CN1727118A - Thicknesser and grinding appts. - Google Patents
Thicknesser and grinding appts. Download PDFInfo
- Publication number
- CN1727118A CN1727118A CNA2005100836086A CN200510083608A CN1727118A CN 1727118 A CN1727118 A CN 1727118A CN A2005100836086 A CNA2005100836086 A CN A2005100836086A CN 200510083608 A CN200510083608 A CN 200510083608A CN 1727118 A CN1727118 A CN 1727118A
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- CN
- China
- Prior art keywords
- plate object
- thickness
- back wave
- fluid
- mentioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000012530 fluid Substances 0.000 claims abstract description 45
- 230000015572 biosynthetic process Effects 0.000 claims description 7
- 238000012423 maintenance Methods 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000126 substance Substances 0.000 abstract 3
- 238000003801 milling Methods 0.000 abstract 1
- 238000005755 formation reaction Methods 0.000 description 6
- 238000005452 bending Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000001902 propagating effect Effects 0.000 description 2
- 238000009774 resonance method Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000002604 ultrasonography Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B17/00—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations
- G01B17/02—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness
- G01B17/025—Measuring arrangements characterised by the use of infrasonic, sonic or ultrasonic vibrations for measuring thickness for measuring thickness of coating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/36—Detecting the response signal, e.g. electronic circuits specially adapted therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/028—Material parameters
- G01N2291/02854—Length, thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/263—Surfaces
- G01N2291/2632—Surfaces flat
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/26—Scanned objects
- G01N2291/269—Various geometry objects
- G01N2291/2697—Wafer or (micro)electronic parts
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices Characterised By Use Of Acoustic Means (AREA)
- Machine Tool Sensing Apparatuses (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a thickness measuring instrument and milling device. The invention accurately measures its thickness without damaging a plate-like substance. A thickness measuring instrument comprises forming a fluid film 3, by making a fluid flow out toward the upper face 2a of the plate-like substance 2 held on a holding table, forming a fluid column 4 in the inside of a cylinder body 12 and finding the thickness of the plate-like matter 2 from the time, until the reflection wave reaches after an ultrasonic waves have been transmitted from a wave-transmitting part 17. Since the cylinder body 12 is not brought into contact with the plate-like substance 2, the plate-like matter will not be damaged.
Description
Technical field
The present invention relates to the grinding attachment measuring the calibrator of plate object thickness and this calibrator has been installed.
Background technology
When wanting, need during processing, accurately measure the thickness of this plate object by machining plate-like thing formation desired thickness.When for example planning that the semiconductor wafer that the surface forms a plurality of circuit is processed as desired thickness, be set at the limit and measure its its lower surface of thickness edges grinding, when measurement result reaches desired thickness, finish grinding (with reference to patent documentation 1,2,3,4).
Patent documentation 1: the spy opens the 2001-1261 communique
Patent documentation 2: the spy opens the 2001-9716 communique
Patent documentation 3: the spy opens flat 8-210833 communique
Patent documentation 4: the spy opens flat 9-189542 communique
Yet because the invention described in the above-mentioned document all adopts the gauge that thickness measuring uses etc. directly to contact with measuring object, thereby there is the problem of easy damaged measuring object.Especially thickness measuring to as if the situation of the workpiece of semiconductor wafer and so on very thin thickness under often become the reason that bending strength descends.
Summary of the invention
Therefore the present invention's problem of planning to solve is not damage accurately its thickness of mensuration of thickness measuring object ground, thereby the bending strength of determination object can not descended.
The present invention is a kind of calibrator of measuring plate object thickness, it is characterized in that, comprising: the maintenance platform that keeps plate object; The plate object upper surface that direction of flow is remained on this maintenance platform forms fluid film, by upper surface mediate contact through this fluid film and this plate object, and the cylindrical body of the fluid column that portion's formation within it simultaneously is made of this fluid; The fluid feeder of fluid is provided for this cylindrical body; Produce hyperacoustic ultrasound transmitter device; The transmitter that the ultrasonic wave that this supersonic generator is produced sends towards this plate object by this fluid column and this fluid film; Seizure is towards the receiver of hyperacoustic back wave of this plate object transmission; Receive the back wave that this receiver captures the back wave receiver, send out after the ultrasonic wave to the time that receives the back wave of this plate object lower surface at this back wave receiver by obtaining this supersonic generator, calculate the thickness calculator of this plate object thickness.
Above-mentioned thickness calculator preferably sends after the ultrasonic wave above-mentioned back wave receiver and receives time of back wave of above-mentioned plate object upper surface and this supersonic generator and send after the ultrasonic wave thickness that the time difference that above-mentioned back wave receiver receives the back wave of this plate object lower surface calculates this plate object by obtaining above-mentioned supersonic generator.Supersonic generator preferably produces pulse ultrasonic wave.
Among thickness calculator, the thickness of plate object is made as W, the velocity of sound in this plate object is made as V, after above-mentioned excusing from death wave producer transmission ultrasonic wave, the time that receives the back wave of this plate object upper surface to above-mentioned back wave receiver is made as T1, this supersonic generator is sent after ultrasonic wave the time that this back wave receiver receives the back wave of this plate object lower surface be made as T2, then the thickness W of this plate object is by W=V * (T2-T1) calculating formula of ÷ 2 is obtained.
The fluid that offers cylindrical body as the fluid feeder can be a pure water.
In addition, the grinding attachment that the present invention relates to is characterized in that: have the grinding means on grinding plate object surface, above-mentioned calibrator has been installed, measure and remain on the thickness that keeps the plate object on the platform.
If adopt the measuring thickness device that the present invention relates to, because tubular spare does not contact with plate object, send ultrasonic wave towards plate object through fluid, by receiving the thickness that its back wave can determine plate object, thereby can not damage plate object.In addition, hyperacoustic propagation is improved, thereby improved the mensuration precision by fluid.Also have, owing to needn't resemble the height of measuring plate object upper surface and two positions of platform surface that keep plate object the contact pin type, thereby can not produce evaluated error.
In addition, the grinding attachment that the present invention relates to has been installed above-mentioned calibrator, owing to during grinding, do not contact the thickness that can accurately determine this plate object with plate object, thereby plate object can be processed into desired thickness.
Description of drawings
Fig. 1 is the key diagram that illustrates measuring thickness device.
Fig. 2 is the concise and to the point profile of expression fluid film and fluid column.
Fig. 3 is the concise and to the point profile of expression ultrasonic wave reflection case on plate object.
Fig. 4 is the schematic diagram that illustrates grinding attachment.
The specific embodiment
Among measuring thickness device shown in Figure 11, the plate object 2 that constitutes the thickness measuring object remains on and keeps on the platform 11.Cylindrical body 12 is to be configured in the top that keeps platform 11 in the face of the 1st opening 12a open state that keeps platform 11.Opening-Di 2 opening 12b of the opposite side of cylindrical body 12 are connected with fluid feeder 14 by valve 13.
In the 2nd opening 12b one side, disposed and produced hyperacoustic supersonic generator 15, the propagation part 16a by cylindrical body 12 inside is connected with transmitter 17.Transmitter 17 is configured in cylindrical body 12 inside face on the position that keeps platform 11, and transmitter 17 sends supersonic generator 15 through propagating the ultrasonic wave that part 16a propagates towards remaining on the plate object 2 that keeps on the platform 11.Can use pulse ultrasonic wave as the ultrasonic wave that supersonic generator 15 sends.
Adjacent with transmitter 17, disposed the receiver 18 of the back wave of ultrasonic wave on plate object 2 that receiver transmitter 17 sends.Receiver 18 be positioned at the contour position of transmitter 17 on.Receiver 18 is connected with the back wave receiver 19 that is configured in the 2nd opening 12b one side through the propagation part 16b of cylindrical body 12 inside, and the back wave that receiver 18 receives sends back wave receiver 19 to through propagating part 16b.But supersonic generator 15 double as back wave receivers 19 use sometimes.But transmitter 17 double as receivers 18 use sometimes.Also have, supersonic generator 15 and transmitter 17, receiver 18 also can adopt with back wave receiver 19 and be the structure of one altogether.
Connecting thickness calculator 20 on supersonic generator 15 and the back wave receiver 19.Thickness calculator 20 produces according to supersonic generator 15, and is gone out the thickness of plate object 2 by the Time Calculation that the back wave that plate object 2 reflects arrives back wave receiver 19.
When mensuration remains on the thickness that keeps the plate object 2 on the platform 11, with the 1st opening 12a one side of cylindrical body 12 not with the upper surface state of contact of plate body 2, open valve 13, the fluid of pure water and so on is provided to cylindrical shell 12 inside from fluid feeder 14, and this fluid is flowed out from the 1st opening 12a.So promptly between the upper surface 2a of plate object 2 and the 1st opening 12a, form fluid film 3 as shown in Figure 2.Also have, the state to link to each other with fluid film 3 in cylindrical body 12 forms the fluid column 4 that is made of the fluid that flows out.
As mentioned above, under the state that forms fluid film 3 and fluid column 4, as shown in Figure 3, send (for example frequency is about 30MHz) ultrasonic wave 100 that supersonic generator shown in Figure 1 15 produces towards plate object 2 by transmitter 17.So, receiver 18 can receive back wave 200 on the plate object upper surface 2a and the back wave 201 on the plate object lower surface 2b, and this back wave 200 and back wave 201 are sent to back wave receiver 19 through propagation part 16b shown in Figure 1.
Two kinds of back waves of thickness calculator 20 identifications arrive the time of back wave receiver 19, can calculate the thickness of plate object 2 according to this time difference.That is to say by obtaining supersonic generator 15 to send out after the ultrasonic wave time of the back wave on the upper surface 2a that the back wave receiver receives plate object 2 and supersonic generator 15 and send out after the ultrasonic wave time difference that the back wave receiver receives the back wave on the plate object 2 lower surface 2b, can calculate the thickness of plate object 2.
If the ultrasonic wave 100 that supersonic generator 15 is sent is after the upper surface 2a of plate object 2 reflection, the time that this back wave 200 arrives back wave receiver 19 is made as T1, with ultrasonic wave 100 after the lower surface 2b of plate object 2 reflection, the time that this back wave 201 arrives back wave receiver 19 is made as T2, the velocity of sound of plate object 2 inside is made as V, and promptly available W=V * (T1-T2) calculating formula of ÷ 2 is obtained the thickness W of plate object 2.(T1-T2) value equals the time difference that two kinds of back waves arrive.
In addition, also available so-called resonance method is obtained the thickness of plate object 2.In the case, be variable with the frequency setting in the supersonic generator 15.Ruo Bianchao plate object 2 sends the ultrasonic wave limits and continuously changes frequency f, in other words, continuously changes wavelength and goes into, and when the integral multiple (n doubly) of half-wavelength when equating with the thickness W of plate object 2, promptly during W=n * λ ÷ 2, ultrasonic wave resonates in plate object 2.Thereby by measuring the interval (f of continuous resonant frequency
N+1-f
n), with W=V ÷ [2 * (f
N+1-f
n)] calculating formula can obtain the value of the thickness W of plate object 2.Adopt under the situation of resonance method, also can pass through fluid film 3 and fluid column 4 propagate ultrasound waves and back wave thereof.
Because so when measuring the thickness of plate object 2, cylindrical body 12 does not contact with plate object 2.Thereby can not damage plate object 2.In addition, often be full of fluid because of fluid film 3 and fluid column 4 between transmitter 17 and receiver 18 and plate object 2, ultrasonic wave is not propagated in air.Since with air in compare, the attenuation of ultrasonic wave in fluid is little, propagation performance is good, thereby can measure more accurately.Then propagation performance is better if make fluid with pure water.
Fig. 1～calibrator 1 shown in Figure 3 can be installed on the grinding attachment shown in Figure 45.This grinding attachment 5 is that the face by the grinding plate object is processed as the device of desired thickness with it, and the maintenance platform 11 that constitutes calibrator 1 is configured to and can rotates flexibly with respect to mobile foundation 50.Cylindrical body 12 is outwards outstanding from mobile foundation 50, and the 1st opening 12a is towards keeping platform 11.Though not shown among Fig. 4, below mobile foundation 50, disposed fluid supply source 14 shown in Figure 1, valve 13, supersonic generator 15, back wave receiver 19 and thickness calculator 20.
Disposed the grinding means driver 52 that thing is implemented grinding grinding means 51 and driven grinding means 51 that is ground that keeps on the platform 11 remaining on the grinding attachment 5.
Grinding means driver 52 by the pair of guide rails on the vertical direction that is configured in wall portion 520 521 and with the leading screw 522 of guide rail 521 configured in parallel, be connected the impulse motor 523 of leading screw one end, when being combined on the guide rail 521 slidably, the formations such as supporter 524 that inner nut and leading screw 522 screw togather, employing is along with leading screw rotates under the driving of impulse motor 523, supporter 524 lifting under the guiding of guide rail 521 is subjected to the also formation of lifting thereupon of grinding means 51 that supporter 524 supports.
Grinding means 51 adopt following formation: by the drive source 511 of the main shaft 510 in axle center, rotation drive shaft 510 with vertical direction, in the lower end of main shaft 510 through the fixing Grinding wheel 513 of wheel carrier 512, be fixed on the abrasive grinding wheel 514 below the Grinding wheel 513, employing is along with main shaft 510 rotates under the driving of drive source 511, and abrasive grinding wheel 514 is the formation of rotation thereupon also.
Because not only abrasive grinding wheel 514 rotates during grinding, keep the maintenance platform 11 of plate object 2 also rotating, thereby abrasive grinding wheel 514 needn't contact the part that existence does not always contact with abrasive grinding wheel 514 on upper surface 2a with the entire upper surface 2a of plate object 2.Thereby can on this part, carry out thickness measurement during the grinding with calibrator 1 always.By the mensuration of carrying out carrying out always, finish grinding when the value that calculates when thickness calculator 20 (with reference to Fig. 1) reaches desirable value and can form plate object 2 with desired thickness with calibrator.
Claims (6)
1, a kind of calibrator of measuring plate object thickness is characterized in that comprising: keep the maintenance platform of plate object,
Make direction of flow remain on plate object surface on this maintenance platform, form fluid film, through the upper surface mediate contact of this fluid film and this plate object, the cylindrical body of the fluid column that portion's formation within it simultaneously is made of this fluid;
The fluid feeder of fluid is provided for this cylindrical body;
Produce hyperacoustic supersonic generator;
The transmitter that the ultrasonic wave that this supersonic generator is produced sends towards this plate object by this fluid column and this fluid film;
Seizure is towards the receiver of hyperacoustic back wave of this plate object transmission;
Receive the back wave receiver of the back wave that this receiver captures;
Send out ultrasonic wave afterwards to the time that receives the back wave of this plate object lower surface at this back wave receiver by obtaining this supersonic generator, calculate the thickness calculator of this plate object thickness.
2, calibrator according to claim 1 is characterized in that: above-mentioned thickness calculator sends after the ultrasonic wave above-mentioned back wave receiver and receives time of back wave of above-mentioned plate object upper surface and this supersonic generator and send after the ultrasonic wave and above-mentionedly instead state time difference that the back wave receiver receives the back wave of this plate object lower surface and calculate the thickness of this plate object by obtaining above-mentioned supersonic generator.
3, calibrator according to claim 1 is characterized in that: supersonic generator produces pulse ultrasonic wave.
4, calibrator according to claim 2, it is characterized in that: among thickness calculator, the thickness of plate object is made as W, the velocity of sound in this plate object is made as V, after above-mentioned excusing from death wave producer transmission ultrasonic wave, the time that receives the back wave of this plate object upper surface to above-mentioned back wave receiver is made as T1, this supersonic generator is sent after ultrasonic wave the time that this back wave receiver receives the back wave of this plate object lower surface be made as T2, then the thickness W of this plate object is by W=V * (T2-T1) calculating formula of ÷ 2 is obtained.
5, calibrator according to claim 1 is characterized in that: the fluid that above-mentioned fluid feeder offers above-mentioned cylindrical body is a pure water.
6, a kind of grinding attachment that has disposed the grinding means on grinding plate object surface is characterized in that: aforesaid right requirement 1 to 5 each described calibrator has been installed, has been measured the thickness that remains on the plate object on the above-mentioned maintenance platform.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004221615 | 2004-07-29 | ||
| JP2004221615A JP2006038744A (en) | 2004-07-29 | 2004-07-29 | Thickness measuring instrument and grinding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1727118A true CN1727118A (en) | 2006-02-01 |
Family
ID=35903886
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100836086A Pending CN1727118A (en) | 2004-07-29 | 2005-07-13 | Thicknesser and grinding appts. |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2006038744A (en) |
| KR (1) | KR20060049934A (en) |
| CN (1) | CN1727118A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103292754A (en) * | 2013-07-06 | 2013-09-11 | 河北联合大学 | Ultrasonic thickness measurement method for multiple medium layers |
| CN103551399A (en) * | 2013-11-07 | 2014-02-05 | 张觉灵 | Measuring equipment |
| CN103586748A (en) * | 2013-10-24 | 2014-02-19 | 安徽东冠器械设备有限公司 | Processing device for curve-edge work surfaces |
| CN103769976A (en) * | 2012-10-24 | 2014-05-07 | 汉达精密电子(昆山)有限公司 | Automatic polishing mechanism |
| CN105598772A (en) * | 2016-02-02 | 2016-05-25 | 东莞市吉宏五金科技有限公司 | PCB deburring machine, automatic thickness-measuring height-adjusting device and automatic thickness-measuring height-adjusting method thereof |
| CN106248008A (en) * | 2016-08-31 | 2016-12-21 | 惠晶显示科技（苏州）有限公司 | A kind of thinning after liquid crystal panel method for measuring thickness |
| CN107449379A (en) * | 2017-08-14 | 2017-12-08 | 北京智芯微电子科技有限公司 | Non-destructive measuring method for SIM card chip |
| CN108027236A (en) * | 2015-09-25 | 2018-05-11 | 株式会社斯库林集团 | Film thickness measurement device and film thickness measuring method |
| CN110797272A (en) * | 2018-08-01 | 2020-02-14 | 北京铂阳顶荣光伏科技有限公司 | Chip cutting method and chip cutting device |
| CN110823145A (en) * | 2018-08-13 | 2020-02-21 | 三星显示有限公司 | Apparatus for measuring thickness and method for measuring thickness |
| CN112207522A (en) * | 2020-10-26 | 2021-01-12 | 许晨玲 | Flatness control method for large aluminum alloy integral wall plate |
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| JP5122854B2 (en) * | 2007-04-13 | 2013-01-16 | 株式会社ディスコ | Device grinding method |
| JP2008307646A (en) * | 2007-06-15 | 2008-12-25 | Disco Abrasive Syst Ltd | Cutting apparatus |
| JP5160190B2 (en) * | 2007-10-29 | 2013-03-13 | 株式会社ディスコ | Grinding apparatus and grinding method |
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| JP2009113149A (en) * | 2007-11-06 | 2009-05-28 | Disco Abrasive Syst Ltd | Grinder |
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-
2004
- 2004-07-29 JP JP2004221615A patent/JP2006038744A/en active Pending
-
2005
- 2005-07-07 KR KR1020050061313A patent/KR20060049934A/en not_active Application Discontinuation
- 2005-07-13 CN CNA2005100836086A patent/CN1727118A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103769976A (en) * | 2012-10-24 | 2014-05-07 | 汉达精密电子(昆山)有限公司 | Automatic polishing mechanism |
| CN103292754B (en) * | 2013-07-06 | 2016-02-03 | 河北联合大学 | Multi-medium-layer ultrasonic thickness test method |
| CN103292754A (en) * | 2013-07-06 | 2013-09-11 | 河北联合大学 | Ultrasonic thickness measurement method for multiple medium layers |
| CN103586748A (en) * | 2013-10-24 | 2014-02-19 | 安徽东冠器械设备有限公司 | Processing device for curve-edge work surfaces |
| CN103586748B (en) * | 2013-10-24 | 2016-04-13 | 安徽东冠器械设备有限公司 | The processing unit (plant) of a kind of bent limit work top |
| CN103551399A (en) * | 2013-11-07 | 2014-02-05 | 张觉灵 | Measuring equipment |
| CN104785547A (en) * | 2013-11-07 | 2015-07-22 | 张觉灵 | Measuring device |
| CN108027236A (en) * | 2015-09-25 | 2018-05-11 | 株式会社斯库林集团 | Film thickness measurement device and film thickness measuring method |
| CN105598772A (en) * | 2016-02-02 | 2016-05-25 | 东莞市吉宏五金科技有限公司 | PCB deburring machine, automatic thickness-measuring height-adjusting device and automatic thickness-measuring height-adjusting method thereof |
| CN106248008A (en) * | 2016-08-31 | 2016-12-21 | 惠晶显示科技（苏州）有限公司 | A kind of thinning after liquid crystal panel method for measuring thickness |
| CN107449379A (en) * | 2017-08-14 | 2017-12-08 | 北京智芯微电子科技有限公司 | Non-destructive measuring method for SIM card chip |
| CN110797272A (en) * | 2018-08-01 | 2020-02-14 | 北京铂阳顶荣光伏科技有限公司 | Chip cutting method and chip cutting device |
| CN110823145A (en) * | 2018-08-13 | 2020-02-21 | 三星显示有限公司 | Apparatus for measuring thickness and method for measuring thickness |
| US11788835B2 (en) | 2018-08-13 | 2023-10-17 | Samsung Display Co., Ltd. | Apparatus for measuring sample thickness and method for measuring sample thickness |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP2006038744A (en) | 2006-02-09 |
| KR20060049934A (en) | 2006-05-19 |
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