CN107801352A - Radiating subassembly - Google Patents
Radiating subassembly Download PDFInfo
- Publication number
- CN107801352A CN107801352A CN201610804006.3A CN201610804006A CN107801352A CN 107801352 A CN107801352 A CN 107801352A CN 201610804006 A CN201610804006 A CN 201610804006A CN 107801352 A CN107801352 A CN 107801352A
- Authority
- CN
- China
- Prior art keywords
- main pipe
- pipe fittings
- evaporator
- radiating subassembly
- working fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
Abstract
The present invention provides a kind of radiating subassembly, and suitable for electronic installation, electronic installation has a thermal source, and radiating subassembly includes evaporator, main pipe fittings and at least one continued pipe fitting.Evaporator thermally contacts thermal source.Main pipe fittings connects evaporator and has an at least discontinuous portion.The pipe fitting that continues connects main pipe fittings and at discontinuous portion.Evaporator, main pipe fittings and the pipe fitting that continues form loop, and working fluid is filled in loop.Gaseous working fluid is mutually changed into steam state working fluid in evaporator heat absorption and is moved away from evaporator.Pass through main pipe fittings and the pipe fitting and radiating of continuing of steam state working fluid is mutually changed into flowing into evaporator after gaseous working fluid and circulating in the loop.
Description
Technical field
The present invention relates to a kind of radiating subassembly.
Background technology
With the development of science and technology existing electronic apparatus advances towards compact profile trend, thus
Structure configuration on also because tend to it is close cause the situation of insufficient space to occur.To allow electronic apparatus to have required hold concurrently
Row efficiency and heat dissipation, so organizational designer often faces the component that need to be configured in limited space needed for foregoing efficiency,
Also need to take into account overall structure simultaneously, to avoid the situation of structural strength deficiency, thus often organizational designer is formed suitable
Puzzlement.
But such cramped construction, which will also tend to produce in configuration with radiating component, to conflict, or makes electronic apparatus
The utilization rate of inner space can not optimize.For example, the existing hydrocone type radiating pipe fitting filled with working fluid, it is to make
It is used for the radiating of electronic apparatus, but it simultaneously be able to can not arbitrarily bend with trend, and cause is that the meeting of bending is serious
Influence the performance of its Section Space.For example, when hydrocone type radiating pipe fitting is linearly to set, its Section Space should be maximum
State, and once bend, then its Section Space can increase and be gradually reduced with the angle of its bending.It is consequently, it is possible to just easy
The flow velocity and flow of its interior working fluid are influenceed, and then influences its radiating efficiency.
It follows that to allow hydrocone type radiating pipe fitting to have preferable radiating efficiency, its external form necessarily reduces as much as possible
It produces the situation of bending, but such as the electronic apparatus of foregoing tight space, but can not unrestrictedly allow hydrocone type radiating tube
Part imposes straight line setting.
The content of the invention
The present invention provides a kind of radiating subassembly, and it has preferable space configuration and radiating efficiency.
The radiating subassembly of the present invention, suitable for electronic installation.Electronic installation has thermal source.Radiating subassembly include evaporator,
Main pipe fittings and at least one continue pipe fitting.Evaporator thermally contacts thermal source.Main pipe fittings connects evaporator, and main pipe fittings has at least one
Discontinuous portion.The pipe fitting that continues connects main pipe fittings and at discontinuous portion, and wherein evaporator, main pipe fittings and the pipe fitting that continues is formed back
Road, working fluid are filled in loop.Gaseous working fluid is mutually changed into steam state working fluid in evaporator heat absorption and is moved away from evaporator.
Steam state working fluid main pipe fittings of passing through pipe fitting and radiates with continuing and is mutually changed into flowing into evaporator after gaseous working fluid, and makes work
Fluid can circulate in the loop.
Based on above-mentioned, in the above embodiment of the present invention, radiating subassembly connects main pipe fittings by the pipe fitting that continues and is located at
At the discontinuous portion of main pipe fittings, therefore the configuration for effectively allowing main pipe fittings to have uniformity at discontinuous portion is able to,
That is, main pipe fittings can change the flow direction of working fluid because of the presence for the pipe fitting that continues.
Brief description of the drawings
Fig. 1 is a kind of radiating subassembly according to one embodiment of the invention applied to the schematic diagram in electronic installation.
Fig. 2 is the partial enlarged drawing of Fig. 1 electronic installations.
Fig. 3 is the electric connection schematic diagram of the electronic installation of another embodiment of the present invention.
Description of reference numerals：
100：Radiating subassembly 110：Evaporator
120：Main pipe fittings 122：Discontinuous portion
130：Continue pipe fitting 132：Entrance
134：Outlet 140：Heat pipe
200：Electronic installation 210：Thermal source
220：Circuit board 230：Battery
240：Metal cover 242：Lip
250：Retainer 310：Control module
320：Display chip 330：Battery
C1：Bent angle d1, d2：Internal diameter
F：Working fluid L1：First paragraph
L2：Second segment L3：3rd section
n1：First passage n2：Second channel
S1、S2：Side
Embodiment
To enable the features described above of the present invention and advantage to become apparent, special embodiment below, and coordinate institute's accompanying drawing to make
Describe in detail as follows.
Fig. 1 is a kind of radiating subassembly according to one embodiment of the invention applied to the schematic diagram in electronic installation, its China and foreign countries
Contouring dotted lines are in favor of recognizing the component in it.Fig. 2 is the partial enlarged drawing of Fig. 1 electronic installations.Referring to
Fig. 1 and Fig. 2, in the present embodiment, electronic installation 200 are, for example, tablet personal computer, have thermal source 210, it is for example disposed on electricity
Processor or display chip on road plate 220, and as circuit board 220 is configured in the left side of the inner space of electronic installation 200.
Meanwhile electronic installation 200 also includes battery 230, it is monolithic structure and configured on the right side of the inner space of electronic installation 200
Side and it is relative with thermal source 210 with aforementioned circuit plate 220.
Furthermore radiating subassembly 100 includes evaporator 110, main pipe fittings 120, continue pipe fitting 130 and heat pipe 140, wherein hot
Pipe 140 is contacted between thermal source 210 and evaporator 110, and heat produced by thermal source 210 is steamed by heat pipe 140 to be sent to
Send out device 110.Say, as shown in figure 1, electronic installation 200 has the metal cover 240 being covered on circuit board 220, thermal source Jin mono- Walk
210 are exposed to the opening of metal cover 240, and by the clasp of heat pipe 140 and are connected to by retainer 250 on thermal source 210, wherein hot
Between pipe 140 and thermal source 210 can direct physical contact, or by heat-conducting medium (such as heat-conducting cream, do not illustrate herein) by thermal source
Heat produced by 210 is conducted to heat pipe 140.
Main pipe fittings 120 connects evaporator 110, and main pipe fittings 120 has an at least discontinuous portion 122, should be noted herein
It is that said discontinuous portion 122 refers to that the pipe structure of main pipe fittings 120 exists to break and lost and discontinuous part.Such as Fig. 1 institutes
Show, the right side in figure of main pipe fittings 120 has two discontinuous portions 122, and then main pipe fittings 120 can be considered as to different multiple areas
Section, indicate first paragraph L1 in the present embodiment, second segment L2 and the 3rd section of L3, wherein first paragraph L1 are connected respectively with the 3rd section of L3
Evaporator 110 a, wherein discontinuous portion 122, between first paragraph L1 and second segment L2, another discontinuous portion 122 is located at second
Between L2 and the 3rd section of L3 of section.The pipe fitting 130 that continues connects main pipe fittings 120 and at the discontinuous portion 122, by main pipe fittings
120 different sections connect, and then form evaporator 110, the different sections of main pipe fittings 120 and the pipe fitting 130 that continues
Loop, and working fluid F is filled in the loop.Here, the loop is two phase flow heat siphon type radiating (Two-
Phase Flow Thermosyphon Cooling) loop, to be reached by working fluid F because of phase transformation produced by absorbing heat, radiating
To heat is conducted from thermal source 210 and dissipates out the effect of electronic installation 200.In Fig. 1 only with arrow sign working fluid F's
Flow direction is illustratively.
Specifically, just can heating evaporation device after heat is sent to evaporator 110 by foregoing heat pipe 140 from thermal source 210
Gaseous working fluid F in 110, and then make it absorb heat and produce mutually to be turned into steam state working fluid F, then steam state working fluid
F flows to main pipe fittings 120 from evaporator 110, and the first paragraph L1 that passes through successively, the pipe fitting 122 that continues, second segment L2, continue pipe fitting 122
And the 3rd section of L3, and in the process by the way that heat to be dissipated to remaining component of electronic installation 200 so that dissipating to week
By environment, and steam state working fluid F is set mutually to be changed into gaseous working fluid F because of radiating, and from the 3rd section of main pipe fittings 120
L3 flows back to evaporator 110 and completes do action.
Here, working fluid F is changed due to the presence for the pipe fitting 122 that continues between the different sections of main pipe fittings 120
Flow direction, as shown in figure 1, the discontinuous portion 122 of main pipe fittings 120 simultaneously and form bending place, namely first paragraph L1 and second
It is between section L2 and not parallel, and it is also not parallel between second segment L2 and the 3rd section of L3.Furthermore, the pipe fitting 130 that continues is real
Configuration at the discontinuous portion 122 is able to that the pipe structure of main pipe fittings 120 can be turned in matter, and does not therefore influence supervisor
The body section of part 120, that is, being collocated with each other by main pipe fittings 120 and the pipe fitting 130 that continues, and allow main pipe fittings 120 can be simultaneously
Have the flow and flow velocity for changing and flowing to without influenceing its interior working fluid F concurrently.
Consequently, it is possible to the main pipe fittings 120 of radiating subassembly 100 just can be improved master by the configuration for the pipe fitting 130 that continues
Compactness between pipe fitting 120 and other components of electronic installation 200.As shown in figure 1, in order to make structure configuration i.e. space sharp
With being optimized, therefore the radiating subassembly 100 of the present embodiment need to be set around battery 230.Now as the pipe fitting that continues is not present
When 130, that is, the external form profile that can correspond to battery 230 need to be bent by representing main pipe fittings 120, and this measure causes main pipe fittings 120
The situation that can reduce by bending of body section.Conversely, the bending angle of main pipe fittings 120 such as to be reduced, then the gesture of main pipe fittings 120
Therefore must there can be larger space between the external form profile of battery 230, thus be unfavorable for space configuration, and easily cause electricity
The waste of the inner space of sub-device 200.
To overcome above mentioned problem, the present embodiment is as follows in the layout of associated components：At least local ring of main pipe fittings 120 is around electricity
Pond 230, and discontinuous portion 122 is adjacent and corresponds to an at least bent angle C1 for the appearance profile of battery 230.In other words, this reality
Applying the battery 230 of example has bent angle C1 and the adjacent bent angle C1 two side S1, S2, the first paragraph L1 of main pipe fittings 120 and the
Two sections of L2 are connected wherein by the pipe fitting 130 that continues, and make first paragraph L1 second segment L2 is parallel to another parallel to a wherein side S1
One side S2.In the present embodiment, the bent angle C1 of battery be in 90 degree, therefore the first paragraph L1 and second segment L2 of main pipe fittings 120 that
This is also vertical, and right the present embodiment is not limiting as the bent angle C1 and main pipe fittings 120 angle of turn.Furthermore as shown in Fig. 2 connect
Continuous pipe fitting 130 it is also L-shaped because coordinating bent angle C1 and with first in A1 and second A2, wherein the first side A1 parallel sides
S1, and the second side A2 parallel sides S2.
Separately it should be mentioned that the pipe fitting 130 that continues is except entrance 132, outlet 134 are respectively required for coordinating first paragraph L1 and second segment L2
Caliber configuration it is outer.Continuing also has first passage n1 and second channel n2 inside pipe fitting 130, and it can be considered main pipe fittings respectively
120 first paragraph L1 and second segment L2 continuity, only first passage n1 internal diameter d1 be less than second channel n2 internal diameter d2, and according to
To be used as working fluid F in the acceleration for the pipe fitting 130 that continues.In addition, second segment L2 and the 3rd section of L3 and splicing sleeve therebetween
Part 130 also it has been observed that being omitted and being repeated no more herein.
It has been observed that configuring the discontinuous portion 122 in main pipe fittings 120 by the pipe fitting 130 that continues, and enable main pipe fittings 120
Bending is produced in the path of the position, and can therefore allow the bending state of main pipe fittings 120 and the external form profile one of battery 230
Cause, and overall structure (main pipe fittings 120, continue pipe fitting 130 and battery 230) is reached compact effect.This measure, allow designer without
It must worry to influence working fluid F flow situation (flow, flow velocity ... etc.) because path is bent.
Referring again to Fig. 1, heat is in addition to chip heat pipe 140 is sent to evaporator 110 produced by thermal source 210, moreover it is possible to transmits
To metal cover 240, to be sent to the casing of electronic installation 200 by metal cover 240 to dissipate out electronic installation 200.Furthermore
Main pipe fittings 120 is carried on the lip 242 of metal cover 240 in structure, also therefore in steam state working fluid F in first paragraph L1
Flow process in, its partial heat also can by metal cover 240 and dissipate.
In addition, as shown in figure 1, main pipe fittings 120 different sections surround and contact battery 230 different sides, thus
Working fluid F (flows through the section that main pipe fittings 120 contacts with battery 230) in flow process, also can therefore transfer heat to
Battery 230 or chip heat conduction connection pad (not illustrating) are sent to the casing of electronic installation 200, to reach the effect of radiating.In other words
Say, main pipe fittings 120 can be considered as the condensation end of radiating subassembly 100 around the part of battery 230.Especially in the present embodiment,
The thermal source 210 is the central processing element of electronic installation 200, therefore it has electrical connection between battery 230, so that
Thermal source 210 also has the ability of driving battery 230 simultaneously.Therefore, when thermal source 210 is the state in power effect operating, this reality
The pause operating of battery 230 can also be driven by applying the thermal source 210 of example, therefore can improve the temperature difference of battery 230 and evaporator 110 according to this
Different (that is, the temperature of evaporator 110 is more than the temperature of battery 230), so for radiating subassembly 100, now stop fortune
The battery 230 turned can be if metal cover 240 is generally as the region of radiating.
On the other hand, in another embodiment that the present invention does not illustrate, also allow for foregoing main pipe fittings and be surrounded on solid state hard disc
(SSD) configuring, also one piece is only capable of surrounding setting by main pipe fittings and can not extended there through the solid state hard disc, because
This is configured and contacted by appearance profile of the main pipe fittings along solid state hard disc is able to condense and phase transformation to provide steam state working fluid F
Go back to the region of gaseous working fluid.The architectural feature of the solid state hard disc can from the art it is known that therefore just repeat no more,
The present embodiment is only that description main pipe fittings and the opposed configuration relation of solid state hard disc.
Fig. 3 is the electric connection schematic diagram of the electronic installation of another embodiment of the present invention.Unlike previous embodiment,
The thermal source of the present embodiment is the display chip 320 of electronic installation, and it is respectively and electrically connected to control module 310 with battery 330, because
This equally can according to this be started according to the operating condition of display chip 320 by control module 310 or close battery, be radiated with allowing
The main pipe fittings of component can pass through and contact battery 330 and be used as condensation.
In summary, in the above embodiment of the present invention, radiating subassembly connects main pipe fittings by the pipe fitting that continues and is located at
At the discontinuous portion of main pipe fittings, therefore the configuration for effectively allowing main pipe fittings to have uniformity at discontinuous portion is able to,
That is, main pipe fittings can change the flow direction of working fluid because of the presence for the part that continues.
Furthermore, it is more compact except that can reach because main pipe fittings is surrounded at the circumference of one piece
Space configuration outside, moreover it is possible to the condensation of radiating subassembly is become by main pipe fittings and the mutual form touch of one piece
End, working fluid effectively radiating effect, the also presence because of the above-mentioned pipe fitting that continues are provided according to this, allow main pipe fittings to be able to needing road
Footpath turning just can be using the pipe fitting that continues as connection, and main pipe fittings is changed its path with the external form of one piece
And need not worry that body causes section deformation because of bending and the situation such as reduces, and remain to maintain the flow of its interior working fluid with
Flow velocity.
Although the present invention is disclosed above with embodiment, so it is not intended to limit the present invention, any art
Middle tool usually intellectual, without departing from the spirit and scope of the present invention, when a little change and retouching can be made, thus it is of the invention
Protection domain when being defined depending on those as defined in claim.
Claims (10)
1. a kind of radiating subassembly, suitable for an electronic installation, the electronic installation has a thermal source, and the radiating subassembly includes：
One evaporator, thermally contact the thermal source；
One main pipe fittings, the evaporator is connected, the main pipe fittings has an at least discontinuous portion；
At least one continues pipe fitting, connects the main pipe fittings and at the discontinuous portion, wherein the evaporator, the main pipe fittings and this connect
Continuous pipe fitting forms primary Ioops, and a working fluid is filled in the loop, and gaseous working fluid is mutually changed into steam state in evaporator heat absorption
Working fluid and be moved away from the evaporator, steam state working fluid pass through the main pipe fittings with this continue pipe fitting and radiate mutually be changed into liquid work
Flow into the evaporator after making fluid and circulated in the loop.
2. radiating subassembly according to claim 1, it is characterised in that the main pipe fittings has a first paragraph and a second segment,
The pipe fitting that continues is connected between the first paragraph and the second segment, and the working fluid is passed through the first paragraph, the pipe fitting that continues successively
With the second segment, the first paragraph is not parallel to the second segment.
3. radiating subassembly according to claim 1, it is characterised in that the electronic installation also has a component, the main pipe fittings
At least local ring around the component, and an at least discontinuous portion is adjacent and an at least bent angle corresponding to the component.
4. radiating subassembly according to claim 3, it is characterised in that the main pipe fittings has a first paragraph and a second segment,
The pipe fitting that continues is connected between the first paragraph and the second segment, and the component also has the two of the opposite sides for abutting against the bent angle
Side, the first paragraph is parallel to a wherein side, and the second segment is parallel to another side.
5. radiating subassembly according to claim 4, it is characterised in that first segment structure is connected to a wherein side, should
Second segment structure is connected to another side.
6. radiating subassembly according to claim 4, it is characterised in that the pipe fitting that continues it is L-shaped and with one first side with
One second side, first side is parallel to a wherein side for the component, another side of second side parallel to the component.
7. radiating subassembly according to claim 3, it is characterised in that the bent angle is 90 degree.
8. radiating subassembly according to claim 3, it is characterised in that the component is the battery or solid-state in monolithic structure
Hard disk.
9. radiating subassembly according to claim 8, it is characterised in that the electronic installation also has a control module, electrically
The battery and the thermal source are connected, when the thermal source is in full effect operating condition, the control module drives the battery or the solid-state hard
Disk pause operating.
10. radiating subassembly according to claim 1, it is characterised in that the loop is that two phase flow heat siphon type radiates back
Road.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804006.3A CN107801352A (en) | 2016-09-06 | 2016-09-06 | Radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610804006.3A CN107801352A (en) | 2016-09-06 | 2016-09-06 | Radiating subassembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107801352A true CN107801352A (en) | 2018-03-13 |
Family
ID=61530421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610804006.3A Pending CN107801352A (en) | 2016-09-06 | 2016-09-06 | Radiating subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107801352A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1941337A (en) * | 2005-09-30 | 2007-04-04 | 三洋电机株式会社 | Electronic equipment cooling plant and electronic equipment |
| CN101022097A (en) * | 2007-03-13 | 2007-08-22 | 秦彪 | Circulating hot tube type radiator |
| CN101308398A (en) * | 2008-06-30 | 2008-11-19 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| TWI424139B (en) * | 2011-08-17 | 2014-01-21 | Giga Byte Tech Co Ltd | Thermal siphon radiator |
| TWM502875U (en) * | 2015-01-20 | 2015-06-11 | Acer Inc | Heat dissipation module |
| JP2015132400A (en) * | 2014-01-10 | 2015-07-23 | 富士通株式会社 | Loop type heat pipe, manufacturing method of the same, and electronic device |
-
2016
- 2016-09-06 CN CN201610804006.3A patent/CN107801352A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1941337A (en) * | 2005-09-30 | 2007-04-04 | 三洋电机株式会社 | Electronic equipment cooling plant and electronic equipment |
| CN101022097A (en) * | 2007-03-13 | 2007-08-22 | 秦彪 | Circulating hot tube type radiator |
| CN101308398A (en) * | 2008-06-30 | 2008-11-19 | 中山大学 | Radiation system for calculation processing arrangements and equipment adopting the heat radiation system |
| TWI424139B (en) * | 2011-08-17 | 2014-01-21 | Giga Byte Tech Co Ltd | Thermal siphon radiator |
| JP2015132400A (en) * | 2014-01-10 | 2015-07-23 | 富士通株式会社 | Loop type heat pipe, manufacturing method of the same, and electronic device |
| TWM502875U (en) * | 2015-01-20 | 2015-06-11 | Acer Inc | Heat dissipation module |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
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Application publication date: 20180313 |