CN1727118A - 测厚仪以及磨削装置 - Google Patents

测厚仪以及磨削装置 Download PDF

Info

Publication number
CN1727118A
CN1727118A CNA2005100836086A CN200510083608A CN1727118A CN 1727118 A CN1727118 A CN 1727118A CN A2005100836086 A CNA2005100836086 A CN A2005100836086A CN 200510083608 A CN200510083608 A CN 200510083608A CN 1727118 A CN1727118 A CN 1727118A
Authority
CN
China
Prior art keywords
plate object
thickness
back wave
fluid
mentioned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005100836086A
Other languages
English (en)
Chinese (zh)
Inventor
关家一马
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of CN1727118A publication Critical patent/CN1727118A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
    • G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
    • G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
    • G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/023—Solids
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/02—Indexing codes associated with the analysed material
    • G01N2291/028—Material parameters
    • G01N2291/02854—Length, thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/263—Surfaces
    • G01N2291/2632—Surfaces flat
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2291/00—Indexing codes associated with group G01N29/00
    • G01N2291/26—Scanned objects
    • G01N2291/269—Various geometry objects
    • G01N2291/2697—Wafer or (micro)electronic parts

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Machine Tool Sensing Apparatuses (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
CNA2005100836086A 2004-07-29 2005-07-13 测厚仪以及磨削装置 Pending CN1727118A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004221615A JP2006038744A (ja) 2004-07-29 2004-07-29 厚み計測器及び研削装置
JP2004221615 2004-07-29

Publications (1)

Publication Number Publication Date
CN1727118A true CN1727118A (zh) 2006-02-01

Family

ID=35903886

Family Applications (1)

Application Number Title Priority Date Filing Date
CNA2005100836086A Pending CN1727118A (zh) 2004-07-29 2005-07-13 测厚仪以及磨削装置

Country Status (3)

Country Link
JP (1) JP2006038744A (ja)
KR (1) KR20060049934A (ja)
CN (1) CN1727118A (ja)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103292754A (zh) * 2013-07-06 2013-09-11 河北联合大学 多介质层超声波测厚方法
CN103551399A (zh) * 2013-11-07 2014-02-05 张觉灵 测量装置
CN103586748A (zh) * 2013-10-24 2014-02-19 安徽东冠器械设备有限公司 一种曲边工作台面的加工装置
CN103769976A (zh) * 2012-10-24 2014-05-07 汉达精密电子(昆山)有限公司 自动打磨机构
CN105598772A (zh) * 2016-02-02 2016-05-25 东莞市吉宏五金科技有限公司 Pcb磨披锋机、自动测厚调高装置及其自动测厚调高方法
CN106248008A (zh) * 2016-08-31 2016-12-21 惠晶显示科技（苏州）有限公司 一种减薄后的液晶面板厚度测量方法
CN107449379A (zh) * 2017-08-14 2017-12-08 北京智芯微电子科技有限公司 用于sim卡芯片的无损测量方法
CN108027236A (zh) * 2015-09-25 2018-05-11 株式会社斯库林集团 膜厚测量装置及膜厚测量方法
CN110797272A (zh) * 2018-08-01 2020-02-14 北京铂阳顶荣光伏科技有限公司 芯片切割方法及芯片切割装置
CN110823145A (zh) * 2018-08-13 2020-02-21 三星显示有限公司 用于测量厚度的设备和用于测量厚度的方法
CN112207522A (zh) * 2020-10-26 2021-01-12 许晨玲 一种大型铝合金整体壁板平度控制方法

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5122854B2 (ja) * 2007-04-13 2013-01-16 株式会社ディスコ デバイスの研削方法
JP2008307646A (ja) * 2007-06-15 2008-12-25 Disco Abrasive Syst Ltd 切削装置
JP5160190B2 (ja) * 2007-10-29 2013-03-13 株式会社ディスコ 研削装置及び研削方法
JP2009111238A (ja) * 2007-10-31 2009-05-21 Marubun Corp 半導体ウエハ研削装置
JP2009113149A (ja) * 2007-11-06 2009-05-28 Disco Abrasive Syst Ltd 研削装置
JP2010199227A (ja) * 2009-02-24 2010-09-09 Disco Abrasive Syst Ltd 研削装置
JP5573459B2 (ja) * 2010-07-27 2014-08-20 株式会社ジェイテクト 研削方法および研削盤
CN103308012B (zh) * 2013-06-24 2016-04-27 广东惠利普路桥信息工程有限公司 混凝土路面厚度检测系统及检测方法
JP6328513B2 (ja) 2014-07-28 2018-05-23 株式会社ディスコ ウエーハの加工方法
KR102074588B1 (ko) * 2018-09-28 2020-02-06 한양대학교 에리카산학협력단 수중침전물질 음향탐지 방법 및 시스템
KR20210025404A (ko) 2019-08-27 2021-03-09 주식회사 엘지화학 단위셀의 두께측정장치 및 두께측정방법

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103769976A (zh) * 2012-10-24 2014-05-07 汉达精密电子(昆山)有限公司 自动打磨机构
CN103292754B (zh) * 2013-07-06 2016-02-03 河北联合大学 多介质层超声波测厚方法
CN103292754A (zh) * 2013-07-06 2013-09-11 河北联合大学 多介质层超声波测厚方法
CN103586748A (zh) * 2013-10-24 2014-02-19 安徽东冠器械设备有限公司 一种曲边工作台面的加工装置
CN103586748B (zh) * 2013-10-24 2016-04-13 安徽东冠器械设备有限公司 一种曲边工作台面的加工装置
CN103551399A (zh) * 2013-11-07 2014-02-05 张觉灵 测量装置
CN104785547A (zh) * 2013-11-07 2015-07-22 张觉灵 测量装置
CN108027236A (zh) * 2015-09-25 2018-05-11 株式会社斯库林集团 膜厚测量装置及膜厚测量方法
CN105598772A (zh) * 2016-02-02 2016-05-25 东莞市吉宏五金科技有限公司 Pcb磨披锋机、自动测厚调高装置及其自动测厚调高方法
CN106248008A (zh) * 2016-08-31 2016-12-21 惠晶显示科技（苏州）有限公司 一种减薄后的液晶面板厚度测量方法
CN107449379A (zh) * 2017-08-14 2017-12-08 北京智芯微电子科技有限公司 用于sim卡芯片的无损测量方法
CN110797272A (zh) * 2018-08-01 2020-02-14 北京铂阳顶荣光伏科技有限公司 芯片切割方法及芯片切割装置
CN110823145A (zh) * 2018-08-13 2020-02-21 三星显示有限公司 用于测量厚度的设备和用于测量厚度的方法
US11788835B2 (en) 2018-08-13 2023-10-17 Samsung Display Co., Ltd. Apparatus for measuring sample thickness and method for measuring sample thickness
CN110823145B (zh) * 2018-08-13 2024-03-26 三星显示有限公司 用于测量厚度的设备和用于测量厚度的方法
CN112207522A (zh) * 2020-10-26 2021-01-12 许晨玲 一种大型铝合金整体壁板平度控制方法

Also Published As

Publication number Publication date
JP2006038744A (ja) 2006-02-09
KR20060049934A (ko) 2006-05-19

Similar Documents

Publication Publication Date Title
CN1727118A (zh) 测厚仪以及磨削装置
AU2020233686A1 (en) Improved Signal Travel Time Flow Meter
US11709152B2 (en) Linkage device, transceiver module and plane stress field measuring device and method capable of achieving synchronous adjustment of distance and angle
CA2492177A1 (en) Method for determining the sound velocity in a base material, particularly for measuring the thickness of a wall
CN110160622B (zh) 一种行波管水听器灵敏度一致性在线校准方法
CN1928493A (zh) 用声波测量混凝土构件特性的装置及其使用方法
CN103676240B (zh) 表面检测装置
CN111323485A (zh) 一种用于轨道板内部缺陷检测的成像方法及装置
CN116183717A (zh) 大型压力容器早期局部腐蚀无损检测方法及装置
CN1926408A (zh) 多普勒型超声波流量计
CN106767721A (zh) 一种峡谷狭深河段水深测量方法和装置
CN111332803B (zh) 一种适用于超声长距离悬浮传输的驻波比调节方法
CN109521099B (zh) 基于拾音器相位差相阵的移动式无损检测方法
CN110133665B (zh) 一种超声换能器基于包络线的多普勒测量方法
CN208283338U (zh) 一种声学特性测量装置及系统
CN100580444C (zh) 中高频下粘弹性材料声学参数测量方法
CN114354502B (zh) 基于激光声表面波的硅片加工表面损伤和残余应力表征方法
CN111982034B (zh) 一种用于测量液体静压导轨油膜厚度的超声波检测装置
CN209471081U (zh) 一种表面波和板波声速的非接触式测量装置
CN206223154U (zh) 一种峡谷狭深河段水深测量装置
CN111983034B (zh) 基于超声波技术标定液体静压导轨油膜刚度的方法
CN111256630A (zh) 利用电磁超声导波频散特性快速测量金属板材厚度方法
CN206854039U (zh) 一种双声程双压电片超声波换能器
CN214473019U (zh) 可调型分割式探头
CN112593926B (zh) 一种利用sh波测量套管井固井胶结质量的方法及系统

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication