CN110058663A - A kind of radiator and the electronic equipment with the radiator - Google Patents
A kind of radiator and the electronic equipment with the radiator Download PDFInfo
- Publication number
- CN110058663A CN110058663A CN201810049179.8A CN201810049179A CN110058663A CN 110058663 A CN110058663 A CN 110058663A CN 201810049179 A CN201810049179 A CN 201810049179A CN 110058663 A CN110058663 A CN 110058663A
- Authority
- CN
- China
- Prior art keywords
- radiator
- accommodating case
- cooling medium
- electronic equipment
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Abstract
The present invention discloses a kind of radiator, radiating treatment for electronic device power element, accommodating case and fan are sealed including cooling medium, wherein, cooling medium in the cooling medium sealing accommodating case is non-full state, the accommodating case has the heat absorbent surface for being bonded with to heat radiation power element surface, and other surfaces are fixedly connected with multiple radiating fins；The work wind flow path of the fan covers the accommodating case.Using the radiator, the radiating treatment of function element can be fast and effeciently realized；On the basis of meeting basic cooling requirements, radiating component can be reduced to the maximum extent and be taken up space, cost of goods manufactured is controllable.Security reliability is higher, is easily installed, detects and transports.The present invention also provides a kind of electronic equipments with the radiator.
Description
Technical field
The present invention relates to power component technical field of heat dissipation, and in particular to a kind of radiator and with the radiator
Electronic equipment.
Background technique
Electronic equipment has the power component to generate heat at work mostly, for example, the chip of PC machine, host control panel etc..
It is well known that the above-mentioned power component as equipment main member overheats, then the normal use of electronic equipment is directly affected, because
This, effective heat dissipation of power component is one of the key point of overall performance guarantee.
Currently, in addition to fan cooling technology, based on the evaporation cooling technique of boiling mechanism power component radiating treatment
In applied.A kind of typical scheme is that the component and power component for accommodating cooling medium using one carry out heat exchange,
Condenser is entered by liquid collecting pipeline after the cooling medium phase transformation of completion heat absorption；In the condenser for being placed in top, cooling medium
It is flowed back to after heat release phase transformation by liquid back pipe road.However, being limited by its own structure, the program is had the disadvantage that
First, in the prior art including pipeline and condenser units, overall structure is complex, production cost compared with
It is high.
Second, heat dissipation effect is undesirable.Condenser is necessarily placed at the top of whole system, for personal PC,
Its circuit main board structure on cabinet inner height direction is compact, and the design space of condenser is smaller, directly affects to totality
Heat dissipation effect；In particular, electronic equipment small develops, the compact feature in inner space is especially prominent.Meanwhile in product
It cannot arbitrarily place in actual use, if direction changes and can will lead to cooling medium and cannot normally follow in systems
Ring, so that system cannot be completed effectively to radiate.
Third, reliability is lower.Existing scheme needs to carry out liquid filling drain processing according to actual use situation, has more
Interface is easy to appear fluid leakage problems in maintenance, transportational process in this way.
In view of this, it would be highly desirable to carry out structure optimization for the evaporation cooling technique of existing power component, be dissipated reliably
On the basis of thermal effect, production cost is effectively controlled.
Summary of the invention
In order to solve the above technical problems, the present invention provides a kind of radiator and the electronic equipment with the radiator,
The apparatus structure is simple and reliable, can efficiently use the assembly space of electronic equipment internal, obtains optimal heat dissipation performance.
Radiator provided by the invention is sealed for the radiating treatment of electronic device power element, including cooling medium
Accommodating case and fan, wherein the cooling medium in the cooling medium sealing accommodating case is non-full state, the accommodating case tool
There is the heat absorbent surface for being bonded with to heat radiation power element surface, and other surfaces are fixedly connected with multiple radiating fins；Institute
The work wind flow path for stating fan covers the accommodating case.
Preferably, the inner wall surface of the accommodating case opposite with the heat absorbent surface does enhanced boiling heat transfer processing, institute
Stating enhanced boiling heat transfer processing includes electrochemical etching, surface groove, surface fin or surface sintered porous material.
Preferably, the non-full state is that cooling medium is no less than the 2/3 of the accommodating case volume.
Preferably, the accommodating case is whole in a rectangular parallelepiped shape, the different form of cylindrical shape or non-standard solid.
It preferably, further include thermally conductive strutbeam, one end is fixedly connected with the outer surface of the accommodating case, and other end side prolongs
It stretches, and elongated end has auxiliary heat absorbent surface.
It preferably, further include the fixation bracket being connected with the accommodating case, the fixed bracket, which has, to be used for and power
The interconnecting piece that element or electronic equipment are fixedly connected.
Preferably, the fixed structure of the fan is fixedly connected with the fixed bracket.
Preferably, the fixed structure of the fan is one of the forming with the fin.
Electronic equipment provided by the invention, including power component；It further include foregoing radiator.
Preferably, the electronic equipment is individual PC.
The present invention considers the lesser feature in electronic equipment internal space, looks for another way for power component and proposes one kind
Radiating treatment scheme.Compared with prior art, it has the advantages that
Firstly, this programme is bonded, base using the sealing accommodating case for being marked with cooling medium with the surface to heat radiation power element
Ensure sufficiently to be absorbed heat in boiling mechanism, after a part of cooling medium absorbs the heat that power component work generates, temperature liter
It up to arrives boiling point and is vaporizated into steam, liquid will be condensed by touching accommodating case cavity wall surface；Another part absorbs power component heat
Amount and unboiled liquid by the thermally conductive fin transferred heat to outside accommodating case of convection current and accommodating case wall surface becomes low
The liquid of temperature, the heat that can rapidly will be transmitted to surface fin under the action of fan are taken away, thus fast and effeciently real
The heat dissipation of existing power component.Using the heat sink conception of the structure type, heat exchange efficiency is compared traditional air cooling fin and can be increased to
40% or more.
Secondly, can reduce to the maximum extent radiating component on the basis of meeting basic cooling requirements and be taken up space, structure
It is simple and reliable, cost of goods manufactured can be substantially reduced, commercialization is more advantageous to.
Again, this programme effectively excessively can lead to the defect leaked by avoidance system interface, and security reliability is higher, convenient for peace
Dress, detection and transport.
Finally, for electronic equipment use posture there is no limit, the radiator under any modes of emplacement can be just
Often reach heat sinking function.
Detailed description of the invention
Fig. 1 is the overall structure diagram of radiator described in embodiment one；
Fig. 2 is the A-A cross-sectional view of Fig. 1；
Fig. 3 is the overall structure diagram of radiator described in embodiment two；
Fig. 4 is the B-B cross-sectional view of Fig. 3.
In figure:
Chip 1, the first chip 11, the second chip 12, third chip 13, accommodating case 2, heat absorbent surface 21, inner wall surface 22,
Radiating fin 3, fan 4, fixed bracket 5, the first thermally conductive strutbeam 61, first assist heat absorbent surface 611, the second thermally conductive strutbeam 62,
Second auxiliary heat absorbent surface 612.
Specific embodiment
It is with reference to the accompanying drawing and specific real in order to make those skilled in the art more fully understand technical solution of the present invention
Applying example, the present invention is described in further detail.
Embodiment one:
Without loss of generality, description main body of the present embodiment using the cpu chip of personal PC as power component is described in detail
The radiator technical solution that the application proposes.In cabinet, which is mounted on circuit main board, provided by the present application
Radiator provides effective solution for the radiating treatment of the cpu chip 1.It should be appreciated that itself function of cpu chip 1
Energy feature, does not constitute radiator described herein limitation on essential meaning.
Referring to Figure 1 and Fig. 2, Fig. 1 show the overall structure diagram of radiator described in embodiment one, Fig. 2 Fig. 1
A-A cross-sectional view.
As shown, the radiator mainly includes sealing accommodating case 2,4 three basic structure of radiating fin 3 and fan.Its
In, for accommodating cooling medium (not shown) in sealing accommodating case 2, cooling medium should be non-full state, to build
Found good refrigeration phase change conditions.
The heat absorbent surface 21 of the accommodating case 2 with chip 1 for fitting closely, here, the surface shape of the heat absorbent surface 21
It is not limited to plane shown in figure, it can be completely suitable with the heating surface shape to radiating treatment chip 1 as the preferably surface
Match, sufficiently to carry out heat transfer exchange.It is understood that when heat absorbent surface 21 is set as plane, as long as to heat dissipation element
Overall size is properly applicable, has better adaptability；And heat absorbent surface 21 and certain power element heating face is thin
When micro concavo-convex structure is adapted to, special designs are equivalent to, manufacturing cost is relatively higher, but can obtain best heat dissipation effect.
Wherein, multiple radiating fins 3 are fixedly connected in the other surfaces of the accommodating case 2, and fan 4 is relative to accommodating case 2
Fixed setting, work wind flow path covers accommodating case 2, to take away the heat on fin fast and reliablely.Fan 4 can
It to be enabled using booting, can also be enabled again when chip temperature up to enables threshold values, that is to say, that according to distinct device difference
The corresponding starting fan control strategy of the formulation of power component.
It should be noted that the specific setting quantity and density of radiating fin 3 select, it can be according to the practical operating condition need that radiate
It is set, for example, the position of highest heat generating spot, the relative positional relationship between power component and cooling medium accommodating case,
And fan functionality parameter etc..As long as specific choice and setting meet the central inventive concept of the application, requested in the application
In the range of protection.
In addition, as with to heat radiation power element be adapted to heat dissipation upstream side component, except its heat absorbent surface 21 preferably with
Power component heating surface adaptation is outer, and 2 global shape of accommodating case can be selected arbitrarily, for example, can using in a rectangular parallelepiped shape, cylinder
The standard primitives of body shape.It is understood that obtaining optimal system boiling heat transfer to efficiently use the internal confined space
Efficiency, accommodating case 2 can use the different form of non-standard solid, to adapt to internal existing arrangement space.
In order to which the exchange capability of heat and system boiling heat transfer efficiency of low boiling point cooling medium is better balanced, further, hold
The loading of low boiling point cooling medium is no less than 2/3 in case 2, that is to say, that the non-full state is no less than for cooling medium
The 2/3 of 2 volume of accommodating case is optimal case.
As the heat dissipation auxiliary part of electronic device power element, also need to consider reasonable package assembly.The heat dissipation
Device can add fixed bracket, be connected with accommodating case 2, preferably fix and connect with the ontology of the preferable accommodating case 2 of structural rigidity
It connects, which has the interconnecting piece 51 for being fixedly connected, specifically can be with the fixation of 1 side of chip in electronic equipment
Structural member is attached；Obviously, if link position can be arranged in power component itself, which can directly and power
Element is fixedly connected with (not shown).
Based on the tool-free design concept quickly assembled, which is to be detachably connected portion, for example, can be using card
Close structure or grafting fastening structure.
In addition, the fixed structure of fan 4 can preferably be one of the forming with fin, anticipate as shown, it in this way can be with maximum limit
The reduction radiator outer dimension of degree, reduces its size requirements to assembly space, is commercialization optimal case.In addition may be used also
To use such design, the fixed structure of fan 4 and fixed bracket 5 are connected and fixed, so set, 4 running noises of fan
Relatively small, stability is higher.
For high heating power element, further structure optimization can be made.Specifically, the appearance opposite with heat absorbent surface 21
2 inner wall surface 22 of case can do enhanced boiling heat transfer processing, so as to form boiling structure, enhanced boiling heat transfer processing is strengthened
Including electrochemical etching, surface groove, surface fin or surface sintered porous material.Here, it is formed by reinforcing boiling structure
Actual size can carry out parameter setting based on specific refrigeration radiating demand, efficiently cooling to achieve the purpose that.
The present embodiment can carry out radiating treatment for particular CPU chip.In general, electronic equipment includes multiple heating power members
Part, further includes other small chips in addition to CPU main core, and following embodiments two provide a kind of for the offer of multiple heating power elements
The preferred embodiment of radiating treatment.
Embodiment two:
Please also refer to Fig. 3 and Fig. 4, wherein Fig. 3 is the overall structure diagram of radiator described in embodiment two, Fig. 4
For the B-B cross-sectional view of Fig. 3.
The basic composition and connection relationship of this programme are the same as example 1, and the main distinction is to have additional thermally conductive strutbeam.
For the material relation for aiding in illustrating two embodiments, for identical function component, relevant drawings are shown using same reference numerals
It is bright.
As shown, in the fixed setting of the outer surface of accommodating case 2, there are two thermally conductive strutbeams, are respectively used to the first chip of processing
Other heating power elements of 11 sides: the second chip 12 and third chip 13, wherein the first thermally conductive strutbeam 61 and second is thermally conductive
62 one end accommodating case 2 of strutbeam is fixedly connected, and can weld or integrally formed sufficiently to realize heat transfer；Two thermally conductive strutbeams it is another
It holds to side heating function element and extends, specifically, the first thermally conductive strutbeam 61 has the first auxiliary being adapted to the second chip 12
Heat absorbent surface 611, the second thermally conductive strutbeam 62 have the second auxiliary heat absorbent surface 612 being adapted to third chip 13.
It should be noted that each thermally conductive strutbeam can carry out adaptability according to a specific side heating power element
Ground design, certainly, the heat radiation combination that the present embodiment is established using thermally conductive strutbeam and accommodating case 2, can also be applied to a breadth compared with
The big and inconvenient heating power element that heat exchange is only sufficiently completed by accommodating case 2.
In addition to the embodiment previously with regard to radiator, present embodiment also provides a kind of electronic equipment, including power member
Part；It further include foregoing radiator.The electronic equipment can preferably individual PC.It should be appreciated that the PC's includes function
Building blocks of function including rate element (chip) can be realized using the prior art, and not this Applicant's Abstract graph verification inventive point place,
Therefore, this article will not repeat them here.
It should be noted that above-described embodiment that present embodiment provides, the relative positional relationship between each component are not
It is confined to radiator as shown in the figure, it should be understood that as long as core idea is consistent with this programme claimed in the application
In range.
The above is only the preferred embodiment of the present invention, it is noted that those skilled in the art are come
It says, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of radiator, the radiating treatment for electronic device power element characterized by comprising
Cooling medium seal accommodating case, in cooling medium be non-full state, the accommodating case have for wait radiate
The heat absorbent surface of power component surface fitting, and other surfaces are fixedly connected with multiple radiating fins；
Fan, work wind flow path cover the accommodating case.
2. radiator according to claim 1, which is characterized in that the accommodating case opposite with the heat absorbent surface
Inner wall surface does enhanced boiling heat transfer processing, and the enhanced boiling heat transfer processing includes electrochemical etching, surface groove, surface wing
Piece or surface sintered porous material.
3. radiator as claimed in claim 1 or 2, which is characterized in that the non-full state is no less than for cooling medium
The 2/3 of the accommodating case volume.
4. radiator as claimed in claim 3, which is characterized in that the accommodating case is whole in a rectangular parallelepiped shape, cylindrical shape
Or the different form of non-standard solid.
5. radiator as described in claim 1, which is characterized in that further include:
Thermally conductive strutbeam, one end are fixedly connected with the outer surface of the accommodating case, and other end side extends, and elongated end is with auxiliary
Help heat absorbent surface.
6. radiator as described in claim 1, which is characterized in that further include:
The fixation bracket being connected with the accommodating case, the fixed bracket have for fixing with power component or electronic equipment
The interconnecting piece of connection.
7. radiator as claimed in claim 6, which is characterized in that the fixed structure of the fan and the fixed bracket are solid
Fixed connection.
8. radiator as described in claim 1, which is characterized in that the fixed structure of the fan is integrated with the fin
Forming.
9. a kind of electronic equipment, including power component；It is characterized in that, further including as described in any item of the claim 1 to 8
Radiator.
10. electronic equipment as claimed in claim 9, which is characterized in that the electronic equipment is individual PC.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810049179.8A CN110058663A (en) | 2018-01-18 | 2018-01-18 | A kind of radiator and the electronic equipment with the radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810049179.8A CN110058663A (en) | 2018-01-18 | 2018-01-18 | A kind of radiator and the electronic equipment with the radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110058663A true CN110058663A (en) | 2019-07-26 |
Family
ID=67315202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810049179.8A Pending CN110058663A (en) | 2018-01-18 | 2018-01-18 | A kind of radiator and the electronic equipment with the radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110058663A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112366192A (en) * | 2020-12-01 | 2021-02-12 | 哈尔滨工业大学 | Electronic component heat abstractor based on electric field regulation and control solid-liquid phase change |
| CN112506317A (en) * | 2020-11-27 | 2021-03-16 | 努比亚技术有限公司 | Heat radiation structure and terminal |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
| CN102072680A (en) * | 2010-05-31 | 2011-05-25 | 束必锬 | Boiling type radiator with high heat-conducting property |
| CN102683307A (en) * | 2012-05-31 | 2012-09-19 | 东南大学 | CPU (Central Processing Unit) radiator with combined corner-tube type flat self-excited capillary heat pipe |
| CN103068210A (en) * | 2012-12-27 | 2013-04-24 | 中国科学院深圳先进技术研究院 | Novel motor controller heat dissipation system |
-
2018
- 2018-01-18 CN CN201810049179.8A patent/CN110058663A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102072680A (en) * | 2010-05-31 | 2011-05-25 | 束必锬 | Boiling type radiator with high heat-conducting property |
| CN101894812A (en) * | 2010-06-13 | 2010-11-24 | 华东理工大学 | Evaporator for cooling chip and manufacture method thereof |
| CN102683307A (en) * | 2012-05-31 | 2012-09-19 | 东南大学 | CPU (Central Processing Unit) radiator with combined corner-tube type flat self-excited capillary heat pipe |
| CN103068210A (en) * | 2012-12-27 | 2013-04-24 | 中国科学院深圳先进技术研究院 | Novel motor controller heat dissipation system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112506317A (en) * | 2020-11-27 | 2021-03-16 | 努比亚技术有限公司 | Heat radiation structure and terminal |
| CN112366192A (en) * | 2020-12-01 | 2021-02-12 | 哈尔滨工业大学 | Electronic component heat abstractor based on electric field regulation and control solid-liquid phase change |
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| PB01 | Publication | ||
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Application publication date: 20190726 |