KR20060083296A - Coverlay laminating method and machine for multi layer type fpcb - Google Patents

Abstract

The present invention relates to a coverlay laminating method and apparatus for a multi-layer flexible printed circuit board, wherein a coverlay and a lamination are also rolled in a roll state of a copper foil circuit board on which a circuit pattern is formed by a roll-to-roll method in a roll state. After cutting, the cutting can be automatically performed, thereby preventing the defect caused by the substrate bending or the foreign matter in the coverlay welding process, thereby greatly improving the productivity.

The present invention for realizing this is carried out in a roll-to-roll method, in which the coverlay is welded to a copper foil circuit board on which a circuit pattern is formed through exposure, development, etching, and peeling processes, and thus, each coiler having a different height is in a roll state. A loading step of loading the copper foil circuit board and the coverlay, respectively; A laminating step of bringing the copper foil circuit board and the coverlay conveyed from the coilers at a constant speed into close contact with each other through a high temperature hot roller; A tension maintaining step of maintaining a constant tension in the path transferred to the close state; A cutting step of recognizing the sensing mark of the copper foil circuit board as a camera and cutting it to a predetermined size in the process of being transferred; It characterized in that it has a manufacturing process and the apparatus comprising a; unloading step of vacuum-stacking the coverlay temporary circuit board made of the cutting by sequentially stacking.

Flexible PCB, FPCB, Coverlay, Welded, Roll to Roll

Description

COVERLAY LAMINATING METHOD AND MACHINE FOR MULTI LAYER TYPE FPCB}

1 is a flow chart of a substrate manufacturing process of the present invention.

Figure 2 is a side configuration diagram of the coverlay laminating apparatus of the present invention.

Figure 3 is a state of operation of the buffer unit of the present invention.

<Explanation of symbols for the main parts of the drawings>

1: copper foil circuit board 2: coverlay

1a: copper foil roll 2a: coverlay roll

8: Release paper recovery roller 9: Upper coil

10: lower coil 20: laminating part

21: hot roller 22: alignment roller

23: pressure cylinder 25: feeding roller

30: buffer part 31: lifting roller

32: guide rod 33: weight

40: alignment regulator 41: detection sensor

50: cutting unit 51: camera

52: cutting cylinder 53: cutting blade

60: adsorption transfer part 61: lifting cylinder

62: guide rod 63: screw rod

70: loading unit

The present invention relates to a multi-layer flexible printed circuit board, and more particularly, to a manufacturing method and apparatus for preventing defects by allowing the cover lay to be made in a roll-to-roll method in a flexible printed circuit board manufacturing process.

In general, with the development of electronic components and component embedding technology, printed circuit boards overlapping circuit conductors have been continuously developed.

Recently, in the field of electronics industry, the rapid development of integrated density of semiconductor integrated circuits and the surface mount technology for directly mounting small chip components have been developed and the electronic equipments have been miniaturized. Therefore, it is necessary to facilitate the installation in more complicated and narrow spaces. In order to meet these demands, multilayer flexible printed circuit boards have been developed.

In particular, in the case of high-flexibility flexible printed circuit boards (FPCBs), demand for mobile phones, DVDs, digital cameras, and PDPs is rapidly increasing due to technological developments. It is true.

In the manufacturing process of the flexible printed circuit board (FPCB), a dry circuit is laminated on a copper foil laminated plate on which copper foil is formed on a base film, and then a predetermined circuit pattern is formed through an exposure, development and etching process, and then a circuit protection on the substrate surface. Cover lay film is temporarily bonded for the purpose.

After laminating each of the copper foil laminated sheets to which the coverlay film is bonded using the bonding sheet, through holes or via holes are formed using an NC drill, and through holes and electroplating processes, through holes and By forming a plating layer on the copper foil layer and electrically connecting the necessary layers, the multilayer flexible circuit board is manufactured by bonding the coverlay film on the outermost copper foil.

However, since the substrate on which the circuit is formed is extremely thin, having a thickness of 27 to 43 μm, there is a problem that the substrate may be wrinkled during the manufacturing process, or the defect of the circuit, and foreign matter defects may occur on the surface of the substrate by handling.

Meanwhile, in order to solve such a problem, a process of preparing a printed board in a roll-to-roll manner is applied in the process of preparing and forming a circuit pattern from the preparation of the copper-clad laminate that forms the base of the substrate to the step of forming the circuit pattern. (Public Patent 2004-5404)

However, after the circuit pattern is formed in the conventional roll-to-roll method, the coverlay is laminated to the surface where the circuit is formed by cutting into a substrate shape and completely bonded through hot press. In this case, the coverlay laminating process is performed by a manual operation of the operator. Since the coverlay has to be laminated (welded) in sheets, the productivity is lowered, and since the work is performed in the form of a sheet, problems such as wrinkles of the substrate and breakage of the circuit arise.

The present invention has been proposed to improve the above-mentioned problems in the prior art, and the laminating step of the coverlay after the FPCB and the coverlay in which the circuit pattern is formed by the roll-to-roll method is rolled with each other in a roll-to-roll manner. By making it possible to improve the productivity as well as the problem of the substrate wrinkles in the welding step can be solved.

The above object is to load the copper foil circuit board and the coverlay in the rolled state to each coiler having a different height in the step of attaching the coverlay to the copper foil laminated board on which the circuit pattern is formed in the process of manufacturing the flexible printed circuit board. step; A laminating step of bringing the copper foil circuit board and the coverlay conveyed from the coilers at a constant speed into close contact with each other through a high temperature hot roller; A tension maintaining step of maintaining a constant tension in the path transferred to the close state; A cutting step of recognizing the sensing mark of the copper foil circuit board as a camera and cutting it to a predetermined size in the process of being transferred; It is possible to achieve through the coverlay laminating method and apparatus of the multilayer type flexible printed circuit board, comprising: an unloading step of sequentially stacking and storing the coverlay-adhesive circuit board which has been cut.

Hereinafter, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a flow chart showing the coverlay welding process of the present invention, Figure 2 is a side view showing the configuration of the coverlay laminating apparatus, Figure 3 is a view showing the operating state of the buffer portion of the present invention.

First, looking at the overall configuration of the coverlay laminating apparatus according to the present embodiment through Figure 2, the copper foil roll (1a) and the coverlay (2) in which the copper foil circuit board 1 is wound in a roll state on one side of the device The upper coil 9 and the lower coil 10 are installed in positions of different heights so that the cover lay rolls 2a wound by the rolls are respectively loaded from the respective rolls 1a and 2a. The laminating part 20 including the hot roller 21 which presses mutually on the supply path | route of the copper foil circuit board 1 and the coverlay 2 supplied so that a close contact may be comprised is comprised.

The pressure cylinder 23 for adjusting the pressing force of the roller is installed on the upper portion of the hot roller 21, and reference numeral 23 denotes a coverlay 2 which is transported downward from the top and a copper foil circuit board 1 which is transported upward from the bottom. It shows the alignment roller for aligning and guiding to the hot roller 21 side.

In addition, the elevating roller 31 and the elevating roller 31 in which the elevating operation is made to move up and down to adjust the tension of the circuit board in which the coverlay is in close contact with each other are moved up and down along the guide rod 32. A plurality of weights 33 constitute the buffer unit 30 so as to enable the alignment adjuster 40 including a detection sensor 41 for detecting a horizontal alignment state in a transport state of the circuit board on which the supply is made. And feeding rollers 25 provided on one side of the apparatus for feeding in one direction for supplying the circuit board are provided along the substrate supply path.

In addition, the cutting unit 50 for cutting the circuit board in which the continuous supply is made to a predetermined size, and the suction transfer unit 60 for individually transporting the circuit board made of the cutting by vacuum to the loading unit 70 side. Is installed. The suction conveying unit 60 is a lifting cylinder 61 for driving the vertical lifting operation of the suction plate 63, a screw rod 63 for driving the left and right conveying direction, and a guide rod 62 for guiding the left and right feeding. consist of.

In addition, a release paper recovery roller 8 for separately recovering the release paper separated from the coverlay is provided at one side of the upper coiler 9, and the cutting unit 50 recognizes the sensing mark displayed on the copper foil circuit board. A cutting blade 52 which is fixed to a camera 51, a cutting cylinder 52 operated according to a signal recognized by the camera 51, and a rod end of the cutting cylinder 52 to reciprocate in a vertical direction. It consists of 53.

The operation process and the resulting effects of the apparatus of the present invention having such a configuration will be described with reference to the flowchart of FIG. 1.

First, the copper foil roll 1a on which the copper foil circuit board 1 is wound in a roll state is loaded onto the lower coiler 10 and the coverlay roll 2a on which the coverlay 2 is wound in a roll state is placed on the upper coiler ( 9).

At this time, the copper foil roll (1a) to be loaded is a copper foil circuit board after the etching is completed by the roll-to-roll method is wound in a roll form, the coverlay wound on the coverlay roll (2a) as the coverlay film and the release paper is bonded Among them, the release paper is released from the cover lay roll 2a and is recovered and wound on the release paper recovery roller 8 side.

Thereafter, each of the loaded copper foil circuit board 1 and the coverlay 2 is transported at a speed of 4 to 8 m / min by the driving force of the feeding roller 25, and the alignment rollers in the laminating unit 20 ( After being combined by 22), the hot rollers 21 pass through the hot rollers 21 to be in close contact with each other by high temperature pressing force.

At this time, the temperature of the hot roller 21 is about 40 ~ 60 ℃ and the pressing force between the rollers is preferably to achieve a range of 2 ~ 4kg / ㎠.

In this way, the copper foil substrate which is in close contact with the coverlay has a constant tension of the substrate in the process of passing through the buffer part 30.

In other words, the tension applied to the substrate is changed by the difference between the feeding speed of the substrate supplied from the upper and lower coilers 9 and 10 and the cutting speed of the substrate in a later process. Accordingly, when the tension of the copper foil substrate passing through the lifting roller 31 is weakened, the lifting roller 31 is lowered by the weight of the weight 33 as shown in FIG. Tension control is performed as the upward movement of 31) takes place.

Thereafter, the alignment adjuster 40 detects whether the horizontal state of the transfer roll-to-roll substrate is maintained by the detection sensor 41, and horizontal alignment is performed. Thus, the sensing mark on the copper foil substrate transferred to the horizontal alignment state is the camera. As the 51 recognizes and sends a signal, the cutting cylinder 52 is operated in the cutting unit 50 according to the signal control, so that the cutting of the substrate by the cutting edge 53 is performed at a predetermined interval.

Each substrate cut in this manner is lifted up and down after the adsorption plate 63 is lowered and adsorbed by the lifting cylinder 61 in the suction transfer unit 60, and the screw rod 63 is rotated in one direction. After being horizontally moved to one side along the guide rod 62, the vacuum adsorption is released while being stacked and stored in the loading unit 70.

The copper sheet having the coverlay welded by the roll-to-roll operation as described above is able to achieve an increase in production and a decrease in defect rate while preventing the occurrence of bending and surface defects of the substrate while supplying and cutting the substrate continuously. Each cut substrate is formed into a multilayer to perform a hot press process to form a multilayer flexible printed wiring board.

As described above, the present invention automatically cuts after laminating and attaching the coverlay film, which is also wound in a roll state, in a state of loading in a roll state without cutting a copper foil circuit board on which a circuit pattern is formed by a roll-to-roll method. By making it possible to prevent the occurrence of defects due to substrate bending or foreign matter in the coverlay laminating process, it is possible to exhibit the effect of greatly improving the productivity through the automated process.

Claims (4)

In manufacturing a flexible printed circuit board, the cover-lay is welded to a copper foil circuit board on which a circuit pattern is formed through exposure, development, etching, and peeling process by a roll-to-roll method using a copper foil. A loading step of loading the copper foil circuit board and the coverlay in a roll state on each coiler having a different height; A laminating step of bringing the copper foil circuit board and the coverlay conveyed from the coilers at a constant speed into close contact with each other through a high temperature hot roller; A tension maintaining step of maintaining a constant tension in the path transferred to the close state; A horizontal alignment maintaining step of controlling the horizontal state of the copper foil substrate in which the coverlay is in close contact with the transfer path; A cutting step of cutting a substrate to a predetermined size by recognizing a sensing mark of a copper foil circuit board transferred while the horizontal state is maintained with a camera; And an unloading step of sequentially stacking and storing the coverlay temporary circuit boards which have been cut by vacuuming, and covering the multilayered flexible printed circuit board. An upper coil (1) configured to be positioned at different heights so that the copper foil roll (1a) on which the copper foil circuit board (1) is rolled and the coverlay roll (2a) on which the coverlay (2) is wound in a roll state are loaded. 9) and the lower coil 10; Laminating part including a hot roller 21 to press the mutually on the supply path of the copper foil circuit board (1) and the coverlay (2) supplied from each of the roll (1a, 2a) to be in close contact ( 20); A plurality of weights are allowed to move up and down along the guide rod 32 while supporting the lifting roller 31 and the lifting roller 31, which are lifted up and down for tension adjustment of the circuit board in which the supply is made. A shock absorbing portion 30 configured with a weight 33; An alignment adjuster (40) comprising a sensing sensor (41) for sensing a horizontal alignment state in a transport state of a circuit board in which the supply is made; A feeding roller 25 provided at one side of the apparatus for transferring in one direction for supplying a circuit board in which the coverlay is in close contact with the coverlay; A cutting unit 50 for cutting the circuit board in which the continuous supply is made to a predetermined size; A cover lay laminating device for a multilayer type flexible printed circuit board comprising: a suction transfer unit (60) for adsorbing the circuit board in which the cutting is made in a vacuum to transport the unit to the loading unit (70). The method according to claim 2, One side of the upper coil (9) coverlay laminating apparatus of a multi-layer flexible printed board, characterized in that the release paper recovery roller (8) for separately recovering the release paper separated from the coverlay. The method according to claim 2, The cutting unit 50 includes a camera 51 for recognizing a sensing mark displayed on a copper foil circuit board, a cutting cylinder 52 operated according to a signal recognized by the camera 51, and a cutting cylinder 52 of the cutting cylinder 52. The coverlay laminating device of a multilayer type flexible printed circuit board, comprising a cutting blade 53 fixedly installed at one end of the rod and reciprocating in a vertical direction.

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