SG10202013099RA - Cleaning liquid supply device, cleaning unit, and storage medium storing program - Google Patents

Cleaning liquid supply device, cleaning unit, and storage medium storing program

Info

Publication number
SG10202013099RA
SG10202013099RA SG10202013099RA SG10202013099RA SG10202013099RA SG 10202013099R A SG10202013099R A SG 10202013099RA SG 10202013099R A SG10202013099R A SG 10202013099RA SG 10202013099R A SG10202013099R A SG 10202013099RA SG 10202013099R A SG10202013099R A SG 10202013099RA
Authority
SG
Singapore
Prior art keywords
storage medium
supply device
liquid supply
medium storing
storing program
Prior art date
Application number
SG10202013099RA
Inventor
Haiyang Xu
Fujihiko Toyomasu
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2016244469A external-priority patent/JP6774327B2/en
Priority claimed from JP2017236998A external-priority patent/JP6978918B2/en
Application filed by Ebara Corp filed Critical Ebara Corp
Publication of SG10202013099RA publication Critical patent/SG10202013099RA/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/05—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects
    • G01F1/34—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure
    • G01F1/36—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by using mechanical effects by measuring pressure or differential pressure the pressure or differential pressure being created by the use of flow constriction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F1/00—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow
    • G01F1/66—Measuring the volume flow or mass flow of fluid or fluent solid material wherein the fluid passes through a meter in a continuous flow by measuring frequency, phase shift or propagation time of electromagnetic or other waves, e.g. using ultrasonic flowmeters
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01F—MEASURING VOLUME, VOLUME FLOW, MASS FLOW OR LIQUID LEVEL; METERING BY VOLUME
    • G01F25/00—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume
    • G01F25/10—Testing or calibration of apparatus for measuring volume, volume flow or liquid level or for metering by volume of flowmeters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
SG10202013099RA 2016-12-16 2017-12-14 Cleaning liquid supply device, cleaning unit, and storage medium storing program SG10202013099RA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016244469A JP6774327B2 (en) 2016-12-16 2016-12-16 Storage medium containing cleaning chemical supply device, cleaning unit, and program
JP2017236998A JP6978918B2 (en) 2017-12-11 2017-12-11 A storage medium containing a cleaning chemical supply device, a cleaning unit, and a program.

Publications (1)

Publication Number Publication Date
SG10202013099RA true SG10202013099RA (en) 2021-01-28

Family

ID=62558796

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202013099RA SG10202013099RA (en) 2016-12-16 2017-12-14 Cleaning liquid supply device, cleaning unit, and storage medium storing program

Country Status (6)

Country Link
US (2) US11358253B2 (en)
KR (2) KR102452928B1 (en)
CN (2) CN116469811A (en)
SG (1) SG10202013099RA (en)
TW (1) TWI753066B (en)
WO (1) WO2018110631A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI734015B (en) * 2018-07-16 2021-07-21 奇景光電股份有限公司 Cleaning system, cleaning apparatus and cleaning method
JP7152279B2 (en) * 2018-11-30 2022-10-12 株式会社荏原製作所 Polishing equipment
CN110665879A (en) * 2019-09-30 2020-01-10 京东方科技集团股份有限公司 Cleaning device and gluing and developing system
JP7419219B2 (en) * 2020-12-01 2024-01-22 株式会社荏原製作所 Cleaning chemical supply device and cleaning chemical supply method
AT526426B1 (en) * 2023-01-26 2024-03-15 Siconnex Customized Solutions Gmbh Treatment device and method for treating semiconductor objects

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018005B2 (en) * 1979-12-16 1985-05-08 株式会社荏原製作所 Ultrasonic flow meter that can automatically switch between transmission measurement mode and reflection measurement mode
JPH09260332A (en) 1996-03-18 1997-10-03 Dainippon Screen Mfg Co Ltd Chemical liquid supplier of substrate processor
JP2000124186A (en) 1998-10-19 2000-04-28 Tokico Ltd Liquid feeding device
JP4984348B2 (en) * 2001-03-15 2012-07-25 パナソニック株式会社 Flow measuring device
JP4339561B2 (en) * 2002-08-16 2009-10-07 大日本スクリーン製造株式会社 Substrate processing apparatus and substrate processing method
JP5361847B2 (en) * 2010-02-26 2013-12-04 東京エレクトロン株式会社 Substrate processing method, recording medium recording program for executing this substrate processing method, and substrate processing apparatus
JP5887089B2 (en) * 2011-09-14 2016-03-16 アドバンス電気工業株式会社 Liquid supply device
JP6265702B2 (en) 2012-12-06 2018-01-24 株式会社荏原製作所 Substrate cleaning apparatus and substrate cleaning method
JP6159282B2 (en) * 2014-03-27 2017-07-05 株式会社荏原製作所 Substrate processing apparatus and piping cleaning method for substrate processing apparatus
JP6339954B2 (en) 2014-06-09 2018-06-06 株式会社荏原製作所 Cleaning chemical supply apparatus, cleaning chemical supply method, and cleaning unit
US10340159B2 (en) * 2014-06-09 2019-07-02 Ebara Corporation Cleaning chemical supplying device, cleaning chemical supplying method, and cleaning unit
JP6378555B2 (en) * 2014-06-26 2018-08-22 株式会社荏原製作所 Cleaning unit

Also Published As

Publication number Publication date
KR20220018074A (en) 2022-02-14
KR102433049B1 (en) 2022-08-17
US20190314951A1 (en) 2019-10-17
TW201828351A (en) 2018-08-01
KR20190094370A (en) 2019-08-13
US20220266417A1 (en) 2022-08-25
CN110073471B (en) 2023-06-09
KR102452928B1 (en) 2022-10-11
CN110073471A (en) 2019-07-30
CN116469811A (en) 2023-07-21
WO2018110631A1 (en) 2018-06-21
TWI753066B (en) 2022-01-21
US11358253B2 (en) 2022-06-14

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