JP6774327B2 - Storage medium containing cleaning chemical supply device, cleaning unit, and program - Google Patents

Description

The present invention relates to a cleaning chemical supply device, a cleaning unit, and a storage medium containing a program.

The CMP (Chemical Mechanical Polishing) device is a polishing unit for polishing the surface of a semiconductor substrate on which a semiconductor chip is formed, and a cleaning unit for cleaning the semiconductor substrate polished by the polishing unit while supplying a chemical solution. And have. This cleaning unit prepares a chemical solution having an adjusted concentration by mixing diluted water such as DIW (De-Ionized Water) with the chemical solution, and cleans the semiconductor substrate using this chemical solution.

Patent Document 1 describes a cleaning chemical solution supply device for a substrate processing device. This cleaning chemical solution supply device includes a processing tank 2 for storing a processing liquid for processing a substrate and a cleaning chemical liquid tank 3 for storing a cleaning chemical solution to be supplied to the processing tank 2, and the cleaning chemical liquid tank 3 to the processing tank 3 is provided. The flow rate of the cleaning chemical solution is adjusted by providing a resistance portion 6 as a throttle in the middle of the pipe 4 leading to 2.
Patent Document 2 describes a cleaning device that scrubs the surface of a substrate with a roll cleaning member. In this cleaning device, the cleaning chemical solution and DIW (De-Ionized Water) supplied through separate channels are supplied to the substrate surface from separate nozzles.
Patent Document 3 describes a cleaning unit having a cleaning device and a cleaning chemical solution supply device. In this cleaning unit, the flow rates of DIW and the cleaning chemicals are adjusted by DIWCLC111 and the chemicals CLC113, respectively, the adjusted DIW and the chemicals are mixed by the mixer 115, and the diluted chemicals are mixed from the mixing unit 115 on the upper surface of the cleaning apparatus 200. It is supplied to the cleaning unit 222 and the bottom surface cleaning unit 223.
Patent Document 4 describes a cleaning unit having a cleaning device and a cleaning chemical solution supply device. In this cleaning unit, when the first chemical solution is supplied to the cleaning device 200, the flow rates of the DIW and the chemical solution are adjusted by DIWCLC110 and the chemical solution CLC120, respectively, the adjusted DIW and the chemical solution are mixed by the mixer 72, and the diluted chemical solution is mixed. Is supplied to the cleaning device 200. On the other hand, when the second chemical solution is supplied to the cleaning device 200, the flow rates of the DIW and the chemical solution are adjusted by the DIWCLC110 and the chemical solution CLC130, respectively, the adjusted DIW and the chemical solution are mixed by the mixer 73, and the diluted chemical solution is used in the cleaning device. Supply to 200.

Japanese Unexamined Patent Publication No. 9-260332 Japanese Unexamined Patent Publication No. 2014-132641 Japanese Unexamined Patent Publication No. 2016-9818 Japanese Unexamined Patent Publication No. 2016-15469

With the configurations described in Patent Documents 1 to 4, the flow rate and concentration of the chemical solution supplied to each surface (for example, the upper surface and the lower surface) of the substrate cannot be controlled independently.
Further, when the chemical solution is supplied to only one of the respective surfaces of the substrate, it is necessary to provide an on-off valve in each flow path in the cleaning device to control the flow and shutoff of the chemical solution.
Further, in recent years, chemicals and / or DIW have been supplied from a common source to a plurality of devices in a factory, and depending on the installation location of the devices, the chemicals and / or the chemicals supplied to the cleaning chemical supply device are supplied. The DIW pressure may be low. As described above, when the chemical solution and / or DIW supply pressure to the cleaning chemical solution supply device is low, the pressure loss of the flow path and the configuration in the cleaning chemical solution supply device and the cleaning device having the conventional configuration is sufficient for the substrate. It may not be possible to supply the flow rate of chemicals.
For example, in a conventional cleaning unit, when a chemical solution and / or DIW is supplied to each surface of a substrate, the flow path is branched from a common flow path to each surface side of the substrate, and a flow rate is provided in one flow path. Is being adjusted. When the chemical solution and / or DIW supply pressure to the cleaning chemical solution supply device is low, there is a possibility that a sufficient flow rate of the chemical solution cannot be supplied to the substrate due to the pressure loss at the throttle portion.
An object of the present invention is to solve at least a part of the above-mentioned problems.

[1] According to the first embodiment, a cleaning chemical solution supply device for supplying a chemical solution for cleaning to the cleaning device is provided. This cleaning chemical solution supply device includes a chemical solution inlet portion and a diluted water inlet portion, a first chemical solution control unit fluidly connected to the chemical solution inlet portion and the diluted water inlet portion, and the chemical solution inlet portion and the diluted water inlet portion. A second chemical solution control unit, which is fluidly connected to the unit, is provided. The first chemical solution control unit receives the supply of the chemical solution from the chemical solution inlet portion, and is configured to control the flow rate of the chemical solution, and the diluted water flow control unit and the diluted water from the diluted water inlet portion. The chemical solution and the diluted water from the first diluted water flow rate control unit, the first chemical solution flow control unit, and the first diluted water flow control unit configured to receive the supply and control the flow rate of the diluted water. It has a first mixing part for mixing the above. The second chemical solution control unit receives the supply of the chemical solution from the chemical solution inlet portion, and is configured to control the flow rate of the chemical solution, and the dilution from the diluted water inlet portion. A second diluted water flow rate control unit configured to receive water supply and control the flow rate of the diluted water, and the chemical solution and the chemical solution from the second chemical solution flow rate control unit and the second diluted water flow rate control unit. It has a second mixing section for mixing diluted water.

According to the first embodiment, the chemical solution from the same chemical solution source can be independently diluted in the first and second chemical solution control units, and the flow rate and concentration of the chemical solution can be controlled independently. For example, the flow rate and concentration of the chemical solution supplied to each surface of the substrate can be controlled independently.
Further, since the chemical solution is output from the first and second chemical solution control units, respectively, if a valve is provided in the first and second chemical solution control units or in connection with the first and second chemical solution control units, the first And the output of the chemical solution from any of the second chemical solution control units can be stopped. Therefore, it is possible to supply the chemical solution to only one of the upper surface and the lower surface of the substrate by controlling the cleaning chemical solution supply device. Therefore, in order to supply the chemical solution to only one of the first surface and the second surface of the substrate, it is not necessary to install an additional valve or the like in the cleaning device.
Further, since the first and second chemical solution control units can control the flow rate of each chemical solution, the flow rate is adjusted by using a throttle as in the case of branching the chemical solution from a common flow path to each surface side of the substrate. There is no need. Therefore, the pressure loss that the chemical solution and the diluted water receive on the flow path of the cleaning chemical solution supply device and the cleaning device is reduced, and the decrease in the flow rate of the chemical solution to the cleaning device can be suppressed or prevented. For example, even when the supply pressure (input pressure) of the chemical solution and / or the diluted water to the cleaning chemical solution supply device is low, it is possible to suppress or prevent a decrease in the flow rate of the chemical solution supplied to each surface of the substrate.

[2] According to the second embodiment, in the cleaning chemical solution supply device of the first embodiment, each of the first and second chemical solution flow rate control units and the first and second diluted water flow rate control units is the chemical solution or the diluted water. It has a flow meter for detecting the flow rate of the above, and a flow control valve for feedback-controlling the flow rate of the chemical solution or the diluted water based on the detected value of the flow meter.
According to the second embodiment, by using a flow rate control unit including a flow meter and a flow rate control valve, it is possible to easily and accurately control the flow rate of the chemical solution and / or the diluted water by a signal from a control unit such as a computer. It is possible. For example, the pressure loss on the flow path can be reduced as compared with the case where the flow rate of the chemical solution to each surface side of the substrate is controlled by a throttle. Further, as compared with the case where the opening degree of the throttle is manually adjusted, the flow rate control unit provided with the flow meter and the flow rate control valve is advantageous in that the flow rate can be automatically controlled.

[3] According to the third embodiment, in the cleaning chemical solution supply device of the second embodiment, at least one of the first and second chemical solution flow rate control units and the first and second diluted water flow rate control units is used as the flow meter. It has an ultrasonic flow meter.
According to the third embodiment, by using the ultrasonic flowmeter, the pressure loss in the flowmeter can be reduced as compared with the case where the differential pressure type flowmeter (orifice flowmeter) is used. In this configuration, the pressure loss on the flow path can be reduced and the decrease in the flow rate that can be supplied to the substrate can be suppressed, which is particularly advantageous when the supply pressure of the chemical solution and / or the diluted water to the cleaning chemical solution supply device is low. is there.

[4] According to the fourth form, in the cleaning chemical solution supply device of the second or third form, at least one of the first and second chemical flow rate control units and the first and second diluted water flow rate control units has the flow rate. The control valve is a motor valve whose opening degree is changed by a motor.
According to the fourth embodiment, the opening degree of the flow rate control valve can be adjusted quickly and accurately by changing the opening degree of the flow rate control valve by the motor.

[5] According to the fifth aspect, in the cleaning chemical solution supply device according to any one of the first to fourth aspects, the first chemical solution control unit further includes a suckback valve unit on the downstream side of the first mixing unit.
According to the fifth embodiment, the output of the diluted chemical solution from the first chemical solution control unit can be distributed / stopped by the suckback valve unit. According to the sackback valve unit, when the output from the first chemical solution control unit is cut off, dripping from the nozzle can be suppressed or prevented.

[6] According to the sixth embodiment, a cleaning unit is provided, and the cleaning unit includes the cleaning chemical solution supply device according to any one of the first to fifth aspects and the cleaning device connected to the cleaning chemical solution supply device. The first and second chemical solution control units are configured to supply the diluted chemical solution to the first surface and the second surface of the same substrate installed in the cleaning device, respectively.
According to the sixth embodiment, the chemical solutions from the same chemical solution supply source are introduced into the first and second chemical solution control units, and the chemical solutions whose flow rates and concentrations are independently controlled by the first and second chemical solution control units are applied to the substrate, respectively. By supplying to the first surface and the second surface, the flow rate and concentration of the chemical solution supplied to the first surface and the second surface of the substrate can be independently controlled.
Further, since the chemical solution is output from the first and second chemical solution control units, respectively, if a valve is provided in the first and second chemical solution control units or in connection with the first and second chemical solution control units, the first And the output of the chemical solution from any of the second chemical solution control units can be stopped. Therefore, it is possible to supply the chemical solution to only one of the first surface and the second surface of the substrate by the control in the cleaning chemical solution supply device. Therefore, in order to supply the chemical solution to only one of the first surface and the second surface of the substrate, it is not necessary to install an additional valve or the like in the cleaning device.
Further, since the first and second chemical solution control units can control the flow rate of each chemical solution, a throttle is used as in the case where the chemical solution is branched from the common flow path to the first surface side and the second surface side of the substrate. There is no need to adjust the flow rate. Therefore, the pressure loss that the chemical solution and the diluted water receive on the flow path of the cleaning chemical solution supply device and the cleaning device is reduced, and the decrease in the flow rate of the chemical solution to the cleaning device can be suppressed or prevented. For example, even when the supply pressure of the chemical solution and / or the diluted water to the cleaning chemical solution supply device is low, it is possible to suppress or prevent a decrease in the flow rate of the chemical solution supplied to the first surface and the second surface of the substrate. ..

[7] According to the seventh embodiment, in the cleaning unit of the sixth embodiment, the second chemical solution control unit is further configured to supply the diluted chemical solution to the substrate waiting for cleaning in the cleaning device. There is.
By supplying the chemical solution from the second chemical solution control unit that supplies the chemical solution to the lower surface of the substrate to the substrate waiting for cleaning, a separate configuration for supplying the chemical solution to the standby substrate can be omitted, and the fluid circuit The configuration can be simplified.

[8] According to the eighth embodiment, a storage medium containing a program for causing a computer to execute a method of controlling a cleaning unit is provided. This recording medium receives the supply of the chemical solution from the chemical solution inlet portion, controls the flow rate of the chemical solution independently by the first and second chemical solution flow control units, and receives the supply of the diluted water from the dilution water inlet portion. The flow rate of the diluted water is controlled independently by the first and second diluted water flow control units, and the chemical solution and the dilution whose flow rate is controlled by the first chemical solution flow control unit and the first diluted water flow control unit. Water is mixed in the first mixing section, and the diluted chemical solution is output to the cleaning device, the chemical solution whose flow rate is controlled by the second chemical solution flow control unit and the second diluted water flow control unit, and the chemical solution. It stores a program for causing a computer to mix the diluted water in the second mixing unit and output the diluted chemical solution to the cleaning device.

According to the eighth embodiment, the chemical solution from the same chemical solution source can be independently diluted in the first and second chemical solution control units, and the flow rate and concentration of the chemical solution can be controlled independently.
Further, since the chemical solution (diluted chemical solution) is output from the first and second chemical solution control units, the output of the chemical solution from any of the first and second chemical solution control units can be stopped.
Further, since the first and second chemical solution control units can control the flow rate of each chemical solution, it is not necessary to adjust the flow rate by using a throttle as in the case of branching the chemical solution from a common flow path. Therefore, the pressure loss that the chemical solution and the diluted water receive on the flow path of the cleaning chemical solution supply device and the cleaning device is reduced, and the decrease in the flow rate of the chemical solution to the cleaning device can be suppressed or prevented.

[9] According to the ninth aspect, in the storage medium of the eighth embodiment, the diluted chemical solution from the first and second mixing portions is further supplied to the first surface and the second surface of the same substrate. Contains a program that causes the computer to execute. The flow rate and concentration of the chemical solution supplied to the first surface and the second surface of the substrate can be controlled independently. By controlling in the cleaning chemical solution supply device, it is possible to supply the chemical solution to only one of the first surface and the second surface of the substrate. Therefore, it is not necessary to install an additional valve or the like in the cleaning device in order to supply the chemical solution to only one of the first surface and the second surface of the substrate. Further, even when the supply pressure of the chemical solution and / or the diluted water to the cleaning chemical solution supply device is low, it is possible to suppress or prevent a decrease in the flow rate of the chemical solution supplied to the first surface or the second surface of the substrate. ..

It is a schematic front view which shows the cleaning chemical liquid supply apparatus which concerns on one Embodiment. It is a fluid circuit diagram of the cleaning unit which concerns on one Embodiment. It is a block diagram which shows the structure of the flow rate control valve unit (CLC) which concerns on one Embodiment. This is an example of a flowchart of the chemical supply process. It is a top view which shows the whole structure of the polishing apparatus which includes the cleaning unit which concerns on one Embodiment.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a schematic front view showing a cleaning chemical solution supply device according to an embodiment of the present invention. The cleaning chemical solution supply device 100 of the present embodiment is configured to be able to supply a chemical solution for cleaning (for example, hydrofluoric acid, ammonia, etc.) to the cleaning apparatus 200 included in the substrate processing apparatus. The substrate processing apparatus includes, for example, a polishing apparatus such as a CMP (Chemical Mechanical Polishing) apparatus.

As shown in FIG. 1, the cleaning chemical solution supply device 100 according to the embodiment includes a case 101, a first chemical solution dilution box (first chemical solution control unit) 120, and a second chemical solution dilution box (second chemical solution control unit). It has 130 and a plurality of chemical utility boxes 50. The first chemical solution dilution box 120, the second chemical solution dilution box 130, and the plurality of chemical solution utility boxes 50 are housed in the case 101. The first chemical solution dilution box 120 and the second chemical solution dilution box 130 mix the chemical solution and the diluted water to generate a chemical solution (diluted chemical solution) whose flow rate and concentration are adjusted. Diluting water is DIW (De-Ionized Water) or other dilution medium. In the following description, the diluted water will be described as DIW, but the diluted water may be a dilution medium other than DIW. In the cleaning chemical solution supply device 100, the chemical solution utility box 50 is configured to introduce the chemical solution from the chemical solution supply source 20 into the cleaning chemical solution supply device 100. In the illustrated example, six chemical solution utility boxes 50 are provided in the cleaning chemical solution supply device 100, but this is an example, and the number of chemical solution utility boxes 50 is appropriately changed according to the specifications of the cleaning device 200.

FIG. 2 is a fluid circuit diagram of the cleaning unit according to the embodiment. The cleaning unit 10 includes a cleaning chemical solution supply device 100 and a cleaning device 200. In the cleaning chemical solution supply device 100, the chemical solution utility box 50 includes an input unit 51 connected to the chemical solution supply source 20 (see FIG. 2), an on-off valve 52, a lockout valve 53, and a pressure gauge 54. .. The on-off valve 52 is controlled to open and close by a signal from the control device 110. The lockout valve 53 is a valve that is manually opened and closed, and is used, for example, when disconnecting the chemical solution supply source 20 from the cleaning chemical solution supply device 100 during maintenance. The pressure gauge 54 detects the pressure of the chemical solution introduced into the cleaning chemical solution supply device 100 from the chemical solution supply source 20. In this example, the input unit 51 constitutes the chemical solution inlet portion. When the chemical solution utility box 50 is omitted, the connection portion of the cleaning chemical solution supply device 100 with the chemical solution supply source 20 constitutes the chemical solution inlet portion.

The control device 110 may be, for example, a control device provided for the cleaning chemical liquid supply device 100, a control device provided for the cleaning unit 10, or a polishing unit provided with the cleaning unit 10. It may be a control device provided for a substrate processing device such as a device. The control device 110 includes a computer such as a microcomputer or a sequencer or a control circuit, and a recording medium (volatile, non-volatile memory, etc.) in which a program executed by the control circuit is stored. The program includes a program for supplying and cleaning the chemical solution (diluted chemical solution) by the cleaning chemical solution supply device 100 and the cleaning device 200. According to this program, each part of the cleaning chemical solution supply device 100 and the cleaning device 200 is controlled. The program may be stored in a recording medium (CD, flash memory, etc.) that can be attached to and detached from the control device 110. Further, the control device 110 may be stored in a recording medium that can be read by wire or wirelessly.

The cleaning chemical solution supply device 100 further includes a regulator 60 for introducing DIW from the DIW supply source 30 into the cleaning chemical solution supply device 100. The regulator 60 adjusts the pressure of the DIW from the DIW supply source 30 and outputs the pressure to the first chemical solution dilution box 120 and the second chemical solution dilution box 130 via the pipes 90, 91, 92. In this example, the input portion 61 of the regulator 60 constitutes the dilution water inlet portion. When the regulator 60 is omitted, the connection portion of the cleaning chemical solution supply device 100 with the DIW supply source 30 constitutes the dilution water inlet portion.

The first chemical solution dilution box 120 controls the flow rates of the chemical solution and DIW, respectively, and outputs the chemical solution (diluted chemical solution) having a desired flow rate and concentration. The input portion of the first chemical solution dilution box 120 is connected to the chemical solution utility box 50 via the pipes 80 and 81, and is connected to the regulator 60 via the pipes 90 and 91. The output unit of the first chemical solution dilution box 120 is connected to the nozzle 211 of the cleaning unit 210 of the cleaning device 200 via the pipe 85.

The first chemical solution dilution box 120 includes a first chemical solution CLC (first chemical solution flow rate control unit) 121, a first DIWCLC (first diluted water flow rate control unit) 122, and a mixing unit 123. C
The LC (Closed Loop Controller) is a flow control valve unit including a closed loop control device as shown in FIG. 3, and details will be described later. The first chemical solution CLC121 controls and outputs the flow rate of the chemical solution from the chemical solution utility box 50. The first DIWCLC122 controls and outputs the flow rate of DIW from the regulator 60. The output unit of the first chemical solution CLC121 is connected to the pipe 83. The output unit of the first DIWCLC122 is connected to the pipe 93. The pipe 83 and the pipe 93 join the pipe 85. The confluence of the pipe 83, the pipe 93, and the pipe 85 constitutes the mixing portion 123. The mixing unit 123 mixes the chemical solution whose flow rate is controlled by the first chemical solution CLC 121 and the DIW whose flow rate is controlled by the first DIWCLC 122, and outputs a chemical solution (diluted chemical solution) having a desired flow rate and concentration. The flow rate and concentration of the diluted chemical solution are determined according to the flow rates of the chemical solution and DIW set in the first chemical solution CLC121 and the first DIWCLC122 by the signal from the control device 110.

FIG. 3 is a configuration diagram showing a configuration of a flow control valve unit (CLC) according to an embodiment. As shown in FIG. 3, the first chemical solution CLC121 and the first DIWCLC122 include a flow meter 1212, a flow control valve (internal control valve) 1211, and a control unit 1213. The flow meter 1212 of the first chemical solution CLC121 is an ultrasonic flowmeter. From the viewpoint of reducing pressure loss, it is preferable to use an ultrasonic flow meter for the flow meter 1212, but in consideration of the pressure loss of the cleaning chemical liquid supply device 100 and the cleaning device 200 as a whole, a differential pressure type flow meter (orifice flow meter). ) May be used. The flow meter 1212 of the first DIWCLC122 uses a differential pressure type flow meter (orifice flow meter). An ultrasonic flowmeter may be used as the flowmeter 1212 of the first DIWCLC122. The flow rate control valve 1211 is a motor valve in the present embodiment, and the opening degree of the valve body 1211a is controlled by the power of the drive source 1211b including the motor. The flow rate control valve 1211 may be any other type of variable flow rate valve (for example, a solenoid valve driven by a solenoid or the like) as long as the opening degree can be adjusted. The control unit 1213 includes a control circuit such as a microcomputer and a memory for storing a program executed by the control circuit. The control circuit and memory are mounted on the control board, for example. The control unit 1213 receives the fluid flow rate set value iT from the control device 110 and also receives the fluid flow rate detection value io from the flow meter 1212, and the flow rate control valve 1211 so that the flow rate detection value io matches the flow rate set value iT. Feedback control. In the first chemical solution CLC121, the fluid is a chemical solution, and in the first DIWCLC122, the fluid is DIW.
Although the flow control valve unit (CLC) including the flow meter, the flow control valve, and the control unit is illustrated here, a part or all of them may be provided separately. For example, the flow meter 1212 and the flow control valve 1211 are provided separately, and the control device 110 replaces the control unit 1213 (or via the control unit 1213) with the flow control valve based on the value detected from the flow meter 1212. 1211 may be controlled to control the flow rate. The control device 110 may appropriately control the flow control valve 1211 via another drive circuit.

As shown in FIG. 2, the first chemical solution dilution box 120 further includes a suckback valve unit 141 and a pressure gauge 142. The suckback valve unit 141 is an on-off valve having a dripping prevention function. The sackback valve unit 141 is a valve unit including a sackback valve that sucks a fluid on the downstream side by a function of causing a volume change due to deformation of a diaphragm, and an on-off valve (stop valve, two-way valve) that opens and closes a flow path. Is. According to the sackback valve unit 141, when the output of the chemical solution (diluted chemical solution) from the first chemical solution dilution box 120 is cut off, dripping from the nozzle 211 (see FIG. 2) can be suppressed or prevented. it can. The pressure gauge 142 detects the pressure of the chemical solution (diluted chemical solution) output from the mixing unit 123, and measures the pressure of the chemical solution (diluted chemical solution) in the pipe 85 where the pipe 83 and the pipe 93 meet. To detect.

The second chemical solution dilution box 130 controls the flow rates of the chemical solution and DIW, respectively, and outputs the chemical solution (diluted chemical solution) having a desired flow rate and concentration. The second chemical solution dilution box 130 controls the flow rates of the chemical solution and DIW, respectively, independently of the control of the first chemical solution dilution box 120. The input portion of the second chemical solution dilution box 130 is connected to the chemical solution utility box 50 via the pipe 80 and the pipe 82, and is connected to the regulator 60 via the pipe 90 and the pipe 92. The output unit of the second chemical dilution box 130 is connected to the nozzle 212 of the cleaning unit 210 of the cleaning device 200 via the pipe 95, and is connected to the nozzle 212 of the standby unit 230 of the cleaning device 200 via the pipe 96 (FIG. Not shown) is connected.

The second chemical solution dilution box 130 includes a second chemical solution CLC (second chemical solution flow rate control unit) 131, a second DIWCLC (second diluted water flow rate control unit) 132, and a mixing unit 133. The second chemical solution CLC131 controls and outputs the flow rate of the chemical solution from the chemical solution utility box 50. The second DIWCLC132 controls and outputs the flow rate of DIW from the regulator 60. The output unit of the second chemical solution CLC131 is connected to the pipe 84. The output unit of the second DIWCLC132 is connected to the pipe 94. The pipe 84 and the pipe 94 join the pipe 86. The confluence of the pipe 84, the pipe 94, and the pipe 86 constitutes the mixing portion 133. The mixing unit 133 mixes the chemical solution whose flow rate is controlled by the second chemical solution CLC131 and the DIW whose flow rate is controlled by the second DIWCLC132, and outputs a chemical solution (diluted chemical solution) having a desired flow rate and concentration. The flow rate and concentration of the diluted chemical solution are determined according to the flow rates of the chemical solution and DIW set by the second chemical solution CLC131 and the second DIWCLC132 by the signal from the control device 110.

The second chemical solution CLC131 and the second DIWCLC132 have the configuration shown in FIG. 3, similarly to the first chemical solution CLC121 and the first DIWCLC122. The flow meter 1212 of the second chemical solution CLC131 is an ultrasonic flowmeter like the first chemical solution CLC121. From the viewpoint of reducing pressure loss, it is preferable to use an ultrasonic flow meter for the flow meter 1212, but in consideration of the pressure loss of the cleaning chemical liquid supply device 100 and the cleaning device 200 as a whole, a differential pressure type flow meter (orifice flow meter). ) May be used. The flow meter 1212 of the second DIWCLC 132 uses a differential pressure type flow meter (orifice flow meter) like the first DIWCLC 122. An ultrasonic flowmeter may be used as the flowmeter 1212 of the second DIWCLC132. In the second chemical solution CLC131, the fluid is a chemical solution, and in the second DIWCLC132, the fluid is DIW. Since the other configurations are as described above, the description thereof will be omitted.

As shown in FIG. 2, the second chemical solution dilution box 130 further includes an on-off valve 151, an on-off valve 152, and a pressure gauge 142. The on-off valve 151 is provided in a pipe 95 branched from the pipe 86. The on-off valve 151 opens and shuts off the fluid connection between the mixing unit 133 and the nozzle 212 on the lower surface side of the substrate of the cleaning device 200. The on-off valve 152 is provided in a pipe 96 branched from the pipe 86. The on-off valve 152 opens and closes the fluid connection between the mixing unit 133 and the standby unit 230 of the cleaning device 200. The pressure gauge 153 detects the pressure of the chemical solution (diluted chemical solution) output from the mixing unit 133, and detects the pressure of the chemical solution in the pipe 86 where the pipe 84 and the pipe 94 meet.

The cleaning device 200 is a device installed in a substrate processing device such as a polishing device to clean the substrate W. As shown in FIG. 2, the cleaning device 200 is connected to the cleaning chemical solution supply device 100 via pipes 85, 95, 96, and the chemical solution (diluted chemical solution) and / or DIW from the cleaning chemical solution supply device 100. Receive the supply of. The cleaning device 200 includes a cleaning unit 210 and a standby unit 230. The cleaning unit 210 supplies a chemical solution (diluted chemical solution) to the first surface and the second surface (upper surface and lower surface in this example) of the substrate W, and cleans the substrate W with the chemical solution. A substrate that waits for cleaning by the cleaning unit 210 is arranged in the standby unit 230. When the cleaning device 200 includes a DIW cleaning unit that is cleaned by DIW, a pipe for supplying DIW may be provided in the cleaning chemical solution supply device 100. Either the first surface or the second surface of the substrate W may be the front surface or the lower surface of the substrate W. Further, the first surface and the second surface of the substrate W are surfaces extending in the vertical direction when the substrate W is arranged upright in the vertical direction.

The cleaning unit 210 includes one or a plurality of nozzles 211 arranged on the upper surface side of the substrate W, and nozzles 212 arranged on the lower surface side of the substrate W. In order to avoid complication of the drawing, only one nozzle 211 is shown in FIG.
One or a plurality of nozzles 211 are arranged above the substrate W and inject a chemical solution (diluted chemical solution) toward the upper surface of the substrate W. The nozzle 211 is connected to the output of the first chemical solution dilution box 120 of the cleaning chemical solution supply device 100 via the pipe 85, and the chemical solution adjusted to a desired flow rate and concentration in the first chemical solution dilution box 120 (after dilution). (Chemical solution) is supplied. For some or all of the nozzles 211, it is preferable to use a low pressure loss type nozzle (for example, a flat type nozzle) in order to reduce the pressure loss on the flow path.
The nozzle 212 has a configuration in which a plurality of nozzle holes are provided in a common housing. The nozzle 212 is arranged below the substrate W and injects a chemical solution (diluted chemical solution) toward the lower surface of the substrate W. The nozzle 212 is connected to the output of the second chemical solution dilution box 130 of the cleaning chemical solution supply device 100 via the pipe 95, and the chemical solution adjusted to a desired flow rate and concentration in the second chemical solution dilution box 130 (after dilution). (Chemical solution) is supplied. For the nozzle 212, it is preferable to use a low pressure loss type nozzle in order to reduce the pressure loss on the flow path.

The standby unit 230 receives a chemical solution (diluted chemical solution) adjusted to a desired flow rate and concentration in the second chemical solution dilution box 130. The on-off valves 151 and 152 may be controlled so that the chemical solution (diluted chemical solution) is supplied from the second chemical solution dilution box 130 to only one of the nozzle 212 and the standby portion 230 of the cleaning unit 210.

From the viewpoint of reducing the pressure loss on the flow path, it is preferable to use a pipe having a large inner diameter and a small pressure loss from the supply sources 20 and 30 to the nozzles 211 and 212 and the standby portion 230. Further, it is preferable to use valves (52, 151, 152, 141) having a small pressure loss.

(Chemical solution supply process)
Next, the chemical solution supply process in the cleaning chemical solution supply device 100 shown in FIG. 2 will be described. Normally, the lockout valve 53 is opened, and at the start of the chemical solution supply process, the on-off valve 52 of the chemical solution utility box 50 is opened by a signal from the control device 110. Further, the regulator 60 is operated by the signal from the control device 110. Further, the sackback valve unit 141, the on-off valve 151, and the on-off valve 152 are opened by the signal from the control device 110. A chemical solution (diluted chemical solution) and DIW are supplied from the chemical solution utility box 50 and the regulator 60 to the first chemical solution dilution box 120 and the second chemical solution dilution box 130. The on-off valve 52, the regulator 60, the sackback valve unit 141, and the on-off valves 151 and 152 are controlled by signals from the control device 110. The control device 110 executes the control of the first chemical solution CLC121 and the first DIWCLC122 according to the program stored in the recording medium.

In the first chemical solution dilution box 120, the first chemical solution CLC 121 controls the flow rate of the chemical solution so as to be the flow rate set value from the control device 110, and the first DIWCLC 122 is set to the flow rate set value from the control device 110. The flow rate of DIW is controlled, and the mixing unit 123 mixes the flow-adjusted chemical solution (diluted chemical solution) and DIW to generate a chemical solution controlled to a predetermined flow rate and concentration (diluted chemical solution). This is output to the nozzle 211 on the upper surface side of the substrate of the cleaning device 200. The first chemical solution CLC121 and the first DIWCLC122 are controlled by a signal from the control device 110. The control device 110 executes the control of the first chemical solution CLC121 and the first DIWCLC122 according to the program stored in the recording medium.

In the second chemical solution dilution box 130, the second chemical solution CLC131 controls the flow rate of the chemical solution so as to be the flow rate set value from the control device 110, and the second DIWCLC132 is set to the flow rate set value from the control device 110. The flow rate of the DIW is controlled, and the mixing unit 133 mixes the chemical solution after adjusting the flow rate and the DIW to generate a chemical solution (diluted chemical solution) controlled to a predetermined flow rate and concentration, and this is produced by the cleaning device 200. Output to the nozzle 212 on the lower surface side of the substrate. Further, the mixing unit 133 supplies a chemical solution (diluted chemical solution) controlled to a predetermined flow rate and concentration to the standby unit 230 of the cleaning device 200. The second chemical solution CLC131 and the second DIWCLC132 are controlled by a signal from the control device 110. The control device 110 executes the control of the second chemical solution CLC131 and the second DIWCLC132 according to the program stored in the recording medium.

When stopping one of the supply of the chemical solution (diluted chemical solution) to the nozzle 211 and the nozzle 212, one of the sackback valve unit 141 and the on-off valve 151 is closed and the other is opened (the first chemical solution CLC121 and). The flow control valve of the first DIWCLC122 or the flow control valves of the second chemical solution CLC131 and the second DIWCLC132 may be closed).
Further, when the chemical solution (diluted chemical solution) is supplied to the nozzle 211 and the supply of the chemical solution to the nozzle 212 and the standby portion 230 is stopped, the on-off valve 141 is opened and the on-off valves 151 and 152 are closed (second). The flow control valves of the chemical liquid CLC131 and the second DIWCLC132 may be closed).
Further, when stopping one of the supply of the chemical solution (diluted chemical solution) to the nozzle 212 or the standby portion 230, one of the on-off valve 151 and the on-off valve 152 is closed.

In the cleaning unit 210 of the cleaning device 200, the chemical solution (diluted chemical solution) whose flow rate and concentration are independently controlled by the first chemical solution dilution box 120 and the second chemical solution dilution box 130 is transferred from the nozzle 21 and the nozzle 212 to the substrate W, respectively. It is supplied to the upper surface and the lower surface of the substrate W to clean the substrate W. For example, a chemical solution having a lower concentration of the chemical solution to the nozzle 212 can be supplied to the nozzle 21. The cleaning device 200 is controlled by a signal from the control device 110. The control device 110 controls the cleaning device 200 according to a program stored in the recording medium.

(flowchart)
FIG. 4 is an example of a flowchart of the chemical solution supply process. These processes are executed in the control device 110.
In step S11, it is determined whether or not to open the on-off valve 52. If it is determined in step S11 that the on-off valve 52 is to be opened, in step S12, the on-off valve 52 is opened by a signal from the control device 110.

In step S13, it is determined whether or not to open the sackback valve unit 141. If it is determined in step S13 that the sackback valve unit 141 is to be opened, in step S14, the sackback valve unit 141 is opened by a signal from the control device 110. If the sackback valve unit 141 is already open, the sackback valve unit 141 is maintained in the open state. On the other hand, when it is determined that the sackback valve unit 141 is kept closed or closed, the sackback valve unit 141 is controlled by the control device 110 so as to keep the sackback valve unit 141 closed or close. Will be done.

In step S15, in the first chemical solution dilution box 120, the first chemical solution CLC121 controls the flow rate of the chemical solution so as to be the flow rate set value from the control device 110, and the first DIWCLC122 controls the flow rate set value from the control device 110. The flow rate of DIW is controlled so as to be.

In step S16, the mixing unit 123 mixes the flow-adjusted chemical solution and DIW to generate a chemical solution (diluted chemical solution) controlled to a predetermined flow rate and concentration, which is produced on the upper surface side of the substrate of the cleaning device 200. Output to the nozzle 211 of. When the valve 141 is closed, the chemical solution (diluted chemical solution) is not output to the nozzle 211 on the upper surface side of the substrate of the cleaning device 200. In this case, the operations of the first chemical solution CLC121 and the first DIWCLC122 may be stopped.

In step S17, it is determined whether or not to open the on-off valve 151. When it is determined in step S17 that the on-off valve 151 is to be opened, in step S18, the on-off valve 151 is opened by a signal from the control device 110. If the on-off valve 151 is already open, the on-off valve 151 is maintained in the open state. On the other hand, when it is determined that the on-off valve 151 is maintained or closed, the on-off valve 151 is controlled by the control device 110 so as to maintain or close the on-off valve 151.

In step S19, it is determined whether or not to open the on-off valve 152. If it is determined in step S19 that the on-off valve 152 is to be opened, in step S20, the on-off valve 152 is opened by a signal from the control device 110. If the on-off valve 152 is already open, the on-off valve 152 is maintained in the open state. On the other hand, when it is determined that the on-off valve 152 is maintained or closed, the on-off valve 151 is controlled by the control device 110 so as to maintain or close the on-off valve 152 in the closed state.

In step S21, in the second chemical solution dilution box 130, the second chemical solution CLC131 controls the flow rate of the chemical solution so as to be the flow rate set value from the control device 110, and the second DIWCLC132 controls the flow rate set value from the control device 110. The flow rate of DIW is controlled so as to be.

In step S22, the mixing unit 133 mixes the flow-adjusted chemical solution and DIW to generate a chemical solution (diluted chemical solution) controlled to a predetermined flow rate and concentration, which is produced on the lower surface side of the substrate of the cleaning device 200. The output is output to the nozzle 212 and the standby unit 230.
When the on-off valve 151 is closed, the chemical solution (diluted chemical solution) is not output to the nozzle 212 on the lower surface side of the substrate of the cleaning device 200. Further, when the on-off valve 152 is closed, the chemical solution (diluted chemical solution) is not supplied to the standby portion 230. When both the on-off valves 151 and 152 are closed, the chemical solution (diluted chemical solution) is not supplied to the nozzle 212 and the standby portion 230. When both the on-off valves 151 and 152 are closed, the operations of the second chemical solution CLC131 and the second DIWCLC132 may be stopped.

In step S23, it is determined whether or not there is an instruction to end the chemical supply process. If there is an termination instruction, in step S24, the termination process such as closing the open valve, stopping the regulator and CLC is executed, and then the chemical solution supply process is terminated. On the other hand, if there is no end instruction, the process returns to step S13, and the processes of steps S13 to S16 and steps S17 to S22 are repeated.

According to this chemical solution supply process, the first chemical solution dilution box 120 and the second chemical solution dilution box 130 can independently control the flow rate and concentration of the chemical solution (S13 to S16, S17 to S22). Further, the supply of the chemical solution (diluted chemical solution) from either the first chemical solution dilution box 120 or the second chemical solution dilution box 130 can be stopped (S13 to S14, S17 to S20).

(Example of substrate processing equipment)
Next, a configuration example of the polishing apparatus will be described as an example of the substrate processing apparatus including the cleaning unit according to the above-described embodiment. FIG. 5 is a plan view showing the overall configuration of the polishing apparatus including the cleaning unit according to the embodiment.

As shown in FIG. 5, the polishing apparatus 1 includes a substantially rectangular housing 2 and a load port 3 on which a substrate cassette for stocking substrates such as a plurality of semiconductor wafers is placed. An open cassette, a SMIF (Standard Manufacturing Interface) pod, or a FOUP (Front Opening Unified Pod) can be mounted on the load port 3. Inside the housing 2, a plurality of (four in this example) polishing units 4a to 4d, cleaning units 5a and 5b for cleaning the polished substrate, and a drying unit 6 for drying the cleaned substrate are housed. ing. The cleaning unit 10 according to the embodiment of the present invention is applied to at least one of the cleaning units 5a and 5b.

The first transfer robot 7 is arranged in the area surrounded by the load port 3, the polishing unit 4a, and the drying unit 6. Further, the transport unit 8 is arranged in parallel with the polishing units 4a to 4d. The first transfer robot 7 receives the substrate before polishing from the load port 3 and delivers it to the transfer unit 8, and also receives the dried substrate from the drying unit 6 and returns it to the load port 3. The transfer unit 8 conveys the substrate received from the first transfer robot 7 and transfers the substrate to and from each of the polishing units 4a to 4d. A second transfer robot 9a that transfers a substrate between the transfer unit 8 and each of these units 5a and 5b is arranged between the cleaning unit 5a and the cleaning unit 5b. Further, a third transfer robot 28 is arranged between the cleaning unit 5b and the drying unit 6 and transfers a substrate between the units 5b and 6 respectively. Further, a control device 300 that controls the movement of each device of the polishing device 1 is arranged inside the housing 2. As the control device 110 described above, the control device 300 of the polishing device may be used.

(Action effect)
According to the above embodiment, the chemical solution is introduced into the first chemical solution dilution box 120 and the second chemical solution dilution box 130 from the same chemical solution supply source 20, and the flow rate of the chemical solution by the first chemical solution dilution box 120 and the second chemical solution dilution box 130. And the concentration can be controlled respectively. Therefore, the flow rate and concentration of the chemical solution (diluted chemical solution) supplied to each surface (upper surface and lower surface) of the substrate can be controlled independently.

Further, since the chemical solution (diluted chemical solution) is output from the first chemical solution dilution box 120 and the second chemical solution dilution box 130, respectively, the suckback valve unit 141, the on-off valve 151, and the on-off valve 152 are opened and closed to open and close the first chemical solution. The output of the chemical solution (diluted chemical solution) from either the 1 chemical solution dilution box 120 or the second chemical solution dilution box 130 can be stopped. Further, by opening and closing the on-off valve 151 and the on-off valve 152, any of the chemicals (diluted chemicals) supplied to the nozzle 212 and the standby portion 230 of the cleaning unit 210 of the cleaning device 200 can be stopped. Therefore, it is possible to supply the chemical solution (diluted chemical solution) only to each surface (upper surface and lower surface) of the substrate or the standby portion by controlling the cleaning chemical solution supply device 100. Therefore, in order to supply the chemical solution (diluted chemical solution) only to each surface (upper surface and lower surface) of the substrate or the standby portion, it is not necessary to install an additional valve or the like in the cleaning device 200.

Further, since the first chemical solution dilution box 120 and the second chemical solution dilution box 130 can control the flow rate of each chemical solution (diluted chemical solution), as in the case of branching the chemical solution (diluted chemical solution) from a common flow path. In addition, there is no need to adjust the flow rate using a dilution. Therefore, the pressure loss that the chemical solution and the diluted water receive on the flow paths of the cleaning chemical solution supply device 100 and the cleaning device 200 is reduced, and the decrease in the flow rate of the chemical solution (diluted chemical solution) to the cleaning device 200 can be suppressed or prevented. it can. For example, even when the supply pressure of the chemical solution and / or the diluted water to the cleaning chemical solution supply device 100 is low, the flow rate of the chemical solution (diluted chemical solution) supplied to each surface (upper surface and lower surface) of the substrate can be reduced. It can be suppressed or prevented.

According to the above embodiment, by using the CLC 121, 122, 122, 132 including the flow meter 1212 and the flow control valve 1211, the flow rate of the chemical solution and / or the diluted water can be easily and accurately measured by the signal from the control device 110. It is possible to control. For example, the pressure loss in the flow meter 1212 and the flow control valve 1211 can be reduced as compared with the case where the flow rate of the chemical solution to each surface (upper surface and lower surface) of the substrate is controlled by a throttle. Further, as compared with the case where the opening degree of the throttle (for example, the needle valve) is manually adjusted, the CLC 121, 122, 122, 132 including the flow meter 1212 and the flow control valve 1211 can automatically control the flow rate. It is advantageous in that.

According to the above embodiment, by using the ultrasonic flowmeter, the pressure loss in the flowmeter can be reduced as compared with the case where the differential pressure type flowmeter (orifice flowmeter) is used. In this configuration, the pressure loss on the flow path can be reduced and the decrease in the flow rate that can be supplied to the substrate can be suppressed, which is particularly advantageous when the supply pressure of the chemical solution and / or the diluted water to the cleaning chemical solution supply device 100 is low. Is.

According to the above embodiment, the opening degree of the flow rate control valve can be adjusted quickly and accurately by changing the opening degree of the valve body 1211a by the drive source 1211b including the motor.

According to the above embodiment, the output of the diluted chemical solution from the first chemical solution dilution box 120 can be distributed / stopped by the suckback valve unit 141. According to the sackback valve unit 141, when the output from the first chemical solution dilution box 120 is cut off, dripping from the nozzle 211 can be suppressed or prevented.

According to the above embodiment, from the second chemical solution dilution box 130 that supplies the chemical solution (the chemical solution after dilution) to any surface (for example, the lower surface) of each surface of the substrate, to the substrate of the standby unit 230 that waits for cleaning. By supplying the chemical solution (diluted chemical solution), it is possible to omit a separate configuration for supplying the chemical solution (diluted chemical solution) to the standby substrate, and the configuration of the fluid circuit can be simplified. ..

Although the embodiments of the present invention have been described above based on some examples, the above-described embodiments of the present invention are for facilitating the understanding of the present invention and do not limit the present invention. .. The present invention can be modified and improved without departing from the spirit thereof, and it goes without saying that the present invention includes an equivalent thereof. In addition, any combination or omission of the claims and the components described in the specification is possible within the range in which at least a part of the above-mentioned problems can be solved or at least a part of the effect is exhibited. Is.

1 Polishing device 2 Housing 3 Load ports 4a to 4d Polishing units 5a and 5b Cleaning unit 6 Drying unit 7 1st transfer robot 8 2nd transfer robot 9a 2nd transfer robot 9b 3rd transfer robot 10 Cleaning unit 20 Chemical solution supply source 30 DIW Supply source 50 Chemical solution utility box 51 Input section 52 On-off valve 53 Lockout valve 54 Pressure gauge 60 Regulator 61 Input section 80 to 86, 90 to 96 Piping 100 Cleaning chemical solution supply device 101 Case 120 1st chemical solution dilution box 121 1st chemical solution CLC
122 1st DIWCLC
130 Second Chemical Solution Dilution Box 131 Second Chemical Solution CLC
132 2nd DIWCLC
141 Sackback valve unit 142 Pressure gauge 200 Cleaning device 210 Cleaning unit 211 Nozzle 212 Nozzle 230 Standby unit 300 Control device 1211 Flow control valve 1211a Valve body 1211b Drive source 1212 Flow meter 1213 Control unit

Claims (8)

It ’s a cleaning unit,
Cleaning equipment and
A cleaning chemical solution supply device connected to the cleaning device and for supplying a chemical solution for cleaning to the cleaning device,
With
The cleaning chemical supply device is
Chemical solution inlet and diluted water inlet,
A first chemical solution control unit fluidly connected to the chemical solution inlet portion and the diluted water inlet portion,
A second chemical control unit fluidly connected to the chemical inlet and the diluted water inlet,
With
The first chemical solution control unit
A first chemical flow rate control unit configured to control the flow rate of the chemical solution by receiving the supply of the chemical solution from the chemical solution inlet portion.
A first diluted water flow rate control unit configured to receive the supply of diluted water from the diluted water inlet and control the flow rate of the diluted water.
It has a first chemical solution flow rate control unit and a first mixing unit that mixes the chemical solution and the diluted water from the first diluted water flow rate control unit.
The second chemical solution control unit
A second chemical flow rate control unit configured to control the flow rate of the chemical solution by receiving the supply of the chemical solution from the chemical solution inlet portion.
A second diluted water flow rate control unit configured to receive the supply of the diluted water from the diluted water inlet and control the flow rate of the diluted water.
It has a second chemical flow rate control unit and a second mixing unit that mixes the chemical solution and the diluted water from the second diluted water flow rate control unit.
The first and second chemical solution control units are a cleaning unit configured to supply the diluted chemical solution to the first surface and the second surface of the same substrate installed in the cleaning device, respectively. In the cleaning unit according to claim 1,
Each of the first and second chemical flow rate control units and the first and second diluted water flow rate control units
A flow meter for detecting the flow rate of the chemical solution or the diluted water, and
A flow control valve that feedback-controls the flow rate of the chemical solution or the diluted water based on the detected value of the flow meter,
Has a cleaning unit. In the cleaning unit according to claim 2,
A cleaning unit having an ultrasonic flow meter as the flow meter, at least one of the first and second chemical flow rate control units and the first and second diluted water flow control units. In the cleaning unit according to claim 2 or 3.
A cleaning unit in which the flow rate control valve is a motor valve whose opening degree is changed by a motor in at least one of the first and second chemical flow rate control units and the first and second diluted water flow rate control units. In the cleaning unit according to any one of claims 1 to 4.
The first chemical solution control unit is a cleaning unit further provided with a suckback valve unit on the downstream side of the first mixing unit. In the cleaning unit according to any one of claims 1 to 5,
The second chemical solution control unit is a cleaning unit further configured to supply the diluted chemical solution to a substrate waiting for cleaning in the cleaning device. A storage medium containing a program for causing a computer to execute a method of controlling a cleaning unit.
Receiving the supply of the chemical solution from the chemical solution inlet portion, and controlling the flow rate of the chemical solution independently by the first and second chemical solution flow rate control units.
To receive the supply of diluted water from the diluted water inlet and to independently control the flow rate of the diluted water by the first and second diluted water flow rate control units.
The first chemical liquid flow rate controller and the drug solution and the diluting water are controlled flow rate in the first dilution water flow control unit in mixing in the first mixing unit, placed a chemical after the dilution washing the apparatus Supplying to the front surface of the diluted substrate,
The chemical solution whose flow rate is controlled by the second chemical flow control unit and the second diluted water flow control unit and the diluted water are mixed in the second mixing unit, and the diluted chemical solution is installed in the cleaning device. Supplying to the second surface opposite to the first surface of the substrate,
A storage medium that contains a program that allows a computer to execute a program. It ’s a cleaning system,
A cleaning device having a plurality of cleaning units for cleaning the substrate,
A cleaning chemical supply device for supplying a chemical solution for cleaning to the cleaning device,
With
The cleaning chemical supply device is
Chemical solution inlet and diluted water inlet,
A first chemical solution control unit fluidly connected to the chemical solution inlet portion and the diluted water inlet portion,
A second chemical control unit fluidly connected to the chemical inlet and the diluted water inlet,
With
The first chemical solution control unit
A first chemical flow rate control unit configured to control the flow rate of the chemical solution by receiving the supply of the chemical solution from the chemical solution inlet portion.
A first diluted water flow rate control unit configured to receive the supply of diluted water from the diluted water inlet and control the flow rate of the diluted water.
It has a first chemical solution flow rate control unit and a first mixing unit that mixes the chemical solution and the diluted water from the first diluted water flow rate control unit.
The second chemical solution control unit
A second chemical flow rate control unit configured to control the flow rate of the chemical solution by receiving the supply of the chemical solution from the chemical solution inlet portion.
A second diluted water flow rate control unit configured to receive the supply of the diluted water from the diluted water inlet and control the flow rate of the diluted water.
It has a second chemical flow rate control unit and a second mixing unit that mixes the chemical solution and the diluted water from the second diluted water flow rate control unit.
In the first and second chemical solution control units, both the diluted chemical solution from the first mixing section and the diluted chemical solution from the second mixing section are the same among the plurality of cleaning sections. A cleaning system configured to supply the cleaning unit.

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