KR20050030639A - 플루오르화 중합체, 포토레지스트 및마이크로리소그래피법 - Google Patents

플루오르화 중합체, 포토레지스트 및마이크로리소그래피법 Download PDF

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Publication number
KR20050030639A
KR20050030639A KR1020057001370A KR20057001370A KR20050030639A KR 20050030639 A KR20050030639 A KR 20050030639A KR 1020057001370 A KR1020057001370 A KR 1020057001370A KR 20057001370 A KR20057001370 A KR 20057001370A KR 20050030639 A KR20050030639 A KR 20050030639A
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KR
South Korea
Prior art keywords
group
fluorine
containing copolymer
alkyl
repeating unit
Prior art date
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KR1020057001370A
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English (en)
Korean (ko)
Inventor
앤드류 에드워드 페이링
프랭크 레너드 3세 샤트
도시유끼 오가따
고우따로 엔도
Original Assignee
이 아이 듀폰 디 네모아 앤드 캄파니
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Publication of KR20050030639A publication Critical patent/KR20050030639A/ko
Withdrawn legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F114/00Homopolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F114/18Monomers containing fluorine
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F214/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
    • C08F214/18Monomers containing fluorine
    • C08F214/186Monomers containing fluorine with non-fluorinated comonomers
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0395Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having a backbone with alicyclic moieties
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/039Macromolecular compounds which are photodegradable, e.g. positive electron resists
    • G03F7/0392Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
    • G03F7/0397Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain

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  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
KR1020057001370A 2002-07-26 2003-07-23 플루오르화 중합체, 포토레지스트 및마이크로리소그래피법 Withdrawn KR20050030639A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US39889902P 2002-07-26 2002-07-26
US60/398,899 2002-07-26

Publications (1)

Publication Number Publication Date
KR20050030639A true KR20050030639A (ko) 2005-03-30

Family

ID=31188514

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020057001370A Withdrawn KR20050030639A (ko) 2002-07-26 2003-07-23 플루오르화 중합체, 포토레지스트 및마이크로리소그래피법

Country Status (9)

Country Link
US (1) US20050203262A1 (enExample)
EP (1) EP1551887A4 (enExample)
JP (1) JP4303202B2 (enExample)
KR (1) KR20050030639A (enExample)
CN (1) CN1678646A (enExample)
AU (1) AU2003254112A1 (enExample)
CA (1) CA2493926A1 (enExample)
TW (1) TW200403262A (enExample)
WO (1) WO2004011509A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4772288B2 (ja) * 2003-06-05 2011-09-14 東京応化工業株式会社 ホトレジスト組成物用樹脂、ホトレジスト組成物、およびレジストパターン形成方法
JP4188265B2 (ja) 2003-10-23 2008-11-26 東京応化工業株式会社 レジスト組成物およびレジストパターン形成方法
US7846637B2 (en) * 2004-04-27 2010-12-07 Tokyo Ohka Kogyo Co., Ltd. Material for forming resist protective film for use in liquid immersion lithography process and method for forming resist pattern using the protective film
US7507522B2 (en) * 2004-05-20 2009-03-24 E. I. Dupont De Nemours And Company Photoresists comprising polymers derived from fluoroalcohol-substituted polycyclic monomers
US7960087B2 (en) * 2005-03-11 2011-06-14 Fujifilm Corporation Positive photosensitive composition and pattern-forming method using the same
US8530148B2 (en) 2006-12-25 2013-09-10 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
US8637229B2 (en) * 2006-12-25 2014-01-28 Fujifilm Corporation Pattern forming method, resist composition for multiple development used in the pattern forming method, developer for negative development used in the pattern forming method, and rinsing solution for negative development used in the pattern forming method
JP4554665B2 (ja) 2006-12-25 2010-09-29 富士フイルム株式会社 パターン形成方法、該パターン形成方法に用いられる多重現像用ポジ型レジスト組成物、該パターン形成方法に用いられるネガ現像用現像液及び該パターン形成方法に用いられるネガ現像用リンス液
US8034547B2 (en) 2007-04-13 2011-10-11 Fujifilm Corporation Pattern forming method, resist composition to be used in the pattern forming method, negative developing solution to be used in the pattern forming method and rinsing solution for negative development to be used in the pattern forming method
US8603733B2 (en) 2007-04-13 2013-12-10 Fujifilm Corporation Pattern forming method, and resist composition, developer and rinsing solution used in the pattern forming method
WO2008129964A1 (ja) 2007-04-13 2008-10-30 Fujifilm Corporation パターン形成方法、該パターン形成方法に用いられるレジスト組成物、現像液及びリンス液
JP4558064B2 (ja) 2007-05-15 2010-10-06 富士フイルム株式会社 パターン形成方法
US8476001B2 (en) 2007-05-15 2013-07-02 Fujifilm Corporation Pattern forming method
JP4617337B2 (ja) * 2007-06-12 2011-01-26 富士フイルム株式会社 パターン形成方法
US8617794B2 (en) 2007-06-12 2013-12-31 Fujifilm Corporation Method of forming patterns
KR101452229B1 (ko) 2007-06-12 2014-10-22 후지필름 가부시키가이샤 네가티브 톤 현상용 레지스트 조성물 및 이것을 사용한 패턴형성방법
US8632942B2 (en) 2007-06-12 2014-01-21 Fujifilm Corporation Method of forming patterns
JP4590431B2 (ja) 2007-06-12 2010-12-01 富士フイルム株式会社 パターン形成方法
KR101768929B1 (ko) * 2010-09-30 2017-08-17 디아이씨 가부시끼가이샤 함불소 중합성 수지, 그것을 사용한 활성 에너지선 경화형 조성물 및 그 경화물
CN102070755B (zh) * 2010-11-09 2013-01-09 浙江理工大学 一种三嵌段氟化聚合物及制备方法
JP6148112B2 (ja) * 2013-04-02 2017-06-14 リソテック ジャパン株式会社 光透過度測定方法
DE102014118490B4 (de) 2014-12-12 2022-03-24 tooz technologies GmbH Anzeigevorrichtungen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444148A (en) * 1964-10-05 1969-05-13 Du Pont Copolymers of selected polyfluoroper-haloketone adducts with other selected ethylenic compounds
KR100263906B1 (ko) * 1998-06-02 2000-09-01 윤종용 백본이 환상구조를 가지는 감광성 폴리머 및 이를 포함하는 레지스트 조성물
KR20020012206A (ko) * 1999-05-04 2002-02-15 메리 이. 보울러 플루오르화 중합체, 포토레지스트 및 마이크로리소그래피방법
US20030022097A1 (en) * 2000-05-05 2003-01-30 Arch Specialty Chemicals, Inc Tertiary-butyl acrylate polymers and their use in photoresist compositions
EP1278786B1 (en) * 2000-05-05 2006-01-04 E.I. Du Pont De Nemours And Company Copolymers for photoresists and processes therefor
US6764809B2 (en) * 2000-10-12 2004-07-20 North Carolina State University CO2-processes photoresists, polymers, and photoactive compounds for microlithography
US6838225B2 (en) * 2001-01-18 2005-01-04 Jsr Corporation Radiation-sensitive resin composition

Also Published As

Publication number Publication date
EP1551887A4 (en) 2008-07-02
JP2005533907A (ja) 2005-11-10
JP4303202B2 (ja) 2009-07-29
CN1678646A (zh) 2005-10-05
TW200403262A (en) 2004-03-01
CA2493926A1 (en) 2004-02-05
US20050203262A1 (en) 2005-09-15
WO2004011509A1 (en) 2004-02-05
EP1551887A1 (en) 2005-07-13
AU2003254112A1 (en) 2004-02-16

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Date Code Title Description
PA0105 International application

Patent event date: 20050125

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid