KR20040104914A - Liquid supply device and substrate process device - Google Patents

Abstract

PURPOSE: An apparatus for supplying a treatment solution and an apparatus for treating a substrate using the same are provided to prevent one solution from mixing in other solution by using a draining unit for draining the solution. CONSTITUTION: An apparatus for supplying a treatment solution comprises a plurality of solution supply units(34,36), and a supply nozzle(31) for supply the mixing solutions comprising one and more solutions from the solution supply units. The solution supply units have outlet pipes(35,37) and the supply nozzle is connected to a supply pipe(32) for leading the mixing solutions to the supply nozzle. The outlet pipes are connected to the supply pipe by a check valve(33). The apparatus further comprises a draining unit(38) for draining the solution connected to at least on of the outlet pipes of the solution supply units.

Description

LIQUID SUPPLY DEVICE AND SUBSTRATE PROCESS DEVICE}

The present invention relates to a substrate processing apparatus for performing chemical liquid processing by discharging the processing liquid onto a substrate. More specifically, the present invention relates to a technique for supplying a treatment liquid.

In the manufacturing process of a board | substrate, the substrate processing apparatus which performs chemical | medical solution process with respect to a board | substrate like a coating apparatus, a developing apparatus, etc. can be used.

For example, the coating device applies the resist liquid to the substrate by discharging the resist liquid (processing liquid) supplied from a liquid supply mechanism such as a liquid tank to the substrate. In the coating apparatus, the resist liquid adheres to the nozzle as the treatment is performed, which later causes particles in the substrate treatment. In addition, there is a problem such as deterioration of the resist liquid in the pipe in the air. Therefore, it is necessary to wash | clean the nozzle and piping inside suitably, For example, in patent document 1, the coating apparatus with a washing function is described.

In Patent Literature 1, a mechanism for supplying a cleaning liquid (pure water or alkaline water) is further provided in a liquid supply mechanism of a coating apparatus, and a technique of discharging the cleaning liquid from a nozzle through a predetermined pipe is proposed. That is, the technique which discharges a washing | cleaning liquid from a nozzle and wash | cleans in a nozzle and piping while the coating device has not performed the process with respect to a board | substrate is proposed. In the case where the coating apparatus performs normal substrate processing, the resist liquid is supplied to the nozzle after closing the flow path of the cleaning liquid and making the state that the cleaning liquid is not supplied to the nozzle. Moreover, as a method of closing a liquid flow path, it is common to use opening / closing mechanisms, such as an on-off valve and a check valve.

[Patent Document 1]

Japanese Patent Application Laid-Open No. 2000-150345

The opening and closing mechanism as described above is a mechanism for closing the liquid flow path by moving the blocking member between the open position and the closed position. Therefore, when the flow path is closed, a state in which two kinds of liquids exist (hereinafter referred to as a "liquid state") occurs through the blocking member. In such a liquid contact state, there is a problem that liquid to be blocked is mixed in the liquid supplied to the nozzle depending on the degree of the sealing effect (the effect of the function of blocking the liquid) of the blocking member. In particular, this mixing phenomenon becomes remarkable when the actual effect of the blocking member is deteriorated due to secular variation, or when the viscosity of the liquid to be blocked is low to cause capillary phenomenon.

The case where the development process of the board | substrate is developed with the developing solution is demonstrated by the example of the bad effect of mixing phenomenon. In the developing apparatus, the developing solution is discharged from the nozzle at a flow rate of several L / min. At this time, if the cleaning solution (pure water) of about 1 cc / min is mixed in the liquid contact state, the concentration change of the developing solution discharged is 0.1%, which sufficiently causes development failure.

This invention is made | formed in view of the said subject, and an object of this invention is to prevent the fall of the processing precision by mixing two or more types of liquids in the process with respect to a board | substrate.

1 is a schematic plan view of a substrate processing apparatus according to the present invention;

FIG. 2 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in the embodiment of FIG. 1; FIG.

3 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in the embodiment of FIG. 2;

4 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in the embodiment of FIG. 3;

FIG. 5 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in the embodiment of FIG. 4; FIG.

FIG. 6 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in the embodiment of FIG. 5; FIG.

7 is a schematic view showing a liquid supply apparatus of a substrate processing apparatus in a modification.

Explanation of Codes in Drawings

1: substrate processing apparatus

20: conveying mechanism (holding means)

30, 30a, 30b, 30c, 30d, 30e: liquid supply device

31: slit nozzle

32: nozzle piping

33: 3-way valve

33a, 33b: coupling portion

33c: on-off valve

34, 34a, 34b, 34c: chemical supply unit

35: chemical liquid piping

36: cleaning liquid supply unit

37: cleaning liquid piping

38: drainage mechanism

39a, 39b: check valve

40: controller

90: substrate

In order to solve the above problems, the invention of claim 1 is characterized in that the liquid supply device for supplying at least one type of processing liquid to a substrate comprises: a discharge means for discharging a plurality of types of liquids including the at least one type of processing liquid; Supply means for supplying the plurality of kinds of liquids, a supply passage for guiding the plurality of kinds of liquid to the discharge means, a plurality of passages for guiding the plurality of kinds of liquid from the supply means to the supply passage; Connecting means for communicating the supply passage with the plurality of flow passages, and drainage means for draining liquid from at least one of the plurality of flow passages.

Further, the invention of claim 2, in the liquid supply apparatus according to the invention of claim 1, has opening and closing means for opening and closing the plurality of flow paths, and the drainage means is supplied to the at least one flow path from the opening and closing means. The liquid is drained between the means.

Further, in the invention of claim 3, in the liquid supply apparatus according to the invention of claim 2, the opening and closing means is a three-way valve.

Further, in the invention of claim 4, in the liquid supply apparatus according to the invention of claim 2, the opening and closing means is a check valve.

Further, the invention of claim 5 is the liquid supply apparatus according to the invention of claim 1, wherein pure water is contained in the plurality of types of liquids, and the liquid is discharged from the flow path where the drainage means is used to guide the pure water in the plurality of flow paths. Drain the

In the liquid supply apparatus according to the invention of claim 6, the developer is contained in the at least one kind of processing liquid.

In the liquid supply apparatus according to the invention of claim 7, the resist liquid is contained in the at least one kind of processing liquid.

In the invention of claim 8, in the liquid supply apparatus according to the invention of claim 1, the drainage means is provided at a position lower than the discharge means.

In addition, the invention of claim 9 is a substrate processing apparatus which performs chemical liquid treatment with a processing liquid on a substrate, comprising: holding means for holding a substrate and supplying a processing liquid to the substrate held by the holding means; The liquid supply apparatus in any one of the Claims 8-8 is provided.

EMBODIMENT OF THE INVENTION Hereinafter, preferred embodiment of this invention is described in detail, referring an accompanying drawing.

<1st embodiment>

1 is a schematic diagram of a substrate processing apparatus 1 according to the present invention. In FIG. 1, for convenience of illustration and description, the Z-axis direction is defined as the vertical direction, and the XY plane is defined as displaying the horizontal plane, but they are defined for convenience in order to grasp the positional relationship, which will be described below. It does not limit each direction. The same applies to the following drawings.

The substrate processing apparatus 1 includes indexers 10 and 11 for carrying in and out of the substrate 90 with respect to the substrate processing apparatus 1, a conveying mechanism 20 for conveying the substrate 90, a liquid supply apparatus 30, and It consists of the control device 40. The substrate processing apparatus 1 is a process for selectively etching an electrode layer or the like formed on the surface of the substrate 90 using a rectangular glass substrate for manufacturing the screen channel of the liquid crystal display device as the substrate to be processed 90. In this configuration, the substrate 90 is subjected to an exposure process. Therefore, in this embodiment, the slit nozzle 31 is configured to discharge the developing solution as the processing liquid.

In addition, the substrate processing apparatus 1 can be used as a device for performing development by discharging the shape liquid to not only glass substrates for liquid crystal display devices but also various substrates. In addition, the liquid which performs chemical | medical solution process with respect to the board | substrate 90 is not limited to a developing solution, For example, the resist liquid etc. which require high precision for density | concentration management in chemical | medical solution processing like a developing solution may be sufficient. In that case, the substrate processing apparatus 1 functions as a coating apparatus for applying the resist liquid onto the substrate 90.

The indexer 10 receives the substrate 90 from a conveyance mechanism outside the device (not shown), maintains the predetermined time at a predetermined position, and then passes the substrate 90 to the conveyance mechanism 20. In addition, the indexer 11 dispatches the board | substrate 90 carried out from the conveyance mechanism 20 to the conveyance mechanism outside the apparatus which is not shown in figure. In addition, the indexers 10 and 11 may be equipped with a mounting table or a conveying robot for exchanging the substrate 90 with the conveying mechanism 20 in order to place a FOUP cassette or the like.

The conveyance mechanism 20 has the function of conveying from the indexer 10 toward the indexer 11 in the state which hold | maintained the board | substrate 90 at a predetermined position. Although details are mentioned later, in the substrate processing apparatus 1, the various processes with respect to the board | substrate 90 are performed in the state in which the conveyance mechanism 20 hold | maintained the board | substrate 90. FIG.

2 is a schematic view showing the configuration of a liquid supply device 30 in the first embodiment. The liquid supply device 30 includes a slit nozzle 31, a nozzle pipe 32, a three-way valve 33, a chemical liquid supply part 34, a chemical liquid pipe 35, a cleaning liquid supply part 36, a cleaning liquid pipe 37 and The developing solution is provided to the board | substrate 90 hold | maintained by the conveyance mechanism 20 by discharging the developing solution supplied from the chemical | medical solution supply part 34 from the slit nozzle 31 provided with the draining mechanism 38. As shown in FIG. Although details are mentioned later, the substrate processing apparatus 1 functions as an apparatus which performs a development process with respect to the board | substrate 90 by this.

The slit nozzle 31 is mainly composed of a linear member extending in the Y-axis direction, and a slit (not shown) for discharging liquid is provided at a position opposite to the substrate 90 held by the transport mechanism 20. It is installed. The slit nozzle 31 is provided with a nozzle pipe 32. The slit nozzle 31 discharges the developer supplied from the chemical liquid supply part 34 to the substrate 90 from the slit described above. In addition, the slit nozzle 31 can also discharge the cleaning liquid supplied from the cleaning liquid supply part 36.

As shown in FIG. 2, the nozzle pipe 32 is connected to the slit nozzle 31 at three positions along the Y-axis direction. As a result, liquid such as a developing solution is supplied to the slit nozzles 31 from three places, so that the discharge accuracy in the Y-axis direction is uniform. In addition, the number of the liquid supply points of the slit nozzle 31 is not limited to three places.

The three-way valve 33 has a function of connecting the chemical liquid pipe 35 and the cleaning liquid pipe 37 to the nozzle pipe 32. That is, the three-way valve 33 mainly corresponds to the connecting means in the present invention. Moreover, it has a function which selectively connects any one of the chemical liquid piping 35 and the washing | cleaning liquid piping 37 with respect to the nozzle piping 32, and closes the other, and also corresponds to an opening-closing means in this invention.

Moreover, the three-way valve 33 is connected to the control apparatus 40, and the opening-closing operation (euro selection operation) is determined according to the control signal from the control apparatus 40. As shown in FIG. For example, when a developing solution is selected by the controller 40 as the liquid to be supplied to the slit nozzle 31, the chemical liquid pipe 35 is connected to the nozzle pipe 32. As a result, the cleaning liquid pipe 37 is closed.

The chemical liquid supply unit 34 includes a chemical liquid tank 340, a liquid feeding pump 341, and an opening / closing valve 342. The chemical liquid tank 340 has a function of a storage tank for storing a developer, and is connected to the chemical liquid pipe 35 through a liquid feed pump 341 and an opening / closing valve 342. The chemical liquid supply part 34 sends the developing solution stored in the chemical liquid tank 340 toward the three-way valve 33 by making the opening / closing valve 342 open and driving the liquid feeding pump 341. At this time, if the three-way valve 33 is in a state of communicating the nozzle pipe 32 and the chemical liquid pipe 35, the developer is supplied to the slit nozzle 31. That is, the chemical solution supply unit 34 has a function of supplying the developer to the slit nozzle 31.

The opening / closing valve 360 opens, and the washing | cleaning liquid supply part 36 sends a washing | cleaning liquid toward the three way valve 33 by a predetermined | prescribed pressure from the washing | cleaning liquid tank outside the apparatus which is not shown in figure. At this time, if the three-way valve 33 is in a state of communicating the nozzle pipe 32 and the cleaning liquid pipe 37, the cleaning liquid is supplied to the slit nozzle 31. In other words, the cleaning liquid supply part 36 has a function of supplying the cleaning liquid to the slit nozzle 31. In addition, since the substrate processing apparatus 1 in this embodiment uses pure water as a washing | cleaning liquid, the structure which supplies a washing | cleaning liquid from the washing | cleaning liquid tank outside an apparatus is employ | adopted, but the mechanism which supplies a washing | cleaning liquid is not limited to this. For example, the liquid feeding pump and the cleaning liquid tank may be provided in the cleaning liquid supply part 36, and the cleaning liquid may be supplied to the slit nozzle 31 by the driving force of the liquid feeding pump. In addition, the washing | cleaning liquid is not limited to pure water, More liquid liquids, such as alkaline water, may be selected.

The substrate processing apparatus 1 according to the present embodiment includes the chemical liquid supply unit 34 and the cleaning liquid supply unit 36, so that a plurality of types of liquids (developer and cleaning liquid in the present embodiment) are slit nozzles 31. ) Can be supplied. That is, the chemical liquid supply part 34 and the cleaning liquid supply part 36 correspond mainly to the supply means in this invention.

As shown in FIG. 2, the draining mechanism 38 includes an on-off valve 380 disposed at a position lower than the height position of the slit nozzle 31, and the on-off valve in accordance with a control signal from the control device 40. By opening 380, the liquid (mainly the cleaning liquid) in the cleaning liquid piping 37 is drained.

In the substrate processing apparatus 1, the nozzle pipe 32, the chemical liquid pipe 35, and the cleaning liquid pipe 37 form a flow path for guiding a liquid to the slit nozzle 31. The nozzle pipe 32 has a function of guiding the liquid supplied to the slit nozzle 31 and corresponds to the supply passage in the present invention. In addition, the chemical liquid piping 35 and the cleaning liquid piping 37 correspond to the some flow path in this invention. In these flow paths, a valve for adjusting the flow rate, a filter for removing particles, a manual valve, or the like may be provided as appropriate.

The control device 40 is a device having a function of a general computer, and is mainly composed of a CPU that performs arithmetic processing and a storage unit that stores data (none of which is shown). The controller 40 is connected to each component of the substrate processing apparatus 1 in a state capable of transmitting and receiving signals, and has a function of controlling each component based on the control signal generated by the CPU described above. In particular, the controller 40 selects a liquid (developing liquid or washing liquid) supplied by the liquid supply device 30 to the slit nozzle 31, and controls the three-way valve 33 to open a flow path other than the selected liquid. To close. By such control, the substrate processing apparatus 1 can discharge the liquid (selected liquid) corresponding to the process from the slit nozzle 31.

The above is description of the structure of the substrate processing apparatus 1 in this embodiment. Next, the operation of the substrate processing apparatus 1 will be described. The processing in the substrate processing apparatus 1 is roughly divided into a developing process and a cleaning process. In addition, the operation | movement of the following substrate processing apparatus 1 is implement | achieved by controlling each structure according to the control signal from the control apparatus 40, unless it is especially neat.

First, the operation of the cleaning process will be described. In the substrate processing apparatus 1, the developing solution remains in the slit nozzle 31 and the nozzle pipe 32 as the developing treatment is performed as described above. Since the remaining developer is deteriorated due to changes over time or the like, it causes particles of contaminants or influences the concentration of the developer in subsequent processing. Therefore, the substrate processing apparatus 1 mainly performs a cleaning process for removing the developer remaining in the slit nozzle 31 and the nozzle pipe 32 before the development processing.

First, in the substrate processing apparatus 1, before starting a washing process, the chemical | medical solution supply part 34 makes the liquid feed pump 341 stop, and makes the on-off valve 342 close. As a result, the supply of the developing solution to the slit nozzle 31 is stopped. Incidentally, the supply stop processing of the developing solution is actually executed at the end of the developing processing described later. Further, the drainage mechanism 38 causes the open / close valve 380 to be closed.

Next, since the liquid to be supplied to the slit nozzle 31 in the cleaning process is the cleaning liquid, the control device 40 communicates the nozzle pipe 32 and the cleaning liquid pipe 37 with respect to the three-way valve 33. Control to connect. According to this control, the three-way valve 33 selectively communicates with the nozzle pipe 32 and the cleaning liquid pipe 37, and the chemical liquid pipe 35 is closed.

Next, the washing | cleaning liquid supply part 36 supplies the washing | cleaning liquid to the slit nozzle 31 by making the opening-closing valve 360 open. When the cleaning liquid is supplied to the slit nozzle 31, the cleaning liquid is discharged from the slit nozzle 31. At this time, in order for the cleaning liquid to pass through the slit nozzle 31 and the nozzle pipe 32, the developer or the like remaining in these flows, and the slit nozzle 31 and the nozzle pipe 32 are cleaned.

When the control device 40 determines that the predetermined time has elapsed and the slit nozzle 31 and the nozzle pipe 32 have been sufficiently cleaned, the control device 40 opens / closes the valve 360 of the cleaning liquid supply part 36. The control signal is output to the cleaning liquid supply part 36 so as to close. In response to this control signal, the cleaning liquid supply part 36 keeps the opening / closing valve 360 closed so that supply of the cleaning liquid to the slit nozzle 31 is stopped and discharge of the cleaning liquid from the slit nozzle 31 is prevented. Stop.

Next, the drainage mechanism 38 sets the open / close valve 380 in an open state in accordance with a control signal from the control device 40. The on-off valve 380 is provided at a position lower than that of the slit nozzle 31. Therefore, when the on-off valve 380 is opened, the cleaning liquid in the slit nozzle 31, the nozzle pipe 32, the three-way valve 33 and the cleaning liquid pipe 37 is mainly caused by the action of gravity. Outflow in the direction indicated by the arrow. That is, the cleaning liquid is drained out of the apparatus by the drainage mechanism 38 without requiring a separate suction mechanism or the like. This prevents the cleaning liquid from remaining in the cleaning liquid piping 37, and the cleaning liquid piping 37 is almost empty.

When pure water is used as the cleaning liquid, as in the substrate processing apparatus 1 of the present embodiment, when pure water stays for a long time, there is a problem that bacteria are generated in the pure water, which causes particles. However, in the substrate processing apparatus 1, even when the apparatus is stopped for a relatively long time, since the drainage mechanism 38 prevents the retention of pure water, generation of bacteria can be prevented.

When the drainage by the drainage mechanism 38 is complete | finished, the washing | cleaning process in the substrate processing apparatus 1 is complete | finished and the substrate processing apparatus 1 will be in a standby state.

Next, operation | movement of the development process in the substrate processing apparatus 1 is demonstrated. The development treatment is one step of the treatment by the liquid to be performed on the substrate 90 in the manufacturing process of the substrate 90. Specifically, it is a process for developing the exposed photosensitive material (resist) on the substrate 90.

The development process is started by carrying in the substrate 90 subjected to the exposure process by the transport apparatus outside the apparatus to the substrate processing apparatus 1 in the standby state. The conveying apparatus outside the apparatus carries in the substrate 90 to the indexer 10.

The indexer 10 transfers the loaded substrate 90 to the transfer mechanism 20 after the timing adjustment is performed while keeping the loaded substrate 90 at a predetermined position. At this time, the indexer 10 may adjust the direction of the substrate 90 by rotating the substrate 90.

The conveyance mechanism 20 conveys in the (+ X) direction, maintaining the received board | substrate 90 in a substantially horizontal direction. When the sensor 40 detects that the substrate 90 has been conveyed to a predetermined position by a sensor (not shown), the control unit 40 supplies the nozzle spool 32 because the liquid to be supplied to the slit nozzle 31 in the developing process is a developing solution. ) And the three-way valve 33 to communicate with the chemical liquid pipe (35). As a result, the three-way valve 33 selectively connects the nozzle pipe 32 and the chemical liquid pipe 35 to close the cleaning liquid pipe 37.

Next, the chemical liquid supply part 34 opens the opening / closing valve 342, and drives the liquid feed pump 341, so that the developer is supplied to the slit nozzle 31, and the slit nozzle 31 with respect to the substrate 90. Discharge of the developer from the start is started.

At this time, the drainage mechanism 38 in the cleaning liquid pipe 37 is in a state in which almost no liquid is present (empty). Therefore, in the substrate processing apparatus 1 in this embodiment, the developing solution and the washing | cleaning liquid do not become a liquid contact state in the 3-way valve 33 during image development processing. Therefore, mixing of the cleaning solution with the developing solution discharged to the substrate 90 is prevented. As a result, since the dilution of the developing solution and the like can be prevented, the accuracy of the density management of the developing solution can be improved and the development failure can be prevented.

The board | substrate 90 receives discharge of the developing solution from the slit nozzle 31, conveying by the conveyance mechanism 20 to (+ X) direction. That is, the board | substrate 90 is scanned by the slit nozzle 31 along the X-axis direction, and the image development material of the exposed photosensitive material on the board | substrate 90 advances.

When the scanning of the board | substrate 90 by the slit nozzle 31 is complete | finished, the chemical | medical solution supply part 34 keeps the opening-closing valve 342 closed, and stops the liquid feed pump 341. FIG. As a result, the supply of the developing solution from the chemical solution supply unit 34 is stopped, and the discharge of the developing solution from the slit nozzle 31 is stopped.

Next, the control device 40 controls the three-way valve 33 so that the nozzle pipe 32 and the cleaning liquid pipe 37 communicate with each other. As a result, the three-way valve 33 selectively connects the nozzle pipe 32 and the cleaning liquid pipe 37, and the chemical liquid pipe 35 is in a closed state. Further, the drain mechanism 38 opens the open / close valve 380 to drain the developing solution in the slit nozzle 31 and the nozzle pipe 32 through the cleaning liquid pipe 37.

This completes the development process. Thereafter, the above-described cleaning process is performed again, and cleaning in the slit nozzle 31 and the nozzle pipe 32 is performed. In addition, the cleaning process does not need to be performed every time the development treatment is performed, and for example, the cleaning treatment may be performed after the predetermined number of development treatments are repeated.

As described above, the substrate processing apparatus 1 according to the present embodiment has a flow path in which the drainage mechanism 38 is in contact with the flow path of the processing liquid before the processing liquid is supplied to the substrate 90 (cleaning liquid piping). By draining the liquid in (37) in advance, it is possible to prevent other liquids from coming into contact with the processing liquid. Therefore, even when the shutoff function is lowered due to the change of the three-way valve 33 over time, or when the viscosity of the liquid used as the cleaning liquid is low, the treatment liquid supplied to the slit nozzle 31 is supplied to the slit nozzle 31 as in the conventional apparatus. Incorporation of other liquids can be prevented.

In addition, by the drainage mechanism 38 draining the cleaning liquid remaining in the cleaning liquid piping 37, it is possible to prevent the retention of the cleaning liquid in the cleaning liquid piping 37. Therefore, in particular, pure water can be used as the cleaning liquid, and even when the substrate processing apparatus 1 is stopped for a relatively long time, it is possible to prevent the occurrence of bacteria that cause particles. This also improves the processing accuracy of the substrate processing apparatus 1.

In addition, in order to prevent the developing solution and the cleaning solution from contacting with each other, in the state where the developing solution is supplied to the slit nozzle 31, the liquid level of the cleaning solution may not be in contact with the three-way valve 33. Therefore, it is not necessary for the drainage mechanism 38 to drain all the cleaning liquid in the cleaning liquid piping 37. However, in order to prevent the retention of the cleaning liquid, such as when the cleaning liquid is pure water, it is preferable that the cleaning liquid in the cleaning liquid piping 37 is drained like the substrate processing apparatus 1 of the present embodiment.

<2. Second Embodiment>

In the first embodiment, the nozzle pipe 32, the chemical liquid pipe 35, and the cleaning liquid pipe 37 are configured to communicate with each other by the three-way valve 33, but the three-way valve is used as a configuration for communicating these pipes. It is not limited to (33). That is, the member which does not have the function which opens and closes a flow path may be sufficient.

3 is a schematic view showing the liquid supply device 30a of the substrate processing apparatus 1 according to the second embodiment constructed on the basis of this principle. The liquid supply apparatus 30a has the structure which replaced the three-way valve 33 of the liquid supply apparatus 30 in 1st Embodiment with the engaging part 33a. In addition, since the liquid supply apparatus 30a has the same structure as the liquid supply apparatus 30 except for the coupling part 33a, illustration and description are abbreviate | omitted suitably.

The operation | movement in the washing process and image development process of the substrate processing apparatus 1 in 2nd Embodiment which has the above structures is demonstrated.

First, the washing process will be described. In the substrate processing apparatus 1 according to the present embodiment, the driving of the liquid feed pump 341 is stopped by the chemical liquid supply unit 34 before the cleaning process is started, and the opening / closing valve 342 is brought into a closed state. In addition, the drainage mechanism 38 makes the on-off valve 380 closed.

Next, in accordance with the control signal from the control device 40, the cleaning liquid supply part 36 makes the on-off valve 360 open. As a result, the cleaning liquid is supplied from the cleaning liquid tank outside the apparatus to the cleaning liquid piping 37, passes through the coupling part 33a and the nozzle piping 32, and is supplied to the slit nozzle 31. As a result, the cleaning liquid is discharged from the slit nozzle 31.

When the predetermined time has elapsed and cleaning of the slit nozzle 31 and the nozzle pipe 32 ends, the cleaning liquid supply part 36 keeps the opening / closing valve 360 closed. The drainage mechanism 38 opens the on / off valve 380 to drain the cleaning liquid remaining in the slit nozzle 31, the nozzle pipe 32, the coupling portion 33a, and the cleaning liquid piping 37. At this time, since the engaging portion 33a has a simpler internal structure or the like as compared with the three-way valve 33, liquid dropping is good and the remaining of the developer is effectively prevented.

When the drainage of the washing | cleaning liquid by the drainage mechanism 38 is complete | finished, the drainage mechanism 38 makes the on-off valve 380 closed. Thereby, the washing | cleaning process of the substrate processing apparatus 1 in this embodiment is complete | finished, and the substrate processing apparatus 1 will be in a standby state. That is, even in the substrate processing apparatus 1 according to the present embodiment, the retention of pure water in the cleaning liquid piping 37 in the air is prevented.

Next, development processing will be described. When the board | substrate 90 is conveyed to the predetermined position by the conveyance mechanism 20, a developing solution is selected as the liquid used by the control apparatus 40, and a control signal is output to the chemical | medical solution supply part 34. As shown in FIG. In response to this control signal, the chemical liquid supply unit 34 starts to drive the liquid feeding pump 341, and at the same time, opens / closes the valve 342.

Thereby, the developing solution is supplied to the chemical liquid piping 35, and the developing solution supplied from the chemical liquid piping 35 to the coupling part 33a also flows into the cleaning liquid piping 37. As shown in FIG. However, since the opening / closing valve 360 of the cleaning liquid supply part 36 and the opening / closing valve 380 of the drainage mechanism 38 are in a closed state, the inflow of the developing solution into the cleaning liquid piping 37 is stopped at a fixed amount. The developer supplied from the chemical liquid pipe 35 is supplied to the slit nozzle 31 through the coupling part 33a and the nozzle pipe 32. Thereby, discharge of the developing solution from the slit nozzle 31 is started.

At this time, since the developing solution in the cleaning liquid pipe 37 is in contact with the cleaning liquid in the opening / closing valve 360, the cleaning liquid is mixed into the cleaning liquid pipe 37. However, although the cleaning solution piping 37 is spatially connected to the developing solution flow path, since it does not directly become the developing solution flow path, the liquid in the cleaning solution piping 37 hardly flows. Therefore, in the opening / closing valve 360 located relatively far from the coupling portion 33a (the substantial flow path of the developing solution), the developing solution and the cleaning solution are brought into contact with each other, and the developer in the cleaning solution pipe 37 is partially diluted. There is little effect on development.

When the scanning of the board | substrate 90 by the slit nozzle 31 is complete | finished, the chemical | medical solution supply part 34 makes the opening-closing valve 342 close, and stops the liquid feed pump 341. FIG. As a result, the supply of the developing solution from the chemical solution supply unit 34 is stopped, and the discharge of the developing solution from the slit nozzle 31 is stopped.

Next, the drain mechanism 38 opens / closes the on / off valve 380 to drain the developer in the slit nozzle 31, the nozzle pipe 32, the coupling portion 33a, and the cleaning liquid pipe 37. The process ends.

As described above, in the substrate processing apparatus 1 according to the second embodiment, the position at which a liquid contact state between the processing liquid used for the chemical liquid processing with respect to the substrate 90 and another liquid occurs is sufficiently separated from the flow path of the processing liquid. By providing a drainage mechanism 38 for properly discharging the diluted treatment liquid according to the liquid contact state, the mixing of the liquid into the processing liquid discharged from the slit nozzle 31 can be prevented. Can be. Therefore, since the substrate processing apparatus 1 in this embodiment can improve the precision of the density control of the process liquid supplied to the board | substrate 90, the process precision of the chemical liquid process with respect to the board | substrate 90 is improved. You can.

3. Third Embodiment

As means for opening and closing the flow path of the liquid, it may be configured to realize by using a general check valve for passing the liquid only in one direction.

4 is a schematic view showing the liquid supply device 30b of the substrate processing apparatus 1 according to the third embodiment constructed on the basis of this principle. The liquid supply device 30b is a mechanism for opening and closing the chemical liquid pipe 35 and the cleaning liquid pipe 37, and differs from the above embodiment in that the check valves 39a and 39b are provided.

The check valve 39a lets the developer flow from the chemical liquid pipe 35 toward the nozzle pipe 32 when the liquid feed pump 341 of the chemical liquid supply part 34 is driven. In addition, the check valve 39a has a function of preventing the back flow of the liquid (developing liquid and cleaning liquid) from the nozzle pipe 32 to the chemical liquid pipe 35.

The check valve 39b passes the cleaning liquid from the cleaning liquid pipe 37 toward the nozzle pipe 32 when the on / off valve 360 of the cleaning liquid supply part 36 is opened. In addition, the check valve 39b prevents the back flow of the liquid (developing liquid and cleaning liquid) from the nozzle pipe 32 to the cleaning liquid pipe 37.

That is, the controller 40 controls the opening and closing of the check valves 39a and 39b by controlling the increase and decrease of the pressure of the liquid on the chemical liquid pipe 35 and the cleaning liquid pipe 37 side of the check valves 39a and 39b. Can be controlled.

The operation | movement in the washing process and image development process of the substrate processing apparatus 1 in 3rd Embodiment which has such a structure is demonstrated.

First, before starting the cleaning process, the chemical liquid supply unit 34 calls the driving of the liquid feed pump 341 a stop state, and the open / close valve 342 is called a closed state. In addition, the drain mechanism 38 calls the on-off valve 380 the closed state.

Next, in accordance with the control signal from the control device 40, the cleaning liquid supply part 36 makes the on-off valve 360 open. As a result, the cleaning liquid is supplied from the cleaning liquid tank outside the apparatus to the cleaning liquid piping 37, and the pressure of the cleaning liquid in the cleaning liquid piping 37 increases. Thus, the check valve 39b is opened, and the cleaning liquid is the check valve. It passes through 39b and the nozzle piping 32, is supplied to the slit nozzle 31, and the cleaning liquid is discharged from the slit nozzle 31. FIG.

When the predetermined time has elapsed and cleaning of the slit nozzle 31 and the nozzle pipe 32 ends, the cleaning liquid supply part 36 keeps the opening / closing valve 360 closed. In addition, the drainage mechanism 38 opens the open / close valve 380 to drain the cleaning liquid remaining in the cleaning liquid pipe 37. Moreover, when the drainage mechanism 38 drains the washing | cleaning liquid in the washing | cleaning liquid piping 37, the pressure in the washing | cleaning liquid piping 37 falls, but the liquid in the nozzle piping 32 is discharged by the check valve 39b. There is no backflow within 37).

By the above, the washing | cleaning process of the substrate processing apparatus 1 in this embodiment is complete | finished, and the substrate processing apparatus 1 will be in a standby state.

Next, development processing will be described. When the board | substrate 90 is conveyed to the predetermined position by the conveyance mechanism 20, a developing solution is selected as the liquid used by the control apparatus 40, and a control signal is output to the chemical | medical solution supply part 34. As shown in FIG. In response to this control signal, the chemical liquid supply unit 34 starts to drive the liquid feeding pump 341, and at the same time, opens / closes the valve 342.

Thereby, the developing solution is supplied to the chemical liquid piping 35, and the pressure of the developing solution in the chemical liquid piping 35 increases, so that the check valve 39a is in an open state. Therefore, the developing solution is supplied to the slit nozzle 31 through the check valve 39a and the nozzle pipe 32, and discharge of the developing solution from the slit nozzle 31 is started.

At this time, since the cleaning liquid in the cleaning liquid pipe 37 is drained in advance by the drainage mechanism 38, the developing solution does not come into contact with the cleaning liquid in the check valve 39b.

As described above, in the substrate processing apparatus 1 according to the third embodiment, the liquid supply apparatus 30b using the check valves 39a and 39b as a mechanism for opening and closing the flow path of the liquid is applied to the first embodiment. The same effect as the substrate processing apparatus 1 in this can be acquired.

In addition, by using the check valves 39a and 39b, the controller 40 can control the chemical liquid supply unit 34 and the cleaning liquid supply unit 36 without causing them to directly control them, thereby achieving desired operation. Can be. Therefore, the control by the control apparatus 40 can be simplified.

In order to prevent the developer and the cleaning solution from remaining in the slit nozzle 31 and the nozzle pipe 32, the height position in the Z-axis direction of the slit nozzle 31 is set in the Z-axis direction of the check valves 39a and 39b. It is preferable to arrange | position so that it may become lower than a height position.

<4th embodiment>

In the liquid supply device 30a according to the second embodiment, the chemical liquid pipe 35 is connected to the coupling portion 33a in a substantially horizontal state. When the nozzle pipe 32 and the chemical liquid pipe 35 are connected by this arrangement, even if the liquid is drained by the drainage mechanism 38, the remaining of the developer in the chemical liquid pipe 35 is anxious.

Like the three-way valve 33 in the first embodiment, when the flow path opening and closing mechanism is assembled in the flow path connecting mechanism, the chemical liquid pipe 35 can be closed during the cleaning process. Thus, the chemical liquid pipe 35 Residue of the developer in () is rarely a problem. This is not a process performed with respect to the substrate 90, but the cleaning process is not required, and the cleaning liquid discharged from the slit nozzle 31 during the cleaning process is in contact with the developer in the three-way valve 33. Although the developing solution mixes by being in a state, if it is mixed in this degree, the cleaning power of a cleaning solution will not fall remarkably.

However, the engaging portion 33a in the second embodiment cannot close the chemical liquid pipe 35 during the cleaning process. Therefore, when the developing solution remains in the chemical liquid pipe 35, the substrate processing apparatus 1 in the second embodiment is compared with the cleaning liquid in the cleaning process in comparison with the substrate processing apparatus 1 in the first embodiment. A lot of developer mixes. That is, when this reduces the cleaning effect by the cleaning liquid, it is preferable to reduce the developer remaining in the chemical liquid pipe 35 as much as possible before starting the cleaning treatment.

FIG. 5 is a schematic view showing the liquid supply device 30c of the substrate processing apparatus 1 according to the fourth embodiment constructed on the basis of this principle. In the liquid supply device 30c, the chemical liquid pipe 35 is inclined and connected to the coupling portion 33a as shown in FIG. That is, the chemical liquid pipe 35 is connected while being inclined downward toward the engaging portion 33a.

As a result, when the drainage mechanism 38 opens the on / off valve 380 to drain the liquid in the cleaning liquid pipe 37, the liquid in the chemical liquid pipe 35 is also smoothly drained and remains in the chemical liquid pipe 35. The amount of liquid to be reduced. In addition, since the structure and operation | movement of the other liquid supply apparatus 30c are the same as that of the liquid supply apparatus 30a in 2nd Embodiment, it abbreviate | omits description.

As mentioned above, even if it uses the same structure as the substrate processing apparatus 1 in 4th Embodiment, the effect similar to 2nd Embodiment can be acquired.

In addition, in the liquid supply device 30c, the chemical liquid pipe 35 is inclined downward toward the coupling portion 33a, and is connected to the coupling portion 33a, so that the chemical liquid pipe 35 is separated from the chemical liquid pipe 35. The liquid drainage improves. Therefore, since the amount of the liquid remaining in the chemical liquid pipe 35 decreases, for example, the amount of the developer mixed into the cleaning liquid in the cleaning treatment can be reduced.

5. Fifth Embodiment

In the substrate processing apparatus 1 according to the above embodiment, the case where one type of liquid (developing liquid) is used as the processing liquid for processing the substrate 90 has been described. However, the processing liquid is not limited to one type. In addition, two or more types may be sufficient.

6 is a schematic view showing a liquid supply device 30d of the substrate processing apparatus 1 according to the fifth embodiment constructed on the basis of this principle.

As shown in FIG. 6, the liquid supply apparatus 30d is provided with three chemical | medical solution supply parts 34a, 34b, 34c, and each is connected to the coupling part 33b. Each chemical liquid supply part 34a, 34b, 34c has the same structure as the chemical liquid supply part 34 in the said embodiment, respectively, and each chemical liquid tank 340 stores different process liquids.

The coupling portion 33b is a member having the same function and configuration as the coupling portion 33a, except that the plurality of chemical liquid pipes 35 can communicate with each other. In addition, in this embodiment, although each chemical liquid piping 35 is provided in the coupling part 33b along a Z-axis direction, as shown in FIG. 6, it is provided in the position which surrounds the circumference | surroundings of the coupling part 33b, for example. You may be.

The controller 40 selects the processing liquid discharged from the slit nozzle 31 in accordance with the processing executed by the substrate processing apparatus 1, and stores the selected processing liquid among the chemical liquid supply units 34a, 34b, 34c. What is present is specified and supplied to the slit nozzle 31. Moreover, when switching the process liquid to be used, the liquid in the slit nozzle 31, the nozzle pipe 32, and the coupling part 33b is drained by the drainage mechanism 38, and the washing | cleaning liquid supply part 36 furthermore You may supply a washing | cleaning liquid and perform a washing process.

As mentioned above, also in the substrate processing apparatus 1 in 5th Embodiment, the effect similar to the said embodiment can be acquired.

In addition, since the liquid supply apparatus 30d includes a plurality of chemical liquid supply portions 34a, 34b, 34c, it is possible to increase the variation in the processing performed by the substrate processing apparatus 1.

<6. Modifications>

As mentioned above, although embodiment of this invention was described, this invention is not limited to the said embodiment, A various deformation | transformation is possible.

For example, the substrate processing apparatus 1 does not always need to perform the development process with respect to the board | substrate 90 carried in. That is, in the case where the substrate processing apparatus 1 is assembled in a line for performing the multiple exposure process or the like, the substrate 90 may be passed over the substrate processing apparatus 1 while the plurality of exposure processings are repeated. In the substrate processing apparatus 1 according to the above embodiment, since the developer attached to the slit nozzle 31 is removed by the cleaning process, the substrate 90 passing through the substrate processing apparatus 1 without performing the developing process in this way is carried out. ), The developer does not fall from the slit nozzle 31, and poor processing is prevented.

In addition, in the said embodiment, although the drainage mechanism 38 drained only in the washing | cleaning liquid piping 37, you may comprise so that drainage may be performed also by providing the mechanism similar to the drainage mechanism 38 also about the chemical liquid piping 35. FIG.

In addition, in the said embodiment, although the drainage mechanism 38 drained without providing a suction mechanism, you may comprise so that the drainage may be carried out while providing the suction mechanism and sucking the liquid in the washing | cleaning liquid piping 37 separately.

In addition, the mechanism which opens and closes a flow path, the position which installs the said mechanism, etc. are not limited to what was shown by the said embodiment. For example, the check valves 39a and 39b of the liquid supply device 30b according to the third embodiment may be replaced with an on / off valve, and the on / off valve may be controlled by the controller 40.

In addition, in the liquid supply apparatuses 30a, 30c, and 30d in the second, fourth, and fifth embodiments, the liquid contact state between the developer and the cleaning liquid does not occur at a position close to the flow path of the developer. However, it is good also as a structure which provides an opening-closing valve in the coupling part 33a (33b) side of the washing | cleaning liquid piping 37. Fig. 7 is a diagram showing a liquid supply device 30e in a modification constructed on the basis of this principle. The liquid supply apparatus 30e has the structure which added the on-off valve 33c to the liquid supply apparatus 30a in 2nd Embodiment. The drainage mechanism 38 in this modified example drains the liquid in the washing liquid piping 37 in the state where the on-off valve 33c is closed. Thereby, even when the chemical liquid piping 35 and the cleaning liquid piping 37 are connected and connected using the coupling part 33a, 33b of a simple structure, the contact state of a developing solution and a cleaning liquid can be prevented. The same applies to the liquid supply device 30c in the fourth embodiment shown in FIG. 5 and the liquid supply device 30d in the fifth embodiment shown in FIG. 6.

In the inventions of claims 1 to 8, by providing a drainage means for draining the liquid from at least one of the plurality of flow paths, it is possible to suppress the incorporation of another liquid into the liquid discharged from the discharge means.

In the invention according to claim 2, since the liquid draining means discharges the liquid from at least one flow path to the supply means for at least one flow path, the liquid contact state between the processing liquid and the other liquid can be prevented. It is possible to prevent the mixing of other liquids in the processing liquid discharged from the discharge means.

In the invention according to claim 4, the control can be simplified by the opening and closing means being a check valve.

In the invention as set forth in claim 5, by discharging the liquid from the flow path used for guiding the pure water in the plurality of flow paths, it is possible to prevent the generation of bacteria that cause particles by preventing the retention of the pure water. .

In the invention according to claim 6, by including the developer in at least one kind of the treatment solution, the accuracy of the density management of the developer to be supplied can be improved, and the development treatment precision can be improved.

In the invention according to claim 7, the resist liquid is contained in at least one kind of the processing liquid, so that the accuracy of the concentration management of the supplied resist liquid can be improved, and the coating processing accuracy can be improved.

In the invention according to claim 8, the drainage means is provided at a position lower than the discharge means, so that the liquid can be drained without providing a suction mechanism or the like.

In the invention according to claim 9, by providing the liquid supply device according to any one of claims 1 to 8, the precision of the concentration management of the processing liquid supplied to the substrate is improved, thereby improving the chemical liquid processing accuracy. can do.

Claims (9)

A liquid supply device for supplying at least one kind of processing liquid to a substrate, Discharge means for discharging a plurality of types of liquids including the at least one type of processing liquid; Supply means for supplying the plurality of liquids; A supply passage for guiding the plurality of liquids to the discharge means; A plurality of flow paths for guiding the plurality of kinds of liquids from the supply means to the supply flow path; Connecting means for communicating the supply passage with the plurality of passages; And a draining means for draining the liquid from at least one of the plurality of flow paths. The method of claim 1, It is provided with opening and closing means for opening and closing the plurality of flow paths, And said drainage means drains liquid from said opening and closing means to said supply means for said at least one flow path. The method of claim 2, The liquid supply device, characterized in that the opening and closing means is a three-way valve. The method of claim 2, And the opening and closing means is a check valve. The method of claim 1, Pure water is contained in the plural kinds of liquids, And the liquid draining means drains the liquid from the flow channel used to guide the pure water in the plurality of flow paths. The method of claim 1, And a developing solution is contained in said at least one type of processing liquid. The method of claim 1, And a resist liquid is contained in said at least one type of processing liquid. The method of claim 1, And the drainage means is provided at a position lower than the discharge means. In the substrate processing apparatus which performs chemical liquid processing with a processing liquid with respect to a board | substrate, Holding means for holding a substrate, A substrate processing apparatus comprising the liquid supply device according to any one of claims 1 to 8 for supplying a processing liquid to the substrate held by the holding means.