KR20060040705A - 점도 감소성 방사선 경화 수지 조성물 - Google Patents
점도 감소성 방사선 경화 수지 조성물 Download PDFInfo
- Publication number
- KR20060040705A KR20060040705A KR1020067001420A KR20067001420A KR20060040705A KR 20060040705 A KR20060040705 A KR 20060040705A KR 1020067001420 A KR1020067001420 A KR 1020067001420A KR 20067001420 A KR20067001420 A KR 20067001420A KR 20060040705 A KR20060040705 A KR 20060040705A
- Authority
- KR
- South Korea
- Prior art keywords
- radiation curable
- viscosity
- composition
- curable composition
- radiation
- Prior art date
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/003—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor characterised by the choice of material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
- C08L51/08—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds
- C08L51/085—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds on to polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
- C09D151/08—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds
- C09D151/085—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to macromolecular compounds obtained otherwise than by reactions only involving carbon-to-carbon unsaturated bonds on to polysiloxanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0037—Production of three-dimensional images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0047—Photosensitive materials characterised by additives for obtaining a metallic or ceramic pattern, e.g. by firing
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
- B29C64/10—Processes of additive manufacturing
Abstract
Description
Claims (18)
- 하나 이상의 방사선 경화 성분 및 충전제를 포함하고 하기 특성을 갖는 점도 감소성 방사선 경화 조성물:(i) 항복 응력 값 1100Pa 미만,(ii) 점도(1초-1의 전단 속도에서) 1 내지 1500Pa·초, 및(iii) 충전제 정착 속도 0.3mm/일 미만.
- 하나 이상의 방사선 경화 성분 및 충전제를 포함하고 하기 특성을 갖는 점도 감소성 방사선 경화 조성물:(i) 항복 응력 값 1100Pa 미만,(ii) 점도(10초-1의 전단 속도에서) 1 내지 200Pa·초, 및(iii) 충전제 정착 속도 0.3mm/일 미만.
- 제 1 항 또는 제 2 항에 있어서,항복 응력 값이 500Pa 미만인 방사선 경화 조성물.
- 제 1 항 내지 제 3 항중 어느 한 항에 있어서,하나 이상의 광개시제를 포함하는 방사선 경화 조성물.
- 제 1 항 내지 제 4 항중 어느 한 항에 있어서,틱소트로피(thixotropy) 지수가 3 이상인 방사선 경화 조성물.
- 제 1 항 내지 제 5 항중 어느 한 항에 있어서,틱소트로피제를 함유하는 방사선 경화 조성물.
- 제 6 항에 있어서,틱소트로피제가 틱신(Thixcin) R, 틱사트롤(Thixatrol) 1, 틱사트롤 GST, 틱사트롤 ST, 알루미늄 스테아레이트 132 및 22, MPA 14, 켄 리액트 리카(Ken react LICA) 38 및 KR 55로 구성된 군에서 선택된 방사선 경화 조성물.
- 제 6 항에 있어서,틱소트로피제가 틱신 R, 틱사트롤 1, 틱사트롤 GST 및 틱사트롤 ST로 구성된 군에서 선택된 방사선 경화 조성물.
- 제 1 항 내지 제 8 항중 어느 한 항에 있어서,유동 보조제를 포함하는 방사선 경화 조성물.
- 제 9 항에 있어서,유동 보조제가 폴리아크릴레이트 및 폴리알킬렌옥사이드 개질된 폴리다이메틸실록산으로 구성된 군에서 선택된 방사선 경화 조성물.
- 제 9 항에 있어서,유동 보조제가 모다플로우(Modaflow) 2100을 포함하는 방사선 경화 조성물.
- 제 1 항 내지 제 11 항중 어느 한 항에 있어서,1초의 정상 전단 후 점도를 300초내에 회복하는 방사선 경화 조성물.
- 제 1 항 내지 제 12 항중 어느 한 항에 있어서,양이온성 경화 성분 및 라디칼성 경화 성분을 포함하는 방사선 경화 조성물.
- 제 9 항에 있어서,양이온성 경화 성분 30 내지 90중량%를 포함하는 방사선 경화 조성물.
- 제 1 항 내지 제 14 항중 어느 한 항에 있어서,라디칼성 중합 성분 5 내지 50중량%를 포함하는 방사선 경화 조성물.
- 이작용성 에폭시 화합물 5 내지 70중량%,2 초과의 작용성을 갖는 아크릴레이트 0.1 내지 15중량%,틱소트로피제 0.1 내지 10중량%,유동 개질제 0.01 내지 5중량%, 및충전제 및 하나 이상의 광개시제 10 내지 90중량%를 포함하는 점도 감소성 방사선 경화 조성물.
- 제 16 항에 있어서,하기 특성을 갖는 방사선 경화 조성물:(i) 항복 응력 값 1100Pa 미만,(ii) 점도(1초-1의 전단 속도에서) 0 내지 1500Pa·초, 및(iii) 충전제 정착 속도 0.3mm/일 미만.
- (a) 표면 상에 제 1 항 내지 제 16 항중 어느 한 항에 따른 점도 감소성 조성물의 층을 피복하는 단계,(b) 상기 층을 점도 감소된 층 보다 높은 점도를 갖는 점도 감소성 조성물 층이 되게 하는 단계,(c) 상기 점도 감소성 층을 화상식으로 광형성하기 위해서 방사선 수단에 의해 방사선에 화상식으로 노출시키는 단계, 및(d) 3차원 물체가 형성될 때까지 상기 단계 (a) 내지 (c)를 반복하는 단계를 포함하는 3차원 물체의 형성 방법.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US48912103P | 2003-07-23 | 2003-07-23 | |
US60/489,121 | 2003-07-23 | ||
PCT/NL2004/000517 WO2005007759A2 (en) | 2003-07-23 | 2004-07-16 | Viscosity reducible radiation curable resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20060040705A true KR20060040705A (ko) | 2006-05-10 |
KR101109977B1 KR101109977B1 (ko) | 2012-03-13 |
Family
ID=34079472
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020067001420A KR101109977B1 (ko) | 2003-07-23 | 2004-07-16 | 점도 감소성 방사선 경화 수지 조성물 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20060231982A1 (ko) |
EP (2) | EP2301742B1 (ko) |
KR (1) | KR101109977B1 (ko) |
CN (2) | CN1826216B (ko) |
AT (1) | ATE533611T1 (ko) |
HK (2) | HK1094651A1 (ko) |
WO (1) | WO2005007759A2 (ko) |
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FR2888255B1 (fr) * | 2005-07-06 | 2007-11-16 | Saint Gobain Vetrotex | Fils de renforcement et composites ayant une tenue au feu amelioree |
WO2009131636A2 (en) * | 2008-04-14 | 2009-10-29 | Rolls-Royce Corporation | Manufacture of field activated components by stereolithography |
US20120259031A1 (en) * | 2009-12-17 | 2012-10-11 | Dsm Ip Assets, B.V. | Led curable liquid resin compositions for additive fabrication |
CN102134449B (zh) * | 2010-12-27 | 2014-01-22 | 东莞市阿比亚能源科技有限公司 | 一种用于lcd板的uv胶 |
EP3266815B1 (en) | 2013-11-05 | 2021-11-03 | Covestro (Netherlands) B.V. | Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication |
KR101551255B1 (ko) * | 2013-12-30 | 2015-09-09 | 전자부품연구원 | 3d 프린팅용 저점도 세라믹 슬러리 조성물 |
KR20170091650A (ko) * | 2014-11-27 | 2017-08-09 | 조지아-퍼시픽 케미칼즈 엘엘씨 | 적층 제조 중의 재료 압출 공정에 사용하기 위한 요변성 열경화성 수지 |
CN107111225B (zh) | 2014-12-23 | 2021-07-27 | 普利司通美国轮胎运营有限责任公司 | 聚合物产品的增材制造方法 |
CN107428892B (zh) * | 2015-03-23 | 2021-05-04 | 陶氏环球技术有限责任公司 | 用于三维打印的光固化性组合物 |
CN105153935A (zh) * | 2015-09-14 | 2015-12-16 | 安徽华润涂料有限公司 | 一种微型汽车的轮毂内侧的耐磨涂料 |
EP3390006B1 (en) | 2015-12-17 | 2021-01-27 | Bridgestone Americas Tire Operations, LLC | Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing |
US11453161B2 (en) | 2016-10-27 | 2022-09-27 | Bridgestone Americas Tire Operations, Llc | Processes for producing cured polymeric products by additive manufacturing |
WO2018119067A1 (en) * | 2016-12-20 | 2018-06-28 | Basf Se | Photopolymer ceramic dispersion |
TW201840510A (zh) * | 2016-12-20 | 2018-11-16 | 德商巴地斯顏料化工廠 | 用於積層製造(additive fabrication)的光聚合物陶瓷分散液 |
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BR112020019475A2 (pt) | 2018-03-28 | 2020-12-29 | Henkel IP & Holding GmbH | Composições fotocuráveis e método para formar características topográficas na superfície de uma membrana usando composições fotocuráveis |
GB201808384D0 (en) * | 2018-05-22 | 2018-07-11 | Photocentric Ltd | Methods for making a metal, sand or ceramic object by additive manufacture and formulations for use in said methods |
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CN114099769A (zh) * | 2020-09-01 | 2022-03-01 | 苏州中瑞智创三维科技股份有限公司 | 一种采用粘弹膏体3d打印牙科全瓷修复体的材料及方法 |
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2004
- 2004-07-16 AT AT04774825T patent/ATE533611T1/de active
- 2004-07-16 WO PCT/NL2004/000517 patent/WO2005007759A2/en active Application Filing
- 2004-07-16 EP EP10184073.4A patent/EP2301742B1/en active Active
- 2004-07-16 EP EP04774825A patent/EP1646493B1/en active Active
- 2004-07-16 KR KR1020067001420A patent/KR101109977B1/ko active IP Right Grant
- 2004-07-16 CN CN2004800211492A patent/CN1826216B/zh active Active
- 2004-07-16 CN CN201010114652XA patent/CN101775197B/zh active Active
- 2004-07-16 US US10/565,000 patent/US20060231982A1/en not_active Abandoned
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2007
- 2007-02-14 HK HK07101731.5A patent/HK1094651A1/xx unknown
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2010
- 2010-12-20 HK HK10111867.5A patent/HK1145695A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
EP1646493B1 (en) | 2011-11-16 |
CN101775197A (zh) | 2010-07-14 |
EP1646493A2 (en) | 2006-04-19 |
EP2301742B1 (en) | 2014-01-15 |
HK1094651A1 (en) | 2007-04-04 |
WO2005007759A3 (en) | 2005-03-03 |
WO2005007759A2 (en) | 2005-01-27 |
ATE533611T1 (de) | 2011-12-15 |
US20060231982A1 (en) | 2006-10-19 |
HK1145695A1 (en) | 2011-04-29 |
CN101775197B (zh) | 2012-09-26 |
EP2301742A1 (en) | 2011-03-30 |
CN1826216A (zh) | 2006-08-30 |
KR101109977B1 (ko) | 2012-03-13 |
CN1826216B (zh) | 2010-04-21 |
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