KR100394000B1 - Refrigerated cooling system for computer - Google Patents

Abstract

The present invention relates to a cooling device for a computer, by installing a refrigeration cooling device that cools the heat generated from the central processing unit or cards when the computer is operating, and improves the performance of the computer, while upgrading or replacing parts By providing a compatible cooling system that can use the existing cooling system, the work maneuver was saved.

To this end, the present invention is connected to the compressor 10, the condenser 20, the expansion valve 30, the compressor 10 and the expansion valve 30 and separated from the devices and the inside of the case 90 Evaporator 40 integrally formed in the middle of the interruption, a blower fan 41 installed on one side to force forced air to the evaporator 40 side, the evaporator 40 and the central processing unit (CPU) to cool the heat It is to be provided with a computer-type refrigeration cooling device having a case 90 is formed of a heat insulating and sealing material to be installed in the 60, and the card (63) is installed on one side of the computer.

Description

Refrigerated Cooling System for Computers {Refrigerated cooling system for computer}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a computer cooling device, and more particularly to a refrigeration cooling device for cooling a semiconductor device or the like, which generates heat during operation of a computer.

In general, a computer has many components such as a semiconductor mounted therein so that data can be processed at high speed, and the heat density of the semiconductor has been increased because the degree of integration increases as the performance is improved.

However, when the temperature of such components is increased, many problems such as slowing down data processing speed and malfunctioning are caused.

Thus, as shown in FIG. 1, a conventional computer is provided with a refrigeration cooling device for cooling heat generated in a central processing unit (hereinafter, CPU 60), which is very sensitive to heat operation characteristics.

The refrigeration cooling apparatus 1 includes a compressor 10, a condenser 20, an expansion valve 30, an evaporator 40 directly attached to an upper surface of a CPU requiring cooling, and the evaporator 40. Blower fan 41 for flowing the air to the furnace, and the cover 70 for packaging the evaporator 40 and the CPU 60 to 80 so that the condensate formed in the evaporator 40 to the other components do not flow.

At this time, the evaporator 40 absorbs the heat generated by the CPU 60 by using the latent heat of evaporation of the refrigerant, but the air inside the computer having an average temperature between 40 ° and 50 ° is lower than the dew point temperature. When in contact with the surface of the evaporator 40 between -40 ° C, moisture contained in the air condenses, causing condensation and freezing on the other parts, causing serious problems in the operation of the other parts.

Accordingly, by forming the evaporator 40 and the CPU 60 in a separate semiconductor package 80 to be insulated from the outside, to prevent freezing of other components, such that the heat transfer of only the CPU 60 is efficiently performed. .

However, since the CPU 80 and the evaporator 40 are insulated and then packaged 80, a lot of parts are consumed and manufacturing is not easy, thus increasing the manufacturing time.

In addition, since the CPU 60 and the evaporator 40 that require cooling are packaged together, the space for connecting the cooling device and the freezer in each case is appropriately installed in order to mount the cooling device on any motherboard. Installation is not easy because it needs to be fixed by piping.

In addition, since the evaporator 40 is directly attached to the upper surface of the semiconductor device, the CPU 60, etc., since the shape of the evaporator 40 is determined according to the shape of these devices, when the computer is upgraded, the existing cooling device is used as it is. Not available, which increases the cost.

In order to solve the above-mentioned problems, the object of the present invention is to improve the operating efficiency of a computer by installing a refrigeration cooling device having an evaporator formed integrally with a case to a group of parts of a computer requiring cooling. have.

Furthermore, an object of the present invention is to provide a refrigeration cooling device that is easy to install and can be used as is when replacing other parts.

1 is a cross-sectional view showing a refrigeration cooling apparatus for cooling a semiconductor package installed in a conventional computer.

2 is a structural diagram schematically showing a configuration in which a refrigeration cooling device is installed in a computer according to the present invention;

3 is a sectional view showing the main parts of a refrigeration cooling apparatus according to the present invention installed in a central processing unit.

* Explanation of Signs of Main Parts

10 compressor 20 condenser

30 expansion valve 40 evaporator

50: motherboard 60: CPU (Central Processing Unit)

70: cover 80: package

1, 2: refrigeration cooling device 41: blowing fan

90 case 42 coolant tube

The present invention provides a compressor for realizing the above objects; A condenser; An expansion valve; An evaporator connected to the compressor and an expansion valve, separated from the apparatus, integrally formed at an internal stop of the case, and controlled to have an evaporation temperature of 0 ° C or higher; A blowing fan installed at one side such that forced air is blown to the evaporator side; A case installed at one side of the computer and formed of a heat insulating and sealing material to embed the evaporator, a CPU to cool the heat, and cards; A heat dissipation fan installed on the central processing unit of the computer to allow the air to flow more smoothly in the case; The upper surface of the central processing unit is configured to include a pin mounted for heat dissipation, the case is a main board space consisting of a central processing unit and a main board and a card for mounting the same by the partition wall is installed on the upper and lower sides of the evaporator And an evaporator space in which the evaporator and the blower fan are installed, and a lower side of the main board on which the central processing unit is installed, separated by the case and connected to the main board by a data bus and a power line. An input / output device space in which a drive, a power supply, etc. are installed is located, and a part of the partition wall separating the inner space of the case is formed with a through-hole through which a connection line for connecting the central processing unit and a peripheral device is formed. The connecting line connects the computer through the case Coupled portion, the evaporator would freeze, a computer cooling device, for characterized in that the condensate discharge pipe for discharging the condensed water generated from the evaporator into the case so that an external connection service.

Hereinafter, the preferred configuration and operation of the present invention will be described in detail with reference to the accompanying drawings.

2 is a structural diagram schematically showing a configuration in which a refrigeration cooling apparatus is installed in a computer according to the present invention, and FIG. 3 is a sectional view showing main parts of the evaporator side of the refrigeration cooling apparatus according to the present invention installed in a central processing unit.

As shown in FIG. 2, the computer-cooled refrigeration apparatus 2 according to the present invention includes a compressor 10 for compressing a refrigerant at a high pressure, and a condenser 20 for isothermally condensing or isothermally evaporating the refrigerant by heat exchange. Evaporator 40 and expansion valve 30 for adiabatic expansion of the refrigerant.

On the one side of the evaporator 40, a blower fan 41 forcibly blowing ambient air to the evaporator 40, a CPU 60 and a card to cool the evaporator 40 and the blower fan 41 and heat. It is composed of a case 90 is formed of a heat insulating and sealing material to be installed on one side of the computer to house the flow (63).

At this time, the case 90, as shown in Figure 3, the main board space consisting of the CPU (60), the motherboard 50 is mounted with the CPU 60, the card (63) and the like ( 92 and a partition wall 94 is installed below the evaporator 40 in the case 90 so as to be separated into the evaporator space 91 in which the evaporator 40 and the blower fan 41 are installed.

In addition, a portion of the partition 94 is provided with a through-hole 95 so that the card (63) mounted on the main board 50 and a peripheral device installed on the outside of the case 90 can be connected.

Accordingly, the connecting line 65 connecting the card 63 and the peripheral device installed outside is connected to the outside of the computer through the case 90.

In addition, a main board space 92 of the case 90 in which the CPU 60 and the like are embedded, a floppy disk drive 65 located below the PCB on which the CPU is installed, and a CD-ROM 66 ) And the input / output device space 93 in which the hard disk drive 67, the power supply 68, and the like are installed are separated by a case 90 formed of a heat insulating material and a sealing material.

The CPU 60 of the main board space 92, the disk drives 65, 67, the power supply 68 of the input / output device space 93, and the like are connected by a data bus and a power line.

That is, the condenser 20, the compressor 10, and the expansion valve 30 are separated from the evaporator 40 and mounted on a computer, and the evaporator 40 is a CPU 60 or a main board of a computer that requires cooling. 50, together with the card 63, is built into the case 90, and is insulated from other spaces of the computer.

On the other hand, the cooling device for a computer according to the present invention may be provided with a heat dissipation fan 62 on the CPU of the computer so that the flow of air in the case 90 more smoothly, the upper surface of the CPU (60) It is understood that the pin 61 can be mounted.

Accordingly, when the blower fan 41 installed on one side of the evaporator 40 is rotated in the case 90, the air in the evaporator space 91 is transferred to the evaporator 40 side to be heat exchanged, and then the cooled air is After the heat exchange with the components introduced into the main board space 92 and mounted thereon, the main board space 92 is reintroduced into the evaporator space 91 through the through hole 95.

At this time, when the temperature of the evaporator 40 is formed at -20 ° to -40 °, since the moisture in the air freezes on the surface of the evaporator at the beginning of the operation of the cooling device, in order to prevent this, the evaporator ( The temperature of 40) is formed above 0 ° C.

On the other hand, the condensate generated during the initial operation of the evaporator 40 in the case 90 is discharged to the compressor 10, the condenser 20 and the expansion device side through the condensate discharge pipe 43 under the evaporator 40, It is applied to the top of the compressor 10 is generated when the heat is generated, or applied to the surface of the condenser 20 so that the heat transfer is effective.

The refrigeration cooling device 1 according to the present invention formed in such a structure is the main board space 50, CPU 60, the card board 63 is mounted, the main board portion 50 is required to cool the space The case 90 is inserted to be positioned at 92, and a refrigerating device such as the condenser 20 connected to the evaporator 40 integrally formed with the case 90 is installed in a computer separately from the case 90.

On the other hand, devices that are easily exposed to external devices such as power supplies, floppy disk drives, hard disks, etc., are isolated from the main board 50 and installed in other spaces inside the computer housing (hereinafter referred to as I / O device space 93). And a main board 50 through a power line.

At this time, the main board space 92 and the input and output device space 93 is connected to the data bus and the power line, the two spaces are insulated and sealed to prevent air flow between the two spaces, the case 90 The air in the motherboard space 92 can be recycled only in the case 90 without leaking to the outside.

In addition, the cards 63 mounted on the main board 50 are connected to an external device by a connection line 65 passing through the case 90.

Accordingly, the refrigerant, which is compressed by the compressor 10 and flows through the condenser 20 and the expansion device, is introduced into the evaporator 40 to flow in the tube of the evaporator 40.

At this time, the air in the evaporator space 91 flows to the evaporator 40 in accordance with the rotation of the fan, the sensible heat transfer is generated by the temperature difference between the evaporator 40 and the air, or at the beginning of operation the evaporator lower than the dew point temperature ( 40) At the surface, condensate is formed due to latent heat transfer.

Cooled air is injected into components such as the CPU 60 that dissipates heat in the motherboard space 92, and sensible heat is transferred between the CPU and the cooled air, so components such as the CPU are cooled and absorb heat. Air is re-introduced into the evaporator space 91 through the through-hole 95 formed in the partition wall 94 in the case (90).

In addition, the air re-introduced into the evaporator space 91 lowers the temperature of the motherboard space 92 while recirculating the process as described above through the evaporator 40 by the blowing fan 41 rotation.

In addition, since the temperature of the evaporator 40 is designed to be 0 ° C. or more, freezing of the components in the case 90 and the inside of the evaporator 40 and the flow path are prevented.

On the other hand, condensate formed in the evaporator 40 by latent heat transfer with the refrigerant is collected in the lower part of the evaporator 40 is sprayed on the condenser 20 or the compressor 10 through the condensate discharge pipe 43.

In addition, the refrigerant pipe 42 and the condensed water discharge pipe 43 connected to the outside of the evaporator space 91 are insulated and sealed so that the condensed water does not fall into other components in the computer outside the case 90 to cause a failure.

As described above, in the present invention, the evaporator is integrally installed in a case formed of a heat insulating material or a sealing material, and the CPU, the main board, and the cards are located therein, so that various parts can be cooled simultaneously. Only the air in the air is continuously circulated, so that the cooling of the parts becomes effective, thereby increasing heat transfer and improving computer performance.

In addition, since the pipes connected to the outside from the case are insulated and sealed, failure of other parts due to condensate is prevented.

In addition, the condensate generated at the beginning of the operation of the evaporator is sprayed on the surface of the condenser or the compressor through the condensate discharge pipe to improve the energy efficiency of the cooling device.

In addition, since the cooling device is installed separately from the components of the computer, it is easy to install the cooling device, and when the parts are replaced, the cooling device can be continuously used without replacing, thereby reducing the labor time.

Claims (5)

A compressor; A condenser; An expansion valve; An evaporator connected to the compressor and an expansion valve, separated from the apparatus, integrally formed at an internal stop of the case, and controlled to have an evaporation temperature of 0 ° C or higher; A blowing fan installed at one side such that forced air is blown to the evaporator side; A case installed at one side of the computer and formed of a heat insulating and sealing material to embed the evaporator, a CPU to cool the heat, and cards; A heat dissipation fan installed on the central processing unit of the computer to allow the air to flow more smoothly in the case; The upper surface of the central processing unit is configured to have a pin mounted for heat dissipation, The case is separated into a main board space consisting of a central processing unit, a main board and a card for mounting the same, and an evaporator space in which the evaporator and a blower fan are installed by partitions connected to upper and lower sides of the evaporator. On the lower side of the main board on which the central processing unit is installed, an input / output device space in which a floppy disk drive, a hard disk drive, a power supply, and the like, is separated by the case and connected to the main board by a data bus and a power line, is located. A portion of the partition wall separating the inner space of the case is formed through the connecting line for connecting the central processing unit and the peripheral device, The connection line connecting the card and the external device is connected to the outside of the computer through the case, The evaporator is a refrigeration cooling device for a computer, characterized in that the condensate discharge pipe for discharging the condensate generated in the evaporator to the outside of the case. delete delete delete delete