JP4083190B2 - 賦型体の製造方法、基板用材料及び基板用フィルム - Google Patents

賦型体の製造方法、基板用材料及び基板用フィルム Download PDF

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Publication number
JP4083190B2
JP4083190B2 JP2005516228A JP2005516228A JP4083190B2 JP 4083190 B2 JP4083190 B2 JP 4083190B2 JP 2005516228 A JP2005516228 A JP 2005516228A JP 2005516228 A JP2005516228 A JP 2005516228A JP 4083190 B2 JP4083190 B2 JP 4083190B2
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JP
Japan
Prior art keywords
resin
thermoplastic resin
layered silicate
weight
thermoplastic
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Expired - Fee Related
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JP2005516228A
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English (en)
Japanese (ja)
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JPWO2005056684A1 (ja
Inventor
晃一 柴山
光治 米澤
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K2003/343Peroxyhydrates, peroxyacids or salts thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00Properties
    • C08L2201/02Flame or fire retardant/resistant
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00Applications
    • C08L2203/20Applications use in electrical or conductive gadgets
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0129Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203Fillers and particles
    • H05K2201/0206Materials
    • H05K2201/0209Inorganic, non-metallic particles

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2005516228A 2003-12-15 2004-12-14 賦型体の製造方法、基板用材料及び基板用フィルム Expired - Fee Related JP4083190B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003417175 2003-12-15
JP2003417175 2003-12-15
PCT/JP2004/018623 WO2005056684A1 (ja) 2003-12-15 2004-12-14 熱可塑性樹脂組成物、基板用材料及び基板用フィルム

Publications (2)

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JPWO2005056684A1 JPWO2005056684A1 (ja) 2007-07-19
JP4083190B2 true JP4083190B2 (ja) 2008-04-30

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Family Applications (1)

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JP2005516228A Expired - Fee Related JP4083190B2 (ja) 2003-12-15 2004-12-14 賦型体の製造方法、基板用材料及び基板用フィルム

Country Status (7)

Country Link
US (2) US20070072963A1 (enExample)
EP (1) EP1696003A4 (enExample)
JP (1) JP4083190B2 (enExample)
KR (1) KR20060130585A (enExample)
CN (1) CN1894342A (enExample)
TW (1) TW200602411A (enExample)
WO (1) WO2005056684A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2332721C1 (ru) * 2007-02-26 2008-08-27 Российская Федерация, от имени которой выступает Федеральное агентство по атомной энергии (Росатом) Устройство для охранной сигнализации

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090093578A1 (en) * 2006-03-08 2009-04-09 Carlos Guerra Transparent stretched acrylic sheets for aircraft window systems having controlled solar transmittance properties
US20070210286A1 (en) * 2006-03-08 2007-09-13 Spartech Corporation Transparent plastic articles having controlled solar energy transmittance properties and methods of making
US20070210287A1 (en) * 2006-03-08 2007-09-13 Spartech Corporation Transparent plastic articles having controlled solar energy transmittance properties and methods of making
TWI643736B (zh) * 2010-09-29 2018-12-11 聖高拜塑膠製品公司 障壁膜或織物
EP4383457A4 (en) * 2021-08-05 2024-12-11 Asahi Kasei Kabushiki Kaisha ANTENNA ELEMENT

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996025460A1 (en) * 1995-02-16 1996-08-22 Chisso Corporation Crystalline polyolefin resin composition and electrical insulation parts made from said composition
DE69632617T2 (de) * 1995-11-02 2005-06-16 Mitsubishi Chemical Corp. Kristalline, thermoplastische Kunststoffzusammensetzung
US6060549A (en) * 1997-05-20 2000-05-09 Exxon Chemical Patents, Inc. Rubber toughened thermoplastic resin nano composites
CN1253498C (zh) * 1999-11-12 2006-04-26 积水化学工业株式会社 聚烯烃树脂组合物
JP4345203B2 (ja) * 2000-06-30 2009-10-14 パナソニック株式会社 加熱調理器
US20050260404A1 (en) * 2000-08-25 2005-11-24 Tetsunari Iwade Sheet-form molding
JP3819701B2 (ja) * 2000-11-10 2006-09-13 三菱樹脂株式会社 ビルドアップ多層プリント配線基板用コア基板
JP3863771B2 (ja) * 2000-12-08 2006-12-27 積水化学工業株式会社 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、tab用フィルム及びプリプレグ
US20040053061A1 (en) * 2000-12-08 2004-03-18 Koji Yonezawa Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polymidefilm, film for tab, and prepreg
KR100884294B1 (ko) * 2001-02-08 2009-02-18 미쓰이 가가쿠 가부시키가이샤 에틸렌과 탄소수 3 ~ 20의 α-올레핀의 랜덤 공중합체와 그것을 사용한 성형품
JP3955188B2 (ja) * 2001-05-21 2007-08-08 三菱樹脂株式会社 基板用耐熱フィルムおよびこれを用いたプリント配線基板
WO2003066740A1 (en) * 2002-02-06 2003-08-14 Sekisui Chemical Co., Ltd. Resin composition
JP2003313313A (ja) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd 離型フィルム
JP4268456B2 (ja) * 2002-06-07 2009-05-27 積水化学工業株式会社 樹脂基板材料
JP2004149584A (ja) * 2002-10-29 2004-05-27 Fuji Photo Film Co Ltd 有機変性層状珪酸塩を含有する樹脂組成物、フィルム、ガスバリア性フィルム、並びにそれらを用いた基板及び画像表示素子
JP2004244510A (ja) * 2003-02-13 2004-09-02 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート、配線基板及びコーティング剤

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2332721C1 (ru) * 2007-02-26 2008-08-27 Российская Федерация, от имени которой выступает Федеральное агентство по атомной энергии (Росатом) Устройство для охранной сигнализации

Also Published As

Publication number Publication date
EP1696003A4 (en) 2008-07-30
US20070072963A1 (en) 2007-03-29
CN1894342A (zh) 2007-01-10
WO2005056684A1 (ja) 2005-06-23
TW200602411A (en) 2006-01-16
TWI314942B (enExample) 2009-09-21
US20090256283A1 (en) 2009-10-15
KR20060130585A (ko) 2006-12-19
JPWO2005056684A1 (ja) 2007-07-19
EP1696003A1 (en) 2006-08-30

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