KR101416780B1 - High speed substrate process system - Google Patents

High speed substrate process system Download PDF

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Publication number
KR101416780B1
KR101416780B1 KR1020070007160A KR20070007160A KR101416780B1 KR 101416780 B1 KR101416780 B1 KR 101416780B1 KR 1020070007160 A KR1020070007160 A KR 1020070007160A KR 20070007160 A KR20070007160 A KR 20070007160A KR 101416780 B1 KR101416780 B1 KR 101416780B1
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South Korea
Prior art keywords
substrate
chamber
process
plurality
rotating plate
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KR1020070007160A
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Korean (ko)
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KR20080069440A (en
Inventor
위순임
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위순임
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Priority to KR1020070007160A priority Critical patent/KR101416780B1/en
Priority claimed from TW096115374A external-priority patent/TWI476855B/en
Priority claimed from CN2007800197501A external-priority patent/CN101461051B/en
Publication of KR20080069440A publication Critical patent/KR20080069440A/en
Application granted granted Critical
Publication of KR101416780B1 publication Critical patent/KR101416780B1/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67155Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742Mechanical parts of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67745Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67754Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a batch of workpieces
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00Material or article handling
    • Y10S414/135Associated with semiconductor wafer handling
    • Y10S414/141Associated with semiconductor wafer handling includes means for gripping wafer

Abstract

The present invention relates to a high-speed substrate processing system having a substrate transfer apparatus capable of continuously improving the productivity by reducing the substrate transfer time by continuously loading / unloading a plurality of substrates into / from the process chamber. The substrate transfer apparatus is installed inside the trans chamber, and performs substrate transfer between the first and second process chambers disposed to the right and left of the trans chamber and the load lock chamber. The substrate transfer apparatus includes a driving unit for providing a rotational force, at least one spindle connected to the driving unit, a plurality of first rotating plate arms for loading / unloading the substrate into / from the first process chamber, and a substrate loading / And / or a plurality of second rotating plate arms for unloading. The substrate processing system using such a substrate transfer apparatus can rapidly perform substrate exchange before and after processing in the process of simultaneously or continuously processing a plurality of substrates, thereby increasing the throughput of facilities and increasing the productivity of the entire substrate.
Substrate transport, process chamber, transport chamber

Description

[0001] HIGH SPEED SUBSTRATE PROCESS SYSTEM [0002]

BRIEF DESCRIPTION OF THE DRAWINGS For a more complete understanding of the drawings used in the detailed description of the present invention, a brief description of each drawing is provided.

1 is a plan view of a substrate processing system according to a first embodiment of the present invention.

2 is a perspective view of a substrate transfer apparatus provided in the transfer chamber of FIG.

Fig. 3 is a view showing an example in which the substrate transfer apparatus is constituted by a separate driving method for the upper part and the lower part.

4 is a perspective view showing the structure of one rotating plate arm.

5 is a plan view of a substrate processing system having a separately driven type substrate transfer apparatus.

6 is a plan view showing an example in which the structure of the rotating plate arm is modified.

7 is a plan view of a substrate processing system comprising a plurality of processing groups.

Description of the Related Art [0002]

100: index 110: carrier

200: load lock chamber 210: atmospheric transfer robot

212: end vector 300: transfer chamber

310: first substrate entrance 320: second substrate entrance

330: Third substrate entry / exit port 400: First process chamber

402: substrate support 410: second process chamber

412: substrate support 500: substrate transport device

510: rotating plate arm 512: end effector

513: opening 514:

515: Entry passage 520: Loading arm

522: Unloading arm 530: Spindle

530a: upper spindle 530b: lower spindle

540: Driving unit 540a:

540b: lower driver 600: first processing group

610: second processing group 620: third processing group

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate processing system for manufacturing a semiconductor device, and more particularly, to a substrate processing system capable of increasing productivity by continuously loading / unloading a plurality of substrates into a process chamber, .

2. Description of the Related Art In recent years, a liquid crystal display device, a plasma display device, and substrate processing systems for manufacturing semiconductor devices have adopted a cluster system capable of processing a plurality of substrates in one operation. A cluster system refers to a multi-chambered substrate processing system that includes a carrier robot (or handler) and a plurality of substrate processing modules disposed therearound.

Generally, the cluster system includes a transfer chamber and a transfer robot provided freely rotatable in the transfer chamber. At each side of the transport chamber, a process chamber for carrying out the processing process of the substrate is mounted. Such a cluster system increases the throughput of a substrate by simultaneously processing a plurality of substrates or allowing various processes to proceed in succession. Another effort to increase the substrate throughput is to process a plurality of substrates simultaneously in one process chamber to increase the substrate throughput per hour.

However, even if the process chamber processes a plurality of substrates simultaneously (or continuously), a time loss occurs if the substrates before and after the process can not be efficiently exchanged in the process chamber. In a typical cluster system, in order to constitute a hexagonal transport chamber (basically composed of four process chambers and two load lock chambers), the area occupied by the transport chamber is not limited to the entire area of the system, The system width which is important in the system arrangement is increased more than necessary and the size of the vacuum system required to keep the transport chamber in a vacuum is increased to increase the equipment cost and installation cost. Further, the area of the transport chamber is further increased as the number of process chambers to be installed increases.

Thus, there is a need for a substrate processing system that can simultaneously (or continuously) treat a plurality of substrates in a process chamber that processes a plurality of substrates, and more efficiently exchange substrates before and after the process.

An object of the present invention is to provide a substrate processing system using a substrate transfer apparatus capable of processing a substrate transfer at a high speed.

It is another object of the present invention to provide a substrate processing system capable of reducing the substrate transportation time and improving productivity.

It is also an object of the present invention to provide a substrate processing system having a small system area.

It is another object of the present invention to provide a substrate processing system having a structure capable of shortening a time required for a process.

Another object of the present invention is to provide a substrate processing system having a structure capable of improving the operation rate of the process chamber.

It is another object of the present invention to provide a substrate processing system capable of drastically reducing the area and system width of a system.

It is another object of the present invention to provide a substrate processing system capable of minimizing an apparatus cost and an installation cost by reducing an unnecessary vacuum area.

According to an aspect of the present invention, there is provided a substrate processing system. A substrate processing system of the present invention comprises: a first processing chamber including a substrate support; A second process chamber including a substrate support; A transfer chamber provided with a substrate transfer device; A first substrate entrance opening formed between the transfer chamber and the outside; A second substrate entry opening formed between the first process chamber and the transfer chamber; And a third substrate entry opening formed between the second process chamber and the transfer chamber, wherein the substrate transfer apparatus comprises: a substrate transfer device for transferring a substrate between an exterior and a substrate through a first substrate entrance port, The substrate is transported to the first or second process chamber through the second or third substrate inlet port and the processed substrates processed in the first or second process chamber are taken over through the second or third substrate inlet / 1 through the board entrance.

In one embodiment, the apparatus includes a load lock chamber connected to a first substrate entry port, and the load lock chamber includes an atmospheric transfer robot for transferring the substrate at atmospheric pressure.

In one embodiment, at least one of the first or second process chambers is a plasma processing chamber.

In one embodiment, at least one of the first or second process chambers is a cooling process chamber.

In one embodiment, at least one of the first or second process chambers is an alignment process chamber.

In one embodiment, the substrate transfer apparatus includes: a driving unit for providing a rotational force; At least one spindle coupled to the drive; A plurality of first rotating plate arms for loading / unloading the substrate into the first process chamber; And a plurality of second rotating plate arms for loading / unloading the substrate into the second process chamber.

In one embodiment, the first and second rotating plate arms are mounted separately and include at least two different spindles that rotate independently of each other.

In one embodiment, the apparatus includes at least one driver that provides rotational force to at least two different spindles.

In one embodiment, each of the first rotary plate arm and the second rotary plate arm includes: a horseshoe-shaped end effector (END EFFECTOR) having an opening with one side opened and a support having a substrate edge on an upper surface thereof; .

In one embodiment, the end effector has an entry passage formed to allow the end effector of the substrate transfer robot installed in the load lock chamber to enter and exit the substrate.

In order to fully understand the present invention, operational advantages of the present invention, and objects achieved by the embodiments of the present invention, reference should be made to the accompanying drawings and the accompanying drawings which illustrate preferred embodiments of the present invention. The embodiments of the present invention may be modified into various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. The present embodiments are provided to enable those skilled in the art to more fully understand the present invention. Accordingly, the shape of elements and the like in the drawings are exaggerated in order to emphasize a clearer explanation. It should be noted that, in understanding each of the figures, the same elements are represented by the same reference numerals whenever possible. And detailed descriptions of known functions and configurations that may unnecessarily obscure the gist of the present invention are omitted.

(Example)

Hereinafter, the substrate processing system of the present invention will be described in detail with reference to the preferred embodiments of the present invention with reference to the accompanying drawings. In the drawings, the same reference numerals are used to denote elements performing the same function.

 The basic intention of the present invention is to increase the productivity by providing a more efficient substrate exchange method in a substrate processing system having a plurality of substrate processing capabilities. Further, it is an object of the present invention to provide a substrate processing system capable of processing a larger number of substrates simultaneously based on an efficient substrate exchange method.

1 is a plan view of a substrate processing system according to a first embodiment of the present invention.

Referring to Figure 1, the substrate processing system of the present invention includes first and second process chambers 400, 410 and a transfer chamber 300 disposed therebetween. The load lock chamber 200 is provided in front of the transfer chamber 300 and the index 100 in which the plurality of carriers 110 are mounted in front of the load lock chamber 200 is installed. Index 100 is sometimes referred to as a facility front end module (EFEM) and sometimes a load lock chamber. The substrate processing system may be provided with a cooling processing chamber (not shown) for cooling the substrate as required.

The load lock chamber 200 is equipped with an atmospheric pressure conveying robot 210 operated at atmospheric pressure. The atmospheric conveying robot 210 takes charge of transferring the substrate between the transfer chamber 300 and the index 100. The atmospheric pressure conveying robot 210 operates to convey the substrate W between the carrier 110 and the transfer chamber 300. The atmospheric pressure conveying robot 210 has a double arm structure having two end effectors 212 capable of carrying two substrates W out of the carrier 210 in a single operation and carrying them into the transfer chamber 300 And a robot. The atmospheric pressure conveying robot 210 has a track 220 that is movable in the left and right direction. The atmospheric pressure conveying robot 210 may use various robots used in a conventional semiconductor manufacturing process in addition to the double arm structure shown in the present embodiment.

  The first and second process chambers 400 and 410 are vacuum chambers for performing a plasma processing process. In the first and second process chambers 400 and 410, one substrate support 402 and 412 are disposed on the path of rotation of the rotation plate arms of the substrate transfer apparatus 500. The first and second process chambers 400 and 410 may be configured to perform various substrate processing operations. For example, it may be an ashing chamber that removes the photoresist using plasma, and may be a CVD (Chemical Vapor Deposition) chamber configured to deposit an insulating film, and may be an aperture apertures, or etch chambers configured to etch openings. Or a PVD chamber configured to deposit a barrier film, and may be a PVD chamber configured to deposit a metal film.

The substrate W to be processed in the present substrate processing system is typically a wafer substrate for manufacturing a semiconductor circuit or a glass substrate for manufacturing a liquid crystal display. In addition to the illustrated configuration of the present substrate processing system, multiple processing systems may be required to perform all of the processes required for the complete fabrication of an integrated circuit or chip. However, for the sake of clarity of the present invention, a conventional configuration or a configuration that can be understood by a person skilled in the art is omitted.

The transfer chamber 300 is provided with a substrate transfer apparatus 800. A first substrate inlet / outlet 310 is formed between the transfer chamber 300 and the load lock chamber 200. A second substrate inlet 320 is formed between the transfer chamber 300 and the first process chamber 400 and a third substrate inlet 330 is formed between the transfer chamber 300 and the second process chamber 410. . The first to third substrate entry / exit openings 310, 320, and 330 are opened / closed by a slit valve (not shown), respectively.

In the process of replacing the substrates before and after the processing in the transfer chamber 300 by the atmospheric pressure conveying robot 210, the second and third substrate outlets 320 and 330 are closed and the first substrate outlets 410 are opened do. In the process of replacing the substrate before and after the process between the first and second process chambers 400 and 410 and the trans chamber 300, the first substrate inlet / outlet 310 is closed While the vacuum is maintained, the second and third substrate entry / exit openings 320 and 330 are opened and proceed in a vacuum state.

2 is a perspective view of a substrate transfer apparatus provided in the transfer chamber of FIG.

2, the substrate transfer apparatus 500 includes a driving unit 540 for providing a rotational force, a spindle 530 connected to the driving unit 540, and a plurality of rotating plate arms 510 mounted on the spindle 530 ). The plurality of rotating plate arms 510 includes two first rotating plate arms for loading / unloading the substrate into the first processing chamber 400 and two rotating plate arms for loading / unloading the substrate into the second processing chamber 410. [ And a second rotating plate arm. The first and second rotating plate arms are alternately arranged. However, it may be arranged sequentially. The plurality of rotating plate arms 510 can be further divided into a loading arm 520 and an unloading arm 522. At this time, it is preferable that the unloading arm 522 is arranged lower than the loading arm 520. The loading arm 520 and the unloading arm 522 are paired with each other. In one embodiment, as shown in FIG.

A plurality of rotating plate arms 510 are operated to unfold in a fan shape, as shown in Fig. Although not shown in detail, the driving unit 540 includes an electric motor for generating rotational force and a gear assembly for transmitting the generated rotational force to the spindle 530 to perform a desired operation of the plurality of rotational plate arms 510 do. A plurality of rotating plate arms 510 are mounted on the spindle 530 and perform an operation of unfolding and folding symmetrically with respect to the spindle 530 as shown in Fig.

Fig. 3 is a view showing an example in which the substrate transfer apparatus is constituted by a separate driving method for the upper part and the lower part.

Referring to FIG. 3, the substrate transfer apparatus 500a of another embodiment includes upper and lower independent spinders 530a and 530b to which the loading arm 520 and the unloading arm 522 are separately mounted, And driving parts 540a and 540b provided separately. Here, it is preferable that the two upper and lower spindles 530a and 530b are aligned on the same axis.

4 is a perspective view showing the structure of one rotating plate arm.

4, a plurality of rotary plate arms 510 constituting the substrate transfer apparatus 500 have openings 513, one side of which is open, and a plurality of support portions 514 on the upper surface of which the substrate edges are placed And has a horseshoe shaped end effector (END EFFECTOR) 512. The opening 513 is for the entrance and exit of a lift pin provided on the substrate support. The end effector 512 has an entry passage 515 formed so that the end effector 212 of the atmospheric pressure conveying robot 510 can enter and exit. The rotary plate arm 510 having such a configuration may be modified into another form within the technical scope of the present invention.

The substrate transport operation of the substrate processing system of the present invention as described above is as follows.

The substrate W is transferred to the loading arm 520 of the substrate transfer apparatus 500 when the first and second substrate access openings 310 are opened in the state where the second and third substrate access openings 320 and 330 are closed. When the substrate transfer is completed, the first substrate inlet / outlet 310 is closed and the transfer chamber 300 is switched to the same vacuum state as the inside of the first and second process chambers 400 and 410. The pumping system for this purpose is naturally included in the present system, but the illustration of the drawing is omitted for the sake of convenience.

The processed substrate W waits on the substrate supporters 402 and 412 of the first and second process chambers 400 and 410. As the lift pins of the substrate supports 402 and 412 are elevated, the processed substrate W is lifted up to a designated height. In addition to this operation, the second and third substrate entry openings 320 and 330 are opened. The loading arm 520 of the substrate transfer apparatus 400 and the unloading arm 522 are paired to form a fan shape. At this time, the processed wafers W are transferred to the unloading arm 522 from the lift pins.

When the substrate W is transferred after processing, the unloading arm 522 returns to the initial position of the transfer chamber 300 again. The lift pins lift up again and take over the substrate W from the loading arms 520 before processing. The loading arms 520 return to the initial position of the transfer chamber 300. In addition, the second and third substrate entry openings 320 and 330 are closed again. In addition, the lift pins are lowered to seat the substrate W on the substrate supports 402 and 412 before processing. Then, the transfer chamber 300 is switched to the atmospheric pressure state and the first substrate entrance 310 is opened. The atmospheric transfer robot 210 of the load lock chamber 200 takes over the substrate W from the unloading arm 522 and then leaves the transfer chamber 400.

Such a series of substrate exchange steps are carried out continuously or concurrently in such a way that the front and back steps are not interfered to minimize the substrate exchange time. The substrate exchange process before and after the processing of the substrate transfer apparatus 500 and the atmospheric pressure transfer robot 210 of the transfer chamber 300 proceeds simultaneously. In other words, the substrate exchange process between the trans chamber 400 and the load lock chamber 200 is such that the unloaded substrate and the unprocessed substrate to be loaded at the same time are exchanged at the same time. After the unloaded processing, the substrate W is loaded on the cassette 110 by the atmospheric transfer robot 210.

If cooling of the unloaded substrate W is required, the substrate processing system may be provided with a separate cooling processing chamber so that the cooling processing is performed. To this end, a separate cooling processing chamber may be installed at a suitable location in the substrate processing system. Alternatively, either the first or second process chamber 400 or 410 may be configured as a cooling process chamber. For example, the first process chamber 400 may be configured as a plasma processing chamber, and the second process chamber 410 may be configured as a cooling process chamber. In this case, the plasma processing is performed on the substrate in the first process chamber 400, and the substrate transfer device 500 is moved from the first process chamber 400 to the second process chamber 410, And cooled. And to return the cooled substrate from the second process chamber 410 to the load lock chamber 200.

If alignment of the substrate W is required before being loaded, the substrate processing system may be provided with an alignment process separately so that the alignment process is performed. For this purpose, a separate alignment process may be provided at a suitable location in the substrate processing system. Alternatively, any one of the first or second process chambers 400 or 410 may be configured as an alignment process. For example, the first process chamber 400 may be configured as a plasma processing chamber, and the second process chamber 410 may be configured as an alignment process. In order to achieve such a configuration, before the plasma processing is performed on the substrate in the first process chamber 400, the substrate transfer apparatus 500 performs the alignment process in the second process chamber 410 before the process, And transferred to the process chamber 400 for plasma processing.

As such, the substrate processing system of the present invention includes first and second process chambers 400 and 410 arranged in parallel on the left and right in order to simultaneously process a plurality of substrates, and the transfer chamber 300 includes two first and second And is located between process chambers 400 and 410. In this structure, since the substrate transport apparatus 300 that enables rapid substrate exchange is provided, it is possible to rapidly exchange substrates before and after the process and carry out the transport process.

Fig. 5 is a plan view of a substrate processing system having a separately driven type substrate transfer apparatus, and Fig. 6 is a plan view showing an example of a modification of the structure of a rotation plate arm.

Referring to FIG. 5, separate drive type substrate transfer apparatuses 500a and 500b which are independently driven in the left and right directions can be installed in the transfer chamber 300. [ That is, one substrate transfer apparatus 500a is responsible for transferring the substrate of the first process chamber 400, and the other substrate transfer apparatus 500b is configured for transferring the substrate of the second process chamber 410 . The detailed configuration of the separate drive type substrate transport apparatuses 500a and 500b is applicable to the example shown in FIGS. 2 and 3, and a detailed description thereof will be omitted. As shown in FIG. 6, the separate drive type substrate transfer apparatuses 500a and 500b may include a rotary plate arm 510 'bent in an' L 'shape.

7 is a plan view of a substrate processing system comprising a plurality of processing groups.

Referring to FIG. 7, the substrate processing system of the present invention may have a plurality of processing groups 600, 610, 620. The plurality of processing groups 600, 610, and 620 has a structure in which a transfer chamber is provided at the center and a plasma processing chamber is provided at both sides, as in the structure of FIG. 1 described above. The first and third processing groups 600 and 620 among the plurality of processing groups 600, 610 and 620 are positioned opposite to each other and the second processing group 610 is positioned rearward. The atmospheric pressure conveying robot 210 located in the load lock chamber 200 has tracks 220 and 230 arranged in a 'T' shape.

The atmospheric pressure conveying robot 210 moves the substrate 110 between the first and third processing groups 600, 610 and 620 while moving along the tracks 220 and 230. The two process chambers provided in the first to third process groups 600, 610 and 620 may be chambers for the plasma processing process. Or either one may be a cooling process chamber, or an alignment process. Or both of the process chambers provided in any one of the first to third process groups may be constituted by the cooling process chambers or all may be configured by the alignment process. As described above, at least one of the plurality of process chambers included in the first to third processing groups 600, 610, and 620 may include the cooling processing chambers. And / or at least one may include an alignment process.

The embodiments of the substrate processing system of the present invention described above are merely illustrative and those skilled in the art will appreciate that various modifications and equivalent embodiments are possible without departing from the scope of the present invention. It will be possible. It is to be understood, therefore, that this invention is not to be limited to the specific forms disclosed in the foregoing description. Accordingly, it is intended that the present invention cover the modifications and variations of this invention provided they come within the scope of the appended claims and their equivalents. Should be understood to include.

According to the substrate processing system of the present invention as described above, it is possible to rapidly perform substrate exchange before and after processing in a substrate processing system that processes a plurality of substrates simultaneously or sequentially, thereby increasing the throughput of the system, . In addition, since a substrate transfer apparatus that simultaneously performs loading and unloading of a substrate is provided, it is very easy to implement a process chamber for processing a plurality of substrates. In addition, the present invention can improve the productivity by reducing the substrate transportation time. Further, the present invention can drastically reduce the area and system width of the system, thereby minimizing the equipment cost and the installation cost.

Claims (10)

  1. A first process chamber including one substrate support, a second process chamber including one substrate support, a transfer chamber provided with a transfer device, a first substrate entry port opened between the transfer chamber and the exterior, a first process chamber and a transfer At least one processing group including a second substrate entry opening formed between the chambers and a third substrate entry opening formed between the second processing chamber and the transfer chamber,
    The substrate transport apparatus includes:
    The substrate before and after the process is transferred to the first or second process chamber through the first substrate entry port, the transferred substrate is transferred to the first or second process chamber through the second or third substrate entry port, And transferring the processed substrates through the second or third substrate entry / exit port to the outside through the first substrate entry / exit port,
    The substrate transport apparatus includes:
    A driving unit 540 for providing a rotational force, a spindle 530 connected to the driving unit 540 and a plurality of rotating plate arms 510 mounted on the spindle 530,
    The plurality of rotating plate arms 510 includes two first rotating plate arms for loading / unloading the substrate into the first processing chamber 400 and two rotating plate arms for loading / unloading the substrate into the second processing chamber 410. [ The second rotating plate arm;
    The plurality of rotating plate arms 510 are again divided into a loading arm 520 and an unloading arm 522;
    The upper and lower spindles 530a and 530b and the upper and lower driving units 540a and 540b for driving the loading arm 520 and the unloading arm 522 are separately provided;
    The plurality of rotary plate arms 510 have openings 513 on one side and have a horseshoe shaped END EFFECTOR 512 having a plurality of supports 514 on the upper surface of which the substrate edges are placed ;
    An opening 513 for the entrance and exit of a lift pin provided on the substrate support;
    And an entry passage (515) formed so that the end effector (212) of the atmospheric pressure conveying robot (510) can enter and exit.
  2. The method according to claim 1,
    Wherein at least one of the first and second processing chambers is a cooling processing chamber.
  3. The method according to claim 1,
    Wherein at least one of the first and second process chambers is an alignment process chamber.
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KR1020070007160A 2007-01-23 2007-01-23 High speed substrate process system KR101416780B1 (en)

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KR1020070007160A KR101416780B1 (en) 2007-01-23 2007-01-23 High speed substrate process system
TW096115374A TWI476855B (en) 2006-05-03 2007-04-30 Substrate transferring apparatus and high speed substrate processing system using the same
JP2009509412A JP5467221B2 (en) 2006-05-03 2007-05-01 Substrate transfer apparatus and high-speed substrate processing system using the same
CN2007800197501A CN101461051B (en) 2006-05-03 2007-05-01 Substrate transfer equipment and substrate processing system using the same
US12/298,972 US9054146B2 (en) 2006-05-03 2007-05-01 Substrate transfer equipment and high speed substrate processing system using the same
EP07746289A EP2020024A4 (en) 2006-05-03 2007-05-01 Substrate transfer equipment and high speed substrate processing system using the same
PCT/KR2007/002133 WO2007126289A1 (en) 2006-05-03 2007-05-01 Substrate transfer equipment and high speed substrate processing system using the same

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KR20050045339A (en) * 2003-11-11 2005-05-17 삼성전자주식회사 Apparatus for transporting wafer
KR20050045191A (en) * 2003-11-10 2005-05-17 삼성전자주식회사 Multi chamber system
KR20050092278A (en) * 2004-03-15 2005-09-21 주식회사 뉴파워 프라즈마 Plasma reaction chamber having multi arrayed vacuum chamber and substrate processing system having the same
KR20060058086A (en) * 2004-08-17 2006-05-29 맷슨 테크놀로지, 인크. Advanced low cost high throughput processing platform

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KR20050045191A (en) * 2003-11-10 2005-05-17 삼성전자주식회사 Multi chamber system
KR20050045339A (en) * 2003-11-11 2005-05-17 삼성전자주식회사 Apparatus for transporting wafer
KR20050092278A (en) * 2004-03-15 2005-09-21 주식회사 뉴파워 프라즈마 Plasma reaction chamber having multi arrayed vacuum chamber and substrate processing system having the same
KR20060058086A (en) * 2004-08-17 2006-05-29 맷슨 테크놀로지, 인크. Advanced low cost high throughput processing platform

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