KR20060049934A - 두께 계측기 및 연삭 장치 - Google Patents

두께 계측기 및 연삭 장치 Download PDF

Info

Publication number
KR20060049934A
KR20060049934A KR1020050061313A KR20050061313A KR20060049934A KR 20060049934 A KR20060049934 A KR 20060049934A KR 1020050061313 A KR1020050061313 A KR 1020050061313A KR 20050061313 A KR20050061313 A KR 20050061313A KR 20060049934 A KR20060049934 A KR 20060049934A
Authority
KR
South Korea
Prior art keywords
plate
thickness
shaped object
fluid
wave
Prior art date
Application number
KR1020050061313A
Other languages
English (en)
Korean (ko)
Inventor
가즈마 세키야
Original Assignee
가부시기가이샤 디스코
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시기가이샤 디스코 filed Critical 가부시기가이샤 디스코
Publication of KR20060049934A publication Critical patent/KR20060049934A/ko

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02854—Length, thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/263—Surfaces
    • G01N2291/2632—Surfaces flat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020050061313A 2004-07-29 2005-07-07 두께 계측기 및 연삭 장치 KR20060049934A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2004-00221615 2004-07-29
JP2004221615A JP2006038744A (ja) 2004-07-29 2004-07-29 厚み計測器及び研削装置

Publications (1)

Publication Number Publication Date
KR20060049934A true KR20060049934A (ko) 2006-05-19

Family

ID=35903886

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050061313A KR20060049934A (ko) 2004-07-29 2005-07-07 두께 계측기 및 연삭 장치

Country Status (3)

Country Link
JP (1) JP2006038744A (ja)
KR (1) KR20060049934A (ja)
CN (1) CN1727118A (ja)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5122854B2 (ja) * 2007-04-13 2013-01-16 株式会社ディスコ デバイスの研削方法
JP2008307646A (ja) * 2007-06-15 2008-12-25 Disco Abrasive Syst Ltd 切削装置
JP5160190B2 (ja) * 2007-10-29 2013-03-13 株式会社ディスコ 研削装置及び研削方法
JP2009111238A (ja) * 2007-10-31 2009-05-21 Marubun Corp 半導体ウエハ研削装置
JP2009113149A (ja) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd 研削装置
JP2010199227A (ja) * 2009-02-24 2010-09-09 Disco Abrasive Syst Ltd 研削装置
JP5573459B2 (ja) * 2010-07-27 2014-08-20 株式会社ジェイテクト 研削方法および研削盤
CN103769976A (zh) * 2012-10-24 2014-05-07 汉达精密电子(昆山)有限公司 自动打磨机构
CN103308012B (zh) * 2013-06-24 2016-04-27 广东惠利普路桥信息工程有限公司 混凝土路面厚度检测系统及检测方法
CN103292754B (zh) * 2013-07-06 2016-02-03 河北联合大学 多介质层超声波测厚方法
CN103586748B (zh) * 2013-10-24 2016-04-13 安徽东冠器械设备有限公司 一种曲边工作台面的加工装置
CN104841703B (zh) * 2013-11-07 2017-11-24 洪洋杰 测量装置
JP6328513B2 (ja) 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法
JP6589239B2 (ja) * 2015-09-25 2019-10-16 株式会社Ｓｃｒｅｅｎホールディングス 膜厚測定装置及び膜厚測定方法
CN105598772A (zh) * 2016-02-02 2016-05-25 东莞市吉宏五金科技有限公司 Pcb磨披锋机、自动测厚调高装置及其自动测厚调高方法
CN106248008A (zh) * 2016-08-31 2016-12-21 惠晶显示科技（苏州）有限公司 一种减薄后的液晶面板厚度测量方法
CN107449379A (zh) * 2017-08-14 2017-12-08 北京智芯微电子科技有限公司 用于sim卡芯片的无损测量方法
CN110797272B (zh) * 2018-08-01 2022-08-26 上海祖强能源有限公司 芯片切割方法及芯片切割装置
KR102645311B1 (ko) * 2018-08-13 2024-03-08 삼성디스플레이 주식회사 두께 측정 장치 및 이를 이용한 두께 측정 방법
KR102074588B1 (ko) * 2018-09-28 2020-02-06 한양대학교 에리카산학협력단 수중침전물질 음향탐지 방법 및 시스템
CN112207522A (zh) * 2020-10-26 2021-01-12 许晨玲 一种大型铝合金整体壁板平度控制方法

Also Published As

Publication number Publication date
CN1727118A (zh) 2006-02-01
JP2006038744A (ja) 2006-02-09

Similar Documents

Publication Publication Date Title
KR20060049934A (ko) 두께 계측기 및 연삭 장치
US7117104B2 (en) Ultrasonic liquid flow controller
US11215489B2 (en) Apparatus and method for measuring the flow velocity of a fluid in a pipe
KR102070465B1 (ko) 균열 두께 검출 장치
KR101635950B1 (ko) 초음파를 이용한 비접촉식 콘크리트 강도 측정 장치
CA2792242C (en) Method and apparatus for determining gvf (gas volume fraction) for aerated fluids and liquids in flotation tanks, columns, drums, tubes, vats
US4065958A (en) Method of controlling physical characteristics of fluid medium
TW201632309A (zh) 被加工物的磨削方法
CN109216223A (zh) 晶圆键合能检测装置以及晶圆键合能的测量方法
CN105849549B (zh) 检测钢板缺陷的超声波检测设备和方法
CN101325178B (zh) 切削装置
US7713106B2 (en) Device grinding method
JPS63250548A (ja) 棒材又は板材の損失係数、動弾性係数、動せん断弾性係数及び動ポアソン比の測定方法並びに測定装置
US3406564A (en) Ultrasonic transducer scanning system
JP2003050117A (ja) 厚さ測定方法及び厚さ測定装置
JPH1114608A (ja) 電磁超音波探触子
RU2383869C2 (ru) Ультразвуковой уровнемер
Zhang et al. Development of a wireless pressure sensor with remote acoustic transmission
JP2005249486A (ja) 超音波厚み測定方法および装置
JP2008304282A (ja) 超音波密度計
JPH07110229A (ja) 金属ストリップループの最下点位置検出装置
CN114577152A (zh) 一种基于声波的抛光垫沟槽检测方法及其检测系统
JP2003028841A (ja) 超音波探傷方法及びその装置
JP2008304283A (ja) 超音波流量計
JP2694862B2 (ja) 網入りガラスの線深さ測定方法

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application