KR20060130585A - 열가소성 수지 조성물, 기판용 재료 및 기판용 필름 - Google Patents
열가소성 수지 조성물, 기판용 재료 및 기판용 필름 Download PDFInfo
- Publication number
- KR20060130585A KR20060130585A KR1020067011685A KR20067011685A KR20060130585A KR 20060130585 A KR20060130585 A KR 20060130585A KR 1020067011685 A KR1020067011685 A KR 1020067011685A KR 20067011685 A KR20067011685 A KR 20067011685A KR 20060130585 A KR20060130585 A KR 20060130585A
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- KR
- South Korea
- Prior art keywords
- thermoplastic resin
- resin
- resin composition
- layered silicate
- inorganic compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004416 thermosoftening plastic Substances 0.000 title abstract description 7
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- 239000011342 resin composition Substances 0.000 claims abstract description 67
- 229910010272 inorganic material Inorganic materials 0.000 claims abstract description 48
- 150000002484 inorganic compounds Chemical class 0.000 claims abstract description 47
- 238000002844 melting Methods 0.000 claims abstract description 23
- 230000008018 melting Effects 0.000 claims abstract description 23
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- 229920005989 resin Polymers 0.000 claims description 100
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- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims description 76
- 239000002245 particle Substances 0.000 claims description 13
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- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 33
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- 239000004593 Epoxy Substances 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
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- 238000012360 testing method Methods 0.000 description 4
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- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
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- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 239000003945 anionic surfactant Substances 0.000 description 3
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- 238000002485 combustion reaction Methods 0.000 description 3
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- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 3
- 125000003827 glycol group Chemical group 0.000 description 3
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 description 3
- 229910000271 hectorite Inorganic materials 0.000 description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 3
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- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
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- 229910000077 silane Inorganic materials 0.000 description 3
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- QQOMQLYQAXGHSU-UHFFFAOYSA-N 2,3,6-Trimethylphenol Chemical compound CC1=CC=C(C)C(O)=C1C QQOMQLYQAXGHSU-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
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- 125000005396 acrylic acid ester group Chemical group 0.000 description 2
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 description 2
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K2003/343—Peroxyhydrates, peroxyacids or salts thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003417175 | 2003-12-15 | ||
| JPJP-P-2003-00417175 | 2003-12-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20060130585A true KR20060130585A (ko) | 2006-12-19 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020067011685A Ceased KR20060130585A (ko) | 2003-12-15 | 2004-12-14 | 열가소성 수지 조성물, 기판용 재료 및 기판용 필름 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US20070072963A1 (enExample) |
| EP (1) | EP1696003A4 (enExample) |
| JP (1) | JP4083190B2 (enExample) |
| KR (1) | KR20060130585A (enExample) |
| CN (1) | CN1894342A (enExample) |
| TW (1) | TW200602411A (enExample) |
| WO (1) | WO2005056684A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090093578A1 (en) * | 2006-03-08 | 2009-04-09 | Carlos Guerra | Transparent stretched acrylic sheets for aircraft window systems having controlled solar transmittance properties |
| US20070210286A1 (en) * | 2006-03-08 | 2007-09-13 | Spartech Corporation | Transparent plastic articles having controlled solar energy transmittance properties and methods of making |
| US20070210287A1 (en) * | 2006-03-08 | 2007-09-13 | Spartech Corporation | Transparent plastic articles having controlled solar energy transmittance properties and methods of making |
| RU2332721C1 (ru) * | 2007-02-26 | 2008-08-27 | Российская Федерация, от имени которой выступает Федеральное агентство по атомной энергии (Росатом) | Устройство для охранной сигнализации |
| TWI643736B (zh) * | 2010-09-29 | 2018-12-11 | 聖高拜塑膠製品公司 | 障壁膜或織物 |
| EP4383457A4 (en) * | 2021-08-05 | 2024-12-11 | Asahi Kasei Kabushiki Kaisha | ANTENNA ELEMENT |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1996025460A1 (en) * | 1995-02-16 | 1996-08-22 | Chisso Corporation | Crystalline polyolefin resin composition and electrical insulation parts made from said composition |
| DE69632617T2 (de) * | 1995-11-02 | 2005-06-16 | Mitsubishi Chemical Corp. | Kristalline, thermoplastische Kunststoffzusammensetzung |
| US6060549A (en) * | 1997-05-20 | 2000-05-09 | Exxon Chemical Patents, Inc. | Rubber toughened thermoplastic resin nano composites |
| CN1253498C (zh) * | 1999-11-12 | 2006-04-26 | 积水化学工业株式会社 | 聚烯烃树脂组合物 |
| JP4345203B2 (ja) * | 2000-06-30 | 2009-10-14 | パナソニック株式会社 | 加熱調理器 |
| US20050260404A1 (en) * | 2000-08-25 | 2005-11-24 | Tetsunari Iwade | Sheet-form molding |
| JP3819701B2 (ja) * | 2000-11-10 | 2006-09-13 | 三菱樹脂株式会社 | ビルドアップ多層プリント配線基板用コア基板 |
| JP3863771B2 (ja) * | 2000-12-08 | 2006-12-27 | 積水化学工業株式会社 | 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ |
| US20040053061A1 (en) * | 2000-12-08 | 2004-03-18 | Koji Yonezawa | Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg |
| KR100884294B1 (ko) * | 2001-02-08 | 2009-02-18 | 미쓰이 가가쿠 가부시키가이샤 | 에틸렌과 탄소수 3 ~ 20의 α-올레핀의 랜덤 공중합체와 그것을 사용한 성형품 |
| JP3955188B2 (ja) * | 2001-05-21 | 2007-08-08 | 三菱樹脂株式会社 | 基板用耐熱フィルムおよびこれを用いたプリント配線基板 |
| WO2003066740A1 (en) * | 2002-02-06 | 2003-08-14 | Sekisui Chemical Co., Ltd. | Resin composition |
| JP2003313313A (ja) * | 2002-02-22 | 2003-11-06 | Sekisui Chem Co Ltd | 離型フィルム |
| JP4268456B2 (ja) * | 2002-06-07 | 2009-05-27 | 積水化学工業株式会社 | 樹脂基板材料 |
| JP2004149584A (ja) * | 2002-10-29 | 2004-05-27 | Fuji Photo Film Co Ltd | 有機変性層状珪酸塩を含有する樹脂組成物、フィルム、ガスバリア性フィルム、並びにそれらを用いた基板及び画像表示素子 |
| JP2004244510A (ja) * | 2003-02-13 | 2004-09-02 | Sekisui Chem Co Ltd | 樹脂組成物、樹脂シート、配線基板及びコーティング剤 |
-
2004
- 2004-12-14 US US10/582,883 patent/US20070072963A1/en not_active Abandoned
- 2004-12-14 KR KR1020067011685A patent/KR20060130585A/ko not_active Ceased
- 2004-12-14 CN CNA2004800372649A patent/CN1894342A/zh active Pending
- 2004-12-14 EP EP04806984A patent/EP1696003A4/en not_active Withdrawn
- 2004-12-14 WO PCT/JP2004/018623 patent/WO2005056684A1/ja not_active Ceased
- 2004-12-14 JP JP2005516228A patent/JP4083190B2/ja not_active Expired - Fee Related
- 2004-12-15 TW TW093139005A patent/TW200602411A/zh not_active IP Right Cessation
-
2009
- 2009-06-20 US US12/488,560 patent/US20090256283A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| EP1696003A4 (en) | 2008-07-30 |
| JP4083190B2 (ja) | 2008-04-30 |
| US20070072963A1 (en) | 2007-03-29 |
| CN1894342A (zh) | 2007-01-10 |
| WO2005056684A1 (ja) | 2005-06-23 |
| TW200602411A (en) | 2006-01-16 |
| TWI314942B (enExample) | 2009-09-21 |
| US20090256283A1 (en) | 2009-10-15 |
| JPWO2005056684A1 (ja) | 2007-07-19 |
| EP1696003A1 (en) | 2006-08-30 |
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