CN1727118A - 测厚仪以及磨削装置 - Google Patents
测厚仪以及磨削装置 Download PDFInfo
- Publication number
- CN1727118A CN1727118A CNA2005100836086A CN200510083608A CN1727118A CN 1727118 A CN1727118 A CN 1727118A CN A2005100836086 A CNA2005100836086 A CN A2005100836086A CN 200510083608 A CN200510083608 A CN 200510083608A CN 1727118 A CN1727118 A CN 1727118A
- Authority
- CN
- China
- Prior art keywords
- plate object
- thickness
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- fluid
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims abstract description 45
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract 3
- 238000003801 milling Methods 0.000 abstract 1
- 238000005755 formation reaction Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000009774 resonance method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Images
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
- G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02854—Length, thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/263—Surfaces
- G01N2291/2632—Surfaces flat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004221615A JP2006038744A (ja) | 2004-07-29 | 2004-07-29 | 厚み計測器及び研削装置 |
JP2004221615 | 2004-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN1727118A true CN1727118A (zh) | 2006-02-01 |
Family
ID=35903886
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNA2005100836086A Pending CN1727118A (zh) | 2004-07-29 | 2005-07-13 | 测厚仪以及磨削装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2006038744A (ja) |
KR (1) | KR20060049934A (ja) |
CN (1) | CN1727118A (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103292754A (zh) * | 2013-07-06 | 2013-09-11 | 河北联合大学 | 多介质层超声波测厚方法 |
CN103551399A (zh) * | 2013-11-07 | 2014-02-05 | 张觉灵 | 测量装置 |
CN103586748A (zh) * | 2013-10-24 | 2014-02-19 | 安徽东冠器械设备有限公司 | 一种曲边工作台面的加工装置 |
CN103769976A (zh) * | 2012-10-24 | 2014-05-07 | 汉达精密电子(昆山)有限公司 | 自动打磨机构 |
CN105598772A (zh) * | 2016-02-02 | 2016-05-25 | 东莞市吉宏五金科技有限公司 | Pcb磨披锋机、自动测厚调高装置及其自动测厚调高方法 |
CN106248008A (zh) * | 2016-08-31 | 2016-12-21 | 惠晶显示科技(苏州)有限公司 | 一种减薄后的液晶面板厚度测量方法 |
CN107449379A (zh) * | 2017-08-14 | 2017-12-08 | 北京智芯微电子科技有限公司 | 用于sim卡芯片的无损测量方法 |
CN108027236A (zh) * | 2015-09-25 | 2018-05-11 | 株式会社斯库林集团 | 膜厚测量装置及膜厚测量方法 |
CN110797272A (zh) * | 2018-08-01 | 2020-02-14 | 北京铂阳顶荣光伏科技有限公司 | 芯片切割方法及芯片切割装置 |
CN110823145A (zh) * | 2018-08-13 | 2020-02-21 | 三星显示有限公司 | 用于测量厚度的设备和用于测量厚度的方法 |
CN112207522A (zh) * | 2020-10-26 | 2021-01-12 | 许晨玲 | 一种大型铝合金整体壁板平度控制方法 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5122854B2 (ja) * | 2007-04-13 | 2013-01-16 | 株式会社ディスコ | デバイスの研削方法 |
JP2008307646A (ja) * | 2007-06-15 | 2008-12-25 | Disco Abrasive Syst Ltd | 切削装置 |
JP5160190B2 (ja) * | 2007-10-29 | 2013-03-13 | 株式会社ディスコ | 研削装置及び研削方法 |
JP2009111238A (ja) * | 2007-10-31 | 2009-05-21 | Marubun Corp | 半導体ウエハ研削装置 |
JP2009113149A (ja) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | 研削装置 |
JP2010199227A (ja) * | 2009-02-24 | 2010-09-09 | Disco Abrasive Syst Ltd | 研削装置 |
JP5573459B2 (ja) * | 2010-07-27 | 2014-08-20 | 株式会社ジェイテクト | 研削方法および研削盤 |
CN103308012B (zh) * | 2013-06-24 | 2016-04-27 | 广东惠利普路桥信息工程有限公司 | 混凝土路面厚度检测系统及检测方法 |
JP6328513B2 (ja) | 2014-07-28 | 2018-05-23 | 株式会社ディスコ | ウエーハの加工方法 |
KR102074588B1 (ko) * | 2018-09-28 | 2020-02-06 | 한양대학교 에리카산학협력단 | 수중침전물질 음향탐지 방법 및 시스템 |
KR20210025404A (ko) | 2019-08-27 | 2021-03-09 | 주식회사 엘지화학 | 단위셀의 두께측정장치 및 두께측정방법 |
-
2004
- 2004-07-29 JP JP2004221615A patent/JP2006038744A/ja active Pending
-
2005
- 2005-07-07 KR KR1020050061313A patent/KR20060049934A/ko not_active Application Discontinuation
- 2005-07-13 CN CNA2005100836086A patent/CN1727118A/zh active Pending
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103769976A (zh) * | 2012-10-24 | 2014-05-07 | 汉达精密电子(昆山)有限公司 | 自动打磨机构 |
CN103292754B (zh) * | 2013-07-06 | 2016-02-03 | 河北联合大学 | 多介质层超声波测厚方法 |
CN103292754A (zh) * | 2013-07-06 | 2013-09-11 | 河北联合大学 | 多介质层超声波测厚方法 |
CN103586748A (zh) * | 2013-10-24 | 2014-02-19 | 安徽东冠器械设备有限公司 | 一种曲边工作台面的加工装置 |
CN103586748B (zh) * | 2013-10-24 | 2016-04-13 | 安徽东冠器械设备有限公司 | 一种曲边工作台面的加工装置 |
CN103551399A (zh) * | 2013-11-07 | 2014-02-05 | 张觉灵 | 测量装置 |
CN104785547A (zh) * | 2013-11-07 | 2015-07-22 | 张觉灵 | 测量装置 |
CN108027236A (zh) * | 2015-09-25 | 2018-05-11 | 株式会社斯库林集团 | 膜厚测量装置及膜厚测量方法 |
CN105598772A (zh) * | 2016-02-02 | 2016-05-25 | 东莞市吉宏五金科技有限公司 | Pcb磨披锋机、自动测厚调高装置及其自动测厚调高方法 |
CN106248008A (zh) * | 2016-08-31 | 2016-12-21 | 惠晶显示科技(苏州)有限公司 | 一种减薄后的液晶面板厚度测量方法 |
CN107449379A (zh) * | 2017-08-14 | 2017-12-08 | 北京智芯微电子科技有限公司 | 用于sim卡芯片的无损测量方法 |
CN110797272A (zh) * | 2018-08-01 | 2020-02-14 | 北京铂阳顶荣光伏科技有限公司 | 芯片切割方法及芯片切割装置 |
CN110823145A (zh) * | 2018-08-13 | 2020-02-21 | 三星显示有限公司 | 用于测量厚度的设备和用于测量厚度的方法 |
US11788835B2 (en) | 2018-08-13 | 2023-10-17 | Samsung Display Co., Ltd. | Apparatus for measuring sample thickness and method for measuring sample thickness |
CN110823145B (zh) * | 2018-08-13 | 2024-03-26 | 三星显示有限公司 | 用于测量厚度的设备和用于测量厚度的方法 |
CN112207522A (zh) * | 2020-10-26 | 2021-01-12 | 许晨玲 | 一种大型铝合金整体壁板平度控制方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2006038744A (ja) | 2006-02-09 |
KR20060049934A (ko) | 2006-05-19 |
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C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
WD01 | Invention patent application deemed withdrawn after publication |