TW200602411A - Thermoplastic resin composition - Google Patents

Thermoplastic resin composition

Info

Publication number
TW200602411A
TW200602411A TW093139005A TW93139005A TW200602411A TW 200602411 A TW200602411 A TW 200602411A TW 093139005 A TW093139005 A TW 093139005A TW 93139005 A TW93139005 A TW 93139005A TW 200602411 A TW200602411 A TW 200602411A
Authority
TW
Taiwan
Prior art keywords
thermoplastic resin
resin composition
article
heated
disclosed
Prior art date
Application number
TW093139005A
Other languages
English (en)
Other versions
TWI314942B (zh
Inventor
Koichi Shibayama
Koji Yonezawa
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of TW200602411A publication Critical patent/TW200602411A/zh
Application granted granted Critical
Publication of TWI314942B publication Critical patent/TWI314942B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K2003/343—Peroxyhydrates, peroxyacids or salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW093139005A 2003-12-15 2004-12-15 Thermoplastic resin composition TW200602411A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003417175 2003-12-15

Publications (2)

Publication Number Publication Date
TW200602411A true TW200602411A (en) 2006-01-16
TWI314942B TWI314942B (zh) 2009-09-21

Family

ID=34675183

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093139005A TW200602411A (en) 2003-12-15 2004-12-15 Thermoplastic resin composition

Country Status (7)

Country Link
US (2) US20070072963A1 (zh)
EP (1) EP1696003A4 (zh)
JP (1) JP4083190B2 (zh)
KR (1) KR20060130585A (zh)
CN (1) CN1894342A (zh)
TW (1) TW200602411A (zh)
WO (1) WO2005056684A1 (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070210286A1 (en) * 2006-03-08 2007-09-13 Spartech Corporation Transparent plastic articles having controlled solar energy transmittance properties and methods of making
US20090093578A1 (en) * 2006-03-08 2009-04-09 Carlos Guerra Transparent stretched acrylic sheets for aircraft window systems having controlled solar transmittance properties
US20070210287A1 (en) * 2006-03-08 2007-09-13 Spartech Corporation Transparent plastic articles having controlled solar energy transmittance properties and methods of making
TWI643736B (zh) * 2010-09-29 2018-12-11 聖高拜塑膠製品公司 障壁膜或織物

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19581920B4 (de) * 1995-02-16 2006-12-28 Chisso Corp. Kristalline Polyolefin-Harzzusammensetzung und elektrisches Isolierteil, das diese Zusammensetzung enthält
EP0771854B1 (en) * 1995-11-02 2004-06-02 Mitsubishi Chemical Corporation Crystalline thermoplastic resin composition
US6060549A (en) * 1997-05-20 2000-05-09 Exxon Chemical Patents, Inc. Rubber toughened thermoplastic resin nano composites
US6924334B1 (en) * 1999-11-12 2005-08-02 Sekisui Chemical Co., Ltd. Polyolefin resin composition
JP4345203B2 (ja) * 2000-06-30 2009-10-14 パナソニック株式会社 加熱調理器
TWI284653B (en) * 2000-08-25 2007-08-01 Sekisui Chemical Co Ltd Sheet-form molding
JP3819701B2 (ja) * 2000-11-10 2006-09-13 三菱樹脂株式会社 ビルドアップ多層プリント配線基板用コア基板
AU2002221097A1 (en) * 2000-12-08 2002-06-18 Sekisui Chemical Co., Ltd. Material for insulating substrate, printed board, laminate, copper foil with resin, copper-clad laminate, polyimide film, film for tab, and prepreg
JP3863771B2 (ja) * 2000-12-08 2006-12-27 積水化学工業株式会社 絶縁基板用材料、プリント基板、積層板、樹脂付き銅箔、銅張積層板、ポリイミドフィルム、ｔａｂ用フィルム及びプリプレグ
US20020107343A1 (en) * 2001-02-08 2002-08-08 Mitsui Chemicals, Inc. Ethylene polymer, preparation process thereof and molded articles of the same
JP3955188B2 (ja) * 2001-05-21 2007-08-08 三菱樹脂株式会社 基板用耐熱フィルムおよびこれを用いたプリント配線基板
DE60336980D1 (de) * 2002-02-06 2011-06-16 Sekisui Chemical Co Ltd Harzzusammensetzung
JP2003313313A (ja) * 2002-02-22 2003-11-06 Sekisui Chem Co Ltd 離型フィルム
JP4268456B2 (ja) * 2002-06-07 2009-05-27 積水化学工業株式会社 樹脂基板材料
JP2004149584A (ja) * 2002-10-29 2004-05-27 Fuji Photo Film Co Ltd 有機変性層状珪酸塩を含有する樹脂組成物、フィルム、ガスバリア性フィルム、並びにそれらを用いた基板及び画像表示素子
JP2004244510A (ja) * 2003-02-13 2004-09-02 Sekisui Chem Co Ltd 樹脂組成物、樹脂シート、配線基板及びコーティング剤

Also Published As

Publication number Publication date
JP4083190B2 (ja) 2008-04-30
CN1894342A (zh) 2007-01-10
TWI314942B (zh) 2009-09-21
JPWO2005056684A1 (ja) 2007-07-19
KR20060130585A (ko) 2006-12-19
US20070072963A1 (en) 2007-03-29
WO2005056684A1 (ja) 2005-06-23
US20090256283A1 (en) 2009-10-15
EP1696003A4 (en) 2008-07-30
EP1696003A1 (en) 2006-08-30

Similar Documents

Publication Publication Date Title
TW200505998A (en) Heat stabilized moulding composition
EP1549470A4 (en) AMBIENTLY TEMPERATURING WATER-BASED DEMOLITION AGENT FOR COMPOSITE MATERIALS
TW200634066A (en) Thermally stable thermoplastic resin compositions, methods of manufacture thereof and articles comprising the same
WO2004016688A3 (en) Polyethylene melt blends for high density polyethylene applications
DK1360047T4 (da) Fremgangsmåde til formning af plast
EP1445282A4 (en) RESIN COMPOSITION AND MOLDED ARTICLE, FILM AND FIBER
TW200736341A (en) Curable silicone resin composition and cured body thereof
BRPI0514700A (pt) artigo de decoração moldado por injeção, filme de transferência, e processo para a produção do artigo
CN104672737B (zh) 耐候性asa基复合材料、共挤成型塑料制品和塑料制品
EP1484378A4 (en) THERMAL STORAGE MATERIAL, COMPOSITION THEREOF AND USE THEREOF
TW200602412A (en) Thermosetting resin composition
TW200643102A (en) Thermoplastic polycarbonate compositions with improved optical surface quality, articles made therefrom and method of manufacture
ATE285883T1 (de) Verfahren zum pulverbeschichten einer form und beschichtpulver dafür
MY147889A (en) Thermoplastic molding materials comprising organic black pigments
DE69023880D1 (de) Artikel in zweifarbiger Giessform zur Verwendung bei der Herstellung von Schaltungen.
DE60307360D1 (de) Trennfolienverwendung
TW200606199A (en) Polyarylene sulfide resin composition and molded article therefrom
DE3780709D1 (de) Verwendung von vorgeschauemte propylenharzpartikel in formgebungsprozessen.
DE59410183D1 (de) Kunststoff-Formmasse zur Herstellung von Formteilen mit Dekoreffekt
TW200942577A (en) Polycarbonate resin composition, polycarbonate resin molded article and manufacturing process
TW200624380A (en) Low-adhesion material and mold for molding resin using the same
EP1496067A8 (en) Thermoplastic polymer, process for producing the same, and molded article
TW342405B (en) Marking composition, moldings thereof and marking method
TW200602411A (en) Thermoplastic resin composition
ATE366275T1 (de) Schrumpffolie und deren herstellungsverfahren

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees