KR20050079092A - 광전기화학전지 - Google Patents
광전기화학전지 Download PDFInfo
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- KR20050079092A KR20050079092A KR1020040007211A KR20040007211A KR20050079092A KR 20050079092 A KR20050079092 A KR 20050079092A KR 1020040007211 A KR1020040007211 A KR 1020040007211A KR 20040007211 A KR20040007211 A KR 20040007211A KR 20050079092 A KR20050079092 A KR 20050079092A
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- South Korea
- Prior art keywords
- metal oxide
- semiconductor
- carbon nanotubes
- electrode
- oxide semiconductor
- Prior art date
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- 239000004065 semiconductor Substances 0.000 claims abstract description 273
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 132
- 239000002041 carbon nanotube Substances 0.000 claims abstract description 129
- 229910021393 carbon nanotube Inorganic materials 0.000 claims abstract description 128
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 127
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 127
- 239000002245 particle Substances 0.000 claims abstract description 96
- 239000008151 electrolyte solution Substances 0.000 claims abstract description 70
- 230000009467 reduction Effects 0.000 claims abstract description 44
- 239000000758 substrate Substances 0.000 claims description 75
- 239000003792 electrolyte Substances 0.000 claims description 49
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 46
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical group O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 28
- 239000000395 magnesium oxide Substances 0.000 claims description 26
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 26
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 26
- 239000000203 mixture Substances 0.000 claims description 26
- 230000003197 catalytic effect Effects 0.000 claims description 23
- 239000002923 metal particle Substances 0.000 claims description 23
- 239000011787 zinc oxide Substances 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 16
- XQPRBTXUXXVTKB-UHFFFAOYSA-M caesium iodide Chemical compound [I-].[Cs+] XQPRBTXUXXVTKB-UHFFFAOYSA-M 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 14
- 239000011148 porous material Substances 0.000 claims description 14
- 239000004408 titanium dioxide Substances 0.000 claims description 12
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 claims description 11
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- ZKATWMILCYLAPD-UHFFFAOYSA-N niobium pentoxide Inorganic materials O=[Nb](=O)O[Nb](=O)=O ZKATWMILCYLAPD-UHFFFAOYSA-N 0.000 claims description 3
- URLJKFSTXLNXLG-UHFFFAOYSA-N niobium(5+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Nb+5].[Nb+5] URLJKFSTXLNXLG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 230000033116 oxidation-reduction process Effects 0.000 claims description 2
- 230000001976 improved effect Effects 0.000 abstract description 30
- 230000027756 respiratory electron transport chain Effects 0.000 abstract description 12
- 230000001747 exhibiting effect Effects 0.000 abstract description 4
- 230000002468 redox effect Effects 0.000 abstract description 2
- 239000000975 dye Substances 0.000 description 70
- 229940021013 electrolyte solution Drugs 0.000 description 60
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 45
- 239000000843 powder Substances 0.000 description 26
- 239000000243 solution Substances 0.000 description 25
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 239000002002 slurry Substances 0.000 description 19
- 238000006243 chemical reaction Methods 0.000 description 18
- QTOFIJKJBFKUGM-UHFFFAOYSA-M 1,2-dimethyl-3-octylimidazol-1-ium;iodide Chemical compound [I-].CCCCCCCCN1C=C[N+](C)=C1C QTOFIJKJBFKUGM-UHFFFAOYSA-M 0.000 description 16
- 239000004020 conductor Substances 0.000 description 16
- 239000011230 binding agent Substances 0.000 description 14
- 239000003054 catalyst Substances 0.000 description 13
- 230000031700 light absorption Effects 0.000 description 13
- -1 iodine ions Chemical class 0.000 description 12
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 10
- 239000002243 precursor Substances 0.000 description 10
- JVKYQNKBSRUGAE-UHFFFAOYSA-N 1-hexyl-2,4-dimethyl-1h-imidazol-1-ium;iodide Chemical compound [I-].CCCCCC[NH+]1C=C(C)N=C1C JVKYQNKBSRUGAE-UHFFFAOYSA-N 0.000 description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 9
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 9
- 230000001965 increasing effect Effects 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 229910052707 ruthenium Inorganic materials 0.000 description 9
- OOWFYDWAMOKVSF-UHFFFAOYSA-N 3-methoxypropanenitrile Chemical compound COCCC#N OOWFYDWAMOKVSF-UHFFFAOYSA-N 0.000 description 8
- YSHMQTRICHYLGF-UHFFFAOYSA-N 4-tert-butylpyridine Chemical compound CC(C)(C)C1=CC=NC=C1 YSHMQTRICHYLGF-UHFFFAOYSA-N 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000002612 dispersion medium Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical compound I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 229910052739 hydrogen Inorganic materials 0.000 description 7
- 239000001257 hydrogen Substances 0.000 description 7
- 238000005470 impregnation Methods 0.000 description 7
- 239000011159 matrix material Substances 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 230000001590 oxidative effect Effects 0.000 description 7
- 238000007353 oxidative pyrolysis Methods 0.000 description 7
- 238000001179 sorption measurement Methods 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000007639 printing Methods 0.000 description 6
- 229910001887 tin oxide Inorganic materials 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 5
- 230000000704 physical effect Effects 0.000 description 5
- 229910052697 platinum Inorganic materials 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- YYXZQUOJBJOARI-UHFFFAOYSA-M 1-hexyl-2,3-dimethylimidazol-3-ium;iodide Chemical compound [I-].CCCCCCN1C=C[N+](C)=C1C YYXZQUOJBJOARI-UHFFFAOYSA-M 0.000 description 4
- PEWJJOZYMNJBHZ-UHFFFAOYSA-N 2-pyridin-2-yl-3h-pyridine-4,4-dicarboxylic acid Chemical compound C1=CC(C(=O)O)(C(O)=O)CC(C=2N=CC=CC=2)=N1 PEWJJOZYMNJBHZ-UHFFFAOYSA-N 0.000 description 4
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 4
- 230000002776 aggregation Effects 0.000 description 4
- 229910002091 carbon monoxide Inorganic materials 0.000 description 4
- 239000007833 carbon precursor Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 230000008093 supporting effect Effects 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 238000005054 agglomeration Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 239000011630 iodine Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 238000010248 power generation Methods 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- 238000002834 transmittance Methods 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- 229920003171 Poly (ethylene oxide) Polymers 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- DKGAVHZHDRPRBM-UHFFFAOYSA-N Tert-Butanol Chemical compound CC(C)(C)O DKGAVHZHDRPRBM-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 239000007772 electrode material Substances 0.000 description 2
- 238000000313 electron-beam-induced deposition Methods 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 150000002431 hydrogen Chemical class 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 238000002207 thermal evaporation Methods 0.000 description 2
- SDGKUVSVPIIUCF-UHFFFAOYSA-N 2,6-dimethylpiperidine Chemical compound CC1CCCC(C)N1 SDGKUVSVPIIUCF-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- MQRWBMAEBQOWAF-UHFFFAOYSA-N acetic acid;nickel Chemical compound [Ni].CC(O)=O.CC(O)=O MQRWBMAEBQOWAF-UHFFFAOYSA-N 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- 229940011182 cobalt acetate Drugs 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- GVPFVAHMJGGAJG-UHFFFAOYSA-L cobalt dichloride Chemical compound [Cl-].[Cl-].[Co+2] GVPFVAHMJGGAJG-UHFFFAOYSA-L 0.000 description 1
- QAHREYKOYSIQPH-UHFFFAOYSA-L cobalt(II) acetate Chemical compound [Co+2].CC([O-])=O.CC([O-])=O QAHREYKOYSIQPH-UHFFFAOYSA-L 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003487 electrochemical reaction Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- VEPSWGHMGZQCIN-UHFFFAOYSA-H ferric oxalate Chemical compound [Fe+3].[Fe+3].[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O.[O-]C(=O)C([O-])=O VEPSWGHMGZQCIN-UHFFFAOYSA-H 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 229910021404 metallic carbon Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021392 nanocarbon Inorganic materials 0.000 description 1
- 239000002105 nanoparticle Substances 0.000 description 1
- 229940078494 nickel acetate Drugs 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- KBJMLQFLOWQJNF-UHFFFAOYSA-N nickel(ii) nitrate Chemical compound [Ni+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O KBJMLQFLOWQJNF-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- SOQBVABWOPYFQZ-UHFFFAOYSA-N oxygen(2-);titanium(4+) Chemical compound [O-2].[O-2].[Ti+4] SOQBVABWOPYFQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011941 photocatalyst Substances 0.000 description 1
- 238000005240 physical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- VIYGIIJYVZRXBD-UHFFFAOYSA-N rubidium tin Chemical compound [Rb].[Sn] VIYGIIJYVZRXBD-UHFFFAOYSA-N 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 229910000314 transition metal oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2027—Light-sensitive devices comprising an oxide semiconductor electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/20—Light-sensitive devices
- H01G9/2027—Light-sensitive devices comprising an oxide semiconductor electrode
- H01G9/2031—Light-sensitive devices comprising an oxide semiconductor electrode comprising titanium oxide, e.g. TiO2
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M14/00—Electrochemical current or voltage generators not provided for in groups H01M6/00 - H01M12/00; Manufacture thereof
- H01M14/005—Photoelectrochemical storage cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/90—Selection of catalytic material
- H01M4/9016—Oxides, hydroxides or oxygenated metallic salts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/86—Inert electrodes with catalytic activity, e.g. for fuel cells
- H01M4/96—Carbon-based electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/20—Carbon compounds, e.g. carbon nanotubes or fullerenes
- H10K85/221—Carbon nanotubes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/60—Organic compounds having low molecular weight
- H10K85/615—Polycyclic condensed aromatic hydrocarbons, e.g. anthracene
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/542—Dye sensitized solar cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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- Chemical & Material Sciences (AREA)
- Power Engineering (AREA)
- Nanotechnology (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Composite Materials (AREA)
- Mathematical Physics (AREA)
- Theoretical Computer Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Hybrid Cells (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
평균입자크기 | 평균기공크기 | 표면적 | 기공률 |
20 nm | 100 Å | 50 m2/g | 0.2 cm3/g |
탄소나노튜브이 유형 | 탄소나노튜브이 직경 | 탄소나노튜브의 길이 | 탄소나노튜브이 함량 |
다중겹 | 30 nm | 1.5 ㎛ | 1 중량% |
Claims (24)
- 다공성 금속산화물 반도체 입자; 및상기 입자의 기공에 담지되어 있는 탄소나노튜브를 포함하는,개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 탄소나노튜브는 상기 다공성 금속산화물 반도체 입자의 기공에 담지되어 있는 촉매금속입자를 기초로 하여 성장되어 있는 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 탄소나노튜브는 전도성의 단일겹 탄소나노튜브, 이중겹 탄소나노튜브, 다중겹 탄소나노튜브, 또는 이들의 혼합물인 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 탄소나노튜브의 직경은 10 내지 50 nm 인 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 탄소나노튜브의 함량은, 상기 개질된 금속산화물 반도체 입자의 전체 중량을 기준으로 하여, 0.1 내지 1 중량% 인 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 다공성 금속산화물 반도체 입자의 평균입자크기가 10 내지 100 nm 인 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 제 1 항에 있어서, 상기 다공성 금속산화물 반도체 입자는 이산화티탄, 이산화주석, 오산화니오븀, 또는 이들의 혼합물인 것을 특징으로 하는, 개질된 금속산화물 반도체 입자.
- 전도성 투명기판; 및 상기 전도성 투명기판의 일면에 부착되어 있는 금속산화물 반도체층을 포함하며, 상기 반도체층은 제 1 항 내지 제 7 항 중 어느 한 항에 따른 개질된 금속산화물 반도체 입자를 함유하고 있는, 광전기화학전지용 반도체전극.
- 제 8 항에 있어서, 상기 반도체전극이 상기 개질된 금속산화물 반도체 입자에 흡착되어 있는 광감응성 염료를 더 포함하는 것을 특징으로 하는 반도체전극.
- 반도체전극; 환원전극; 및 상기 반도체전극과 상기 환원전극 사이에 위치하는 산화환원 전해질층을 포함하며,상기 반도체전극이 제 1 항 내지 제 7 항 중 어느 한 항에 따른 개질된 금속산화물 반도체 입자를 함유하는, 광전기화학전지.
- 전도성 투명 기판;상기 기판 위에 부착되어 있으며, 상기 기판과의 접촉면의 반대편에 형성되어 있는 요철면을 갖는 산화아연층; 및상기 산화아연층의 요철면에 부착되어 있는 금속산화물 반도체 입자를 포함하는,광전기화학전지용 반도체전극.
- 제 11 항에 있어서, 상기 산화아연층의 요철면은, 스트라이프 형태의 물결 모양, 스트라이프 형태의 톱니 모양, 스트라이프 형태의 직각홈, 섬 형태의 요부, 또는 분화구 형태의 철부를 갖는 것을 특징으로 하는 반도체전극.
- 제 11 항에 있어서, 상기 산화아연층의 두께가 0.2 내지 2 ㎛ 인 것을 특징으로 하는 반도체전극.
- 제 11 항에 있어서, 상기 반도체전극이 상기 금속산화물 반도체 입자에 흡착되어 있는 광감응성 염료를 더 포함하는 것을 특징으로 하는 반도체전극.
- 반도체전극; 환원전극; 및 상기 반도체전극과 상기 환원전극 사이에 위치하는 산화환원 전해질층을 포함하며,상기 반도체전극이 제 11 항 내지 제 14 항 중 어느 한 항에 따른 반도체전극인, 광전기화학전지.
- 산화마그네슘이 증착되어 있는 탄소나노튜브, 또는 산화마그네슘과 세슘요오다이드가 증착되어 있는 탄소나노튜브, 또는 이들의 혼합물을 함유하는 광전기화학전지용 산화환원 전해질 용액.
- 제 16 항에 있어서, 상기 산화환원 전해질 용액이 I-/I3 - 에 기초한 레독스 시스템을 함유하는 것을 특징으로 하는 산화환원 전해질 용액.
- 제 16 항에 있어서, 상기 산화마그네슘이 증착되어 있는 탄소나노튜브, 또는 산화마그네슘과 세슘요오다이드가 증착되어 있는 탄소나노튜브의 함량이, 상기 전해질 용액 전체 중량을 기준으로 하여, 0.1 내지 1 중량% 인 것을 특징으로 하는 산화환원 전해질 용액.
- 제 16 항에 있어서, 상기 산화환원 전해질 용액이 광감응성 염료를 더 포함하는 것을 특징으로 하는 산화환원 전해질 용액.
- 반도체전극; 환원전극; 및 상기 반도체전극과 상기 환원전극 사이에 위치하는 산화환원 전해질층을 포함하며,상기 산화환원 전해질층 제 16 항 내지 제 19 항 중 어느 한 항에 따른 산화환원 전해질 용액을 함유하는, 광전기화학전지.
- 전도성 기판; 및 상기 기판의 일면에 부착되어 있는 탄소나노튜브를 포함하는, 광전기화학전지용 환원전극.
- 제 21 항에 있어서, 상기 환원전극이 상기 탄소나노튜브에 도핑되거나 코팅되어 있는 전자주게물질을 더 포함하는 것을 특징으로 하는 환원전극.
- 반도체전극; 환원전극; 및 상기 반도체전극과 상기 환원전극 사이에 위치하는 산화환원 전해질층을 포함하며,상기 환원전극이 제 21 항 내지 제 22 항에 따른 환원전극인, 광전기화학전지.
- 전도성 투명기판; 및 상기 전도성 투명기판의 일면에 부착되어 있는 금속산화물 반도체층을 포함하며, 상기 반도체층은 앞에서 설명한 본 발명의 개질된 금속산화물 반도체 입자를 함유하고 있는, 반도체전극;전도성 기판; 및 상기 기판의 일면에 부착되어 있는 탄소나노튜브를 포함하고 있는 환원전극; 및상기 반도체전극과 상기 환원전극 사이에 위치하는 산화환원 전해질층으로서, 산화마그네슘이 증착되어 있는 탄소나노튜브, 또는 산화마그네슘과 세슘요오다이드가 증착되어 있는 탄소나노튜브, 또는 이들의 혼합물을 함유하는 산화환원 전해질 용액을 포함하는 산화환원 전해질층;을 포함하는 광전기화학전지.
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KR100722085B1 (ko) * | 2005-09-12 | 2007-05-25 | 삼성전자주식회사 | 전기영동법으로 형성된 탄소나노튜브를 포함하는 태양 전지및 그 제조방법 |
KR100846156B1 (ko) * | 2006-12-07 | 2008-07-14 | 재단법인서울대학교산학협력재단 | 탄소입자를 이용한 작업전극의 제조방법 및 이를 이용한염료감응 태양전지 모듈 |
KR100877517B1 (ko) * | 2007-04-04 | 2009-01-09 | 성균관대학교산학협력단 | 염료감응형 태양전지 및 이의 제조 방법 |
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