KR20100135626A - Substrate transfering apparatus and substrate processing system having the same - Google Patents

Substrate transfering apparatus and substrate processing system having the same Download PDF

Info

Publication number
KR20100135626A
KR20100135626A KR1020090054109A KR20090054109A KR20100135626A KR 20100135626 A KR20100135626 A KR 20100135626A KR 1020090054109 A KR1020090054109 A KR 1020090054109A KR 20090054109 A KR20090054109 A KR 20090054109A KR 20100135626 A KR20100135626 A KR 20100135626A
Authority
KR
South Korea
Prior art keywords
substrate
transfer
chamber
belt
base
Prior art date
Application number
KR1020090054109A
Other languages
Korean (ko)
Inventor
최대규
Original Assignee
주식회사 뉴파워 프라즈마
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 뉴파워 프라즈마 filed Critical 주식회사 뉴파워 프라즈마
Priority to KR1020090054109A priority Critical patent/KR20100135626A/en
Publication of KR20100135626A publication Critical patent/KR20100135626A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J18/00—Arms
    • B25J18/02—Arms extensible
    • B25J18/025—Arms extensible telescopic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
    • B25J9/104—Programme-controlled manipulators characterised by positioning means for manipulator elements with cables, chains or ribbons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

PURPOSE: A substrate transferring device and a substrate processing system including the same are provided to improve productivity by increasing an exchange speed of a substrate between a process chamber and a transfer chamber. CONSTITUTION: A transfer unit slides on a base. A substrate(W) is supported on the upper side of the transfer unit. A base plate(220) supports the base. A process chamber(100a,100b,100c) includes a substrate support(110) to load the substrate.

Description

Substrate transfer device and substrate processing system including same {SUBSTRATE TRANSFERING APPARATUS AND SUBSTRATE PROCESSING SYSTEM HAVING THE SAME}

The present invention relates to a substrate transfer apparatus and a substrate processing system including the same, and more particularly, to a substrate transfer apparatus capable of increasing productivity by loading / unloading a plurality of substrates more quickly into a process chamber to increase substrate exchange speed. It relates to a substrate processing system including the same.

Background Art In recent years, substrate processing systems for manufacturing liquid crystal display devices, plasma display devices, and semiconductor devices have generally adopted cluster systems capable of consistently processing a plurality of substrates.

In general, a cluster system refers to a multi-chambered substrate processing system that includes a transfer robot (or handler) and a plurality of substrate processing modules provided around it.

The cluster system includes a transfer chamber and a transfer robot provided with a free rotation in the transfer chamber. Each side of the transfer chamber is equipped with a process chamber for carrying out a substrate processing process. Such a cluster system increases substrate throughput by processing a plurality of substrates at the same time or by allowing several processes to proceed continuously. Another effort to increase the substrate throughput is to simultaneously process a plurality of substrates in one process chamber to increase the substrate throughput per hour.

However, even if the process chamber processes a plurality of substrates simultaneously (or continuously), time loss occurs when the substrates before and after the process are not efficiently exchanged in the process chamber.

In addition, the conventional cluster system, in the configuration of the hexagonal transfer chamber (when basically composed of four process chambers and two load lock chambers), due to the area occupied by the transfer chamber, not only the area of the entire system but also the manufacturing The system width, which is important for the system arrangement in the line, is increased more than necessary, and the size of the vacuum system required to keep the conveying chamber in vacuum is increased, thereby increasing the equipment cost and installation cost. In addition, the area of such a conveyance chamber is further weighted as the number of process chambers installed is increased.

Therefore, there is a demand for a substrate processing system capable of processing a plurality of substrates simultaneously (or continuously) in a process chamber for processing a plurality of substrates, and for exchanging substrates before and after the treatment more efficiently.

Accordingly, an object of the present invention is to provide a high-speed substrate processing system capable of improving productivity by increasing an exchange rate of a substrate to be processed between a process chamber and a transfer chamber.

One aspect of the present invention for achieving the above technical problem relates to a substrate transfer apparatus and a substrate processing system including the same. The substrate transfer apparatus of the present invention includes: a base; a transfer part provided to be slidably movable on the base and supported on an upper surface of the substrate; It characterized in that it comprises a belt driving unit for supporting the transfer unit to move on the base, including a belt which is coupled to the base and the transfer unit and the length is elongated or contracted.

According to one embodiment, the transfer unit is provided to be stacked on each other and includes a plurality of transfer arm assembly which is slidingly moved by the belt driving unit.

According to one embodiment, the belt driving unit is provided so that the transfer unit is selectively movable in either direction of the bidirectional of the base.

According to one embodiment, further comprising a base plate for supporting the base, the base plate is provided rotatably.

According to an embodiment, the transfer part further includes an auxiliary transfer arm assembly provided on the base to be spaced apart from the transfer arm assembly to transfer a substrate simultaneously with the transfer container assembly.

On the other hand, the substrate processing system according to the present invention comprises at least one process chamber including a substrate support on which the substrate to be processed and the first substrate entrance; A transfer chamber connected to the first substrate entrance and exit and provided with the substrate transfer device to load / unload the substrate into the process chamber; And a load lock chamber connected to the transfer chamber and on which an unprocessed substrate and a substrate are respectively loaded.

According to the high speed substrate processing system of the present invention, productivity can be improved by increasing the exchange rate of the substrate to be processed between the process chamber and the transfer chamber.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiment of the present invention may be modified in various forms, the scope of the invention should not be construed as limited to the embodiments described in detail below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shape of the elements in the drawings and the like may be exaggerated to emphasize a more clear description. It should be noted that the same members in each drawing are sometimes shown with the same reference numerals. Detailed descriptions of well-known functions and constructions which may be unnecessarily obscured by the gist of the present invention are omitted.

1 is a block diagram of a substrate processing system according to a preferred embodiment of the present invention.

Referring to FIG. 1, a substrate processing system 10 according to a preferred embodiment of the present invention may include first, second, and third process chambers 100a, 100b, 100c (hereinafter, process chamber 100) having a substrate support 110. Is provided, and the transfer chamber 200 is installed therebetween. In front of the substrate processing system 10 is provided with a load lock chamber 300 is loaded substrate. A first substrate entrance 130 is provided between the process chambers 100a, 100b, 100c and the transfer chamber 200, and a second substrate entrance 250 is provided between the transfer chamber 200 and the load lock chamber 300. It is provided. Each of the first to second substrate entrances 130 and 250 is configured with a slit valve so that each entrance is independently opened and closed.

The load lock chamber 300 is provided in front of the transfer chamber 200, and the load lock chamber 300 includes a transfer chamber 320 connected to the transfer chamber 200, and multiple substrates on both sides of the transfer chamber 320. The preheating processor 310 and the cooling processor 330 are installed. The transfer chamber 320 is provided with an atmospheric pressure conveying robot (not shown) operated at atmospheric pressure. Atmospheric pressure transfer robot (not shown) is in charge of substrate transfer between the transfer chamber 200, the preheating unit 310 and the cooling processor 330. Atmospheric pressure transport robots (not shown) have long, thin plate-shaped end effectors (not shown) for supporting and transporting substrates.

The process chambers 100a, 100b, 100c have a substrate support 110 on which the substrate W to be placed is placed. Each substrate support 110 includes a lift pin 120 capable of raising and lowering the substrate W, a mechanism (not shown) for driving the plasma support 140, and a plasma source 140 for processing the substrate W. Is provided. The lift pin 120 lifts and lowers the substrate support 110 and supports the substrate W transferred from the transfer chamber 200. Process chambers 100a, 100b, 100c may be configured to perform various substrate processing operations. For example, it may be an ashing chamber that removes photoresist using plasma, a chemical vapor deposition (CVD) chamber configured to deposit an insulating film, and may be formed by apertures in the insulating film to form interconnect structures. an etch chamber configured to etch apertures or openings. Or a PVD chamber configured to deposit a barrier film, and may be a PVD chamber configured to deposit a metal film.

The substrate W to be processed in the substrate processing system 10 is typically a wafer substrate for producing a semiconductor circuit or a glass substrate for producing a liquid crystal display. In addition to the illustrated configuration of the present substrate processing system, multiple processing systems may be required to perform all the processes required for complete fabrication of integrated circuits or chips. However, for the sake of clarity, the conventional structures or configurations that can be understood by those skilled in the art are omitted.

2 and 3 are views showing a process in which the transfer chamber 200 of the present invention transfers the substrate W to the process chambers 100a, 100b, and 100c, and FIG. 4 is a belt driving source ( 240 is a view illustrating an operation process.

As shown, the transfer chamber 200 of the present invention includes a chamber wall 210 provided between the process chambers 100a, 100b, and 100c, a base plate 220 provided inside the chamber wall 210, and The driving arm is provided on the base plate 220 to transfer the substrate between the load lock chamber 300 and the process chambers 100a, 100b, and 100c and the transfer arm assembly 230. It includes a belt driving source 240 for transmitting.

The base plate 220 supports the transfer arm assembly 230 so that the substrate W is stably transferred. In addition, the base plate 220 is rotatably provided inside the transfer chamber 200 by the magnetic gears 211 and 270 to be described later, so that the transfer arm assembly 230 is formed of a plurality of process chambers 100a, 100b and 100c. W) to be transported.

The transfer arm assembly 230 is provided on the base plate 220 to be slidably moved by the belt driving source 240 to transfer the substrate W to the load lock chamber 300 and the process chambers 100a, 100b, and 100c. do. The transfer arm assembly 230 includes a pair of base arms 231 fixedly coupled to the base plate 220, and a pair of lower transfer arms 233 movably provided at the pair of base arms 231, respectively. A pair of upper transfer arms 235 are provided to be movable on the pair of lower transfer arms 233 and on which the substrate is mounted. Each of the transfer arms 231, 233, 235 is provided with a hook ring (not shown) in the lower region so as to slide along the surface without being separated from each other, and a guide groove (not shown) for moving the hook ring (not shown) in the upper region. Can be prepared.

The upper transfer arm 235 is provided with a substrate loading groove 235a to stably load the substrate W on the upper surface thereof. The substrate loading groove 235a is provided to correspond to the size of the substrate (W).

The belt drive source 240 allows the plurality of transfer arms 231, 233, 235 to be slidably moved by extension and contraction of the first and second coupling belts 246 and 247 coupled to the transfer arm assembly 230, thereby extending or contracting the entire length. . Belt drive source 240 is provided in the lower left belt coupling rib 241a, lower right belt coupling rib 241b provided on the base arm 231, and the lower transfer arm 233 as shown in FIG. The middle left belt support rib 243a and the middle right belt support rib 243b, the upper left belt coupling rib 245a and the upper right coupling rib 245b coupled to the upper transfer arm 235, in a direction facing each other. The first coupling belt 246 and the second coupling belt 247 are combined.

The first coupling belt 246 is coupled to the lower left belt coupling rib 241a, the middle right belt support rib 243b, and the upper left belt coupling rib 245a. Here, a driving source (not shown) is coupled to the lower left belt coupling rib 241a to rotate the lower left belt coupling rib 241a according to a transfer signal so that the first coupling belt 246 is released or wound. The middle right belt support rib 243b supports the outer circumference of the first coupling belt 246 to transmit the extension and compression of the first coupling belt 246. The upper left belt coupling rib 245a is fixed to the first coupling belt 246.

The second coupling belt 247 is coupled to the lower right belt coupling rib 241b, the middle left belt support rib 243a and the upper right belt coupling rib 245b. Here, a driving source (not shown) is coupled to the lower right belt coupling rib 241b to rotate the lower right belt coupling rib 241b according to a transfer signal so that the second coupling belt 247 is released or wound. The middle left belt support rib 243a supports the outer circumference of the first coupling belt 246 and transmits the extension and compression of the second coupling belt 247. The upper right belt coupling rib 245b is fixed to the second coupling belt 247.

Each of the supporting ribs and the coupling ribs protrudes from the side surfaces of the plurality of transfer arms 231, 233, and 235. The plurality of support ribs may be provided together on one side of the transfer arms 231, 233, 235, or the coupling ribs supporting the first coupling belt 246 to remove interference of the coupling belts 246, 247 may be provided on the left side of the transfer arms 231, 233, 235. A coupling rib provided to support the second coupling belt 247 may be provided on the right side of the transfer arms 231, 233, and 235.

The lower right belt coupling rib 241b and the lower left belt coupling rib 241a are initially counterclockwise as shown by the driving source (not shown) with the three transfer arms 231, 233 and 235 stacked on each other. When rotated in the direction, the first coupling belt 246 is extended and the second coupling belt 247 is compressed. Accordingly, the lower transfer arm 233 and the upper transfer arm 235 are slid by the extension force of the first coupling belt 246 and the compression force of the second coupling belt 247 to extend the entire length.

On the other hand, when the lower right belt coupling rib 241b and the lower left belt coupling rib 241a are rotated clockwise as shown by driving of a driving source (not shown), the first coupling belt 246 is compressed and the second The coupling belt 247 is extended. Accordingly, the lower transfer arm 233 and the upper transfer arm 235 are slid by the compressive force of the first coupling belt 246 and the stretching force of the second coupling belt 247 to compress the entire length and move to the initial position.

Here, the transfer arm assembly 230 adjusts the rotational direction of the first coupling belt 246 and the second coupling belt 247 as shown in Figure 5 the transfer arms (231, 233, 235) in the right direction as well as the left direction Can also be moved. That is, the transfer arms 231, 233, 235 are movable in both directions along the longitudinal direction of the base arm 231 by mutually adjusting the extension direction and the compression direction of the first coupling belt 246 and the second coupling belt 247. It may be provided. As a result, the substrate can be transferred to a plurality of process chambers arranged to face each other in one transfer arm assembly.

6 is an exemplary view illustrating a process of transferring the substrate W to the process chambers 100a, 100b, and 100c by the transfer arm assembly 230 of the present invention. As shown in (a), the transfer arm assembly 230 waits in the transfer chamber 200 while the substrate W is loaded on the upper surface. At this time, the three transfer arms 231, 233, 235 are stacked on each other. When the first substrate entrance 140 is opened, as shown in (b), the lower transfer arm 233 and the upper transfer arm 235 are coupled to the first coupling belt 246 by the driving of the belt driving source 240. The belt 247 moves inside the process chambers 100a, 100b, and 100c. When the lower transfer arm 233 and the upper transfer arm 235 enter the process chambers 100a, 100b, and 100c, the lift pin 120 is raised as shown in (c). The lift pin 120 rises a certain height higher than the upper transfer arm 235. By this operation, the substrate W on the upper surface of the upper transfer arm 235 is moved to and supported by the upper surface of the lift pin 120.

When the substrate W is moved to the upper surface of the lift pin 120, the upper transfer arm 235 and the lower transfer arm 233 are transferred back to the transfer chamber 200, as shown in (d), and shown in (e). As described above, the lift pin 120 is lowered to the substrate support 110 to complete the substrate transfer.

The transfer arm assembly 230 of the present invention transfers the substrate W to the process chambers 100a, 100b, and 100c by the above-described method, and the substrate W on which the processing is completed in the process chambers 100a, 100b, and 100c is completed. Received and transferred to the transfer chamber 320. In addition, the substrate W is transferred from the transfer chamber 320 and transferred to the process chambers 100a, 100b, and 100c. Here, the transfer of the substrate between the transfer arm assembly 230 and the transfer chamber 320 is carried by an atmospheric pressure transfer robot (not shown) in the transfer chamber 320 or transfer the substrate W loaded in the transfer chamber 320. The arm assembly 230 may transfer directly.

7 is a schematic diagram schematically showing the configuration of the magnetic gears 211 and 270 provided in the transfer chamber 200. The magnetic gears 211 and 270 are provided on the lower side of the base plate 220 and include a bearing 280 for supporting the base plate 220, and annular magnetic gears 211 and 270 in which the N pole and the S pole are alternately arranged. . In order to rotate in the chamber wall 210, the base plate 220 is provided in a cylindrical shape, and may have a predetermined interval in a vacuum state from the chamber wall 210. The magnetic gears 211 and 270 are provided in a form in which the first magnetic gear 211 in the base plate 220 faces the second magnetic gear 270 in the base plate 220 along the side surface of the chamber wall 210. When the magnetic gear 270 rotates, the first magnetic gear 211 rotates along the inside. Since the first magnetic gear 211 is fixed to the base plate 220, when the second magnetic gear 270 rotates, the entire base plate 220 rotates.

8 is a schematic diagram showing a substrate transfer process of the substrate processing system 10 of the present invention. As shown in the substrate processing system 10 of the present invention, the substrate W loaded in the preheater 310 is supplied to the transfer chamber 320, and the substrate W in the transfer chamber 320 is transferred to the transfer chamber ( 200). The transfer arm assembly 230 of the transfer chamber 200 transfers the substrate W supplied by the rotation of the base plate 220 to the first, second, and third process chambers 100a, 100b, and 100c. The substrates processed in the process chambers 100a, 100b, and 100c are transferred to the transfer chamber 320 through the transfer arm assembly 230. The processed substrate transferred to the transfer chamber 320 is transferred to the outside via the cooling processing unit 330.

9 illustrates a case in which the load lock chamber 300a is provided in the form of a single chamber without a preheating unit and a cooling unit. In this case, the transfer arm assembly 230 receives the substrate from the load lock chamber 300a and transfers the substrate to the first, second, and third process chambers 100a, 100b, and 100c. Here, the substrate exchange between the transfer arm assembly 230 and the load lock chamber 300a may be implemented by the transfer arm assembly 230 or by an atmospheric pressure transport robot (not shown) in the load lock chamber 300a as described above. Can be.

As described above, the substrate processing system according to the present invention transfers the substrate by a plurality of transfer arm assemblies coupled to each other by sliding and conveying force by the stretching force and the compressive force of the belt, so that the load lock chamber and the transfer chamber, the transfer chamber, Substrate transfer can be performed quickly and accurately between process chambers.

10 to 13 are exemplary views showing various modifications of the transfer arm assembly of the present invention. As shown in FIG. 10, the transfer arm assembly 200a according to the first modified example of the present invention further includes a substrate loading stand 237 on which the substrate is supported on the upper transfer arm 235. The substrate loading stage 237 stably supports the entire area of the substrate so that eccentricity does not occur when the substrate is supported on the two transfer arms 235.

In the transfer arm assembly 200b according to the second modification of the present invention, the substrate is transferred by the transfer of the transfer arms 231b, 233b, and 235b in a row. That is, while the substrate is transferred by the transfer of a pair of transfer arms in which the transfer arm assembly 200 according to the above-described preferred embodiment is spaced apart from the left and right, the iso arm assembly 200b according to the second modification is It is carried by a row of transfer arms 231b, 233b and 235b which support the center region of the substrate. Here, the substrate loading stage 237b for supporting the entire area of the substrate is provided on the upper transfer arm 235b, and the coupling blade 236b for coupling the substrate loading stage 237 and the upper transfer arm 235b to each other is provided.

The transfer arm assembly according to the preferred embodiment of the present invention and the first and second modifications described above were able to transfer only one substrate. On the other hand, the transfer arm assembly 200c and the transfer arm assembly 200d according to the fourth modified example 200d according to the third modified example of the present invention shown in FIGS. 12 and 13 are provided to transfer two substrates at the same time. .

The transfer arm assembly 200c according to the third modification is provided with a pair of transfer arm assemblies 291 and 293 on the inner side and the outer side, respectively. The second transfer arm assembly 293 provided on the outside is provided with a height higher than the substrate loading height of the first transfer arm assembly 291 provided on the inner side. The second transfer arm assembly 293 is further provided with a height support 295 for supporting a height higher than that of the first transfer arm assembly 291. As a result, the first transfer arm assembly 291 and the second transfer arm assembly 293 may transfer the substrate without interfering with each other. The first transfer arm assembly 291 and the second transfer arm assembly 293 may load / unload the substrate in opposite directions.

The transfer arm assembly 200d according to the fourth modified example has two substrates opposite to each other by a row of transfer arm assemblies 291a and 293a arranged left and right, compared to the transfer arm assembly 200c according to the third modified example. Will be transferred to.

Here, the transfer arm assembly may be modified in various forms in addition to the four modifications described above. That is, the transfer arm assembly may be respectively provided on the bottom surface and the top surface of the transfer chamber to simultaneously transfer a plurality of substrates.

Embodiments of the substrate transfer apparatus of the present invention and the substrate processing system including the same described above are merely illustrative, and those skilled in the art to which the present invention pertains may perform various modifications and other equivalent implementations therefrom. You can see that examples are possible. Accordingly, it is to be understood that the present invention is not limited to the above-described embodiments. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents, and substitutes within the spirit and scope of the invention as defined by the appended claims.

1 is a perspective view showing the configuration of a substrate processing system of the present invention;

2 and 3 are perspective views showing a substrate transfer process between the transfer chamber and the process chamber of the present invention,

4 and 5 are schematic views showing the operation of the belt drive source of the transfer chamber of the present invention,

6 is an exemplary view illustrating a process of transferring a substrate to a process chamber by a transfer arm assembly of a transfer chamber of the present invention;

7 is a schematic diagram schematically showing the configuration of the magnetic gear of the transfer chamber of the present invention,

8 is a schematic diagram schematically showing a substrate transfer process of the substrate processing system of the present invention;

9 is a schematic diagram schematically showing a substrate transfer process of a substrate processing system according to a modification of the present invention;

10 to 13 are exemplary views showing various modifications of the transfer arm assembly of the transfer chamber of the present invention.

* Description of the symbols for the main parts of the drawings *

10: substrate processing system 100a, 100b, 100c: process chamber

110: substrate support 120: lift pin

130: first substrate entrance 140: plasma source

200: transfer chamber 210: chamber wall

211: first magnetic gear 220: base plate

230: transfer arm assembly 231: base arm

233: lower transfer arm 235: upper transfer arm

235a: substrate seating groove 240: belt drive

241a: Lower left belt coupling rib 241b: Lower right belt coupling rib

243a: Middle left belt support rib 243b: Middle right belt support rib

245a: Upper left belt coupling rib 245b: Upper right belt coupling rib

246: first coupling belt 247: second coupling belt

250: 2nd board entrance 270: 2nd magnetic gear

280: bearing 300: load lock chamber

310: preheat treatment unit 320: transfer chamber

330: cooling processing unit

Claims (6)

       A base; A transfer part provided on the base to be slidably movable and supporting a substrate to be processed on an upper surface thereof; And a belt driving unit coupled to the base and the transfer unit, the belt driving unit supporting the transfer unit to move on the base, including a belt extending or contracting in length. The method of claim 1, The transfer unit is a substrate transfer device, characterized in that provided with a plurality of transfer arm assembly which is provided to be stacked on each other and slidingly moved by the belt driving unit. The method according to claim 1 or 2, The belt driving unit is a substrate transfer device, characterized in that the transfer unit is provided to be selectively moved in either direction of the base. The method of claim 3, Further comprising a base plate for supporting the base, And the base plate is rotatably provided. The method of claim 2, The transfer unit, And an auxiliary transfer arm assembly provided on the base to be spaced apart from the transfer arm assembly and simultaneously transferring the substrate to the transfer container assembly. At least one process chamber including a substrate support on which a substrate to be processed is loaded and a first substrate entrance and exit; A transfer chamber connected to the first substrate entrance and exit and provided with a substrate transfer device according to claim 1 or 2, for loading / unloading a substrate into the process chamber; And a load lock chamber connected to the transfer chamber and having an unprocessed substrate and a substrate disposed thereon, respectively.
KR1020090054109A 2009-06-17 2009-06-17 Substrate transfering apparatus and substrate processing system having the same KR20100135626A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020090054109A KR20100135626A (en) 2009-06-17 2009-06-17 Substrate transfering apparatus and substrate processing system having the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090054109A KR20100135626A (en) 2009-06-17 2009-06-17 Substrate transfering apparatus and substrate processing system having the same

Publications (1)

Publication Number Publication Date
KR20100135626A true KR20100135626A (en) 2010-12-27

Family

ID=43510044

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090054109A KR20100135626A (en) 2009-06-17 2009-06-17 Substrate transfering apparatus and substrate processing system having the same

Country Status (1)

Country Link
KR (1) KR20100135626A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310293B1 (en) * 2011-08-03 2013-09-23 (주)동부로봇 Multistage sliding-type apparatus for transferring substrate
US20200238506A1 (en) * 2019-01-24 2020-07-30 Kindred Systems Inc. Nested linear stroke multipliers for robot manipulators
CN112027636A (en) * 2019-06-03 2020-12-04 顺丰科技有限公司 Linear stroke amplifying mechanism
KR102386972B1 (en) * 2020-12-24 2022-04-15 (주)씨엔원 Semiconductor Substrate Carrying Apparatus for Loadlock Chamer Using Magnetic Coupling

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310293B1 (en) * 2011-08-03 2013-09-23 (주)동부로봇 Multistage sliding-type apparatus for transferring substrate
US20200238506A1 (en) * 2019-01-24 2020-07-30 Kindred Systems Inc. Nested linear stroke multipliers for robot manipulators
CN112027636A (en) * 2019-06-03 2020-12-04 顺丰科技有限公司 Linear stroke amplifying mechanism
KR102386972B1 (en) * 2020-12-24 2022-04-15 (주)씨엔원 Semiconductor Substrate Carrying Apparatus for Loadlock Chamer Using Magnetic Coupling
WO2022139178A1 (en) * 2020-12-24 2022-06-30 주식회사 씨엔원 Substrate transfer device for loadlock chamber, using magnetic coupling

Similar Documents

Publication Publication Date Title
US10679879B2 (en) Substrate processing apparatus
JP5467221B2 (en) Substrate transfer apparatus and high-speed substrate processing system using the same
KR100814238B1 (en) Substrate transfer equipment and substrate processing system using the same
KR100818044B1 (en) Substrate pedestal and substrate transfer equipment and substrate processing system and method using the same
US8545160B2 (en) Substrate transfer apparatus and substrate transfer method
JP2008016815A (en) Substrate conveyance device, and substrate processing equipment using the same
KR20190130965A (en) Substrate processing apparatus
KR20090124118A (en) Substrate processing system
KR20100135626A (en) Substrate transfering apparatus and substrate processing system having the same
KR100781816B1 (en) Substrate transfer equipment and substrate processing system using the same
KR100665658B1 (en) Substrate processing apparatus
US20150083331A1 (en) Process Chamber, Semiconductor Manufacturing Apparatus and Substrate Processing Method Having the Same
KR101383248B1 (en) High speed substrate processing system
KR20090020167A (en) Substrate processing system
KR101649299B1 (en) Wafer processing system having linear wafer transfering apparatus
CN112242336A (en) Substrate processing apparatus and substrate transfer apparatus
KR101578081B1 (en) Wafer processing system
KR101486243B1 (en) Substrate transfer apparatus
KR101364583B1 (en) Substrate processing system
KR101416780B1 (en) High speed substrate process system
KR101492258B1 (en) In-line substrate processing system
KR101661217B1 (en) load port And Cluster Apparatus Including The Same
KR101649303B1 (en) Wafer processing system
KR101578078B1 (en) Substrate processing system
KR101367899B1 (en) System for substrate processing

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application
J201 Request for trial against refusal decision
J501 Disposition of invalidation of trial