KR100748208B1 - A laminating device of flexible printed circuits board and the making methed thereof - Google Patents

A laminating device of flexible printed circuits board and the making methed thereof Download PDF

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Publication number
KR100748208B1
KR100748208B1 KR1020070043916A KR20070043916A KR100748208B1 KR 100748208 B1 KR100748208 B1 KR 100748208B1 KR 1020070043916 A KR1020070043916 A KR 1020070043916A KR 20070043916 A KR20070043916 A KR 20070043916A KR 100748208 B1 KR100748208 B1 KR 100748208B1
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South Korea
Prior art keywords
roller
copper foil
heat
film
laminated
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KR1020070043916A
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Korean (ko)
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김병응
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주식회사 케이엔테크
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

A laminating device of a flexible printed circuit board and a method thereof are provided to freely adjust a pre-heated section according to a thickness and a material of a copper film and upper and lower dry films by adjusting incident angles of the copper film and the upper and the lower dry films. A copper film(4) from a copper film providing roller is contacted with a first lower heat adhering roller(7) and is pre-heated by providing the copper film(4) from a lower part through a first lower incident angle adjustment roller(6). An upper dry film(11) is provided to have an adjusted incident angle from an upper part through an upper incident angle adjustment roller(12) which adjusts a height. An upper plane laminating unit(2) penetrates with the copper film(4) between the upper heat adhering roller(15) and the first lower heat adhering roller(7) and is laminated on an upper plane of the copper film(4). A laminated copper film(18) is provided to have an adjusted incident angle from an upper part through a second upper incident angle adjustment roller(22) which adjusts a height. The laminated copper film(18) is contacted with a heat adhering roller(23) and is pre-heated. A lower dry film(20) from a lower film providing roller(24) is provided to have an adjusted incident angle from a lower part through a second lower incident angle adjustment roller(25) when removing a cover film. A lower plane laminating unit(19) passes with the upper laminated copper(18) between the second lower heat adhering roller(26) and the second upper heat adhering roller(23) which is contacted with the second lower heat adhering roller(26) and is pre-heated. The lower plane laminating unit(19) is laminated on a lower plane of the copper film(4).

Description

연성회로기판의 라미네이팅 장치 및 그 방법{A laminating device of flexible printed circuits board and the making methed thereof}Laminating device of flexible printed circuits board and the making method

도 1은 본 발명에 따른 라미네이팅 장치의 전체 구성도1 is an overall configuration diagram of a laminating apparatus according to the present invention

도 2는 본 발명에 따른 라미네이팅 장치의 작동상태도Figure 2 is an operating state of the laminating apparatus according to the present invention

도 3은 본 발명에 따른 라미네이팅 장치에서 입사각조절에 따라 예열구간이 달라지는 상태를 도시한 일부 측면개략도Figure 3 is a partial side schematic view showing a state in which the preheating section is changed according to the incident angle control in the laminating apparatus according to the present invention

도 4는 본 발명에 따른 라미네이팅 장치를 이용하여 일면 라미네이팅하는 상태의 개략도Figure 4 is a schematic diagram of a state of laminating one surface using a laminating apparatus according to the present invention

도 5는 종래의 라미네이팅 장치의 측면개략도5 is a side schematic view of a conventional laminating device

도 6은 종래의 장치에 의해 상,하부드라이필름이 양면 라미네이팅된 동박의 단면개략도Figure 6 is a schematic cross-sectional view of the copper foil with the upper and lower dry film laminated on both sides by a conventional device

< 도면의 주요 부분에 대한 부호의 설명 >                <Description of Symbols for Main Parts of Drawings>

1, 1'. 라미네이팅 장치 2. 상면라미네이팅부1, 1 '. Laminating Device 2. Top Laminating Part

3, 3'. 동박공급롤러 4, 4'. 동박3, 3 '. Copper foil feed roller 4, 4 '. Copper foil

5, 5'. 전방가이드롤러 6. 제 1하부입사각조절롤러5, 5 '. Front guide roller 6. First lower incidence roller

7. 제 1하부가열접착롤러 8a, 8b, 8c, 8d. 수직이동실린더7. First lower heat adhesive rollers 8a, 8b, 8c, 8d. Vertical Cylinder

9. 텐션롤러 10, 10'. 상부필름공급롤러9. Tension roller 10, 10 '. Upper Film Feed Roller

11, 11'. 상부드라이필름 12. 제 1상부입사각조절롤러11, 11 '. Top dry film 12. First top angle adjusting roller

13a, 13b, 13a', 13b'. 커버필름분리롤러 13a, 13b, 13a ', 13b'. Cover Film Separation Roller

14a, 14b, 14a', 14b'. 커버필름14a, 14b, 14a ', 14b'. Cover film

15. 제 1상부가열접착롤러 16a, 16b. 커버필름권취롤러15. First upper heated adhesive roller 16a, 16b. Cover Film Winding Roller

17a, 17b. 가압실린더 18. 상면 라미네이팅된 동박17a, 17b. Pressurized Cylinder 18. Top Laminated Copper Foil

19. 하면라미네이팅부 20, 20'. 하부드라이필름19. Lower surface laminating part 20, 20 '. Bottom dry film

21. 중간이드롤러 22. 제 2상부입사각조절롤러21. Intermediate guide roller 22. Second upper incidence roller

23. 제 2상부가열접착롤러 24, 24'. 하부필름공급롤러23. Second upper heated rollers 24, 24 '. Lower Film Feed Roller

25. 제 2하부입사각조절롤러 26. 제 2하부가열접착롤러25. Second lower incidence rollers 26. Second lower incidence rollers

27, 27'. 양면 라미네이팅된 동박 28. 후방가이드롤러27, 27 '. Double sided laminated copper foil 28. Rear guide roller

29. 완성품권취롤러 30. 일면 라미네이팅된 롤러29. Finished winding roller 30. One side laminated roller

31'. 상부가열첩착롤러 32'. 하부가열접착롤러31 '. Upper heated adhesive roller 32 '. Lower Heating Adhesive Roller

33'. 기포 L, L', L1, L1', L2, L2'. 예열구간33 '. Bubble L, L ', L 1 , L 1 ', L 2 , L 2 '. Preheating section

본 발명은 연성회로기판의 제조시 얇게 가공된 동박(copper foil) 또는 상기 동박에 PI필름(Poly imide film)이 접착된 동박필름에 감광용 드라이필름(dry film)을 라미네이팅하는 장치 및 그 방법에 관한 것으로, 더욱 상세하게는 동박공급롤러로부터의 동박을 상하높이조절되는 제 1하부입사각조절롤러를 통해 하부로부터 입사각이 조절된 상태로 공급하여 상기 동박이 제 1하부가열접착롤러에 맞닿아 예열되도록 하고 상부필름공급롤러로부터의 상부드라이필름은 상하높이조절되는 제 1상부입사각조절롤러를 통해 상부로부터 입사각이 조절된 상태로 공급하여 상부드라이필름이 제 1상부가열접착롤러에 맞닿아 예열되면서 가열 가압작동되는 상기 제 1상,하부가열접착롤러 사이를 통과하여 동박의 상면에 라미네이팅되도록 하는 상면라미네이팅부와, 상기 상면 라미네이팅된 동박을 상하높이조절되는 제 2상부입사각조절롤러를 통해 상부로부터 입사각이 조절된 상태로 공급하여 상기 상면 라미네이팅된 동박이 제 2상부가열접착롤러에 맞닿아 예열되도록 하고 하부필름공급롤러로부터의 하부드라이필름을 커버필름이 제거된 상태에서 상하높이조절되는 제 2하부입사각조절롤러를 통해 하부로부터 입사각이 조절된 상태로 공급되도록 하여 상기 하부드라이필름이 제 2하부가열접착롤러에 맞닿아 예열되면서 가열 가압작동되는 상기 제 2상,하부가열접착롤러 사이를 통과하여 동박의 하면에 라미네이팅되도록 하는 하면라미네이팅부를 통해 양면 라미네이팅된 동박을 제조하도록 되어 있는 것을 특징으로 하는 연성회로기판의 라미네이팅 장치 및 그 방법에 관한 것이다.The present invention relates to an apparatus and method for laminating a dry film for photosensitive to a copper foil (copper foil) that is thinly processed in the manufacture of a flexible circuit board or a copper foil film having a polyimide film adhered to the copper foil. In more detail, the copper foil from the copper foil supply roller is supplied in a state in which the angle of incidence is adjusted from the bottom through a first lower incidence adjusting roller which is adjusted up and down so that the copper foil is preheated in contact with the first lower heat-adhesive roller. The upper dry film from the upper film supply roller is supplied with the first upper incident angle adjusting roller which is adjusted up and down in a state where the incidence angle is controlled from the upper side, and the upper dry film is preheated by contacting the first upper heat-adhesive roller and heated and pressurized. An upper surface laminating part for laminating the upper surface of the copper foil by passing between the first upper and lower thermal bonding rollers operated, and the upper The surface-laminated copper foil is supplied in a state where the incidence angle is adjusted from the top through a second upper incidence angle adjusting roller that is vertically adjusted so that the upper surface of the laminated copper foil is in contact with the second upper portion heat-adhesive roller and preheated. The lower dry film of the lower dry film is supplied in a state in which the angle of incidence is adjusted from the lower through the second lower incidence adjusting roller which is adjusted up and down in the state that the cover film is removed so that the lower dry film contacts the second lower heat-adhesive roller Laminating apparatus for a flexible circuit board and the two-sided, the lower portion of the heat-adhesive roller while passing through the pressurized operation to produce a laminated double-sided copper foil through the lower surface laminating portion to be laminated on the lower surface of the copper foil and its It is about a method.

일반적으로 연성회로기판(Flexible printed circuits board)은 전자산업 기 술분야에서 반도체 집적회로의 집적도의 급속한 발전과 소형칩부품을 직접 탑재하는 표면실장기술이 발전하고 전자제품의 소형화 및 경량화에 따라 개발된 전자부품으로 작업성이 뛰어나며 내열성 및 내곡성, 내약품성이 우수하여 핸드폰, DVD, 디자털카메라, PDP 등 각종 전자제품의 핵심부품으로 널리 사용되고 있으며, 이와 같은 연성회로기판의 일반적인 제조과정은 얇게 가공된 동박(copper foil) 또는 상기 동박에 PI필름(Poly imide film)이 접착된 동박필름을 드릴링, 디버링(deburing) 공정을 통해 전처리한 다음 상기 동박필름 또는 동박의 상,하 양면에 감광용 드라이필름(dry film)을 라미네이팅(laminating)한 후 노광(exposure), 현상(developing), 에칭(etching) 등의 공정을 통하여 소정의 회로패턴이 형성되도록 한 다음 기판면의 회로보호를 위해 상,하 커버레이필름(Cover lay film)을 접합시킨 후 타발공정 등의 후처리공정을 통해 낱개의 연성회로기판을 제조하게 된다. In general, flexible printed circuits boards have been developed in the electronics industry because of the rapid development of the integration density of semiconductor integrated circuits and the surface mount technology for directly mounting small chip components and the miniaturization and lightening of electronic products. It is excellent in workability as an electronic component, and has excellent heat resistance, bending resistance, and chemical resistance, so it is widely used as a core component of various electronic products such as mobile phones, DVDs, digital cameras, and PDPs, and the general manufacturing process of such flexible circuit boards is thinly processed. Pre-treated copper foil or copper foil film having a polyimide film adhered to the copper foil by drilling and deburring, and then drying the photosensitive dry film on the upper and lower surfaces of the copper foil or copper foil. After laminating the dry film, a predetermined circuit pattern is formed through a process such as exposure, developing, and etching. And then is prepared with upper and lower coverlay film for flexible circuit boards individually and then through the treatment process, such as punching process and then bonded to (Cover lay film) for protecting the circuit board surface so that the castle.

이러한 연성회로기판의 제조과정에 있어서, 상기 전처리된 동박필름 또는 동박의 상,하 양면에 감광용 드라이필름(dry film)을 적층 접합하는 종래의 라미네이팅 장치(1')는 도 5에 도시된 바와 같이 동박공급롤러(3')에 감겨진 동박필름 또는 동박(4')이 다수개의 전방가이드롤러(5')를 통해 가운데 부분으로 공급되고 그 상부에는 상부필름공급롤러(10')에 감겨진 상부드라이필름(11')이 커버필름분리롤러(13a')에 의해 커버필름(14a')이 벗겨진 상태로 공급되며 이와 동시에 하부에는 하부필름공급롤러(24')에 감겨진 하부드라이필름(20')이 커버필름분리롤러(13b')에 의해 커버필름(14b')이 벗겨진 상태로 공급되어 상기 동박필름 또는 동박(4')의 상 하에 각각 상부드라이필름(11')과 하부드라이필름(20')이 위치되면서 소정의 온도와 압력으로 가열 및 압착작동하는 상부가열접착롤러(31')와 하부가열접착롤러(32') 사이를 통과하여 하나로 적층 접합되어 양면 라미네이팅된 동박(27')이 제조도록 되어 있다.In the manufacturing process of such a flexible circuit board, a conventional laminating apparatus 1 'for laminating and bonding a photosensitive dry film on both upper and lower surfaces of the pretreated copper foil film or copper foil is shown in FIG. 5. The copper foil film or copper foil 4 'wound on the copper foil feed roller 3' is supplied to the center portion through a plurality of front guide rollers 5 ', and the upper portion is wound on the upper film feed roller 10'. The upper dry film 11 'is supplied with the cover film 14a' peeled off by the cover film separation roller 13a ', and at the same time, the lower dry film 20 wound around the lower film supply roller 24'. ') Is supplied with the cover film 14b' peeled off by the cover film separation roller 13b ', so that the upper dry film 11' and the lower dry film ('') above and below the copper film or copper foil 4 ', respectively. 20 ') is positioned and heated and compressed at a predetermined temperature and pressure. Between the additional heat-adhesive roller 31 'and the lower heat-adhesive roller 32', laminated and bonded together to produce a double-sided laminated copper foil 27 '.

이때 상기 라미네이팅 장치(1')는 가운데 부분에 위치된 동박필름이나 동박(4)의 상하로 각각 공급되는 상부드라이필름(11')과 하부드라이필름(20')이 상부가열접착롤러(31')와 하부가열접착롤러(32')로 유입되는 과정에서 소정의 각도로 경사진 상태로 유입되어 가열 압착되기 직전에 상부가열접착롤러(31')와 하부가열접착롤러(32')에 맞닿아 있는 부분이 미리 예열되도록 하여 상부가열접착롤러(31')와 하부가열접착롤러(32')사이를 통과하면서 원활한 가열 및 가압 접합이 이루어지도록 되어 있는데, 상기 상,하부필름공급롤러(10')(24')로부터 공급되는 상,하부드라이필름(11')(20')은 항상 정해진 입사각으로만 상하 공급되도록 되어 있어 동박필름이나 동박(4) 및 상,하부드라이필름(11')(20')의 두께 및 재질 등에 따른 적절한 입사각조절이 이루어질 수 없으며, 가운데 부분으로 공급되는 동박필름이나 동박(4')은 전혀 예열되지 않은 상태에서 곧바로 가열 및 가압되도록 되어 있어 상,하부드라이필름(11')(20')과의 접합이 양호하게 이루어지지 못할 뿐 아니라, 특히 두꺼운 재질의 상,하부드라이필름(11')(20')이 공급되는 경우에는 상부가열접착롤러(31')와 하부가열접착롤러(32')에 각각 맞닿는 예열구간이 충분치 못하여 제대로 예열되지 않은 상태에서 가열 및 가압 접합되면서 완성된 양면 라미네이팅된 동박(27')은 도 6에 도시된 바와 같이 동박(4')과 상부드라이필름(11')과 하부드라이 필름(20')의 접합부분 사이에 다량의 기포(33')가 낀 불량제품으로 생산되며, 또한 가운데 부분으로는 동박필름이나 동박(4')이 공급되고 그 상하로 상부드라이필름(11')과 하부드라이필름(20')이 동시에 공급되면서 라미네이팅되도록 되어 있어 가운데 부분에 위치된 동박(4')과 상,하부드라이필름(11')(20')의 위치가 서로 어긋나면서 접합되어 얼라인먼트(alignment)가 맞지 않는 불량제품이 생산되는 문제점이 있었다.In this case, the laminating apparatus 1 'includes an upper dry film 11' and a lower dry film 20 'which are respectively supplied to the copper foil film or the copper foil 4 positioned at the center and the upper dry adhesive roller 31'. ) In contact with the upper heat-adhesive roller 31 'and the lower heat-adhesive roller 32' immediately before being heated and pressed in a state inclined at a predetermined angle in the process of flowing into the lower heat-adhesive roller 32 '. The preheated portion is preheated to allow smooth heating and pressure bonding while passing between the upper heat-adhesive roller 31 'and the lower heat-adhesive roller 32'. The upper and lower film supply rollers 10 ' The upper and lower dry films 11 'and 20' supplied from the 24 'are always supplied vertically at a predetermined angle of incidence so that the copper foil film or the copper foil 4 and the upper and lower dry films 11' and 20 ' According to the thickness and material of ') can not be adjusted appropriately, The copper foil film or copper foil 4 'supplied to the lower portion is directly heated and pressurized without being preheated at all, so that the bonding with the upper and lower dry films 11' and 20 'is not satisfactory. In particular, when the upper and lower dry films 11 'and 20' of a thick material are supplied, the preheating section which contacts each of the upper heating adhesive roller 31 'and the lower heating adhesive roller 32' is not sufficient. As shown in FIG. 6, the double-sided laminated copper foil 27 ′, which is completed by heating and pressure bonding in a non-preheated state, is formed of the copper foil 4 ′, the upper dry film 11 ′, and the lower dry film 20 ′. It is produced as a defective product with a large amount of bubbles (33 ') between the joints, and the copper foil film or copper foil (4') is supplied to the middle portion, and the upper dry film 11 'and the lower dry film (up and down) are supplied. 20 ') will be laminated at the same time There is a problem in that a defective product that is not aligned due to the alignment of the copper foil (4 ') and the upper and lower dry film (11', 20 ') located in the center and shifted from each other is produced.

본 발명은 상기와 같은 문제점들을 해결하기 위한 것으로, 동박과 상,하부드라이필름을 동시에 라미네이팅하지 않고 1차적으로 동박과 상부드라이필름을 상면 라미네이팅하고 2차적으로 일면 라미네이팅된 동박과 하부드라이필름을 하면 라미네이팅하여 동박과 상,하부드라이필름이 모두 최적의 예열상태를 유지하면서 라미네이팅되도록 함으로써 양호한 접합이 이루어지도록 하고 동박과 상,하부드라이필름의 접합부분 사이에 기포가 개재(介在)되지 않도록 하며, 동박과 상부드라이필름을 정확하게 정렬하여 접합한 후 하부드라이필름을 접합하여 상,하부드라이필름과 동박의 위치가 서로 일정하게 정렬되도록 하고, 동박과 상,하부드라이필름의 입사각이 각각 조절되도록 하여 제 1상,하부가열접착롤러와 제 2상,하부가열접착롤러에 맞닿는 예열구간을 상기 동박과 상,하부드라이필름의 두께 및 재질 등에 따라 자유롭게 조절하도록 하는 것에 그 목적이 있다.The present invention is to solve the above problems, without laminating the copper foil and the upper and lower dry film at the same time, if the upper surface of the copper foil and the upper dry film laminated first and secondly laminated copper foil and the lower dry film Laminating to ensure that the copper foil, upper and lower dry films are all laminated while maintaining the optimum preheating state, so that good bonding is achieved, and bubbles are not interposed between the copper foil and the upper and lower dry films. After aligning and bonding the upper dry film accurately, and then bonding the lower dry film so that the position of the upper, lower dry film and the copper foil is consistently aligned with each other, and the angle of incidence of the copper foil and the upper and lower dry film is adjusted respectively, the first Preheating to contact upper and lower heat-adhesive rollers and second upper and lower heat-adhesive rollers It is an object to be freely adjusted according to the liver, etc. The copper foil and the upper and lower dry film thickness and the material of.

이러한 목적을 달성하기 위하여 동박공급롤러로부터의 동박을 상하높이조절 되는 제 1하부입사각조절롤러를 통해 하부로부터 입사각이 조절된 상태로 공급하여 상기 동박이 제 1하부가열접착롤러에 맞닿아 예열되도록 하고 상부필름공급롤러로부터의 상부드라이필름은 상하높이조절되는 제 1상부입사각조절롤러를 통해 상부로부터 입사각이 조절된 상태로 공급하여 상부드라이필름이 제 1상부가열접착롤러에 맞닿아 예열되면서 상기 동박과 함께 가열 가압작동되는 제 1상,하부가열접착롤러 사이를 통과하여 동박의 상면에 라미네이팅되도록 하는 상면라미네이팅부와, 상기 상면 라미네이팅된 동박을 상하높이조절되는 제 2상부입사각조절롤러를 통해 상부로부터 입사각이 조절된 상태로 공급하여 상기 상면 라미네이팅된 동박이 제 2상부가열접착롤러에 맞닿아 예열되도록 하고 하부필름공급롤러로부터의 하부드라이필름을 커버필름이 제거된 상태에서 상하높이조절되는 제 2하부입사각조절롤러를 통해 하부로부터 입사각이 조절된 상태로 공급되도록 하여 상기 하부드라이필름이 제 2하부가열접착롤러에 맞닿아 예열되면서 상기 상면 라미네이팅된 동박과 함께 가열 가압작동되는 제 2상,하부가열접착롤러 사이를 통과하여 동박의 하면에 라미네이팅되도록 하는 하면라미네이팅부로 구성된 것에 본 발명의 특징이 있다.In order to achieve this purpose, the copper foil from the copper foil supply roller is supplied in a state in which the angle of incidence is adjusted from the bottom through the first lower incidence adjusting roller which is adjusted up and down so that the copper foil comes into contact with the first lower heat adhesive roller and is preheated. The upper dry film from the upper film feed roller is supplied in a state where the incidence angle is adjusted from the upper through the first upper incident angle adjusting roller which is vertically adjusted so that the upper dry film is preheated by contacting the first upper heat-adhesive roller, Incident angle from the top through the upper and lower laminating part for passing the first and lower parts of the heat-adhesive roller to be laminated on the upper surface of the copper foil, and the second upper incident angle adjusting roller for adjusting the upper and lower laminated copper foils. The upper surface laminated copper foil is supplied to the second state The lower dry film from the lower film supply roller is supplied to the lower dry film from the lower film supply roller in a state where the incidence angle is adjusted from the lower portion through a second lower angle adjusting roller which is vertically adjusted in a state where the cover film is removed. The present invention is composed of a lower surface laminating part which allows the film to be laminated on the lower surface of the copper foil by passing through the second upper and lower thermal bonding rollers which are heated and pressurized together with the upper laminated lamination copper foil while being preheated by contacting the second lower laminating roller. There is a characteristic of.

이하 본 발명에 따른 바람직한 구성을 도면에 의해 상세히 설명하면 다음과 같다. Hereinafter, the preferred configuration according to the present invention will be described in detail with reference to the drawings.

본 발명의 라미네이팅 장치(1)는 연성회로기판의 제조시 얇게 가공된 동박(copper foil) 또는 상기 동박에 PI필름(Poly imide film)이 접착된 동박필름에 감광용 드라이필름(dry film)을 라미네이팅(laminating)하는 것으로, 도 1 내지 4에 도시된 바와 같이 동박공급롤러(3)를 통해 하부에서 공급되는 동박(4)과 상부필름공급롤러(10)를 통해 상부에서 공급되는 상부드라이필름(11)의 입사각이 각각 자유롭게 조절된 상태에서 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7) 사이로 통과되면서 동박(4)의 상면에 라미네이팅되도록 하는 상면라미네이팅부(2)와, 상기 제 1상,하부가열접착롤러(15)(7) 사이를 통과하여 상부에서 공급되는 상면 라미네이팅된 동박(18)과 하부필름공급롤러(24)를 통해 하부에서 공급되는 하부드라이필름(20)의 입사각이 각각 자유롭게 조절된 상태에서 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26) 사이로 통과되면서 동박(4)의 하면에 라미네이팅되도록 하는 하면라미네이팅부(19)로 구성되어 있다.Laminating apparatus (1) of the present invention laminating a photosensitive dry film (dry film) to a copper foil (copper foil) that is thinly processed in the manufacture of a flexible circuit board or a copper foil film bonded to a polyimide film (PI film) to the copper foil 1 to 4, the upper dry film 11 supplied from the upper side through the copper foil supply roller 3 and the upper film supply roller 10, as shown in FIGS. The upper laminating part 2 to be laminated on the upper surface of the copper foil 4 while passing between the first upper heat-adhesive roller 15 and the first lower heat-adhesive roller 7 in a state where the angle of incidence is freely adjusted, respectively; The lower dry film 20 supplied from the lower side through the upper laminated lamination copper foil 18 and the lower film supply roller 24 which are supplied from the upper side through the first upper and lower heat adhesive rollers 15 and 7. Each of which the angle of incidence of As in the passage between the second upper heated bonding rollers 23 and a second lower heat bonding roller 26 is composed of laminated unit 19 such that when laminated to a lower surface of the copper foil (4).

상기 상면라미네이팅부(2)는 도 1 내지 4에 도시된 바와 같이 상하에서 각각 공급되는 동박(4)과 상부드라이필름(11)의 입사각을 조절하여 최적의 예열상태를 유지하면서 상기 동박(4)의 상면에 상부드라이필름(11)을 라미네이팅하도록 되어 있는 부분으로, 하부에 위치된 동박공급롤러(3)에 롤형태로 감겨 있는 동박(4)이 다수개의 전방가이드롤러(5)를 통해 상하높이조절되는 제 1하부입사각조절롤러(6)로 공급되도록 되어 있고 상기 제 1하부입사각조절롤러(6)는 상하 높이조절되면서 제 1하부가열접착롤러(7)로 공급되는 동박(4)의 입사각을 조절하도록 되어 있어 상기 동박(4)이 가운데 부분에 위치된 제 1하부가열접착롤러(7)로 비스듬히 상향경사진 상태로 공급되어 상부 외측면의 예열구간(L)에 맞닿아 상기 제 1상부가열접착롤 러(15)와 제 1하부가열접착롤러(7)사이를 통과하면서 가열 및 가압작동으로 접합되기 전에 미리 예열된 상태를 유지하도록 되어 있다. As shown in FIGS. 1 to 4, the upper laminating part 2 adjusts the angle of incidence of the copper foil 4 and the upper dry film 11 which are respectively supplied from above and below to maintain an optimal preheating state. The upper dry film 11 is laminated on the upper surface of the copper foil 4, which is rolled around the copper foil feed roller 3 located in the lower portion of the upper and lower heights through the plurality of front guide rollers 5. The first lower incident angle adjusting roller 6 is to be adjusted and the first lower incident angle adjusting roller 6 adjusts the incidence angle of the copper foil 4 which is supplied to the first lower heat attaching roller 7 while being adjusted up and down. The copper foil 4 is supplied to the first lower portion of the heat-adhesive roller 7 located at the center thereof in an oblique upwardly inclined state so that the copper foil 4 is in contact with the preheating section L of the upper outer side to be heated. Adhesive Roller 15 and First Lower Thermal Bonding Roll The preheated state is maintained before joining by heating and pressurizing operation while passing between the chucks 7.

상기 제 1하부입사각조절롤러(6)는 하부에 통상의 에어실린더로 된 수직이동실린더(8a)가 설치되어 있어 상기 수직이동실린더(8a)의 승강작동에 의해 상하이동되도록 되어 있고 그 상부에는 통상의 탄성스프링에 의해 탄성지지되고 있는 텐션롤러(9)가 맞닿은 상태로 설치되어 있어 상기 텐션롤러(9)와 제 1하부입사각조절롤러(6)사이로 동박(4)이 통과되면서 상기 수직이동실린더(8a)에 의한 제 1하부입사각조절롤러(6)의 상하이동시 텐션롤러(9)의 가압에 의해 동박(4)이 일정한 텐션(tension)을 유지한 상태로 입사각이 정확하게 조절되어 제 1하부가열접착롤러(7)로 공급되도록 되어 있다.The first lower angle adjusting roller 6 has a vertical movement cylinder 8a made of a normal air cylinder at the lower portion thereof so as to be moved up and down by lifting and lowering operation of the vertical movement cylinder 8a. The tension roller 9, which is elastically supported by the elastic spring of the spring, is installed in contact with the tension roller 9, and the copper foil 4 passes between the tension roller 9 and the first lower angle adjusting roller 6. The incidence angle is precisely adjusted while the copper foil 4 maintains a constant tension by the pressure of the first lower incidence adjustment roller 6 in Shanghai at the same time, and the first lower incidence heat bonding is performed. It is supposed to be supplied to the roller 7.

한편, 상기 동박(4)은 20 ~ 50㎛ 정도의 두께로 얇게 가공된 것이 사용되며 필요에 따라 상기 동박(4)에 PI필름(Poly imide film)이 접착된 동박필름이 사용될 수 있다.On the other hand, the copper foil 4 is used to be thinly processed to a thickness of about 20 ~ 50㎛ and, if necessary, a copper foil film having a PI film (Poly imide film) adhered to the copper foil 4 may be used.

또한, 상부에 위치된 상부필름공급롤러(10)에 롤형태로 감겨 있는 상부드라이필름(11)은 상하높이조절되는 제 1상부입사각조절롤러(12)를 통해 입사각이 조절된 상태에서 제 1상부가열접착롤러(15)로 공급되도록 되어 있되, 상기 상부드라이필름(11)은 제 1상부입사각조절롤러(12)을 통과하면서 인접설치된 커버필름분리롤러(13a)에 의해 이면(裏面)에 붙어있는 커버필름(14a)이 제거된 상태에서 제 1상부 입사각조절롤러(12)에 의해 제 1상부가열접착롤러(15)로 비스듬히 하향경사진 상태로 공급되어 하부 외측면의 예열구간(L')에 맞닿아 상기 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7)사이를 통과하면서 가열 및 가압작동으로 접합되기 전에 미리 예열된 상태를 유지하도록 되어 있다. In addition, the upper dry film 11 wound in the form of a roll on the upper film supply roller 10 positioned in the upper portion of the first upper portion in a state where the incidence angle is adjusted through the first upper incident angle adjusting roller 12 that is adjusted up and down It is to be supplied to the heat adhesive roller 15, the upper dry film 11 is attached to the rear surface by the cover film separation roller 13a installed adjacently while passing through the first upper angle adjusting roller 12. When the cover film 14a is removed, the first upper part incident angle adjusting roller 12 is supplied to the first upper part heat-adhesive roller 15 in an obliquely downwardly inclined state to the preheating section L 'of the lower outer surface. In contact with each other, the first upper portion is maintained in a preheated state before passing through the heat-adhesive roller 15 and the first lower portion of the heat-adhesive roller 7 before being joined by heating and pressing operations.

상기 상부드라이필름(11)의 이면(裏面)으로부터 벗져진 커버필름(14a)은 일측에 구비된 커버필름권취롤러(16a)로 보내지면서 권취되도록 되어 있다. The cover film 14a peeled off the back surface of the upper dry film 11 is wound while being sent to the cover film winding roller 16a provided on one side.

상기 제 1상부입사각조절롤러(12)는 상부에 통상의 에어실린더로 된 수직이동실린더(8b)가 설치되어 있어 상기 수직이동실린더(8b)의 승강작동에 의해 상하이동되면서 상부드라이필름(11)의 입사각이 정확하게 조절되도록 되어 있되 인접설치된 커버필름분리롤러(13a)도 상기 수직이동실린더(8b)에 의해 함께 승강작동되도록 되어 있어 상기 커버필름분리롤러(13a)와 제 1상부입사각조절롤러(12)사이로 상부드라이필름(11)이 통과되면서 원활하게 커버필름(14a)이 벗겨진 상태에서 제 1상부가열접착롤러(15)로 공급되도록 되어 있다.The first upper incident angle adjusting roller 12 has a vertical moving cylinder 8b made of a normal air cylinder on the top thereof, and is moved up and down by the lifting operation of the vertical moving cylinder 8b. Although the incidence angle of the cover film separation roller 13a adjacently installed is also lifted and operated together by the vertical movement cylinder 8b, the cover film separation roller 13a and the first upper incident angle control roller 12 As the upper dry film 11 passes through the cover film 14a, the first upper portion is supplied to the thermal adhesive roller 15 in a state where the cover film 14a is peeled off smoothly.

또한, 상기 제 1상,하부입사각조절롤러(12)(6)는 동박(4) 또는 상부드라이필름(11)의 두께 및 재질 등에 따라 그 입사각이 조절되도록 되어 있되, 상기 동박(4) 또는 상부드라이필름(11)의 두께가 두꺼워 충분한 예열이 필요한 경우에는 도 3에 도시된 바와 같이 제 1상,하부가열접착롤러(15)(7)에 맞닿는 예열구간(L)(L')이 길어지도록 제 1상부입사각조절롤러(12)는 상승작동하고 제 1하부입사 각조절롤러(6)는 하강작동하여 입사각이 작아지면서 긴 예열구간(L2)(L2')을 갖도록 하며, 반대로 상기 동박(4) 또는 상부드라이필름(11)의 두께가 얇아 단시간 예열되어야 할 경우에는 제 1상,하부가열접착롤러(15)(7)에 맞닿는 예열구간(L)(L')이 줄어들도록 제 1상부입사각조절롤러(12)는 하강작동하고 제 1하부입사각조절롤러(6)는 상승작동하여 짧은 예열구간(L1)(L1')을 갖도록 한다. In addition, the first upper and lower incidence angle adjustment rollers 12 and 6 are to adjust the incidence angle according to the thickness and material of the copper foil 4 or the upper dry film 11, the copper foil 4 or the upper When the dry film 11 is thick and sufficient preheating is required, as shown in FIG. 3, the preheating section L (L ') contacting the first upper and lower heat-adhesive rollers 15 and 7 is lengthened. The first upper incidence angle adjusting roller 12 is operated upwardly and the first lower incidence angle adjusting roller 6 is operated downwardly so as to have a long preheating section L 2 (L 2 ′) while the incidence angle decreases. (4) Or, if the thickness of the upper dry film 11 is to be preheated for a short time, the first upper and lower preheating sections (L) (L ') in contact with the heat-adhesive roller (15) (7) is reduced to the first The upper incidence adjustment roller 12 is lowered and the first lower incidence adjustment roller 6 is in the ascending operation to have a shorter preheating section L 1 (L 1 ′). To do that.

상기 제 1하부가열접착롤러(7)는 일정온도로 가열된 상태에서 상부일측면의 예열구간(L)에 동박(4)이 맞닿아 예열되도록 되어 있고, 상기 제 1상부가열접착롤러(15)는 제 1하부가열접착롤러(7)의 수직상부에 위치된 상태로 일정온도로 가열되어 하부일측면의 예열구간(L')에 상부드라이필름(11)이 맞닿아 예열되도록 되어 있되 상부에는 통상의 가압실린더(17a)가 설치되어 있어 일정한 압력으로 제 1하부가열접착롤러(7)와 제 1상부가열접착롤러(15)사이를 함께 통과하는 상기 동박(4) 및 상부드라이필름(11)을 가열 및 가압작동으로 접합하여 상면 라미네이팅된 동박(18)을 형성하도록 되어 있다.The first lower heat-adhesive roller 7 is preheated by contacting the copper foil 4 with the preheating section L on one side of the upper side in a state of being heated to a predetermined temperature. The first lower part is heated to a predetermined temperature in a state located in the vertical upper portion of the heat-adhesive roller (7) is to be preheated by the upper dry film 11 abuts on the preheating section (L ') of the lower one side, but the upper part is usually The pressurized cylinder 17a of the copper foil 4 and the upper dry film 11 which pass together between the first lower side heat adhesion roller 7 and the first upper side heat adhesion roller 15 at a constant pressure. Bonding by heating and pressing operation is performed to form the top laminated copper foil 18.

상기 하면라미네이팅부(19)는 도 1 내지 4에 도시된 바와 같이 상하에서 각각 공급되는 상면 라미네이팅된 동박(18)과 하부드라이필름(20)의 입사각을 조절하여 최적의 예열상태를 유지하면서 상면 라미네이팅된 동박(18)의 하면에 하부드라이필름(20)을 라미네이팅하도록 되어 있는 부분으로, 다수개의 중간가이드롤러(21) 를 통해 이송된 상면 라미네이팅된 동박(18)은 상부에 위치된 상태로 상하높이조절되는 제 2상부입사각조절롤러(22)로 공급되도록 되어 있고 상기 제 2상부입사각조절롤러(22)는 상하 높이조절되면서 제 2상부가열접착롤러(23)로 공급되는 상면 라미네이팅된 동박(18)의 입사각을 조절하도록 되어 있어 상면 라미네이팅된 동박(18)이 제 2상부가열접착롤러(23)로 비스듬히 하향 경사진 상태로 공급되어 하부 외측면의 예열구간(L')에 맞닿아 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26)사이를 통과하면서 가열 및 가압작동으로 접합되기 전에 미리 예열된 상태를 유지하도록 되어 있다. As shown in FIGS. 1 to 4, the lower surface laminating unit 19 adjusts the incidence angles of the upper and lower laminated copper foils 18 and the lower dry film 20, which are respectively supplied from the upper and lower sides, to maintain the optimum preheating state. The lower surface of the copper foil 18 is laminated to the lower dry film 20, the upper surface of the laminated copper foil 18 transported through the plurality of intermediate guide rollers 21 is located in the upper and lower height The upper laminated laminated copper foil 18, which is supplied to the second upper incident angle adjusting roller 22 to be adjusted, and the second upper incident angle adjusting roller 22 is supplied to the second upper portion heat-adhesive roller 23 while being adjusted up and down. The angle of incidence of the upper surface laminated copper foil 18 is supplied to the second upper heat-adhesive roller 23 in an obliquely downwardly inclined state to contact the preheating section L 'of the lower outer surface. 2 is adapted to maintain a pre-warm-up state the upper heating the adhesive roller 23 and the second lower heated while passing between the adhesive roller 26 before it is bonded with heat and pressure operation.

상기 제 2상부입사각조절롤러(22)는 상부에 통상의 에어실린더로 된 수직이동실린더(8c)가 설치되어 있어 상기 수직이동실린더(8c)의 승강작동에 의해 상하이동되도록 되어 있고 상기 다수개의 중간가이드롤러(21)와 제 2상부가열접착롤러(23)사이의 가운데 부분 상부쪽에 설치되어 있되 상면 라미네이팅된 동박(18)이 제 2상부입사각조절롤러(22)의 상면부쪽으로 걸쳐져 비스듬하게 하향 경사진 상태로 제 2상부가열접착롤러(23)로 공급되도록 되어 있어 상기 수직이동실린더(8c)에 의한 제 2상부입사각조절롤러(22)의 상하이동시에도 상면 라미네이팅된 동박(18)이 일정한 텐션(tension)을 유지한 상태로 입사각이 정확하게 조절되어 제 2상부가열접착롤러(23)로 공급되도록 되어 있다.The second upper incident angle adjusting roller 22 has a vertical moving cylinder 8c made of a normal air cylinder on its upper part, and is moved to and fro by the lifting operation of the vertical moving cylinder 8c. Between the guide roller 21 and the second upper heat-adhesive roller 23, the upper part of the middle portion of the upper laminated laminating copper foil 18 is directed toward the upper surface of the second upper angle adjusting roller 22 to beveled downward. In the photographed state, it is supplied to the second upper heat-adhesive roller 23, so that the upper surface laminated copper foil 18 has a constant tension even at the same time when the second upper incident angle adjusting roller 22 is moved by the vertical movement cylinder 8c. The incidence angle is accurately adjusted while maintaining the tension) so that the second upper portion is supplied to the thermal bonding roller 23.

또한, 하부에 위치된 하부필름공급롤러(24)에 롤형태로 감겨 있는 하부드라이필름(20)은 상하높이조절되는 제 2하부입사각조절롤러(25)를 통해 입사각이 조절 된 상태에서 제 2하부가열접착롤러(26)로 공급되도록 되어 있되, 상기 하부드라이필름(20)은 제 2하부입사각조절롤러(25)을 통과하면서 인접설치된 커버필름분리롤러(13b)에 의해 이면(裏面)에 붙어있는 커버필름(14b)이 제거된 상태에서 제 2하부입사각조절롤러(25)에 의해 제 2하부가열접착롤러(26)로 비스듬히 상향 경사진 상태로 공급되어 상부 외측면의 예열구간(L')에 맞닿아 상기 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26)사이를 통과하면서 가열 및 가압작동으로 접합되기 전에 미리 예열된 상태를 유지하도록 되어 있다. In addition, the lower dry film 20, which is wound in the form of a roll on the lower film supply roller 24 positioned in the lower portion, has a second lower portion in which the incident angle is adjusted through the second lower incident angle adjusting roller 25 that is vertically adjusted. It is to be supplied to the heat adhesive roller 26, the lower dry film 20 is attached to the rear surface by the cover film separation roller (13b) adjacently installed while passing through the second lower angle adjusting roller (25). In the state where the cover film 14b is removed, the second lower part incident angle adjusting roller 25 is supplied to the second lower part heat adhesion roller 26 in an inclined upward direction and is supplied to the preheating section L 'of the upper outer surface. In contact with each other, the second upper portion is maintained in a preheated state before the second lower portion is joined by the heating and pressing operation while passing between the thermally bonding roller 23 and the second lower portion.

상기 하부드라이필름(20)의 이면(裏面)으로부터 벗져진 커버필름(14b)은 일측에 구비된 커버필름권취롤러(16b)로 보내지면서 권취되도록 되어 있다. The cover film 14b peeled off from the back surface of the lower dry film 20 is wound up while being sent to the cover film winding roller 16b provided on one side.

상기 제 2하부입사각조절롤러(25)는 하부에 통상의 에어실린더로 된 수직이동실린더(8d)가 설치되어 있어 상기 수직이동실린더(8d)의 승강작동에 의해 상하이동되면서 하부드라이필름(20)의 입사각이 정확하게 조절되도록 되어 있되 인접설치된 커버필름분리롤러(13b)도 상기 수직이동실린더(8d)에 의해 함께 승강작동되도록 되어 있어 상기 커버필름분리롤러(13b)와 제 2하부입사각조절롤러(25)사이로 하부드라이필름(20)이 통과되면서 원활하게 커버필름(14b)이 벗겨진 상태에서 제 2하부가열접착롤러(26)로 공급되도록 되어 있다.The second lower angle adjusting roller 25 is installed in the lower vertical movement cylinder (8d) made of a normal air cylinder is moved by the lifting operation of the vertical movement cylinder (8d) while the lower dry film 20 Although the incidence angle of the cover film separation roller 13b adjacently installed is also lifted and operated together by the vertical movement cylinder 8d, the cover film separation roller 13b and the second lower angle adjustment roller 25 As the lower dry film 20 passes through the cover film 14b, the second lower part is supplied to the thermal adhesive roller 26 in a state where the cover film 14b is peeled off smoothly.

또한, 상기 제 2상,하부입사각조절롤러(22)(25)는 상면 라미네이팅된 동박(18) 또는 하부드라이필름(20)의 두께 및 재질 등에 따라 그 입사각이 조절되도록 되어 있되, 상면 라미네이팅된 동박(18) 또는 하부드라이필름(20)의 두께가 두 꺼워 충분한 예열이 필요한 경우에는 도 3에 도시된 바와 같이 제 2상,하부가열접착롤러(23)(26)에 맞닿는 예열구간(L)(L')이 길어지도록 제 2상부입사각조절롤러(22)는 상승작동하고 제 2하부입사각조절롤러(25)는 하강작동하여 입사각이 작아지면서 긴 예열구간(L2)(L2')을 갖도록 하며, 반대로 상면 라미네이팅 된 동박(18) 또는 하부드라이필름(20)의 두께가 얇아 단시간 예열되어야 할 경우에는 제 2상,하부가열접착롤러(23)(26)에 맞닿는 예열구간(L)(L)이 줄어들도록 제 2상부입사각조절롤러(22)는 하강작동하고 제 2하부입사각조절롤러(25)는 상승작동하여 짧은 예열구간(L1)(L1')을 갖도록 한다. In addition, the incident angle of the second upper and lower incidence adjustment rollers 22 and 25 may be adjusted according to the thickness and the material of the upper laminated lamination copper foil 18 or the lower dry film 20, and the upper laminated lamination copper foil. 18 or when the lower dry film 20 is thick and sufficient preheating is required, as shown in FIG. 3, the preheating section L contacting the second upper and lower heat adhesive rollers 23 and 26 ( The second upper incidence adjustment roller 22 moves up and the second lower incidence adjustment roller 25 moves down so that L ') becomes long so that the incident angle decreases to have a long preheating section L 2 (L 2 '). On the contrary, when the upper surface of the laminated copper foil 18 or the lower dry film 20 is thin and needs to be preheated for a short time, the preheating sections L and L which contact the second and lower heat-adhesive rollers 23 and 26 are short. The second upper incidence adjusting roller 22 is lowered and the second lower incidence is adjusted so that The roller 25 moves up to have a short preheating section L 1 (L 1 ′).

상기 제 2하부가열접착롤러(26)는 일정온도로 가열된 상태에서 상부 일측면의 예열구간(L)에 하부드라이필름(20)이 맞닿아 예열되도록 되어 있고, 상기 제 2상부가열접착롤러(23)는 제 2하부가열접착롤러(26)의 수직상부에 위치된 상태로 일정온도로 가열되어 하부 일측면의 예열구간(L')에 상면 라미네이팅된 동박(18)이 맞닿아 예열되도록 되어 있되 상부에는 통상의 가압실린더(17b)가 설치되어 있어 일정한 압력으로 제 2하부가열접착롤러(26)와 제 2상부가열접착롤러(23)사이를 함께 통과하는 상면 라미네이팅된 동박(18) 및 하부드라이필름(20)을 가열 및 가압작동으로 접합하여 양면 라미네이팅된 동박(27)을 형성하도록 되어 있다.The second lower heating adhesive roller 26 is preheated by contacting the lower dry film 20 to the preheating section L of the upper one side in a heated state at a predetermined temperature, and the second upper heating adhesive roller ( 23) is heated to a predetermined temperature in a state located in the vertical upper portion of the second lower heat adhesive roller 26 is preheated by the upper surface laminated copper foil 18 in contact with the preheating section (L ') of the lower one side. The upper pressurized cylinder 17b is installed in the upper part so that the upper surface laminated copper foil 18 and the lower dry which pass together between the second lower heat-adhesive roller 26 and the second upper heat-adhesive roller 23 at a constant pressure. The film 20 is bonded by heating and pressing to form a double-side laminated copper foil 27.

상기와 같이 제 2상,하부가열접착롤러(23)(26)를 통과하여 상,하 양면 라미 네이팅된 동박(27)은 후방가이드롤러(28)를 거쳐 완성품권취롤러(29)에 권취되고 다음공정으로 이동되어 연성회로기판(FPCB)로 제조된다.As described above, the upper and lower double-sided laminated copper foils 27 passing through the second upper and lower heat adhesive rollers 23 and 26 are wound on the finished product winding roller 29 via the rear guide roller 28. It is moved to the next process to manufacture a flexible printed circuit board (FPCB).

이하 본 발명에 따른 제조공정은 다음과 같다.Hereinafter, the manufacturing process according to the present invention is as follows.

본 발명의 라미네이팅 장치(1)는 상면라미네이팅부(2)의 하부에 위치된 동박공급롤러(3)에 롤형태로 감겨져 있는 동박필름이나 동박(4)은 다수개의 전방가이드롤러(5)를 거쳐 상기 동박(4)의 두께 및 재질에 따라 일정하게 높이조절된 제 1하부입사각조절롤러(6)를 통해 입사각이 조절된 상태에서 제 1하부가열접착롤러(7)로 비스듬히 상향 경사지게 공급되면서 상기 제 1하부가열접착롤러(7)의 상부 외측면의 예열구간(L)에 맞닿아 일정온도로 예열되고, 상부에 위치된 상부필름공급롤러(10)에 롤형태로 감겨져 있는 상부드라이필름(11)은 커버필름분리롤러(13a)에 의해 커버필름(14a)이 제거된 상태에서 상기 상부드라이필름(11)의 두께 및 재질에 따라 일정하게 높이조절된 제 1상부입사각조절롤러(12)를 통해 입사각이 조절된 상태에서 제 1상부가열접착롤러(15)로 비스듬히 하향 경사지게 공급되면서 상기 제 1상부가열접착롤러(15)의 하부 외측면의 예열구간(L')에 맞닿아 예열되며 가열 가압작동되는 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7) 사이를 상기 동박(4)과 함께 통과하여 동박(4)의 상면에 상부드라이필름(11)이 라미네이팅된다. Laminating apparatus (1) of the present invention is a copper foil film or copper foil (4) wound in a roll shape on the copper foil feed roller (3) located at the bottom of the upper surface laminating portion (2) through a plurality of front guide rollers (5) The first lower part is inclined upwardly inclined upwardly to the heat-adhesive roller 7 while the incident angle is controlled by the first lower incident angle adjusting roller 6 which is constantly adjusted according to the thickness and material of the copper foil 4. 1 The upper dry film 11 which is preheated to a predetermined temperature in contact with the preheating section L of the upper outer surface of the lower heat-adhesive roller 7 and wound in a roll form on the upper film supply roller 10 positioned at the upper portion. Angle of incidence through the first upper incident angle adjusting roller 12 which is constantly adjusted according to the thickness and material of the upper dry film 11 in a state where the cover film 14a is removed by the silver cover film separating roller 13a. In this adjusted state, the first upper part heat-adhesive roller 15 The first upper portion heat-adhesive roller 15 and the first lower portion heat-adhesive, which are preheated and heated and pressurized by contacting the preheating section L 'of the lower outer surface of the first upper heat-adhesive roller 15 while being inclined downward at an angle. The upper dry film 11 is laminated on the upper surface of the copper foil 4 by passing between the rollers 7 together with the copper foil 4.

상기 상면라미네이팅부(2)에서 상면 라미네이팅된 동박(18)은 하면라미네이팅부(19)에 구비된 다수개의 중간가이드롤러(21)를 통해 상부에 위치된 제 2상부입사각조절롤러(22)로 공급되고 상면 라미네이팅된 동박(18)의 두께 및 재질에 따라 일정하게 높이조절된 제 2상부입사각조절롤러(22)를 통해 입사각이 조절된 상태에서 제 2상부가열접착롤러(23)로 비스듬히 하향 경사지게 공급되면서 상기 제 2상부가열접착롤러(23)의 하부 외측면의 예열구간(L')에 맞닿아 일정온도로 예열되고, 하부에 위치된 하부필름공급롤러(24)에 롤형태로 감겨져 있는 하부드라이필름(20)은 커버필름분리롤러(13b)에 의해 커버필름(14b)이 제거된 상태에서 상기 하부드라이필름(20)의 두께 및 재질에 따라 일정하게 높이조절된 제 2하부입사각조절롤러(25)를 통해 입사각이 조절된 상태에서 제 2하부가열접착롤러(26)로 비스듬히 상향 경사지게 공급되면서 상기 제 2하부가열접착롤러(26)의 상부 외측면의 예열구간(L)에 맞닿아 예열되며 가열 가압작동되는 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26) 사이를 상면 라미네이팅된 동박(18)과 함께 통과하여 상면 라미네이팅된 동박(18)의 하면에 하부드라이필름(20)이 라미네이팅되어 양면 라미네이팅된 동박(27)이 제조되고, 상기 양면 라미네이팅된 동박(27)은 후방가이드롤러(28)를 통해 완성품권취롤러(29)에 권취된다. The copper foil 18 laminated on the upper surface of the upper laminating part 2 is supplied to the second upper incident angle adjusting roller 22 positioned at the upper portion through the plurality of intermediate guide rollers 21 provided on the lower laminating part 19. And inclined downward to the second upper heat-adhesive roller 23 in a state in which the angle of incidence is adjusted through the second upper incident angle adjusting roller 22 constantly adjusted according to the thickness and the material of the upper surface laminated copper foil 18. While being heated to a predetermined temperature in contact with the preheating section (L ') of the lower outer surface of the second upper heat-adhesive roller 23, the lower dry wound in the form of a roll on the lower film supply roller 24 located below The film 20 is the second lower angle adjustment roller 25 which is constantly adjusted according to the thickness and material of the lower dry film 20 in a state in which the cover film 14b is removed by the cover film separation roller 13b. ), The angle of incidence is adjusted The second lower portion is attached to the heat adhesive roller 26 inclined upwardly obliquely in contact with the preheating section (L) of the upper outer surface of the second lower portion of the heat adhesive roller 26 is preheated and heated and pressurized The lower dry film 20 is laminated on the lower surface of the upper laminated copper foil 18 by passing between the roller 23 and the second lower heat-adhesive roller 26 together with the upper laminated copper foil 18, and the double-layer laminated copper foil (27) is manufactured, and the double-sided laminated copper foil (27) is wound on the finished product winding roller (29) through the rear guide roller (28).

한편, 본 발명의 다른 실시예로서 어느 한쪽면에만 라미네이팅된 동박을 제조하고자 하는 경우에는 도 4에 도시된 바와 같이 하면라미네이팅부(19)의 제 2상,하부가열접착롤러(23)(26)의 작동을 중단시킴과 동시에 하부필름공급롤러(24)로부터의 하부드라이필름(20) 공급을 중지시킨 상태에서 상면라미네이팅부(2)를 가동하여 상면 라미네이팅된 동박(18)이 제 2상,하부가열접착롤러(23)(26)에 의해 가열 및 가압되지 않고 그대로 통과되도록 하여 일면 라미네이팅된 동박(30)을 제조하거 나, 또는 상기와 반대로 상면라미네이팅부(2)의 제 1상,하부가열접착롤러(15)(7)의 작동을 중단시킴과 동시에 상부필름공급롤러(10)로부터의 상부드라이필름(11) 공급을 중지시킨 상태에서 하면라미네이팅부(19)를 가동하여 동박공급롤러(3)로부터의 동박(4)이 제 1상,하부가열접착롤러(15)(7)에 의해 가열 및 가압되지 않고 그대로 통과하며 하면라미네이팅부(19)에서 하부드라이필름(20)이 라미네이팅되어 일면 라미네이팅된 동박(30)을 제조할 수 있다.On the other hand, as another embodiment of the present invention, if you want to manufacture the laminated copper foil on only one side, as shown in Figure 4 the second phase, the lower portion of the laminating portion 19, the thermal adhesive roller (23, 26) Of the upper and the lower laminated copper foil 18 by operating the upper laminating unit 2 while stopping the operation of the lower dry film 20 from the lower film supply roller 24. Heat-adhesive rollers (23) and (26) to pass through without being heated and pressurized to produce a laminated copper foil 30 on one side, or the first upper and lower parts of the upper surface laminating part (2) in contrast to the above The copper foil feed roller (3) is operated by stopping the operation of the rollers (15) and (7) and operating the lower surface laminating portion (19) while stopping the supply of the upper dry film (11) from the upper film feed roller (10). Copper foil from the first phase The lower dry film 20 is laminated on the lower laminating unit 19 while passing through the roller 15 and 7 without being heated and pressurized, thereby manufacturing the laminated copper foil 30.

상기와 같이 본 발명에 의하면 동박과 상,하부드라이필름을 동시에 라미네이팅하지 않고 1차적으로 동박과 상부드라이필름의 상하 입사각이 각각 조절된 상태에서 제 1상,하부가열접착롤러 사이로 공급되도록 하여 동박과 상부드라이필름이 최적의 예열상태를 유지하면서 상면 라미네이팅되도록 하고, 2차적으로 상면 라미네이팅된 동박과 하부드라이필름의 상하 입사각이 각각 조절된 상태에서 제 2상,하부가열접착롤러 사이로 공급되도록 하여 상면 라미네이팅된 동박과 하부드라이필름이 최적의 예열상태를 유지하면서 하면 라미네이팅되도록 할 수 있어 상기 동박과 상,하부드라이필름이 양호하게 접합되고 충분한 예열에 의해 접합부분 사이에 기포가 개재(介在)되지 않으며, 상기 동박과 상부드라이필름을 정확하게 정렬하여 접합한 후 하부드라이필름을 접합하여 상,하부드라이필름과 동박의 위치가 서로 일정하게 정렬되고, 또한 상기 동박과 상,하부드라이필름의 입사각이 각각 조절되도록 되어 있어 제 1상,하부가열접착롤러과 제 2상,하부가열접착롤러에 맞닿아 각각 예열 되는 구간을 동박과 상,하부드라이필름의 두께 및 재질 등에 따라 자유롭게 조절할 수 있는 효과가 있다. As described above, according to the present invention, the copper foil and the upper and lower dry films are not laminated at the same time, and the upper and lower incidence angles of the copper foil and the upper dry film are first controlled, respectively, so that they are supplied between the first upper and lower heat adhesive rollers. The upper dry film keeps the upper surface laminating while maintaining the optimal preheating state, and the upper and lower side of the upper laminated film is supplied between the second upper and lower heat-adhesive rollers with the upper and lower incident angles of the upper and lower dry film respectively adjusted. The copper foil and the lower dry film can be laminated while maintaining the optimum preheating state, so that the copper foil and the upper and lower dry film are bonded well, and bubbles are not interposed between the joints by sufficient preheating. The copper foil and the upper dry film is accurately aligned and bonded to the lower de By bonding the films, the positions of the upper and lower dry films and the copper foil are uniformly aligned with each other, and the incidence angles of the copper foil, the upper and lower dry films are adjusted, respectively, so that the first phase, the lower thermal bonding roller, the second phase, There is an effect that can be freely adjusted according to the thickness and the material of the copper foil and the upper and lower dry film, respectively, the preheated section in contact with the lower heating adhesive roller.

Claims (8)

동박공급롤러(3)로부터의 동박(4)을 상하높이조절되는 제 1하부입사각조절롤러(6)를 통해 하부로부터 입사각이 조절된 상태로 공급되도록 하여 상기 동박(4)이 제 1하부가열접착롤러(7)에 맞닿아 예열되도록 하고 상부필름공급롤러(10)로부터의 상부드라이필름(11)을 커버필름(14a)이 제거된 상태에서 상하높이조절되는 제 1상부입사각조절롤러(12)를 통해 상부로부터 입사각이 조절된 상태로 공급되도록 하여 상기 상부드라이필름(11)이 제 1상부가열접착롤러(15)에 맞닿아 예열되면서 가열 가압작동되는 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7) 사이를 상기 동박(4)과 함께 통과하여 동박(4)의 상면에 라미네이팅되도록 하는 상면라미네이팅부(2)와, 상면 라미네이팅된 동박(18)을 상하높이조절되는 제 2상부입사각조절롤러(22)를 통해 상부로부터 입사각이 조절된 상태로 공급하여 상면 라미네이팅된 동박(18)이 제 2상부가열접착롤러(23)에 맞닿아 예열되도록 하고 하부필름공급롤러(24)로부터의 하부드라이필름(20)을 커버필름(14b)이 제거된 상태에서 상하높이조절되는 제 2하부입사각조절롤러(25)를 통해 하부로부터 입사각이 조절된 상태로 공급되도록 하여 상기 하부드라이필름(20)이 제 2하부가열접착롤러(26)에 맞닿아 예열되면서 가열 가압작동되는 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26) 사이를 상면 라미네이팅된 동박(18)과 함께 통과하여 동박(4)의 하면에 라미네이팅되도록 하는 하면라미네이팅부(19)로 구성된 것을 특징으로 하는 연성회로기판의 라미네이팅 장치.The copper foil 4 is supplied with the first lower side heat-adhesive by supplying the copper foil 4 from the copper foil supply roller 3 in a state in which the incidence angle is adjusted from the lower side through the first lower incidence adjusting roller 6 which is vertically adjusted. The first upper inclined angle adjusting roller 12 which is brought into contact with the roller 7 to be preheated and the upper dry film 11 from the upper film supply roller 10 is adjusted up and down in a state where the cover film 14a is removed. First upper portion heat-adhesive roller 15 and the first upper portion heat-adhesive roller 15 which is heated and pressurized while the upper dry film 11 abuts on the first upper portion heat-adhesive roller 15 so that the angle of incidence is adjusted from the upper side through the upper side. The upper laminating part 2 and the upper laminating copper foil 18 which pass between the lower heating adhesion rollers 7 together with the said copper foil 4, and are laminated on the upper surface of the copper foil 4, The 2nd height which adjusts up and down Mouth from the top through the upper angle adjusting roller (22) The upper surface laminated copper foil 18 is brought into contact with the second upper heat-adhesive roller 23 so as to be preheated while the square is adjusted, and the lower dry film 20 from the lower film supply roller 24 is covered with a cover film. The lower dry film 20 is supplied with the second lower heat-adhesive roller 26 by supplying the incidence angle from the lower side through the second lower incidence angle adjusting roller 25 in which the upper and lower heights are adjusted 14b). The upper and lower heat-adhesive roller 23 and the second lower-heat-adhesive roller 26, which are heated and pressurized while being in contact with each other, pass together with the upper-laminated copper foil 18 to be laminated on the lower surface of the copper foil 4. Laminating apparatus of a flexible circuit board, characterized in that consisting of a lower surface laminating unit (19). 제 1항에 있어서, 상기 제 1하부입사각조절롤러(6)는 하부에 에어실린더로 된 수직이동실린더(8a)가 설치되어 있어 상기 수직이동실린더(8a)의 승강작동에 의해 상하이동되도록 되어 있고 그 상부에는 탄성스프링에 의해 탄성지지되고 있는 텐션롤러(9)가 맞닿은 상태로 설치되어 있어 상기 텐션롤러(9)와 제 1하부입사각조절롤러(6)사이로 동박(4)이 통과되면서 제 1하부입사각조절롤러(6)의 상하이동시 텐션롤러(9)의 일정한 가압에 의해 동박(4)의 텐션이 알맞게 유지되어 입사각이 정확하게 조절된 상태로 비스듬히 상향 경사지게 제 1하부가열접착롤러(7)로 공급되도록 되어 있는 것을 특징으로 하는 연성회로기판의 라미네이팅 장치.According to claim 1, wherein the first lower angle adjustment roller (6) is provided with a vertical cylinder (8a) made of an air cylinder in the lower portion is to be moved by the lifting operation of the vertical cylinder (8a) A tension roller 9 elastically supported by an elastic spring is installed at an upper portion thereof so that the copper foil 4 passes between the tension roller 9 and the first lower angle adjusting roller 6. The tension of the copper foil 4 is properly maintained by constant pressurization of the Shanghai simultaneous tension roller 9 of the incident angle adjusting roller 6, and is supplied to the first lower heat-adhesive roller 7 so that the angle of incidence is adjusted obliquely upward. Laminating apparatus of a flexible circuit board, characterized in that. 제 1항에 있어서, 상기 제 1상부입사각조절롤러(12)는 상부에 에어실린더로 된 수직이동실린더(8b)가 설치되어 있어 상기 수직이동실린더(8b)의 승강작동에 의해 상하이동되면서 상부드라이필름(11)의 입사각이 정확하게 조절되도록 되어 있되 인접설치되어 커버필름(14a)을 벗기는 커버필름분리롤러(13a)도 상기 수직이동실린더(8b)에 의해 함께 승강작동되도록 되어 있어 상기 커버필름분리롤러(13a)와 제 1상부입사각조절롤러(12)사이로 상부드라이필름(11)이 통과되면서 원활하게 커버필름(14a)이 벗겨진 상태에서 비스듬히 하향 경사지게 제 1상부가열접착롤러(15)로 공급되도록 되어 있는 것을 특징으로 하는 연성회로기판의 라미네이팅 장치. According to claim 1, wherein the first upper vertical adjustment roller 12 is provided with a vertical cylinder (8b) made of an air cylinder at the top of the upper dry while moving by the lifting operation of the vertical cylinder (8b) The angle of incidence of the film 11 is precisely controlled, but the cover film separation roller 13a which is installed adjacent to and removes the cover film 14a is also lifted and operated together by the vertically moving cylinder 8b. As the upper dry film 11 passes between the 13a and the first upper incident angle adjusting roller 12, the cover film 14a is smoothly inclined downward to be supplied to the first upper heat-adhesive roller 15 in a state where the cover film 14a is peeled off. Laminating apparatus of a flexible circuit board, characterized in that. 제 1항에 있어서, 상기 제 2상부입사각조절롤러(22)는 상부에 에어실린더로 된 수직이동실린더(8c)가 설치되어 있어 상기 수직이동실린더(8c)의 승강작동에 의해 상하이동되도록 되어 있고 다수개의 중간가이드롤러(21)와 제 2상부가열접착롤러(23)사이의 가운데 부분 상부쪽에 설치되어 있되 상면 라미네이팅된 동박(18)이 제 2상부입사각조절롤러(22)의 상면부쪽으로 걸쳐져 비스듬히 하향 경사진 상태로 제 2상부가열접착롤러(23)로 공급되도록 되어 있어 상기 수직이동실린더(8c)에 의한 제 2상부입사각조절롤러(22)의 상하이동시에도 상면 라미네이팅된 동박(18)이 일정한 텐션을 유지한 상태로 입사각이 정확하게 조절되도록 되어 있는 것을 특징으로 하는 연성회로기판의 라미네이팅 장치.According to claim 1, wherein the second upper vertical adjustment roller 22 is installed in the upper vertical cylinder (8c) made of an air cylinder to be moved by the lifting operation of the vertical cylinder (8c) A plurality of intermediate guide rollers 21 and the second upper heat-adhesive roller 23 are installed on the upper part of the middle part, but the laminated copper foil 18 is spread over the upper surface of the second upper-inclined angle adjusting roller 22 at an angle. The upper laminated laminated copper foil 18 is fixed even at the same time as the second upper incident angle adjusting roller 22 by the vertical movable cylinder 8c is supplied to the second upper thermal bonding roller 23 in a downwardly inclined state. Laminating apparatus of a flexible circuit board, characterized in that the angle of incidence is adjusted accurately while maintaining the tension. 제 1항에 있어서, 상기 제 2하부입사각조절롤러(25)는 하부에 에어실린더로 된 수직이동실린더(8d)가 설치되어 있어 상기 수직이동실린더(8d)의 승강작동에 의해 상하이동되면서 하부드라이필름(20)의 입사각이 정확하게 조절되도록 되어 있되 인접설치되어 커버필름(14b)을 벗기는 커버필름분리롤러(13b)도 상기 수직이동실린더(8d)에 의해 함께 승강작동되도록 되어 있어 상기 커버필름분리롤러(13b)와 제 2하부입사각조절롤러(25)사이로 하부드라이필름(20)이 통과되면서 원활하게 커버필름(14b)이 벗겨진 상태에서 비스듬히 상향 경사지게 제 2하부가열접착롤러(26)로 공급되도록 되어 있는 것을 특징으로 하는 연성회로기판의 라미네이팅 장치. According to claim 1, wherein the second lower angle adjustment roller 25 is installed in the lower vertical movement cylinder (8d) made of an air cylinder is lowered while moving by the lifting operation of the vertical movement cylinder (8d) The incidence angle of the film 20 is precisely adjusted, but the cover film separation roller 13b which is installed adjacent to and removes the cover film 14b is also lifted and operated together by the vertically moving cylinder 8d. As the lower dry film 20 passes between the 13b and the second lower angle adjusting roller 25, the cover film 14b is smoothly inclined upwardly in an inclined upward direction to be supplied to the second lower heat adhesive roller 26. Laminating apparatus of a flexible circuit board, characterized in that. 상면라미네이팅부(2)의 하부에 위치된 동박공급롤러(3)에 감겨있는 동박필름 또는 동박(4)이 다수개의 전방가이드롤러(5)를 거쳐 일정하게 높이조절된 제 1하부입사각조절롤러(6)를 통해 입사각이 조절된 상태에서 제 1하부가열접착롤러(7)로 비스듬히 상향 경사지게 공급되면서 상기 제 1하부가열접착롤러(7)의 상부 외측면의 예열구간(L)에 맞닿아 예열되고, 상부에 위치된 상부필름공급롤러(10)에 감겨있는 상부드라이필름(11)은 커버필름분리롤러(13a)에 의해 커버필름(14a)이 제거된 상태에서 일정하게 높이조절된 제 1상부입사각조절롤러(12)를 통해 입사각이 조절된 상태에서 제 1상부가열접착롤러(15)로 비스듬히 하향 경사지게 공급되면서 상기 제 1상부가열접착롤러(15)의 하부 외측면의 예열구간(L')에 맞닿아 예열되며 가열 가압작동되는 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7)사이를 상기 동박(4)과 함께 통과하여 동박(4)의 상면에 상부드라이필름(11)이 라미네이팅되고, 상면 라미네이팅된 동박(18)은 하면라미네이팅부(19)에 구비된 다수개의 중간가이드롤러(21)를 통해 상부에 위치된 제 2상부입사각조절롤러(22)로 공급되고 일정하게 높이조절된 제 2상부입사각조절롤러(22)를 통해 입사각이 조절된 상태에서 제 2상부가열접착롤러(23)로 비스듬히 하향 경사지게 공급되면서 상기 제 2상부가열접착롤러(23)의 하부 외측면의 예열구간(L')에 맞닿아 예열되고, 하부에 위치된 하부필름공급롤러(24)에 감겨있는 하부드라이필름(20)이 커버필름분리롤러(13b)에 의해 커버필름(14b)이 제거된 상태에서 일정하게 높이조절된 제 2하부입사각조절롤러(25)를 통해 입사각이 조절된 상태에서 제 2하부가열접착롤러(26)로 비스듬히 상향 경사지게 공급되면서 상기 제 2하부가열접착롤러(26)의 상부 외측면의 예열구간(L)에 맞닿아 예열되며 가열 가압작동되는 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26) 사이를 상면 라미네이팅된 동박(18)과 함께 통과하여 상면 라미네이팅된 동박(18)의 하면에 하부드라이필름(20)이 라미네이팅되어 양면 라미네이팅된 동박(27)을 제조하는 것을 특징으로 하는 연성회로기판의 라미네이팅 방법.The first lower angle adjusting roller whose copper foil film or copper foil 4 wound around the copper foil feed roller 3 positioned below the upper laminating part 2 is constantly adjusted via a plurality of front guide rollers 5 ( 6) while the angle of incidence is adjusted, the first lower part is preheated obliquely upward to the first heat adhesive roller 7 while being preheated by contacting the preheating section L of the upper outer surface of the first lower heat adhesive roller 7. The upper dry film 11 wound on the upper film feed roller 10 positioned at the upper portion has a first upper incident angle which is constantly adjusted in a state in which the cover film 14a is removed by the cover film separating roller 13a. In the state where the angle of incidence is adjusted through the adjusting roller 12, the first upper portion is inclined downwardly inclined to the thermal bonding roller 15 to the preheating section L 'of the lower outer surface of the first upper thermal bonding roller 15. The first upper heating unit which is abutted and heated and pressurized The upper dry film 11 is laminated on the upper surface of the copper foil 4 by passing between the contact roller 15 and the first lower heat-adhesive roller 7 together with the copper foil 4, and the upper laminated lamination copper foil 18. The second upper incident angle adjusting roller 22 is supplied to the second upper incident angle adjusting roller 22 positioned at the upper portion through the plurality of intermediate guide rollers 21 provided on the lower surface laminating unit 19 and is constantly adjusted in height. Preheated in contact with the preheating section (L ') of the lower outer surface of the second upper portion of the heat-adhesive roller 23 while being inclined downward obliquely to the second upper portion of the heat-adhesive roller (23) in the state of the incident angle is adjusted through, The second lower incident angle adjustment of the lower dry film 20 wound around the lower film supply roller 24 positioned at the lower part of which the height is constantly adjusted while the cover film 14b is removed by the cover film separation roller 13b. Second lower portion thermal bonding in a state where the incidence angle is adjusted through the roller 25 The second upper portion of the heat-adhesive roller 23 and the preheated and heated and pressurized by contacting the preheating section L of the upper outer side surface of the second lower portion of the heat-adhesive roller 26 while being supplied obliquely upwardly to the roller 26. The lower dry film 20 is laminated on the lower surface of the upper laminated lamination copper foil 18 by passing between the lower portion of the heat-adhesive roller 26 together with the upper laminated lamination copper foil 18 to produce a double-sided laminated copper foil 27. Laminating method of a flexible circuit board, characterized in that. 하면라미네이팅부(19)의 제 2상,하부가열접착롤러(23)(26)의 작동을 중단시킴과 동시에 하부필름공급롤러(24)로부터의 하부드라이필름(20) 공급을 중지시킨 상태에서 상면라미네이팅부(2)를 가동하여 상면라미네이팅부(2)의 하부에 위치된 동박공급롤러(3)에 감겨있는 동박필름 또는 동박(4)이 다수개의 전방가이드롤러(5)를 거쳐 일정하게 높이조절된 제 1하부입사각조절롤러(6)를 통해 입사각이 조절된 상태에서 제 1하부가열접착롤러(7)로 비스듬히 상향 경사지게 공급되면서 상기 제 1하부가열접착롤러(7)의 상부 외측면의 예열구간(L)에 맞닿아 예열되고, 상부에 위치된 상부필름공급롤러(10)에 감겨있는 상부드라이필름(11)은 커버필름분리롤러(13a)에 의해 커버필름(14a)이 제거된 상태에서 일정하게 높이조절된 제 1상부입사각조절롤러(12)를 통해 입사각이 조절된 상태에서 제 1상부가열접착롤러(15)로 비스듬히 하향 경사지게 공급되면서 상기 제 1상부가열접착롤러(15)의 하부 외측면 의 예열구간(L')에 맞닿아 예열되며 가열 가압작동되는 제 1상부가열접착롤러(15)와 제 1하부가열접착롤러(7)사이를 상기 동박(4)과 함께 통과하여 동박(4)의 상면에 상부드라이필름(11)이 라미네이팅되고, 상면 라미네이팅된 동박(18)이 제 2상,하부가열접착롤러(23)(26)에 의해 가열 및 가압되지 않고 그대로 통과되도록 하여 일면 라미네이팅된 동박(30)을 제조하는 것을 특징으로 하는 연성회로기판의 라미네이팅 방법.The upper and lower surfaces of the lower surface laminating unit 19 stop the operation of the thermal adhesive rollers 23 and 26 and at the same time the supply of the lower dry film 20 from the lower film supply roller 24 is stopped. By operating the laminating part 2, the copper foil film or the copper foil 4 wound on the copper foil supply roller 3 positioned at the lower part of the upper laminating part 2 is constantly adjusted via a plurality of front guide rollers 5. Preheating section of the upper outer surface of the first lower portion of the heat-adhesive roller (7) while being supplied obliquely upwardly inclined to the first lower portion of the heat-adhesion roller (7) while the angle of incidence is adjusted through the first lower incidence adjustment roller (6) The upper dry film 11, which is preheated against (L) and wound on the upper film feed roller 10 positioned at the upper portion, is fixed in a state in which the cover film 14a is removed by the cover film separation roller 13a. The incident angle through the first upper incident angle adjusting roller 12 A first preheated and heated and pressurized by contacting the preheating section L 'of the lower outer surface of the first upper heat-adhesive roller 15 while being inclined downward to the first upper heat-adhesive roller 15 in a cut state. The upper dry film 11 is laminated on the upper surface of the copper foil 4 by passing between the upper heating adhesive roller 15 and the first lower heating adhesive roller 7 together with the copper foil 4, and the upper laminated lamination copper foil ( 18) Laminating method of the flexible circuit board, characterized in that the second phase, the lower portion is bonded to the heat-sealed rollers (23, 26) to pass through as it is without heating and pressurized as it is. 상면라미네이팅부(2)의 제 1상,하부가열접착롤러(15)(7)의 작동을 중단시킴과 동시에 상부필름공급롤러(10)로부터의 상부드라이필름(11) 공급을 중지시킨 상태에서 하면라미네이팅부(19)를 가동하여 동박공급롤러(3)로부터의 동박필름 또는 동박(4)이 제 1상,하부가열접착롤러(15)(7)에 의해 가열 및 가압되지 않고 그대로 통과하도록 하며, 상기 동박(4)은 하면라미네이팅부(19)에 구비된 다수개의 중간가이드롤러(21)를 통해 상부에 위치된 제 2상부입사각조절롤러(22)로 공급되고 일정하게 높이조절된 제 2상부입사각조절롤러(22)를 통해 입사각이 조절된 상태에서 제 2상부가열접착롤러(23)로 비스듬히 하향 경사지게 공급되면서 상기 제 2상부가열접착롤러(23)의 하부 외측면의 예열구간(L')에 맞닿아 예열되고, 하부에 위치된 하부필름공급롤러(24)에 감겨있는 하부드라이필름(20)이 커버필름분리롤러(13b)에 의해 커버필름(14b)이 제거된 상태에서 일정하게 높이조절된 제 2하부입사각조절롤러(25)를 통해 입사각이 조절된 상태에서 제 2하부가열접착롤러(26)로 비스듬히 상 향 경사지게 공급되면서 상기 제 2하부가열접착롤러(26)의 상부 외측면의 예열구간(L)에 맞닿아 예열되며 가열 가압작동되는 제 2상부가열접착롤러(23)와 제 2하부가열접착롤러(26) 사이를 상기 동박(4)과 함께 통과하여 동박(4)의 하면에 하부드라이필름(20)이 라미네이팅되어 일면 라미네이팅된 동박(30)을 제조하는 것을 특징으로 하는 연성회로기판의 라미네이팅 방법.When the first upper and lower portions of the upper laminating part 2 stop the operation of the thermal bonding rollers 15 and 7 and at the same time the supply of the upper dry film 11 from the upper film supply roller 10 is stopped, The laminating part 19 is operated so that the copper foil film or the copper foil 4 from the copper foil supply roller 3 passes through the first upper and lower portions without being heated and pressurized by the heat-adhesive rollers 15 and 7, The copper foil 4 is supplied to the second upper incident angle adjusting roller 22 positioned at the upper side through the plurality of intermediate guide rollers 21 provided on the lower surface laminating part 19 and the second upper incident angle is constantly adjusted. In the state in which the incidence angle is adjusted through the adjustment roller 22, the second upper portion is inclined downwardly inclined to the thermal bonding roller 23, and then to the preheating section L 'of the lower outer surface of the second upper portion thermal bonding roller 23. Abutment preheated and wound around the lower film feed roller 24 located below The second in the state where the incidence angle is adjusted through the second lower incidence adjustment roller 25 which is constantly height-adjusted while the cover film separation roller 13b is removed by the cover film separation roller 13b. The second upper heat-adhesive roller which is preheated and heated and pressed against the preheating section L of the upper outer surface of the second lower heat-adhesive roller 26 while being inclined upwardly obliquely to the lower heat-adhesive roller 26 ( The lower dry film 20 is laminated on the lower surface of the copper foil 4 by passing between the 23 and the second lower heat-adhesive roller 26 together with the copper foil 4 to produce the laminated copper foil 30 on one side. Laminating method of a flexible circuit board characterized in that.
KR1020070043916A 2007-05-07 2007-05-07 A laminating device of flexible printed circuits board and the making methed thereof KR100748208B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101859428B1 (en) 2018-04-05 2018-05-21 최상문 Method for manufacturing laminated film for printed circuit board
CN108391380A (en) * 2018-04-18 2018-08-10 深圳市爱升精密电路科技有限公司 The preparation method of flexible circuit board
CN109548322A (en) * 2017-09-21 2019-03-29 鹤山市得润电子科技有限公司 A kind of manufacturing method and production equipment of multi-layer soft circuit board
WO2021149917A1 (en) * 2020-01-22 2021-07-29 주식회사 두산 Laminator
KR20220022613A (en) * 2020-08-19 2022-02-28 율촌화학 주식회사 Method for fabricating laminated film

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Publication number Priority date Publication date Assignee Title
JPH1024522A (en) 1996-07-10 1998-01-27 Toyo Kohan Co Ltd Method and apparatus for manufacturing metal plate coated with thermoplastic resin
KR20010086385A (en) 1998-09-11 2001-09-10 우찌가사끼 이사오 Device and method for lamination
JP2001260156A (en) * 2000-03-17 2001-09-25 Matsushita Electric Ind Co Ltd Lamination apparatus

Patent Citations (3)

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Publication number Priority date Publication date Assignee Title
JPH1024522A (en) 1996-07-10 1998-01-27 Toyo Kohan Co Ltd Method and apparatus for manufacturing metal plate coated with thermoplastic resin
KR20010086385A (en) 1998-09-11 2001-09-10 우찌가사끼 이사오 Device and method for lamination
JP2001260156A (en) * 2000-03-17 2001-09-25 Matsushita Electric Ind Co Ltd Lamination apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109548322A (en) * 2017-09-21 2019-03-29 鹤山市得润电子科技有限公司 A kind of manufacturing method and production equipment of multi-layer soft circuit board
KR101859428B1 (en) 2018-04-05 2018-05-21 최상문 Method for manufacturing laminated film for printed circuit board
CN108391380A (en) * 2018-04-18 2018-08-10 深圳市爱升精密电路科技有限公司 The preparation method of flexible circuit board
WO2021149917A1 (en) * 2020-01-22 2021-07-29 주식회사 두산 Laminator
CN114930989A (en) * 2020-01-22 2022-08-19 株式会社斗山 Film pressing machine
CN114930989B (en) * 2020-01-22 2023-09-29 株式会社斗山 Film pressing machine
EP4068916A4 (en) * 2020-01-22 2023-12-13 Doosan Corporation Laminator
KR20220022613A (en) * 2020-08-19 2022-02-28 율촌화학 주식회사 Method for fabricating laminated film
KR102407188B1 (en) * 2020-08-19 2022-06-10 율촌화학 주식회사 Method for fabricating laminated film

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