KR20060062998A - 인쇄회로기판 - Google Patents

인쇄회로기판 Download PDF

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Publication number
KR20060062998A
KR20060062998A KR1020040102025A KR20040102025A KR20060062998A KR 20060062998 A KR20060062998 A KR 20060062998A KR 1020040102025 A KR1020040102025 A KR 1020040102025A KR 20040102025 A KR20040102025 A KR 20040102025A KR 20060062998 A KR20060062998 A KR 20060062998A
Authority
KR
South Korea
Prior art keywords
circuit board
printed circuit
pad portion
lead
diameter
Prior art date
Application number
KR1020040102025A
Other languages
English (en)
Korean (ko)
Inventor
방용웅
Original Assignee
삼성전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 삼성전자주식회사 filed Critical 삼성전자주식회사
Priority to KR1020040102025A priority Critical patent/KR20060062998A/ko
Priority to CNA2005100813440A priority patent/CN1787723A/zh
Priority to JP2005188739A priority patent/JP2006165503A/ja
Publication of KR20060062998A publication Critical patent/KR20060062998A/ko

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/115—Via connections; Lands around holes or via connections
    • H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3405—Edge mounted components, e.g. terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09427—Special relation between the location or dimension of a pad or land and the location or dimension of a terminal

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
KR1020040102025A 2004-12-06 2004-12-06 인쇄회로기판 KR20060062998A (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020040102025A KR20060062998A (ko) 2004-12-06 2004-12-06 인쇄회로기판
CNA2005100813440A CN1787723A (zh) 2004-12-06 2005-06-27 印刷电路基板
JP2005188739A JP2006165503A (ja) 2004-12-06 2005-06-28 印刷回路基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020040102025A KR20060062998A (ko) 2004-12-06 2004-12-06 인쇄회로기판

Publications (1)

Publication Number Publication Date
KR20060062998A true KR20060062998A (ko) 2006-06-12

Family

ID=36667131

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020040102025A KR20060062998A (ko) 2004-12-06 2004-12-06 인쇄회로기판

Country Status (3)

Country Link
JP (1) JP2006165503A (ja)
KR (1) KR20060062998A (ja)
CN (1) CN1787723A (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008159822A (ja) * 2006-12-24 2008-07-10 Fuji Electric Fa Components & Systems Co Ltd 基板およびその製造方法
JP2012023386A (ja) * 2011-09-13 2012-02-02 Fuji Electric Co Ltd 基板

Also Published As

Publication number Publication date
JP2006165503A (ja) 2006-06-22
CN1787723A (zh) 2006-06-14

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Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination