 243-266
Page) and Utility Model Application Publication No. 63-127144.

[Problem to be solved by the invention]

When starting up a computer, power supply to the LSI is often started after the amount of cooling in the cooling device has stabilized.

Generally, when the cooling system starts up, the refrigeration cycle is unstable and the amount of cooling is lower than during normal operation. Therefore, it is necessary for the cooling device to secure a large amount of cooling as soon as possible until the computer can start up.

With conventional multi-tube evaporators or flooded shell-and-tube evaporators, the residence time of the refrigerant gas evaporated by the heat of the cooling water becomes longer in the evaporator, making the refrigeration cycle unstable. The disadvantage is that the response is slow. In other words, as shown in FIG. 19, in the case of the multi-tube evaporator 22, even if liquid refrigerant is sent to the heat transfer surface 25 at startup, the evaporated refrigerant gas forms bubbles 26 inside the heat transfer tubes 25 of the multi-tube evaporator. As a result, a large amount of evaporative refrigerant gas necessary for the refrigeration cycle does not immediately flow out from the outlet of the heat transfer tube 25, resulting in a time loss. The red stamp in the figure indicates the direction of flow of refrigerant gas bubbles. In addition, the air bubbles become interposed between the heat transfer wall and the liquid refrigerant, creating thermal resistance and reducing heat exchange efficiency, which increases the required length of the heat transfer tube. As a result, more time is required to evaporate a given amount of refrigerant.

Furthermore, as shown in Fig. 20, even in the liquid-filled shell-and-tube evaporation system, in which the refrigerant liquid fills the shell and evaporates outside the tube [27], when the cooling system is started, the refrigerant is transferred by the warm cooling water inside the tube. A large amount of refrigerant liquid 28 around the heat tube must be heated, and the evaporated refrigerant gas must rise to the surface as bubbles 26 in the refrigerant liquid 28, resulting in a rise in cooling characteristics at startup. Lost time occurs when In addition, this heat exchange takes place with the refrigerant liquid filling the shell, so the refrigerant liquid is almost stationary and a very high heat transfer coefficient cannot be expected. Therefore, the required length of the heat exchanger tube becomes long, and it takes a relatively long time for the refrigerant gas from which the cooling liquid has evaporated to reach the outlet of the evaporator.

On the other hand, in computers and the like, the operating rate of the LSIs they own may fluctuate, and the total amount of heat generated changes accordingly. It is necessary to quickly change the cooling amount of the cooling device in response to the variation in the amount of heat generated by the LSI. If the amount of cooling exceeds the total heat generated by the LSI, the water temperature will become too low and, depending on the environmental conditions such as indoor temperature and humidity, moisture in the air will condense on the solid surface and form condensation. arise.

Conductive moisture generally causes electronic devices to malfunction, so it is necessary to protect them from moisture. Furthermore, if the amount of cooling is too small, the water temperature will rise too much and the LSI will become hot, reducing the reliability of the LSI. In this way, it is necessary to quickly respond to fluctuations in the amount of heat generated by the LSI and perform cooling with an appropriate amount of cooling.

Furthermore, as described above, when a computer that generates a large amount of heat is cooled by a plurality of cooling devices including a backup device for the cooling device, the installation area of the cooling device inevitably becomes large. Among the devices that make up the refrigeration cycle, the area occupied by the heat exchanger greatly affects the area of the cooling device.

Therefore, LSI cooling devices using conventional multi-tube evaporators or flooded shell-and-tube evaporators have limitations in achieving high cooling performance.

SUMMARY OF THE INVENTION An object of the present invention is to provide an LSI cooling device that can reduce waiting time when starting up a computer.

Another object of the present invention is to
The objective is to stably cool the LSI even if the total heat generation amount of the SI changes.

Still another object of the present invention is to obtain an LSI cooling device that can reduce the occupied area.

Still another object of the present invention is to obtain an LSI cooling device that can significantly improve the effect of reducing the area occupied by the device when a plurality of cooling devices are installed.

[Means to solve the problem]

The features of the present invention for achieving the above object include a cooling device equipped with a falling film evaporator, an integrated circuit of an electronic computer,
A cooling fluid passage provided near the integrated circuit and through which a cooling fluid flows for cooling the integrated circuit, and a cooling fluid passage connected to a falling film evaporator of the cooling device to cool the cooling fluid cooled by the evaporator. The cooling device for an electronic computer includes piping for guiding fluid to the cooling fluid passage and for guiding cooling fluid from the cooling fluid passage again to the evaporator.

The second feature of the present invention is a cooling device in which a compressor, a condenser, an expansion valve, and a falling film evaporator are sequentially connected by refrigerant piping, an integrated circuit of an electronic computer, and a cooling device for cooling this integrated circuit. It is equipped with a cooling fluid passage.

The cooling device for an electronic computer cools the cooling fluid in the cooling fluid passage with the falling film type evaporator, and circulates and supplies the cooled cooling fluid to the integrated circuit to cool the integrated circuit.

A third feature of the present invention is that the evaporator includes an evaporator, a condenser, a compressor, and an expansion valve that perform heat exchange between a refrigerant and an external fluid, and the evaporator is configured to conduct heat transfer with cooling water for cooling an electronic computer. This computer cooling device is a falling film type evaporator in which the refrigerant passes through the tube and evaporates as it flows down the outer surface of the heat transfer tube.

A fourth feature of the present invention is that the evaporator includes an evaporator and a condenser that perform heat exchange between a refrigerant and an external fluid, a compressor, an expansion valve, and a cooling water flow path that cools an integrated circuit of a computer. The cooling device for an electronic computer includes a falling liquid film type evaporator of nitric acid in which a refrigerant flows down the outer surface of the heat transfer tube and the cooling water flows through the cooling water flow path inside the heat transfer tube.

A fifth feature of the present invention is to provide a cooling device equipped with a falling film evaporator, and supply the cooling fluid to the integrated circuit portion of the vehicle p calculator after cooling the cooling fluid with the falling film evaporator of the cooling device. Then, the cooling fluid cooled by the falling film type evaporator is integrated by cooling the integrated circuit and returning the cooling fluid after cooling the integrated circuit to the falling film type S* device for recooling. circulates in the circuit.

The problem lies in the cooling method of the electronic counter-meter that supplies the ring.

A sixth feature of the present invention is that the cooling fluid after cooling the integrated circuit is guided to an evaporator, the cooling fluid is caused to flow in the vertical direction within the evaporator, and the cooling fluid is passed through a heat exchange wall to the cooling fluid. is caused to flow down in a thin film, the heat retained by the cooling fluid is imparted to the flowing refrigerant to evaporate the refrigerant, thereby cooling the cooling fluid, and the cooled fluid is returned to the part of the integrated circuit. The present invention relates to a method for cooling an integrated circuit, in which the integrated circuit is cooled by cooling the integrated circuit.

A seventh feature of the present invention is a flow path for circulating fluid in the computer heat generating section, and a means for sending the fluid.

A cooling device for an electronic computer includes a cooling device having a falling film type evaporator for cooling the fluid.

An eighth feature of the present invention is an electronic computer, a flow path for circulating fluid around an LSI chip of the computer, means for sending the fluid, means for measuring the temperature of the fluid, and cooling the fluid. a cooling device having a falling film evaporator, a compressor, and a 'mm scale expansion valve; and means for controlling the operating state of the compressor of the cooling device based on information from the fluid thermometer measuring means. The cooling system for electronic computers is equipped with

A ninth feature of the present invention is a cooling device for cooling an LSI of a computer, which includes an evaporator, a condenser, a compressor, and an expansion valve for performing heat exchange between a refrigerant and an external fluid. The evaporator is a falling film type evaporator in which the refrigerant flows down the outer surface of the heat transfer tube, and the rotation speed of the compressor is controlled by an inverter to change the amount of cooling and keep the temperature of the cooling water for the computer constant. This is in a cooling system for electronic computers.

A tenth feature of the present invention is a cooling device for cooling an integrated circuit, which includes an evaporator, a condenser, a compressor, and an expansion valve that perform heat exchange between a refrigerant and an external fluid. A falling film type evaporator that flows down the outer surface of the heat tube, and the condenser is an air-cooled condenser that cools the refrigerant with an air flow,
The cooling device for an electronic computer is characterized in that the evaporator and the condenser are arranged vertically so that they overlap each other.

An eleventh feature of the present invention is a cooling device for an electronic computer having an evaporator and a condenser, a compressor, and an expansion valve that perform heat exchange between a refrigerant and an external fluid, wherein the evaporator of the cooling device comprises:
A falling film evaporator in which the refrigerant flows down the outer surface of the heat transfer tube, and the condenser is an air-cooled condenser that cools the refrigerant by an air flow, and the evaporator and the condenser have different heights from the bottom of the cooling device. The evaporator and the condenser are arranged so that their respective projections on the bottom surface at least partially overlap, and the rotation speed of the compressor is controlled by an inverter. It is located in the cooling device for the i-child computer.

The twelfth feature of the present invention is. A plurality of sets of cooling devices for cooling an electronic computer are prepared, each including a compressor and an evaporator provided in a housing, and a condenser arranged on a side surface of the housing, and the plurality of sets of cooling devices are arranged in a stacked manner. and cooling a cooling fluid for cooling the electronic computer by the cooling device,
A method for cooling an electronic computer includes supplying the cooled cooling fluid to the electronic computer to cool the electronic computer.

The thirteenth feature of the present invention is. A cooling device configured by stacking a plurality of cooling units each including a compressor and an evaporator provided in a housing, and a condenser placed on a side surface of the housing, and a cooling device provided near an integrated circuit of a computer. a cooling fluid passage through which a cooling fluid flows for cooling the integrated circuit;
piping for connecting the cooling fluid passage and the evaporator of the cooling device, guiding the cooling fluid cooled by the evaporator to the cooling fluid passage, and guiding the cooling fluid from the cooling fluid passage to the evaporator again; It is located in a cooling device for electronic computers.

A fourteenth feature of the present invention is that cooling devices that include a compressor, an evaporator, and a condenser and that cool an integrated circuit of an electronic computer are stacked and used, and each cooling device has at least a side surface of the cooling device. There is a cooling device for an electronic computer in which a device is arranged.

[Effect]

The above objective, in order to speed up the start-up of the LSI cooling device, is achieved by using a falling film type evaporator as the evaporator of the refrigeration cycle. Namely.

In a falling film evaporator, the refrigerant evaporates on the outer surface of the internal heat transfer tube, so the evaporated refrigerant gas immediately flows into the compressor through a pipe connected to the compressor provided in the evaporator shell. Therefore, since the refrigerant gas does not remain in the shell of the evaporator, the response is quick, the cooling device starts up quickly when the cooling device is started, and the amount of cooling in a normal stable state after startup can be quickly obtained.

Furthermore, if the total heat generation amount of the LSI that makes up the computer fluctuates during steady operation, even if the refrigerant discharge behavior of the compressor is changed by, for example, changing the frequency of the inverter in accordance with the temperature change of the cooling water of the LSI, A falling film evaporator has good responsiveness to changes in the amount of refrigerant circulating in the refrigeration cycle, and can quickly respond to changes in the total calorific value.

In addition, in a falling film evaporator, the working fluid, such as a refrigerant, evaporates while flowing down outside the heat transfer tube, so two forms of heat transfer, forced convection and evaporation, coexist, resulting in a high heat transfer rate. is obtained. Furthermore, since evaporation occurs on the outer surface of the tube, micro-machining to increase the heat transfer coefficient for refrigerants such as fluorocarbons, which have a lower thermal conductivity than the cooling water flowing inside the tube, is easier to perform on the outer surface of the tube, which reduces manufacturing costs. It is also advantageous that heat transfer can be promoted more easily than in a multi-tube evaporator that performs evaporation within the tubes. Therefore, by using a falling film type evaporator, the required heat transfer area of the evaporator, that is, the installation area of the evaporator can be reduced. If the heat transfer area becomes smaller, the time it takes for a given amount of refrigerant to spread over the entire heat transfer area becomes shorter, and the time it takes for a given amount of heat to move becomes shorter.

Further, by providing the condenser on the side of the cooling device, the cooling devices can be stacked and arranged, and the area occupied when a plurality of cooling devices are installed can be significantly reduced.

Furthermore, in order to prevent the heated air flow from coming into direct contact with the operator, etc., this can be easily achieved by, for example, forming a duct-like flow path in a space facing other stacked cooling water supply devices. can.

〔Example〕

An embodiment of the present invention is shown in FIG. 1, which shows a cooling water flow path 3 for cooling an LSI module 2 mounted in a case 1 of an LSI cooling device. Pump 4゜Heat exchanger 6 (
falling film evaporator).

Compressor that compresses refrigerant7. A heat exchanger (condenser) that exchanges heat between the refrigerant and cooling water for cooling the refrigerant 15.
Refrigerant cooling water flow path8. Expansion valve for forming a refrigeration cycle9. Electric control panel 12 for control and cooling device housing 1
The system is configured from 0. FIG. 1 shows an example in which an inverter 11 is installed, which detects the temperature of cooling water using a temperature sensor 30 and controls the rotation speed of a compressor motor. Note that the arrows in Figure 1 indicate the flow direction of the refrigerant or cooling water.

FIG. 2 shows the startup characteristics of a refrigeration cycle composed of a falling film evaporator 6 and a commonly used coiled multi-tubular heat exchanger 22. A falling film evaporator 6
In this case, the refrigerant circulation rate and the increment in the amount of cooling are larger at startup than in the multi-tubular heat exchanger 22, and this shows a faster start-up characteristic at the time of startup.

As shown in FIG. 3, the falling film evaporator 6 has a high heat transfer coefficient because a thin stream of refrigerant evaporates on the outer surface of the heat transfer tube, which is hotter than the refrigerant.

In addition, the outer surface of the heat transfer tube can be processed into a heat transfer surface with a large number of holes to promote evaporative heat transfer, which promotes heat transfer more than a shell-and-tube evaporator that evaporates inside the tube. Furthermore, in FIG. 3, as soon as the liquid refrigerant touches the heat transfer surface 23, the refrigerant liquid evaporates.

Refrigerant gas flows out to the compressor without staying in the evaporator shell. That is, the structure of the falling film evaporator 6 is as follows:
As soon as the liquid refrigerant evaporates, it is discharged from the refrigerant gas discharge pipe 24, so that the refrigerant circulates quickly to the compressor at startup, improving the startup characteristics of the amount of cooling. As described above, in a cooling device for cooling a computer, it is necessary to supply power to the computer main body and quickly execute calculations, so a falling film evaporator is particularly suitable for cooling LSI of a computer.

In FIG. 4, an inverter is used as another embodiment, and L
The water temperature control method when the calorific value of the SI module changes will be described. This water temperature control is performed when the LSI module is at a high temperature (for example, T'J>85°C).

TJ: LSI junction temperature).
w: Surface temperature, when the indoor environment in which the cooling device is installed has a dry bulb temperature of 22°C and humidity of 70%), which causes moisture in the indoor air to condense on the outside surface of the flow path through which cooling water flows. Implemented to prevent.

Figure 4 shows an example where the total calorific value of an LSI module increases due to changes in the operating conditions of the computer, etc., and the frequency of the inverter that enters the compressor increases due to one or more inverters installed in the cooling water of the LSI. This shows the case where the temperature rises in response to the temperature signal from the water temperature sensor. In Figure 4, LS
I module total heat generation is 10.7 50 minutes after startup
In Figure 0, which shows the change in the temperature of the cooling water and the change in the frequency of the inverter when the KW suddenly increases by 20% from 12.9 KW to 12.9 KW, the total heat generation amount of the computer's LgI is the change in the computer's load. When the temperature of the cooling water increases in a stepwise manner, the temperature of the cooling water rises accordingly.The water temperature sensor detects this rise in water temperature, calculates the increase or decrease of the inverter in the arithmetic control circuit, and sends a signal to the inverter. send.

As the frequency of the inverter changes, the number of rotations of the compressor increases, the amount of refrigerant circulating through the refrigeration cycle increases, and the PI increases when sending a signal from the water temperature sensor to the inverter. (proportional-integral) control or I) ID (proportional-integral-derivative) control:
It is possible to maintain a stable water temperature by reducing the fluctuation range of the cooling water temperature, but if the responsiveness of the evaporator, which exchanges heat between the refrigerant and the cooling water, is good, it is difficult to use PI control or I) ID control. The control constants for weighting can be determined analytically. In other words, it is sufficient to omit the term of evaporator responsiveness and analyze the cooling water temperature responsiveness.For this reason, if a falling film evaporator with good responsiveness to fluctuations in cooling withdrawal is applied, By using an inverter and falling film evaporator in this way, it is easy to determine control constants.
Even if the total calorific value of the LSI fluctuates, it can be kept within the set temperature range of the cooling water moisture control (28° C.±2° C. in FIG. 4).

FIG. 5 shows a structural diagram of a falling film evaporator. In the falling film evaporator 6, the refrigerant enters from the liquid refrigerant port 32 at the top of the evaporator shell 31. The liquid refrigerant 28 flows down in a thin film state over the outer surfaces of the many heat transfer tubes 34 in the evaporator shell 31, and as it evaporates, the liquid refrigerant 28 removes the heat of the LSI cooling water 35 flowing inside the heat transfer tubes 34. , the cooling water is being cooled.

The refrigerant gas entering the evaporator together with the liquid refrigerant reaches the refrigerant outlet 36 via the refrigerant gas vent pipe. The gasified refrigerant flows out from the refrigerant gas outlet 36. The LSI cooling water 35 enters from the cooling water port 37, is cooled while passing through the heat transfer tube 34, and then flows out of the falling film evaporator from the cooling water outlet 38 to cool the LSI module.

As shown in Figure 5, refrigerants such as chlorofluorocarbons flowing down outside the tube have a lower thermal conductivity, which is an important physical property value during heat exchange, than the cooling water inside the tube, so the falling liquid film evaporates. At the same time, if the heat transfer surface outside the tube is also processed to promote liquid film evaporation, even higher performance can be achieved. Heat transfer for falling film evaporators, as described in U.S. Pat. No. 4,520,8
66 or U.S. Pat. No. 4,690,211, or U.S. Pat. No. 4,690,2.
The heat transfer tube described in No. 11 has a fine porous surface formed on the outside of the tube, and protrusions that promote turbulent heat transfer on the water side of the tube are formed inside the tube. On the extravascular porous surface, multiple tunnels are formed under the surface epidermis, and openings are regularly formed on the tunnels. The liquid refrigerant spreads over the surface through the micro tunnels of this porous surface, and evaporates within the tunnel.
Refrigerant gas is generated from the apertures 54.

By creating a surface structure that increases the amount of evaporation of the refrigerant and improves the wettability and spreadability of the refrigerant liquid, the liquid film evaporation heat transfer coefficient can be improved.

As mentioned above, the falling liquid film full steamer has a high liquid film evaporation heat transfer coefficient, and the refrigerant flows outside the tube, which is easy to process, so it is easy to process to promote heat transfer, and it is an index of heat exchange. The heat transfer rate can be increased, and the evaporator can be made smaller.

FIG. 6 shows an example of application of the present invention, in which a falling liquid film is installed inside a coil-shaped water-cooled condenser (heat of the refrigerant is cooled by external cooling water) 15 in the case lo of the cooling device. It contains an evaporator 6. By setting it up like this. The space inside the housing can be used effectively and downsizing can be achieved. The housing 10 of the cooling device contains a compressor and a heat exchanger for performing four sets of refrigeration cycles, and each refrigeration cycle is configured in two stages to further save space. In the system in this case, for example, three out of four units are operated, and one unit is used as a backup in case of failure. Cooling water for the LSI is stored in the header 18 by the pump 4, passes through the LSI cooling water flow path 3, and flows to the LSI.
This will lead you to module 2.

FIG. 7 shows a plate type falling film evaporator 20 used as the evaporator of the refrigeration cycle in the housing 10 of the cooling device. In FIG. 1, the header 18 in the pump housing 19 is used. First, store cooling water for the LSI, and
A system is shown in which cooling water flows to module 2. Plate-shaped falling liquid film evaporation 8120 is a method in which a carbon fluoride-based refrigerant or the like flows down on the surface of a plate-shaped heat transfer surface, and a high heat transfer coefficient can be obtained at the same time as it flows down on the outer surface of the heat transfer tube. Moreover, it also has the effect of saving space.

In the embodiment shown in FIG. 7, the heat transfer tube may be installed horizontally as the evaporator of the refrigeration cycle, and a falling film evaporator may be used in which the refrigerant liquid flows down from the upper part.

FIG. 8 shows an example in which an air-cooled condenser 16 is used as the condenser in the housing 10 of the cooling device. of refrigerant is condensed into liquid refrigerant.

There may be only one air-cooled condenser in the cooling device casing 10, but if multiple units are used as shown in Figure 1, it is best to install the air-cooled condensers 16 at different levels so that they partially overlap. The evaporator 6 and compressor 7 are also located at the bottom of the air-cooled condenser 16,
Alternatively, size reduction can be achieved by placing it above the air-cooled condenser 16.

In this figure, it is composed of two sets of refrigeration cycles. In this case, if a vertically installed falling film evaporator 6 is used, the vertical projected area is small.

A blower 17 for blowing air has a small pressure loss with respect to the air flow sucked from the lower part of the cooling device casing 10 and directed upward.
The burden on the operator can be reduced and a sufficient amount of air can be blown.

FIG. 9 shows the expansion valve opening degree on the horizontal axis and the cooling amount on the vertical axis, and shows data for a set of refrigeration cycles corresponding to FIG. 1. The frequency of the compressor inverter is used as a parameter to change the amount of refrigerant circulation. 7 by making the inverter frequency and expansion valve opening variable variable.
The amount of cooling can be changed in the range of KW to 17KW. In addition, by using multiple refrigeration cycles as shown in Figure 6, the amount of cooling can be increased, and the system shown in Figure 6 is operated with three units (in the system shown in Figure 6, three units are operated, 1
(The unit is used as a backup in case of failure), and the power can be varied from 7KW to 51KW by switching the number of units. In this case, the expansion valve is an electronic expansion valve whose opening degree can be controlled by the number of pulses that are electronic signals.

FIG. 10 shows an example of the arrangement of the device of the present invention.
In Figure 0 (a) and (b), four cooling water supply devices are arranged on the floor 60, two of them are stacked one above the other, and each of the stacked cooling water supply devices faces each other. It is arranged as follows. Floor 60 in the lower stage of the stacked cooling water supply devices
A hole 60a is provided in the surface, and the atmosphere is allowed to flow in through the hole 60a. The air is introduced by driving a blower 17 in the cooling water supply device. The blower 17 is disposed on the side of the space (forming the duct-like flow path 61) formed by the opposing stacked cooling water supply devices, and the air flowing out through the blower 17 is is guided to the duct-like flow path 61 via an air-cooled condenser 16 also arranged on the space side. In addition, each cooling water supply device mainly includes an evaporator 6. Compressor 7 etc. are incorporated.

Next, an example of the chilled water system configuration in the cooling device shown in FIG. 10 is shown in FIG. The LSI 2b is cooled by absorbing heat generated from the LSI 2b in the flow path 2a.

In the figure, the direction of the arrow indicates the flow direction of the cooling water, and the refrigeration cycle is connected to the air condenser 16. Evaporator6. It is composed of a compressor 7 and an expansion valve 9 whose opening degree is controlled by a fitter signal, of which the compressor 7 is controlled by eight inverters 11.

In the example configured in this way, each cooling water supply device adopts a configuration in which the air-cooled condenser 16 is arranged on the side thereof, so that it is possible to arrange the cooling water supply device side by side. It becomes possible to reduce the space occupied by the supply device.

In addition, in the Example mentioned above, the case where all each cooling water supply device is operated is shown. However, when the cooling water supply device is used to cool a large computer, if the computer were to stop for a short period of time, it could have a serious impact. Therefore, it is preferable to use one unit as a backup as a backup in such a case, and use the remaining three units for cooling.

In other words, when one of the four cooling water supply devices shown in FIG.
Suppose that there is W, and it is necessary to cool the sum of this amount of heat and the heat wave 1, for example 2KW, generated by the cold water pump, which is 30KW. At this time, normally three cooling water supply devices each have a power of 10KW.
The above-mentioned 30KW is cooled in total. At this time, the backup machine's 8-inch cooling system is also of the 10KW class, but it is not normally in operation.

However, if one of the operating cooling water supply devices stops for some reason, a backup device will be activated immediately to prevent the entire computer cooling water system from stopping.

FIG. 12 shows a flowchart of the control system starting from a method of detecting when the backup cooling water supply device operates and when it does not. FIG. 13 shows a flowchart of the microcomputer that implements these processes. In the cooling water supply system abnormality detection process shown in step 70, the compressor suction pressure (Ps) of the cooling water supply system is detected.

Compressor discharge pressure (Pd), discharge gas humidity (Td).

Check compressor supply overcurrent (abnormality of this is checked by overcurrent thermal switch). If there is nothing wrong with these things.

In step 71, the water temperature is detected by the temperature sensor 30, and in step 72, the frequency of the inverter that drives the compressor is changed. That is, if the temperature of cooling water for the LSI is higher than a predetermined set temperature, the frequency of the inverter is increased to increase the amount of cooling, and conversely, if the temperature is lower than the set temperature, the frequency of the inverter is lowered. The inverter frequency (ΔHz) changed in step 72 is weighted in various ways, and the following PL control method is performed here.

ΔHz = K p X t + K i XΔT i
X τs Here, t: ΔTi - ΔTo, constant temperature of one stage of LSI cooling water tank, ΔT' o: Δ of previous sampling
Tj.

τS: sampling time, Kp, Ki: control constants.

In step 73, the opening degree of the electronic expansion valve is controlled to optimize the refrigeration cycle of the cooling water supply device.

As for the opening control method, the compressor discharge pressure Td and the condensation temperature 1°C were detected by a temperature sensor 30 installed in the cooling water supply device, and the difference was calculated and determined in advance from each frequency. There is a method of adjusting the opening degree of the electronic expansion valve so as to obtain the optimum value.

Step 74 indicates a case where some abnormality is detected in step 70, and the cooling water supply device (
(usually 1 unit) is stopped +h. Step 75 shows a method of operating a cooling water supply device that does not detect an abnormality, which is different from the one in which an abnormality is detected. First, in step 75, the water temperature is detected. Then, in step 76, the inverter frequency is corrected, and in step 77, the opening degree of the electronic expansion valve is changed to the optimum value. Then, the process proceeds to step 78, and it is determined whether, for example, 5 minutes have elapsed since the detection of an abnormality in the cooling water supply system.If the elapsed time has elapsed, the process proceeds to step 70, and if the 5 minutes have not elapsed, the process proceeds to step 55 again.The process returns to step 74, and After the detected cooling water supply device is stopped, in step 79, another backup cooling water supply device is activated. In step 80, the initial frequency of the backup cooling water supply device is set (0, usually the maximum inverter frequency).

In step 81, when the compressor starts operating, for example, in order to increase the compressor suction pressure, an instruction is issued to fully open the electronic expansion valve. For example, after 5 minutes have elapsed, normal operation resumes.

Furthermore, FIG. 13 shows a flowchart of the microcomputer that drives the inverter of the cooling water supply device, and the humidity sensor 3
0. Overcurrent thermal switch 64° Compressor digging pressure (Ps
), compressor discharge pressure (Pd).

Compressor discharge humidity (Td), condensing temperature ('l' c ), etc. are detected, signal processing is performed by an arithmetic controller connected to a storage element, and the signal is sent to the inverter 11. lla, or expansion valve driving means 65, 65
The expansion valves 9 and 9a are driven through a.

In addition, the 14th Ij4 shows a composite number of blowers 17, which is an example of a method in which a plurality of air-cooled condenser blowers are operated as a method of taking backup in one of the plurality of cooling water supply devices. A blower rotation number counter 6 is installed in each of the
6, and if an abnormality is detected by the rotation number counter, the relay switch 67 may be activated to stop only the blower in which the abnormality has occurred.In this case,
Since multiple blowers are operating, even if one blower stops, the condensation pressure in the air-cooled condenser will only increase slightly, and the cooling water supply system will not stop, and a backup machine will be activated. The probability can be reduced.

FIG. 19 shows another example of the evaporator 6. Although not shown in Fig. 19, which shows an example in which four cooling water supply devices consisting of a compressor 7°, a water-cooled condenser 15, etc. are stacked, the water piping from the water-cooled condenser 15 is connected to an outdoor cooling tower. The cooling water is cooled in a cooling tower.

FIG. 20 shows another example of the evaporator 6. In a cooling water supply system composed of a compressor 7 and a water-cooled condenser 15, the compressor, evaporator, and water-cooled condenser are each arranged together.

FIG. 21 shows another example, a compressor.

In the case where a cooling water supply device consisting of an evaporator, a water-cooled condenser, etc. is divided into 12 housings, and there is a duct-like flow path 61 in the center through which air cools the air-cooled condenser. An example was given.

FIGS. 22(a) and 22(b) show other examples.

A plurality of blowers 17 of a cooling water supply device equipped with an air-cooled condenser 16 are installed on the ceiling of a duct-like flow path 61.

FIGS. 23(a) and 23(b) show another example of the present invention, in which the air-cooled condenser 16 is also provided at the upper part of the housing 10 of the cooling water supply device, and a duct-like flow in the center is provided. The airflow velocity through the passage 61 is slightly lower than in the case of FIG. 14, and the airflow is dispersed, so there is a noise reduction effect. For the same reason, a conventional cooling water supply device may be used as the top cooling water supply device.

24(a) and 24(b) show another example of the present invention, in which air for cooling the air-cooled condenser 16 is used.

Air intake port 6 provided on the side of the housing 10 of the cooling water supply device
8, which eliminates the need for an opening for air intake under the floor as shown in FIG.

Particularly in the case of Fig. 23, the air taken in flows through each device, and the flow is not smooth due to the inflow resistance, increasing the load on the blower 17. However, if the air is configured as shown in Fig. 24, By doing so, such adverse effects can be eliminated.

FIG. 25 shows another example of the present invention, in which the airflow that has passed through the air-cooled condenser 16 is rectified to the rectifying plate 45 in the duct-like flow path 61. In addition to the effect of reducing pressure loss during the process, noise caused by turbulence is also reduced. If the baffle plate 45 were not provided, the condensation efficiency would be poor, and this problem is a peculiar phenomenon when the cooling water supply devices are stacked and facing each other.

The configuration shown in FIG. 12 above is effective. In addition, in order to eliminate the above-mentioned adverse effects, in addition to the rectifying plate 45, a duct-like flow path 61 is provided.
A partition plate may be provided so as to define cooling water supply devices stacked in opposite directions at the center of the cooling water supply device.

FIG. 26 shows another example of the present invention, in which relatively high-temperature airflow that has passed through the air-cooled condensers 2 of the cooling water supply devices installed in a stack is seen from the center of the housing. It is configured to pass through an outer duct-like flow path 61. In this case, it goes without saying that the same effect can be obtained even if the cooling water supply devices that are in contact with each other on their back surfaces are separated at the contact portion.

Figure 27 shows another example of the present invention, in which cooling water supply devices with a large cooling capacity are installed singly without being stacked, and cooling water supply devices with a small cooling capacity are installed in a stacked manner. shows.

FIG. 28 shows another example of the present invention.

Two cooling water supply device casings 10 are stacked on top of the casing 1 containing the LSI 2b, which has a larger area reduction effect.

FIG. 29 shows another example of the present invention, in which the housing 1 of a cooling water supply device houses a compressor, an evaporator, a condenser, and an expansion valve.
0 is circular, and the housings 10 are stacked to form an LSI cooling water supply device. In this example, the air that has passed through the air-cooled condenser is configured to pass through a flow path 61 having a circular cross section.

FIG. 15 shows another example of the system configuration of the device of the present invention, in which the air-cooled condenser 16 is installed outside the building, and the refrigerant flow path 6
9, the room where the computer is installed is air evaporator 9
The refrigerant passes through two heat exchangers (evaporators) 91: 0, and a refrigerant and water for cooling the computer. The housing 10 of the cooling water supply device is stacked on the housing 2a containing the LSI 2b.

The fluid that cools the LSI, that is, the fluid that flows through the flow path 2a of the LSI, may be water or a refrigerant. When a refrigerant is used, the LSI 2b will be cooled by boiling heat transfer.

FIG. 16 shows another example of the present invention, in which a cooling tower 92
Cooling water passes through a cooling water flow path 93, part of which passes through a water-cooled condenser 15, passes through another heat exchanger 91, and exchanges heat with water or refrigerant. One of the machines is a backup machine. cooling tower 92
When the cooling water from the LSI 2b is at a low temperature, the valve 94 is closed, heat exchange is performed only by the heat exchanger 91 in the uppermost case, the compressor 7 is not operated, and the LSI 2b can be cooled in an energy-saving state. For example, when the cooling water passing through the cooling tower 92 reaches a relatively high temperature, such as in the summer, the valve 94 is opened to operate the compressor to cool the water.

At this time, in the heat exchanger 91 of the uppermost case in FIG. 16, the cooling water of the highly humid LSI 2b is precooled with the cooling water that has passed through the cooling tower 92. The fluid passing through the cooling water flow path 2a of the LSI may be water or a refrigerant, and if this fluid is a refrigerant, the LSI 2b will be boiled and cooled. When a refrigerant is used as the fluid, there are times when it is necessary to use the pump 4 and times when it is not necessary. That is, the boiled refrigerant gas rises in a two-phase state through the piping, and the electric pump 4 may become unnecessary due to the action of the bubble pump.

FIG. 17 shows an example of an air-cooled condenser 16 used in the present invention, in which air-cooled fins 1 with slits 16a
Air flows between the refrigerant pipes 6b for cooling, and the refrigerant in the refrigerant pipe 16c condenses.

FIG. 18 specifically shows the configuration of the apparatus of the present invention, in which a falling film type evaporator 6 is used as the evaporator. The heat transfer tube 34 of the falling film evaporator is installed vertically, and the refrigerant flows in the form of a liquid film on the outside of the heat transfer tube to cool the LSI cooling water inside the heat transfer tube.

By using this type of evaporator, it becomes a vertically elongated heat exchanger, and the installation space of the falling film type evaporator in the cooling water supply system can be reduced.

According to the device of the present invention, when the cooling device is started, the refrigerant gas can quickly leave the heat transfer surface of the falling film evaporator, the time the refrigerant gas stays in the evaporator shell is short, and as a result, the refrigerant As soon as the LSI is circulated, the LSI can be cooled down, so an LSI cooling device with quick response can be obtained.

Furthermore, since the falling film evaporator exchanges heat at a high heat transfer rate, the size of the heat exchanger can be reduced, and the heat load due to the amount of heat exchanged per unit heat transfer area increases.

Improves responsiveness during startup or when changing the amount of cooling by the inverter.

Furthermore, although the area occupied by the evaporator in the entire refrigeration cycle is large, in the present invention, by using a falling film evaporator, the installation area of the cooling device can be reduced, and therefore the entire refrigeration cycle can be made smaller.

〔Effect of the invention〕

As explained above, according to the present invention, by using a falling film evaporator as the evaporator of the refrigeration cycle in the computer cooling system, it is possible to reduce the waiting time when starting the computer, and also to reduce the waiting time when the computer starts up. LSI
Since the water temperature can be stabilized even if the total amount of heat generated by be.

In addition, according to the invention of a cooling device in which a condenser is placed on the side, even if it is necessary to use multiple cooling devices, the device can be placed without increasing the area occupied indoors. There is.

[Brief explanation of drawings]

Fig. 1 is an overall configuration diagram showing one embodiment of the computer cooling device of the present invention, Fig. 2 is a diagram showing the start-up characteristics of the inventive device, and Fig. 3 is a diagram showing the flow of refrigerant in a falling film evaporator. A perspective view explaining the flow, FIG. 4 is a line diagram explaining water temperature control by an inverter, FIG. 5 is a vertical cross-sectional view showing the detailed structure of the falling film evaporator shown in FIG. 1, and FIG. 6 is a cooling diagram. A perspective view showing an embodiment of the present invention when a plurality of devices are used, FIGS. 7 and 8
9 is a diagram illustrating the cooling performance of the cooling device of the present invention, and FIG. 10 is an example of the arrangement of the device of the present invention. )
is a front view, (b) is a top view, Fig. 11 is a cooling system diagram of the device shown in Fig. 10, Fig. 12 is a flow chart explaining the operating situation of the backup machine of the cooling system, and Fig. 13 is a diagram of the cooling system. 14 is a block diagram showing a control circuit for a blower in a cooling device; FIGS. 15 and 16 are overall configuration diagrams showing an example of the system configuration of the device of the present invention, respectively; FIG. 17 is a perspective view showing an example of air cooling fins used in the condenser of the cooling device of the present invention, FIG. 18 is a perspective view specifically showing the configuration of the device of the present invention, and FIGS. 19 and 20 are respectively FIG. 2 is a partially sectional perspective view illustrating the flow of refrigerant gas in a heat exchanger conventionally used for bags. 1.10... Housing, 2... LSI module (integrated circuit module) 2a... LSI flow path, 2b... L
SI (integrated circuit), 3... Cooling water flow path, 6... Heat exchanger (evaporator), 7... Compressor, 9... Expansion valve, 1
1... Inverter, 12... Control panel, 15... Heat exchanger (condenser), 16... Air-cooled condenser, 17...
Blower, 2o...Plate type falling film evaporator, 3o
... Temperature sensor, 61 ... Duct-like channel, 62.
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Claims (20)

[Claims] 1. Evaporator and condenser that exchange heat between refrigerant and external fluid,
The evaporator includes a compressor and an expansion valve, and the evaporator is a falling film evaporator in which cooling water for cooling the computer passes through the heat transfer tube, and the refrigerant evaporates while flowing down the outer surface of the heat transfer tube. A cooling device for electronic computers featuring: 2. The evaporator is equipped with an evaporator and a condenser that perform heat exchange between the refrigerant and an external fluid, a compressor, an expansion valve, and a cooling water passage that cools the integrated circuit of the computer. A cooling device for an electronic computer, characterized in that the cooling water flowing through the cooling water flow path is a falling film type evaporator configured such that the cooling water flows inside the heat transfer tube. 3. A cooling device comprising a compressor, a condenser, an expansion valve, and a falling film evaporator connected in sequence through refrigerant piping, an integrated circuit of an electronic computer, and a cooling fluid passage for cooling the integrated circuit. A cooling device for an electronic computer, characterized in that the cooling fluid in the fluid passage is cooled by the falling film type evaporator, and the cooled cooling fluid is circulated and supplied to the integrated circuit portion to cool the integrated circuit. . 4. a cooling device comprising a falling film evaporator, an integrated circuit of an electronic computer, a cooling fluid passage provided near the integrated circuit through which a cooling fluid flows for cooling the integrated circuit, the cooling fluid passage and the cooling An electronic device comprising piping for connecting a falling film evaporator of the device, guiding cooling fluid cooled by the evaporator to the cooling fluid passage, and guiding cooling fluid from the cooling fluid passage to the evaporator again. Cooling device for computers. 5. 5. A cooling device for an electronic computer according to claim 4, comprising a temperature sensor for detecting the temperature of the cooling fluid, and an inverter for controlling the rotation speed of a compressor constituting the cooling device based on information from the temperature sensor. . 6. A cooling device including a falling film evaporator is provided, and the cooling fluid is cooled by the falling film evaporator of the cooling device and then supplied to an integrated circuit portion of an electronic computer to cool the integrated circuit and integrate the cooling fluid. An electronic device characterized in that the cooling fluid cooled by the falling film evaporator is circulated and supplied to the integrated circuit by returning the cooling fluid after cooling the circuit to the falling film evaporator and recooling the cooling fluid. How to cool your computer. 7. directing the cooling fluid after cooling the integrated circuit to an evaporator;
The cooling fluid is made to flow in the vertical direction in the evaporator, and the refrigerant is caused to flow down in a thin film form through a heat exchange wall, and the heat held by the cooling fluid is imparted to the flowing refrigerant to cool the refrigerant. A method for cooling an integrated circuit, characterized in that the cooling fluid is evaporated, thereby cooling the cooling fluid, and the cooled fluid is supplied again to parts of the integrated circuit to cool the integrated circuit. 8. For an electronic computer, comprising: a flow path for circulating a fluid in a heat generating part of the electronic computer; a means for sending the fluid; and a cooling device having a falling film evaporator for cooling the fluid. Cooling system. 9. An electronic computer, a flow path for circulating fluid to an LSI chip of the computer, means for sending the fluid, means for measuring the temperature of the fluid, and a falling film evaporator and compressor for cooling the fluid. , for an electronic computer, comprising: a cooling device having a condenser and an expansion valve; and means for controlling the operating state of a compressor of the cooling device based on information from the fluid temperature measuring means. Cooling system. 10. In a cooling device for cooling an LSI of a computer, the cooling device has an evaporator, a condenser, a compressor, and an expansion valve that perform heat exchange between the refrigerant and an external fluid. For an electronic computer, comprising a falling film type evaporator that flows downward, and the rotation speed of the compressor is controlled by an inverter to change the amount of cooling to keep the temperature of the cooling water of the computer constant. Cooling system. 11. In a cooling device that cools an integrated circuit and has an evaporator, a condenser, a compressor, and an expansion valve that perform heat exchange between the refrigerant and an external fluid, the refrigerant passes through the evaporator as a falling liquid film flowing down the outer surface of the heat transfer tube. for an electronic computer, characterized in that the condenser is an air-cooled condenser that cools the refrigerant with an air flow, and the evaporator and condenser are arranged so as to partially overlap in the vertical direction. Cooling system. 12. In a computer cooling device that includes an evaporator, a condenser, a compressor, and an expansion valve that perform heat exchange between a refrigerant and an external fluid, the evaporator of the cooling device is configured to cool a flowing liquid in which the refrigerant flows down the outer surface of the heat transfer tube. a film evaporator, and the condenser is an air-cooled condenser that cools the refrigerant by air flow, and the evaporator and condenser are located at different heights from the bottom of the cooling device, and each A cooling device for an electronic computer, characterized in that an evaporator and a condenser are arranged so that their projection parts overlap at least partially, and the rotation speed of the compressor is controlled by an inverter. 13. A plurality of sets of cooling devices for cooling an electronic computer are prepared, each of which includes a compressor and an evaporator provided in a housing, and a condenser arranged on a side surface of the housing, and the plurality of sets of cooling devices are arranged in a stacked manner. A method for cooling an electronic computer, characterized in that a cooling fluid for cooling the electronic computer is cooled by the cooling device, and the cooled cooling fluid is supplied to the electronic computer to cool the electronic computer. 14. A cooling device configured by stacking a plurality of cooling units each including a compressor and an evaporator provided in a housing, and a condenser placed on a side surface of the housing; a cooling fluid passage through which a cooling fluid for cooling a circuit flows; and a cooling fluid passage that connects the cooling fluid passage with an evaporator of the cooling device to guide the cooling fluid cooled by the evaporator to the cooling fluid passage and from the cooling fluid passage. A cooling device for an electronic computer, comprising piping for guiding the cooling fluid of the above to the evaporator again. 15. Cooling devices each having a compressor, an evaporator, and a condenser for cooling an integrated circuit of an electronic computer are stacked and used, and each cooling device has the condenser disposed on at least one side thereof. A cooling device for an electronic computer characterized by the following. 16. 16. The computer cooling device according to claim 15, wherein the top cooling device of the stacked cooling devices has a condenser also disposed on its upper surface. 17. 16. The cooling device for an electronic computer according to claim 15, wherein a duct-like flow path is formed on the side where the condenser is disposed. 18. 18. The cooling device for an electronic computer according to claim 17, wherein the duct-like flow path is constructed by arranging stacked cooling devices and respective condensers facing each other. 19. Claim 1: The duct-like flow path is provided with a rectifying plate.
19. The cooling device for an electronic computer according to 7 or 18. 20. 19. The computer cooling device according to claim 17, further comprising a blower provided in the duct-like flow path.