JP5045518B2 - Circuit board manufacturing apparatus and circuit board manufacturing method - Google Patents

Description

  The present invention relates to a manufacturing apparatus and a circuit board manufacturing method used for manufacturing a circuit board having a function of interlayer connection.

  In recent years, with the miniaturization and high density of electronic devices, there has been a strong demand for circuit boards not only for industrial use but also for consumer use. In particular, circuit boards have been improved in functionality, and are connected by using a plurality of finer circuit patterns and inner layer connection means, and the connection reliability is an important factor.

  A conventional method for manufacturing a double-sided and multilayer circuit board will be described below.

  First, a method of manufacturing a double-sided circuit board that also serves as a base of a multilayer circuit board will be described.

  FIG. 7 is a process sectional view of a conventional circuit board manufacturing method.

  First, reference numeral 51 shown in FIG. 7A denotes a prepreg which is a substrate material in which a glass cloth is impregnated with a thermosetting epoxy resin, and the size in length, width and thickness is 500 mm × 500 mm × 0.1 mm. .

  Reference numeral 52 denotes a plastic film having a thickness of about 19 μm which becomes a mask film when filled with a conductive paste, and has a structure having a release layer in which a thermosetting resin layer is applied on one side and silicon or the like is applied on the opposite side. For example, polyethylene terephthalate (hereinafter referred to as PET sheet) is used as the material.

  Next, as shown in FIG. 7 (b), the prepreg 51 is sandwiched between the prepregs 51 by sandwiching the prepreg 51 with the PET sheet 52 and applying heat and pressure by a method such as laminating. Form. The PET sheet 52 can be easily peeled off from the prepreg 51 in a step of peeling later.

  Next, as shown in FIG.7 (c), the through-hole 54 is formed in the predetermined location of the prepreg 53 by laser processing.

  Next, as shown in FIG. 7 (d), the conductive paste 56 is filled into the through hole 54 from the front side of the PET sheet 52 serving as a print mask with the squeegee 55 using a printing machine (not shown). Thus, the conduction hole 57 is formed.

  At this time, the prepreg 53 having the through hole 54 is held in a vacuum suction state with a laying paper 71 interposed on a stage 70 (not shown) of the printing press.

  The prepreg 53 filled with the conductive paste 56 adheres to the laying paper 71 with the pressure of the squeegee and is fixed on the laying paper 71 by static electricity generated during squeegeeing.

  The conductive paste 56 coming out from the lower side of the through hole 54 is in contact with the laying paper 71, so that the resin and solvent contained in the conductive paste 54 are absorbed, and the F value of the conductive paste increases. As a result, the resistance value of the conduction hole 57 is stabilized.

  Next, as shown in FIG. 7 (e), the prepreg 53 that has been filled with the conductive paste 54 is slid so as not to float from the top of the laying paper 71.

  That is, by applying a shearing force at the interface between the laying paper 71 and the conductive paste, the prepreg 53 is peeled off from the laying paper 71 to prevent the conductive paste in the through hole from coming out. The amount of side slip is sufficient if it is about the diameter of the through hole 54 or slightly larger than that.

  Since the prepreg 53 and the laying paper 71 are strongly adhered with static electricity or conductive paste as described above, it is necessary to reduce or cancel the vacuum suction pressure before the side slip.

  In addition, the printing press has a function as a transporting means by winding up the wrapping paper after peeling by shearing by skidding, and can transport the prepreg 53 to the next process.

  Next, as shown in FIG. 7 (f), the prepreg 58 filled with the conductive paste is formed by peeling the PET sheet 52 from both sides of the prepreg 53.

  By this peeling step, the conductive paste filled in the holes formed in the PET sheet 52 remains in the form of convex ridges corresponding to the thickness of the PET sheet 52, thereby heating and pressing described later In this case, a compression effect is brought about and the electrical connection of the conduction holes is stabilized.

  Next, as shown in FIG. 7 (g), a metal foil 59 such as copper foil is stacked on both surfaces of the prepreg 58 and heated and pressed by a hot press, so that the metal foil 59 adheres to the prepreg 58, and FIG. The copper-clad laminate 60 on both sides shown in FIG.

  The metal foils 59 on both sides are electrically connected by a conductive paste in a conduction hole 57 provided at a predetermined position.

  Then, as shown in FIG. 7 (i), the double-sided metal foil 59 is selectively etched to form a circuit pattern 61, whereby a double-sided circuit board 62 is obtained.

  At least one double-sided circuit board 62 manufactured in accordance with FIGS. 7A to 7I, a plurality of prepregs 58 manufactured in FIGS. 7A to 7F, and for the outermost layer. It is also possible to manufacture a multilayer circuit board by preparing a metal foil and alternately laminating the circuit board 62 and the prepreg 58 and laminating the metal foil on the outermost layer.

As prior art document materials related to the invention of this application, for example, Patent Documents 1 and 2 are known.
Japanese Patent Laid-Open No. 9-246718 JP 2001-257468 A

  In the above circuit board manufacturing method, in order to stabilize the connection between the layers, the through hole is processed with a hole diameter close to the design value, and the conductive hole is surely filled with the conductive paste to form the conductive hole. It is.

  However, after conducting a continuity test, analyzing the state of a conductive hole with a high resistance value or a disconnected conductive hole, there is no conductive paste in the conductive hole, or the amount of conductive paste filled There were extremely few things.

  As a result of the investigation, it was found that the conductive paste once filled in the through holes had fallen out of the through holes.

  Furthermore, when the main cause was investigated, when conductive paste was filled into a crepe with wrinkles or a prepreg with warping or undulation, skiing was performed with a slight gap between the lay and the prepreg. Zing will be performed.

  In this case, the gap between the prepreg and the prepreg is further expanded due to the level difference caused by the wrinkles of the laying paper and the prepreg undulation at the moment when the vacuum suction is released. Turned out to be.

  For this reason, the prepreg is peeled off in a direction perpendicular to the laying paper and bonded to the laying paper before shear peeling at the interface between the laying paper and the conductive paste by applying side slip to the prepreg. A tensile force acts on the adhesive paste in the vertical direction. As a result, a part of the conductive paste in the conduction hole is broken and dropped out in the conduction hole.

  For this reason, in the past, by improving the quality of the laying paper, by peeling the prepreg, the peeling mechanism at the interface between the laying paper and the conductive paste, or by improving the planar uniformity of the laminated prepreg, The falling off of the conductive paste from the conduction hole was suppressed.

  However, even if these measures are taken, the above abnormalities may occur in rare cases due to wrinkling of the laying paper or warping and undulation of the prepreg, etc. There is a problem that the yield (non-defective product rate) of the manufacturing process is lowered because the process cannot be detected immediately.

  The present invention solves the above-mentioned conventional problems, and improves the reliability of the connection between the layers through the conduction holes by immediately detecting an abnormality in the formation of the conduction holes in the process of filling the conductive paste. SUMMARY OF THE INVENTION It is an object of the present invention to provide a circuit board manufacturing apparatus and a circuit board manufacturing method for realizing the above.

  In order to achieve the above object, a circuit board manufacturing apparatus according to the present invention fixes a printing stage having means for adsorbing a sheet-like material, and a printing plate frame that can move up and down above the printing stage. Means for moving, a squeegee holder that is movable in a horizontal direction with respect to the printing plate, a supply roll for supplying a covering paper onto the printing stage, a winding roll for winding the covering paper from the printing stage, and It comprises means for sliding the sheet-like material and detection means installed in front of the take-up roll, and the detection means recognizes the surface state of the laying sheet as an image. In the case of detecting an abnormality on the surface of the laying paper, it is possible to immediately check the content of the abnormality and take countermeasures by making the specification to automatically stop the manufacturing device and issue abnormality information, It is possible to prevent the-sustaining product failure.

  The method for manufacturing a circuit board according to the present invention includes a step of forming a through hole in a sheet-like material, a step of placing the sheet-like material on a laying paper, and a conductive paste in the through-hole of the sheet-like material. A step of bringing the conductive paste and the covering paper into contact with each other by filling until reaching the covering sheet, a step of sliding the sheet-like material to shear the conductive paste and the covering paper, and the covering And a step of observing the surface of the paper, whereby there can be provided a circuit board with high connection reliability between the layers without any abnormality in the conduction holes due to the drop of the conductive paste. .

  According to the present invention, the circuit board manufacturing apparatus and the circuit board manufacturing method having the above-described configuration can immediately detect the amount of the conductive paste adhered to the laying paper in the conductive paste filling step, and Even if the phenomenon of the removal of the conductive paste occurs, a countermeasure can be taken immediately, so that there is no possibility that the conductive hole has a potential abnormality in the subsequent process. As a result, continuous product abnormalities can be prevented, and the formation of the conduction holes can be stabilized, thereby providing an effect of providing a circuit board with high reliability of interlayer connection.

(Embodiment)
The circuit board manufacturing method and the circuit board manufacturing material of the present invention will be described below.

  In the present embodiment, double-sided and multilayer circuit boards will be described.

  FIG. 1 is a process cross-sectional view showing a circuit board manufacturing method according to an embodiment of the present invention.

  First, a prepreg 1 as a sheet-like substrate material in FIG. 1A is obtained by impregnating a glass cloth with a thermosetting epoxy resin, and has a size of 500 mm × 500 mm × 0. 1 mm.

  A plastic sheet (hereinafter referred to as a PET sheet) 2 is mainly composed of a plastic film having a thickness of about 19 μm serving as a mask film.

  The PET sheet 2 has a hole diameter control layer (not shown) having a thickness of about 1.2 μm made of a thermosetting resin having no melting point on the surface layer of the plastic film, and is a surface in contact with the prepreg 1 which is the opposite surface. Is a structure having a release layer coated with silicon or the like.

  For example, polyethylene terephthalate is used as the base material of the PET sheet 2, but PEN (polyethylene naphthalate), PPS (poniphenylene sulfide), or the like may be used.

  Next, as shown in FIG. 1B, the prepreg 1 is sandwiched between the PET sheets 2 and heated and pressurized by a method such as laminating. Thereby, the laminated prepreg 3 having a configuration in which the PET sheet 2 is attached to both surfaces of the prepreg 1 is formed.

  Next, as shown in FIG.1 (c), the through-hole 4 is formed in the predetermined location of the prepreg 3 using a laser processing method.

  Next, as shown in FIG. 1 (d), until the squeegee 5 is slid on the PET sheet 2 using a printing machine (not shown), the conductive paste 6 is spread on the through holes 4 until reaching the paper 21. By filling, the conductive paste and the laying paper are brought into contact with each other to form a conduction hole 7.

  In this process, the front side PET sheet 2 plays a role of a printing mask, and the hole diameter of the hole formed in the PET sheet among the through holes 4 is the connection reliability between the layers of the circuit board and the alignment in the multilayer stacking process. It affects the quality of (match).

  Next, as shown in FIG. 1 (e), the prepreg 3 is slid parallel to the laying paper 21 to shear-peel the interface between the conductive paste 6 and the laying paper 21.

  In addition, in the manufacturing method of the circuit board of this invention, although the process of observing the surface of the laying paper 21 after shearing peeling is provided, the detail is mentioned later.

  Next, as shown in FIG. 1 (f), the PET sheet 2 is peeled from both sides of the prepreg 3 to form a prepreg 8 filled with a conductive paste.

  Next, as shown in FIG. 1 (g), a metal foil 9 such as copper foil is overlapped on both sides of the prepreg 8, and heated and pressed with a hot press, whereby the double-sided copper clad laminate shown in FIG. 1 (h). 10 is formed. Thereby, the metal foils 9 on both sides are electrically connected via the conduction holes 7.

  And as shown in FIG.1 (i), the metal foil 9 of both surfaces is selectively etched, the circuit pattern 11 is formed, and the circuit board 12 of both surfaces is obtained.

  Next, the manufacturing method of the multilayer circuit board of this invention is demonstrated using FIG.

  FIG. 2 is a process cross-sectional view illustrating a method for manufacturing a multilayer circuit board according to the present invention, and illustrates a four-layer board as an example.

  First, as shown in FIG. 2 (a), the double-sided circuit board 12 manufactured through the steps of FIGS. 1 (a) to (i) and the steps of FIGS. 1 (a) to (f) are manufactured. A prepreg 8a for upper lamination and a prepreg 8b for lower lamination provided with the conducted holes 7 are prepared.

  Next, as shown in FIG. 2B, a metal foil 9 is placed on a lamination stage (not shown), and a prepreg 8b, a double-sided circuit board 12, and a prepreg 8a are used in that order using an image recognition device or the like. Positioning and lamination are performed, and a metal foil 9 is further laminated thereon.

  Next, as shown in FIG. 2C, the prepregs 8a and 8b and the double-sided circuit board 12 sandwiched between the metal foils 9 are heated and pressed by hot pressing to obtain a four-layered copper-clad laminated board 13.

  Through the above steps, the outermost metal foil 9 is electrically connected by the circular circuit pattern 11 for connection of the double-sided circuit board 12 for the inner layer through the conductive paste in the conduction hole.

  Next, as shown in FIG. 2 (d), the metal foils 9 on both sides are selectively etched to form a circuit pattern 11, and a four-layer circuit board 14 is obtained.

  In the present embodiment, a four-layer multilayer substrate has been described. However, for a multilayer substrate having four or more layers, for example, a six-layer substrate, the four-layer circuit substrate obtained by the above manufacturing method is used as the double-sided circuit substrate. Instead of the above, the method of manufacturing a multilayer circuit board {FIG. 2 (a) to FIG. 2 (d)} may be repeated.

  Details of the conductive paste filling step and the like in FIGS. 1D and 1E will be described.

  FIG. 3 is a schematic view showing a filling process and a circuit board manufacturing apparatus according to the present invention.

  First, the outline of the circuit board manufacturing apparatus of the present invention shown in FIG. 3 will be described.

  The circuit board manufacturing apparatus of the present invention mainly includes a printing stage 20, a means (not shown) for fixing a printing plate frame that is movable above and below the printing stage, and a printing plate in a horizontal direction. A slidable squeegee holder (not shown), a supply roll 28a for supplying the covering paper 21 onto the printing stage 20, a take-up roll 28b for winding up the covering paper 21 from the printing stage 20, and a sheet-like material Is made up of an image sensor 27 as a detection means installed in front of the take-up roll 28b.

  The printing stage 20 has a vacuum suction hole for sucking and fixing the prepreg sheet 3, a printing plate 25 having an opening is fixed to a means for fixing the plate frame, and a squeegee 5 is attached to the squeegee holder. It is attached. The squeegee holder has a structure that moves up and down simultaneously when the means for fixing the plate frame moves up and down.

  Further, a porous plastic sheet 24 is disposed on the printing stage 20, and a laying paper 21 having a function of absorbing a resin component and a solvent component when the conductive paste is filled thereon is disposed. Yes.

  In addition, the plastic sheet 24 has pores, and the flow of air during vacuum suction is performed in order to prevent the resin and solvent contained in the conductive paste from entering the vacuum suction holes and to suck the entire surface of the prepreg 3. Is diffused in the sheet.

  Further, the laying paper 21 and the plastic sheet 24 are connected to supply rolls 28a and 29a and take-up rolls 28b and 29b respectively installed before and after the printing stage, and in particular, the laying paper 21 moves the prepreg to the printing position. When moving out from the printing position, it is supplied from the supply roll 28a and simultaneously wound around the take-up roll 28b. Note that the plastic sheet 24 supplied immediately below the laying paper 21 can be wound once every time the laying paper 21 is wound a plurality of times, or wound simultaneously with the winding of the laying paper 21. It is also possible.

  The detecting means recognizes the surface state of the laying paper 21 before the laying paper 21 is wound on the take-up roll 28b, and can detect a wide range by using an image sensor 27 such as an area sensor. If the detection is performed at a certain width by a CCD camera arranged in the width direction of the laying paper 21 as detection means, high-definition recognition can be performed.

  Further, the detecting means further includes means for comparing and judging the recognized images and means for stopping the sliding of the squeegee holder, thereby preventing the abnormality of the conduction holes from occurring continuously.

  Next, the filling process of the conductive paste in the circuit board manufacturing method of the present invention will be described.

  As shown in FIG. 3 (a), the prepreg 3 placed on the laying sheet 21 on the plastic sheet 24 is carried in as the supply-side roll 28a and the winding-side roll 28b rotate in synchronization with each other, and printing is performed. It stops on the printing stage 20 at a position corresponding to the opening of the printing plate 25 installed on the upper side of the stage 20.

  Next, the prepreg 3 and the laying paper 21 are brought into close contact with each other by sucking air from the vacuum suction hole of the printing stage 20 through the plastic sheet 24.

  Next, the conductive paste 6 is placed in the through hole by sliding the squeegee 5 fixed on a squeegee holder (not shown) capable of moving in the horizontal direction with respect to the printing plate 25 on the PET sheet 2. Fill. At that time, the conductive paste 6 is filled until reaching the laying paper 21, and the conductive paste 6 that has reached the lower side of the through hole comes into contact with the laying paper 21 and sucks out resin and solvent.

  Next, as shown in FIG. 3B, after the printing plate 25 and the squeegee 5 fixed to the means for fixing the plate frame and the squeegee holder are raised, the suction force of the printing stage 20 is weakened or released. Then, the prepreg 3 is slid in the horizontal direction using the side-sliding jig 26.

  By this operation, the conductive paste below the through hole in contact with the laying paper 21 is sheared at the contact interface with the laying paper 21 and can be peeled off without the conductive paste in the through hole falling off.

  Next, as shown in FIG. 3C, the prepreg 3 is unloaded from the printing stage 20 by winding the laying paper 21 with a winding roll 28 b.

  At this time, the surface of the laying paper 21 is observed with an image sensor 27 installed before the laying paper 21 is wound around the take-up roll 28, and the presence or absence of the conductive paste is attached by recognizing the color change. Detect the amount.

  In the present embodiment, an image sensor is used. However, similar detection is possible using image recognition means such as a CCD.

  In any case, if an abnormality is detected on the surface of the laying paper 21, it is possible to immediately check the content of the abnormality and take measures by setting the specification to automatically stop the manufacturing apparatus and issue abnormality information. It becomes possible to prevent continuous product defects.

  The operation of the circuit board manufacturing apparatus according to the present invention will be described from the viewpoint of the manufacturing method. The step of forming a through hole in the prepreg, the step of placing the prepreg on the paper, and the conductive through the through hole of the prepreg. A step of bringing the conductive paste into contact with the wrapping paper by filling the conductive paste until reaching the laying paper, a step of sliding the prepreg to shear-peel the conductive paste and the laying paper, And a step of observing the surface of the laying paper, and as a result of observing the surface of the laying paper 21, when there is no abnormality in color tone or the like, that is, when the conductive paste is not adhered or the amount of adhesion is very small The prepreg filled with the conductive paste is sent to the subsequent process, and if there is an abnormality in the color tone, i.e., if the conductive paste adheres over a certain amount, Strike is an indication that not send on subsequent steps prepreg filled.

  Thereby, the double-sided circuit board formed through the steps of FIGS. 1F to 1I or the multilayer circuit board formed through the process of FIG. It is possible to provide a circuit board having no abnormality in the conduction holes and high connection reliability between the layers.

  The above configuration, which is a feature of the present invention, has been derived by the inventor performing the following observations. This is described below.

  First, when the laying paper 21 after use when the conductive paste is filled in a normal state is observed, as shown in FIG. In addition, it was confirmed that traces 30 were formed as if the absorbed resin content and solvent soaked and were wet.

  Next, when the prepreg shown in the step of FIG. 1 (e) is peeled off in the vertical direction without the side slip, a part of the conductive paste adhered to the laying paper 21 falls out of the conduction hole 7, A space 31 from which the conductive paste is removed is formed in the conduction hole 7 as shown in FIG. In this case, the surface of the laying paper 21 was in a state where the conductive paste 36 was adhered and the color thereof was dark and conspicuous.

  Further, as shown in FIG. 6, when the conductive paste is removed due to the wrinkles 32 of the laying paper 21 or the like, there is a clear color around the wrinkles 32 generated on the laying paper 21 as compared with the case of the trace 30 described above. It was confirmed that there is a difference.

  This is because the prepreg is peeled off vertically from the laying paper 21 due to the influence of wrinkles 32 of the laying paper 21 before the shear detachment due to the side slip of the prepreg, and the conductive paste bonded to the laying paper 21 is pulled in the vertical direction. As a result, a part of the conductive paste in the conduction hole is broken and falls off.

  In such a case, the surface of the wrapping paper 21 is different from a color (trace 30) in which a normal resin component or a solvent component is soaked and wetted, and the lump of metal powder in the conductive paste has a through-hole diameter. Are attached in the same size as the conductive paste 36, and thus the conductive paste 36 is observed in a colored state.

  In addition, when the level difference due to the wrinkle 32 of the laying paper 21 is large, the gap between the laying paper 21 and the prepreg 3 cannot be eliminated even during the filling of the conductive paste, and therefore, the leakage from the through hole. The conductive paste 37 thus adhered may adhere to the laying paper 21 with an area larger than the through hole.

  This shows that by visually observing the surface of the laying paper, it can be determined whether the conductive paste is normally filled in the through holes or whether the conductive paste has fallen out of the conductive holes. is there.

  That is, the present inventor has focused on the fact that abnormal formation of the conduction hole is manifested on the surface of the laying paper after filling with the conductive paste, and has reached the above-described configuration of the present invention.

  In the past, when the above-mentioned abnormalities were rarely caused by wrinkles or prepreg warpage or waviness of the laying paper, the laying paper was also used as a prepreg conveying means by winding operation after filling with conductive paste. For this reason, it is difficult to immediately detect abnormality of the conduction hole.

  In addition, once the above-mentioned abnormality of the conduction hole occurs, there is a high possibility of continuously generating product defects, which has the problem of reducing the manufacturing process yield (non-defective product rate). This makes it possible to immediately detect abnormalities in the conduction holes, prevent the occurrence of continuous product defects, and improve the manufacturing process yield.

  Furthermore, the advantage of manufacturing a double-sided or multilayer circuit board using the circuit board manufacturing method of the present invention is that in addition to providing a circuit board with high connection reliability between layers, in the circuit board manufacturing process It is possible to improve productivity.

  In other words, in the present invention, what was conventionally detected as a defective product in the final electrical inspection process can be detected immediately in the course of the manufacturing process, and unnecessary man-hours and material costs can be reduced. It becomes possible to improve the yield.

  In addition, it is easy to adopt the technique of the present invention, and this technique can be spread.

  As described above, when the circuit board manufacturing apparatus and the circuit board manufacturing method of the present invention are used, abnormalities in the conductive holes can be detected immediately, so that the quality of the conductive holes in the process of filling the conductive paste is stabilized, A circuit board with high reliability of interlayer connection can be provided. From this, it can be said that the industrial applicability of the present invention is great.

Sectional drawing which shows the manufacturing method of the circuit board in embodiment of this invention Process sectional drawing which shows the manufacturing method of the multilayer circuit board in the embodiment Schematic which shows the filling process of the electrically conductive paste in the embodiment The figure for demonstrating the manufacturing method of the circuit board in the embodiment The figure for demonstrating the manufacturing method of the circuit board in the embodiment The figure for demonstrating the manufacturing method of the circuit board in the embodiment Process sectional view showing a conventional method of manufacturing a circuit board

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Prepreg 2 PET sheet 3 Laminated prepreg 4 Through-hole 5 Squeegee 6 Conductive paste 7 Conductive hole 8, 8a, 8b Prepreg filled with conductive paste 9 Metal foil 10 Double-sided copper-clad laminate 11 Circuit pattern 12 Double-sided Circuit board 13 Multi-layer copper-clad laminate 14 Multi-layer circuit board 20 Printing stage 21 Laying paper 24 Plastic sheet 25 Printing plate 26 Side-sliding jig 27 Detection means 28a, 29a Supply roll 28b, 29b Winding roll 30 Trace 31 Space 32 Wrinkles 36, 37 Conductive paste attached to the paper

Claims (9)

A printing stage having means for adsorbing the sheet-like material;
Means for fixing a plate frame of a printing plate which is movable above and below the printing stage;
A squeegee holder that can move horizontally with respect to the printing plate;
A supply roll for supplying a laying paper onto the printing stage;
A take-up roll for winding the laying paper from the printing stage;
Means for sliding the sheet material;
A detection means installed in front of the winding roll,
The circuit board manufacturing apparatus, wherein the detection means recognizes an image of a surface state of the laying paper. 2. The circuit board manufacturing apparatus according to claim 1, wherein the detecting means is an image sensor or a CCD camera. 2. The circuit board manufacturing apparatus according to claim 1, wherein the detecting means recognizes the color tone of the surface of the laying paper. A plastic sheet supply roll for supplying the plastic sheet onto the printing stage; and a plastic sheet take-up roll for winding up the plastic sheet from the printing stage. The plastic sheet is on the printing stage and directly under the laying paper The circuit board manufacturing apparatus according to claim 1, wherein the circuit board manufacturing apparatus is supplied. 2. The circuit board manufacturing apparatus according to claim 1, wherein the detecting means further comprises means for comparing and determining the recognized images and means for stopping the sliding of the squeegee holder. 5. The circuit board manufacturing apparatus according to claim 4, wherein the plastic sheet has holes. Forming a through hole in the sheet-like material;
Placing the sheet-like material on a laying paper;
Bringing the conductive paste into contact with the covering paper by filling the through hole of the sheet-like material with the conductive paste until reaching the covering paper;
Slipping the sheet-like material to shear-peel the conductive paste and the laying paper;
And a step of observing the surface of the laying paper. The step of observing the surface of the laying paper is to detect the presence or absence or amount of the conductive paste by recognizing a change in color tone of the laying paper. A method of manufacturing a circuit board. 8. The method for manufacturing a circuit board according to claim 7, wherein the sheet-like material is obtained by sticking a PET sheet to both surfaces of the prepreg.

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