KR20040103379A - Substrate transporting apparatus, substrate transporting method and vacuum processing apparatus - Google Patents

Abstract

PURPOSE: An apparatus and a method for transferring a substrate and an apparatus for a vacuum treatment are provided to transfer a large sized substrate without bend of the substrate by supporting both the edge portion and the inside portion of the substrate. CONSTITUTION: An apparatus for transferring a substrate comprises a substrate transfer unit(70) and a substrate exchange unit(80). The substrate transfer unit transfers a substrate(G) between the first room(20) and the second room(10). The substrate exchange unit has the first support elements(81,82) for supporting the edge of the substrate and the second support element(85) for supporting the inside of the substrate. The substrate exchange is installed in the first room, where the substrate exchange unit performs the exchange of the substrate between the substrate transfer unit and an another substrate transfer unit.

Description

SUBSTRATE TRANSPORTING APPARATUS, SUBSTRATE TRANSPORTING METHOD AND VACUUM PROCESSING APPARATUS}

BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a substrate transfer technique and a vacuum treatment technique, and in particular, a substrate transfer process such as a glass substrate for a flat panel display such as a liquid crystal display device (LCD) or a plasma display, or a vacuum such as dry etching with respect to the glass substrate. TECHNICAL FIELD The present invention relates to a technique effective for application to a vacuum processing apparatus for performing a treatment or the like.

For example, in an LCD manufacturing process, vacuum processing, such as dry etching, sputtering, CVD (chemical vapor deposition), is frequently used with respect to the LCD glass substrate which is a to-be-processed substrate.

In the vacuum processing apparatus which performs such a vacuum process, the vacuum preliminary chamber is provided adjacent to the vacuum processing chamber which maintains a vacuum and performs the said process, and makes the fluctuation | variation of the atmosphere in a vacuum processing chamber very small at the time of carrying in and out of a to-be-processed substrate. It is structured.

Specifically, for example, a load lock chamber serving as an interface between the atmospheric side and the vacuum side is provided between the cassette disposed in the atmosphere and the vacuum processing chamber which performs the etching process or the like. In this loadlock chamber, the exhaust air to the high vacuum equivalent to that of the vacuum processing chamber is repeated every time the substrate to be processed passes. Therefore, it is necessary to make the volume as small as possible to shorten the exhaust time to high vacuum in order to improve the processing efficiency. It is an important factor.

On the other hand, in such a vacuum processing apparatus, since the to-be-processed board | substrate is exchanged between the conveyance mechanism provided in the load lock chamber and the conveyance mechanism outside the load lock chamber, the buffer which raises and lowers to the position which surrounds the conveyance mechanism provided in the load lock chamber The plate is installed, the substrate to be mounted on the conveying mechanism in the load lock chamber is floated and replaced by the conveying mechanism outside the load lock chamber, or the substrate to be mounted on the conveying mechanism outside the load lock chamber is received and received. The structure which performs an exchange operation | movement, such as dropping and replacing on the conveyance mechanism in a load lock chamber, is known (for example, Unexamined-Japanese-Patent No. 2001-148410).

By the way, in recent years, the demand for the enlargement of the LCD glass substrate is strong, and the super large size board | substrate exceeding 1m is used, and in such a super large size board, in the floating operation in the peripheral support by the buffer plate mentioned above, The amount of whip deformation due to its own weight increases, and the lifting stroke length necessary for completely floating and separating the substrate from the conveying mechanism increases. As the lifting stroke length increases, the height dimension of the load lock chamber in which the buffer plate is installed increases, the volume of the load lock chamber increases more than necessary, the time required for evacuation increases, and the processing efficiency decreases. have.

Moreover, the conveyance mechanism itself also has a problem that the installation space in the height direction becomes larger than necessary.

This invention is made | formed in view of such a situation, and an object of this invention is to provide the board | substrate conveyance technique which can extend a conveyance distance, without increasing a height dimension.

Moreover, an object of this invention is to provide the board | substrate conveying technique which can carry out the conveyance of a comparatively large board | substrate via a vacuum preliminary chamber, without increasing the volume of the vacuum preliminary chamber of an installation object.

Moreover, an object of this invention is to provide the vacuum processing apparatus which can improve the processing efficiency in the vacuum processing of a comparatively large sized board | substrate.

Moreover, an object of this invention is to provide the board | substrate conveying technique which can carry out conveyance of a comparatively large board | substrate without requiring installation space larger than necessary in a height direction.

In order to solve the said subject, from the 1st viewpoint of this invention, the conveyance mechanism which conveys the board | substrate exchanged at the 1st position to a 2nd position, and conveys the board | substrate received at the said 2nd position to a 1st position, and the said A first support portion having a first support portion for supporting a peripheral portion of the substrate and a second support portion for supporting an inner portion also at the first support portion of the substrate, in a first position, between the transport mechanism and the other transport mechanism at the first position. A board | substrate conveying apparatus is provided, Comprising: The board | substrate exchange mechanism which performs the exchange operation | movement of the board | substrate in this invention is provided.

According to a second aspect of the present invention, there is provided a vacuum processing chamber which performs a process in a vacuum on a substrate, and a vacuum preliminary chamber which is temporarily accommodated in a process in which the substrate is carried in and out of the vacuum processing chamber, and whose interior is maintained in vacuum. A substrate conveying apparatus provided in the vacuum preliminary chamber by a vacuum processing apparatus, wherein the substrate exchanged at a first position in the vacuum preliminary chamber is conveyed to a second position in the vacuum processing chamber, and at a second position in the vacuum processing chamber. The conveyance mechanism which conveys the received board | substrate to the 1st position of a vacuum preliminary chamber, The 1st support part which is provided in the said vacuum preliminary chamber, and supports the periphery of the said board | substrate at the said 1st position among them, and the said 1st of said board | substrate The first support part is also provided with a second support part which supports the inner part, and performs a board | substrate exchange operation between the said conveyance mechanism and another conveyance mechanism. Provides a substrate transfer apparatus comprising the substrate exchange mechanism to the vacuum pre-chamber.

In a 3rd viewpoint of this invention, the 1st conveyance mechanism which conveys the board | substrate exchanged at the 1st position to a 2nd position, and conveys the board | substrate received at the 2nd position to a 1st position, and the said in a said 1st position In the substrate conveyance method which performs the exchange | exchange of a board | substrate between the 2nd conveyance mechanism which exchanges a board | substrate with respect to a 1st conveyance mechanism, the 1st support part which supports the peripheral part of a board | substrate, and the said 1st support part of a board | substrate also have an inner part. A substrate transfer method is provided, wherein an exchange operation of the substrate is performed between a first and a second transfer mechanism that performs the transfer operation of the substrate using a substrate exchange mechanism comprising a second support portion to support.

In a fourth aspect of the present invention, there is provided a vacuum processing chamber for performing a process in a vacuum to a substrate, and a vacuum preliminary chamber temporarily accommodated in the process of carrying in and out of the substrate into the vacuum processing chamber, and the inside thereof maintained in vacuum. A vacuum processing apparatus comprising: a substrate installed in the vacuum preliminary chamber and conveyed a substrate exchanged at a first position in the vacuum preliminary chamber to a second position in the vacuum processing chamber and received at a second position in the vacuum processing chamber. The substrate between the first conveyance mechanism for conveying the substrate to the first position of the vacuum reserve chamber and the second conveyance mechanism for exchanging the substrate with respect to the first conveyance mechanism at the first position of the vacuum reserve chamber in the atmosphere. In the substrate conveyance method which performs the replacement | exchange, the inside part is also made into the 1st support part which supports the peripheral part of a board | substrate, and the said 1st support part of a board | substrate. Underground using a substrate exchanging mechanism comprising a second support portion, there is provided a substrate transfer method, characterized in that running the exchanging operation of the substrate between the first and second transport mechanism running the transport operation of the substrate.

In a fifth aspect of the present invention, a vacuum processing chamber that performs a predetermined process in a vacuum on a substrate, and a vacuum preliminary temporarily accommodated in the process of carrying in and out of the substrate into the vacuum processing chamber, and the inside thereof is kept in vacuum. An agent provided in the chamber and the vacuum preliminary chamber, for transferring the substrate between a first position therein and a second position in the vacuum processing chamber, and for exchanging the substrate between a second transfer mechanism provided externally; 1 conveyance mechanism, the 1st support part which is provided in the said vacuum preliminary chamber, supports the peripheral part of the said board | substrate, and the 2nd support part which supports an inner part also in the said 1st support part of the said board | substrate, The said 2nd conveyance mechanism and It is provided with the vacuum processing apparatus characterized by including the board | substrate exchange mechanism which performs the exchange operation | movement of the said board | substrate between the said 1st conveyance mechanisms. The.

According to this invention, in the board | substrate exchange between the conveyance mechanism and another conveyance mechanism which conveys the board | substrate exchanged at the 1st position to a 2nd position, and conveys the board | substrate received at the said 2nd position to a 1st position, The peripheral portion of the substrate is supported by the first support portion, and the first support portion of the substrate also supports the inner portion with the second support portion so that the substrate is not bent and floated from the other transfer mechanism to be transferred to the transfer mechanism, thereby replacing the substrate. Therefore, even in the case of a board | substrate with a large amount of warpage, it is not necessary to enlarge the stroke of the lifting operation of a 1st support part. For this reason, it is not necessary to ensure a large space in a height direction, and it becomes effective for conveyance of a comparatively large board | substrate. For example, in a vacuum processing apparatus or the like in which a conveyance mechanism of the present invention is installed in a vacuum preliminary chamber because of the transfer of a relatively large substrate, it is not necessary to increase the height dimension of the vacuum preliminary chamber in order to secure the stroke of the member supporting the substrate. Increasing the volume of the vacuum reserve chamber can be prevented.

As a result, it is possible to suppress an increase in the time required for evacuation of the vacuum preliminary chamber by increasing the volume of the vacuum preliminary chamber, and to increase the processing efficiency in the vacuum processing step of the substrate with the conveying operation via the vacuum preliminary chamber. Improvement can be realized. Moreover, the installation space of the conveyance mechanism itself which conveys a large sized board | substrate can also be reduced.

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a longitudinal sectional view of a vacuum preliminary chamber in a vacuum processing apparatus provided with a substrate transfer device according to a first embodiment of the present invention;

2 is a longitudinal sectional view of a vacuum preliminary chamber in the vacuum processing apparatus provided with the substrate transfer apparatus according to the first embodiment of the present invention;

3 is a horizontal sectional view showing a vacuum processing apparatus with a substrate conveying apparatus according to a first embodiment of the present invention;

4 is a perspective view showing an example of a structure of a substrate transfer mechanism of the substrate transfer apparatus according to the first embodiment of the present invention;

5 is a perspective view showing an appearance of a vacuum processing apparatus including a substrate transfer device according to a first embodiment of the present invention;

6 is an explanatory diagram showing an example of the operation of the substrate transfer apparatus according to the reference technology of the present invention;

7 is a longitudinal sectional view of a vacuum preliminary chamber in the vacuum processing apparatus provided with the substrate transfer device according to the second embodiment of the present invention;

8 is a longitudinal sectional view of a vacuum preliminary chamber in the vacuum processing apparatus provided with the substrate transfer device according to the second embodiment of the present invention;

9 is a horizontal sectional view showing a disposition relationship between a substrate transfer mechanism, a first buffer plate, and a second buffer plate of the substrate transfer apparatus according to the second embodiment of the present invention.

Explanation of symbols for the main parts of the drawings

10: vacuum processing chamber 20: load lock chamber

30: gate valve 40: gate valve

50: atmospheric side conveyance mechanism 51: conveyance arm

52: notch 55: substrate rack

60: vacuum pump (air pressure pump) 70, 70 ': substrate transfer mechanism

100: vacuum processing device

Embodiment of the Invention

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[First Embodiment]

1 and 2 are longitudinal cross-sectional views of a vacuum preliminary chamber in a vacuum processing apparatus provided with a substrate transfer apparatus according to a first embodiment of the present invention, and FIG. 3 shows a substrate transfer apparatus according to a first embodiment of the present invention. 4 is a perspective view showing an example of a configuration of a substrate transfer mechanism of the substrate transfer apparatus according to the first embodiment of the present invention, and FIG. 5 is a perspective view showing the first embodiment of the present invention. It is a perspective view which shows the external appearance of the vacuum processing apparatus provided with the board | substrate conveyance apparatus.

The vacuum processing apparatus 100 of the present embodiment includes a vacuum processing chamber 10 which performs a desired vacuum processing such as a plasma etching process or a thin film forming process on a substrate G such as an LCD glass substrate in a vacuum atmosphere, and this vacuum. The load lock chamber 20 which is addressed to the processing chamber 10 and functions as a vacuum preliminary chamber, the gate valve 30 provided between the vacuum processing chamber 10 and the load lock chamber 20, the load lock chamber 20, and the outside of the load lock chamber 20. The gate valve 40 which interrupts | blocks the atmospheric conveyance mechanism 50 is provided.

The vacuum pump (atmospheric water pump) 60 is connected to the vacuum processing chamber 10 via the exhaust control valve 61, and the vacuum exhaust to the vacuum degree required for the predetermined vacuum processing of the substrate G is possible. . In addition, the processing gas supply part 12 is connected to the vacuum processing chamber 10 via the gas control valve 11, and it is possible to form the processing gas atmosphere of predetermined pressure inside the vacuum processing chamber 10. FIG. It is. The processing stage 13 is installed inside the vacuum processing chamber 10, and the substrate G to be processed is mounted.

A vacuum pump (atmospheric water pump) 60 is connected to the load lock chamber 20 via an exhaust control valve 62, so that the vacuum can be evacuated to a vacuum degree equivalent to that of the vacuum processing chamber 10.

The gate valve 30 communicates with the vacuum processing chamber 10 and the load lock chamber 20, and has an opening 31 having a size that allows the substrate G supported by the substrate transfer mechanism 70 to be described later to pass therethrough, and this opening portion. The valve main body 32 which performs opening / closing operation | movement of the 31 is provided.

The gate valve 40 communicates with the load lock chamber 20 and the external air side, and has an opening 41 having a size that allows the substrate G supported by the air-side transfer mechanism 50 to pass therethrough, and the opening ( The valve main body 42 which performs the opening-closing operation | movement of 41 is provided.

Inside the load lock chamber 20, a linear substrate transfer mechanism 70 is provided. The substrate conveyance mechanism 70 includes a base plate 71 fixed to the bottom of the load lock chamber 20, a first slide plate 72 and a second slide plate stacked in multiple stages on the base plate 71. A 73 and a third slide plate 74 serving as a substrate support are provided. The base plate 71 and the first to third slide plates 74 constitute a substrate transfer mechanism main body.

The base plate 71 is provided with a pair of slide rails 71a for supporting the first slide plate 72 directly above and slidably in the horizontal direction, and applying a horizontal driving force to the slide plate 72. The slide drive device 71b which reciprocates on the slide rail 71a is provided.

The first slide plate 72 supports a pair of slide rails 72a for supporting the second slide plate 73 directly above and slidably in the horizontal direction, and a driving force in the horizontal direction on the slide plate 73. Is provided, and the slide drive device 72b which reciprocates on the slide rail 72a is provided.

The second slide plate 73 supports a pair of slide rails 73a for supporting the third slide plate 74 directly above and slidably in the horizontal direction, and a driving force in the horizontal direction on the slide plate 74. Is provided, and the slide drive device 73b which reciprocates on the slide rail 73a is provided.

The uppermost third slide plate 74 is provided with a substantially U-shaped slide peak 74a that functions as a substrate support portion that supports the lower surface of the substrate G to be mounted.

The slide drive apparatuses 71b-73b are comprised by the belt which both ends extended to the follower which is not shown in the base plate 71 and the slide plates 72-73, for example, and slides which a part of each of these belts is located above. The first to third slide plates 72 are fixed by hanging on the bottoms of the plates 72 to 74 and driven circumferentially in a forward / reverse direction by a slide motor 70a disposed at the bottom of the base plate 71. To 74) to generate propulsion force in the stretch / degenerate movement direction. And the board | substrate conveyance mechanism 70 extends the 1st-3rd slide plates 72-74 in multiple stages in a horizontal direction, and the vacuum processing chamber 10 carries out the board | substrate G supported by the 3rd slide plate 74. The board | substrate G received on the 3rd slide plate 74 in the vacuum processing chamber 10 by degenerating the carrying-in operation | movement carried in inward and the 1st-3rd slide plates 72-74 in multiple stages in the horizontal direction. Carrying out operation to take out to the load lock chamber 20 is performed.

The board exchange mechanism 80 is provided inside the load lock chamber 20. The substrate exchange mechanism 80 includes buffer plates 81 and 82 provided at positions to insert the substrate transfer mechanism 70, buffer lifting mechanisms 83 and 84 for raising the buffer plates 81 and 82, and a base. The support pin 85 provided in the center of the bottom part of the plate 71, and the pin lift mechanism 86 which raises this support pin 85 are provided. Then, the first support part is configured by the buffer plates 81 and 82 and the buffer lifting mechanisms 83 and 84, and the second support part is configured by the support pins 85 and the pin lifting mechanism 86.

The substrate exchange mechanism 80 supports the peripheral portion of the substrate G supported by the slide peak 74a on the third slide plate 74 of the substrate transfer mechanism 70 from below with buffer plates 81 and 82, Substrate exchange operations such as the operation of floating the substrate G from the slide peak 74a and the operation of lowering the substrate G received from the atmospheric side transport mechanism 50 onto the slide peak 74a are performed. In addition, the center of the board | substrate G is supported by the support pin 85 at this time.

In the center part of the base plate 71 and the 1st-3rd slide plates 72-74 which comprise the board | substrate conveyance mechanism 70 mentioned above, the pin through-hole 71c which the said support pin 85 can pass, and a pin The through hole 72c, the pin through hole 73c, and the pin through hole 74c are provided, respectively. In the stacked state (degenerate state) in which the first to third slide plates 72 to 74 are introduced into the load lock chamber 20, the pin through holes 71c and the pin through holes 72c to 74c are perpendicular to each other. And the support pin 85 protrudes on the uppermost slide plate 74 to pass through the pin through holes 71c and 72c to 74c, so that the substrate mounted on the slide plate 74 ( An operation of contacting and supporting the bottom center of G) (in the case of the present embodiment, as an example, substantially the center position of the substrate G) is made possible.

That is, the support pin 85 is raised in synchronization with the buffer plates 81 and 82 in the above-described substrate exchange operation in the load lock chamber 20, and the peripheral portions are supported by the buffer plates 81 and 82. The center portion of the substrate G serves to support horizontally so as not to bend downward due to its own weight.

The atmospheric | transport side conveyance mechanism 50 is equipped with the conveyance arm 51 which can be rotated and expanded and is one board | substrate unprocessed by the conveyance arm 51 from the board | substrate rack 55 in which several board | substrate G was accommodated. The board | substrate conveyance mechanism in the load lock chamber 20 is taken out (G), the operation | movement which passes to the board | substrate conveyance mechanism 70 in the loadlock chamber 20 via the gate valve 40, and the processed board | substrate G in the loadlock chamber 20 ( Received from 70, taken out to the atmosphere via the gate valve 40, and stored in the substrate rack 55 is executed. The notch part 52 is provided in the conveyance arm 51 so that it may not interfere with the support pin 85 in the exchange in the load lock chamber 20 of the board | substrate G. As shown in FIG.

Next, the operation will be described.

First, the substrate conveyance mechanism 70 is degenerate in the load lock chamber 20, the valve body 32 of the gate valve 30 is sealed, and the inside of the vacuum processing chamber 10 is a vacuum pump (atmospheric water pump) ( 60) is evacuated to the required vacuum.

The atmospheric side conveyance mechanism 50 takes out the unprocessed board | substrate G from the board | substrate rack 55 with the conveyance arm 51, and carries it in into the load lock chamber 20 through the opening part 41 of the gate valve 40. , It is positioned immediately above the third slide plate 74 of the substrate transfer mechanism 70.

Next, the buffer plates 81 and 82 are raised to lift the periphery of the substrate G from both sides, and the support pins 85 pass through the pin through holes 71c to 74c to raise the transfer arms 51. As shown in FIG. 1, the substrate G is transported in a substantially horizontal posture without bending, as shown in FIG. 1 by passing through the cutout 52 of FIG. Injured from.

Thereafter, the transfer arm 51 is pulled out to the air side and retracted to the outside of the load lock chamber 20, and then the buffer plates 81 and 82 and the support pins 85 are lowered, as shown in FIG. The board | substrate G moves on the slide peak 74a of the 3rd slide plate 74 in the board | substrate conveyance mechanism 70, and is mounted.

Then, the valve body 42 of the gate valve 40 is sealed to make the load lock chamber 20 sealed, and the exhaust control valve 62 is opened to exhaust the vacuum to the same degree as the vacuum chamber 10. The valve body 32 of the gate valve 30 is opened. At this time, since the load lock chamber 20 is evacuated, the vacuum degree and atmosphere of the vacuum processing chamber 10 are not damaged. Then, the openings 31 of the gate valve 30 extend the first to third slide plates 72 to 74 of the substrate transfer mechanism 70 in multiple stages toward the inside of the vacuum processing chamber 10, and the substrate (G) is carried directly over the processing stage 13 of the vacuum processing chamber 10 and mounted on the processing stage 13 via a lifting pin or the like not shown provided in the processing stage 13. Thereafter, the first to third slide plates 72 to 74 degenerate and retract into the load lock chamber 20, close the valve body 32 of the gate valve 30, and close the vacuum processing chamber 10. .

Thereafter, the required gas is introduced from the processing gas supply part 12 into the sealed vacuum processing chamber 10 to form a processing gas atmosphere, and the processing necessary for the substrate G is performed.

After a predetermined time has elapsed, the introduction of the processing gas is stopped, the valve body 32 of the gate valve 30 is opened, and the first to third slide plates 72 of the substrate transfer mechanism 70 in the load lock chamber 20 are opened. To 74) in the vacuum processing chamber 10 in multiple stages, and the processed substrate G of the vacuum processing chamber 10 is subjected to the third slide from the processing stage 13 in the reverse order of the carrying-in operation described above. After moving to the slide peak 74a of the plate 74, the slide plates 72-74 are retracted and carried out to the load lock chamber 20, and the valve main body 32 of the gate valve 30 is sealed, The vacuum processing chamber 10 is sealed. At this time, the board | substrate conveyance mechanism 70 in the load lock chamber 20 is a state of FIG.

Thereafter, the exhaust of the load lock chamber 20 is stopped, the N ₂ gas or the like is introduced to a pressure close to atmospheric pressure, and the buffer plates 81 and 82 and the support pins 85 are raised to raise the substrate G. Of the substrate G, which floats the valve body 42 of the gate valve 40 and floats the conveyance arm 51 of the atmospheric conveyance mechanism 50 after supporting the periphery and the central portion of the float and floating in a substantially horizontal posture. ) And the buffer plates 81 and 82 and the support pins 85 are lowered in the state, thereby transferring the substrate G to the transfer arm 51.

Then, the transport arm 51 is pulled out to the atmosphere side, whereby the processed substrate G is taken out from the load lock chamber 20 to the atmosphere side and stored in the substrate rack 55.

Here, in the putting in and out of the vacuum processing chamber 10 of the board | substrate G via the load lock chamber 20 mentioned above, conventionally, as shown in FIG. 6, the board | substrate G is enlarged and it is carried out by the buffer plate. When the amount of warpage B in the floating operation increases, the stroke S of the buffer plate for securing the insertion gap (gap C) of the transfer arm 51 increases, and the movable range of the stroke S is ensured. In order to do this, it was necessary to increase the height dimension of the load lock chamber 20.

On the other hand, in this embodiment, as shown in FIG. 1 mentioned above, the board | substrate G is cooperated with the buffer plates 8l and 82 which support the peripheral part of the board | substrate G, and the support pin 85 which supports the center part. Since the exchange operation can be performed by the rise of the substrate G without causing warpage), the stroke S1 of the buffer plates 81 and 82 is significantly reduced than the stroke S shown in FIG. The height dimension H of the load lock chamber 20 can be made smaller by that amount. As a result, the volume of the load lock chamber 20 is reduced, and the vacuum exhaust time required for the load lock chamber 20 can be shortened, and the vacuum processing step of the substrate G including the exhaust time required for the load lock chamber 20 is included. The processing efficiency in the process improves.

In particular, in the load lock chamber 20 which accommodates the large-sized board | substrate G in which one side exceeds 1 m, a horizontal cross-sectional area becomes large, and the reduction of the height dimension of the load lock chamber 20 has a large volume reduction effect, and exhaust time is required. Contributes greatly to the reduction.

Second Embodiment

Next, a second embodiment of the present invention will be described.

7 and 8 are longitudinal cross-sectional views of a vacuum preliminary chamber in a vacuum processing apparatus including a substrate transfer apparatus according to a second embodiment of the present invention, and FIG. 9 is a substrate transfer apparatus according to a second embodiment of the present invention. It is a horizontal cross section which shows the arrangement relationship of a board | substrate conveyance mechanism, a 1st buffer plate, and a 2nd buffer plate. In addition, in this figure, the same code | symbol is attached | subjected to the same thing as 1st Example, and the description is abbreviate | omitted. In addition, it is comprised like the 1st Example except a vacuum preliminary chamber.

In this embodiment, inside the load lock chamber 20, the substrate transfer mechanism 70 'which is the same as the substrate transfer mechanism 70 in the first embodiment is provided. This board | substrate conveyance mechanism 70 'and the base plate 71' and 1st which have the same function as the base plate 71 and the 1st and 3rd slide plates 72-74 of the board | substrate conveyance mechanism 70, respectively. To third slide plates 72 'to 74'. And the board | substrate conveyance mechanism main body is comprised by such a base plate 71 'and the 1st-3rd slide plates 72'-74'.

The peak 75 which functions as a board | substrate support part is attached to the 3rd slide plate 74 'so that it may protrude to the side, This peak 75 is provided at intervals from the board | substrate conveyance mechanism main body.

The board exchange mechanism 90 is provided inside the load lock chamber 20. The substrate exchange mechanism 90 is provided with a pair of first buffer plates 91 and 92 provided at a position at which the substrate transfer mechanism 70 'is inserted to contact and support the periphery of the substrate, and the first buffer plate 91. And a first buffer raising and lowering mechanism (93, 94) for raising the 92 and the substrate conveyance mechanism (70 ') inside the first buffer plates (91, 92) are inserted to transfer the substrate of the substrate (G). A pair of second buffer plates 95 and 96, which are in contact with and supported by the inner portion of the peak 75 with a portion outside the mechanism body, and a second buffer lifting mechanism for raising the second buffer plates 95 and 96. (97, 98) is provided. Then, the first support portion is composed of the first buffer plates 91 and 92 and the first buffer raising and lowering mechanisms 93 and 94, and the second buffer plates 95 and 96 and the second buffer raising and lowering mechanisms 97 and 98 are provided. The second support part is comprised. Further, the first buffer plates 91 and 92 and the second buffer plates 95 and 96 are independently of each other by the first buffer lifting mechanisms 93 and 94 and the second buffer lifting mechanisms 97 and 98. It can be driven.

The substrate exchange mechanism 90 supports the peripheral portion of the substrate G supported by the peak 75 of the substrate transfer mechanism 70 'from below with the first buffer plates 91 and 92, and furthermore, The operation | movement which raises the board | substrate G from the peak 75 by supporting the inner part of the peak 75 from the lower side with the 2nd buffer plates 95 and 96 to the outer part of a board | substrate conveyance mechanism main body ( Substrate exchange operation such as the operation of dropping the substrate G received from 50 onto the peak 75 is performed.

Next, the operation will be described.

First, the substrate conveyance mechanism 70 'is degenerate in the load lock chamber 20, the valve body 32 of the gate valve 30 is closed, and the inside of the vacuum processing chamber 10 is a vacuum pump (atmospheric water pump). The evacuation is performed at the vacuum degree necessary for 60.

The atmospheric conveyance mechanism 50 takes out the unprocessed board | substrate G from the board | substrate rack 55 with the conveyance arm 51, and carries it in into the load lock chamber 20 through the opening part 41 of the gate valve 40. It is positioned just above the third slide plate 74 'of the substrate transfer mechanism 70'.

Next, the first buffer plates 91 and 92 are raised to lift the peripheral portion of the substrate G from both sides, and the second buffer plates 95 and 96 are positioned outside the main body of the substrate transfer mechanism of the substrate G. By lifting the inner portion of the peak 75, the substrate G rises from the transfer arm 51 in a substantially horizontal posture without being bent, as shown in FIG. 7.

Thereafter, the transfer arm 51 is pulled out to the air side and retracted to the outside of the load lock chamber 20, and then the first buffer plates 91 and 92 and the second buffer plates 95 and 96 are lowered, thereby FIG. 8. As shown in FIG. 8, the substrate G shifts and mounts on the peak 75 in the substrate transfer mechanism 70 ′.

And the conveyance operation | movement of a board | substrate is performed in the same procedure as the 1st Example below. That is, after closing the valve body 42 of the gate valve 40 to make the load lock chamber 20 sealed, and opening the exhaust control valve 62 to exhaust to the same degree of vacuum as the vacuum processing chamber 10, The valve body 32 of the gate valve 30 is opened. The first to third slide plates 72 'to 74' of the substrate transfer mechanism 70 'are extended in multiple stages to the inside of the vacuum processing chamber 10 through the opening 31 of the gate valve 30. The substrate G is carried directly over the processing stage 13 of the vacuum processing chamber 10 and mounted on the processing stage 13 via a lifting pin or the like not shown provided in the processing stage 13. Thereafter, the first to third slide plates 72 'to 74' are retracted and retracted into the load lock chamber 20, and the valve body 32 of the gate valve 30 is closed to close the vacuum processing chamber 10. Seal it.

Subsequently, a necessary gas is introduced from the processing gas supply part 12 into the sealed vacuum processing chamber 10 to form a processing gas atmosphere, and the processing necessary for the substrate G is performed.

After the lapse of a predetermined time, the introduction of the processing gas is stopped, the valve body 32 of the gate valve 30 is opened, and the first to third slide plates of the substrate transfer mechanism 70 'in the load lock chamber 20 ( 72 'to 74' are stretched in multiple stages inside the vacuum processing chamber 10, and the processed substrate G of the vacuum processing chamber 10 is removed from the processing stage 13 in the reverse order of the carrying-in operation mentioned above. The slide plates 72'- 74 'are degenerate by moving onto the peak 75 and taken out into the load lock chamber 20, and then the valve body 32 of the gate valve 30 is closed and the vacuum processing chamber 10 Seal) At this time, the board | substrate conveyance mechanism 70 'in the load lock chamber 20 is the state of FIG.

Thereafter, the exhaust of the load lock chamber 20 is stopped, and N ₂ gas or the like is introduced to a pressure close to atmospheric pressure, and the first buffer plates 91 and 92 and the second buffer plates 95 and 96 are raised. After supporting the peripheral part of the board | substrate G, the part between the board | substrate conveyance mechanism main body, and the peak 75, and making it float in a substantially horizontal attitude | position, the valve main body 42 of the gate valve 40 is opened, and an atmospheric side conveyance is carried out. The transfer arm 51 of the mechanism 50 is inserted below the floating substrate G, and the first buffer plates 91 and 92 and the second buffer plates 95 and 96 are dropped in that state. (G) is transferred to the conveyance arm 51.

Then, the transport arm 51 is pulled out to the atmosphere side, whereby the processed substrate G is taken out from the load lock chamber 20 to the atmosphere side and stored in the substrate rack 55.

In the present embodiment, as shown in FIG. 7 described above, the portions between the first buffer plates 91 and 92 supporting the peripheral portion of the substrate G, and the substrate conveyance mechanism main body and the peak 75 of the substrate G are separated. By cooperating with the second buffer plates 95 and 96 to support, the first buffer can be replaced by the floating of the substrate G without causing warpage to the substrate G as in the first embodiment. The strokes of the plates 91 and 92 and the second buffer plates 95 and 96 are considerably shorter than before, and the height dimension of the load lock chamber 20 can be made smaller. As a result, the volume of the load lock chamber 20 can be reduced, so that the time required for evacuating the load lock chamber 20 can be shortened, and the vacuum of the substrate G including the time required for evacuation of the load lock chamber 20 is included. The treatment efficiency in the treatment step is improved. In particular, in the case of a large substrate, such a treatment efficiency improvement effect is large.

In addition, this invention is not limited to the said Example, A various deformation | transformation is possible within the scope of the idea of this invention. For example, the substrate conveyance mechanism set in the vacuum preliminary chamber, such as a load lock chamber, is not limited to being a conveyance mechanism of the structure which performs the linear conveyance operation which laminated | stacked the slide plate, and is equipped with the several robot arm to rotate. It may be a joint robot or the like. In that case, the support pin may be arranged at a position where the articulated robot degenerates in the vacuum reserve chamber so as to perform replacement of the substrate, at a position not interfering with the robot arm or at a position penetrating the robot arm. Can be.

In addition, the substrate is not limited to a flat panel display substrate such as an LCD or a plasma display, but can be applied to other substrates.

Since this invention can suppress the curvature of a board | substrate at the time of board exchange, it is especially effective for conveyance of a large size board | substrate.

Claims (23)

A conveyance mechanism for conveying the substrate exchanged at the first position to the second position and conveying the substrate received at the second position to the first position; The said 1st position WHEREIN: The 1st support part which supports the peripheral part of the said board | substrate, and the 2nd support part which supports an inner part also in the said 1st support part of the said board | substrate are provided, The said conveyance mechanism and another conveyance mechanism in the said 1st position And a substrate exchange mechanism for performing substrate exchange therebetween. Substrate transfer device. The vacuum preliminary apparatus in the vacuum processing apparatus including a vacuum processing chamber which performs a process on a substrate in a vacuum, and a vacuum preliminary chamber which is temporarily accommodated in the process of transporting the substrate into and out of the vacuum processing chamber, and the inside thereof is kept in vacuum. In the board | substrate conveying apparatus provided in a seal | sticker, A conveying mechanism for conveying the substrate exchanged at the first position in the vacuum preliminary chamber to a second position in the vacuum processing chamber and conveying the substrate received at the second position in the vacuum processing chamber to the first position of the vacuum preliminary chamber; It is provided in the said vacuum preliminary chamber, Comprising: The 1st support part in which the 1st support part which supports a peripheral part of the said board | substrate, and the 2nd support part which supports an inner part rather than the said 1st support part of the said board | substrate are provided, The said vacuum reserve It is provided with the board | substrate exchange mechanism which performs the board | substrate exchange operation | movement between the said conveyance mechanism and another conveyance mechanism in a chamber, Substrate transfer device. The method according to claim 1 or 2, The said conveyance mechanism has a conveyance mechanism main body and the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, In the substrate exchange mechanism, the first support portion is disposed around the conveyance mechanism, has a plate in contact with a lower peripheral portion of the substrate, and a plate elevating mechanism for elevating the plate, and the second support portion includes: When the said board | substrate support part of a conveyance mechanism is holding the said board | substrate at the said 1st position, it has a support pin which penetrates the said conveyance mechanism main body, and contacts the center part of the said board | substrate, and the pin lifting mechanism which raises and lowers the said support pin, It is characterized by the above-mentioned. doing Substrate transfer device. The method of claim 3, wherein The said support pin of the said 2nd support part is arrange | positioned in the position which contacts the center position of the said board | substrate, It is characterized by the above-mentioned. Substrate transfer device. The method according to claim 1 or 2, The said conveyance mechanism has a conveyance mechanism main body and the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, The said 1st support part has a 1st plate which is arrange | positioned around the said conveyance mechanism, and is in contact with the periphery lower part of the said board | substrate, and a 1st lifting mechanism which raises the said 1st plate, The said 2nd support part is the said conveyance of the said board | substrate. It has a 2nd plate which contacts an outer part rather than a mechanism main body, and the 2nd lifting mechanism which raises a said 2nd plate. Substrate transfer device. The method of claim 5, wherein The substrate support portion protrudes laterally at intervals from the conveyance mechanism body, and the second plate contacts a portion between the conveyance mechanism body and the substrate support portion of the substrate. Substrate transfer device. The method according to any one of claims 3 to 6, The said conveyance mechanism main body has several plate-shaped arms laminated | stacked under the said board | substrate support part, The said drive apparatus extends | stretches and drives by sliding the said board | substrate support part and the said several plate-shaped arms in the width direction in multiple steps, The substrate can be held in the first position in a state where the plate-shaped arm is degenerated, and the substrate can be held in the second position in the state where the plurality of plate-shaped arms are extended. Substrate transfer device. The method according to any one of claims 1 to 7, The substrate is characterized in that the flat display substrate Substrate transfer device. The board | substrate is conveyed with respect to the 1st conveyance mechanism which conveys the board | substrate exchanged in the 1st position to a 2nd position, and conveys the board | substrate received in the 2nd position to a 1st position, and the said 1st conveyance mechanism in the said 1st position. In the substrate conveyance method which performs exchange | exchange of a board | substrate with the 2nd conveyance mechanism to exchange, Between the 1st and 2nd conveyance mechanism which performs the conveyance operation | movement of the said board | substrate using the board exchange mechanism which consists of a 1st support part which supports the peripheral part of a board | substrate, and the 2nd support part which supports an inner part also in the said 1st support part of a board | substrate. Performing an exchange operation of the substrate at Substrate conveying method. In the vacuum processing apparatus having a vacuum processing chamber which performs a process in a vacuum with respect to a board | substrate, and a vacuum spare room which is temporarily accommodated in the process of carrying in and out of the said board | substrate to the said vacuum processing chamber, and the inside is kept in vacuum, The said vacuum preliminary apparatus The substrate, which is installed in the chamber and exchanged at the first position in the vacuum preliminary chamber, is transferred to the second position in the vacuum processing chamber, and the substrate received at the second position in the vacuum processing chamber is moved to the first position of the vacuum preliminary chamber. In the substrate conveyance method which performs a board | substrate exchange between the 1st conveyance mechanism to convey and a 2nd conveyance mechanism which exchanges a board | substrate with respect to the said 1st conveyance mechanism in the 1st position of the said vacuum preliminary chamber in air | atmosphere. , Between the 1st and 2nd conveyance mechanism which performs the conveyance operation | movement of the said board | substrate using the board exchange mechanism which consists of a 1st support part which supports the peripheral part of a board | substrate, and the 2nd support part which supports an inner part also in the said 1st support part of a board | substrate. Performing an exchange operation of the substrate at Substrate conveying method. The method according to claim 9 or 10, Moving the substrate mounted on the second transfer mechanism to an upper portion of the first transfer mechanism; Raising the first and second support portions of the substrate exchange mechanism to lift the substrate from the second transfer mechanism; A step of evacuating the second conveyance mechanism from above the first conveyance mechanism; And dropping the first and second support portions to transfer the substrate to the first transfer mechanism. Substrate conveying method. The method according to claim 9 or 10, Raising the substrate mounted on the first transport mechanism at the first support and the second support to lift the substrate from the first transport mechanism; Inserting the second transfer mechanism between the substrate and the first transfer mechanism; And dropping the first and second support portions and transferring the substrate to the second transfer mechanism. Substrate conveying method. The method according to any one of claims 9 to 12, The said 1st conveyance mechanism has a conveyance mechanism main body and the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, In the substrate exchange mechanism, the first support portion has a plate disposed around the first transport mechanism and in contact with a lower peripheral portion of the substrate, and a plate elevating mechanism for raising the plate, and the second support portion includes: When the said board | substrate support part of the said 1st conveyance mechanism hold | maintains the said board | substrate at the said 1st position, it has a support pin which penetrates the said conveyance mechanism main body, and contacts the center part of the said board | substrate, and the pin lifting mechanism which raises the said support pin. Characterized by Substrate conveying method. The method of claim 13, The support pin of the second support part is disposed at a position in contact with the center position of the substrate. Substrate conveying method. The method according to any one of claims 9 to 12, The said 1st conveyance mechanism has a conveyance mechanism main body, the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, The said 1st support part is a periphery of the said 1st conveyance mechanism. It has a 1st plate which is arrange | positioned and in contact with the peripheral lower part of the said board | substrate, and a 1st lifting mechanism which raises a said 1st plate, The said 2nd support part is the 2nd plate which contacts the outer part rather than the said conveyance mechanism main body of the said board | substrate. And a second elevating mechanism for raising the second plate. Substrate conveying method. The method of claim 15, The substrate support portion projects laterally at intervals from the conveyance mechanism body, and the second plate is in contact with a portion between the conveyance mechanism body and the substrate support portion of the substrate. Substrate conveying method. The method according to any one of claims 13 to 16, The said conveyance mechanism main body has several plate-shaped arms laminated | stacked below the said board | substrate support part, The said drive apparatus slides the said board | substrate support part and the said several plate-shaped arms in the width direction in multiple steps, and expands and contracts, said The board | substrate can be hold | maintained at a said 1st position in the state which the some plate-shaped arm degenerate, and a board | substrate can be hold | maintained at said 2nd position in the state which the said some plate-shaped arm extended | stretched, Substrate conveying method. A vacuum processing chamber which performs a predetermined process in a vacuum on the substrate, A vacuum preliminary chamber which is temporarily accommodated in the process of carrying in and out of the substrate, and the inside thereof is maintained in a vacuum; First conveyance which is installed in the said vacuum preliminary chamber, conveys a board | substrate between a 1st position and a 2nd position in the said vacuum processing chamber among them, and performs the exchange | exchange of the said board | substrate between the 2nd conveyance mechanism provided externally. Appliance, It is provided in the said vacuum reserve chamber, Comprising: The 1st support part which supports the peripheral part of the said board | substrate, and the 2nd support part which supports an inner part rather than the said 1st support part of the said board | substrate, The said 2nd conveyance mechanism and the said 1st conveyance mechanism are provided. And a substrate exchange mechanism for performing the exchange operation of the substrate therebetween. Vacuum processing unit. The method of claim 18, The said 1st conveyance mechanism has a conveyance mechanism main body, the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, In the substrate exchange mechanism, the first support portion has a plate disposed around the first transport mechanism and in contact with a lower peripheral portion of the substrate, and a plate elevating mechanism for raising the plate, and the second support portion includes: When the said board | substrate support part of the said 1st conveyance mechanism hold | maintains the said board | substrate at the said 1st position, it has a support pin which penetrates the said conveyance mechanism main body, and contacts the center part of the said board | substrate, and the pin lifting mechanism which raises the said support pin. Characterized by Vacuum processing unit. The method of claim 19, The said support pin of the said 2nd support part is arrange | positioned in the position which contacts the center position of the said board | substrate, It is characterized by the above-mentioned. Vacuum processing unit. The method of claim 18, The said 1st conveyance mechanism has a conveyance mechanism main body and the board | substrate support part which supports a board | substrate, and the drive apparatus which drives the said conveyance mechanism main body and the said board | substrate support part, The first support portion has a first plate disposed around the first conveyance mechanism and in contact with the periphery lower portion of the substrate and a first lift mechanism for raising the first plate, wherein the second support portion is formed on the substrate of the substrate. It has a 2nd plate which contacts an outer part rather than a conveyance mechanism main body, and the 2nd lifting mechanism which raises a said 2nd plate. Vacuum processing unit. The method of claim 21, The said board | substrate support part protrudes laterally at intervals from the said conveyance mechanism main body, and the said 2nd plate contacts the part between the said conveyance mechanism main body and the said board | substrate support part of the said board | substrate, It is characterized by the above-mentioned. Vacuum processing unit. The method according to any one of claims 19 to 22, The said conveyance mechanism main body has several plate-shaped arms laminated | stacked below the said board | substrate support part, The said drive apparatus slides the said board | substrate support part and the said several plate-shaped arms in the width direction in multiple stages, and expands and contracts, It is possible to hold the substrate in the first position in the state where the plate-shaped arm is degenerated, and the substrate can be held in the second position in the state where the plurality of plate-shaped arms are extended. Vacuum processing unit.